CN110564331A - 一种弹性压敏胶带的制备方法及弹性压敏胶带 - Google Patents

一种弹性压敏胶带的制备方法及弹性压敏胶带 Download PDF

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CN110564331A
CN110564331A CN201910904122.6A CN201910904122A CN110564331A CN 110564331 A CN110564331 A CN 110564331A CN 201910904122 A CN201910904122 A CN 201910904122A CN 110564331 A CN110564331 A CN 110564331A
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sensitive adhesive
elastic pressure
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substrate
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顾正青
周帅
计建荣
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Suzhou Shihua New Material Polytron Technologies Inc
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Abstract

本发明提出了一种弹性压敏胶带的制备方法及弹性压敏胶带,本发明采用了含碳碳双键的聚丙烯酸酯树脂和含碳碳双键的稀释单体为胶的主体成分,并采用了类微胶囊粉体成分,其中类微胶囊粉体的壳材选用纤维素类水溶性高分子聚合物,芯材选用低沸点烷烃,使用UV固化、加热破壳结合的制备方式,得到自身具有弹性的胶层,并制备得到压敏胶带成品。本发明的制备方法与现有技术的弹性压敏胶带相比,制备工艺简单。本发明制备方法得到的压敏胶带突破传统泡棉带材的限制,在不需要使用泡棉作为基材即可具备良好的缓冲性、压缩性。

Description

一种弹性压敏胶带的制备方法及弹性压敏胶带
技术领域
本发明涉及压敏胶带技术领域,具体涉及一种弹性压敏胶带的制备方法及弹性压敏胶带。
背景技术
随着各类智能电子产品对抗跌落、抗变形、防水防尘的要求越来越苛刻,硬件生产商迫切需要高性能的缓冲吸能类材料来实现上述功能。目前市场上的具有缓冲性能的压敏胶带大部分为泡棉胶带。
泡棉胶带是使用泡棉为基材做成的一种胶带产品,这种胶带比普通胶带厚,具有较好的密封减震作用,可使用在多种场合中。常见的泡棉为聚烯烃或聚氨酯类的发泡材料,通过螺杆机等设备将聚烯烃或聚氨酯加热剪切至高温熔融状态,并与电子束激发的发泡剂进行共混,再经挤出成型、辐照发泡、切割定型等工艺完成最终的带材泡棉制造。泡棉胶带一般要将压敏胶水涂布在离型膜上,固化后再贴合到泡棉上。这种泡棉胶带,由于其使用的泡棉带材自身的特性,在制造和应用中往往存在一些固有不足:(1)由于泡棉材料使用的是聚烯烃或聚氨酯类材料,耐热性不好,在没有足够的外界张力支持时,80℃就会出现不同程度的收缩、起拱等变形,这就导致泡棉带材不能经过高温制程,也就意味着不能使用胶水直接在泡棉表面涂布的工艺来制造泡棉胶带:溶剂型胶水需要高温除溶剂和固化,UV型胶水在长时间UV固化过程中同样会产生高温,两者都会导致泡棉变形,因此只能通过将压敏胶水涂布在离型膜上再贴合到泡棉上的方法制造泡棉胶带;而泡棉的表面能大多在32达因以下,这就导致泡棉胶带制造时,必须要通过电晕、预涂布附着力促进剂等方法来提高泡棉表面能,以此来确保压敏胶层可以与泡棉表面的贴合后粘结强度足够,制程工艺复杂,制造成本高。