CN110544657A - Tool and system for automatic gold wire bonding machine - Google Patents
Tool and system for automatic gold wire bonding machine Download PDFInfo
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- CN110544657A CN110544657A CN201910955889.1A CN201910955889A CN110544657A CN 110544657 A CN110544657 A CN 110544657A CN 201910955889 A CN201910955889 A CN 201910955889A CN 110544657 A CN110544657 A CN 110544657A
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 26
- 238000007599 discharging Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000001179 sorption measurement Methods 0.000 claims description 9
- 239000010408 film Substances 0.000 description 67
- 239000000463 material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67138—Apparatus for wiring semiconductor or solid state device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
The invention relates to a tool and a system used on an automatic gold wire bonding machine, comprising a positioning and clamping device used for positioning and clamping a double-row pin product shell (305) on a platform of the automatic gold wire bonding machine; the positioning and clamping device comprises a tool frame (301) arranged on a platform of the automatic gold wire bonding machine, rack bar slideways (307) longitudinally arranged at two sides of the tool frame (301), a tube shell support bar (304) with lower end legs at two sides positioned in the rack bar slideways (307) and used for placing a double-row lead product shell (305), positioning holes arranged at two ends of the tube shell support bar (304), and a pin control lifting push rod (308) arranged at a bonding station of the tool frame (301).
Description
Technical Field
The invention relates to a tool and a system for an automatic gold wire bonding machine.
Background
the wire bonding realizes the excellent electrical interconnection function of microelectronic products and is widely applied in the field of microelectronics. Automated wire bonding technology has absolute advantages as an advanced wire bonding technology. The automatic bonding technology is to automatically complete the process of wire bonding by executing a corresponding program through an automatic bonding machine. The automatic bonding has the advantages of controllability, good consistency, high reliability and the like. With the continuous development of electronic packaging technology, microwave components are continuously developing towards miniaturization, high density, high reliability, high performance and large batch, higher requirements are provided for controllability, high consistency, high reliability and high production efficiency of products, and the trend of realizing automatic production in compliance with the development trend becomes a trend.
Disclosure of Invention
The invention aims to solve the technical problem of providing a tool, a system and a method for an automatic gold wire bonding machine.
in order to solve the problems, the technical scheme adopted by the invention is as follows:
A tool used on an automatic gold wire bonding machine comprises a positioning and clamping device used for positioning and clamping a double-row pin product shell on a platform of the automatic gold wire bonding machine;
The positioning and clamping device comprises a tool frame arranged on a platform of the automatic gold wire bonding machine, frame strip slideways longitudinally arranged on two sides of the tool frame, tube support strips with lower end legs on two sides located in the frame strip slideways and used for placing double-row pin product shells, positioning holes arranged at two ends of the tube support strips, a pin control lifting push rod arranged at a bonding station of the tool frame, a lifting positioning pin arranged at the lower end of a telescopic head of the pin control lifting push rod and used for being inserted into the positioning holes, and frame strip adsorption holes arranged on the tube support strips and used for adsorbing the back faces of the double-row pin product shells.
As a further improvement of the above technical solution:
the frame strip slideway is matched with the tube shell support strip by a T-shaped key groove or a dovetail key rail;
And the tool frame is provided with a platform heating pipe for heating the lower surface of the pipe shell support strip.
A frame conveying channel extending to a bonding station is arranged at a feeding station of the tool frame; a frame conveying manipulator is arranged on the frame conveying channel, and a frame conveying U-shaped support hand for supporting a tube shell support strip from a feeding station to a bonding station is arranged on the frame conveying manipulator;
a discharge station of the tool frame is provided with a frame outlet channel extending to the bonding station; the frame outlet channel is provided with a frame outlet manipulator, and the frame outlet manipulator is provided with a frame outlet U-shaped support hand for supporting the tube shell support strip from the bonding station to the discharging station.
A tool used on an automatic gold wire bonder comprises a feeding device which is used for conveying a double-row pin product shell to the automatic gold wire bonder;
The feeding device comprises a feeding rack arranged on one side of a feeding station of the automatic gold wire bonder, a feeding lifting frame arranged on the feeding rack in a lifting manner, a feeding frame base arranged on the feeding lifting frame, feeding frame side frames arranged on two sides of the feeding frame base, a feeding vertical guide sleeve vertically arranged at the lower end of the feeding rack, a feeding vertical guide rod vertically arranged at the lower end of the feeding lifting frame and vertically movable in the feeding vertical guide sleeve, a feeding auxiliary spring arranged between the feeding vertical guide sleeve and the feeding vertical guide rod, a feeding clamping position vertical rod vertically arranged at the lower end of the feeding lifting frame, feeding unidirectional right-angle teeth vertically distributed on the side wall of the feeding clamping position vertical rod, feeding clamping position movable right-angle teeth with right-angle parts hinged on the feeding rack and used for being matched with the feeding unidirectional right-angle teeth, and a feeding unidirectional positioning block arranged on one side of the vertical edge of the feeding clamping position rectangular right-angle teeth, The feeding clamping position upper stop block is arranged above the horizontal right-angle side of the feeding clamping position movable right-angle tooth;
The feeding frame base and the feeding frame side frame are of U-shaped structures;
The feeding unidirectional right-angle tooth is of a right-angled triangle structure, the bevel edge is positioned above a right-angle edge, and the other right-angle edge is connected with the feeding clamping position vertical rod;
the movable right-angle tooth of the feeding clamping position is of a right-angled triangle structure, the bevel edge is positioned below a right-angle edge, and the other right-angle edge is positioned on one side far away from the feeding unidirectional right-angle tooth.
