CN117637608A - Method for manufacturing through silicon via - Google Patents
Method for manufacturing through silicon via Download PDFInfo
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- CN117637608A CN117637608A CN202410105230.8A CN202410105230A CN117637608A CN 117637608 A CN117637608 A CN 117637608A CN 202410105230 A CN202410105230 A CN 202410105230A CN 117637608 A CN117637608 A CN 117637608A
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- wall
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 29
- 239000010703 silicon Substances 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 87
- 238000005530 etching Methods 0.000 claims abstract description 55
- 230000007246 mechanism Effects 0.000 claims abstract description 38
- 238000001020 plasma etching Methods 0.000 claims abstract description 27
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000002210 silicon-based material Substances 0.000 claims abstract description 5
- 238000003860 storage Methods 0.000 claims description 40
- 239000007789 gas Substances 0.000 claims description 39
- 230000005540 biological transmission Effects 0.000 claims description 33
- 238000006073 displacement reaction Methods 0.000 claims description 32
- 230000000087 stabilizing effect Effects 0.000 claims description 28
- 230000033001 locomotion Effects 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 10
- 230000003014 reinforcing effect Effects 0.000 claims description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 3
- 229910052786 argon Inorganic materials 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 239000000460 chlorine Substances 0.000 claims description 3
- 229910052801 chlorine Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to the technical field of semiconductors, in particular to a method for manufacturing a through silicon via, which comprises the following steps: forming a groove at a position of the substrate, which is required to be prefabricated with a silicon through hole, and performing reactive ion etching on the substrate by utilizing reactive ion etching equipment to form the groove; an etching cavity is formed in the reactive ion etching equipment, a clamping mechanism and a uniform air outlet mechanism are arranged in the etching cavity, the uniform air outlet mechanism is connected with an external air supply system, and the reactive ion etching equipment is connected with a vacuumizing device; step two: forming an insulating layer on the top wall of the substrate with the grooves; after forming the insulating layer, removing the insulating layer at the bottom of the groove to reserve the insulating layer on the side wall of the groove; step three: growing a silicon material epitaxial layer on the surface of the insulating layer until the groove is filled, and then thinning the epitaxial layer until the insulating layer on the top wall of the substrate is exposed; step four: and thinning the back of the substrate until the grooves are exposed, and forming the through silicon vias filled with the epitaxial layers and the insulating layers. The invention can improve the etching quality of the substrate.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a method for manufacturing a through silicon via.
Background
Through-silicon via technology is an abbreviation for through-silicon via technology, which is the latest technology for realizing interconnection between chips by making vertical conduction between chips and between wafers. In the packaging process of the MEMS device, the electrical connection between the multiple layers of the device can also be realized by means of the through silicon via technology.
The method for manufacturing the through silicon via usually needs to form a groove on the substrate, and the common method comprises a reactive ion etching method, wherein the method needs to use a reactive ion etching device, but the current reactive ion etching device directly injects gas into an etching cavity through an air inlet, so that the gas can locally gather and disperse unevenly in the etching cavity, thereby causing poor etching uniformity and affecting the product quality.
Disclosure of Invention
The invention aims to provide a method for manufacturing a through silicon via, which aims to solve the technical problems and is realized by adopting the following technical scheme:
a method for manufacturing a through silicon via comprises the following steps:
step one: providing a substrate, forming a groove at a position, needing to be prefabricated with a silicon through hole, in the substrate, and performing reactive ion etching on the substrate by utilizing reactive ion etching equipment to form the groove;
an etching cavity is formed in the reactive ion etching equipment, a clamping mechanism and a uniform air outlet mechanism are arranged in the etching cavity, the uniform air outlet mechanism comprises an air charging hose, a displacement air outlet device, a fixed rod and a second piston, and the uniform air outlet mechanism is connected with an external air supply system;
the side wall of the reactive ion etching equipment is connected with a vacuumizing device through an exhaust pipe; the bottom wall of the etching cavity is communicated with the bottom wall of the reactive ion etching equipment through a connecting channel, a vacuumizing device is started to vacuumize the etching cavity, the air pressure in the etching cavity is gradually reduced, the external air pressure is larger than the air pressure in the etching cavity, and therefore the first piston is pushed upwards by the external air pressure and drives the second rack to move upwards;
step two: forming an insulating layer on the top wall of the substrate with the grooves;
after forming the insulating layer, removing the insulating layer at the bottom of the groove to reserve the insulating layer on the side wall of the groove;
step three: growing a silicon material epitaxial layer on the surface of the insulating layer until the groove is filled, and then thinning the epitaxial layer until the insulating layer on the top wall of the substrate is exposed;
step four: and thinning the back of the substrate until the grooves are exposed, and forming the through silicon vias filled with the epitaxial layers and the insulating layers.
