CN213459752U

CN213459752U - Solar cell and photovoltaic module

Info

Publication number: CN213459752U
Application number: CN202022740011.7U
Authority: CN
Inventors: 邓圣杰; 王立富; 王海翔; 陈敏华
Original assignee: Shangrao Jietai New Energy Technology Co Ltd
Current assignee: Shangrao Jietai New Energy Technology Co Ltd
Priority date: 2020-11-24
Filing date: 2020-11-24
Publication date: 2021-06-15
Anticipated expiration: 2030-11-24

Abstract

The application discloses a solar cell, which comprises a silicon wafer, a plurality of main grids, a plurality of auxiliary grids and a plurality of welding spots; the surface of the silicon chip is distributed with a plurality of silicon leakage areas, the edge of the silicon leakage areas is distributed with a main grid, a welding spot is positioned in the silicon leakage areas, and the silicon leakage areas are not distributed with auxiliary grids and silver paste; the welding point is connected with the main grid in the direction parallel to the auxiliary grid, and the width of the welding point in the direction vertical to the auxiliary grid is smaller than the length of the silicon leakage area. Have a plurality of hourglass silicon region on solar cell's the silicon chip, the solder joint distributes in leaking the silicon region, the width of solder joint is less than the length of leaking the silicon region in perpendicular to auxiliary grid direction, and do not have auxiliary grid and silver thick liquid in leaking the silicon region, there is an empty region in one side of solder joint promptly, this empty region is the partly of leaking the silicon region, when the welding, the solder strip that corresponds with empty region can not be because of the auxiliary grid, silver thick liquid is heightened by the bed, increase the laminating nature of solder strip and solder joint, promote the welded reliability, and then promote solar cell quality. The application also provides a photovoltaic module.

Description

Solar cell and photovoltaic module

Technical Field

The application relates to the technical field of solar cells, in particular to a solar cell and a photovoltaic module.

Background

The multi-main-grid (MBB) solar cell gradually becomes a mainstream product in the photovoltaic industry, a structural schematic diagram of the front side of the MBB solar cell is shown in fig. 1, fig. 2 and fig. 3 are partial enlarged views of fig. 1, a plurality of main grids 5 and auxiliary grids 6 which are vertically distributed in a cross manner are distributed on the front side of the MBB solar cell, and welding spots 2 are distributed on the main grids 5. As the main grid 5 of the MBB solar cell is increasingly refined, the main grid 5 has almost no solderability, and when soldering, soldering can be performed only by using the solder joint 2 on the front side of the MBB solar cell 1 as a main solder joint, and the solder strip 3 connects the solder joint 2 and the back electrode 4 of the adjacent MBB solar cell, and the soldering schematic diagram is shown in fig. 4. In order to consider the manufacturing cost and the quality of the solar cell, the welding spots can not be widened and lengthened without limitation and are limited by the size of the welding spots, the weldable area of the MBB solar cell is very small, once the welding strips and the welding spots are not effectively combined, insufficient welding is easily caused, so that the current collection and transmission of the whole solar cell are reduced, and the quality of the solar cell is influenced.

Therefore, how to solve the above technical problems should be a great concern to those skilled in the art.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a solar cell and photovoltaic module to reliability when reinforcing solder joint welding promotes solar cell's quality.

In order to solve the above technical problem, the present application provides a solar cell, including: the device comprises a silicon chip, a plurality of main grids, a plurality of auxiliary grids and a plurality of welding spots;

a plurality of silicon leakage areas are distributed on the surface of the silicon chip, the main gates are distributed on the edges of the silicon leakage areas, the welding points are located in the silicon leakage areas, and the auxiliary gates and silver paste are not distributed in the silicon leakage areas; the welding point is connected with the main grid in the direction parallel to the auxiliary grid, and the width of the welding point in the direction vertical to the auxiliary grid is smaller than the length of the silicon leakage area.

Optionally, in the solar cell, the solder joint is located in the middle of the silicon leakage region.

Optionally, in the solar cell, the shape of the solder joint is any one of a rectangle, a circle, an ellipse, and a square.

Optionally, in the solar cell, the width of the main grid ranges from 0.06mm to 0.10mm, inclusive.

The application also provides a photovoltaic module, photovoltaic module includes by lower supreme first base plate, first glued membrane layer, battery piece layer, second glued membrane layer, the second base plate that stacks gradually, the battery piece layer includes any of a plurality of above-mentioned any solar cell.

Optionally, in the photovoltaic module, the first adhesive film layer and the second adhesive film layer are both EVA adhesive film layers.