As a further improvement of the above technical solution:
A horizontal guide rail is arranged on the feeding rack, a feeding descending driving piece is horizontally and reciprocally arranged on the horizontal guide rail, and the movable end of the feeding descending driving piece is connected with a feeding unidirectional positioning block; a feeding clamping position return spring is arranged between the feeding clamping position movable right-angle tooth horizontal right-angle edge and the feeding clamping position upper stop block.
A linkage lifting rack is vertically arranged on the feeding lifting frame, a linkage lifting gear meshed with the linkage lifting rack is arranged on the feeding rack, and a linkage driving ratchet wheel is coaxially arranged on the linkage lifting gear; a transverse linkage frame is arranged above the linkage driving ratchet wheel, a linkage hinged right-angle shifting tooth is hinged to the lower end of the transverse linkage frame, a linkage shifting tooth reset spring is connected between the transverse linkage frame and the linkage hinged right-angle shifting tooth, a transverse driving arm is connected to the front end of the transverse linkage frame, and a feeding mechanical head which reciprocates between a feeding frame base and a feeding station of the automatic gold wire bonding machine is connected to the front end of the transverse driving arm;
a feeding suction nozzle lifting driving piece is arranged on the feeding mechanical head, the lower end of the feeding suction nozzle lifting driving piece is connected with a feeding negative pressure suction nozzle used for adsorbing a double-row pin product shell, and the feeding negative pressure suction nozzle is externally connected with a feeding suction nozzle negative pressure pipeline communicated with a vacuum pump/air pump
A transverse pushing cylinder and a transverse guide rail are horizontally arranged on the feeding rack, and a piston rod of the transverse pushing cylinder penetrates through the transverse guide rail and then is connected with the tail of the transverse linkage rack.
A film dismounting device is arranged on the feeding mechanical head;
The film dismounting device comprises a film lower driving push rod which is arranged on the feeding mechanical head in an inverted mode, a film hollow puncturing head which is arranged at the lower end of the film lower driving push rod, and a film arc end which is arranged at the lower end of the film hollow puncturing head, is used for contacting the upper surface of the film dismounting device and is used for puncturing a film.
a film end notch is formed in the lower end of an outlet of the film hollow puncturing head, a film central jet pipeline is arranged in the film hollow puncturing head, the upper end of the film central jet pipeline penetrates through the film lower driving push rod and then is connected with an air compressor/air pump, and air flow sprayed by the film central jet pipeline is injected into a gap between the film and a double-row pin product shell through the film end notch;
And a film hooking hand which is operated by a mechanical hand to take out the film on the plastic package double-row pin product shell is arranged at the feeding station of the automatic gold wire bonding machine.
A system used on an automatic gold wire bonder comprises the automatic gold wire bonder and a tool matched with the automatic gold wire bonder and used on the automatic gold wire bonder;
The tool used on the automatic gold wire bonding machine comprises a positioning and clamping device used for positioning and clamping a double-row pin product shell on a platform of the automatic gold wire bonding machine and a feeding device used for conveying the double-row pin product shell to a feeding station of the positioning and clamping device.
drawings
fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic structural diagram of a first component of the present invention.
Fig. 3 is a schematic structural view of a second component of the present invention.
Fig. 4 is a schematic structural diagram of part one of the present invention.
Fig. 5 is a schematic structural view of part two of the present invention.
Fig. 6 is a schematic structural view of part three of the present invention.
wherein: 301. a tooling frame; 302. a lifting positioning pin; 303. a platform heating pipe; 304. a tube shell support strip; 305. a double-row pin product housing; 306. a rack bar adsorption hole; 307. a rack bar slideway; 308. the pin controls the lifting push rod; 309. a rack conveying channel; 310. a frame conveying manipulator; 311. a U-shaped support arm is delivered; 312. a rack discharging channel; 313. a rack discharging manipulator; 314. taking out the U-shaped bracket; 315. a feeding rack; 316. a feeding lifting frame; 317. a feeding frame base; 318. a loading frame side frame; 319. feeding a vertical guide sleeve; 320. a feeding vertical guide rod; 321. a feeding auxiliary spring; 322. a material loading clamping vertical rod; 323. feeding unidirectional right-angle teeth; 324. the feeding clamping position is provided with a movable right-angle tooth; 325. a feeding unidirectional positioning block; 326. a material loading drop drive; 327. a feeding clamping position return spring; 328. a stop block is arranged on the feeding clamping position; 329. a linkage lifting rack; 330. a linkage lifting gear; 331. the ratchet wheel is driven in a linkage manner; 332. a feeding mechanical head; 333. a feeding negative pressure suction nozzle; 334. the feeding suction nozzle lifts the driving piece; 335. a negative pressure pipeline of the feeding suction nozzle; 336. a transverse pushing cylinder; 337. a transverse guide rail; 338. a transverse linkage frame; 339. the right-angle shifting teeth are hinged in a linkage manner; 340. a linkage shifting tooth return spring; 341. a transverse driving arm; 342. a film removal device; 343. a driving push rod under the film; 344. a film hollow thorn head; 345. a thin film arc end; 346. a film end notch; 347. a thin film central jet pipeline; 348. the film hooks the hand.