The clamping mechanism comprises a substrate frame, a fixed plate is fixedly connected to the top wall of the substrate frame, a first groove body is formed in the substrate frame, a clamping plate is connected to the bottom wall of the first groove body in a sliding mode, the clamping plate is connected with the side wall of the first groove body through a first elastic piece, a second groove body is formed in the side wall of the clamping plate, a sliding sheet is connected to the bottom wall of the second groove body in a sliding mode, an extension strip is fixedly connected to the sliding sheet, the extension strip extends to the outside of the clamping plate, the sliding sheet is connected with the side wall of the second groove body through a second elastic piece, a reinforcing sheet is connected with the top wall of the second groove body through a rotating shaft in a rotating mode, a lug and a fixed head are fixedly connected to the reinforcing sheet, and the lug and the sliding sheet are abutted against each other;
the first transmission rear wall is connected with a first rack and a second rack in a sliding manner, the first transmission rear wall is connected with a spur gear in a rotating manner, the first rack and the second rack are respectively meshed with the spur gear, the upper end of the first rack extends into the first groove body, the first rack abuts against the clamping plate, the lower end of the second rack extends into the connecting channel, the lower end of the second rack is fixedly connected with a first piston, the first piston is connected with the inner wall of the connecting channel in a sliding manner, the side wall of the connecting channel is fixedly connected with a first limiting block and a second limiting block, and the second limiting block abuts against the first piston;
the substrate frame is an electrode and is electrically connected with an external power supply;
the substrate is placed on the top wall of the substrate frame, the substrate is located between the fixed plate and the clamping and stabilizing plate, the second rack drives the spur gear to rotate clockwise, the spur gear drives the first rack to move downwards, the clamping and stabilizing plate moves rightwards until the right wall of the clamping and stabilizing plate abuts against the left wall of the substrate under the action of the elastic force of the first elastic piece after losing the limit of the first rack, the extension bar and the sliding piece overcome the elastic force of the second elastic piece to move leftwards after abutting against the left wall of the substrate in the right moving process of the clamping and stabilizing plate, and the lug rotates clockwise around the rotating shaft under the elastic force of the third elastic piece after losing the limit of the sliding piece, so that the fixed head on the rotating shaft abuts against the top wall of the substrate to clamp and limit the horizontal direction clamping and the vertical direction clamping of the substrate are completed.
The uniform air outlet mechanism comprises an air charging hose, a displacement air outlet device, a fixed rod and a second piston, wherein the fixed rod is fixedly connected with the bottom wall of the etching cavity, the second piston is fixedly connected with the upper end of the fixed rod, the displacement air outlet device is provided with an air storage cavity communicated with the bottom wall of the displacement air outlet device, the second piston is slidably connected with the inner wall of the air storage cavity, one end of the air charging hose is communicated with the air storage cavity, and the other end of the air charging hose is connected with the external air supply system;
the side wall of the gas storage cavity is communicated with the outer side wall of the displacement gas outlet device through a gas outlet channel, a second transmission cavity is formed in the displacement gas outlet device, the rear wall of the second transmission cavity is connected with a baffle and a transmission bar in a sliding manner, the top wall of the baffle extends into the gas outlet channel, the top wall of the baffle is fixedly connected with a buffer plate, the buffer plate is propped against the top wall of the gas outlet channel, the baffle is connected with the top wall of the second transmission cavity through a fourth elastic piece, the bottom wall of the baffle is fixedly connected with a first wedge block, a second wedge block, a third wedge block and a locking bar are fixedly connected onto the transmission bar, the transmission bar extends into the gas storage cavity, the third wedge block is positioned in the gas storage cavity, the side wall of the second transmission cavity is fixedly connected with a lock seat, the side wall of the lock seat is provided with a lock groove, and a push type elastic self-locking mechanism is arranged in the lock groove and is adapted to the push type elastic self-locking mechanism and the locking bar;
the side wall of the fixed rod is provided with a third groove body and a fourth groove body, the rear wall of the third groove body is rotationally connected with a fourth wedge block, the fourth wedge block is connected with the top wall of the third groove body through a fifth elastic piece, the rear wall of the fourth groove body is rotationally connected with a wedge piece, and the wedge piece is connected with the bottom wall of the fourth groove body through a sixth elastic piece;
the external air supply system is used for introducing air into the air storage cavity through the air charging hose, the air storage cavity space above the second piston is gradually increased, so that the displacement air outlet device moves upwards, the third wedge block firstly pushes the fourth wedge block to overcome the elasticity of the fifth elastic piece and rotate clockwise, the third wedge block cannot horizontally displace at the moment, when the third wedge block moves upwards to be propped against the wedge block and then moves upwards to be above the wedge block, the third wedge block is pushed leftwards by the wedge block, so that the transmission bar, the second wedge block and the locking bar move leftwards, the locking bar is inserted into the locking groove and locked by the pressing elastic self-locking mechanism, the second wedge block pushes the first wedge block to move downwards, the baffle plate and the buffer plate are driven by the first wedge block to move downwards, the air outlet channel is changed into a communicated state, the air in the air storage cavity is sprayed into the air outlet channel through the air outlet channel, and the air outlet speed of the air outlet channel is larger than the air inlet speed of the air charging hose, the air pressure in the air storage cavity is gradually reduced, the displacement air outlet device gradually moves downwards, the air outlet channel keeps air outlet in the downward movement process of the displacement air outlet device, air is supplied to different positions in the etching cavity, the third wedge block pushes the wedge piece to rotate anticlockwise against the elastic force of the sixth elastic piece when moving downwards, so that the third wedge block continues to move downwards under the condition that horizontal movement cannot occur, after the third wedge block and the fourth wedge block are propped against each other, the fourth wedge block pushes the third wedge block and the locking strip to move leftwards for a certain distance, the locking strip releases the locking of the push type elastic self-locking mechanism, the third wedge block continues to move downwards to the position below the third groove body, the baffle moves upwards under the elastic force of the fourth elastic piece to reset, so that the buffer plate and the top wall of the air outlet channel are propped against each other, the baffle blocks the air outlet channel, the first wedge block pushes the second wedge block to move rightwards, and the air storage cavity space above the second piston is gradually increased again, so that the air outlet channel can reciprocate up and down and simultaneously jet out air.