(2)泡棉胶带在组装到智能电子产品内部之前,需要先通过模切制程加工出各种形状的缓冲器件,而在模切过程中,由于聚烯烃或聚氨酯自身较脆,容易出现粉屑,而电子产品对洁净度要求高,这就使得组装过程中要时刻注意有泡棉胶带的器件是否产生了粉屑,增加了品质成本。(3)泡棉在发泡过程中形成的气泡结构,一旦在模切过程中遭到破坏,就会出现永久性的开放结构,这就导致水汽、灰尘非常容易从这些开放结构中侵入泡棉内部,并沿着泡棉内部的多孔结构穿过泡棉,导致很多对水汽、灰尘有严格限制的精密器件需要额外增加密封结构来避免污染,增加了结构成本。
有鉴于此,国内外多家企业开始尝试开发更优秀的泡棉胶带,例如通过调整泡棉的制造工艺,生产出闭孔结构的泡棉,以此为基材生产的泡棉胶带可以减少避免水汽和灰尘的侵入;或者在聚氨酯泡棉制造时中引入一些提高表面能的低聚物,提升泡棉的表面能,从而减少泡棉转涂压敏胶层时的预处理成本。这两种方法虽然可以改善泡棉胶带性能,但前者的闭孔结构只适用于大尺寸器件应用,小尺寸器件在模切过程中闭孔结构一旦遭到破坏,仍然会出现全通情况;而后者只能少量提升泡棉表面能,制造高粘泡棉胶带时仍然需要进行预处理。3M则采用极低交联密度黏弹体芯材与高交联密度黏弹体表层的方案,利用芯材在高频剪切下的高损耗因子特性,将外界冲击转化为芯材的力学松弛,以此种方式获得了类似泡棉胶带的缓冲性能。但此种方案的缓冲性能要劣于泡棉基材胶带,仍然需要泡棉结构来补强。
现有技术中报道将可膨胀聚合物微球应用于粘合剂中通过模头挤压来获得压敏胶片材,后与衬垫层压形成粘合剂胶带;这一方法存在如下缺陷:(1)无法生产厚度较薄(小于200微米)的压敏粘合剂胶带,因此难以应用于超薄空间;(2)可膨胀聚合物微球在粘合剂组合物排出模头前只是被部分膨胀,挤出后仍然可以受热后继续膨胀,应用在电子器件的粘接中,存在继续膨胀导致器件破损的风险;(3)聚合物微球膨胀后外壳固定,最终形成的压敏胶片材弹性/可压缩性受限于微球外壳的机械强度,需要通过调整外壳的材质、厚度等来改变微球的弹性;(4)可膨胀聚合物微球生产工艺较为繁琐,壳材机械强度高,需要100℃以上高温来实现膨胀;(5)采用熔融挤出的工艺制造,上料设备庞大复杂,需要100℃以上高温来实现聚合物微球膨胀,能耗高,工艺较为繁琐。前述报道中的压敏胶片材并不适用于目前的轻薄型智能电子产品。
发明内容
为解决现有技术的不足,本发明的目的在于提供一种适用于轻薄型智能电子产品的弹性压敏胶带的制备方法,本发明的制备方法得到的弹性压敏胶带,压敏胶层本身具有弹性,突破传统泡棉带材的限制,不需要使用泡棉作为基材即可具备良好的缓冲性、压缩性;且本发明的制备方法与现有技术的弹性压敏胶带相比,制备工艺简单,适用于轻薄型智能电子产品的器件粘接、固定。
为实现上述目的,本发明提供如下方案。
本发明提出一种弹性压敏胶带的制备方法,包括如下步骤:
步骤(1)将胶水涂布在第一基底上,在UV固化烘道中固化10-30秒,使得胶水初步固化;其中胶水的组成包括质量份为1-20份类微胶囊粉体,100-200份含碳碳双键的聚丙烯酸酯树脂,20-50份含碳碳双键的稀释单体,1-10份光引发剂,1-3份抑制剂,30-50份液态增黏树脂,0-70份色浆;其中类微胶囊粉体的壳材包括水溶性高分子聚合物,芯材包括低沸点烷烃;
步骤(2)再进入70-100℃烘道中加热2-5分钟,使低沸点烷烃快速气化膨胀、撑破壳材,在聚丙烯酸酯树脂内部形成多个密闭气泡;
