CN110517980B - Automatic wafer conveying mechanism for semiconductor industry - Google Patents
Automatic wafer conveying mechanism for semiconductor industry Download PDFInfo
- Publication number
- CN110517980B CN110517980B CN201910908159.6A CN201910908159A CN110517980B CN 110517980 B CN110517980 B CN 110517980B CN 201910908159 A CN201910908159 A CN 201910908159A CN 110517980 B CN110517980 B CN 110517980B
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- Prior art keywords
- wafer
- automatic
- slip
- bearing table
- automatic anti
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- 230000007246 mechanism Effects 0.000 title claims abstract description 30
- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 239000000463 material Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052755 nonmetal Inorganic materials 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 13
- 238000001514 detection method Methods 0.000 abstract 2
- 235000012431 wafers Nutrition 0.000 description 92
- 230000002159 abnormal effect Effects 0.000 description 4
- 230000003749 cleanliness Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a mechanism for automatically conveying a wafer in the semiconductor industry, wherein the wafer is placed in a wafer box, and the wafer box is automatically conveyed from a position A to a position B through a bearing table, a connecting structure and a conveying mechanism. The wafer box is placed on the bearing table, and an automatic detection mechanism confirms whether the wafer box is placed at the correct position or not, so that no offset is ensured, and if the offset occurs, an alarm is given; the detection mechanism transmits an instruction to the automatic wafer anti-slip device after detecting no offset, and the automatic anti-slip device locks the wafer to ensure that the wafer cannot slip out in the process of automatically transmitting the wafer from the position A to the position B.
Description
Technical Field
The invention relates to a mechanism for automatically conveying wafers of semiconductor equipment, in particular to a mechanism for automatically conveying wafers in the semiconductor industry.
Background
In the field of semiconductors, a wafer in-out semiconductor device needs to have an automatic conveying function, so that the device is required to convey, related devices or mechanisms of the conveying device can convey wafers with different sizes, and multiple functions meeting industry requirements exist in the conveying process, wherein the functions comprise multi-size wafer application, occupation automatic identification, automatic taking-out and conveying, automatic scanning of wafer states, automatic anti-slip devices and the like.
Disclosure of Invention
In order to solve the technical problems, the invention aims to provide an automatic wafer conveying mechanism for the semiconductor industry, which comprises the following specific technical scheme:
the automatic wafer conveying mechanism for the semiconductor industry comprises a wafer box, an automatic anti-slip limiting rod, an automatic anti-slip rotating shaft, a supporting piece, a conveying sliding table, an identification sensor, a rotary automatic anti-slip device, a bearing table, an equipment virtual door and a limiting block;
the bearing table is provided with a hollow mounting opening, the bottom end of one side of the bearing table is fixed on the supporting piece, the sliding table drives the supporting piece, and the supporting piece drives the bearing table to slide back and forth;
The rotary automatic anti-slip device comprises an automatic anti-slip limiting rod, an automatic anti-slip rotating shaft and a rotary electric cylinder;
The fixed plate on the rotary electric cylinder is connected to one side of the bearing table;
One end of the rotary electric cylinder is connected with the automatic anti-slip rotating shaft, and the automatic anti-slip limiting rod is arranged on the automatic anti-slip rotating shaft and rotates along the shaft;
The wafer box is placed on the bearing table, the position is limited by the limiting block, the wafer is arranged in the wafer box, and the wafer in the wafer box is locked by the anti-slip limiting rod;
the identification sensor is arranged at the mounting port at the inner side of the bearing table and is used for identifying whether the wafer box is at the correct position of the bearing table or not through the sensor;
after the virtual door of the equipment is opened, the carrying table brings the wafer box into and out of the equipment A and the equipment B.
The wafer automatic conveying mechanism for the semiconductor industry has the preferable scheme that the wafer sizes are respectively 2 inches, 3 inches, 4 inches, 6 inches, 8 inches and 12 inches, and the wafer boxes corresponding to the corresponding sizes are used for loading.
The wafer automatic conveying mechanism for the semiconductor industry has the preferable scheme that an anti-slip limiting rod in the rotary automatic anti-slip device can be classified into pneumatic control or electric control, metal or nonmetal according to control and materials.
