CN110560918A - Processing method and device of display device - Google Patents
Processing method and device of display device Download PDFInfo
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- CN110560918A CN110560918A CN201810479242.1A CN201810479242A CN110560918A CN 110560918 A CN110560918 A CN 110560918A CN 201810479242 A CN201810479242 A CN 201810479242A CN 110560918 A CN110560918 A CN 110560918A
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- 238000003672 processing method Methods 0.000 title claims abstract description 15
- 238000005520 cutting process Methods 0.000 claims abstract description 148
- 238000005452 bending Methods 0.000 claims abstract description 59
- 238000012545 processing Methods 0.000 claims abstract description 58
- 230000003287 optical effect Effects 0.000 claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 16
- 238000004140 cleaning Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- -1 Polyethylene terephthalate Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- CFNHVUGPXZUTRR-UHFFFAOYSA-N n'-propylethane-1,2-diamine Chemical compound CCCNCCN CFNHVUGPXZUTRR-UHFFFAOYSA-N 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a processing method and a device of a display device, which relate to the technical field of display equipment, and the processing method of the display device comprises the following steps: placing a display device on a processing platform, wherein the display device comprises a circuit layer, an intermediate layer and a cutting layer which are sequentially overlapped; controlling a laser to emit a laser beam, wherein the laser beam is focused on a cutting layer of the display device through an optical path system; determining cutting parameters of the display device, and controlling a laser to cut a cutting layer of the display device according to the cutting parameters to form a plurality of cutting channels, wherein the cutting channels form bending areas; after the display device is cut, removing the cutting layer in the bending area; and bending the circuit layer and the middle layer where the bending area is located by taking the cutting channel as a reference. The thickness of the bending area of the display device can be effectively reduced, the bending of the display device is facilitated, and the manufacturing of a full-face screen is facilitated.
Description
Technical Field
The invention relates to the technical field of display equipment, in particular to a method and a device for processing a display device.
Background
With the continuous development of electronic technology, the current portable devices such as mobile phones, tablet computers and the like gradually develop towards a trend of higher screen occupation ratio, the so-called screen occupation ratio refers to the ratio of the screen display area to the area of a front panel, the larger the ratio is, the narrower the frame of the device is, and the stronger the visual impact force of the display picture on the screen is, so that the full-screen electronic devices are increasingly favored by consumers and are also an inevitable trend of future development of the electronic devices such as mobile phones and the like.
in the conventional method for manufacturing a flexible OLED (Organic Light-Emitting Diode) display, a flexible display is bent, and then an IC (integrated circuit) chip is attached to the bent area, so that the area of a display area of a screen is increased, thereby implementing a full-screen display.
in the process of implementing the invention, the inventor finds that at least the following problems exist in the prior art: the method is characterized in that the flexible display screen is directly bent, due to the stress action of the flexible display screen during bending, the inner radius and the outer radius of a bending area are different, the outer side material is stretched to generate tensile stress, the inner side material is compressed to generate compressive stress, and the material is easily damaged under the action of the inner stress and the outer stress, so that the circuit part on the screen is damaged, and the production yield of the display screen is reduced.
disclosure of Invention
In order to overcome the defects of related products in the prior art, the invention provides a processing method and a processing device of a display device, and solves the problem that the screen is possibly damaged due to the bending processing of the conventional flexible OLED display screen.
The invention provides a processing method of a display device, which comprises the following steps:
placing a display device on a processing platform, wherein the display device comprises a circuit layer, an intermediate layer and a cutting layer which are sequentially overlapped;
controlling a laser to emit a laser beam, wherein the laser beam is focused on a cutting layer of the display device through an optical path system;
Determining cutting parameters of the display device, and controlling a laser to cut a cutting layer of the display device according to the cutting parameters to form a plurality of cutting channels, wherein the cutting channels form bending areas;
after the display device is cut, removing the cutting layer in the bending area;
And bending the circuit layer and the middle layer where the bending area is located by taking the cutting channel as a reference.
In certain embodiments, the method further comprises:
And determining cutting parameters of the display device according to the size of the functional area of the display device, wherein the cutting parameters comprise laser parameters, the length and the depth of the cutting channel, and the range of the bending area on the circuit layer and the middle layer.
In some embodiments, the display device is bent from the circuit layer to the cutting layer with reference to the cutting line.
in certain embodiments, the method further comprises:
after the display device is cut and the cutting layer is removed, detecting whether the cutting layer remains in the bending area;
if so, deeply cleaning the residual cutting layer.