步骤(3)之后再进入UV固化烘道中固化20-40秒,使其完全固化,使得在第一基底上形成弹性压敏胶层,制得弹性压敏胶带。
本发明制备得到的弹性压敏胶层在0.5MPa下压缩比在20%-70%之间连续可调。
本发明提出的一种弹性压敏胶带的制备方法,其中,胶水的制备方法包括:先将20-50份含碳碳双键的稀释单体加入配胶容器,在搅拌状态下依次向其中加入30-50份液态增黏树脂、100-200份含碳碳双键的聚丙烯酸酯树脂与1-3份抑制剂,完全分散后,继续搅拌,向其中加入1-20份类微胶囊粉体;继续在搅拌状态下,依次向胶水中加入1-10份光引发剂,搅拌至光引发剂完全溶解后再加入0-70份色浆,搅拌均匀后过滤待用。
本发明提出的一种弹性压敏胶带的制备方法,其中,类微胶囊粉体的制备包括:将质量份为1-3份水性高分子聚合物溶胀在质量份为100-200份去离子水中,再将溶液的温度下降至4-8℃,加入质量份为3-5份液态低沸点烷烃,经乳化泵处理形成乳液,乳液直径控制在2-5μm,再冷冻真空干燥除去水分,形成类微胶囊结构干燥粉体。
本发明提出的一种弹性压敏胶带的制备方法,其中,类微胶囊粉体的结构为壳-核结构,壳材包括水溶性高分子聚合物,芯材包括低沸点烷烃;其中壳材优选纤维素类水溶性高分子聚合物,更优选甲基纤维素、羧甲基纤维素、乙基纤维素、羟乙基纤维素、羟丙基纤维素、羟丙基甲基纤维素中的一种或多种。芯材优选正戊烷、异戊烷、新戊烷的一种或多种。本发明的类微胶囊粉体采用的壳材材质的强度较低,芯材气化膨胀过程中会使得壳撑破;因此本发明胶水、类微胶囊粉体的制备均在低温下制备,以及胶水、类微胶囊粉体的存储均在低温下存储,温度不能超过芯材的气化温度。
本发明提出的一种弹性压敏胶带的制备方法,其中,含碳碳双键的聚丙烯酸酯树脂的本体玻璃化转变温度范围为-40℃至-15℃,储能模量和损耗模量均小于105Pa。
本发明提出的一种弹性压敏胶带的制备方法,其中,含碳碳双键的稀释单体包括丙烯酸异冰片酯,丙烯酸月桂酯,丙烯酸十八烷基酯中的一种或多种;沸点在80-150℃。
本发明提出的一种弹性压敏胶带的制备方法,其中,液态增黏树脂优选为液态松香酯,软化点-10℃至15℃
本发明提出的一种弹性压敏胶带的制备方法,其中,光引发剂为184光引发剂,1127光引发剂,369光引发剂,TPO光引发剂中的一种或多种;优选的,使用上述四种光引发剂中的UVC和UVA型光引发剂复配。
本发明提出的一种弹性压敏胶带的制备方法,其中,抑制剂为对苯二酚。
本发明制备方法中,弹性压敏胶层的厚度可在50-250μm范围内任意调节。
本发明的第一基底优选为PET基材有机硅离型膜,20小时老化离型力10-50gf/25mm。本发明的第一基底还可以为现有技术的其他基底,只要满足基底能够承受固化过程中的温度和20小时老化离型力范围即可。
本发明的第一基底为离型膜时,本发明的弹性压敏胶带的制备方法还包括将步骤(3)得到的弹性压敏胶层的非基底面分别贴合于第二基底两面;其中第二基底为PET、PI、PC、PU中的一种,表面能为36-68达因/厘米。
本发明的第一基底为离型膜时,本发明的弹性压敏胶带的制备方法还包括将步骤(3)得到的弹性压敏胶层的非基底面对贴制得。
当本发明的第一基底采用非离型膜的其他基底时,本发明的弹性压敏胶带的制备方法还包括将步骤(3)得到的弹性压敏胶层的非基底面与第二基底贴合;其中,第二基底为离型膜。
