CN110501752A - A kind of detector radiator based on TEC refrigeration - Google Patents
A kind of detector radiator based on TEC refrigeration Download PDFInfo
- Publication number
- CN110501752A CN110501752A CN201910618857.2A CN201910618857A CN110501752A CN 110501752 A CN110501752 A CN 110501752A CN 201910618857 A CN201910618857 A CN 201910618857A CN 110501752 A CN110501752 A CN 110501752A
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- detector
- thermal conductive
- conductive belt
- heat
- silicon rubber
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V8/00—Prospecting or detecting by optical means
- G01V8/10—Detecting, e.g. by using light barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Geophysics (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention discloses a kind of detector radiators based on TEC refrigeration, are made of box detector, detector switching circuit board, detector, TEC component, flexible thermal conductive belt, thermal conductive belt briquetting, silicon rubber, thermal conductive belt tabletting and detector box cover.Detector is welded on detector switching circuit board by pin, is fixed in box detector as component is heat-insulated.TEC component cold end is adhered to detector back by heat-conducting silicon rubber.Position and the thermally conductive connection in TEC component hot end among flexible thermal conductive belt, two-end part and the thermally conductive connection of box detector.Thermally conductive connection between detector box cover and box detector, the filled silicon rubber between thermal conductive belt briquetting and detector box cover.The method have the characteristics that using flexible thermal conductive belt and the filled silicon rubber between thermal conductive belt briquetting and detector box cover, form heat conductive elastomeric support, while radiating to detector, has mechanical and the thermal stress ability that disappears, be suitable for space optical remote field of detecting.
Description
Technical field:
The present invention relates to a kind of detector radiators, are freezed using TEC device, are applied to space optical remote and visit
Survey field.
Background technique:
The detector thermal design and thermal control technology of space optical remote sensor has become the emphasis of field technical staff
Concerned issue.Space optical remote sensor is equipped on spacecraft, the space environment in vacuum, by the cold black sky of 4K at light inlet
Between, the complicated coupling effects of the Orbital heat flux such as earth infrared radiation and the sunlight reflection of light, thermal environment is very severe.Detector is empty
Between the important component of load is imaged, the quality of thermal design is directly related to image quality.Due to system thermal noise and secretly
Electric current has large effect to the performance of detector, therefore the temperature of detector must control in a certain range.
Space optical remote sensor will undergo the effect of dynamics environment in transmitting, during flying and reenter, such as impact,
Overload and vibration, these dynamics environments are acted on step by step in the structure of each subsystem grade and component level, may cause structure
It destroys, the performance decline of equipment, trouble or failure.Therefore, the detector assembly of space optical remote sensor must have certain anti-
Mechanics ability.
Applied to the detector assembly of space optical remote sensor, components material is different, in temperature changing process
In, different materials can generate destructive thermal stress in component internal, therefore be applied to spatial light because of the difference of thermal expansion coefficient
The detector assembly for learning remote sensor must have certain thermal stress ability that disappears.
In summary technical need needs to consider mechanical and disappears when carrying out thermal design with detector assembly to space
Thermal stress design.
Summary of the invention:
Object of the present invention is to design a kind of detector radiator based on TEC refrigeration, detector is carried out in realization scattered
While hot, has mechanical and the thermal stress ability that disappears.
Specific invention is as shown in Fig. 1
A kind of detector radiator based on TEC refrigeration, by box detector 1, detector switching circuit board 2, detector
3, TEC component 4, flexible thermal conductive belt 5, thermal conductive belt briquetting 6, silicon rubber 7, thermal conductive belt tabletting 8 and detector box cover 9 form, detection
Device 3 is welded on detector pinboard 2 by pin, is fixed in box detector 1 as component, detector switching circuit board 2
It is installed with the spaced heat of box detector 1.TEC component 4 is by TEC4-1, hot end heat-conducting block 4-2, cold end heat-conducting block 4-3, temperature detecting resistance
4-4 composition.Hot end heat-conducting block 4-2, cold end heat-conducting block 4-3 are fixed on hot end and the cold end of TEC4-1 with heat-conducting silicon rubber respectively.
Temperature detecting resistance 4-4 is fixed in cold end heat-conducting block 4-3 interior grooves with heat-conducting silicon rubber.4 cold end of TEC component after solidification passes through
Heat-conducting silicon rubber is adhered to 3 back of detector.The intermediate position of flexible thermal conductive belt 5 and the thermally conductive connection in 4 hot end of TEC component, use are thermally conductive
Band briquetting 6 is fixed, and two-end part and the thermally conductive connection of box detector 1 are fixed with thermal conductive belt tabletting 8.Detector box cover 9 and detector
Thermally conductive connection between box 1, the filled silicon rubber 7 between thermal conductive belt briquetting 6 and detector box cover 9, flexible thermal conductive belt 5 and silicon rubber
7 combinations form heat conductive elastomeric support.
