CN110500805A - A kind of two level semiconductor damp-proof moisture removing apparatus of controllable temperature - Google Patents

A kind of two level semiconductor damp-proof moisture removing apparatus of controllable temperature Download PDF

Info

Publication number
CN110500805A
CN110500805A CN201910677988.8A CN201910677988A CN110500805A CN 110500805 A CN110500805 A CN 110500805A CN 201910677988 A CN201910677988 A CN 201910677988A CN 110500805 A CN110500805 A CN 110500805A
Authority
CN
China
Prior art keywords
level
temperature
semiconductor
damp
removing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201910677988.8A
Other languages
Chinese (zh)
Other versions
CN110500805B (en
Inventor
杨卫斌
汪小憨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangzhou Institute of Energy Conversion of CAS
Original Assignee
Guangzhou Institute of Energy Conversion of CAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangzhou Institute of Energy Conversion of CAS filed Critical Guangzhou Institute of Energy Conversion of CAS
Priority to CN201910677988.8A priority Critical patent/CN110500805B/en
Publication of CN110500805A publication Critical patent/CN110500805A/en
Application granted granted Critical
Publication of CN110500805B publication Critical patent/CN110500805B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00Machines, plants or systems, using electric or magnetic effects
    • F25B21/02Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/04Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
    • F25D17/06Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D21/00Defrosting; Preventing frosting; Removing condensed or defrost water
    • F25D21/06Removing frost
    • F25D21/08Removing frost by electric heating
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D21/00Defrosting; Preventing frosting; Removing condensed or defrost water
    • F25D21/14Collecting or removing condensed and defrost water; Drip trays
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D29/00Arrangement or mounting of control or safety devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/24Arrangements for promoting turbulent flow of heat-exchange media, e.g. by plates
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2700/00Means for sensing or measuring; Sensors therefor
    • F25D2700/12Sensors measuring the inside temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Fluid Mechanics (AREA)
  • Drying Of Gases (AREA)

Abstract

The invention discloses a kind of two level semiconductor damp-proof moisture removing apparatus of controllable temperature, air duct includes sequentially connected entrance net, inlet fans, level-one cold end radiator, two-stage connection air duct, second level cold end radiator, medium temperature sensor, demister, level-one hot-side heat dissipation device, outlet Temperature Humidity Sensor, dry gas outlet in device;Two-stage connection air duct lower end is connected with seal groove, is provided with sealing block in seal groove;It further include sluice way, sink and absolute altitude floating ball;Sluice way one end is connect with seal groove, and the other end is oriented to sink, and absolute altitude floating ball is arranged in sink.The present apparatus can meet simultaneously requires control of both temperature, humidity, and dampproof effect is good;The temperature of more accurate set point is obtained by program;It realizes unidirectional outlet dehumidification function, can defrost, dehumidify back and forth;Under humidity hold mode, fan operation is not needed, the spontaneous wind of temperature difference, self-loopa are passed through.