Detailed Description
as shown in fig. 1 to 6, the tooling for the gold wire bonder in this embodiment includes a positioning and clamping device for positioning and clamping the dual-column lead product housing 305 on the platform of the gold wire bonder; thereby realized location and centre gripping to replace artifical, the machining precision is high, the commonality is strong.
the positioning and clamping device comprises a tool frame 301 arranged on a platform of an automatic gold wire bonding machine, a rack bar slideway 307 longitudinally arranged on two sides of the tool frame 301 realizes guiding, a tube shell support bar 304 with lower end legs positioned in the rack bar slideway 307 and used for placing a double-row lead product shell 305 is used as a clamping fixture to realize supporting of a workpiece, positioning holes arranged at two ends of the tube shell support bar 304, a pin control lifting push rod 308 arranged at a bonding station of the tool frame 301, a lifting positioning pin 302 arranged at the lower end of a telescopic head of the pin control lifting push rod 308 and used for being inserted into the positioning holes so as to realize positioning during bonding operation, and a rack bar adsorption hole 306 arranged on the tube shell support bar 304 and used for adsorbing the back of the double-row lead product shell 305, so that auxiliary negative pressure adsorption is realized, and vibration is reduced.
The frame strip slide 307 and the tube shell support strip 304 are matched by a T-shaped key slot or a dovetail key track, so that the guiding is realized. (ii) a
the tool frame 301 is provided with a platen heating pipe 303 for heating the lower surface of the tube housing support bar 304. Thereby achieving auxiliary heating. .
A frame conveying channel 309 extending to a bonding station is arranged at the feeding station of the tool frame 301; a rack conveying manipulator 310 is arranged on the rack conveying channel 309, and a rack conveying U-shaped support hand 311 for supporting the shell support bar 304 from the feeding station to the bonding station is arranged on the rack conveying manipulator 310;
A rack outlet channel 312 extending to the bonding station is arranged at the discharging station of the tool frame 301; an ejection manipulator 313 is arranged on the ejection channel 312, and an ejection U-shaped holding hand 314 for holding the cartridge support bar 304 from the bonding station to the ejection station is arranged on the ejection manipulator 313. Thereby realized the automatic feeding and the automatic unloading of mould, greatly improved the automaticity.
the tool for the automatic gold wire bonder of the embodiment comprises a feeding device for feeding a double-row pin product shell 305 to the automatic gold wire bonder; thereby realizing automatic feeding of the bonding machine.
the feeding device comprises a feeding rack 315 arranged on one side of a feeding station of the automatic gold wire bonding machine, a feeding lifting frame 316 arranged on the feeding rack 315 in a lifting way can be driven to lift through a cylinder, a screw rod, a rack and the like, so that a workpiece is lifted by one station, the suction nozzle can be ensured to absorb quickly, a feeding frame base 317 arranged on the feeding lifting frame 316 is convenient for placing the workpiece, lateral supporting of feeding frame side frames 318 arranged on two sides of the feeding frame base 317 is realized, lifting guiding is realized by a feeding vertical guide sleeve 319 vertically arranged at the lower end of the feeding rack 315, a feeding vertical guide rod 320 vertically arranged at the lower end of the feeding lifting frame 316 and moving up and down in the feeding vertical guide sleeve 319 realizes guiding function, a feeding auxiliary spring 321 arranged between the feeding vertical guide sleeve 319 and the feeding vertical guide rod 320 realizes buffering function, a feeding clamping vertical upright rod 322 arranged at the lower end of the feeding lifting frame 316, The feeding unidirectional right-angle tooth 323 is vertically distributed on the side wall of the feeding clamping vertical rod 322, the feeding clamping position movable right-angle tooth 324 is hinged to the feeding rack 315 at the right angle and is used for being matched with the feeding unidirectional right-angle tooth 323, the feeding unidirectional positioning block 325 is arranged on one side of the vertical right-angle edge of the feeding clamping movable right-angle tooth 324, and the feeding clamping position upper stop block 328 is arranged above the horizontal right-angle edge of the feeding clamping movable right-angle tooth 324; therefore, automatic descending and locking are prevented when the lifting is realized, and automatic descending can be realized; 317 and a side frame 318 of the material loading frame are in a U-shaped structure, thereby facilitating the action of the suction nozzle.
the feeding unidirectional right-angle tooth 323 is of a right-angled triangle structure, the bevel edge is positioned above a right-angle edge, and the other right-angle edge is connected with the feeding clamping position vertical rod 322;
The feeding clamping position movable right-angle tooth 324 is of a right-angled triangle structure, the inclined edge is located below a right-angle edge, and the other right-angle edge is located on the side far away from the feeding unidirectional right-angle tooth 323. Other shapes which can realize one-way backstop are also possible, such as arc or crescent.
a horizontal guide rail is arranged on the feeding rack 315, a feeding descending driving piece 326 is horizontally and reciprocally arranged on the horizontal guide rail, and the movable end of the feeding descending driving piece 326 is connected with a feeding unidirectional positioning block 325; a feeding clamping position return spring 327 is arranged between the horizontal right-angle edge of the feeding clamping position movable right-angle tooth 324 and the feeding clamping position upper stop block 328. Playing a role of buffering.