The method have the characteristics that pasting TEC component with heat-conducting silicon rubber at detector back, TEC component hot end uses soft
Property thermal conductive belt heat dissipation, the filled silicon rubber between flexible thermal conductive belt briquetting and detector box cover utilizes flexible thermal conductive belt and silicon rubber
Elastic characteristic, form heat conductive elastomeric support, while radiating to detector, realize the mechanical of detector assembly with
The thermal stress that disappears design.
Detailed description of the invention:
Fig. 1 is schematic structural view of the invention, in figure:
1 --- box detector；
2 --- detector switching circuit board；
3 --- detector；
4 --- TEC component；
4-1——TEC；
4-2 --- hot end heat-conducting block；
4-3 --- cold end heat-conducting block；
4-4 --- temperature detecting resistance；
5 --- flexible thermal conductive belt；
6 --- thermal conductive belt briquetting；
7 --- silicon rubber；
8 --- thermal conductive belt tabletting；
9 --- detector box cover.
Specific embodiment:
A preferable embodiment of the invention is provided below according to Fig. 1, to illustrate structure feature and embodiment party of the invention
Method, rather than range for the purpose of limiting the invention.
Detector radiator based on TEC refrigeration in the present embodiment, box detector, box detector cover material select 6061
Aluminium alloy, surface black anodized.Hot end heat-conducting block, cold end heat-conducting block, thermal conductive belt briquetting, the choosing of thermal conductive belt tabletting material
With 6063 aluminium alloys, surface true qualities electric conductive oxidation.The detector to be freezed is visible smooth surface battle array cmos detector STAR250.It adopts
TEC refrigerator model MARLOW RC3-6L, temperature detecting resistance model MF501, flexible thermal conductive belt is by conduction graphite film system
It forms, silicon rubber used is GD414C.After entire radiator is completed, thermal vacuum and sinusoidal, random has been carried out
Vibration test, test front and back, assembly function are normal.Thermal vacuum test condition is -35 DEG C~+70 DEG C, 6.5 circulations.It is sinusoidal, with
Machine vibration experimental condition is as shown in table 1.
1 sine of table and random experiment condition
Claims (1)
1. a kind of detector radiator based on TEC refrigeration, including box detector (1), detector switching circuit board (2), spy
Survey device (3), TEC component (4), flexible thermal conductive belt (5), thermal conductive belt briquetting (6), silicon rubber (7), thermal conductive belt tabletting (8) and detection
Device box cover (9), it is characterised in that:
Detector (3) is welded on detector pinboard (2) by pin, is fixed in box detector (1) as component, detection
Device switching circuit board (2) and the spaced heat of box detector (1) are installed.TEC component (4) is by TEC (4-1), hot end heat-conducting block (4-
2), cold end heat-conducting block (4-3), temperature detecting resistance (4-4) composition.Hot end heat-conducting block (4-2), cold end heat-conducting block (4-3) are respectively with leading
Hot silicon rubber is fixed on hot end and the cold end of TEC (4-1).Temperature detecting resistance (4-4) is fixed on cold end heat-conducting block with heat-conducting silicon rubber
In (4-3) interior grooves.TEC component (4) cold end after solidification is adhered to detector (3) back by heat-conducting silicon rubber.It is flexible
The intermediate position of thermal conductive belt (5) and the thermally conductive connection in TEC component (4) hot end, two-end part and detection fixed with thermal conductive belt briquetting (6)
Device box (1) thermally conductive connection, it is fixed with thermal conductive belt tabletting (8).Thermally conductive connection between detector box cover (9) and box detector (1), In
Filled silicon rubber (7) between thermal conductive belt briquetting (6) and detector box cover (9), flexible thermal conductive belt (5) combine shape with silicon rubber (7)
