CN110506236B - 用于显示器制造的基板上的自动临界尺寸测量的方法、用于检查用于显示器制造的大面积基板的方法和设备和操作所述设备的方法 - Google Patents

用于显示器制造的基板上的自动临界尺寸测量的方法、用于检查用于显示器制造的大面积基板的方法和设备和操作所述设备的方法 Download PDF

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Publication number
CN110506236B
CN110506236B CN201880004163.3A CN201880004163A CN110506236B CN 110506236 B CN110506236 B CN 110506236B CN 201880004163 A CN201880004163 A CN 201880004163A CN 110506236 B CN110506236 B CN 110506236B
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substrate
charged particle
particle beam
image
resolution
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CN110506236A (zh
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伯恩哈德·G·穆勒
罗伯特·特劳纳
伯恩哈德·舒勒
彼得·C·斯塔芬森
库普雷特·辛格·维尔迪
沃尔克·戴克
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Applied Materials Inc
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Applied Materials Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/22—Treatment of data
    • H01J2237/221—Image processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/245—Detection characterised by the variable being measured
    • H01J2237/24571—Measurements of non-electric or non-magnetic variables
    • H01J2237/24578—Spatial variables, e.g. position, distance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/245—Detection characterised by the variable being measured
    • H01J2237/24592—Inspection and quality control of devices

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Electromagnetism (AREA)
CN201880004163.3A 2018-02-22 2018-02-22 用于显示器制造的基板上的自动临界尺寸测量的方法、用于检查用于显示器制造的大面积基板的方法和设备和操作所述设备的方法 Active CN110506236B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2018/054411 WO2019161899A1 (en) 2018-02-22 2018-02-22 Method for automated critical dimension measurement on a substrate for display manufacturing, method of inspecting a large area substrate for display manufacturing, apparatus for inspecting a large area substrate for display manufacturing and method of operating thereof

Publications (2)

Publication Number Publication Date
CN110506236A CN110506236A (zh) 2019-11-26
CN110506236B true CN110506236B (zh) 2021-12-03

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CN201880004163.3A Active CN110506236B (zh) 2018-02-22 2018-02-22 用于显示器制造的基板上的自动临界尺寸测量的方法、用于检查用于显示器制造的大面积基板的方法和设备和操作所述设备的方法

Country Status (6)

Country Link
US (1) US11687008B2 (ko)
JP (2) JP6916281B2 (ko)
KR (1) KR102329264B1 (ko)
CN (1) CN110506236B (ko)
TW (1) TWI687648B (ko)
WO (1) WO2019161899A1 (ko)

Families Citing this family (3)

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Publication number Priority date Publication date Assignee Title
KR20230002982A (ko) * 2020-04-24 2023-01-05 어플라이드 머티어리얼스, 인코포레이티드 기판 상의 오염 분자들의 증착을 감소시키기 위한 장치 및 방법
KR20230048409A (ko) * 2020-08-11 2023-04-11 어플라이드 머티어리얼스, 인코포레이티드 기판 상의 결함 검토 측정을 위한 방법, 기판을 이미징하기 위한 장치, 및 장치를 작동시키는 방법
WO2023180784A1 (en) * 2022-03-21 2023-09-28 Applied Materials, Inc. Method of generating a computational model for improving parameter settings of one or more display manufacturing tools, method of setting parameters of one or more display manufacturing tools, and display manufacturing fab equipment

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CN1254943A (zh) * 1998-11-20 2000-05-31 日本电气株式会社 电子束曝光系统
CN1264850A (zh) * 1999-02-24 2000-08-30 日本电气株式会社 电子束曝光系统及其方法
JP2017084537A (ja) * 2015-10-26 2017-05-18 東方晶源微電子科技（北京）有限公司 電子ビーム検査・測長装置用の電子ビーム径制御方法及び電子ビーム径制御装置、並びに電子ビーム検査・測長装置
CN107110799A (zh) * 2014-12-22 2017-08-29 应用材料公司 用于检查基板的设备、用于检查基板的方法、大面积基板检查设备及其操作方法

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US6075245A (en) * 1998-01-12 2000-06-13 Toro-Lira; Guillermo L. High speed electron beam based system for testing large area flat panel displays
US6476388B1 (en) * 1998-10-19 2002-11-05 Hitachi, Ltd. Scanning electron microscope having magnification switching control
JP2003308803A (ja) * 2002-04-12 2003-10-31 Seiko Instruments Inc 走査型顕微鏡におけるリファレンス画像先読み機能
US7186486B2 (en) * 2003-08-04 2007-03-06 Micronic Laser Systems Ab Method to pattern a substrate
US7075323B2 (en) * 2004-07-29 2006-07-11 Applied Materials, Inc. Large substrate test system
DE102005014793B4 (de) * 2005-03-31 2007-11-29 Advanced Micro Devices, Inc., Sunnyvale Verfahren und Inspektionssystem zur CD-Messung auf der Grundlage der Bestimmung von Flächenanteilen
WO2007067296A2 (en) * 2005-12-02 2007-06-14 Alis Corporation Ion sources, systems and methods
JP2007187538A (ja) * 2006-01-13 2007-07-26 Hitachi High-Technologies Corp 荷電粒子線装置及びそれを用いた画像取得方法
JP2009289468A (ja) * 2008-05-27 2009-12-10 Hitachi High-Technologies Corp 荷電粒子線装置
US8196068B2 (en) * 2009-04-30 2012-06-05 Synopsys, Inc. Modeling critical-dimension (CD) scanning-electron-microscopy (CD-SEM) CD extraction
JP5556274B2 (ja) * 2010-03-17 2014-07-23 凸版印刷株式会社 パターン評価方法及びパターン評価装置
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WO2013158574A1 (en) * 2012-04-18 2013-10-24 D2S, Inc. Method and system for critical dimension uniformity using charged particle beam lithography
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JP2019109960A (ja) * 2016-03-15 2019-07-04 株式会社日立ハイテクノロジーズ 荷電粒子ビームの評価方法、荷電粒子ビームの評価のためのコンピュータープログラム、及び荷電粒子ビームの評価装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1254943A (zh) * 1998-11-20 2000-05-31 日本电气株式会社 电子束曝光系统
CN1264850A (zh) * 1999-02-24 2000-08-30 日本电气株式会社 电子束曝光系统及其方法
CN107110799A (zh) * 2014-12-22 2017-08-29 应用材料公司 用于检查基板的设备、用于检查基板的方法、大面积基板检查设备及其操作方法
JP2017084537A (ja) * 2015-10-26 2017-05-18 東方晶源微電子科技（北京）有限公司 電子ビーム検査・測長装置用の電子ビーム径制御方法及び電子ビーム径制御装置、並びに電子ビーム検査・測長装置

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Publication number Publication date
KR102329264B1 (ko) 2021-11-18
TWI687648B (zh) 2020-03-11
TW201937131A (zh) 2019-09-16
CN110506236A (zh) 2019-11-26
JP2021119565A (ja) 2021-08-12
US11687008B2 (en) 2023-06-27
KR20190102170A (ko) 2019-09-03
JP2020512656A (ja) 2020-04-23
JP6916281B2 (ja) 2021-08-11
US20210373444A1 (en) 2021-12-02
WO2019161899A1 (en) 2019-08-29

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