CN108676352A - A kind of printed circuit board drilling backing plate and preparation method thereof - Google Patents
A kind of printed circuit board drilling backing plate and preparation method thereof Download PDFInfo
- Publication number
- CN108676352A CN108676352A CN201810530955.6A CN201810530955A CN108676352A CN 108676352 A CN108676352 A CN 108676352A CN 201810530955 A CN201810530955 A CN 201810530955A CN 108676352 A CN108676352 A CN 108676352A
- Authority
- CN
- China
- Prior art keywords
- backing plate
- circuit board
- printed circuit
- board drilling
- production method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
- C08J9/06—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
- C08J9/10—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent developing nitrogen, the blowing agent being a compound containing a nitrogen-to-nitrogen bond
- C08J9/102—Azo-compounds
- C08J9/103—Azodicarbonamide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2203/00—Foams characterized by the expanding agent
- C08J2203/04—N2 releasing, ex azodicarbonamide or nitroso compound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/042—Graphene or derivatives, e.g. graphene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/098—Metal salts of carboxylic acids
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Drilling And Boring (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses a kind of printed circuit board drilling backing plates and preparation method thereof, wherein the method includes the steps：By nylon, graphene, solid packing and auxiliary agent be kneaded, and be granulated, be cast after slice is made；The slice is heat-treated to get boring backing plate.The present invention solves the problems, such as that existing printed circuit board drilling is difficult to recycle with backing plate.
Description
Technical field
The present invention relates to printed-board technology field more particularly to a kind of printed circuit board drilling backing plate and its making
Method.
Background technology
Currently, printed circuit board drilling generally uses wood-fiber board, phenolic resin plate etc. with backing plate, this needs timber, stone
Change product as raw material, be environment consumable products, although wood-fibred derives from trees, belong to renewable resource, regenerates
Speed is much unable to catch up with depletion rate of the mankind to resource；And phenolic resin raw material sources belong in fossil resources such as oil
Non-renewable resources；In addition, existing backing plate heat conductivility is bad, it is susceptible to that drilling burr, fracture drill point when in use.
Therefore, the existing technology needs to be improved and developed.
Invention content
In view of above-mentioned deficiencies of the prior art, the purpose of the present invention is to provide a kind of printed circuit board drilling backing plate and
Its production method, it is intended to solve the problems, such as that existing printed circuit board is difficult to recycle.
Technical scheme is as follows：
A kind of production method of printed circuit board drilling backing plate, wherein the method includes the steps：
By nylon, graphene, solid packing and auxiliary agent be kneaded, and be granulated, be cast after slice is made；
The slice is heat-treated to get boring backing plate.
The production method of the printed circuit board drilling backing plate, wherein by weight, the ratio of each component is：
Nylon 72 ~ 95, graphene 0.3 ~ 2, solid packing 3 ~ 20, auxiliary agent 0.5 ~ 6.
The production method of the printed circuit board drilling backing plate, wherein the solid packing is calcium carbonate, aluminium oxide
And it is one or more in aluminium hydroxide.
The production method of the printed circuit board drilling backing plate, wherein the auxiliary agent includes foaming agent.
The production method of the printed circuit board drilling backing plate, wherein the auxiliary agent further includes releasing agent.
The production method of the printed circuit board drilling backing plate, wherein the slice thickness is 1.5 ~ 2.5mm.
The production method of the printed circuit board drilling backing plate, wherein the heat treatment temperature be 100 ~ 120 DEG C,
Time is 10 ~ 15mins.
The production method of the printed circuit board drilling backing plate, wherein using high boiling liquid to it is described be sliced into
Row heat treatment.
The production method of the printed circuit board drilling backing plate, wherein the high boiling liquid is mineral oil, glycerine
Or atoleine.
A kind of printed circuit board drilling backing plate, wherein be made by method as described above.
Advantageous effect：Printed circuit board drilling backing plate provided by the present invention passes through graphite based on nylon material
Alkene and solid packing are modified nylon material, improve its hardness, lubricity, can effectively reduce drilling burr and reduce and rub
It wipes, protection drill point, and product can be by being kneaded, being granulated, be cast, be sliced after having drilled again, you can realize recycling.This
Invention solves the problems, such as that existing printed circuit board drilling is difficult to recycle with backing plate.
Description of the drawings
Fig. 1 is the production method preferred embodiment flow chart of printed circuit board drilling backing plate of the present invention.
Specific implementation mode
The present invention provides a kind of printed circuit board drilling backing plates and preparation method thereof, to make the purpose of the present invention, skill
Art scheme and effect are clearer, clear, and the present invention is described in more detail below.It should be appreciated that tool described herein
Body embodiment is only used to explain the present invention, is not intended to limit the present invention.
The production method of a kind of printed circuit board drilling backing plate of the present invention, wherein as shown in Figure 1, including step
Suddenly：
S1, by nylon, graphene, solid packing and auxiliary agent be kneaded, and be granulated, be cast after slice is made；
S2, the slice is heat-treated to get boring backing plate.