本发明所述的弹性压敏胶带中第一基底上形成的弹性压敏胶层,自身具备弹性,密闭气泡是由于胶水在固化过程中形成。因为胶水的组成中包括类微胶囊粉体结构,且类微胶囊粉体的壳材采用了水溶性高分子聚合物,优选纤维素类水溶性高分子聚合物,芯材采用低沸点烷烃,在固化过程中,固化温度使得类微胶囊的芯材气化膨胀,撑破类微胶囊的壳材,最终由压敏胶包裹住气体,即在弹性压敏胶层中形成多个密闭气泡。本发明中的“多个”密闭气泡,对密闭气泡的个数没有特殊的限制,可以根据使用过程中所需的弹性、缓冲性等,选择合适的密闭气泡的数量,使得弹性压敏胶层在0.5MPa下压缩比在20%-70%之间连续可调,密闭气泡的直径分布范围为30-150μm。
本发明还提出了一种弹性压敏胶带,所述的弹性压敏胶带由上述制备方法得到。本发明得到的弹性压敏胶带可以是单面胶,也可以是双面胶。
本发明提出的一种弹性压敏胶带的制备方法及弹性压敏胶带,与现有技术相比,有益效果如下:
本发明提出的弹性压敏胶带的制备方法中,压敏胶带的主体成分采用含碳碳双键的聚丙烯酸酯树脂和含碳碳双键的稀释单体,乳液胶水中采用类微胶囊粉体结构,类微胶囊粉体的壳材采用了水溶性高分子聚合物,优选纤维素类水溶性高分子聚合物,芯材采用低沸点烷烃,通过芯材受热气化膨胀,壳材撑破,压敏胶包裹气体,在胶层中形成密闭气泡,类微胶囊的壳有效避免低沸点烷烃与溶剂、稀释单体互溶,可以通过控制类微胶囊直径来有效控制最终的密闭气泡直径,进而控制压敏胶层的压缩特性;同时类微胶囊在受热破裂时,壳材不会随着温度上升同步增大,最终压敏胶层的压缩特性完全由密闭气泡提供,较之聚合物外壳具有更好的可压缩性;且本发明的类微胶囊的制备工艺简单,对壳材强度无特殊要求,破壳温度低,不需要100℃以上高温来实现热膨胀。进一步,与现有技术泡棉胶带的制备、弹性胶层挤出工艺相比,本发明的工艺更简单,且得到的密闭气泡结构在涂布作业结束后已经膨胀完全,不会出现再膨胀,避免了由再膨胀导致的粘接器件损坏。
由本发明的方法制备得到的弹性压敏胶带中,第一基底上形成的弹性压敏胶层自身具有弹性,因此不需要泡棉作为基材;本发明的压敏胶带具有良好的缓冲性和压缩性。
本发明的制备方法得到的压敏胶带,由于弹性压敏胶层自身的压敏粘结特点,模切时不会出现粉屑污染情况,因此该弹性压敏胶带在模切时的粉屑污染要远优于传统泡棉胶带;同时这种弹性压敏胶可以根据实际应用需要定制厚度、粘性、压缩性,具有非常灵活的适用性。
本发明的制备方法得到的压敏胶带,切口处可以有很好的封闭性,模切过程中密闭气泡结构泡囊被破坏后,压敏胶体会流平填满空隙,水和空气均不能通过。
附图说明
图1本发明弹性压敏胶层侧截面,采用金相显微镜拍摄200倍拍摄照片。
图2普通泡棉侧截面,采用金相显微镜拍摄200倍拍摄照片。
具体实施方式
结合实施例对本发明的技术方案做进一步描述。以下实施例仅用于更加清楚地说明本发明的技术方案,而不能以此来限制本发明的保护范围。
本发明提出的弹性压敏胶带,制备方法包括:
步骤(1)将胶水涂布在第一基底上,在UV固化烘道中固化10-30秒,使得胶水初步固化;其中胶水的组成包括质量份为1-20份类微胶囊粉体,100-200份含碳碳双键的聚丙烯酸酯树脂,20-50份含碳碳双键的稀释单体,1-10份光引发剂,1-3份抑制剂,30-50份液态增黏树脂,0-70份色浆;其中类微胶囊粉体的壳材包括水溶性高分子聚合物,芯材包括低沸点烷烃;
步骤(2)再进入70-100℃烘道中加热2-5分钟,使低沸点烷烃快速气化膨胀、撑破壳材,在聚丙烯酸酯树脂内部形成多个密闭气泡;
步骤(3)之后再进入UV固化烘道中固化20-40秒,使其完全固化,使得在第一基底上形成弹性压敏胶层,制得弹性压敏胶带。
本发明的弹性压敏胶带制备方法还包括将步骤(3)得到的弹性压敏胶层的非基底面分别贴合于第二基底两面;其中第二基底为PET、PI、PC、PU中的一种,表面能为36-68达因/厘米;或将步骤(3)得到的弹性压敏胶层的非基底面对贴制得;其中第一基底为离型膜。