A linkage lifting rack 329 is vertically arranged on the feeding lifting frame 316 so as to realize lifting drive control, a linkage lifting gear 330 meshed with the linkage lifting rack 329 is arranged on the feeding rack 315, and a linkage driving ratchet 331 is coaxially arranged on the linkage lifting gear 330; a transverse linkage frame 338 is arranged above the linkage driving ratchet 331, a linkage hinge right-angle shifting tooth 339 is hinged at the lower end of the transverse linkage frame 338, a linkage shifting tooth reset spring 340 is connected between the transverse linkage frame 338 and the linkage hinge right-angle shifting tooth 339, a transverse driving arm 341 is connected at the front end of the transverse linkage frame 338, and a feeding mechanical head 332 which reciprocates between a feeding frame base 317 and a feeding station of the automatic gold wire bonder is connected at the front end of the transverse driving arm 341; thereby realizing two action outputs of once power, reasonable structure, ingenious design and simplified transmission chain.
A feeding suction nozzle lifting driving piece 334 is arranged on the feeding mechanical head 332, a feeding negative pressure suction nozzle 333 for adsorbing the double-row pin product shell 305 is connected to the lower end of the feeding suction nozzle lifting driving piece 334, and a feeding suction nozzle negative pressure pipeline 335 communicated with a vacuum pump/air pump is externally connected to the feeding negative pressure suction nozzle 333; adsorption is realized by air suction, and release is realized by air outlet.
A transverse pushing cylinder 336 and a transverse guide rail 337 are horizontally arranged on the feeding rack 315, and a piston rod of the transverse pushing cylinder 336 passes through the transverse guide rail 337 and then is connected with the tail of the transverse linkage frame 338.
When the surface of the workpiece is provided with a film, the device is adopted. The loading mechanical head 332 is provided with a film dismounting device 342;
the film removing device 342 comprises a film lower driving push rod 343 which is inverted on the loading mechanical head 332 to move downwards, a film hollow puncturing head 344 which is arranged at the lower end of the film lower driving push rod 343, and a film arc end 345 which is arranged at the lower end of the film hollow puncturing head 344, is used for the upper surface contact of the film removing device 342 and is used for puncturing the film, so that the film can be punctured, and the workpiece can be prevented from being scratched.
A film end notch 346 is arranged at the lower end of the outlet of the film hollow bayonet 344, so that high-pressure gas can conveniently enter a film gap from the notch, and further convenience in separation of a film and a workpiece is realized, a film central jet pipeline 347 is arranged in the film hollow bayonet 344 and used for inputting gas flow, preferably high-temperature ion gas flow, so that static electricity and surface tension can be conveniently eliminated, and the film is separated, the upper end of the film central jet pipeline 347 penetrates through a film lower driving push rod 343 and then is connected with an air compressor/air pump, and the gas flow sprayed by the film central jet pipeline 347 is injected into the gap between the film and the double-row pin product shell 305 through the film end notch 346;
A film hook 348 operated by a mechanical hand to take out the film on the plastic package double-row pin product shell 305 is arranged at the feeding station of the automatic gold wire bonding machine. Thereby removing the separated film.
the system used on the automatic gold wire bonding machine comprises the automatic gold wire bonding machine and a tool matched with the automatic gold wire bonding machine and used on the automatic gold wire bonding machine;
The tool used on the automatic gold wire bonding machine comprises a positioning and clamping device used for positioning and clamping the double-row pin product shell 305 on the platform of the automatic gold wire bonding machine and a feeding device used for conveying the double-row pin product shell 305 to a feeding station of the positioning and clamping device. Thereby realizing automatic production.
the method for installing the tool on the automatic gold wire bonder comprises the following steps of firstly, installing a positioning and clamping device on a platform of the automatic gold wire bonder; then, mounting a feeding device on one side of a feeding station of the automatic gold wire bonding machine; and secondly, connecting the positioning and clamping device with the feeding device in a working procedure.
the installation of the positioning and clamping device comprises the following steps;
Firstly, a rack bar slide way 307, a rack conveying channel 309 and a rack discharging channel 312 are processed on a tooling frame 301, and rack bar adsorption holes 306 are processed on a tube shell support bar 304; then, the arms of the rack conveying manipulator 310 and the rack discharging manipulator 313 are respectively arranged on the corresponding rack conveying U-shaped bracket 311 and the corresponding rack discharging U-shaped bracket 314; secondly, placing a frame feeding U-shaped bracket 311 and a frame discharging U-shaped bracket 314 in the corresponding frame feeding channel 309 and frame discharging channel 312 respectively; thirdly, the tube shell support bar 304 is sent to the tooling frame 301 along the frame bar slide 307, the side wall of the sliding seat of the tube shell support bar 304 is ground, and the assembly precision of the side wall of the sliding seat and the frame bar slide 307 is adjusted to meet the bonding requirement of the double-row pin product shell 305; next, hoisting the tool frame 301 to the platform of the automatic gold wire bonding machine, and positioning and installing; then, according to the bonding station, assembling a pin control lifting push rod 308, installing a lifting positioning pin 302 at the lower end of the pin control lifting push rod 308, and drilling a positioning hole corresponding to the lifting positioning pin 302 on the tube shell support strip 304; and then, mounting a platform heating pipe 303 on the tool frame 301, and connecting the frame strip adsorption hole 306 with a vacuum pump/air pump. The installation is simple, and the maintenance is convenient.
