CN110505752A - A kind of high-frequency microwave circuit board and preparation method thereof - Google Patents
A kind of high-frequency microwave circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN110505752A CN110505752A CN201910877095.8A CN201910877095A CN110505752A CN 110505752 A CN110505752 A CN 110505752A CN 201910877095 A CN201910877095 A CN 201910877095A CN 110505752 A CN110505752 A CN 110505752A
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- Prior art keywords
- circuit board
- copper
- substrate
- adhesion agent
- frequency microwave
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a kind of high-frequency microwave circuit boards of circuit board technology field and preparation method thereof, comprising: substrate；First adhesion agent layer, first adhesion agent layer are coated in the top of the substrate；Copper foil layer, the copper foil layer are covered on the top of first adhesion agent layer；Second adhesion agent layer, second adhesion agent layer are coated in the top of the copper foil layer；Film layers, the film layers are covered on the top of second adhesion agent layer, sawing sheet: plate greatly is placed on cutting machine and cuts into fritter production plate, the present invention improves the viscous stickiness of substrate, effectively prevent the appearance of filling perforation phenomenon, the quality of circuit board is ensured, by being modified to substrate, so that substrate has excellent viscous stickiness, copper foil can be effectively sticky on substrate, and secondary punching is carried out to circuit board, effectively prevent the appearance of filling perforation phenomenon, the appearance of circuit board breaking phenomena is reduced by the cooperation of the two, the quality of circuit board is ensured.
Description
Technical field
The present invention relates to circuit board technology field, specially a kind of high-frequency microwave circuit board and preparation method thereof.
Background technique
The title of circuit board has: ceramic circuit board, aluminium oxide ceramics circuit board, aluminium nitride ceramics circuit board, wiring board,
Pcb board, aluminum substrate, high frequency plate, thick copper sheet, impedance plate, PCB, ultra-thin wiring board, ultrathin circuit board print (copper lithographic technique)
Circuit board etc..Circuit board makes circuit miniaturization, intuitiveization, and the batch production and optimization electrical appliance for fixed circuit are laid out lifting
It acts on.Circuit board can be described as printed wiring board or printed circuit board, English name be (PrintedCircuitBoard) PCB,
(FlexiblePrintedCircuitboard) FPC wiring board (FPC wiring board be also known as flexible circuit board flexible circuit board be with
Polyimides or polyester film are that one kind made of substrate has height reliability, excellent flexible printed circuit.Have
The feature that Distribution density is high, light-weight, thickness is thin, bending is good.) and Rigid Flex (reechas,
Softandhardcombinationplate) the birth and development of-FPC and PCB has expedited the emergence of this new product of Rigid Flex.
Therefore, Rigid Flex is exactly that flexible circuit board and rigid wiring board are combined by processes such as pressings by related process requirement
Together, the wiring board with FPC characteristic and PCB characteristic of formation.
Electronic equipment high frequency is development trend, especially wireless network, satellite communication it is increasingly developed, information products are walked
To high speed and high frequency and communication products move towards voice, video and the data normalization of the big fireballing wireless transmission of capacity because
The new generation product of this development requires high frequency substrate, and satellite system, mobile phone receive the communication products such as base station and must apply
High-frequency circuit board, the coming years again necessarily rapidly develop, high frequency substrate will wilderness demand, at this stage high-frequency circuit board mostly be
It is made using polytetrafluoroethylene (PTFE), the performance of ptfe substrate is much higher than other substrates, applies more and exceeds 10GHz's in frequency
Circuit board.
But the viscous stickiness of existing ptfe substrate is insufficient, can not effectively be combined with copper foil, be easy to lead
The appearance of breaking phenomena is caused, also, offers through-hole on circuit board, through-hole needs to carry out copper facing, copper facing to through-hole after opening up
It is easy to cause the appearance of filling perforation phenomenon in journey, causes the connection of circuit board is bad to cause open circuit.
Summary of the invention
The purpose of the present invention is to provide a kind of high-frequency microwave circuit boards and preparation method thereof, to solve above-mentioned background technique
The viscous stickiness of the existing ptfe substrate of middle proposition is insufficient, can not effectively be combined, be easy to cause disconnected with copper foil
The appearance of road phenomenon, also, through-hole is offered on circuit board, through-hole needs to carry out copper facing to through-hole after opening up, during copper facing
It is be easy to cause the appearance of filling perforation phenomenon, leads to the bad problem for causing open circuit of the connection of circuit board.
To achieve the above object, the invention provides the following technical scheme: a kind of high-frequency microwave circuit board, comprising:
Substrate；
First adhesion agent layer, first adhesion agent layer are coated in the top of the substrate；
Copper foil layer, the copper foil layer are covered on the top of first adhesion agent layer；
Second adhesion agent layer, second adhesion agent layer are coated in the top of the copper foil layer；
Film layers, the film layers are covered on the top of second adhesion agent layer.