It is supported at heat conductive elastomeric.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910618857.2A CN110501752B (en) | 2019-07-10 | 2019-07-10 | Detector heat dissipation device based on TEC refrigeration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910618857.2A CN110501752B (en) | 2019-07-10 | 2019-07-10 | Detector heat dissipation device based on TEC refrigeration |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110501752A true CN110501752A (en) | 2019-11-26 |
| CN110501752B CN110501752B (en) | 2021-06-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910618857.2A Active CN110501752B (en) | 2019-07-10 | 2019-07-10 | Detector heat dissipation device based on TEC refrigeration |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111219907A (en) * | 2020-02-28 | 2020-06-02 | 中国科学院上海技术物理研究所 | TEC heat dissipation assembly for direct-insert type multi-element area array detector |
| CN112763095A (en) * | 2020-12-29 | 2021-05-07 | 中国科学院合肥物质科学研究院 | CCD temperature control system of satellite-borne hyperspectral detector |
| CN113301782A (en) * | 2021-06-02 | 2021-08-24 | 苏州鸿凌达电子科技有限公司 | Intelligent ultra-micro TEC (thermoelectric cooler) refrigeration module and manufacturing method thereof |
| CN113556523A (en) * | 2021-07-09 | 2021-10-26 | 湖州师范学院 | Virtual reality live-action projection system |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101813951A (en) * | 2009-12-07 | 2010-08-25 | 中国科学院西安光学精密机械研究所 | Temperature controlled focal plane detector mechanism |
| CN103090586A (en) * | 2013-01-17 | 2013-05-08 | 贾磊 | Air cooling heat dissipation thermoelectric cooler (TEC) electric refrigeration charge coupled device (CCD) Dewar |
| CN103344061A (en) * | 2013-06-21 | 2013-10-09 | 中国科学院上海技术物理研究所 | Coupling structure between linear type pulse tube refrigerator and infrared device and manufacturing method for same |
| CN103730710A (en) * | 2013-12-24 | 2014-04-16 | 中国电子科技集团公司第十六研究所 | X-waveband refrigeration polarizer cooling structure device |
| CN103746712A (en) * | 2013-12-24 | 2014-04-23 | 中国电子科技集团公司第十六研究所 | High-temperature superconducting receiver front-end device in space |
| CN207833202U (en) * | 2017-07-25 | 2018-09-07 | 苏州德锐特成像技术有限公司 | A kind of phase refrigerator |
-
2019
- 2019-07-10 CN CN201910618857.2A patent/CN110501752B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101813951A (en) * | 2009-12-07 | 2010-08-25 | 中国科学院西安光学精密机械研究所 | Temperature controlled focal plane detector mechanism |
| CN103090586A (en) * | 2013-01-17 | 2013-05-08 | 贾磊 | Air cooling heat dissipation thermoelectric cooler (TEC) electric refrigeration charge coupled device (CCD) Dewar |
| CN103344061A (en) * | 2013-06-21 | 2013-10-09 | 中国科学院上海技术物理研究所 | Coupling structure between linear type pulse tube refrigerator and infrared device and manufacturing method for same |
| CN103730710A (en) * | 2013-12-24 | 2014-04-16 | 中国电子科技集团公司第十六研究所 | X-waveband refrigeration polarizer cooling structure device |
| CN103746712A (en) * | 2013-12-24 | 2014-04-23 | 中国电子科技集团公司第十六研究所 | High-temperature superconducting receiver front-end device in space |
| CN207833202U (en) * | 2017-07-25 | 2018-09-07 | 苏州德锐特成像技术有限公司 | A kind of phase refrigerator |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111219907A (en) * | 2020-02-28 | 2020-06-02 | 中国科学院上海技术物理研究所 | TEC heat dissipation assembly for direct-insert type multi-element area array detector |
| CN111219907B (en) * | 2020-02-28 | 2024-03-26 | 中国科学院上海技术物理研究所 | TEC heat dissipation assembly for direct-insert type multi-element area array detector |
| CN112763095A (en) * | 2020-12-29 | 2021-05-07 | 中国科学院合肥物质科学研究院 | CCD temperature control system of satellite-borne hyperspectral detector |
| CN112763095B (en) * | 2020-12-29 | 2024-02-23 | 中国科学院合肥物质科学研究院 | CCD temperature control system of satellite-borne hyperspectral detector |
| CN113301782A (en) * | 2021-06-02 | 2021-08-24 | 苏州鸿凌达电子科技有限公司 | Intelligent ultra-micro TEC (thermoelectric cooler) refrigeration module and manufacturing method thereof |
| CN113556523A (en) * | 2021-07-09 | 2021-10-26 | 湖州师范学院 | Virtual reality live-action projection system |
| CN113556523B (en) * | 2021-07-09 | 2023-06-13 | 湖州师范学院 | Virtual reality live-action projection system |
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| CN110501752B (en) | 2021-06-15 |
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