The vacuum degree display device is characterized in that the vacuum degree display device is arranged on the exhaust tube, and whether the vacuum degree in the etching cavity reaches the standard is judged by observing the numerical value of the vacuum degree display device.
Advantageously, the fixing head is of silicone material.
Advantageously, the inflation hose is a plastic hose.
Advantageously, the sixth and fifth elastic members are each a leaf spring.
Advantageously, the gas provided by the external gas supply system comprises argon, oxygen, carbon tetrafluoride gas or chlorine.
The invention has the following beneficial effects:
when the groove is formed by etching the substrate, the clamping stabilizing plate and the fixing plate can automatically clamp the substrate in the horizontal direction through the pressure difference in vacuumizing, the reinforcing plate can automatically clamp the substrate in the vertical direction, and the substrate is clamped at multiple angles, so that an additional electric clamping device is not required to be arranged, and the influence on the etching quality caused by the movement of the clamping stabilizing plate and the fixing plate in the etching process due to external force is prevented; through piling up and release of gas to make displacement air outlet device reciprocating motion from top to bottom, and the passageway of giving vent to anger can be at jam and the direct automatic switch-over of unblock state, thereby make gas can spout to a plurality of positions in the etching chamber evenly, prevent that local gas gathering phenomenon from appearing, thereby lead to the inhomogeneous phenomenon of etching to take place, can effectively improve etching quality.
Drawings
The invention will be further described with reference to the accompanying drawings, in which embodiments do not constitute any limitation of the invention, and other drawings can be obtained by one of ordinary skill in the art without inventive effort from the following drawings.
FIG. 1 is a schematic diagram of a method for fabricating a through silicon via according to the present invention;
FIG. 2 is an enlarged view of the invention at A in FIG. 1;
FIG. 3 is an enlarged view of the invention at B in FIG. 1;
FIG. 4 is an enlarged view of the invention at C in FIG. 1;
fig. 5 is an enlarged view of the invention at D in fig. 1.
Reference numerals: 1. a reactive ion etching device; 2. etching the cavity; 3. a vacuum pumping device; 4. an exhaust pipe; 5. a vacuum degree display; 6. a substrate; 7. a substrate frame; 8. a fixing plate; 9. a first tank body; 10. a first transmission; 11. a first elastic member; 12. clamping a stabilizing plate; 13. a second tank body; 14. an extension strip; 15. a sliding sheet; 16. a second elastic member; 17. a third elastic member; 18. a reinforcing sheet; 19. a tab; 20. a fixed head; 21. a rotating shaft; 22. a first rack; 23. spur gears; 24. a second rack; 25. a first piston; 26. a connection channel; 27. a first limiting block; 28. a second limiting block; 29. an inflatable hose; 30. a displacement air outlet device; 31. a gas storage chamber; 32. an air outlet channel; 33. a second transmission chamber; 34. a baffle; 341. a fourth elastic member; 35. a buffer plate; 36. a first wedge block; 37. a transmission bar; 38. a second wedge block; 39. a third wedge; 40. a locking bar; 41. a lock base; 42. a locking groove; 43. a fixed rod; 44. a third tank; 441. a fourth wedge; 442. a fifth elastic member; 45. a fourth tank body; 46. wedge-shaped pieces; 47. a sixth elastic member; 48. and a second piston.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the azimuth or positional relationship indicated by the terms "vertical", "upper", "lower", "horizontal", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or element in question must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," "fourth," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, directly connected, connected via an intermediary, or connected by communication between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
As shown in fig. 1-5, a method for manufacturing a through silicon via includes the following steps:
step one: providing a substrate 6, forming a groove at a position, where a through silicon via is required to be prefabricated, in the substrate 6, and performing reactive ion etching on the substrate 6 by using a reactive ion etching device 1 to form the groove;
an etching cavity 2 is formed in the reactive ion etching equipment 1, a clamping mechanism and a uniform air outlet mechanism are arranged in the etching cavity 2, the uniform air outlet mechanism is connected with an external air supply system, and the side wall of the reactive ion etching equipment 1 is connected with a vacuumizing device 3 through an exhaust pipe 4;
step two: forming an insulating layer on the top wall of the substrate 6 with the grooves;
after forming the insulating layer, removing the insulating layer at the bottom of the groove to reserve the insulating layer on the side wall of the groove;
step three: growing a silicon material epitaxial layer on the surface of the insulating layer until the groove is filled, and then thinning the epitaxial layer until the insulating layer on the top wall of the substrate 6 is exposed;
step four: the substrate 6 is thinned on the back until the grooves are exposed, forming through silicon vias filled with epitaxial layers and insulating layers.