The invention also provides a processing device of a display device, which is applied to any one processing method of the display device, and is characterized by comprising the following steps: the device comprises a display device, a laser, a light path system, a processing platform, a motion assembly and a control module;
the processing platform is used for placing the display device, and the display device comprises a circuit layer, an intermediate layer and a cutting layer which are sequentially overlapped;
The laser is used for emitting laser beams to cut the cutting layer of the display device to form a plurality of cutting channels, and the cutting channels form bending areas;
the optical path system is used for guiding the laser beam emitted by the laser and focusing the laser beam on a cutting layer of the display device;
The moving assembly is used for removing the cutting layer in the bending area after the display device is cut, and bending the circuit layer and the middle layer where the bending area is located by taking the cutting channel as a reference;
And the control module is connected with the laser, the optical path system, the processing platform and the motion assembly and is used for determining the cutting parameters of the display device.
in some embodiments, the control module is specifically configured to:
and determining cutting parameters of the display device according to the size of the functional area of the display device, wherein the cutting parameters comprise laser parameters, the length and the depth of the cutting channel, and the range of the bending area on the circuit layer and the middle layer.
In some embodiments, the display device is bent from the circuit layer to the cutting layer with reference to the cutting line.
In some embodiments, the motion assembly is further configured to:
After the display device is cut and the cutting layer is removed, detecting whether the cutting layer remains in the bending area;
if so, deeply cleaning the residual cutting layer.
compared with the prior art, the invention has the following advantages:
According to the processing method of the display device, the buffer middle layer and the cutting layer are arranged on the display device, and the cutting layer of the region needing to be bent is removed through laser processing, so that the overall thickness of the region is reduced, the circuit part damage caused by stress action when the circuit layer of the display device is bent is effectively avoided, the thickness of the display device can be effectively reduced while the circuit layer is not damaged, the bending of the display device is facilitated, and the manufacturing of a whole screen is facilitated.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
fig. 1 is a schematic flow chart of a method for processing a display device according to the present invention;
fig. 2 is a schematic structural view of a display device according to the present invention;
FIG. 3 is a schematic diagram of a laser of the present invention performing a cutting process on a cutting layer of the display device;
Fig. 4 is a schematic diagram of the laser of the present invention after the cutting process of the cutting layer of the display device;
FIG. 5 is a schematic view showing a microscopic structure of a laser according to the present invention after cutting a cutting layer of the display device;
FIG. 6 is a schematic view of a bent display device according to the present invention;
fig. 7 is a schematic structural diagram of a processing apparatus for a display device according to the present invention.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely illustrative of some, but not all, of the embodiments of the invention, and that the preferred embodiments of the invention are shown in the drawings. This invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be construed as broadly as the present disclosure is set forth in order to provide a more thorough understanding thereof. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The terms "including" and "having," and any variations thereof, in the description and claims of this invention and the above-described drawings are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
fig. 1 is a schematic flow chart of a processing method of a display device according to the present invention, for bending the display device, and referring to fig. 1, the processing method of the display device includes the following steps:
S101: the display device is placed on the processing platform and comprises a circuit layer, a middle layer and a cutting layer which are sequentially stacked.
as shown in fig. 2, fig. 2 is a schematic structural diagram of a display device according to the present invention, the display device includes a circuit layer 10, an intermediate layer 20 and a cutting layer 30, which are sequentially stacked, in an embodiment of the present invention, the display device is a flexible OLED display screen, wherein the circuit layer 10 is a PI (polyimide film) material, a circuit is etched on the circuit layer 10, the intermediate layer 20 is a PSA (N-propyl ethylene diamine) glue material for buffering and adhering the circuit layer 10 and the cutting layer 30, so as to reduce an internal stress when the circuit layer 10 is bent, the cutting layer 30 is an outermost layer of the display device, the cutting layer 30 is a PET (Polyethylene terephthalate) material, of course, in other embodiments of the present invention, the circuit layer 10, the intermediate layer 20 and the cutting layer 30 may be other materials, the invention is not limited in this regard.
In order to make the display device more convenient to be mounted on a smart device (such as a mobile phone, a computer, etc.), the thickness of the bent portion of the display device needs to be reduced, in an embodiment of the present invention, the thickness of the circuit layer 10 may be 20um, the thickness of the intermediate layer 20 may be 30um, and the thickness of the dicing layer 30 may be 80um, although in other embodiments of the present invention, the thicknesses of the circuit layer 10, the intermediate layer 20, and the dicing layer 30 may be other values, which is not limited in the present invention.