Preferably, the substrate is modified Teflon substrate.
Preferably, the modified Teflon substrate is by polytetrafluoroethylene (PTFE) and nitrobenzene and bromobenzene covalent cross-linking structure
At.
A kind of production method of high-frequency microwave circuit board, it is characterised in that: the production method packet of the high-frequency microwave circuit board
Include following steps:
S1: sawing sheet: according to the requirement of engineering data MI, satisfactory plate greatly, which is placed on cutting machine, will open greatly plate
Material cuts into fritter production plate；
S2: press mold: fritter production plate is put into film laminator, and dry film against corrosion is overlayed up and down the two of fritter production plate
Face；
S3: exposure: the production plate after press mold is put into exposure machine and is exposed；
S4: development: the production plate after exposure is put into lye, and the part that will do not chemically reacted is acted on lye
It washes out；
S5: etching: the production plate after development being put into etching medical fluid and is etched, after being developed using etching medical fluid
The copper eating away of exposing forms line pattern, circuit board is made；
S6: striping: the circuit board after etching is put into lye, the resist layer of copper face will be protected to peel off by lye,
Appear line pattern；
S7: punching: the circuit board after striping is put on perforating press and is drilled to circuit board；
S8: deburring: the circuit board after drilling is put into, the drilled edge on circuit board is not cut off on scrubber
Copper wire and the glass cloth not cut off carry out polish-brush deburring processing；
S9: it copper facing: is precipitated going the circuit board after flash removed to be immersed in chemical copper, then is precipitating chemical copper
Copper is crossed on circuit board；
S10: secondary punching: the circuit board after copper facing being placed again on perforating press and is punched out, and perforating press is used to be bored
The outer diameter of head is less than the aperture that hole has been used on circuit board.
Preferably, the fritter production plate in the step S1 need to carry out edging by the corner that sander produces plate to fritter
With fillet processing.
Preferably, the film laminator in the step S2 is heat pressing type film laminator, and dry film is water-soluble dry films.
Preferably, the etching medical fluid in the step S5 is copper chloride.
Preferably, the lye in the step S6 is sodium hydroxide.
Preferably, the chemical copper in the step S9 is precipitated on the surface of circuit board by way of chemical precipitation
0.508 micron -1.016 microns of chemical copper, the copper of the copper-plated thickness with a thickness of 5.08-12.7.
Compared with prior art, it the beneficial effects of the present invention are: the present invention improves the viscous stickiness of substrate, effectively prevents
The appearance of filling perforation phenomenon has ensured the quality of circuit board, by being modified to substrate, so that there is substrate excellent gluing to stick
Property, copper foil can be effectively sticky on substrate, and to circuit board progress secondary punching, effectively prevent filling perforation phenomenon
Occur, the appearance of circuit board breaking phenomena is reduced by the cooperation of the two, has ensured the quality of circuit board.
Detailed description of the invention
Fig. 1 is schematic structural view of the invention；
Fig. 2 is production flow diagram of the present invention.
In figure: 100 substrates, 200 first adhesion agent layers, 300 copper foil layers, 400 second adhesion agent layers, 500 film layers.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The present invention provides a kind of high-frequency microwave circuit board, enhances the viscous stickiness of substrate, can effectively glue copper foil glutinous
On substrate, improve the quality of production of circuit board, referring to Fig. 1, substrate 100, the first adhesion agent layer 200, copper foil layer 300,
Second adhesion agent layer 400 and film layers 500；
Referring to Fig. 1, substrate 100 is modified Teflon substrate, and modified Teflon substrate is by poly- four
Vinyl fluoride and nitrobenzene and bromobenzene covalent cross-linking are constituted, and polytetrafluoroethylmodified modified method is first to play PTFE sand for surface paper
Mill, acetone clean 5min, are placed in 80 DEG C of stove drying, then are inserted into the surface PTFE (10 μm) with Pt electrode, local reduction examination
Sample surface is allowed to be carbonized, then, in N2Or Ar2Under atmosphere, sample is placed in the four of nitrobenzene and the fifty-fifty diazonium salt of bromobenzene
5~10min is reacted in borofluoride dielectric, then the magnetic stirring 12h in methanol solution, cyclic voltammetry and fluorescence X- are penetrated
Line experiment shows that nitrobenzene and bromobenzene covalent cross-linking are grafted on the surface of PTFE, and only wearing can just be allowed to remove, to poly- four
Vinyl fluoride substrate is modified, and improves the viscous stickiness of substrate, copper foil is effectively sticky on substrate, electricity is improved
The quality of production of road plate；
Referring to Fig. 1, the first adhesion agent layer 200 is coated in the top of substrate 100；
Referring to Fig. 1, copper foil layer 300 is covered on the top of the first adhesion agent layer 200；
Referring to Fig. 1, the second adhesion agent layer 400 is coated in the top of copper foil layer 300；
Referring to Fig. 1, film layers 500 are covered on the top of the second adhesion agent layer 400.