本发明的制备方法得到的弹性压敏胶带可以为单面胶或双面胶。
本发明所述的胶水的制备方法包括:先将20-50份UV固化型稀释单体加入配胶容器,在搅拌状态下依次向其中加入30-50份液态增黏树脂、100-200份含碳碳双键的聚丙烯酸酯树脂与1-3份抑制剂,完全分散后,继续搅拌,向其中加入1-20份类微胶囊粉体;继续在搅拌状态下,依次向胶水中加入1-10份光引发剂,搅拌至光引发剂完全溶解后再加入0-70份色浆,搅拌均匀后过滤待用。
本发明所述的类微胶囊粉体的制备包括:将质量份为1-3份水溶性高分子聚合物溶胀在质量份为100-200份去离子水中,再将溶液的温度下降至4-8℃,加入质量份为3-5份液态低沸点烷烃,经乳化泵处理形成乳液,乳液直径控制在2-5μm,再冷冻真空干燥除去水分,形成类微胶囊结构干燥粉体。
本发明提出的一种弹性压敏胶层、压敏胶带及压敏胶带的制备方法的具体实施例如下。以下为本发明的优选实施例,不能因此而理解为对本发明专利范围的限制。
实施例1
类微胶囊粉体原料配比:后述均为质量份组成,1份水溶性高分子聚合物甲基纤维素,100份去离子水,3份新戊烷。制备过程:将水溶性高分子聚合物甲基纤维素与去离子水充分搅拌分散,形成均匀的混合溶液,冷却至4-8℃;再将新戊烷与上述混合溶液混合,经乳化泵乳化处理,乳液直径控制在2-5μm。再将此乳液经真空冷冻干燥处理,获得类微胶囊粉体。
胶水配比:后述均为质量份组成,1份类微胶囊粉体,20份含碳碳双键的稀释单体,100份含碳碳双键的聚丙烯酸酯树脂,30份液态松香酯,1份光引发剂,1份抑制剂,无色浆。其中含碳碳双键的稀释单体为丙烯酸异冰片酯,含碳碳双键的聚丙烯酸酯树脂的本体玻璃化转变温度范围为-20℃至-15℃,储能模量和损耗模量均小于105Pa,液态松香酯软化点0-15℃,光引发剂为184光引发剂。
制备过程:准确按照配比称量好各组分,首先将丙烯酸异冰片酯稀释单体转移到配胶容器中,在搅拌状态下,依次向其中加入液态松香酯、含碳碳双键的聚丙烯酸酯树脂与抑制剂,完全分散后,继续搅拌,向其中加入制备好的类微胶囊粉体;继续在搅拌状态下,依次向胶水中加入184光引发剂,搅拌至光引发剂完全溶解后过滤待用。
弹性压敏胶带结构设计为无基材双面胶,第一基底选用厚度为50μm的PET基材单面有机硅离型膜,20小时老化离型力10-20gf/25mm。
使用刮刀型涂布线进行制造,烘道15节,每节烘道长度2米,每节烘道均具备UV固化灯组以及加热功能,机速设置为12米/分钟,开启第一节、第十四和十五节烘道的UV灯组,其余12节烘道不开启UV灯组,按照70℃-100℃的梯度设置温度,即第二节至第十三节烘道的温度依次设置为70℃,70℃,70℃,80℃,80℃,80℃,90℃,90℃,90℃,100℃,100℃,100℃。将胶水涂布在离型膜上,湿胶厚度控制在40-45μm,经过烘道,在离型膜上形成弹性压敏胶层,弹性压敏胶层厚度50-60μm,0.5MPa压强下压缩率达到20%。
将上述弹性压敏胶层的非贴合离型膜面经过对贴制程,制得无基材双面弹性压敏胶带,总厚度100-120μm(此厚度指两层弹性压敏胶层的厚度),180°剥离强度1400-1800gf/25mm。
实施例2
类微胶囊粉体原料配比:后述均为质量份组成,3份水溶性高分子聚合物,150份去离子水,4份新戊烷,1份异戊烷。制备过程:将水溶性高分子聚合物与去离子水充分搅拌分散,形成均匀的混合溶液,冷却至4-8℃;再将新戊烷、异戊烷与上述混合溶液混合,经乳化泵乳化处理,乳液直径控制在2-5μm。再将此乳液经真空冷冻干燥处理,获得类微胶囊粉体;其中水溶性高分子聚合物选用1份羧甲基纤维素,1份乙基纤维素和1份羟乙基纤维素。