The wafer automatic conveying mechanism for the semiconductor industry is characterized in that wafer boxes with different sizes are conveyed on a bearing table through conveying mechanisms with different forms of air cylinders or electric cylinders, so that the wafer boxes move.
The wafer state is automatically scanned, after the wafer box is automatically identified through occupation, the sensor scans the wafers in the wafer box, the number of the wafers is confirmed, whether abnormal conditions such as lamination and heavy sheets occur or not is confirmed, and if abnormal conditions occur, an alarm is given;
and after the automatic anti-slip device rotates and the bearing table automatically recognizes whether the wafer box occupies a space, the automatic anti-slip device locks the wafer in the wafer box, so that the wafer is ensured not to slip out of the wafer box in the delivery process.
And (3) automatically taking and delivering, namely placing the wafer box on a bearing table, wherein the bearing table is correct in automatic identification position, and automatically conveying the wafer box to the inside of high cleanliness from the outside of the equipment by the bearing table after the rotary automatic anti-slip device is locked.
The working principle of the automatic wafer conveying mechanism for the semiconductor industry is as follows: and in the process of automatically conveying the wafer box to the position B from the position A, the wafer box is placed on a bearing table, whether the placement position of the wafer box is correct or not is judged by an identification sensor, if the placement position of the wafer box is incorrect, alarm feedback is given, after the position of the wafer box is adjusted, an instruction is automatically transmitted to a rotating mechanism, an automatic anti-slip rotating shaft is driven to rotate by the rotation of the wafer box, and then the automatic anti-slip rotating shaft drives an automatic anti-slip limiting rod to lock the wafer in the wafer box at the position, so that the wafer box cannot slip. The conveying sliding table is connected with the supporting piece, the supporting piece is connected with the bearing table, the bearing table bears the wafer box, and the wafer box starts to move from the position A to the position B through the virtual door of the in-out equipment, and the process is the process that the wafer box enters the equipment, and otherwise, the process that the wafer box exits the equipment.
The invention has the beneficial effects that: the invention has simple structure, comprehensive functions and cost saving. The wafer conveying device meets the requirement of the wafer on high clean space work by conveying wafers with various sizes into and out of semiconductor equipment, and the structure occupies small space and has good compatibility. Therefore, the structure has great social and economic benefits.
Drawings
Fig. 1 is a schematic diagram of an automatic wafer transfer mechanism for semiconductor industry.
In the figure, 1 is a wafer box, 2 is an automatic anti-slip limiting rod, 3 is an automatic anti-slip rotating shaft, 4 is a supporting piece, 5 is a conveying sliding table, 6 is an identification sensor, 7 is a rotating mechanism, 8 is a bearing table, 9 is an equipment virtual door, and 10 is a limiting block.
Detailed Description
The automatic wafer conveying mechanism for the semiconductor industry comprises a wafer box 1, an automatic anti-slip limiting rod 2, an automatic anti-slip rotating shaft 3, a supporting piece 4, a conveying sliding table 5, an identification sensor 6, a rotary automatic anti-slip device 7, a bearing table 8, an equipment virtual door 9 and a limiting block 10, wherein the automatic wafer conveying mechanism is shown in fig. 1;
the bearing table 8 is provided with a hollow mounting opening, the bottom end of one side of the bearing table 8 is fixed on the supporting piece 4, the conveying sliding table 5 drives the supporting piece 4, and the supporting piece 4 drives the bearing table 8 to slide back and forth;
The rotary automatic anti-slip device 7 comprises an automatic anti-slip limiting rod 2, an automatic anti-slip rotating shaft 3 and a rotary electric cylinder;
The fixed plate on the rotary electric cylinder is connected to one side of the bearing table 8;
One end of the rotary electric cylinder is connected with an automatic anti-slip out rotating shaft 3, and an automatic anti-slip out limiting rod 2 is arranged on the automatic anti-slip out rotating shaft 3 and rotates along the shaft;
The wafer box 1 is placed on the bearing table 8, the position is limited by the limiting block 10, the wafer is arranged in the wafer box 1, and the wafer in the wafer box 1 is locked by the anti-slip limiting rod 2;
The identification sensor 6 is arranged at an inner side mounting port of the bearing table 8 and is used for identifying whether the wafer box 1 is at the correct position of the bearing table 8 or not through the sensor;
after the virtual door 9 is opened, the carrying table 8 carries the wafer cassette 1 into and out of the equipment a and the equipment B.