In an alternative embodiment of the present invention, the bottom wall of the etching chamber 2 is communicated with the bottom wall of the reactive ion etching apparatus 1 through a connecting channel 26;
the clamping mechanism comprises a substrate frame 7, a fixed plate 8 is fixedly connected to the top wall of the substrate frame 7, a first groove body 9 is formed in the substrate frame 7, a clamping and stabilizing plate 12 is connected to the bottom wall of the first groove body 9 in a sliding mode, the clamping and stabilizing plate 12 is connected with the side wall of the first groove body 9 through a first elastic piece 11, a second groove body 13 is formed in the side wall of the clamping and stabilizing plate 12, a sliding sheet 15 is connected to the bottom wall of the second groove body 13 in a sliding mode, an extension strip 14 is fixedly connected to the sliding sheet 15, the extension strip 14 extends to the outside of the clamping and stabilizing plate 12, the sliding sheet 15 is connected with the side wall of the second groove body 13 through a second elastic piece 16, a reinforcing sheet 18 is connected with the top wall of the second groove body 13 through a rotating shaft 21 in a sliding mode, a lug 19 and a fixing head 20 are fixedly connected to the reinforcing sheet 18, and the lug 19 and the sliding sheet 15 are abutted against each other;
the rear wall of the first transmission 10 is slidably connected with a first rack 22 and a second rack 24, the rear wall of the first transmission 10 is rotatably connected with a spur gear 23, the first rack 22 and the second rack 24 are respectively meshed with the spur gear 23, the upper end of the first rack 22 extends into the first groove body 9, the first rack 22 abuts against the clamping plate 12, the lower end of the second rack 24 extends into the connecting channel 26, the lower end of the second rack 24 is fixedly connected with a first piston 25, the first piston 25 is slidably connected with the inner wall of the connecting channel 26, the side wall of the connecting channel 26 is fixedly connected with a first limiting block 27 and a second limiting block 28, and the second limiting block 28 abuts against the first piston 25;
the substrate frame 7 is an electrode, and the substrate frame 7 is electrically connected with an external power supply;
the substrate 6 is placed on the top wall of the substrate frame 7, the substrate 6 is located between the fixed plate 8 and the clamping and stabilizing plate 12, the vacuumizing device 3 is started to vacuumize the etching cavity 2, the air pressure in the etching cavity 2 is gradually reduced, the external air pressure is larger than the air pressure in the etching cavity 2, the first piston 25 is pushed upwards by the external air pressure, the first piston 25 drives the second rack 24 to move upwards, the second rack 24 drives the spur gear 23 to rotate clockwise, the spur gear 23 drives the first rack 22 to move downwards, the clamping and stabilizing plate 12 moves rightwards under the elastic force of the first elastic piece 11 after being limited by the first rack 22 until the right wall of the clamping and stabilizing plate 12 abuts against the left wall of the substrate 6, after the extending strip 14 abuts against the left wall of the substrate 6 in the right moving process of the clamping and stabilizing plate 12, the extending strip 14 and the sliding piece 15 overcome the elastic force of the second elastic piece 16 to move leftwards, and the fixing head 20 on the rotating shaft 21 abuts against the top wall of the substrate 6 under the elastic force of the third elastic piece 17 after the sliding piece 19 loses the limit, and the fixing head 20 on the rotating shaft 21 rotates clockwise around the rotating shaft 21, and the clamping and limiting the substrate 6 in the horizontal direction is completed.
According to an alternative embodiment of the present invention, the uniform air outlet mechanism includes an air-charging hose 29, a displacement air outlet device 30, a fixing rod 43 and a second piston 48, the fixing rod 43 is fixedly connected to the bottom wall of the etching chamber 2, the second piston 48 is fixedly connected to the upper end of the fixing rod 43, the displacement air outlet device 30 is provided with an air storage chamber 31 communicating with the bottom wall of the displacement air outlet device 30, the second piston 48 is slidably connected to the inner wall of the air storage chamber 31, one end of the air-charging hose 29 is communicated with the air storage chamber 31, and the other end of the air-charging hose 29 is connected with the external air supply system;