胶水配比:后述均为质量份组成,20份类微胶囊粉体,50份含碳碳双键的稀释单体,200份含碳碳双键的聚丙烯酸酯树脂,50份液态松香酯,10份光引发剂,3份抑制剂,70份黑色色浆。其中含碳碳双键的稀释单体为20份丙烯酸月桂酯和30份丙烯酸十八烷基酯,含碳碳双键的聚丙烯酸酯树脂的玻璃化转变温度-30℃至-25℃,储能模量和损耗模量均小于105Pa;液态松香酯软化点-10℃至0℃,光引发剂为4份184光引发剂、3份369光引发剂与3份TPO光引发剂。
制备过程:准确按照配比称量好各组分,首先将含碳碳双键的稀释单体转移到配胶容器中,在搅拌状态下,依次向其中加入液态松香酯、含碳碳双键的聚丙烯酸酯树脂与抑制剂,完全分散后,继续搅拌,向其中加入制备好的类微胶囊粉体。继续在搅拌状态下,依次向胶水中加入光引发剂,搅拌至光引发剂完全溶解后再加入色浆,待搅拌均匀后过滤待用。
弹性压敏胶带结构设计为无基材双面胶,第一基底选用50μm厚度的PET基材单面有机硅离型膜,20小时老化离型力35-50gf/25mm。
使用刮刀型涂布线进行制造,烘道15节,每节烘道长度2米,每节烘道均具备UV固化灯组以及加热功能,机速设置为6米/分钟,开启第一节和第十四、十五节烘道的UV灯组,其余12节烘道不开启UV灯组,按照70℃-100℃的梯度设置温度,即第二节至第十三节烘道的温度依次设置为70℃,70℃,70℃,80℃,80℃,80℃,90℃,90℃,90℃,100℃,100℃,100℃。将胶水涂布在离型膜上,湿胶厚度控制在120-125μm,经过烘道,在离型膜上形成弹性压敏胶层,弹性压敏胶层厚度230-250μm,0.5MPa压强下压缩率达到53%。显微镜下观察胶层侧截面(模切后),可以发现孔洞结构都已流平(参见图1),而模切后的普通泡棉的侧界面的孔洞仍然存在(参见图2)。
将上述弹性压敏胶层的非贴合离型膜面经过对贴制程,制得无基材双面弹性压敏胶带,总厚度460-500μm(此厚度指两层弹性压敏胶层的厚度),180°剥离强度3000-3400gf/25mm。
实施例3
类微胶囊粉体原料配比:后述均为质量份组成,2份水溶性高分子聚合物,200份去离子水,4份新戊烷,1份正戊烷。制备过程:将水溶性高分子聚合物与去离子水充分搅拌分散,形成均匀的混合溶液,冷却至4-8℃;再将新戊烷、正戊烷与上述混合溶液混合,经乳化泵乳化处理,乳液直径控制在2-5μm。再将此乳液经真空冷冻干燥处理,获得类微胶囊粉体;其中水溶性高分子聚合物选用2份羟丙基甲基纤维素。
胶水配比:后述均为质量份组成,7份类微胶囊粉体,35份含碳碳双键的稀释单体,170份含碳碳双键的聚丙烯酸酯树脂,40份液态松香酯,7份光引发剂,2份抑制剂,30份蓝色色浆。其中含碳碳双键的稀释单体为10份丙烯酸异冰片酯和25份丙烯酸十八烷基酯,含碳碳双键的聚丙烯酸酯树脂的玻璃化转变温度-40℃至-35℃,储能模量和损耗模量均小于105Pa;液态松香酯软化点-5℃至10℃,光引发剂为4份1172、1份369与2份TPO。
制备过程:准确按照配比称量好各组分,首先将含碳碳双键的稀释单体转移到配胶容器中,在搅拌状态下,依次向其中加入液态松香酯、含碳碳双键的聚丙烯酸酯树脂与抑制剂,完全分散后,继续搅拌,向其中加入制备好的类微胶囊粉体。继续在搅拌状态下,依次向胶水中加入光引发剂,搅拌至光引发剂完全溶解后再加入色浆,待搅拌均匀后过滤待用。
弹性压敏胶带结构设计为有基材双面胶,第一基底采用离型膜选择75μm厚度的PET基材单面有机硅离型膜,20小时老化离型力20-35gf/25mm;第二基底采用PET基材,厚度选择25μm,表面能36-42达因/厘米。