Description

A kind of two level semiconductor damp-proof moisture removing apparatus of controllable temperature
Technical field
The present invention relates to proof cabinet dehumidifying and two level semiconductors of climatic chamber technical field more particularly to a kind of controllable temperature Damp-proof moisture removing apparatus.
Background technique
The conventional general physics moisture absorption method of electronic dampproof box, regeneration repetitive cycling moisture absorption use, and when moisture absorption, hinge door is internal It opens, hygroscopic material moisture content out of the moisture absorption window moisture absorption cabinet enables cabinet humidity decline;When humidity discharging, hygroscopic material is heated and is regenerated, The outer exhausting moisture window of valve rotating opening cabinet, drains moisture.Moisture absorption humidity discharging cycling, is realized by program time controller, until Reach setting value in cabinet.The temperature inside the box has certain rising when hydrofuge.
The water that cold end condenses is passed through suction by semiconductor refrigerating proof cabinet, the semiconductor refrigeration sheet of energization one side cold side heat Enclosure material is adsorbed onto the external dehumidifying of cabinet.But when cold end frosting, dehumidification efficiency declines to a great extent, and effect on moisture extraction is very poor.
High temperature and moist and low temperature have an impact to storage goods equipment.
Water or aqueous vapor can be easy to cause circuit board short-circuit, and moist aqueous vapor can also oxidize metal rate raising, make electricity There is miscellaneous failure in device.Article is set phenomena such as deliquescing, mildew occur.
High temperature changes item characteristics and even burns, and such as has the semiconductor devices of PN junction.
Low temperature is crossed, dew condensation phenomenon can be generated, greatly increase failure rate, certain material properties is made to become fragile or seriously receive Contracting, causes structural failure.
Summary of the invention
The purpose of the present invention is overcoming above-mentioned the deficiencies in the prior art, a kind of two level semiconductor Moistureproof dehumidification of controllable temperature is provided Device, the device can control temperature and humidity simultaneously.
The present invention is achieved through the following technical solutions: a kind of two level semiconductor damp-proof moisture removing apparatus of controllable temperature, packet Include Level One semiconductor cooling piece and Level Two semiconductor cooling piece;Level One semiconductor cooling piece side is the heat dissipation of level-one cold end Device, the other side are level-one hot-side heat dissipation device;Level Two semiconductor cooling piece side is second level cold end radiator, the other side For second level hot-side heat dissipation device;Air duct includes sequentially connected inlet fans, level-one cold end radiator, two-stage connection in described device Air duct, second level cold end radiator, medium temperature sensor, demister, level-one hot-side heat dissipation device, outlet Temperature Humidity Sensor, Dry gas outlet;Two-stage connection air duct lower end is connected with unidirectional water trap.
Gas can be condensed by level-one cold end radiator and second level cold end radiator in device, form drop;Demister Realize the effect for removing droplet;The setting of seal groove, sluice way and sink can exclude liquid, at the same avoid outside moisture body into Enter.
The unidirectional water trap includes seal groove, sealing block, sluice way, sink and absolute altitude floating ball;The seal groove It is connected to two-stage connection air duct lower end, the sealing block is arranged in the seal groove;Described sluice way one end with it is described Seal groove connection, the other end are oriented to the sink, and the absolute altitude floating ball is arranged in the sink.
Described device after 0.5~10 hour of dehumidification process continuous work enter defrosting process, by it is described enter one's intention as revealed in what one says Fan reversion, air-flow is reversely with dehumidification process on the contrary, open the electric heater or the Level One semiconductor cooling piece, described in closing Level Two semiconductor cooling piece realizes defrosting function, and when intermediate temperature sensor is higher than 0 DEG C and is less than or equal to, stopping defrosted Journey returns to dehumidification process.
The control temperature range of the medium temperature sensor are as follows: T2=-55.116+11.878ln (W1+0.86625)+ (0.53574+0.09218ln(W1+0.43378))×T1, wherein W1Humidity to be achieved, T are needed for device1It is reached for device needs The temperature arrived.
Electric heater is provided between the level-one hot-side heat dissipation device and the outlet Temperature Humidity Sensor.
It is provided with entrance Temperature Humidity Sensor between the inlet fans and the level-one cold end radiator, is located at institute Air duct in the opposite device of second level cold end heat sink location is stated to offer entrance and inlet is provided with external hot end fan.
The demister is set as drawer-type structure and can detach or be inserted into from device internal channel;The demister is Silk screen demister or baffle plate demister.
The sealing block is hollow metal or the sealing block that plastic material is made and its density ratio water is small, alternatively, described close Sealing block is sealing block made of metal filled and process, alternatively, the sealing block is sealing block made of ceramic filler foam.Sealing Block density is small, could float in a liquid.
The inlet fans are centrifugal fan, cross flow fan, aerofoil fan or mixed flow fan;The inlet fans are placed on Entrance, outlet or the centre of device.
