CN110535025A - It is a kind of that BAR structure for putting quantity can be improved - Google Patents

It is a kind of that BAR structure for putting quantity can be improved Download PDF

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Publication number
CN110535025A
CN110535025A CN201910878672.5A CN201910878672A CN110535025A CN 110535025 A CN110535025 A CN 110535025A CN 201910878672 A CN201910878672 A CN 201910878672A CN 110535025 A CN110535025 A CN 110535025A
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CN
China
Prior art keywords
area
vallum
metal
bar
improved
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Granted
Application number
CN201910878672.5A
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Chinese (zh)
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CN110535025B (en
Inventor
王忠政
张永
单智发
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Quanli Photoelectric Co Ltd
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Quanli Photoelectric Co Ltd
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Priority to CN201910878672.5A priority Critical patent/CN110535025B/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/028Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Chemically Coating (AREA)

Abstract

A kind of that BAR structure for putting quantity can be improved, which is formed by connecting by several chip structures, and the vallum area of strip is provided in the middle part of chip structure, and the both ends in vallum area extend respectively to the edges at two ends of the chip structure;First metal area is equipped on the chip structure of vallum area two sides, two first metal areas are symmetrical arranged about vallum area, and the side of the first metal area is provided with the second metal area, and two second metal areas are symmetrically arranged at the two sides in vallum area;The height of first metal area and the second metal area is all larger than the height in vallum area.The configuration of the present invention is simple, processing cost is low, practicability is high, be not required to change operation process, be also not required to additional investment equipment, can with it is simple and convenient it is reliable improve BAR optical coating when the quantity put, the use for accompanying item can also be cancelled, solve the problems, such as that plated film production capacity is insufficient, it is thus also avoided that the problem of vallum film layer will be peeled off at lower substantially increases yields and production efficiency.