The present invention is added graphene, solid packing and auxiliary agent and is kneaded, realized based on the nylon material of recoverable
Nylon is modified, using being granulated, cutting into slice after curtain coating, is then heat-treated to eliminate stress, and is obtained
Boring backing plate re-starts mixing, granulation, curtain coating, slicer heat treatment after piercing, can realize and recycle, with
Greatly save resource consumption, environmental protection.
Nylon has excellent toughness, self lubricity, wearability, chemical resistance, gas-premeable, oil resistivity, nontoxic and appearance
The advantages that easy coloring, with making printed circuit board drilling backing plate, when such drill bit gets into backing plate, nylon based on nylon material
Drill point can be lubricated, friction is reduced, protects drill point.But, it is contemplated that nylon material has rigid insufficient and poor heat conduction
Problem needs to be modified it.Preferably, as in the step S1, nylon, graphene, solid packing and auxiliary agent are kneaded,
To realize the modification to nylon, wherein graphene is a kind of high-end high-strength material, and has excellent heat conductivility and profit
Slip energy is conducive to provide support strength and heat conductivility after addition, it is possible to reduce the generation of burr, while reducing the temperature of drill bit
Degree, and solid packing is then used to further increase product strength and case hardness.
Preferably, the solid packing is one or more in calcium carbonate, aluminium oxide and aluminium hydroxide, and the nylon
The general nylon such as PA6, PA66, PA46, PA1010 can be used in material.
More preferably, when being kneaded, by weight, the ratio of each component is：Nylon 72 ~ 95, graphene 0.3 ~ 2, solid
Filler 3 ~ 20, auxiliary agent 0.5 ~ 6, the product toughness being kneaded according to the above ratio reaches with hardness and thermal conductivity to be balanced well.
More preferably, by weight, in the solid packing, the content of calcium carbonate, aluminium oxide and aluminium hydroxide is identical.
Preferably, the auxiliary agent includes foaming agent, bulk gas of the foaming agent after expanding in product can reduce drill point
With the time of contact of resin, be conducive to cooling and chip removal.It is particularly preferred that the Barium azodicarboxylate, azoformic acid ammonium, to toluene
Sulfoamido urea etc. is one such or several.
Preferably, the auxiliary agent further includes releasing agent, such as zinc stearate or white oil, the addition of releasing agent are conducive to be cast
Subsequently it is fabricated to a pint mould.
More preferably, when being kneaded, by weight, the auxiliary agent includes 0.2 ~ 3 part of releasing agent, 0.3 ~ 3 part of foaming agent.
It in the step S1, is granulated after mixing, then by product, then is squeezed out at a temperature of 240-320 DEG C, is cast, and make
It is 1.5-2.5mm with two pairs of rollers control thickness, cuts in flakes, be 1.5-2.5mm backing plate semi-finished product, this thickness to which thickness be made
Backing plate can realize that backing plate acts on well in range, and the burr that drills reduces significantly.
In the step S2, by being heat-treated to slice, to eliminate stress therein and enhance dimensional stability.Compared with
Goodly, heat treatment temperature is 100 ~ 120 DEG C, and temperature is too low, cannot reach stress-relieving by beat treatment purpose, and temperature is excessively high to damage
Evil piece cutting structure, causes aging, influences final product structure；And heat treatment time is preferably controlled in 10 ~ 15mins and can will answer
Power is eliminated, and the time is too short, can not thoroughly eliminate stress.More preferably, pass through the higher boilings liquid such as mineral oil, glycerine or atoleine
Body to slice be heat-treated because high boiling liquid it is not volatile and it is heated evenly, can be preferably by answering in slice
Power is eliminated.Thermally treated product, which should be noted that, to be slowly cooled to room temperature, to prevent quenching from stress in product being caused to regenerate.
Based on the above method, the present invention also provides a kind of printed circuit board drilling backing plates, wherein by above method system
It forms.The backing plate that the present invention makes drilling quality in the application that 0.35mm or more bores diameter is good.The boring backing plate is boring
It is recycled behind hole, re-starts mixing, granulation, curtain coating, slicer heat treatment, can realize that repetitive cycling uses.
Below by embodiment, the invention will be further described：
Embodiment 1
In parts by mass, by 80 parts of nylon, 1 part of graphene, 3 parts of calcium carbonate, 3 parts of aluminium oxide, 3 parts of aluminium hydroxides, 1.5 parts of tristearin
Sour zinc and 1.5 parts of Azodicarbonamides are kneaded abundant, are squeezed out at 300 DEG C again after granulation, curtain coating, and be using two pairs of rollers control thickness
Then 2mm cuts into pieces, slice is then carried out heat treatment 12 minutes in 110 DEG C of atoleine, and it is slow to further take out slice
It is cooled to room temperature to get to printed circuit board drilling backing plate；
It drills by the backing plate pad on the downside of printed circuit board and with the brill diameter of 0.35mm, burr can be obviously reduced；
It is kneaded, is granulated again after being drilled using the backing plate, 260 DEG C of extrusions, being cast and carry out slicing treatment, and using two pairs of rollers
Control thickness is 2mm, is then cut into pieces, and slice is then carried out heat treatment 10 minutes in 110 DEG C of atoleine, then take
Go out slice to be slowly cooled to room temperature, you can retrieve printed circuit board drilling backing plate.