S102: controlling a laser to emit a laser beam, wherein the laser beam is focused on a cutting layer of the display device through an optical path system;
The laser is a CO2 laser with a wavelength of 9.4um, but in other embodiments of the present invention, the laser may be other types and wavelengths of laser, which is not limited in the present invention. The laser beam emitted by the laser is focused to a cutting layer of the display device through the optical path system to process the cutting layer, wherein in one embodiment, the optical path system comprises: the beam expander is used for expanding and collimating the laser beam emitted by the laser so as to improve the collimation of the laser beam; the reflecting mirrors are used for changing the transmission direction of the laser beam, so that the light path arrangement is more flexible; the laser scanning galvanometer is used for changing the deflection direction of a laser beam at a high speed and is matched with the processing platform for processing to obtain rich processing tracks; and the focusing mirror is used for focusing the laser beam to obtain a small focusing light spot to cut the display device, so that the heat affected zone of laser processing is further reduced, and better processing quality is obtained. In one embodiment, the size of the focused light spot is about 15-20 um, and in other embodiments, the size of the focused light spot can be other values to adapt to more application ranges.
in the embodiment of the invention, two laser processing modes are mainly adopted, wherein the first mode is that the galvanometer scanning is used for processing, the position of the display device on the processing platform is kept unchanged, and the galvanometer is used for scanning at a high speed for processing; the second is that the processing platform drives the display device to move, and the laser focusing spot position remains unchanged, so as to obtain larger processing breadth, but the processing speed is generally below 800 mm/s. In practical application, the two processing modes are matched for use, and the method has wider application range.
s103: and determining cutting parameters of the display device, and controlling a laser to cut the cutting layer of the display device according to the cutting parameters to form a plurality of cutting channels, wherein the cutting channels form bending areas.
According to the embodiment of the invention, cutting parameters of the display device are determined according to the size of the functional area of the display device, wherein the cutting parameters comprise laser parameters, the length and the depth of the cutting channel, and the range of the bending area on the circuit layer 10 and the middle layer 20; the laser parameters specifically include energy of the laser beam, processing speed, scanning times, and the like.
in this scheme, the display device may be mainly divided into two parts, the first part is the functional region, specifically, the part of the display device used for displaying pictures during installation and use, and the second part, i.e., the bent part, is connected to a circuit main board inside a device (e.g., an intelligent terminal) where the display device is installed. In one embodiment, the display area is 5.5 "screen size, i.e. the functional area size: the length is about 12.18 cm, the width is about 6.85 cm, and the size of the display device may be 15 cm and 7 cm, so for the processing of the display device, the length of the bending region, i.e. the length of the cutting street, is equal to the width of the display device, and is 7 cm, and the width of the bending region may be adjusted according to the needs of the practical application, for example, 1.5mm or 2mm, etc.
Fig. 3 is a schematic diagram of a laser of the present invention cutting the cutting layer 30 of the display device, fig. 4 is a schematic diagram of the laser of the present invention cutting the cutting layer 30 of the display device, fig. 5 is a microscopic schematic diagram of the laser of the present invention cutting the cutting layer 30 of the display device, and as shown in fig. 3-5, in an embodiment of the present invention, the cutting streets are used to provide an avoidance space for the middle layer 20 and the circuit layer 10 when bending, wherein the range of the bending region on the circuit layer 10 and the middle layer 20 is determined according to the positions of the cutting streets, in an embodiment of the present invention, the cutting streets are two parallel straight lines, the distance between the two cutting streets is 1500um, the cutting depth of the cutting streets is 80um, in other embodiments of the present invention, the plurality of cutting streets may be in other numbers and distributed at different positions, the length and depth of the cutting lines and the distance between the cutting lines are selected according to actual cutting and bending requirements, and the embodiment of the invention is not limited thereto.
As for the laser parameters used in the processing, in one embodiment, the power of the laser beam is about 5-15W, a CO2 laser is used, the pulse frequency is 50-300kHz, and the processing speed is about 300-2000 mm/s.
S104: and after the display device is cut, removing the cutting layer in the bending area, and bending the circuit layer and the middle layer in which the bending area is located by taking the cutting channel as a reference.
