CN110543065A - equipment for repairing and regenerating chemical mechanical grinding head of semiconductor equipment - Google Patents
equipment for repairing and regenerating chemical mechanical grinding head of semiconductor equipment Download PDFInfo
- Publication number
- CN110543065A CN110543065A CN201910701226.7A CN201910701226A CN110543065A CN 110543065 A CN110543065 A CN 110543065A CN 201910701226 A CN201910701226 A CN 201910701226A CN 110543065 A CN110543065 A CN 110543065A
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- CN
- China
- Prior art keywords
- base
- guide rail
- hole
- seat
- chemical mechanical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B15/00—Special procedures for taking photographs; Apparatus therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The utility model provides an equipment that is used for semiconductor equipment chemical machinery grinding head to maintain regeneration, belongs to semiconductor equipment grinding head maintenance regeneration equipment field. The device comprises a positioning photographing plate, a supporting mechanism, a guide rail, a sliding block and a base; the both sides of base bottom are equipped with the slider respectively, and the slider is located corresponding guide rail, and guide rail one end is located supporting mechanism, and supporting mechanism includes a plurality of lower cradles, and the lower cradle passes through the lifting screw to be connected with the upper bracket, and the upper bracket is installed the location and is shot the board. The invention can accurately position the part through the guide rail and the movable part of the base, the positioning photographing plate can ensure that the photographing distance is consistent each time, and the marks on the positioning photographing plate can facilitate the sequential splicing of the quartered photos and the finding of the position of a problem area.
Description
Technical Field
The invention relates to the field of grinding head maintenance and regeneration equipment of semiconductor equipment, in particular to equipment for the maintenance and regeneration of a chemical mechanical grinding head of the semiconductor equipment.
Background
At present, in a process of repairing and regenerating a grinding head of a semiconductor chemical machinery, the assembled grinding head needs to be photographed, the grinding head is circular, the photographing requirement needs to be divided into four equal parts, each equal part is photographed, and the photographed pictures are just spliced into a whole picture of the grinding head.
Disclosure of Invention
The invention provides a device for repairing and regenerating a chemical mechanical grinding head of semiconductor equipment, which aims to solve the problems that the result obtained by manually carrying out quartering photographing on the grinding head is inaccurate and splicing treatment is not easy.
In order to achieve the purpose, the invention adopts the technical scheme that: a device for repairing and regenerating a chemical mechanical grinding head of semiconductor equipment comprises a positioning photographing plate, a supporting mechanism, a guide rail, a sliding block and a base; the both sides of base bottom are equipped with the slider respectively, and the slider is located corresponding guide rail, and guide rail one end is located supporting mechanism, and supporting mechanism includes a plurality of lower cradles, and the lower cradle passes through the lifting screw to be connected with the upper bracket, and the board is shot in the installation location of upper bracket, evenly sets up a plurality of location holes of shooing on the board is shot in the location.
Furthermore, the lifting screw comprises a threaded section and a smooth section, the smooth section is located in a hole A in the bottom of the upper support, the threaded section is connected with a threaded hole A in the lifting sleeve in a matched mode, and the lifting sleeve is located in a hole B in the top of the lower support.
Furthermore, the bottom of the positioning shooting plate is provided with a groove connected with the upper support, and the positioning shooting plate is also provided with a weight reduction groove A.
Furthermore, the lower support is L-shaped, the hole B is positioned at the top of the vertical end of the lower support, and the horizontal end of the lower support is connected with the guide rail seat.
furthermore, the guide rail is fixed on a guide rail seat, two ends of the guide rail seat are respectively provided with a baffle A and a baffle B, and the guide rail seat is also provided with a weight reduction groove B.
furthermore, a plurality of positioning holes are uniformly formed in the guide rail.
Further, when the base is located at the photographing position, the base is located in the supporting mechanism, and one side of the base is in contact with the baffle A; when the base is located the initial position, the base is located outside the supporting mechanism, and the other side of the base contacts with the baffle B.
Furthermore, the base is provided with a part supporting surface and a plurality of mounting holes, and the inner diameter of the upper end of each mounting hole is larger than that of the lower end of each mounting hole.