The fin of the level-one cold end radiator and the level-one hot-side heat dissipation device is sheet, parallel shape, column, radiation Shape, screw-type or cast, and fin is arranged in in-line or staggered arrangement.
It is compared with the prior art, the present invention has the advantages that the present apparatus can meet simultaneously to control of both temperature, humidity System requires, and dampproof effect is good;The temperature of more accurate set point is obtained by program;Realize unidirectional outlet dehumidification function, energy It defrosts back and forth, dehumidify two processes;Under humidity hold mode, do not need fan (blower) operation, by the spontaneous wind of temperature difference, Self-loopa.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the embodiment of the present invention 1 using the semiconductor moisture remover of dampproof box of centrifugal fan;
Fig. 2 is structural schematic diagram of the embodiment of the present invention 2 using the semiconductor moisture remover of dampproof box of cross flow fan.
Appended drawing reference meaning in figure: 1, dry gas exports;2, Temperature Humidity Sensor is exported;3, electric heater;4, entrance Net;5, inlet fans;6, level-one cold end radiator;7, Level One semiconductor cooling piece;8, level-one hot-side heat dissipation device;9, demisting fills It sets;10, medium temperature sensor;11, two-stage connects air duct;12, second level cold end radiator;13, Level Two semiconductor cooling piece; 14, second level hot-side heat dissipation device;15, sealing block;16, seal groove;17, sluice way;18, sink;19, absolute altitude floating ball;20, entrance temperature Humidity sensor;21, external hot end fan.
Specific embodiment
The contents of the present invention are described in further details with reference to the accompanying drawings and detailed description.
Embodiment 1
It refering to fig. 1, is a kind of two level semiconductor damp-proof moisture removing apparatus of controllable temperature, including Level One semiconductor cooling piece 7 and two Level semiconductor cooling piece 13;7 side of Level One semiconductor cooling piece is level-one cold end radiator 6, and the other side dissipates for level-one hot end Hot device 8;13 side of Level Two semiconductor cooling piece is second level cold end radiator 12, and the other side is second level hot-side heat dissipation device 14;Dress Setting interior air duct includes that sequentially connected entrance net 4, inlet fans 5, level-one cold end radiator 6, two-stage connection air duct 11, second level are cold Hold radiator 12, medium temperature sensor 10, demister 9, level-one hot-side heat dissipation device 8, outlet Temperature Humidity Sensor 2, drying Gas vent 1;Two-stage connection 11 lower end of air duct is connected with unidirectional water trap.In seal groove 16;17 one end of sluice way and sealing Slot 16 connects, and the other end is oriented to sink 18, and absolute altitude floating ball 19 is arranged in sink 18.Level One semiconductor cooling piece 7 and second level Semiconductor chilling plate 13 is refrigerating plant, and semiconductor refrigerating, Stirling or other refrigeration modes may be selected.
The setting of entrance net 4 can prevent ash from entering in device, and can avoid accidentally touching electric fan, and gas can in device It is condensed by level-one cold end radiator 6 and second level cold end radiator 12, forms drop;Demister 9, which can be realized, removes droplet Effect;The setting of seal groove 16, sluice way 17 and sink 18 can exclude liquid, while outside moisture body being avoided to enter.
Device enters defrosting process after 0.5~10 hour of dehumidification process continuous work, is inverted by inlet fans 5, Air-flow is reversely with dehumidification process on the contrary, opening electric heater 3 or Level One semiconductor cooling piece 7, close Level Two semiconductor cooling piece 13 realize defrosting functions, when intermediate temperature sensor 10 be higher than 0 DEG C and less than or equal to when, stop defrosting process, back to removing Wet process.
The control temperature range of medium temperature sensor 10 are as follows: T2=-55.116+11.878ln (W1+0.86625)+ (0.53574+0.09218ln(W1+0.43378))×T1, wherein W1Humidity to be achieved, T are needed for device1It is reached for device needs The temperature arrived.
Electric heater 3 is provided between level-one hot-side heat dissipation device 8 and outlet Temperature Humidity Sensor 2.
Demister 9 is set as drawer-type structure and can detach or be inserted into from device internal channel;Demister 9 removes for silk screen Mist device or baffle plate demister.
Sealing block 15 is hollow metal or the sealing block 15 that plastic material is made and its density ratio water is small, alternatively, sealing block 15 be sealing block 15 made of metal filled and process, alternatively, sealing block 15 is sealing block 15 made of ceramic filler foam.Sealing 15 density of block is small, could float in a liquid.
Inlet fans 5 are centrifugal fan, cross flow fan, aerofoil fan or mixed flow fan;Inlet fans 5 are placed on device Entrance, outlet or centre.Inlet fans 5 are driving effect, are placed on entrance, outlet or centre and do not affect use.
The fin of level-one cold end radiator 6 and level-one hot-side heat dissipation device 8 is sheet, parallel shape, column, radial, screw Type or cast, and fin is arranged in in-line or staggered arrangement.Level-one cold end radiator 6 can be used with level-one hot-side heat dissipation device 8 Radiator made of the strong material of the thermal conductivity such as aluminium, copper, iron or stainless steel.
In the present embodiment, inlet fans 5 carry out expansion explanation using centrifugal fan is used.The present apparatus is when coming into operation, meeting One is equipped with for controlling the controller of two level semiconductor damp-proof moisture removing apparatus start and stop of controllable temperature.