Because the cutting layer 30 is the film that the PET material formed, consequently, after the cutting layer 30 processed out the cutting way, only need will buckle the district the film tears can accomplish and get rid of, easy operation has improved the efficiency of the processing of buckling, simultaneously, the film that the cutting layer 30 formed can reduce the production of pollutant, improves the processing yield of product.
Fig. 6 is a microscopic view of the display device after being bent according to the present invention, and referring to fig. 2, in an embodiment of the present invention, a bending direction of the display device is from outside to inside with reference to the scribe line, that is, the display device is bent from the circuit layer 10 to the scribe layer 30.
In some cases, under the influence of external factors, after the laser cuts and removes the cutting layer 30, there may still be a cutting layer 30 residue in the bending region, so as to achieve the bending processing of the display module, therefore, in the embodiment of the present invention, after cutting and removing the cutting layer 30, the display device is cut, whether there is a cutting layer 30 residue in the bending region is identified, and the depth cleaning is performed on the remaining cutting layer 30, where the identification may be manual operation for removing the cutting layer 30 after manual identification, or may be automatic detection on the cutting layer 30 by a visual detection technology, whether there is a cutting layer 30 residue in the bending region is identified, and when it is determined that there is a remaining cutting layer 30, the corresponding functional device is controlled to remove the remaining cutting layer 30; the removal method of the dicing layer 30 may be selected according to cost considerations and processing requirements, but the present invention is not limited thereto.
According to the processing method of the display device, the buffer middle layer 20 and the cutting layer 30 are arranged on the display device, so that the circuit part damage caused by stress during bending processing of the circuit layer 10 of the display device is effectively avoided, the thickness of the display device can be effectively reduced while the circuit layer 10 is not damaged, the bending of the display device is facilitated, and the manufacturing of a full-face screen is facilitated.
On the basis of the foregoing embodiments, the present invention further provides a processing apparatus for a display device, which is applied to the processing method for the display device according to any of the foregoing embodiments, fig. 7 is a schematic structural diagram of the processing apparatus for the display device according to the present invention, and referring to fig. 7, the processing apparatus for the display device includes a display device 1, a laser 2, an optical path system 3, a processing platform 4, a moving component 5, and a control module 6.
the processing platform 4 is used for placing the display device 1, and the display device 1 comprises a circuit layer 10, an intermediate layer 20 and a cutting layer 30 which are sequentially overlapped;
The laser 2 is used for emitting laser beams to cut the cutting layer 30 of the display device 1 to form a plurality of cutting channels, and the cutting channels form bending areas;
An optical path system 3 for guiding the laser beam emitted from the laser 2 and focusing the laser beam onto the cutting layer 30 of the display device 1;
Wherein, in one embodiment, the optical path system 3 comprises: the beam expander is used for expanding and collimating the laser beam emitted by the laser 2 so as to improve the collimation of the laser beam; the reflecting mirrors are used for changing the transmission direction of the laser beam, so that the light path arrangement is more flexible; the laser scanning galvanometer is used for changing the deflection direction of the laser beam at a high speed and is matched with the processing platform 4 for processing to obtain rich processing tracks; and the focusing mirror is used for focusing the laser beam to obtain a small focusing light spot to cut the display device 1, so that the heat affected zone of laser processing is further reduced, and better processing quality is obtained.
The moving assembly 5 is used for removing the cutting layer 30 in the bending area after the display device 1 is cut, and bending the circuit layer 10 and the middle layer 20 in which the bending area is located by taking the cutting path as a reference; after the moving assembly 5 cuts the display device 1 and removes the cutting layer 30, identifying whether the cutting layer 30 remains in the bending area, and performing deep cleaning on the remaining cutting layer 30; in the embodiment of the present invention, the motion assembly 5 is used to assist a laser to perform laser cutting, and the motion assembly 5 may further include a motion control unit and a mechanical unit, wherein the motion control unit controls the mechanical unit to perform a removing operation on the cutting layer 30, and the mechanical unit may be a robot or other mechanical structure.
The control module 6 is respectively connected with the laser 2, the optical path system 3, the processing platform 4 and the motion assembly 5 and is used for determining cutting parameters of the display device 1; the control module 6 determines cutting parameters of the display device 1 according to the functional area size of the display device 1, where the cutting parameters include laser parameters, the length and depth of the cutting path, and the range of the bending region on the circuit layer 10 and the intermediate layer 20.
according to the processing device of the display device, the buffer middle layer 20 and the cutting layer 30 are arranged on the display device 1, the cutting layer 30 of the region needing to be bent is removed through laser processing, and the overall thickness of the region is reduced, so that the damage of a circuit part caused by stress action when the circuit layer 10 of the display device 1 is bent is effectively avoided, the thickness of the display device 1 can be effectively reduced while the circuit layer 10 is not damaged, the bending of the display device 1 is facilitated, and the manufacturing of a whole screen is facilitated.