the side wall of the air storage cavity 31 is communicated with the outer side wall of the displacement air outlet device 30 through an air outlet channel 32, a second transmission cavity 33 is formed in the displacement air outlet device 30, the rear wall of the second transmission cavity 33 is connected with a baffle 34 and a transmission bar 37 in a sliding manner, the top wall of the baffle 34 extends into the air outlet channel 32, the top wall of the baffle 34 is fixedly connected with a buffer plate 35, the buffer plate 35 is abutted against the top wall of the air outlet channel 32, the baffle 34 is connected with the top wall of the second transmission cavity 33 through a fourth elastic piece 341, the bottom wall of the baffle 34 is fixedly connected with a first wedge block 36, a second wedge block 38, a third wedge block 39 and a locking bar 40 are fixedly connected onto the transmission bar 37, the transmission bar 37 extends into the air storage cavity 31, the third wedge block 39 is positioned in the air storage cavity 31, the side wall of the second transmission cavity 33 is fixedly connected with a lock seat 41, the side wall of the lock seat 41 is provided with a lock groove 42, and a push type elastic self-locking mechanism is arranged in the lock groove 42 and is adapted to the lock bar 40;
the side wall of the fixed rod 43 is provided with a third groove body 44 and a fourth groove body 45, the rear wall of the third groove body 44 is rotationally connected with a fourth wedge-shaped block 441, the fourth wedge-shaped block 441 is connected with the top wall of the third groove body 44 through a fifth elastic piece 442, the rear wall of the fourth groove body 45 is rotationally connected with a wedge-shaped piece 46, and the wedge-shaped piece 46 is connected with the bottom wall of the fourth groove body 45 through a sixth elastic piece 47;
the external air supply system introduces air into the air storage cavity 31 through the air charging hose 29, the space of the air storage cavity 31 above the second piston 48 is gradually increased, so that the displacement air outlet device 30 moves upwards, the third wedge block 39 firstly pushes the fourth wedge block 441 to overcome the elastic force of the fifth elastic piece 442 to rotate clockwise, the third wedge block 39 cannot horizontally displace at the moment, when the third wedge block 39 moves upwards to be propped against the wedge piece 46 and then moves upwards to be above the wedge piece 46, the third wedge block 39 is pushed leftwards by the wedge piece 46, thereby enabling the transmission bar 37, the second wedge block 38 and the locking bar 40 to move leftwards, the locking bar 40 is inserted into the locking groove 42 and locked by the pressing type elastic self-locking mechanism, the second wedge block 38 pushes the first wedge block 36 to move downwards, the first wedge block 36 drives the baffle 34 and the buffer plate 35 to move downwards, the air outlet channel 32 becomes in a communicating state, the air in the air storage cavity 31 is sprayed into the air outlet channel 32 through the air outlet channel 32, the air outlet speed of the air outlet channel 32 is larger than the air inlet speed of the air charging hose 29, the air pressure in the air storage cavity 31 is gradually reduced, the displacement air outlet device 30 is gradually moved downwards, the air outlet channel 32 keeps air outlet in the downward moving process of the displacement air outlet device 30, air is supplied to different positions in the etching cavity 2, the wedge-shaped piece 46 is pushed to rotate anticlockwise against the elastic force of the sixth elastic piece 47 when the third wedge-shaped piece 39 moves downwards, so that the third wedge-shaped piece 39 continues to move downwards under the condition that horizontal movement does not occur, when the third wedge-shaped piece 39 and the fourth wedge-shaped piece 441 abut against each other, the fourth wedge-shaped piece 441 pushes the third wedge-shaped piece 39 and the locking strip 40 to move leftwards for a certain distance, the locking strip 40 releases the locking of the push type elastic self-locking mechanism, the third wedge-shaped piece 39 continues to move downwards to the lower side of the third groove body 44, the baffle 34 moves upwards under the elastic force of the fourth elastic piece 341 to reset, so that the buffer plate 35 and the top wall of the air outlet channel 32 are propped against each other, the baffle 34 blocks the air outlet channel 32, the first wedge-shaped block 36 pushes the second wedge-shaped block 38 to move right, and the space of the air storage cavity 31 above the second piston 48 is gradually increased again, so that the air outlet channel 32 reciprocates up and down and simultaneously sprays air.
According to an alternative embodiment of the present invention, the vacuum degree indicator 5 is disposed on the exhaust pipe 4, and the vacuum degree in the etching chamber 2 is judged whether to reach the standard by observing the value of the vacuum degree indicator 5.
In an alternative embodiment of the present invention, the fixing head 20 is made of silicone.
In an alternative embodiment according to the invention, the inflatable hose 29 is a plastic hose.
In an alternative embodiment according to the present invention, the sixth elastic member 47 and the fifth elastic member 442 are each spring pieces.
In an alternative embodiment according to the present invention, the gas provided by the external gas supply system comprises argon, oxygen, carbon tetrafluoride gas or chlorine.