The temperature T that user needs to reach in controller input1, humidity W1After %, the control temperature of medium temperature sensor 10 Spend T2It can substantially be determined by following formula:
T2=-55.116+11.878ln (W1+0.86625)+(0.53574+0.09218ln(W1+0.43378))×T1
By T2Initial setting temperature as medium temperature sensor 10.The temperature has lowered 0.5 DEG C.
Work as T2When > 0, defrosting movement is not needed substantially, and concrete operations are as follows, open Level One semiconductor cooling piece 7 and removed It is wet.2 temperature of Temperature Humidity Sensor is such as exported higher than set temperature T1, then Level Two semiconductor cooling piece 13 is opened;Such as medium temperature Sensor 10 reaches T2When, outlet 2 temperature of Temperature Humidity Sensor is lower than in set temperature T1, then opening electric heater 3, make to obtain Mouth 2 temperature of Temperature Humidity Sensor reaches set temperature T1。T1, T2After temperature reaches, outlet 2 humidity value of Temperature Humidity Sensor is higher than Set humidity W1When %, gradually slightly lower T2, so that outlet 2 humidity value of Temperature Humidity Sensor reaches setting humidity W1% requirement. Similarly, Temperature Humidity Sensor humidity value is far below setting humidity W1When %, by gradually slightly improving T2, reach and require.Generally need Want Temperature Humidity Sensor humidity value than setting humidity W1It is slightly lower when %.Such as control temperature T1At 50 DEG C, T2It, can near 0 DEG C Make W1It is minimum to reach 5%.If general procedure described above, inlet fans 5 are opened, and adjustable different air quantity is wanted It asks.In outlet, Temperature Humidity Sensor 2 reaches the temperature T of setting1, humidity W1% was delayed through (such as 0.5-2 hours) after a period of time Afterwards, into humidity hold mode.This state semiconductor cooling piece, Level Two semiconductor cooling piece 13 and electric heater 3 need not It is switched on, inlet fans 5 can also close at this time, be circulated by what atmospheric density difference was formed.Gas flows following path, Gas in enclosure space with heat preservation sucks semiconductor moisture remover of dampproof box by inlet fans 5;In 5 front of inlet fans Entrance net 4 is provided with to prevent ash from entering device, while preventing operator from touching flabellum.Into semiconductor moisture remover of dampproof box The second level cold end heat dissipation that gas passes through the level-one cold end radiator 6 and Level Two semiconductor cooling piece 13 of Level One semiconductor cooling piece 7 Device 12 condenses, and forms drop, removes droplet by such as silk screen demister 9 of demister 9, drop flows down to two-stage connection wind 11 lower end of road;Two-stage connection 11 lower end of air duct is connected with seal groove 16, and it is more horizontal than seal groove 16 that cross section is provided on seal groove 16 The smaller sealing block 15 (float) in section, sealing block 15 (float) density are more light than liquid.When there is liquid to flow to, boost close It seals block 15 (float), liquid flows to sink 18 by sluice way 17, and 17 lower part of sluice way uses soft material, sink 18 is facilitated to take Out.The absolute altitude floating ball 19 of observation liquid level can be set on sink 18.When not having liquid to pass through, sealing block 15 (float) is due to weight Power falls into seal groove 16 and forms sealing state, and external humid gas does not enter in band enclosure space.Second level hot-side heat dissipation device 14 prolongs It reaches near seal groove 16, prevents lower liquid from freezing by this partial heat.Gas after demisting passes through level-one hot-side heat dissipation Device 8 and electric heater 3 heat.Setting outlet Temperature Humidity Sensor 2, reaches suitable temperature and humidity near dry gas outlet 1 Gas is flowed in enclosure space by dry gas outlet 1.
Work as T2When≤0, dehumidification process and work as T2It is similar when > 0, it is not both to increase defrosting process, since frosting influences to dehumidify Effect needs slightly to lower T2Temperature, to guarantee humidity requirement.Due to T2≤ 0, it can be in the even level-one of second level cold end radiator 12 The 6 surface frosting of cold end radiator influences heat transfer effect, and compared with low humidity requirement, it is also desirable to second level cold end radiator 12 is in frost point It works below.Enter defrosting process for a period of time (such as 0.5~8 hour) in dehumidification process continuous work, at this moment inlet fans 5 Reversion, air-flow are reversely opposite with dehumidification process.Opening electric heater 3 can also open one if being not provided with electric heater 3 Level semiconductor cooling piece 7 obtains heating effect;Close Level Two semiconductor cooling piece 13.At this moment since heating effect keeps second level cold End radiator 12 and the frost on 6 surface of level-one cold end radiator are melted into liquid, fall into two-stage connection 11 lower end of air duct, pass through sealing Slot 16, sealing block 15 (float), sluice way 17 flow in sink 18.When intermediate temperature sensor 10 is higher than 0 DEG C (such as 0.01~8 DEG C) stop defrosting process, return to dehumidification process.It, will be in enclosure space by toggling defrosting process and dehumidification process Limited moisture discharge, so that humidity reaches setting value.Such as control temperature T1At 50 DEG C, T2Near -7 DEG C, or control temperature T1At 45 DEG C, T2Near -10 DEG C, W can be made1It is minimum to reach 3%.It even will such as control temperature T1When being set in 50 DEG C, T2At -20 DEG C hereinafter, W1It is minimum to reach 1% hereinafter, only at this moment refrigerating efficiency is very low.Generally arrival lower temperature, two 13 power of level semiconductor cooling piece is greater than 7 power of Level One semiconductor cooling piece, the best refrigeration of Level Two semiconductor cooling piece 13 function Rate is greater than 7 heating power of Level One semiconductor cooling piece.Demister 9 is fabricated to drawer type, can take out in the direction of the arrow, and It is inserted into along arrow opposite direction.