Optionally, in the photovoltaic module, the second substrate is an ultra-white patterned glass substrate.

Optionally, in the photovoltaic module, the first substrate is a glass substrate or a back plate.

The application provides a solar cell, includes: the device comprises a silicon chip, a plurality of main grids, a plurality of auxiliary grids and a plurality of welding spots; a plurality of silicon leakage areas are distributed on the surface of the silicon chip, the main gates are distributed on the edges of the silicon leakage areas, the welding points are located in the silicon leakage areas, and the auxiliary gates and silver paste are not distributed in the silicon leakage areas; the welding point is connected with the main grid in the direction parallel to the auxiliary grid, and the width of the welding point in the direction vertical to the auxiliary grid is smaller than the length of the silicon leakage area.

It can be seen that, a plurality of silicon leakage regions are arranged on a silicon wafer of a solar cell in the application, welding spots are distributed in the silicon leakage regions, main grids are distributed at the edges of the silicon leakage regions, the welding spots are connected with the main grids in the direction parallel to the auxiliary grids, the width of the welding spots in the direction perpendicular to the auxiliary grids is smaller than the length of the silicon leakage regions, and no auxiliary grid or silver paste exists in the silicon leakage regions, namely, a blank region exists at least on one side of the welding spots, the blank region is a part of the silicon leakage region, when welding is carried out, a welding strip corresponding to the blank region cannot be heightened due to the auxiliary grids and the silver paste, so that the laminating property of the welding strip and the welding spots is increased, the welding reliability is improved, and the quality of the solar cell is.

In addition, this application still provides a photovoltaic module.

Drawings

For a clearer explanation of the embodiments or technical solutions of the prior art of the present application, the drawings needed for the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of the front side of an MBB solar cell;

FIG. 2 is an enlarged view of a portion of the dashed line box A of FIG. 1;

FIG. 3 is an enlarged view of a portion of the dashed box B in FIG. 1;

FIG. 4 is a schematic illustration of MBB solar cell soldering;

fig. 5 is a schematic front view of a solar cell according to an embodiment of the present disclosure;

fig. 6 is an enlarged schematic view of a dotted line frame C of a front structure of a solar cell according to an embodiment of the present disclosure;

fig. 7 is an enlarged schematic view of a dotted line frame D of a front structure of a solar cell according to an embodiment of the present disclosure;

fig. 8 is a schematic structural diagram of a photovoltaic module according to an embodiment of the present application.

Detailed Description

In order that those skilled in the art will better understand the disclosure, the following detailed description will be given with reference to the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be implemented in other ways different from the specific details set forth herein, and one skilled in the art may similarly generalize the present invention without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.

As described in the background section, since the solder joints cannot be widened and lengthened without limitation, and are limited by the size of the solder joints, the solderable areas of the MBB solar cell are very small, and once the solder ribbons and the solder joints are not effectively bonded, cold solder joints are easily caused, so that the current collection and transmission of the whole solar cell are reduced, and the quality of the solar cell is affected.

In view of the above, the present application provides a solar cell, please refer to fig. 5 to 7, fig. 5 is a schematic front view of the solar cell provided in the embodiment of the present application, fig. 6 and 7 are enlarged partial views of dotted line frames C and D in fig. 5, and the solar cell includes: the silicon chip, a plurality of main grids 5, a plurality of auxiliary grids 6 and a plurality of welding spots 2;

a plurality of silicon leakage areas 7 are distributed on the surface of the silicon chip, the main grid 5 is distributed on the edge of each silicon leakage area 7, the welding spot 2 is positioned in each silicon leakage area 7, and the auxiliary grid 6 and silver paste are not distributed in each silicon leakage area 7; the welding point 2 is connected with the main grid 5 in the direction parallel to the auxiliary grid 6, and the width of the welding point 2 in the direction vertical to the auxiliary grid 6 is smaller than the length of the silicon leakage area 7.

The silicon leakage region 7 is a region on the surface of the silicon wafer, and the region is free from any other materials. It should be noted that the length of the silicon leakage region 7 is not particularly limited in this application, as the case may be. The main grid 5 and the auxiliary grid 6 are vertically distributed in a crossed way.

Optionally, the width of the main grid 5 ranges from 0.06mm to 0.10mm, inclusive, e.g. 0.07mm, 0.08mm, 0.09mm, etc.

It should be noted that the shape of the welding spot 2 is not specifically limited in this application, and may be set by itself. For example, the shape of the solder 2 may be any one of rectangular, circular, elliptical, and square.