The wafer sizes are 2 inches, 3 inches, 4 inches, 6 inches, 8 inches and 12 inches, respectively, and are corresponding to the wafer boxes 1 with corresponding sizes.
The anti-slip-out limiting rod 2 in the automatic rotating anti-slip-out device 7 can be classified into pneumatic control or electric control, metal or nonmetal according to control and materials.
The wafer cassettes 1 with different sizes are moved on the carrying platform 8 by different types of conveying mechanisms of air cylinders or electric cylinders.
The wafer state is automatically scanned, after the wafer box 1 is automatically identified through occupation, the sensor scans the wafers in the wafer box, the number of the wafers is confirmed, whether abnormal conditions such as lamination and heavy sheets occur or not is confirmed, and if abnormal conditions occur, an alarm is given;
The automatic anti-slip device is rotated, and after the bearing table automatically recognizes whether the wafer box 1 occupies a space, the automatic anti-slip device locks the wafers in the wafer box 1, so that the wafers cannot slip out of the wafer box in the delivery process.
And (3) automatically taking and delivering, namely placing the wafer box 1 on the bearing table 8, automatically identifying the correct position of the bearing table 8, and automatically conveying the wafer box to the inside of high cleanliness from the outside of the equipment by the bearing table after the automatic anti-slip device is locked.
The working principle of the automatic wafer conveying mechanism for the semiconductor industry is as follows: in the process that the wafer box 1 is automatically conveyed to the position B from the position A, the wafer box 1 is placed on the bearing table 8, whether the placement position of the wafer box 1 is correct or not is judged by the identification sensor, if not, alarm feedback is given, after the position of the wafer box 1 is adjusted, an instruction is automatically conveyed to the rotating mechanism 7, the rotating mechanism rotates to drive the automatic anti-slip rotating shaft 3 to rotate, and then the automatic anti-slip rotating shaft 3 drives the automatic anti-slip limiting rod 2 to lock the wafer in the wafer box 1 to a position, so that the wafer cannot slip. The conveying sliding table 5 is connected with the supporting piece 4, the supporting piece 4 is connected with the bearing table 8, the bearing table 8 bears the wafer box 1, and the wafer box 1 starts to move from the position A to the position B through the equipment inlet and outlet virtual door 9, and the process is the equipment inlet process of the wafer box 1, and the process is the equipment outlet process of the wafer box 1.
Claims (4)
1. An automatic wafer conveying mechanism for the semiconductor industry is characterized in that: the device comprises a wafer box, an automatic anti-slip limiting rod, an automatic anti-slip rotating shaft, a supporting piece, a conveying sliding table, an identification sensor, a rotary automatic anti-slip device, a bearing table, an in-out equipment virtual door and a limiting block;
the bearing table is provided with a hollow mounting opening, the bottom end of one side of the bearing table is fixed on the supporting piece, the sliding table drives the supporting piece, and the supporting piece drives the bearing table to slide back and forth;
The rotary automatic anti-slip device comprises an automatic anti-slip limiting rod, an automatic anti-slip rotating shaft and a rotary electric cylinder;
The fixed plate on the rotary electric cylinder is connected to one side of the bearing table;
One end of the rotary electric cylinder is connected with the automatic anti-slip rotating shaft, and the automatic anti-slip limiting rod is arranged on the automatic anti-slip rotating shaft and rotates along the shaft;
The wafer box is placed on the bearing table, the position is limited by the limiting block, the wafer is arranged in the wafer box, and the wafer in the wafer box is locked by the anti-slip limiting rod;
the identification sensor is arranged at the mounting port at the inner side of the bearing table and is used for identifying whether the wafer box is at the correct position of the bearing table or not through the sensor;
after the virtual door of the equipment is opened, the carrying table brings the wafer box into and out of the equipment A and the equipment B.
2. An automatic wafer transfer mechanism for the semiconductor industry as claimed in claim 1, wherein: the wafer sizes are 2 inches, 3 inches, 4 inches, 6 inches, 8 inches and 12 inches respectively, and are corresponding to the wafer boxes with corresponding sizes.
3. An automatic wafer transfer mechanism for the semiconductor industry as claimed in claim 1, wherein: the anti-slip limiting rod in the automatic rotary anti-slip device can be classified into pneumatic control or electric control, metal or nonmetal according to control and materials.