Embodiment 2
Referring to Fig.2, for another two level semiconductor damp-proof moisture removing apparatus of controllable temperature, the difference of embodiment 2 and embodiment 1 it Be in: between inlet fans 5 and level-one cold end radiator 6 be provided with entrance Temperature Humidity Sensor 20, it is cold to be located at second level Air duct offers entrance and inlet is provided with external hot end fan 21 in the opposite device in end 12 position of radiator.
In the present embodiment, inlet fans 5 carry out expansion explanation using cross flow fan, cancel 3 heat of electric heater by level-one Semiconductor chilling plate 7 obtains.Increase entrance Temperature Humidity Sensor 20, controlling gas in enclosure space can be passed by entrance temperature and humidity Sensor 20 controls, but will lead to outlet temperature and can be higher than set temperature T1If by entrance Temperature Humidity Sensor 20 and outlet temperature Humidity sensor 2 jointly controls, and effect makes moderate progress.Increase external hot end fan 21 and improves 13 efficiency of Level Two semiconductor cooling piece And the fan net of associated satellite.And the centrifugal fan of 1 inlet fans 5 of embodiment is replaced with cross flow fan.
The present apparatus can be equipped with one for controlling the control of controllable temperature semiconductor damp-proof moisture removing apparatus start and stop when coming into operation Device processed.
The temperature T that user needs to reach in controller input1, humidity W1After %, the control temperature of medium temperature sensor 10 Spend T2It can substantially be determined by following formula:
T2=-55.116+11.878ln (W1+0.86625)+(0.53574+0.09218ln(W1+0.43378))×T1
By T2Initial setting temperature as medium temperature sensor 10.The temperature has lowered 0.5 DEG C.
Work as T2When > 0, defrosting movement is not needed substantially, and concrete operations are as follows, open Level One semiconductor cooling piece 7 and removed It is wet.As 20 temperature of entrance Temperature Humidity Sensor is higher than set temperature T1, then Level Two semiconductor cooling piece 13 is opened;Such as medium temperature Sensor 10 reaches T2When, 20 temperature of entrance Temperature Humidity Sensor is lower than in set temperature T1, then Level Two semiconductor cooling piece is closed 13, so that 20 temperature of entrance Temperature Humidity Sensor reaches set temperature T1。T1, T2After temperature reaches, entrance Temperature Humidity Sensor 20 Humidity value is higher than setting humidity W1When %, gradually slightly lower T2, so that 20 humidity value of entrance Temperature Humidity Sensor reach setting it is wet Spend W1% requirement.Similarly, Temperature Humidity Sensor humidity value is far below setting humidity W1When %, by gradually slightly improving T2, reach It is required that.Temperature Humidity Sensor humidity value is generally required than setting humidity W1It is slightly lower when %.Such as control temperature T1At 50 DEG C, T2 Near 0 DEG C, W can be made1It is minimum to reach 5%.If general procedure described above, inlet fans 5 are opened, adjustable Different air quantity requirements.The temperature T of setting is reached in entrance Temperature Humidity Sensor 201, humidity W1% is through after a period of time (such as 0.5-3 hours) delay after, into humidity hold mode.This state semiconductor cooling piece, Level Two semiconductor cooling piece 13 not It must be switched on, inlet fans 5 can also close at this time, be circulated by what atmospheric density difference was formed.Gas flows following road Diameter passes through inlet fans 5 and sucks semiconductor moisture remover of dampproof box with gas in the enclosure space kept the temperature;Before inlet fans 5 Face is provided with entrance net 4 to prevent ash from entering device, while preventing operator from touching flabellum.It dehumidifies and fills into semiconductor proof cabinet Gas is set to dissipate by the level-one cold end radiator 6 of Level One semiconductor cooling piece 7 and the second level cold end of Level Two semiconductor cooling piece 13 Hot device 12 condenses, and forms drop, removes droplet by such as silk screen demister 9 of demister 9, drop flows down to two-stage connection 11 lower end of air duct;Two-stage connection 11 lower end of air duct is connected with seal groove 16, and cross section is provided on seal groove 16 than seal groove 16 The smaller sealing block 15 (float) in cross section, sealing block 15 (float) density are more light than liquid.When there is liquid to flow to, boost Sealing block 15 (float), liquid flow to sink 18 by sluice way 17, and 17 lower part of sluice way uses soft material, sink 18 is facilitated to take Out.The absolute altitude floating ball 19 of observation liquid level can be set on sink 18.When not having liquid to pass through, sealing block 15 (float) is due to weight Power falls into seal groove 16 and forms sealing state, and external humid gas does not enter in band enclosure space.Second level hot-side heat dissipation device 14 prolongs It reaches near seal groove 16, prevents lower liquid from freezing by this partial heat.Gas after demisting passes through level-one hot-side heat dissipation Device 8 and electric heater 3 heat.The inlet porting Temperature Humidity Sensor 20 near dry gas outlet 1, reaches suitable temperature and humidity Gas is flowed in enclosure space by dry gas outlet 1.