the installation of the feeding device comprises the following steps;
Firstly, a feeding rack 315 is installed on one side of a feeding station of an automatic gold wire bonding machine, and a transverse pushing cylinder 336 is horizontally installed on the feeding rack 315; then, a transverse guide rail 337, a feeding vertical guide sleeve 319 and a feeding lifting frame 316 are installed on the feeding rack 315; secondly, a feeding frame base 317 and a feeding frame side frame 318 are arranged on a feeding lifting frame 316 to form a U-shaped structure, a feeding clamping vertical rod 322 and a feeding vertical guide rod 320 are arranged at the lower end of the feeding lifting frame 316, wherein after a feeding auxiliary spring 321 is arranged on the feeding vertical guide rod 320, the feeding auxiliary spring is inserted into a feeding vertical guide sleeve 319, and a feeding unidirectional right-angle tooth 323 is arranged on one side of the feeding clamping vertical rod 322; thirdly, a feeding clamping movable right-angle tooth 324 is installed on the feeding rack 315, wherein the feeding clamping movable right-angle tooth 324 is of a right-angled triangle structure, the bevel edge of the feeding clamping movable right-angle tooth is located below a right-angle edge, the other right-angle edge of the feeding clamping movable right-angle tooth is located on the side far away from the feeding unidirectional right-angle tooth 323, a feeding clamping upper stop 328 and a feeding unidirectional positioning block 325 are distributed at the upper end and the lower end of the feeding clamping movable right-angle tooth 324, the feeding clamping movable right-angle tooth 324 is connected with the feeding clamping upper stop 328 through a feeding clamping return spring 327, the feeding lifting frame 316 is connected with the feeding unidirectional positioning block 325, and the position of the feeding unidirectional positioning block 325 is adjusted according to the swing amplitude of the feeding clamping movable right-angle tooth 324; next, a piston rod of a transverse pushing cylinder 336 penetrates through a transverse guide rail 337 and then is connected with the tail of a transverse linkage frame 338, a linkage hinge right-angle shifting tooth 339 is distributed on the lower surface of the transverse linkage frame 338, a linkage shifting tooth reset spring 340 is connected between the transverse linkage frame 338 and the linkage hinge right-angle shifting tooth 339, the front end of the transverse linkage frame 338 is connected with a transverse driving arm 341, and the front end of the transverse driving arm 341 is connected with a feeding mechanical head 332 which reciprocates between a feeding frame base 317 and a feeding station of the automatic gold wire bonding machine;
firstly, installing a feeding suction nozzle lifting driving piece 334 on the feeding clamping vertical rod 322; then, a feeding negative pressure suction nozzle 333 is arranged at the lower end of the feeding suction nozzle lifting driving piece 334 and is connected with a feeding suction nozzle negative pressure pipeline 335 communicated with a vacuum pump/air pump through a reversing valve;
step three, firstly, a linkage lifting rack 329 is vertically arranged on the feeding lifting frame 316, a linkage lifting gear 330 meshed with the linkage lifting rack 329 is arranged on the feeding rack 315, and a linkage driving ratchet 331 is coaxially arranged on the linkage lifting gear 330 and corresponds to the linkage shifting tooth reset spring 340;
step four, a film dismounting device 342 is arranged on the feeding mechanical head 332; firstly, a film central jet pipeline 347 is inserted into a film lower driving push rod 343; then, the film lower driving push rod 343 is inverted on the loading mechanical head 332; secondly, the length of the hollow thorn head 344 extending downwards is adjusted;
and step five, installing a film hook 348 operated by a manipulator and used for taking out the film on the plastic-sealed double-row pin product shell 305 at a feeding station of the automatic gold wire bonding machine.
in the tooling bonding method for the automatic gold wire bonder of the embodiment, firstly, a double-row pin product shell 305 is sent to a positioning and clamping device from a feeding device; then, an automatic gold wire bonder bonds the dual-column lead product housing 305 on the positioning and clamping device, and outputs the dual-column lead product housing 305 after bonding.
wherein, the step of conveying the double-row pin product shell 305 from the feeding device to the positioning and clamping device comprises the following steps;
step two, firstly, the double-row pin product shell 305 is stored on a feeding frame base 317; then, the feeding suction nozzle lifting driving piece 334 is started, and the feeding negative pressure suction nozzle 333 ascends after descending to adsorb the double-row pin product shell 305; next, the lateral pushing cylinder 336 is activated, and the lateral pushing cylinder 336 drives the lateral linkage frame 338 along the lateral guide 337; thirdly, the transverse linkage frame 338 drives the feeding mechanical head 332 to the feeding station of the automatic gold wire bonding machine through the transverse driving arm 341, and simultaneously, the linkage hinge right-angle shifting tooth 339 swings backwards after contacting the linkage driving ratchet 331, so that the linkage driving ratchet 331 is not driven to rotate
Secondly, the feeding negative pressure suction nozzle 333 sends the double-row pin product shell 305 to a positioning and clamping device;
step two, when the feeding mechanical head 332 returns, the linkage hinged right-angle shifting teeth 339 drive the linkage driving ratchet 331 to rotate, the linkage driving ratchet 331 drives the linkage lifting rack 329 to ascend through the linkage lifting gear 330, and the feeding lifting frame 316 drives the double-row pin product shell 305 in the feeding frame base 317 to ascend for a station to wait for being sucked; meanwhile, the material loading auxiliary spring 321 is used for assisting lifting, and the material loading one-way right-angle tooth 323 and the material loading clamping position movable right-angle tooth 324 are used for realizing one-way self-locking;
Step two, after the control of the feeding frame base 317, the feeding descending driving member 326 is pulled back, so that the one-way positioning block 325 is separated from the feeding clamping position movable right-angle tooth 324, and the feeding lifting frame 316 descends and resets under the buffering of the feeding auxiliary spring 321 under the action of self weight.