The implementation process comprises the following steps:
step one: providing a substrate 6, forming a groove at a position, where a through silicon via is required to be prefabricated, in the substrate 6, and performing reactive ion etching on the substrate 6 by using a reactive ion etching device 1 to form the groove;
an etching cavity 2 is formed in the reactive ion etching equipment 1, a clamping mechanism and a uniform air outlet mechanism are arranged in the etching cavity 2, the uniform air outlet mechanism is connected with an external air supply system, and the side wall of the reactive ion etching equipment 1 is connected with a vacuumizing device 3 through an exhaust pipe 4;
placing the substrate 6 on the top wall of the substrate frame 7, placing the substrate 6 between the fixed plate 8 and the clamping and stabilizing plate 12, starting the vacuumizing device 3 to vacuumize the etching cavity 2 until the numerical value of the vacuum degree display 5 on the exhaust tube 4 reaches a preset value, gradually reducing the air pressure in the etching cavity 2 when vacuuming, wherein the external air pressure is larger than the air pressure in the etching cavity 2, so that the external air pressure pushes the first piston 25 upwards, the first piston 25 drives the second rack 24 to move upwards, the second rack 24 drives the spur gear 23 to rotate clockwise, the spur gear 23 drives the first rack 22 to move downwards, the clamping and stabilizing plate 12 loses the limit of the first rack 22 and then moves downwards under the action of the elastic force of the first elastic piece 11 until the right wall of the clamping and stabilizing plate 12 abuts against the left wall of the substrate 6, and after the extending strip 14 abuts against the left wall of the substrate 6 in the right movement process of the clamping and stabilizing plate 12, the extending strip 14 and the sliding piece 15 overcomes the elastic force of the second elastic piece 16 to move leftwards, and the tab 19 loses the limit of the sliding piece 15 and then rotates clockwise around the rotating shaft 21 under the elastic force of the third elastic piece 17, so that the fixed head 20 on the second rack 24 and the substrate 6 abut against the top wall 6 in the horizontal direction, and the clamping and limiting direction of the substrate 6 are completed;
the external air supply system introduces air into the air storage cavity 31 through the air charging hose 29, the space of the air storage cavity 31 above the second piston 48 is gradually increased, so that the displacement air outlet device 30 moves upwards, the third wedge block 39 firstly pushes the fourth wedge block 441 to overcome the elastic force of the fifth elastic piece 442 to rotate clockwise, the third wedge block 39 cannot horizontally displace at the moment, when the third wedge block 39 moves upwards to be propped against the wedge piece 46 and then moves upwards to be above the wedge piece 46, the third wedge block 39 is pushed leftwards by the wedge piece 46, thereby enabling the transmission bar 37, the second wedge block 38 and the locking bar 40 to move leftwards, the locking bar 40 is inserted into the locking groove 42 and locked by the pressing type elastic self-locking mechanism, the second wedge block 38 pushes the first wedge block 36 to move downwards, the first wedge block 36 drives the baffle 34 and the buffer plate 35 to move downwards, the air outlet channel 32 becomes in a communicating state, the air in the air storage cavity 31 is sprayed into the air outlet channel 32 through the air outlet channel 32, the air outlet speed of the air outlet channel 32 is larger than the air inlet speed of the air charging hose 29, the air pressure in the air storage cavity 31 is gradually reduced, the displacement air outlet device 30 is gradually moved downwards, the air outlet channel 32 keeps air outlet in the downward moving process of the displacement air outlet device 30, air is supplied to different positions in the etching cavity 2, the wedge-shaped piece 46 is pushed to rotate anticlockwise against the elastic force of the sixth elastic piece 47 when the third wedge-shaped piece 39 moves downwards, so that the third wedge-shaped piece 39 continues to move downwards under the condition that horizontal movement does not occur, when the third wedge-shaped piece 39 and the fourth wedge-shaped piece 441 abut against each other, the fourth wedge-shaped piece 441 pushes the third wedge-shaped piece 39 and the locking strip 40 to move leftwards for a certain distance, the locking strip 40 releases the locking of the push type elastic self-locking mechanism, the third wedge-shaped piece 39 continues to move downwards to the lower side of the third groove body 44, the baffle 34 moves upwards under the elastic force of the fourth elastic piece 341 to reset, so that the buffer plate 35 and the top wall of the air outlet channel 32 are propped against, the baffle 34 blocks the air outlet channel 32, the first wedge-shaped block 36 pushes the second wedge-shaped block 38 to move rightwards, the space of the air storage cavity 31 above the second piston 48 is gradually increased again, and thus the air outlet channel 32 reciprocates up and down and simultaneously ejects air, so that the air is uniformly distributed in the etching cavity 2, and the subsequent etching uniformity is improved.
The external power supply is started to discharge, the power of the power supply is 220W-800W, the power supply discharge is carried out under vacuum, the gas sprayed out by the gas outlet channel 32 is at anode potential, the substrate frame 7 and the substrate 6 are at cathode potential, most of the potential drops near the cathode of the substrate 6 during discharge, a large number of charged particles are accelerated by an electric field vertical to the surface of the substrate 6 and vertically incident on the surface of the substrate 6, and meanwhile, the charged particles and the surface of the substrate 6 are subjected to strong chemical reaction, so that the etching effect is achieved.
Step two: forming an insulating layer on the top wall of the substrate 6 with the grooves;
after forming the insulating layer, removing the insulating layer at the bottom of the groove to reserve the insulating layer on the side wall of the groove;
step three: growing a silicon material epitaxial layer on the surface of the insulating layer until the groove is filled, and then thinning the epitaxial layer until the insulating layer on the top wall of the substrate 6 is exposed;
step four: the substrate 6 is thinned on the back until the grooves are exposed, forming through silicon vias filled with epitaxial layers and insulating layers.
When the groove is formed by etching the substrate 6, the clamping stabilizing plate 12 and the fixing plate 8 can automatically clamp the substrate 6 in the horizontal direction by the pressure difference in vacuumizing, the reinforcing sheet 18 can automatically clamp the substrate 6 in the vertical direction, and the substrate 6 is clamped at multiple angles, so that an additional electric clamping device is not required to be arranged, and the influence on the etching quality caused by the movement of the substrate 6 in the etching process due to external force is prevented; through accumulation and release of gas, the displacement air outlet device 30 moves up and down in a reciprocating manner, and the air outlet channel 32 can be directly and automatically switched between a blocking state and a non-blocking state, so that the gas can be uniformly sprayed to a plurality of positions in the etching cavity 2, the occurrence of local gas aggregation phenomenon is prevented, the occurrence of the phenomenon of uneven etching is caused, and the etching quality can be effectively improved.