Work as T2When≤0, dehumidification process and work as T2It is similar when > 0, it is not both to increase defrosting process, since frosting influences to dehumidify Effect needs slightly to lower T2Temperature, to guarantee humidity requirement.Due to T2≤ 0, it can be in the even level-one of second level cold end radiator 12 The 6 surface frosting of cold end radiator influences heat transfer effect, and compared with low humidity requirement, it is also desirable to second level cold end radiator 12 is in frost point It works below.Enter defrosting process for a period of time (such as 0.5~10 hour) in dehumidification process continuous work, at this moment inlet fans 5 reversions, air-flow are reversely opposite with dehumidification process.Level One semiconductor cooling piece 7 is opened, heating effect is obtained;Second level is closed partly to lead Body cooling piece 13.At this moment since heating effect is melted into the frost on 6 surface of second level cold end radiator 12 and level-one cold end radiator Liquid falls into two-stage connection 11 lower end of air duct, is flowed in sink 18 by seal groove 16, sealing block 15 (float), sluice way 17. When intermediate temperature sensor 10 is higher than 0 DEG C (such as 0.01~8 DEG C) stopping defrosting process, back to dehumidification process.By carrying out switchback Defrosting process and dehumidification process are changed, the limited moisture in enclosure space is discharged, so that humidity reaches setting value.Such as control temperature T1At 50 DEG C, T2Near -7 DEG C, or control temperature T1At 45 DEG C, T2Near -10 DEG C, W can be made1It is minimum to reach 3%.It even will such as control temperature T1When being set in 50 DEG C, T2At -20 DEG C hereinafter, W1It is minimum can reach 1% hereinafter, only this When refrigerating efficiency it is very low.Lower temperature is generally reached, 13 power of Level Two semiconductor cooling piece is greater than Level One semiconductor refrigeration 7 power of piece, best 13 refrigeration work consumption of Level Two semiconductor cooling piece are greater than 7 heating power of Level One semiconductor cooling piece.Demister 9 It is fabricated to drawer type, can be taken out in the direction of the arrow, and is inserted into along arrow opposite direction.
T1、W1It can also be determined by entrance Temperature Humidity Sensor 20 and outlet 2 average value of Temperature Humidity Sensor.Passing through simultaneously can To control interior circulating fan speed, the temperature and humidity difference between adjustment entrance Temperature Humidity Sensor 20 and outlet Temperature Humidity Sensor 2 is not It can be excessive.
The moisture remover of dampproof box of the application can control temperature and humidity simultaneously.By in case or in control space Temperature control, so that refrigeration mode proof cabinet, dehumidifier relative humidity are more than common refrigeration mode proof cabinet 10%, lead to 6% or so Inlet fans reversion defrosting is crossed, or even obtains 3% or less relative humidity even lower such as 1% or less.Being provided simultaneously with will finally reach To temperature, humidity controlled, meet desired atmosphere requirements double to temperature and humidity, be more than that common proof cabinet only carries out humidity Control.Optimize data, set by temperature humidity, so that it may the preliminary temperature for obtaining control and needing.
After the given temperature for needing to reach, humidity, pass through the temperature that program obtains two set points.In a band heat preservation Enclosure space in the temperature of two set points of control obtain given temperature, the humidity for needing to reach.Two-stage semiconductor cooler Piece, the cold heat exchanging part of level-one side in the enclosed space, the cold heat exchanging part of level-one is on the outside of enclosure space, and hot heat exchanging part is in outside Space.Demister 9 is arranged after the cold heat exchanging part of second level again.When needing relative humidity very low, low-temperature space temperature 0 degree with Under, stop Level Two semiconductor cooling piece 13 after reaching humidity requirement and freeze, the reversion reversion of inlet fans 5 defrost to low Warm area temperature restores normal dehumidification process at 0 degree or more.
The present apparatus have have the advantages that following some technical characterstics and:
1) to atmosphere temperature and humidity double control.
2) under humidity hold mode, blower (inlet fans 5) operation is not needed, the spontaneous wind of temperature difference, self-loopa are passed through.
3) it is located at the discharge outlet and sink 18 of self-sealing, is excluded so that moisture is unidirectionally outer in enclosure space.
4) two-stage semiconductor cooler piece (refrigerating plant) makes enclosure space temperature, can pass through second level semiconductor refrigerating Piece 13 cools down, and can also be heated up by first order semiconductor chilling plate 7 and heater.
5) freezing state is reached by two-stage semiconductor cooler piece, obtained after being suitble to temperature, (enter one's intention as revealed in what one says by inverting blower 5) fan, defrosts, 0 degree of removal or less moisture obtains lower humidity.
6) temperature of more accurate two set points is obtained after the given temperature for needing to reach, humidity by program Degree.
Above-listed detailed description is illustrating for possible embodiments of the present invention, and the embodiment is not to limit this hair Bright the scope of the patents, all equivalence enforcements or change without departing from carried out by the present invention, is intended to be limited solely by the scope of the patents of this case.It answers When, it is noted that for those of ordinary skill in the art, without departing from the inventive concept of the premise, can also make Several modifications and improvements, these are all within the scope of protection of the present invention.