Description

It is a kind of that BAR structure for putting quantity can be improved
Technical field
The present invention relates to a kind of laser BAR items, and in particular to a kind of that BAR structure for putting quantity can be improved.
Background technique
Currently, the preparation of optic communication semiconductor laser, represents the hair of advanced micro-nano technology and device integration process Direction is opened up, has obtained the great attention of every country in the world, the semiconductor laser of optic communication is the core of fiber optic communication. Currently, optic communication mainly applies INP substrate slice to carry out epitaxial growth and rear end processing with semiconductor laser, in the processing of rear end BAR end face optical coating technique is to guarantee the critical process of laser parameter.
BAR optical coating exactly plates corresponding optical medium film layer at the both ends of BAR item, coating process in order to Guarantee that coating quality, BAR item cannot continuously be put, one folded up between BAR item and accompanies item, accompany the width ratio BAR item of item slightly narrow, It can make BAR slightly protruding when putting.Existing method is to put BAR item on one block of sheet glass and accompany item, can only be protected in this way There is a protrusion in card upper end, lower end with accompany item concordant, the lower end of BAR item is directly contacted with sheet glass, be easy to appear when putting breakage with It is dirty, and that end that do not protrude is easy for film layer occur in plated film being adhered phenomenon, just will appear film in the separation of BAR item The damaged situation of layer, yields reduce, how to guarantee the integrality of the optical medium film layer of vallum when BAR item is put, become and grind The emphasis and difficult point studied carefully.
Presently, there are the problem of have: 1. when BAR item is put, and one can be folded up between BAR item accompanies item, accompany after plated film Item can not reuse, and cause to waste, at high cost;2. accompanying the end face of item if any breakage, the optical medium at BAR both ends is easily caused Film layer is imperfect, influences quality;3.BAR item puts that quantity is few, and optical coating production capacity is lower.
Therefore, it devises one kind and can not only improve and put quantity, and in the case where item is accompanied in cancellation, moreover it is possible to possess both ends BAR structure of the integrality of the optical dielectric matter of vallum solves the above problems.
Summary of the invention
To overcome the deficiencies in the prior art described above, it is an object of that present invention to provide a kind of can be improved to put the BAR of quantity Structure.
In order to achieve the above objects and other related objects, present invention provide the technical scheme that one kind, which can be improved, puts number BAR structure of amount, the BAR item are formed by connecting by several chip structures, are provided with strip in the middle part of the chip structure The both ends in vallum area, the vallum area extend respectively to the edges at two ends of the chip structure;The chip knot of vallum area two sides First metal area is equipped on structure, two first metal areas are symmetrical arranged about the vallum area, first metal area Side is provided with the second metal area, and two second metal areas are symmetrically arranged at the two sides in the vallum area;First metal The height of area and second metal area is all larger than the height in the vallum area.
Preferred technical solution are as follows: the vallum area includes the vallum of middle part protrusion and the groove of two sides, the vallum area Upper layer be provided with metal layer.
Preferred technical solution are as follows: the shape of first metal area and second metal area is square.
Preferred technical solution are as follows: the area of first metal area is greater than the area of second metal area.
Preferred technical solution are as follows: the thickness of first metal area and second metal area is not less than the vallum Twice of area's metal layer thickness.
Preferred technical solution are as follows: the distance of first metal area to the vallum area is greater than second metal area and arrives The distance in the vallum area.
Since above-mentioned technical proposal is used, the present invention has the advantage, that compared with prior art
The configuration of the present invention is simple, processing cost is low, and practicability is high, is not required to change operation process, is also not required to additional investment equipment, can With the quantity put when BAR optical coating of simple and convenient reliable raising, the use for accompanying item can also be cancelled, solve plated film The problem of production capacity deficiency, it is thus also avoided that the problem of vallum film layer will be peeled off at lower substantially increases yields and production efficiency.
Detailed description of the invention
Fig. 1 is BAR part-structure top view.
Fig. 2 is BAR superposed state side view.
In the figures above, vallum area 1, the first metal area 2, the second metal area 3.
Specific embodiment
Embodiments of the present invention are illustrated by particular specific embodiment below, those skilled in the art can be by this explanation Content disclosed by book is understood other advantages and efficacy of the present invention easily.
Please refer to Fig. 1 ~ Fig. 2.It should be clear that this specification structure depicted in this specification institute accompanying drawings, ratio, size etc., only to Cooperate the revealed content of specification, so that those skilled in the art understands and reads, being not intended to limit the invention can be real The qualifications applied, therefore do not have technical essential meaning, the tune of the modification of any structure, the change of proportionate relationship or size It is whole, in the case where not influencing the effect of present invention can be generated and the purpose that can reach, it should all still fall in disclosed skill Art content obtains in the range of capable of covering.Meanwhile in this specification it is cited as "upper", "lower", "left", "right", " centre " and The term of " one " etc. is merely convenient to being illustrated for narration, rather than to limit the scope of the invention, relativeness It is altered or modified, under the content of no substantial changes in technology, when being also considered as the enforceable scope of the present invention.
Embodiment: a kind of that BAR structure for putting quantity can be improved as shown in Fig. 1 ~ Fig. 2, the BAR item is by several chips Structure is formed by connecting, and the vallum area of strip is provided in the middle part of chip structure, and the both ends in vallum area extend respectively to the chip The edges at two ends of structure;First metal area is equipped on the chip structure of vallum area two sides, two first metal areas are about ridge Area is symmetrical arranged, and the side of the first metal area is provided with the second metal area, and two second metal areas are symmetrically arranged at vallum The two sides in area;The height of first metal area and the second metal area is all larger than the height in vallum area.Vallum area includes middle part protrusion The upper layer of the groove of vallum and two sides, vallum area is provided with metal layer.The area of first metal area is greater than the face of the second metal area Product.
Preferred embodiment are as follows: as shown in Figure 1, the shape of the first metal area and the second metal area is square.Support Stablize, it is easy to process.
Preferred embodiment are as follows: the thickness of the first metal area and the second metal area is not less than vallum area metal layer thickness Twice.It can guarantee the integrality of the optical medium film layer of vallum when BAR item is put.
Preferred embodiment are as follows: the distance of the first metal area to vallum area be greater than the second metal area to vallum area away from From.Distance is not identical, guarantees supporting & stablizing.
As shown in Figure 1, the width size of the first metal area and the second metal area can be with self-defining, shape as shown in the figure Thicker thickness can be arranged in the range of cost allows with appropriate adjustment in the thickness of square, the first metal area and the second metal area Degree, can preferably protect to vallum.
As shown in Fig. 2, the arrangement method of BAR item are as follows: BAR item is put on the glass sheet, and another BAR can be directly placed in On previous BAR item, when optical coating, which needs to erect BAR item, is put, and wherein the space in the area D is bigger, optical dielectric film layer Can be more complete, also it can avoid optical dielectric film layer because solution item causes film layer to peel off.
The configuration of the present invention is simple, processing cost is low, and practicability is high, is not required to change operation process, is also not required to additional investment and sets It is standby, it can also cancel the use for accompanying item with the quantity put when BAR optical coating of simple and convenient reliable raising, solve The problem of plated film production capacity deficiency, it is thus also avoided that the problem of vallum film layer will be peeled off at lower substantially increases yields and life Produce efficiency.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as At all equivalent modifications or change, should be covered by the claims of the present invention.