4. An automatic wafer transfer mechanism for the semiconductor industry as claimed in claim 1, wherein: the wafer boxes with different sizes are moved on the bearing table through different forms of conveying mechanisms of air cylinders or electric cylinders.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910908159.6A CN110517980B (en) | 2019-09-25 | 2019-09-25 | Automatic wafer conveying mechanism for semiconductor industry |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910908159.6A CN110517980B (en) | 2019-09-25 | 2019-09-25 | Automatic wafer conveying mechanism for semiconductor industry |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110517980A CN110517980A (en) | 2019-11-29 |
| CN110517980B true CN110517980B (en) | 2024-04-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910908159.6A Active CN110517980B (en) | 2019-09-25 | 2019-09-25 | Automatic wafer conveying mechanism for semiconductor industry |
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| CN (1) | CN110517980B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114023682B (en) * | 2021-10-26 | 2022-06-10 | 江苏亚电科技有限公司 | Wafer box alignment turnover mechanism |
| CN117049179A (en) * | 2023-07-11 | 2023-11-14 | 上海稷以科技有限公司 | Semiconductor automation device and automation control method |
| CN117352438B (en) * | 2023-12-04 | 2024-03-22 | 北京锐洁机器人科技有限公司 | Multi-size wafer loading platform |
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| CN104637848A (en) * | 2013-11-07 | 2015-05-20 | 沈阳芯源微电子设备有限公司 | Wafer temporary storage device being used in semiconductor equipment |
| CN204809199U (en) * | 2015-07-31 | 2015-11-25 | 中芯国际集成电路制造(北京)有限公司 | Wafer box transports system |
| CN105810561A (en) * | 2016-05-09 | 2016-07-27 | 安徽晶新微电子有限公司 | Sliding prevention protection device and protection method for wafer of prober transfer mechanism |
| CN206363994U (en) * | 2017-01-17 | 2017-07-28 | 中芯国际集成电路制造（天津）有限公司 | Wafer load device |
| WO2017135518A1 (en) * | 2016-02-05 | 2017-08-10 | 주식회사 이오테크닉스 | Wafer alignment apparatus and wafer transfer apparatus |
| CN109119369A (en) * | 2017-06-23 | 2019-01-01 | 上海微电子装备（集团）股份有限公司 | Wafer transfer box and wafer automatic transfer system |
| CN210129497U (en) * | 2019-09-25 | 2020-03-06 | 沈阳芯达半导体设备有限公司 | Automatic wafer conveying mechanism for semiconductor industry |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4219579B2 (en) * | 2001-07-24 | 2009-02-04 | 東京エレクトロン株式会社 | Wafer transfer system, wafer transfer method, and automatic guided vehicle system |
-
2019
- 2019-09-25 CN CN201910908159.6A patent/CN110517980B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104637848A (en) * | 2013-11-07 | 2015-05-20 | 沈阳芯源微电子设备有限公司 | Wafer temporary storage device being used in semiconductor equipment |
| CN204809199U (en) * | 2015-07-31 | 2015-11-25 | 中芯国际集成电路制造(北京)有限公司 | Wafer box transports system |
| WO2017135518A1 (en) * | 2016-02-05 | 2017-08-10 | 주식회사 이오테크닉스 | Wafer alignment apparatus and wafer transfer apparatus |
| CN105810561A (en) * | 2016-05-09 | 2016-07-27 | 安徽晶新微电子有限公司 | Sliding prevention protection device and protection method for wafer of prober transfer mechanism |
| CN206363994U (en) * | 2017-01-17 | 2017-07-28 | 中芯国际集成电路制造（天津）有限公司 | Wafer load device |
| CN109119369A (en) * | 2017-06-23 | 2019-01-01 | 上海微电子装备（集团）股份有限公司 | Wafer transfer box and wafer automatic transfer system |
| CN210129497U (en) * | 2019-09-25 | 2020-03-06 | 沈阳芯达半导体设备有限公司 | Automatic wafer conveying mechanism for semiconductor industry |
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| Publication number | Publication date |
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| CN110517980A (en) | 2019-11-29 |
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Inventor after: Wei Meng Inventor after: Zhang Shuang Inventor before: Guo Cong Inventor before: Wei Meng Inventor before: Zhang Shuang |
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