Further, a plurality of mounting holes are provided with an part positioning rod seat and/or an part positioning hole seat, the outer diameter of the upper end of the part positioning rod seat is larger than the outer diameter of the lower end, the top surface of the part positioning rod seat is parallel and level to the top surface of the base, a threaded hole B is formed in the part positioning rod seat and connected with a threaded rod, the outer diameter of the upper end of the part positioning rod seat is larger than the outer diameter of the lower end, the top surface of the part positioning hole seat is parallel and level to the top surface of the base, and a unthreaded hole is formed in the part positioning hole seat.
Furthermore, four corners of the top surface of the base are provided with marks.
The invention has the beneficial effects that: move some article can be accurate through guide rail and base and fix a position some article, fix a position the board of shooing and can guarantee to shoot at every turn apart from unanimous, fix a position the mark number on the board of shooing can be convenient for carry out the order concatenation to quartering photo and be convenient for find problem area position.
Drawings
FIG. 1 is an elevational view of the base of the present invention in a starting position and with the support mechanism in a retracted state;
FIG. 2 is a schematic view of the base of the present invention in a starting position with the support mechanism in a retracted state;
FIG. 3 is a schematic view of the base of the present invention in a starting position with the support mechanism in a retracted state;
FIG. 4 is a partial cross-sectional view of the present invention;
FIG. 5 is a partial top view of the present invention;
FIG. 6 is a schematic structural diagram of a base according to the present invention;
FIG. 7 is a front view of the base of the present invention in a starting position with the support mechanism extended;
FIG. 8 is a schematic view of the base of the present invention in a starting position with the support mechanism in an extended position;
FIG. 9 is a schematic view of the base of the present invention in a starting position with the support mechanism in an extended position;
FIG. 10 is a schematic view showing a connection structure of an upper bracket, a lifting screw and a lower bracket according to the present invention;
FIG. 11 is a schematic view of the lifting screw of the present invention;
FIG. 12 is a schematic view of the construction of the lift sleeve of the present invention;
fig. 13 is a cross-sectional view of a lift sleeve of the present invention.
In the figure, 1, a positioning photographing plate, 2, an upper support, 3, a lifting screw rod, 4, a lower support, 5, a baffle A, 6, a guide rail seat, 7, a guide rail, 8, a sliding block, 9, a base, 10, a lightening groove A, 11, a positioning photographing hole, 12, a positioning hole, 13, a lightening groove B, 14, a part supporting surface, 15, a mounting hole, 16, a lifting sleeve, 17, a threaded hole A, 18, a threaded section, 19, a smooth section, 20, a part positioning hole seat and 21, a part positioning rod seat are arranged.
Detailed Description
A device for repairing and regenerating a chemical mechanical grinding head of a semiconductor device comprises a positioning photographing plate 1, a supporting mechanism, a guide rail 7, a sliding block 8 and a base 9; the both sides of base 9 bottom are respectively through the bolt fastening have slider 8, preferred one side is equipped with two sliders 8, and slider 8 is located 9 bottom one corners of base in order to guarantee stability, slider 8 is located corresponding guide rail 7, 7 one ends of guide rail are located the supporting mechanism, the supporting mechanism includes four lower carriage 4, lower carriage 4 passes through lifting screw 3 and is connected with upper bracket 2, upper bracket 2 is gone up installation location and is shot board 1, the supporting mechanism adopts stainless steel, the location is shot board 1, guide rail 7, slider 8 and base 9 and are adopted the polypropylene material.
Lifting screw 3 includes screw thread section 18 and smooth section 19, smooth section 19 is located the hole A of upper bracket 2 bottom, when supporting mechanism goes up and down, smooth section 19 is rotary motion in hole A, screw thread section 18 is connected with the screw hole A17 screw-thread fit in the lifting sleeve 16, lifting sleeve 16 is fixed in the hole B at lower carriage 4 top, when supporting mechanism goes up and down, screw thread section 18 is at screw hole A17 internal rotation and drives lifting screw 3, upper bracket 2 and the board 1 lift of shooing of location, be convenient for shoot the height of board 1 according to the article (grinding head) size adjustment location, in order to adjust the distance of shooing, lifting sleeve 16 adopts stainless steel.
