CN110549012A - 一种多色超短脉冲光丝隐切方法及装置 - Google Patents
一种多色超短脉冲光丝隐切方法及装置 Download PDFInfo
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- CN110549012A CN110549012A CN201910857217.7A CN201910857217A CN110549012A CN 110549012 A CN110549012 A CN 110549012A CN 201910857217 A CN201910857217 A CN 201910857217A CN 110549012 A CN110549012 A CN 110549012A
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- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 42
- 238000005520 cutting process Methods 0.000 claims abstract description 40
- 230000000694 effects Effects 0.000 claims abstract description 14
- PLXMOAALOJOTIY-FPTXNFDTSA-N Aesculin Natural products OC[C@@H]1[C@@H](O)[C@H](O)[C@@H](O)[C@H](O)[C@H]1Oc2cc3C=CC(=O)Oc3cc2O PLXMOAALOJOTIY-FPTXNFDTSA-N 0.000 claims abstract description 6
- 230000002035 prolonged effect Effects 0.000 claims abstract description 6
- 230000001427 coherent effect Effects 0.000 claims abstract description 5
- 230000003287 optical effect Effects 0.000 claims description 20
- 238000001816 cooling Methods 0.000 claims description 12
- 239000013307 optical fiber Substances 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 3
- 238000003698 laser cutting Methods 0.000 claims description 3
- 229910052594 sapphire Inorganic materials 0.000 claims description 3
- 239000010980 sapphire Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 10
- 210000002381 plasma Anatomy 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 238000011161 development Methods 0.000 description 1
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
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- 238000012360 testing method Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
- H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
对比例1 | 对比例2 | 对比例3 | 实验例 | |
所耗时间(秒) | 109 | 55 | 7 | 1.5 |
激光功率(微焦) | 100 | 34 | 65 | 107 |
Claims (8)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910857217.7A CN110549012B (zh) | 2019-09-11 | 2019-09-11 | 一种多色超短脉冲光丝隐切方法及装置 |
US16/926,842 US11646228B2 (en) | 2019-09-11 | 2020-07-13 | Stealth dicing method including filamentation and apparatus thereof |
Applications Claiming Priority (1)
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CN201910857217.7A CN110549012B (zh) | 2019-09-11 | 2019-09-11 | 一种多色超短脉冲光丝隐切方法及装置 |
Publications (2)
Publication Number | Publication Date |
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CN110549012A true CN110549012A (zh) | 2019-12-10 |
CN110549012B CN110549012B (zh) | 2021-07-09 |
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CN201910857217.7A Active CN110549012B (zh) | 2019-09-11 | 2019-09-11 | 一种多色超短脉冲光丝隐切方法及装置 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111439924A (zh) * | 2020-04-28 | 2020-07-24 | 深圳市东赢激光设备有限公司 | 一种大幅面玻璃超快皮秒激光切割机的使用方法 |
Citations (8)
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---|---|---|---|---|
CN1434553A (zh) * | 2003-02-19 | 2003-08-06 | 南京大学 | 超晶格全固态红、黄、绿、蓝四色激光器的设置方法 |
CN1497802A (zh) * | 2002-09-29 | 2004-05-19 | 中国科学院福建物质结构研究所 | 一种可调谐红-绿-蓝-紫色激光器 |
CN104768698A (zh) * | 2012-11-14 | 2015-07-08 | 肖特公开股份有限公司 | 用于通过超短聚焦脉冲激光束制造线状成列的破坏部位的方法;用于借助超短聚焦激光束在使用保护气体环境的情况下分离工件的方法和设备 |
CN104914645A (zh) * | 2015-06-30 | 2015-09-16 | 中国科学院上海光学精密机械研究所 | 多色飞秒激光产生装置 |
CN105487320A (zh) * | 2015-11-17 | 2016-04-13 | 长春理工大学 | 飞秒激光在透明光学介质中的阵列成丝装置和方法 |
CN105633774A (zh) * | 2016-03-23 | 2016-06-01 | 孔令杰 | 多波长超短脉冲光纤激光光源 |
CN106853555A (zh) * | 2015-12-08 | 2017-06-16 | 彭翔 | 材料加工中的激光聚焦控制方法 |
CN108788451A (zh) * | 2018-09-10 | 2018-11-13 | 杭州银湖激光科技有限公司 | 一种超快激光透明材料的加工方法及装置 |
-
2019
- 2019-09-11 CN CN201910857217.7A patent/CN110549012B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1497802A (zh) * | 2002-09-29 | 2004-05-19 | 中国科学院福建物质结构研究所 | 一种可调谐红-绿-蓝-紫色激光器 |
CN1434553A (zh) * | 2003-02-19 | 2003-08-06 | 南京大学 | 超晶格全固态红、黄、绿、蓝四色激光器的设置方法 |
CN104768698A (zh) * | 2012-11-14 | 2015-07-08 | 肖特公开股份有限公司 | 用于通过超短聚焦脉冲激光束制造线状成列的破坏部位的方法;用于借助超短聚焦激光束在使用保护气体环境的情况下分离工件的方法和设备 |
CN104914645A (zh) * | 2015-06-30 | 2015-09-16 | 中国科学院上海光学精密机械研究所 | 多色飞秒激光产生装置 |
CN105487320A (zh) * | 2015-11-17 | 2016-04-13 | 长春理工大学 | 飞秒激光在透明光学介质中的阵列成丝装置和方法 |
CN106853555A (zh) * | 2015-12-08 | 2017-06-16 | 彭翔 | 材料加工中的激光聚焦控制方法 |
CN105633774A (zh) * | 2016-03-23 | 2016-06-01 | 孔令杰 | 多波长超短脉冲光纤激光光源 |
CN108788451A (zh) * | 2018-09-10 | 2018-11-13 | 杭州银湖激光科技有限公司 | 一种超快激光透明材料的加工方法及装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111439924A (zh) * | 2020-04-28 | 2020-07-24 | 深圳市东赢激光设备有限公司 | 一种大幅面玻璃超快皮秒激光切割机的使用方法 |
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