In conclusion a kind of printed circuit board drilling backing plate provided by the present invention, the printed circuit board drilling is used
Backing plate is modified nylon material by graphene and solid packing based on nylon material, improves its hardness, lubrication
Property, it can effectively reduce drilling burr and reduce friction, protection drill point, and product can be by being kneaded, making after having drilled again
Grain, curtain coating, slice, you can realize recycling.The present invention solves existing printed circuit board drilling and is difficult to recycle with backing plate
The problem of utilization.
It should be understood that the application of the present invention is not limited to the above for those of ordinary skills can
With improvement or transformation based on the above description, all these modifications and variations should all belong to the guarantor of appended claims of the present invention
Protect range.
Claims (10)
1. a kind of production method of printed circuit board drilling backing plate, which is characterized in that the method includes the steps：
By nylon, graphene, solid packing and auxiliary agent be kneaded, and be granulated, be cast after slice is made；
The slice is heat-treated to get boring backing plate.
2. the production method of printed circuit board drilling backing plate according to claim 1, which is characterized in that by weight
Meter, the ratio of each component are：Nylon 72 ~ 95, graphene 0.3 ~ 2, solid packing 3 ~ 20, auxiliary agent 0.5 ~ 6.
3. the production method of printed circuit board drilling backing plate according to claim 1, which is characterized in that the solid is filled out
Material is one or more in calcium carbonate, aluminium oxide and aluminium hydroxide.
4. the production method of printed circuit board drilling backing plate according to claim 1, which is characterized in that the auxiliary agent packet
Include foaming agent.
5. the production method of printed circuit board drilling backing plate according to claim 4, which is characterized in that the auxiliary agent is also
Including releasing agent.
6. the production method of printed circuit board drilling backing plate according to claim 1, which is characterized in that the slice thick
Degree is 1.5 ~ 2.5mm.
7. the production method of printed circuit board drilling backing plate according to claim 1, which is characterized in that the heat treatment
Temperature is 100 ~ 120 DEG C, the time is 10 ~ 15mins.
8. the production method of printed circuit board drilling backing plate according to claim 7, which is characterized in that utilize higher boiling
Liquid is heat-treated the slice.
9. the production method of printed circuit board drilling backing plate according to claim 8, which is characterized in that the higher boiling
Liquid is mineral oil, glycerine or atoleine.
10. a kind of printed circuit board drilling backing plate, which is characterized in that by any method making of claim 1 ~ 9
At.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810530955.6A CN108676352A (en) | 2018-05-29 | 2018-05-29 | A kind of printed circuit board drilling backing plate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810530955.6A CN108676352A (en) | 2018-05-29 | 2018-05-29 | A kind of printed circuit board drilling backing plate and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108676352A true CN108676352A (en) | 2018-10-19 |
Family
ID=63808651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810530955.6A Pending CN108676352A (en) | 2018-05-29 | 2018-05-29 | A kind of printed circuit board drilling backing plate and preparation method thereof |
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| Country | Link |
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| CN (1) | CN108676352A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110572943A (en) * | 2019-09-12 | 2019-12-13 | 泰州市博泰电子有限公司 | Circuit board drilling backing plate |
| CN112624666A (en) * | 2019-10-09 | 2021-04-09 | 刘天与 | Hard stone plastic cushion plate for PCB drilling and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102729281A (en) * | 2012-07-19 | 2012-10-17 | 周伟 | Drilling pressing plate and drilling method of circuit board |
| CN104175658A (en) * | 2014-08-22 | 2014-12-03 | 烟台柳鑫新材料科技有限公司 | Base plate for printed circuit board drilling and preparation method for base plate |
| CN105799193A (en) * | 2016-03-11 | 2016-07-27 | 深圳市柳鑫实业股份有限公司 | Backing plate used for printed circuit board (PCB) drilling and preparation method of backing plate |
-
2018
- 2018-05-29 CN CN201810530955.6A patent/CN108676352A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102729281A (en) * | 2012-07-19 | 2012-10-17 | 周伟 | Drilling pressing plate and drilling method of circuit board |
| CN104175658A (en) * | 2014-08-22 | 2014-12-03 | 烟台柳鑫新材料科技有限公司 | Base plate for printed circuit board drilling and preparation method for base plate |
| CN105799193A (en) * | 2016-03-11 | 2016-07-27 | 深圳市柳鑫实业股份有限公司 | Backing plate used for printed circuit board (PCB) drilling and preparation method of backing plate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110572943A (en) * | 2019-09-12 | 2019-12-13 | 泰州市博泰电子有限公司 | Circuit board drilling backing plate |
| CN110572943B (en) * | 2019-09-12 | 2021-08-24 | 泰州市博泰电子有限公司 | Circuit board drilling backing plate |
| CN112624666A (en) * | 2019-10-09 | 2021-04-09 | 刘天与 | Hard stone plastic cushion plate for PCB drilling and preparation method thereof |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181019 |
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| RJ01 | Rejection of invention patent application after publication |