The board 1 of shooing in location is the rectangle, evenly sets up four location holes 11 of shooing on the board 1 of shooing in location, and four location holes 11 of shooing are located four angles of a virtual rectangle respectively in order to guarantee unanimous distance and the angle of shooing, and the board 1 bottom of shooing in location is equipped with the groove of being connected with upper bracket 2, still is equipped with on the board 1 of shooing in location and subtracts heavy groove A10.
The lower support 4 is L-shaped, the hole B is positioned at the top of the vertical end of the lower support 4, and the horizontal end of the lower support 4 is fixedly connected with the guide rail seat 6.
the guide rail 7 is fixed on the guide rail seat 6, a baffle A5 and a baffle B for limiting are arranged at two ends of the guide rail seat 6 respectively, the baffle A5 and the baffle B have a limiting effect on the base 9 and further keep the photographing distance and the center, the guide rail seat 6 is further provided with a weight reduction groove B13, and the baffle A5 and the baffle B are made of polypropylene materials.
A plurality of positioning holes 12 are uniformly formed in the guide rail 7, and when the base 9 is located at a designated position, positioning pins are inserted into the positioning holes 12 exposed at two sides or one side of the base 9 to fix the position of the base 9.
When the base 9 is located at the photographing position, the base 9 is located in the supporting mechanism, the base 9 fixed with the parts is located under the positioning photographing plate 1 (the centers of the parts, the base 9 and the positioning photographing plate 1 are located on a vertical central line), and one side of the base 9 is in contact with the baffle A5; when the base 9 is located at the initial position, the base 9 is located outside the supporting mechanism, and the other side of the base 9 is in contact with the baffle B.
The base 9 is provided with an annular part supporting surface 14 and two mounting holes 15, the annular part supporting surface 14 surrounds the two mounting holes 15, the inner diameter of the upper end of each mounting hole 15 is larger than that of the lower end of each mounting hole, and the part supporting surface 14 is attached to the bottom surface of the part and limits the part.
The two mounting holes 15 can be placed with any combination of the part positioning rod seat 21 and the part positioning hole seat 20, for example, the two mounting holes 15 are both part positioning rod seats 21, or the two mounting holes 15 are both part positioning hole seats 20, or one of the two mounting holes 15 is the part positioning rod seat 21, and the other is the part positioning hole seat 20, the outer diameter of the upper end of the part positioning rod seat 21 is larger than that of the lower end, the top surface of the part positioning rod seat 21 is flush with the top surface of the base 9, the inside of the part positioning rod seat 21 is provided with a threaded hole B which is connected with a threaded rod, the outer diameter of the upper end of the part positioning hole seat 20 is larger than that of the lower end, the top surface of the part positioning hole seat 20 is flush with that of the base 9, the inside of the part positioning hole seat 20 is provided with a light hole which is matched with a part, the threaded rod of the part positioning rod seat 21 and the part positioning hole seat 20 can limit the part, the mounting hole 15 is a through hole, the structure of the mounting hole is convenient for placing and taking out the part positioning rod seat 21 and the part positioning hole seat 20, and the part positioning rod seat 21, the part positioning hole seat 20 and the threaded rod are made of polypropylene materials.
The four corners of the top surface of the base 9 are provided with labels, and preferably, the four corners are sequentially marked with 1, 2, 3 and 4, so that the positions of the photos shot can be conveniently corresponded according to the labels, and the quartered photos can be sequentially spliced.