使用刮刀型涂布线进行制造,烘道15节,每节烘道长度2米,每节烘道均具备UV固化灯组以及加热功能,机速设置为8米/分钟,开启第一、二节和第十四、十五节烘道的UV灯组,其余烘道不开启UV灯组,按照70℃-100℃的梯度设置温度,即第三节至第十三节烘道的温度依次设置为70,70,70,80,80,80,90,90,90,100,100。将胶水涂布在离型膜上,湿胶厚度控制在90-95μm,经过烘道,在离型膜上形成弹性压敏胶层,弹性压敏胶层厚度135-150μm,0.5MPa压强下压缩率达到37%。
制备方法还包括将上述得到的弹性压敏胶层的非贴合离型膜面面分别贴合于PET基材的两面,最终的成品为有基材双面胶。其中,总厚度295-325μm(此厚度指基材+两面弹性压敏胶层的厚度),180°剥离强度3000-3400gf/25mm。
实施例4
类微胶囊粉体原料配比:后述均为质量份组成,2份水溶性高分子聚合物,170份去离子水,2份新戊烷,2份异戊烷。制备过程:将水溶性高分子与去离子水充分搅拌分散,形成均匀的混合溶液,冷却至4-8℃;再将新戊烷、异戊烷与上述混合溶液混合,经乳化泵乳化处理,乳液直径控制在2-5μm。再将此乳液经真空冷冻干燥处理,获得类微胶囊粉体;其中水溶性高分子聚合物选用1份羟乙基纤维素和1份羟丙基纤维素。
胶水配比:后述均为质量份组成,18份类微胶囊粉体,43份含碳碳双键的稀释单体,135份含碳碳双键的聚丙烯酸酯树脂,35份液态松香酯,5份光引发剂,2份抑制剂,55份白色色浆。其中含碳碳双键的稀释单体为23份丙烯酸异冰片酯、10份丙烯酸月桂酯和10份丙烯酸十八烷基酯;含碳碳双键的聚丙烯酸酯树脂的玻璃化转变温度-25℃至-20℃,储能模量和损耗模量均小于105Pa;液态松香酯软化点-10℃至5℃,光引发剂为2份184、1份1172和2份TPO。
制备过程:准确按照配比称量好各组分,首先将含碳碳双键的稀释单体转移到配胶容器中,在搅拌状态下,依次向其中加入液态增黏树脂、含碳碳双键的聚丙烯酸酯树脂与抑制剂,完全分散后,继续搅拌,向其中加入制备好的类微胶囊粉体。继续在搅拌状态下,依次向胶水中加入光引发剂,搅拌至光引发剂完全溶解后再加入色浆,待搅拌均匀后过滤待用。
弹性压敏胶带结构设计为有基材双面胶,第一基底采用厚度为75μm的PET基材单面有机硅离型膜,20小时老化离型力20-35gf/25mm;第二基底采用厚度为25μm的PI基材,表面能64-68达因/厘米。
使用刮刀型涂布线进行制造,烘道12节,每节烘道长度2米,每节烘道均具备UV固化灯组以及加热功能,机速设置为4米/分钟,开启第一节和第十二节烘道的UV灯组,其余烘道不开启UV灯组,按照70℃-100℃的梯度设置温度,即第二节至第十一节烘道的温度依次设置为70℃,70℃,70℃,80℃,80℃,90℃,90℃,100℃,100℃,100℃。将胶水涂布在离型膜上,湿胶厚度控制在90-95μm,经过烘道,在离型膜上形成弹性压敏胶层,弹性压敏胶层厚度230-250μm,0.5MPa压强下压缩率达到70%。
制备方法还包括将上述得到的弹性压敏胶带的非贴合离型面面分别贴合于PI基材的两面,最终的成品为有基材双面胶。双面胶中,两层弹性压敏胶层的总厚度为485-525μm(此厚度指基材+两面弹性压敏胶层的厚度);180°剥离强度2300-2800gf/25mm。
以上仅为本发明的实施方式,其描述较为具体和详细,但是不能因此而理解为对本发明专利范围的限制。应当指出的是,对于本领域的普通技术人员来说,在不脱离本发明的构思的前提下,还可以做出若干变形和改进,这些均属于本发明的保护范围。