when the upper surface has a film, executing a second step A, firstly, driving the feeding negative pressure suction nozzle 333 to descend by the feeding suction nozzle lifting driving piece 334 to send the double-row pin product shell 305 to the positioning and clamping device; then, the film lower driving push rod 343 is started, so that the film arc end 345 is in pressure contact with the upper surface of the double-row pin product shell 305 and punctures the film; secondly, starting the film central jet pipeline 347, and feeding gas to separate the film from the double-row pin product shell 305; thirdly, the feeding negative pressure suction nozzle 333 moves upwards to tear the film; subsequently, the film hook 348 takes the film away to the garbage can, and the feeding negative pressure suction nozzle 333 blows air reversely;
when no film exists on the upper surface of the double-row pin product shell 305, executing a second step B, firstly, driving the feeding negative pressure suction nozzle 333 to descend by the feeding suction nozzle lifting driving piece 334 to send the double-row pin product shell 305 to the positioning and clamping device; then, the feeding negative pressure suction nozzle 333 resets after releasing the reverse blowing.
After the shell support bar 304 of the positioning and clamping device receives the sent double-row pin product shell 305, the following steps are executed;
firstly, the frame bar adsorption hole 306 adsorbs a double-row pin product shell 305; then, the frame-conveying manipulator 310 conveys the tube shell support bar 304 from the feeding station to the bonding station through a frame-conveying U-shaped supporting hand 311, and the pin control lifting push rod 308 controls the lifting positioning pin 302 to be inserted into the positioning hole; secondly, the platform heating pipe 303 heats the double-row pin product shell 305 to a specified temperature, and bonding operation is carried out; after the bonding is completed, the rack-out robot 313 outputs the cartridge rack bar 304.
The feeding negative pressure suction nozzle 333 resets after releasing by reverse blowing.
The automatic feeding device realizes multiple steps of automatic feeding, automatic positioning, automatic clamping, automatic output and the like, replaces manpower, and improves efficiency.
the invention has the advantages of reasonable design, low cost, firmness, durability, safety, reliability, simple operation, time and labor saving, capital saving, compact structure and convenient use.
The present invention has been fully described for a clear disclosure and is not to be considered as an exemplification of the prior art.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; it is obvious as a person skilled in the art to combine several aspects of the invention. And such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. The utility model provides a frock for on automatic gold wire bonder which characterized in that: the automatic gold wire bonder comprises a positioning and clamping device for positioning and clamping a double-row pin product shell (305) on an automatic gold wire bonder platform;
the positioning and clamping device comprises a tool frame (301) arranged on a platform of the automatic gold wire bonding machine, a rack bar slide way (307) longitudinally arranged on two sides of the tool frame (301), a tube shell support bar (304) with lower end legs on two sides located in the rack bar slide way (307) and used for placing a double-row pin product shell (305), positioning holes arranged at two ends of the tube shell support bar (304), a pin control lifting push rod (308) arranged at a bonding station of the tool frame (301), a lifting positioning pin (302) arranged at the lower end of a telescopic head of the pin control lifting push rod (308) and used for being inserted into the positioning holes, and a rack bar adsorption hole (306) arranged on the tube shell support bar (304) and used for adsorbing the back of the double-row pin product shell (305).
2. The tooling for the automatic gold wire bonding machine according to claim 1, wherein the frame strip slide way (307) is matched with the tube shell support strip (304) by a T-shaped key slot or a dovetail key track;
The tool framework (301) is provided with a platform heating pipe (303) for heating the lower surface of the pipe shell support strip (304).
3. The tooling for the automatic gold wire bonding machine according to claim 2, characterized in that a frame conveying channel (309) extending to the bonding station is arranged at the feeding station of the tooling frame (301); a rack conveying manipulator (310) is arranged on the rack conveying channel (309), and a rack conveying U-shaped supporting hand (311) used for supporting and lifting the shell support strip (304) from the feeding station to the bonding station is arranged on the rack conveying manipulator (310);
A rack outlet channel (312) extending to the bonding station is arranged at the discharging station of the tool frame (301); the rack outlet channel (312) is provided with a rack outlet manipulator (313), and the rack outlet manipulator (313) is provided with a rack outlet U-shaped support hand (314) for supporting and lifting the shell support bar (304) from the bonding station to the discharging station.