Preferably, the solder joint 2 is located in the middle of the silicon leakage region 7 so as to ensure that the areas of the silicon leakage regions 7 on the two sides of the solder joint 2 are equal, when the solder joint is welded with a solder strip, the solder strips on the two sides of the solder joint 2 cannot be lifted by a pad, the whole body of the solder joint 2 is ensured to be attached to the solder strip, and the welding reliability is further improved.

Have a plurality of silicon regions 7 that leak on solar cell's the silicon chip in this application, solder joint 2 distributes in leaking silicon region 7, the edge distribution who leaks silicon region 7 has main bars 5, solder joint 2 is connected with main bars 5 on being on a parallel with vice bars 6 direction, the width of solder joint 2 is less than the length that leaks silicon region 7 in the vice bars 6 direction of perpendicular to, and do not have vice bars 6 and silver thick liquid in leaking silicon region 7, there is a vacant region in one side of solder joint 2 at least, this vacant region is partly of leaking silicon region 7, when the welding, the solder strip that corresponds with vacant region can not be because of vice bars 6, the silver thick liquid is bed hedgehopping, thereby increase solder strip and solder joint 2's laminating nature, promote welded reliability, and then promote solar cell's quality.

The present application further provides a photovoltaic module, please refer to fig. 8, and fig. 8 is a schematic structural diagram of the photovoltaic module provided in the embodiment of the present application, where the photovoltaic module includes a first substrate 8, a first adhesive film layer 9, a cell layer 10, a second adhesive film layer 11, and a second substrate 12, which are sequentially stacked from bottom to top, and the cell layer 10 includes a plurality of solar cells according to the above embodiments.

Optionally, in an embodiment of the present application, the first adhesive film layer 9 and the second adhesive film layer 11 are both EVA (Ethylene Vinyl Acetate) adhesive film layers, but this is not particularly limited in the present application, and the first adhesive film layer 9 and the second adhesive film layer 11 may also be both POE (Ethylene-propylene copolymer) adhesive film layers.

Preferably, the second substrate 12 is an ultra-white patterned glass substrate, and the ultra-white patterned glass has the characteristics of high light transmittance and low reflectivity, so that the utilization rate of the photovoltaic module to light is improved, and the efficiency of the photovoltaic module is improved.

Optionally, when the photovoltaic module is a single glass module, the first substrate 8 is a back plate, which is not specifically limited in this application, for example, the back plate may be a structural back plate such as TPT, TPE, KPE, or the like; when the photovoltaic module is a dual-glass module, the first substrate 8 is a glass substrate.

This application includes a plurality of solar cell among the photovoltaic module, solar cell's silicon chip has a plurality of silicon region 7 that leak, solder joint 2 distributes in leaking silicon region 7, the edge distribution who leaks silicon region 7 has main bars 5, solder joint 2 is connected with main bars 5 on being on a parallel with vice bars 6 direction, the width of solder joint 2 is less than the length that leaks silicon region 7 in perpendicular to vice bars 6 direction, and leak not have vice bars 6 and silver thick liquid in silicon region 7, there is an empty region in one side of solder joint 2 at least, this empty region is a part of leaking silicon region 7, when the welding, the solder strip that corresponds with empty region can not be because of vice bars 6, silver thick liquid is bed hedgehopping, thereby increase solder strip and solder joint 2's laminating nature, promote the welded reliability, and then promote solar cell's quality, thereby promote photovoltaic module's quality.

The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.

The solar cell and photovoltaic module provided by the present application are described in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.

Claims

1. A solar cell, comprising: the device comprises a silicon chip, a plurality of main grids, a plurality of auxiliary grids and a plurality of welding spots;

2. The solar cell of claim 1, wherein the solder joint is located in the middle of the silicon drain region.

3. The solar cell of claim 1, wherein the shape of the solder joint is any one of rectangular, circular, elliptical, and square.

4. A solar cell according to any of claims 1 to 3, wherein the width of the main grid ranges from 0.06mm to 0.10mm, inclusive.

5. A photovoltaic module, which is characterized by comprising a first substrate, a first adhesive film layer, a cell sheet layer, a second adhesive film layer and a second substrate which are sequentially stacked from bottom to top, wherein the cell sheet layer comprises a plurality of solar cells as claimed in any one of claims 1 to 4.

6. The photovoltaic module of claim 5, wherein the first and second adhesive film layers are both EVA adhesive film layers.

7. The photovoltaic module of claim 6 wherein the second substrate is an ultra-white patterned glass substrate.

8. The photovoltaic module of claim 7, wherein the first substrate is a glass substrate or a backsheet.