The embodiment also provides a use method of the equipment for repairing and regenerating the chemical mechanical polishing head of the semiconductor equipment, which comprises the following specific steps:
s1: moving the base 9 to the initial position, and selecting the combination mode of the component positioning rod seat 21 and the component positioning hole seat 20 inserted into the mounting hole 15 according to the component;
s2: adjusting the height of the positioning photographing plate 1 according to the height of the part, and rotating the lifting screw 3 to enable the positioning photographing plate 1 to rise to the designated height;
s3: placing the part on the base 9, enabling the bottom surface of the part to be attached to the supporting surface 14, if the part positioning rod seat 21 is selected, rotating the threaded rod by the part positioning rod seat 21, enabling the top of the threaded rod to extend out and to be in contact with the corresponding position of the bottom of the part, and if the part positioning hole seat 20 is selected, enabling the protrusion at the bottom of the part to extend into the light hole of the part positioning hole seat 20;
s4: slightly rotating the part to ensure that the threaded rod is fully seated in the hole in the bottom of the part, ensuring that it has been positioned;
S5: pushing the slide block 8 to enable the base 9 with the parts to move to a photographing position, inserting a positioning pin into a positioning hole 12 exposed on one side of the base 9, and fixing the position of the base 9;
s6: positioning a camera arranged on the photographing plate 1 for photographing;
s7: the positioning pin is pulled out, and the sliding block 8 drives the base 9 with the part to return to the initial position.
the embodiment also provides a system for equipment for repairing and regenerating the chemical mechanical polishing head of the semiconductor equipment, which comprises the following specific steps:
Lifting positioning device
The capacitive proximity switch and the electric lifting control device are adopted to be matched with each other to fix the rotation direction of the product.
1. The motor lifting transmission device adopts a servo control system and a lead screw structure for occasions with higher precision.
2. a fixed distance lifting and contracting fixing pin is arranged at the supporting mechanism, and a lifting and contracting power source is provided by an air cylinder.
After the part article are placed, the supporting mechanism is started, the device stops when the proximity switch of the supporting mechanism receives a signal, the air cylinder outputs to enable the positioning pin to be inserted into the positioning hole 21, the grinding head is fixed by the positioning rod, after the photographing operation is completed, the part article is withdrawn from the rear portion of the positioning rod to be positioned, and the part article is taken away.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.
Claims (10)
1. The equipment for repairing and regenerating the chemical mechanical grinding head of the semiconductor equipment is characterized by comprising a positioning photographing plate (1), a supporting mechanism, a guide rail (7), a sliding block (8) and a base (9); the both sides of base (9) bottom are equipped with slider (8) respectively, and slider (8) are located corresponding guide rail (7), and guide rail (7) one end is located supporting mechanism, and supporting mechanism includes a plurality of lower carriage (4), and lower carriage (4) are connected with upper bracket (2) through lifting screw (3), and upper bracket (2) are gone up the installation location and are shot board (1), and the location is shot evenly to set up a plurality of locations on board (1) and is shot hole (11).
2. the apparatus for chemical mechanical polishing head maintenance and regeneration of semiconductor devices according to claim 1, wherein the lifting screw (3) comprises a threaded section (18) and a smooth section (19), the smooth section (19) is located in a hole A at the bottom of the upper bracket (2), the threaded section (18) is in fit connection with a threaded hole A (17) in the lifting sleeve (16), and the lifting sleeve (16) is located in a hole B at the top of the lower bracket (4).
3. the apparatus for repairing and regenerating the chemical mechanical polishing head of the semiconductor device as claimed in claim 1, wherein the bottom of the positioning photo plate (1) is provided with a slot connected with the upper bracket (2), and the positioning photo plate (1) is further provided with a lightening slot A (10).
4. the apparatus for repairing and regenerating a chemical mechanical polishing head of a semiconductor device according to claim 1, characterized in that the lower bracket (4) is "L" shaped, the hole B is positioned on top of the vertical end of the lower bracket (4), and the horizontal end of the lower bracket (4) is connected with the guide rail seat (6).
5. The apparatus for repairing and regenerating the chemical mechanical polishing head of the semiconductor device as claimed in claim 1, wherein the guide rail (7) is fixed on a guide rail seat (6), the two ends of the guide rail seat (6) are respectively provided with a baffle A (5) and a baffle B, and the guide rail seat (6) is further provided with a weight reduction groove B (13).
6. The apparatus for chemical mechanical polishing head maintenance and regeneration of semiconductor devices according to claim 1, wherein said guide rails (7) are uniformly provided with a plurality of positioning holes (12).