4. a tool used on an automatic gold wire bonder is characterized by comprising a feeding device which is used for conveying a double-row pin product shell (305) to the automatic gold wire bonder;
the feeding device comprises a feeding rack (315) arranged on one side of a feeding station of the automatic gold wire bonding machine, a feeding lifting frame (316) arranged on the feeding rack (315) in a lifting manner, a feeding frame base (317) arranged on the feeding lifting frame (316), feeding frame side frames (318) arranged on two sides of the feeding frame base (317), a feeding vertical guide sleeve (319) vertically arranged at the lower end of the feeding rack (315), a feeding vertical guide rod (320) vertically arranged at the lower end of the feeding lifting frame (316) and vertically movable in the feeding vertical guide sleeve (319), a feeding auxiliary spring (321) arranged between the feeding vertical guide sleeve (319) and the feeding vertical guide rod (320), a feeding clamping position vertical rod (322) vertically arranged at the lower end of the feeding lifting frame (316), feeding unidirectional right-angle teeth (323) vertically distributed on the side wall of the feeding clamping vertical rod (322), A feeding clamping position movable right-angle tooth (324) which is hinged on a feeding rack (315) at the right angle and is used for being matched with the feeding unidirectional right-angle tooth (323), a feeding unidirectional positioning block (325) arranged on one side of the vertical right-angle edge of the feeding clamping position movable right-angle tooth (324), and a feeding clamping position upper stop block (328) arranged above the horizontal right-angle edge of the feeding clamping position movable right-angle tooth (324);
The feeding frame base (317) and the feeding frame side frame (318) are of U-shaped structures;
The feeding unidirectional right-angle tooth (323) is of a right-angled triangle structure, the bevel edge is positioned above a right-angle edge, and the other right-angle edge is connected with a feeding clamping vertical rod (322);
The feeding clamping position movable right-angle tooth (324) is of a right-angled triangle structure, the bevel edge is located below a right-angle edge, and the other right-angle edge is located on one side far away from the feeding unidirectional right-angle tooth (323).
5. The tooling for the automatic gold wire bonding machine according to claim 4, wherein a horizontal guide rail is arranged on the feeding rack (315), a feeding descending driving piece (326) is horizontally and reciprocally arranged on the horizontal guide rail, and the movable end of the feeding descending driving piece (326) is connected with the feeding unidirectional positioning block (325); a feeding clamping position return spring (327) is arranged between the horizontal right-angle edge of the feeding clamping position movable right-angle tooth (324) and the feeding clamping position upper stop block (328).
6. the tooling for the automatic gold wire bonding machine according to claim 4 is characterized in that a linkage lifting rack (329) is vertically arranged on the loading lifting frame (316), a linkage lifting gear (330) meshed with the linkage lifting rack (329) is arranged on the loading rack (315), and a linkage driving ratchet wheel (331) is coaxially arranged on the linkage lifting gear (330); a transverse linkage frame (338) is arranged above the linkage driving ratchet wheel (331), a linkage hinge right-angle shifting tooth (339) is hinged to the lower end of the transverse linkage frame (338), a linkage shifting tooth reset spring (340) is connected between the transverse linkage frame (338) and the linkage hinge right-angle shifting tooth (339), a transverse driving arm (341) is connected to the front end of the transverse linkage frame (338), and a feeding mechanical head (332) which reciprocates between a feeding frame base (317) and a feeding station of the automatic gold wire bonding machine is connected to the front end of the transverse driving arm (341);
A feeding suction nozzle lifting driving piece (334) is arranged on the feeding mechanical head (332), the lower end of the feeding suction nozzle lifting driving piece (334) is connected with a feeding negative pressure suction nozzle (333) used for absorbing the double-row pin product shell (305), and the feeding negative pressure suction nozzle (333) is externally connected with a feeding suction nozzle negative pressure pipeline (335) communicated with a vacuum pump/air pump
A transverse pushing cylinder (336) and a transverse guide rail (337) are horizontally arranged on the feeding rack (315), and a piston rod of the transverse pushing cylinder (336) penetrates through the transverse guide rail (337) and then is connected with the tail of a transverse linkage frame (338).
7. the tooling for the automatic gold wire bonding machine according to claim 6, characterized in that a film dismounting device (342) is arranged on the feeding mechanical head (332);
the film disassembling device (342) comprises a film lower driving push rod (343) which is inverted on the feeding mechanical head (332), a film hollow puncturing head (344) which is arranged at the lower end of the film lower driving push rod (343), and a film arc end (345) which is arranged at the lower end of the film hollow puncturing head (344), is used for the upper surface contact of the film disassembling device (342) and is used for puncturing the film.
8. The tooling for the automatic gold wire bonding machine according to claim 7, wherein a film end notch (346) is arranged at the lower end of the outlet of the film hollow puncturing head (344), a film central jet pipeline (347) is arranged in the film hollow puncturing head (344), the upper end of the film central jet pipeline (347) passes through the film lower driving push rod (343) and then is connected with an air compressor/air pump, and the air flow sprayed by the film central jet pipeline (347) is injected into the gap between the film and the double-row pin product shell (305) through the film end notch (346);
A film hooking hand (348) which is operated by a mechanical hand and used for taking out a film on the plastic package double-row pin product shell (305) is arranged at a feeding station of the automatic gold wire bonding machine.