Claims (6)

1. a kind of can be improved BAR structure for putting quantity, which is formed by connecting by several chip structures, it is characterised in that: The vallum area of strip is provided in the middle part of the chip structure, the both ends in the vallum area extend respectively to the chip structure Edges at two ends;First metal area is equipped on the chip structure of vallum area two sides, two first metal areas are about described Vallum area is symmetrical arranged, and the side of first metal area is provided with the second metal area, and two second metal areas are symmetrically arranged In the two sides in the vallum area;The height of first metal area and second metal area is all larger than the height in the vallum area Degree.
A kind of BAR structure for putting quantity can be improved 2. according to claim 1, it is characterised in that: the vallum area The groove of vallum and two sides including middle part protrusion, the upper layer in the vallum area are provided with metal layer.
A kind of BAR structure for putting quantity can be improved 3. according to claim 2, it is characterised in that: first gold medal The shape for belonging to area and second metal area is square.
A kind of BAR structure for putting quantity can be improved 4. according to claim 3, it is characterised in that: first gold medal The area for belonging to area is greater than the area of second metal area.
A kind of BAR structure for putting quantity can be improved 5. according to claim 4, it is characterised in that: first gold medal The thickness of category area and second metal area is not less than twice of vallum area metal layer thickness.
A kind of BAR structure for putting quantity can be improved 6. according to claim 5, it is characterised in that: first gold medal The distance for belonging to area to the vallum area is greater than second metal area to the distance in the vallum area.
CN201910878672.5A 2019-09-18 2019-09-18 BAR strip structure capable of increasing placement quantity Active CN110535025B (en)

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Application Number Priority Date Filing Date Title
CN201910878672.5A CN110535025B (en) 2019-09-18 2019-09-18 BAR strip structure capable of increasing placement quantity

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CN110535025A true CN110535025A (en) 2019-12-03
CN110535025B CN110535025B (en) 2024-06-14

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070082712A (en) * 2006-02-17 2007-08-22 엘에스전선 주식회사 Jig apparatus for coating the cleaved facet of laser diode and spacer structure therefor
US20110116526A1 (en) * 2009-11-19 2011-05-19 Opnext Japan, Inc. Semiconductor optical device
CN102545041A (en) * 2012-01-17 2012-07-04 苏州纳睿光电有限公司 Coating strip of cavity surface of semiconductor laser and preparation method thereof
CN103138157A (en) * 2011-11-23 2013-06-05 光环科技股份有限公司 Edge-emitting semiconductor laser element, manufacturing method thereof and crystal strip with edge-emitting semiconductor laser element
CN105006740A (en) * 2015-07-23 2015-10-28 山东华光光电子有限公司 End face coating fixture for stripe-geometry semiconductor laser and application thereof
CN105938976A (en) * 2016-03-08 2016-09-14 北京工业大学 Semiconductor laser cavity surface coating clamp
CN205811271U (en) * 2016-06-30 2016-12-14 西安立芯光电科技有限公司 A kind of plating films on cavity surfaces of semiconductor lasers fixture assembling structure
CN108631153A (en) * 2017-03-22 2018-10-09 山东华光光电子股份有限公司 A kind of total reflection light waveguide semiconductor chip of laser and preparation method thereof
CN208055456U (en) * 2018-04-04 2018-11-06 福建中科光芯光电科技有限公司 Realize both ends male means when BAR optical coating is put
CN210379763U (en) * 2019-09-18 2020-04-21 全磊光电股份有限公司 Can improve BAR strip structure of quantity of putting

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070082712A (en) * 2006-02-17 2007-08-22 엘에스전선 주식회사 Jig apparatus for coating the cleaved facet of laser diode and spacer structure therefor
US20110116526A1 (en) * 2009-11-19 2011-05-19 Opnext Japan, Inc. Semiconductor optical device
CN103138157A (en) * 2011-11-23 2013-06-05 光环科技股份有限公司 Edge-emitting semiconductor laser element, manufacturing method thereof and crystal strip with edge-emitting semiconductor laser element
CN102545041A (en) * 2012-01-17 2012-07-04 苏州纳睿光电有限公司 Coating strip of cavity surface of semiconductor laser and preparation method thereof
CN105006740A (en) * 2015-07-23 2015-10-28 山东华光光电子有限公司 End face coating fixture for stripe-geometry semiconductor laser and application thereof
CN105938976A (en) * 2016-03-08 2016-09-14 北京工业大学 Semiconductor laser cavity surface coating clamp
CN205811271U (en) * 2016-06-30 2016-12-14 西安立芯光电科技有限公司 A kind of plating films on cavity surfaces of semiconductor lasers fixture assembling structure
CN108631153A (en) * 2017-03-22 2018-10-09 山东华光光电子股份有限公司 A kind of total reflection light waveguide semiconductor chip of laser and preparation method thereof
CN208055456U (en) * 2018-04-04 2018-11-06 福建中科光芯光电科技有限公司 Realize both ends male means when BAR optical coating is put
CN210379763U (en) * 2019-09-18 2020-04-21 全磊光电股份有限公司 Can improve BAR strip structure of quantity of putting

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