Claims (10)

1. a kind of two level semiconductor damp-proof moisture removing apparatus of controllable temperature, it is characterised in that: including Level One semiconductor cooling piece and second level Semiconductor chilling plate;Level One semiconductor cooling piece side is level-one cold end radiator, and the other side is level-one hot-side heat dissipation Device;Level Two semiconductor cooling piece side is second level cold end radiator, and the other side is second level hot-side heat dissipation device;Described device Interior air duct includes sequentially connected inlet fans, level-one cold end radiator, two-stage connection air duct, second level cold end radiator, centre Temperature sensor, demister, level-one hot-side heat dissipation device, outlet Temperature Humidity Sensor, dry gas outlet;The two-stage connection Air duct lower end is connected with unidirectional water trap.
2. two level semiconductor damp-proof moisture removing apparatus of controllable temperature according to claim 1, it is characterised in that: described unidirectionally to remove water Device includes seal groove, sealing block, sluice way, sink and absolute altitude floating ball;The seal groove is connected to the two-stage connection wind Road lower end, the sealing block are arranged in the seal groove;Described sluice way one end is connect with the seal groove, and the other end is led To the sink, the absolute altitude floating ball is arranged in the sink.
3. two level semiconductor damp-proof moisture removing apparatus of controllable temperature according to claim 1, it is characterised in that: described device is being removed After 0.5~10 hour of wet process continuous work enter defrosting process, inverted by the inlet fans, air-flow reversely with dehumidifying Process is closed the Level Two semiconductor cooling piece and is realized on the contrary, open the electric heater or the Level One semiconductor cooling piece Defrost function, when intermediate temperature sensor is higher than 0 DEG C and is less than or equal to 8 DEG C, stops defrosting process, back to dehumidifying Journey.
4. two level semiconductor damp-proof moisture removing apparatus of controllable temperature according to claim 1, it is characterised in that: the medium temperature The control temperature range of sensor are as follows: T2=-55.116+11.878ln (W1+0.86625)+(0.53574+0.09218ln(W1+ 0.43378))×T1, wherein W1Humidity to be achieved, T are needed for device1Temperature to be achieved is needed for device.
5. two level semiconductor damp-proof moisture removing apparatus of controllable temperature according to claim 1, it is characterised in that: be located at the level-one Electric heater is provided between hot-side heat dissipation device and the outlet Temperature Humidity Sensor.
6. two level semiconductor damp-proof moisture removing apparatus of controllable temperature according to claim 1, it is characterised in that: be located at the entrance It is provided with entrance Temperature Humidity Sensor between fan and the level-one cold end radiator, is located at the second level cold end heat sink location Air duct offers entrance and inlet is provided with external hot end fan in opposite device.
7. two level semiconductor damp-proof moisture removing apparatus of controllable temperature according to claim 1, it is characterised in that: the demister It is set as drawer-type structure and can detach or be inserted into from device internal channel;The demister is silk screen demister or baffle plate Demisting.
8. two level semiconductor damp-proof moisture removing apparatus of controllable temperature according to claim 1, it is characterised in that: the sealing block is The sealing block that hollow metal or plastic material are made and its density ratio water is small, alternatively, the sealing block is metal filled and process system At sealing block, alternatively, the sealing block be ceramic filler foam made of sealing block.
9. two level semiconductor damp-proof moisture removing apparatus of controllable temperature according to claim 1, it is characterised in that: the inlet fans For centrifugal fan, cross flow fan, aerofoil fan or mixed flow fan;The inlet fans be placed on device entrance, outlet or It is intermediate.
10. two level semiconductor damp-proof moisture removing apparatus of controllable temperature according to claim 1, it is characterised in that: the level-one is cold Hold the fin of radiator and the level-one hot-side heat dissipation device for sheet, parallel shape, column, radial, screw-type or cast, and Fin is arranged in in-line or staggered arrangement.
CN201910677988.8A 2019-07-25 2019-07-25 Temperature-controllable two-stage semiconductor moisture-proof and dehumidifying device Active CN110500805B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910677988.8A CN110500805B (en) 2019-07-25 2019-07-25 Temperature-controllable two-stage semiconductor moisture-proof and dehumidifying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910677988.8A CN110500805B (en) 2019-07-25 2019-07-25 Temperature-controllable two-stage semiconductor moisture-proof and dehumidifying device