The processing apparatus for a display device according to the embodiment of the present invention can execute the processing method for a display device provided in the above embodiment, and the processing apparatus for a display device has the functional steps and beneficial effects corresponding to the processing method for a display device according to the above embodiment.
in the above embodiments provided by the present invention, it should be understood that the disclosed apparatus and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the modules is merely a logical division, and other divisions may be realized in practice, for example, a plurality of modules or components may be combined or integrated into another system, or some features may be omitted, or not executed.
the modules or components described as separate parts may or may not be physically separate, and parts shown as modules or components may or may not be physical modules, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules or components can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing detailed description, or equivalent changes may be made in some of the features of the embodiments. All equivalent structures made by using the contents of the specification and the attached drawings of the invention can be directly or indirectly applied to other related technical fields, and are also within the protection scope of the patent of the invention.
Claims (8)
1. a method of fabricating a display device, comprising:
Placing a display device on a processing platform, wherein the display device comprises a circuit layer, an intermediate layer and a cutting layer which are sequentially overlapped;
controlling a laser to emit a laser beam, wherein the laser beam is focused on a cutting layer of the display device through an optical path system;
determining cutting parameters of the display device, and controlling the laser beam to cut a cutting layer of the display device according to the cutting parameters to form a plurality of cutting channels, wherein the cutting channels form bending areas;
After the display device is cut, removing the cutting layer in the bending area;
and bending the circuit layer and the middle layer where the bending area is located by taking the cutting channel as a reference.
2. The method of manufacturing a display device according to claim 1, wherein the method further comprises:
and determining cutting parameters of the display device according to the size of the functional area of the display device, wherein the cutting parameters comprise laser parameters, the length and the depth of the cutting channel, and the range of the bending area on the circuit layer and the middle layer.
3. The method of manufacturing a display device according to claim 2, wherein the display device is bent in a direction from the circuit layer to the dicing layer with reference to the dicing streets.
4. the method of manufacturing a display device according to claim 1, wherein the method further comprises:
After the display device is cut and the cutting layer is removed, detecting whether the cutting layer remains in the bending area;
If so, deeply cleaning the residual cutting layer.
5. A processing apparatus for a display device, applied to the processing method for a display device according to any one of claims 1 to 4, comprising: the device comprises a display device, a laser, a light path system, a processing platform, a motion assembly and a control module;
the processing platform is used for placing the display device, and the display device comprises a circuit layer, an intermediate layer and a cutting layer which are sequentially overlapped;
the laser is used for emitting laser beams to cut the cutting layer of the display device to form a plurality of cutting channels, and the cutting channels form bending areas;
The optical path system is used for guiding the laser beam emitted by the laser and focusing the laser beam on a cutting layer of the display device;
the moving assembly is used for removing the cutting layer in the bending area after the display device is cut, and bending the circuit layer and the middle layer where the bending area is located by taking the cutting channel as a reference;
And the control module is connected with the laser, the optical path system, the processing platform and the motion assembly and is used for determining the cutting parameters of the display device.
6. the processing apparatus of the display device according to claim 5, wherein the control module is specifically configured to:
and determining cutting parameters of the display device according to the size of the functional area of the display device, wherein the cutting parameters comprise laser parameters, the length and the depth of the cutting channel, and the range of the bending area on the circuit layer and the middle layer.
7. the apparatus for processing a display device according to claim 6, wherein the display device is bent in a direction from the circuit layer to the dicing layer with reference to the dicing streets.
8. the processing apparatus of the display device according to claim 5, wherein the motion assembly is further configured to:
After the display device is cut and the cutting layer is removed, detecting whether the cutting layer remains in the bending area;
If so, deeply cleaning the residual cutting layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810479242.1A CN110560918A (en) | 2018-05-18 | 2018-05-18 | Processing method and device of display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810479242.1A CN110560918A (en) | 2018-05-18 | 2018-05-18 | Processing method and device of display device |
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| Publication Number | Publication Date |
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| CN110560918A true CN110560918A (en) | 2019-12-13 |
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| CN201810479242.1A Pending CN110560918A (en) | 2018-05-18 | 2018-05-18 | Processing method and device of display device |
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