Claims (10)

1.一种弹性压敏胶带的制备方法,其特征在于,包括如下步骤:
步骤(1)将胶水涂布在第一基底上,在UV固化烘道中固化10-30秒,使得胶水初步固化;所述胶水的组成包括质量份为1-20份类微胶囊粉体,100-200份含碳碳双键的聚丙烯酸酯树脂,20-50份含碳碳双键的稀释单体,1-10份光引发剂,1-3份抑制剂,30-50份液态增黏树脂,0-70份色浆;所述类微胶囊粉体的壳材包括水溶性高分子聚合物,芯材包括低沸点烷烃;
步骤(2)再进入70-100℃烘道中加热2-5分钟,使低沸点烷烃快速气化膨胀、撑破壳材,在聚丙烯酸酯树脂内部形成多个密闭气泡;
步骤(3)之后再进入UV固化烘道中固化20-40秒,使其完全固化,使得在第一基底上形成弹性压敏胶层,制得弹性压敏胶带。
2.根据权利要求1所述的一种弹性压敏胶带的制备方法,其特征在于,所述胶水的制备方法包括:先将20-50份含碳碳双键的稀释单体加入配胶容器,在搅拌状态下依次向其中加入30-50份液态增黏树脂、100-200份含碳碳双键的聚丙烯酸酯树脂与1-3份抑制剂,完全分散后,继续搅拌,向其中加入1-20份类微胶囊粉体;继续在搅拌状态下,依次向胶水中加入1-10份光引发剂,搅拌至光引发剂完全溶解后再加入0-70份色浆,搅拌均匀后过滤待用。
3.根据权利要求2所述的一种弹性压敏胶带的制备方法,其特征在于,所述类微胶囊粉体的制备包括:将质量份为1-3份水性高分子聚合物溶胀在质量份为100-200份去离子水中,再将溶液的温度下降至4-8℃,加入质量份为3-5份液态低沸点烷烃,经乳化泵处理形成乳液,乳液直径控制在2-5μm,再冷冻真空干燥除去水分,形成类微胶囊结构干燥粉体。
4.根据权利要求1所述的一种弹性压敏胶带的制备方法,其特征在于,所述含碳碳双键的聚丙烯酸酯树脂的本体玻璃化转变温度范围为-40℃至-15℃,储能模量和损耗模量均小于105Pa;所述含碳碳双键的稀释单体包括丙烯酸异冰片酯,丙烯酸月桂酯,丙烯酸十八烷基酯中的一种或多种,沸点在80-150℃。
5.根据权利要求1所述的一种弹性压敏胶带的制备方法,其特征在于,液态增黏树脂为液态松香酯,软化点-10℃至15℃;光引发剂为184光引发剂,1127光引发剂,369光引发剂,TPO光引发剂中的一种或多种;或光引发剂包括在184、1127、369、TPO四种光引发剂中按照UVA与UVC型复配使用;抑制剂为对苯二酚。
6.根据权利要求1所述的一种弹性压敏胶带的制备方法,其特征在于,所述水溶性高分子聚合物为甲基纤维素、羧甲基纤维素、乙基纤维素、羟乙基纤维素、羟丙基纤维素、羟丙基甲基纤维素中的一种或多种;所述低沸点烷烃为正戊烷、异戊烷、新戊烷的一种或多种。
7.根据权利要求1所述的一种弹性压敏胶带的制备方法,其特征在于,密闭气泡的直径分布范围为30-150μm;弹性压敏胶层的厚度在50-250μm范围内任意调节。
8.根据权利要求1所述的一种弹性压敏胶带的制备方法,其特征在于,第一基底为PET基材有机硅离型膜,20小时老化离型力10-50gf/25mm。
9.根据权利要求1所述的一种弹性压敏胶带的制备方法,其特征在于,所述的制备方法还包括将步骤(3)得到的弹性压敏胶层的非基底面分别贴合于第二基底两面;其中第二基底为PET、PI、PC、PU中的一种,表面能为36-68达因/厘米;或将步骤(3)得到的弹性压敏胶层的非基底面对贴制得;其中第一基底为离型膜。
10.一种弹性压敏胶带,由权利要求1-9任一所述的制备方法制备得到。
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