The components, modules, mechanisms and devices of the invention, which do not describe the structure in detail, are all common standard components or components known to those skilled in the art, and the structure and principle thereof are all known to those skilled in the art through technical manuals or through routine experimental methods.
Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention.
Claims (8)
1. The method for manufacturing the through silicon via is characterized by comprising the following steps of:
step one: providing a substrate (6), forming a groove at a position, where a through silicon via is required to be prefabricated, in the substrate (6), and performing reactive ion etching on the substrate (6) by using a reactive ion etching device (1) to form the groove;
an etching cavity (2) is formed in the reactive ion etching equipment (1), a clamping mechanism and a uniform air outlet mechanism are arranged in the etching cavity (2), the uniform air outlet mechanism comprises an air inflation hose (29), a displacement air outlet device (30), a fixing rod (43) and a second piston (48), and the uniform air outlet mechanism is connected with an external air supply system;
the side wall of the reactive ion etching equipment (1) is connected with a vacuumizing device (3) through an exhaust pipe (4); the bottom wall of the etching cavity (2) is communicated with the bottom wall of the reactive ion etching equipment (1) through a connecting channel (26), a vacuumizing device (3) is started to vacuumize the etching cavity (2), the air pressure in the etching cavity (2) is gradually reduced, the external air pressure is larger than the air pressure in the etching cavity (2), and accordingly the first piston (25) is pushed upwards by the external air pressure, and the first piston (25) drives the second rack (24) to move upwards;
step two: forming an insulating layer on the top wall of the substrate (6) with the grooves;
after forming the insulating layer, removing the insulating layer at the bottom of the groove to reserve the insulating layer on the side wall of the groove;
step three: growing a silicon material epitaxial layer on the surface of the insulating layer until the groove is filled, and then thinning the epitaxial layer until the insulating layer on the top wall of the substrate (6) is exposed;
step four: and thinning the back of the substrate (6) until the grooves are exposed, and forming through silicon holes filled with the epitaxial layers and the insulating layers.
2. The method for fabricating a through silicon via of claim 1, wherein,
the clamping mechanism comprises a baseplate frame (7), a fixed plate (8) is fixedly connected to the top wall of the baseplate frame (7), a first groove body (9) is formed in the baseplate frame (7), a clamping and stabilizing plate (12) is connected to the bottom wall of the first groove body (9) in a sliding mode, the clamping and stabilizing plate (12) is connected with the side wall of the first groove body (9) through a first elastic piece (11), a second groove body (13) is formed in the side wall of the clamping and stabilizing plate (12), a sliding piece (15) is connected to the bottom wall of the second groove body (13) in a sliding mode, an extension strip (14) is fixedly connected to the sliding piece (15), the extension strip (14) extends to the outside of the clamping and stabilizing plate (12), a reinforcing piece (18) is connected to the rear wall of the second groove body (13) through a rotating shaft (21), and the reinforcing piece (18) is connected with the top wall of the second groove body (13) through a third elastic piece (17), and a fixing lug (19) are fixedly connected to the sliding piece (19);
the rear wall of the first transmission (10) is slidably connected with a first rack (22) and a second rack (24), the rear wall of the first transmission (10) is rotatably connected with a spur gear (23), the first rack (22) and the second rack (24) are respectively meshed with the spur gear (23), the upper end of the first rack (22) extends into the first groove body (9), the first rack (22) is abutted against the clamping plate (12), the lower end of the second rack (24) extends into the connecting channel (26), the lower end of the second rack (24) is fixedly connected with a first piston (25), the first piston (25) is slidably connected with the inner wall of the connecting channel (26), the side wall of the connecting channel (26) is fixedly connected with a first limiting block (27) and a second limiting block (28), and the second limiting block (28) is abutted against the first piston (25);
the substrate frame (7) is an electrode, and the substrate frame (7) is electrically connected with an external power supply;
the substrate (6) is placed on the top wall of the substrate frame (7), the substrate (6) is located between the fixed plate (8) and the clamping and stabilizing plate (12), the second rack (24) drives the spur gear (23) to rotate clockwise, the spur gear (23) drives the first rack (22) to move downwards, the clamping and stabilizing plate (12) moves rightwards under the elastic force of the first elastic piece (11) until the right wall of the clamping and stabilizing plate (12) abuts against the left wall of the substrate (6), the extending strip (14) and the sliding piece (15) overcome the elastic force of the second elastic piece (16) to move leftwards after the right wall of the clamping and stabilizing plate (12) abuts against the left wall of the substrate (6), the lug (19) rotates clockwise around the rotating shaft (21) under the elastic force of the third elastic piece (17) after the sliding piece (15) is limited, and therefore the fixed head (20) on the rotating shaft (21) and the top wall of the substrate (6) abut against the horizontal direction clamping and limiting in the vertical direction of the substrate (6) are completed.