The present invention also provides a kind of production methods of high-frequency microwave circuit board, can effectively ensure the hole on circuit board
For through-hole state, the appearance of filling perforation phenomenon is effectively prevented, referring to Fig. 2, the production method packet of the high-frequency microwave circuit board
Include following steps:
S1: sawing sheet: according to the requirement of engineering data MI, satisfactory plate greatly, which is placed on cutting machine, will open greatly plate
Material cuts into fritter production plate, and fritter produces plate and need to be carried out at edging and fillet by the corner that sander produces plate to fritter
Reason；
S2: press mold: fritter production plate is put into film laminator, and dry film against corrosion is overlayed up and down the two of fritter production plate
Face, film laminator are heat pressing type film laminator, and dry film is water-soluble dry films, and organic acid is contained in water-soluble dry films, can be anti-with weak base
The salt of organic acid should be become, can be dissolved in water, manifest figure；
S3: exposure: the production plate after press mold being put into exposure machine and is exposed, through light radiation by original bottom
The image of on piece is transferred on photosensitive bottom plate, and photopolymerization reaction occurs for white light transmission part, and black portions are not sent out then because opaque
Raw reaction；
S4: development: the production plate after exposure is put into lye, and the part that will do not chemically reacted is acted on lye
It washes out, the dry film that the dry film that polymerization reaction does not occur washes out, and polymerization reaction occurs is retained in plate face using lye, as
Anticorrosion protection layer when etching；
S5: etching: the production plate after development being put into etching medical fluid and is etched, after being developed using etching medical fluid
The copper eating away of exposing forms line pattern, and circuit board is made, and etching medical fluid is copper chloride；
S6: striping: the circuit board after etching is put into lye, the resist layer of copper face will be protected to peel off by lye,
Appear line pattern, lye is sodium hydroxide；
S7: punching: the circuit board after striping is put on perforating press and is drilled to circuit board；
S8: deburring: the circuit board after drilling is put into, the drilled edge on circuit board is not cut off on scrubber
Copper wire and the glass cloth not cut off carry out polish-brush deburring processing, remove the burr of bore edges, can effectively prevent plated hole not
It is good；
S9: it copper facing: is precipitated going the circuit board after flash removed to be immersed in chemical copper, then is precipitating chemical copper
Copper is crossed on circuit board, precipitates 0.508 micron -1.016 microns of chemistry on the surface of production plate by way of chemical precipitation
Copper crosses the copper of the thickness of upper 5.08-12.7 on the production plate for having precipitated chemical copper, to protect 0.508 micron -1.016 it is micro-
The thick chemical copper of rice；
S10: secondary punching: the circuit board after copper facing being placed again on perforating press and is punched out, and perforating press is used to be bored
The outer diameter of head is less than the aperture that hole has been used on circuit board, can effectively ensure that the hole on production plate is by secondary punching
Through-hole state effectively prevents the appearance of filling perforation phenomenon.
In summary, the present invention improves the viscous stickiness of substrate, the appearance of filling perforation phenomenon is effectively prevented, is ensured
The quality of circuit board, by being modified to substrate, so that substrate has excellent viscous stickiness, copper foil can be effectively sticky in
On substrate, and secondary punching is carried out to circuit board, effectively prevent the appearance of filling perforation phenomenon, reduced by the cooperation of the two
The appearance of circuit board breaking phenomena, has ensured the quality of circuit board.
Although hereinbefore invention has been described by reference to embodiment, the scope of the present invention is not being departed from
In the case where, various improvement can be carried out to it and can replace component therein with equivalent.Especially, as long as being not present
Structural conflict, the various features in presently disclosed embodiment can be combined with each other use by any way, In
The description for not carrying out exhaustive to the case where these combinations in this specification is examined merely for the sake of omission length with what is economized on resources
Consider.Therefore, the invention is not limited to specific embodiments disclosed herein, but the institute including falling within the scope of the appended claims
There is technical solution.
Claims (9)
1. a kind of high-frequency microwave circuit board, it is characterised in that: include:
Substrate (100)；
First adhesion agent layer (200), first adhesion agent layer (200) are coated in the top of the substrate (100)；
Copper foil layer (300), the copper foil layer (300) are covered on the top of first adhesion agent layer (200)；
Second adhesion agent layer (400), second adhesion agent layer (400) are coated in the top of the copper foil layer (300)；
Film layers (500), the film layers (500) are covered on the top of second adhesion agent layer (400).