9. A system used on an automatic gold wire bonder is characterized by comprising the automatic gold wire bonder and a tool matched with the automatic gold wire bonder and used on the automatic gold wire bonder;
The tool used on the automatic gold wire bonding machine comprises a positioning and clamping device used for positioning and clamping a double-row pin product shell (305) on a platform of the automatic gold wire bonding machine and a feeding device used for conveying the double-row pin product shell (305) to a feeding station of the positioning and clamping device.
10. A system used on an automatic gold wire bonder is characterized by comprising a film dismounting device (342) arranged on a loading mechanical head (332); the film disassembling device (342) comprises a film lower driving push rod (343) which is inverted on the feeding mechanical head (332), a film hollow puncturing head (344) which is arranged at the lower end of the film lower driving push rod (343), and a film arc end (345) which is arranged at the lower end of the film hollow puncturing head (344), is used for the upper surface contact of the film disassembling device (342) and is used for puncturing the film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910955889.1A CN110544657A (en) | 2019-10-09 | 2019-10-09 | Tool and system for automatic gold wire bonding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910955889.1A CN110544657A (en) | 2019-10-09 | 2019-10-09 | Tool and system for automatic gold wire bonding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110544657A true CN110544657A (en) | 2019-12-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910955889.1A Pending CN110544657A (en) | 2019-10-09 | 2019-10-09 | Tool and system for automatic gold wire bonding machine |
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| Country | Link |
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| CN (1) | CN110544657A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117637608A (en) * | 2024-01-25 | 2024-03-01 | 中国科学院长春光学精密机械与物理研究所 | Method for manufacturing through silicon via |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0445654A1 (en) * | 1990-03-05 | 1991-09-11 | Tet Techno Investment Trust Settlement | Holding and positioning device for a substrate container |
| KR940022777A (en) * | 1993-03-30 | 1994-10-21 | 곽노권 | Separator for Semiconductor Package |
| US5685589A (en) * | 1995-07-27 | 1997-11-11 | Kabushiki Kaisha Shinkawa | Lead frame suction holding device |
| US5813590A (en) * | 1995-12-18 | 1998-09-29 | Micron Technology, Inc. | Extended travel wire bonding machine |
| US5839877A (en) * | 1995-07-13 | 1998-11-24 | Kabushiki Kaisha Shinkawa | Suction holding assembly for lead frames |
| TW426571B (en) * | 1998-10-19 | 2001-03-21 | Yamazaki Mazak Corp | Workpiece attaching and moving equipment and attaching end |
| CN1756462A (en) * | 2004-09-27 | 2006-04-05 | 日本特殊陶业株式会社 | Film peeling apparatus and method of manufacturing wiring board |
| CN203932032U (en) * | 2014-06-10 | 2014-11-05 | 天水华天微电子股份有限公司 | Integrated circuit metal-packaged shell location built-up jig |
| CN106989090A (en) * | 2017-04-28 | 2017-07-28 | 歌尔股份有限公司 | Cutting part pastes frock |
| CN208985972U (en) * | 2018-11-06 | 2019-06-14 | 泰州麒润电子有限公司 | A kind of lead frame production positioning device |
| CN210349790U (en) * | 2019-10-09 | 2020-04-17 | 青岛航天半导体研究所有限公司 | Gold wire bonding mould |
-
2019
- 2019-10-09 CN CN201910955889.1A patent/CN110544657A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0445654A1 (en) * | 1990-03-05 | 1991-09-11 | Tet Techno Investment Trust Settlement | Holding and positioning device for a substrate container |
| KR940022777A (en) * | 1993-03-30 | 1994-10-21 | 곽노권 | Separator for Semiconductor Package |
| US5839877A (en) * | 1995-07-13 | 1998-11-24 | Kabushiki Kaisha Shinkawa | Suction holding assembly for lead frames |
| US5685589A (en) * | 1995-07-27 | 1997-11-11 | Kabushiki Kaisha Shinkawa | Lead frame suction holding device |
| US5813590A (en) * | 1995-12-18 | 1998-09-29 | Micron Technology, Inc. | Extended travel wire bonding machine |
| TW426571B (en) * | 1998-10-19 | 2001-03-21 | Yamazaki Mazak Corp | Workpiece attaching and moving equipment and attaching end |
| CN1756462A (en) * | 2004-09-27 | 2006-04-05 | 日本特殊陶业株式会社 | Film peeling apparatus and method of manufacturing wiring board |
| CN203932032U (en) * | 2014-06-10 | 2014-11-05 | 天水华天微电子股份有限公司 | Integrated circuit metal-packaged shell location built-up jig |
| CN106989090A (en) * | 2017-04-28 | 2017-07-28 | 歌尔股份有限公司 | Cutting part pastes frock |
| CN208985972U (en) * | 2018-11-06 | 2019-06-14 | 泰州麒润电子有限公司 | A kind of lead frame production positioning device |
| CN210349790U (en) * | 2019-10-09 | 2020-04-17 | 青岛航天半导体研究所有限公司 | Gold wire bonding mould |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117637608A (en) * | 2024-01-25 | 2024-03-01 | 中国科学院长春光学精密机械与物理研究所 | Method for manufacturing through silicon via |
| CN117637608B (en) * | 2024-01-25 | 2024-05-14 | 中国科学院长春光学精密机械与物理研究所 | Method for manufacturing through silicon via |
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