7. The apparatus for repairing and regenerating a chemical mechanical polishing head of a semiconductor device as claimed in claim 1, characterized in that when the base (9) is in the photographing position, the base (9) is located in the supporting mechanism, and one side of the base (9) is in contact with the baffle A (5); when the base (9) is positioned at the initial position, the base (9) is positioned outside the supporting mechanism, and the other side of the base (9) is contacted with the baffle B.
8. The apparatus of claim 1, wherein the base (9) is provided with a part supporting surface (14) and a plurality of mounting holes (15), and an inner diameter of an upper end of each mounting hole (15) is larger than an inner diameter of a lower end of each mounting hole (15).
9. The apparatus of claim 8, wherein the plurality of mounting holes (15) are provided with a part positioning rod seat (21) and/or a part positioning hole seat (20), the outer diameter of the upper end of the part positioning rod seat (21) is larger than that of the lower end, the top surface of the part positioning rod seat (21) is flush with the top surface of the base (9), a threaded hole B is formed in the part positioning rod seat (21), the threaded hole B is connected with the threaded rod, the outer diameter of the upper end of the part positioning hole seat (20) is larger than that of the lower end, the top surface of the part positioning hole seat (20) is flush with the top surface of the base (9), and a light hole is formed in the part positioning hole seat (20).
10. The apparatus for chemical mechanical polishing head maintenance and regeneration of semiconductor devices according to claim 1, wherein the four corners of the top surface of said base (9) are marked.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910701226.7A CN110543065B (en) | 2019-07-31 | 2019-07-31 | Equipment for repairing and regenerating chemical mechanical grinding head of semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910701226.7A CN110543065B (en) | 2019-07-31 | 2019-07-31 | Equipment for repairing and regenerating chemical mechanical grinding head of semiconductor equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110543065A true CN110543065A (en) | 2019-12-06 |
| CN110543065B CN110543065B (en) | 2023-08-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910701226.7A Active CN110543065B (en) | 2019-07-31 | 2019-07-31 | Equipment for repairing and regenerating chemical mechanical grinding head of semiconductor equipment |
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| Country | Link |
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| CN (1) | CN110543065B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112170276A (en) * | 2020-08-28 | 2021-01-05 | 富乐德科技发展（大连）有限公司 | Cleaning process for parts in grinding device in semiconductor equipment |
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| CN102967282A (en) * | 2012-11-02 | 2013-03-13 | 苏州富士胶片映像机器有限公司 | Height-adjustable universal fixture for measurement of externally-installed parts of digital cameras |
| CN103217218A (en) * | 2013-03-18 | 2013-07-24 | 京东方科技集团股份有限公司 | Spectrum test device and method |
| CN104796507A (en) * | 2015-04-29 | 2015-07-22 | 天津德铃通信部品有限公司 | Camera support rotating and being limited by 360 degrees and mobile terminal |
| CN105548012A (en) * | 2016-01-22 | 2016-05-04 | 东莞市誉铭新精密技术股份有限公司 | Turnover mechanism of CCD detection machine |
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2019
- 2019-07-31 CN CN201910701226.7A patent/CN110543065B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102096234A (en) * | 2009-12-15 | 2011-06-15 | 康佳集团股份有限公司 | Assembly structure of side-light type backlight module |
| CN102967282A (en) * | 2012-11-02 | 2013-03-13 | 苏州富士胶片映像机器有限公司 | Height-adjustable universal fixture for measurement of externally-installed parts of digital cameras |
| CN103217218A (en) * | 2013-03-18 | 2013-07-24 | 京东方科技集团股份有限公司 | Spectrum test device and method |
| CN104796507A (en) * | 2015-04-29 | 2015-07-22 | 天津德铃通信部品有限公司 | Camera support rotating and being limited by 360 degrees and mobile terminal |
| CN105548012A (en) * | 2016-01-22 | 2016-05-04 | 东莞市誉铭新精密技术股份有限公司 | Turnover mechanism of CCD detection machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112170276A (en) * | 2020-08-28 | 2021-01-05 | 富乐德科技发展（大连）有限公司 | Cleaning process for parts in grinding device in semiconductor equipment |
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| Publication number | Publication date |
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| CN110543065B (en) | 2023-08-04 |
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