3. The method for manufacturing the through silicon via according to claim 2, wherein the uniform gas outlet mechanism comprises a gas charging hose (29), a displacement gas outlet device (30), a fixed rod (43) and a second piston (48), the fixed rod (43) is fixedly connected with the bottom wall of the etching cavity (2), the second piston (48) is fixedly connected with the upper end of the fixed rod (43), the displacement gas outlet device (30) is provided with a gas storage cavity (31) communicated with the bottom wall of the displacement gas outlet device (30), the second piston (48) is slidably connected with the inner wall of the gas storage cavity (31), one end of the gas charging hose (29) is communicated with the gas storage cavity (31), and the other end of the gas charging hose (29) is connected with the external gas supply system;
the side wall of the air storage cavity (31) is communicated with the outer side wall of the displacement air outlet device (30) through an air outlet channel (32), a second transmission cavity (33) is formed in the displacement air outlet device (30), a baffle plate (34) and a transmission strip (37) are connected to the rear wall of the second transmission cavity (33) in a sliding mode, the top wall of the baffle plate (34) extends into the air outlet channel (32), a buffer plate (35) is fixedly connected to the top wall of the baffle plate (34), the buffer plate (35) is propped against the top wall of the air outlet channel (32), the baffle plate (34) is connected with the top wall of the second transmission cavity (33) through a fourth elastic piece (341), a first wedge block (36) is fixedly connected to the bottom wall of the baffle plate (34), a second wedge block (38), a third wedge block (39) and a locking strip (40) are fixedly connected to the transmission strip (37), the third wedge block (39) is located in the air storage cavity (31), a locking seat (41) is fixedly connected to the side wall of the second transmission cavity (33), a locking seat (41), a locking groove (42) is formed in the side wall of the air storage cavity (31), and a pressing type elastic self-locking mechanism and a pressing type self-locking mechanism (40) are arranged in the locking mechanism.
A third groove body (44) and a fourth groove body (45) are formed in the side wall of the fixed rod (43), a fourth wedge-shaped block (441) is rotatably connected to the rear wall of the third groove body (44), the fourth wedge-shaped block (441) is connected with the top wall of the third groove body (44) through a fifth elastic piece (442), a wedge-shaped piece (46) is rotatably connected to the rear wall of the fourth groove body (45), and the wedge-shaped piece (46) is connected with the bottom wall of the fourth groove body (45) through a sixth elastic piece (47);
the external air supply system introduces air into the air storage cavity (31) through the air charging hose (29), the space of the air storage cavity (31) above the second piston (48) is gradually increased, so that the displacement air outlet device (30) moves upwards, the third wedge block (39) firstly pushes the fourth wedge block (441) to overcome the elasticity of the fifth elastic piece (442) to rotate clockwise, the third wedge block (39) cannot horizontally displace at the moment, when the third wedge block (39) moves upwards to be propped against the wedge piece (46) and then moves upwards to be above the wedge piece (46), the third wedge block (39) is pushed leftwards by the wedge piece (46), so that the transmission bar (37), the second wedge block (38) and the locking bar (40) move left, the locking bar (40) is inserted into the locking groove (42) and locked by the pressing elastic self-locking mechanism, the second wedge block (38) pushes the first wedge block (36) to move downwards, the first wedge block (36) drives the baffle plate (34) and the buffer plate (35) to move downwards, the air outlet channel (32) becomes a communicated state, air in the air storage cavity (31) is sprayed into the air outlet channel (32) through the air outlet channel (32), the air outlet speed of the air outlet channel (32) is larger than the air inlet speed of the air charging hose (29), the air pressure in the air storage cavity (31) is gradually reduced, the displacement air outlet device (30) is gradually moved downwards, the displacement air outlet device (30) keeps the air outlet channel (32) in the downward movement process, air is supplied to different positions in the etching cavity (2), the third wedge block (39) pushes the wedge piece (46) to rotate anticlockwise against the elastic force of the sixth elastic piece (47) when being moved downward, so that the third wedge block (39) continues to move downward under the condition that horizontal movement cannot occur, after the third wedge block (39) and the fourth wedge block (441) are propped against each other, the fourth wedge block (441) pushes the third wedge block (39) and the locking strip (40) to move leftwards for a certain distance, the locking strip (40) releases and presses the locking of the elastic self-locking mechanism, the third wedge block (39) continues to move downward to the lower side of the third groove body (44), the baffle plate (34) moves upward under the elastic force of the fourth elastic piece (341), the top wall of the buffer plate (35) and the air outlet channel (32) are propped against each other, the first wedge block (36) pushes the second wedge block (38) to move rightward, and the air outlet channel (32) is gradually increased in the air storage space (48) above the second piston, and the air storage cavity (31) is gradually moved upward at the same time.
4. A method for fabricating a through silicon via according to claim 3, wherein the vacuum degree indicator (5) is disposed on the exhaust tube (4), and whether the vacuum degree in the etching chamber (2) reaches the standard is determined by observing the value of the vacuum degree indicator (5).
5. The method of manufacturing through silicon vias according to claim 4, wherein said stationary head (20) is of silicone material.
6. A method of manufacturing a through silicon via according to claim 5, wherein the pneumatic hose (29) is a plastic hose.
7. The method of forming a through silicon via of claim 6, wherein the sixth elastic member (47) and the fifth elastic member (442) are each spring pieces.
8. The method of claim 7, wherein the gas provided by the external gas supply system comprises argon, oxygen, carbon tetrafluoride gas or chlorine.
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