2. a kind of high-frequency microwave circuit board according to claim 1, it is characterised in that: the substrate (100) is modified poly-
Tetrafluoroethene substrate.
3. a kind of high-frequency microwave circuit board according to claim 2, it is characterised in that: the modified Teflon substrate
It is to be made of polytetrafluoroethylene (PTFE) and nitrobenzene and bromobenzene covalent cross-linking.
4. a kind of production method of high-frequency microwave circuit board, it is characterised in that: the production method of the high-frequency microwave circuit board includes
Following steps:
S1: sawing sheet: according to the requirement of engineering data MI, satisfactory plate greatly, which is placed on cutting machine, which will open greatly plate, is cut out
It is cut into small pieces and produces plate；
S2: press mold: fritter production plate is put into film laminator, and dry film against corrosion is overlayed the upper and lower surface in fritter production plate；
S3: exposure: the production plate after press mold is put into exposure machine and is exposed；
S4: development: the production plate after exposure is put into lye, is rushed the part not chemically reacted with lye effect
Fall；
S5: etching: the production plate after development being put into etching medical fluid and is etched, and will be exposed after development using etching medical fluid
Copper eating away, formed line pattern, circuit board is made；
S6: striping: the circuit board after etching is put into lye, the resist layer of copper face will be protected to peel off by lye, appeared
Line pattern；
S7: punching: the circuit board after striping is put on perforating press and is drilled to circuit board；
S8: the circuit board after drilling deburring: is put into the copper wire not cut off on scrubber to the drilled edge on circuit board
And the glass cloth not cut off carries out polish-brush deburring processing；
S9: it copper facing: is precipitated going the circuit board after flash removed to be immersed in chemical copper, then in the circuit for having precipitated chemical copper
Copper is crossed on plate；
S10: secondary punching: the circuit board after copper facing being placed again on perforating press and is punched out, drill bit used in perforating press
Outer diameter is less than the aperture that hole has been used on circuit board.
5. a kind of high-frequency microwave circuit board according to claim 4, it is characterised in that: the fritter production in the step S1
Plate need to carry out edging by the corner that sander produces plate to fritter and fillet is handled.
6. a kind of high-frequency microwave circuit board according to claim 4, it is characterised in that: the film laminator in the step S2 is
Heat pressing type film laminator, dry film are water-soluble dry films.
7. a kind of high-frequency microwave circuit board according to claim 4, it is characterised in that: the etching medical fluid in the step S5
For copper chloride.
8. a kind of high-frequency microwave circuit board according to claim 4, it is characterised in that: the lye in the step S6 is hydrogen
Sodium oxide molybdena.
9. a kind of high-frequency microwave circuit board according to claim 4, it is characterised in that: the chemical copper in the step S9 is logical
The mode for crossing chemical precipitation precipitates 0.508 micron -1.016 microns of chemical copper on the surface of circuit board, it is copper-plated with a thickness of
5.08-12.7 thickness copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910877095.8A CN110505752A (en) | 2019-09-17 | 2019-09-17 | A kind of high-frequency microwave circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910877095.8A CN110505752A (en) | 2019-09-17 | 2019-09-17 | A kind of high-frequency microwave circuit board and preparation method thereof |
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| Publication Number | Publication Date |
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| CN110505752A true CN110505752A (en) | 2019-11-26 |
Family
ID=68592052
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910877095.8A Pending CN110505752A (en) | 2019-09-17 | 2019-09-17 | A kind of high-frequency microwave circuit board and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112399705A (en) * | 2020-11-10 | 2021-02-23 | 四川深北电路科技有限公司 | High-frequency high-heat-conductivity mixed compression plate for 5G communication equipment and manufacturing method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN203300795U (en) * | 2013-05-10 | 2013-11-20 | 深圳市邦华电子有限公司 | Mobile phone antenna based on flexible insulation substrate |
-
2019
- 2019-09-17 CN CN201910877095.8A patent/CN110505752A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203300795U (en) * | 2013-05-10 | 2013-11-20 | 深圳市邦华电子有限公司 | Mobile phone antenna based on flexible insulation substrate |
Non-Patent Citations (1)
| Title |
|---|
| SUNYU4366: "聚四氟乙烯的六大表面改性技术", 《百度文库》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112399705A (en) * | 2020-11-10 | 2021-02-23 | 四川深北电路科技有限公司 | High-frequency high-heat-conductivity mixed compression plate for 5G communication equipment and manufacturing method thereof |
| CN112399705B (en) * | 2020-11-10 | 2022-09-30 | 四川深北电路科技有限公司 | High-frequency high-heat-conductivity mixed compression plate for 5G communication equipment and manufacturing method thereof |
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Application publication date: 20191126 |
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