Publications (2)

Publication Number Publication Date
CN110500805A true CN110500805A (en) 2019-11-26
CN110500805B CN110500805B (en) 2021-08-10

Family

ID=68586757

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910677988.8A Active CN110500805B (en) 2019-07-25 2019-07-25 Temperature-controllable two-stage semiconductor moisture-proof and dehumidifying device

Country Status (1)

Country Link
CN (1) CN110500805B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110935292A (en) * 2019-12-23 2020-03-31 南京呈禾信息科技有限公司 Two unification flue gas preliminary treatment condensers of inverter compressor and semiconductor refrigeration piece
CN112556305A (en) * 2020-11-25 2021-03-26 赵天芳 Financial management data cabinet
CN114130168A (en) * 2021-11-10 2022-03-04 北京京仪自动化装备技术股份有限公司 Multistage dehumidification device, exhaust gas treatment system and dehumidification control method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2699201Y (en) * 2004-04-26 2005-05-11 海口瑞尔科技发展有限公司 Built-in type moisture proof mildew resistant device
JP2011173118A (en) * 2011-03-11 2011-09-08 Mitsubishi Electric Corp Electrostatic atomizer and air conditioner
CN104331108A (en) * 2014-10-09 2015-02-04 国家电网公司 Dehumidifier and control method thereof
CN108758882A (en) * 2018-08-06 2018-11-06 奥克斯空调股份有限公司 A kind of semiconductor refrigerating dehumidizer and its dehumanization method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2699201Y (en) * 2004-04-26 2005-05-11 海口瑞尔科技发展有限公司 Built-in type moisture proof mildew resistant device
JP2011173118A (en) * 2011-03-11 2011-09-08 Mitsubishi Electric Corp Electrostatic atomizer and air conditioner
CN104331108A (en) * 2014-10-09 2015-02-04 国家电网公司 Dehumidifier and control method thereof
CN108758882A (en) * 2018-08-06 2018-11-06 奥克斯空调股份有限公司 A kind of semiconductor refrigerating dehumidizer and its dehumanization method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110935292A (en) * 2019-12-23 2020-03-31 南京呈禾信息科技有限公司 Two unification flue gas preliminary treatment condensers of inverter compressor and semiconductor refrigeration piece
CN112556305A (en) * 2020-11-25 2021-03-26 赵天芳 Financial management data cabinet
CN114130168A (en) * 2021-11-10 2022-03-04 北京京仪自动化装备技术股份有限公司 Multistage dehumidification device, exhaust gas treatment system and dehumidification control method
CN114130168B (en) * 2021-11-10 2023-08-04 北京京仪自动化装备技术股份有限公司 Multistage dehumidification device, exhaust gas treatment system and dehumidification control method

Also Published As

Publication number Publication date
CN110500805B (en) 2021-08-10

Similar Documents

Publication Publication Date Title
CN110486983A (en) A kind of controllable temperature semiconductor damp-proof moisture removing apparatus
CN110500805A (en) A kind of two level semiconductor damp-proof moisture removing apparatus of controllable temperature
CN205641752U (en) Air -cooling refrigerator
WO2018006572A1 (en) Air-cooled refrigerator and dehumidification method thereof
US4730464A (en) Refrigerator and freezer
CN108826793A (en) Refrigerator, its control system and control method
CN207751204U (en) Environmental test chamber dehumidifying, refrigeration system
CN207853281U (en) A kind of dehumidifying dedusting cooling noise reduction integration electrical cabinet
CN201555424U (en) Heat pump circulatory dehumidification barn
CN206531315U (en) Intelligent dehumidification by condensation device
US20220113087A1 (en) Multi-chamber dryer using adjustable conditioned air flow
AU2012385848B2 (en) Room Temperature Drying System
CN108579349B (en) Dry air generator, charging pile and dehumidification method for circuit board of charging pile
JP6019386B2 (en) refrigerator
CN208209467U (en) A kind of Outdoor Terminal Case Intelligent dehumidifying device
CN109373669B (en) Refrigerator with a refrigerator body
CN212023513U (en) Temperature-controllable semiconductor moisture-proof box
CN210892250U (en) Temperature-controllable two-stage semiconductor moisture-proof box
JP6895919B2 (en) Environment forming device and environment forming method
JP6251884B2 (en) Dehumidifier
CN205690528U (en) Dehumidifier with air quantity regulation
CN211854066U (en) Compact flue gas white elimination system
CN219050856U (en) Low-temperature air dehumidifying device
CN111137564B (en) Frost prevention system for cold storage plate for fresh-keeping transport case and control method
CN203286804U (en) Automatic dehumidifying device of vortex tubes

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant