CN110500805A - A kind of two level semiconductor damp-proof moisture removing apparatus of controllable temperature - Google Patents
A kind of two level semiconductor damp-proof moisture removing apparatus of controllable temperature Download PDFInfo
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- CN110500805A CN110500805A CN201910677988.8A CN201910677988A CN110500805A CN 110500805 A CN110500805 A CN 110500805A CN 201910677988 A CN201910677988 A CN 201910677988A CN 110500805 A CN110500805 A CN 110500805A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
- F25D17/06—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
- F25D21/06—Removing frost
- F25D21/08—Removing frost by electric heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
- F25D21/14—Collecting or removing condensed and defrost water; Drip trays
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/24—Arrangements for promoting turbulent flow of heat-exchange media, e.g. by plates
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D2700/00—Means for sensing or measuring; Sensors therefor
- F25D2700/12—Sensors measuring the inside temperature
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Fluid Mechanics (AREA)
- Drying Of Gases (AREA)
Abstract
The invention discloses a kind of two level semiconductor damp-proof moisture removing apparatus of controllable temperature, air duct includes sequentially connected entrance net, inlet fans, level-one cold end radiator, two-stage connection air duct, second level cold end radiator, medium temperature sensor, demister, level-one hot-side heat dissipation device, outlet Temperature Humidity Sensor, dry gas outlet in device；Two-stage connection air duct lower end is connected with seal groove, is provided with sealing block in seal groove；It further include sluice way, sink and absolute altitude floating ball；Sluice way one end is connect with seal groove, and the other end is oriented to sink, and absolute altitude floating ball is arranged in sink.The present apparatus can meet simultaneously requires control of both temperature, humidity, and dampproof effect is good；The temperature of more accurate set point is obtained by program；It realizes unidirectional outlet dehumidification function, can defrost, dehumidify back and forth；Under humidity hold mode, fan operation is not needed, the spontaneous wind of temperature difference, self-loopa are passed through.
Description
Technical field
The present invention relates to proof cabinet dehumidifying and two level semiconductors of climatic chamber technical field more particularly to a kind of controllable temperature
Damp-proof moisture removing apparatus.
Background technique
The conventional general physics moisture absorption method of electronic dampproof box, regeneration repetitive cycling moisture absorption use, and when moisture absorption, hinge door is internal
It opens, hygroscopic material moisture content out of the moisture absorption window moisture absorption cabinet enables cabinet humidity decline；When humidity discharging, hygroscopic material is heated and is regenerated,
The outer exhausting moisture window of valve rotating opening cabinet, drains moisture.Moisture absorption humidity discharging cycling, is realized by program time controller, until
Reach setting value in cabinet.The temperature inside the box has certain rising when hydrofuge.
The water that cold end condenses is passed through suction by semiconductor refrigerating proof cabinet, the semiconductor refrigeration sheet of energization one side cold side heat
Enclosure material is adsorbed onto the external dehumidifying of cabinet.But when cold end frosting, dehumidification efficiency declines to a great extent, and effect on moisture extraction is very poor.
High temperature and moist and low temperature have an impact to storage goods equipment.
Water or aqueous vapor can be easy to cause circuit board short-circuit, and moist aqueous vapor can also oxidize metal rate raising, make electricity
There is miscellaneous failure in device.Article is set phenomena such as deliquescing, mildew occur.
High temperature changes item characteristics and even burns, and such as has the semiconductor devices of PN junction.
Low temperature is crossed, dew condensation phenomenon can be generated, greatly increase failure rate, certain material properties is made to become fragile or seriously receive
Contracting, causes structural failure.
Summary of the invention
The purpose of the present invention is overcoming above-mentioned the deficiencies in the prior art, a kind of two level semiconductor Moistureproof dehumidification of controllable temperature is provided
Device, the device can control temperature and humidity simultaneously.
The present invention is achieved through the following technical solutions: a kind of two level semiconductor damp-proof moisture removing apparatus of controllable temperature, packet
Include Level One semiconductor cooling piece and Level Two semiconductor cooling piece；Level One semiconductor cooling piece side is the heat dissipation of level-one cold end
Device, the other side are level-one hot-side heat dissipation device；Level Two semiconductor cooling piece side is second level cold end radiator, the other side
For second level hot-side heat dissipation device；Air duct includes sequentially connected inlet fans, level-one cold end radiator, two-stage connection in described device
Air duct, second level cold end radiator, medium temperature sensor, demister, level-one hot-side heat dissipation device, outlet Temperature Humidity Sensor,
Dry gas outlet；Two-stage connection air duct lower end is connected with unidirectional water trap.
Gas can be condensed by level-one cold end radiator and second level cold end radiator in device, form drop；Demister
Realize the effect for removing droplet；The setting of seal groove, sluice way and sink can exclude liquid, at the same avoid outside moisture body into
Enter.
The unidirectional water trap includes seal groove, sealing block, sluice way, sink and absolute altitude floating ball；The seal groove
It is connected to two-stage connection air duct lower end, the sealing block is arranged in the seal groove；Described sluice way one end with it is described
Seal groove connection, the other end are oriented to the sink, and the absolute altitude floating ball is arranged in the sink.
Described device after 0.5~10 hour of dehumidification process continuous work enter defrosting process, by it is described enter one's intention as revealed in what one says
Fan reversion, air-flow is reversely with dehumidification process on the contrary, open the electric heater or the Level One semiconductor cooling piece, described in closing
Level Two semiconductor cooling piece realizes defrosting function, and when intermediate temperature sensor is higher than 0 DEG C and is less than or equal to, stopping defrosted
Journey returns to dehumidification process.
The control temperature range of the medium temperature sensor are as follows: T2=-55.116+11.878ln (W1+0.86625)+
(0.53574+0.09218ln(W1+0.43378))×T1, wherein W1Humidity to be achieved, T are needed for device1It is reached for device needs
The temperature arrived.
Electric heater is provided between the level-one hot-side heat dissipation device and the outlet Temperature Humidity Sensor.
It is provided with entrance Temperature Humidity Sensor between the inlet fans and the level-one cold end radiator, is located at institute
Air duct in the opposite device of second level cold end heat sink location is stated to offer entrance and inlet is provided with external hot end fan.
The demister is set as drawer-type structure and can detach or be inserted into from device internal channel；The demister is
Silk screen demister or baffle plate demister.
The sealing block is hollow metal or the sealing block that plastic material is made and its density ratio water is small, alternatively, described close
Sealing block is sealing block made of metal filled and process, alternatively, the sealing block is sealing block made of ceramic filler foam.Sealing
Block density is small, could float in a liquid.
The inlet fans are centrifugal fan, cross flow fan, aerofoil fan or mixed flow fan；The inlet fans are placed on
Entrance, outlet or the centre of device.
The fin of the level-one cold end radiator and the level-one hot-side heat dissipation device is sheet, parallel shape, column, radiation
Shape, screw-type or cast, and fin is arranged in in-line or staggered arrangement.
It is compared with the prior art, the present invention has the advantages that the present apparatus can meet simultaneously to control of both temperature, humidity
System requires, and dampproof effect is good；The temperature of more accurate set point is obtained by program；Realize unidirectional outlet dehumidification function, energy
It defrosts back and forth, dehumidify two processes；Under humidity hold mode, do not need fan (blower) operation, by the spontaneous wind of temperature difference,
Self-loopa.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the embodiment of the present invention 1 using the semiconductor moisture remover of dampproof box of centrifugal fan；
Fig. 2 is structural schematic diagram of the embodiment of the present invention 2 using the semiconductor moisture remover of dampproof box of cross flow fan.
Appended drawing reference meaning in figure: 1, dry gas exports；2, Temperature Humidity Sensor is exported；3, electric heater；4, entrance
Net；5, inlet fans；6, level-one cold end radiator；7, Level One semiconductor cooling piece；8, level-one hot-side heat dissipation device；9, demisting fills
It sets；10, medium temperature sensor；11, two-stage connects air duct；12, second level cold end radiator；13, Level Two semiconductor cooling piece；
14, second level hot-side heat dissipation device；15, sealing block；16, seal groove；17, sluice way；18, sink；19, absolute altitude floating ball；20, entrance temperature
Humidity sensor；21, external hot end fan.
Specific embodiment
The contents of the present invention are described in further details with reference to the accompanying drawings and detailed description.
Embodiment 1
It refering to fig. 1, is a kind of two level semiconductor damp-proof moisture removing apparatus of controllable temperature, including Level One semiconductor cooling piece 7 and two
Level semiconductor cooling piece 13；7 side of Level One semiconductor cooling piece is level-one cold end radiator 6, and the other side dissipates for level-one hot end
Hot device 8；13 side of Level Two semiconductor cooling piece is second level cold end radiator 12, and the other side is second level hot-side heat dissipation device 14；Dress
Setting interior air duct includes that sequentially connected entrance net 4, inlet fans 5, level-one cold end radiator 6, two-stage connection air duct 11, second level are cold
Hold radiator 12, medium temperature sensor 10, demister 9, level-one hot-side heat dissipation device 8, outlet Temperature Humidity Sensor 2, drying
Gas vent 1；Two-stage connection 11 lower end of air duct is connected with unidirectional water trap.In seal groove 16；17 one end of sluice way and sealing
Slot 16 connects, and the other end is oriented to sink 18, and absolute altitude floating ball 19 is arranged in sink 18.Level One semiconductor cooling piece 7 and second level
Semiconductor chilling plate 13 is refrigerating plant, and semiconductor refrigerating, Stirling or other refrigeration modes may be selected.
The setting of entrance net 4 can prevent ash from entering in device, and can avoid accidentally touching electric fan, and gas can in device
It is condensed by level-one cold end radiator 6 and second level cold end radiator 12, forms drop；Demister 9, which can be realized, removes droplet
Effect；The setting of seal groove 16, sluice way 17 and sink 18 can exclude liquid, while outside moisture body being avoided to enter.
Device enters defrosting process after 0.5~10 hour of dehumidification process continuous work, is inverted by inlet fans 5,
Air-flow is reversely with dehumidification process on the contrary, opening electric heater 3 or Level One semiconductor cooling piece 7, close Level Two semiconductor cooling piece
13 realize defrosting functions, when intermediate temperature sensor 10 be higher than 0 DEG C and less than or equal to when, stop defrosting process, back to removing
Wet process.
The control temperature range of medium temperature sensor 10 are as follows: T2=-55.116+11.878ln (W1+0.86625)+
(0.53574+0.09218ln(W1+0.43378))×T1, wherein W1Humidity to be achieved, T are needed for device1It is reached for device needs
The temperature arrived.
Electric heater 3 is provided between level-one hot-side heat dissipation device 8 and outlet Temperature Humidity Sensor 2.
Demister 9 is set as drawer-type structure and can detach or be inserted into from device internal channel；Demister 9 removes for silk screen
Mist device or baffle plate demister.
Sealing block 15 is hollow metal or the sealing block 15 that plastic material is made and its density ratio water is small, alternatively, sealing block
15 be sealing block 15 made of metal filled and process, alternatively, sealing block 15 is sealing block 15 made of ceramic filler foam.Sealing
15 density of block is small, could float in a liquid.
Inlet fans 5 are centrifugal fan, cross flow fan, aerofoil fan or mixed flow fan；Inlet fans 5 are placed on device
Entrance, outlet or centre.Inlet fans 5 are driving effect, are placed on entrance, outlet or centre and do not affect use.
The fin of level-one cold end radiator 6 and level-one hot-side heat dissipation device 8 is sheet, parallel shape, column, radial, screw
Type or cast, and fin is arranged in in-line or staggered arrangement.Level-one cold end radiator 6 can be used with level-one hot-side heat dissipation device 8
Radiator made of the strong material of the thermal conductivity such as aluminium, copper, iron or stainless steel.
In the present embodiment, inlet fans 5 carry out expansion explanation using centrifugal fan is used.The present apparatus is when coming into operation, meeting
One is equipped with for controlling the controller of two level semiconductor damp-proof moisture removing apparatus start and stop of controllable temperature.
The temperature T that user needs to reach in controller input1, humidity W1After %, the control temperature of medium temperature sensor 10
Spend T2It can substantially be determined by following formula:
T2=-55.116+11.878ln (W1+0.86625)+(0.53574+0.09218ln(W1+0.43378))×T1
By T2Initial setting temperature as medium temperature sensor 10.The temperature has lowered 0.5 DEG C.
Work as T2When > 0, defrosting movement is not needed substantially, and concrete operations are as follows, open Level One semiconductor cooling piece 7 and removed
It is wet.2 temperature of Temperature Humidity Sensor is such as exported higher than set temperature T1, then Level Two semiconductor cooling piece 13 is opened；Such as medium temperature
Sensor 10 reaches T2When, outlet 2 temperature of Temperature Humidity Sensor is lower than in set temperature T1, then opening electric heater 3, make to obtain
Mouth 2 temperature of Temperature Humidity Sensor reaches set temperature T1。T1, T2After temperature reaches, outlet 2 humidity value of Temperature Humidity Sensor is higher than
Set humidity W1When %, gradually slightly lower T2, so that outlet 2 humidity value of Temperature Humidity Sensor reaches setting humidity W1% requirement.
Similarly, Temperature Humidity Sensor humidity value is far below setting humidity W1When %, by gradually slightly improving T2, reach and require.Generally need
Want Temperature Humidity Sensor humidity value than setting humidity W1It is slightly lower when %.Such as control temperature T1At 50 DEG C, T2It, can near 0 DEG C
Make W1It is minimum to reach 5%.If general procedure described above, inlet fans 5 are opened, and adjustable different air quantity is wanted
It asks.In outlet, Temperature Humidity Sensor 2 reaches the temperature T of setting1, humidity W1% was delayed through (such as 0.5-2 hours) after a period of time
Afterwards, into humidity hold mode.This state semiconductor cooling piece, Level Two semiconductor cooling piece 13 and electric heater 3 need not
It is switched on, inlet fans 5 can also close at this time, be circulated by what atmospheric density difference was formed.Gas flows following path,
Gas in enclosure space with heat preservation sucks semiconductor moisture remover of dampproof box by inlet fans 5；In 5 front of inlet fans
Entrance net 4 is provided with to prevent ash from entering device, while preventing operator from touching flabellum.Into semiconductor moisture remover of dampproof box
The second level cold end heat dissipation that gas passes through the level-one cold end radiator 6 and Level Two semiconductor cooling piece 13 of Level One semiconductor cooling piece 7
Device 12 condenses, and forms drop, removes droplet by such as silk screen demister 9 of demister 9, drop flows down to two-stage connection wind
11 lower end of road；Two-stage connection 11 lower end of air duct is connected with seal groove 16, and it is more horizontal than seal groove 16 that cross section is provided on seal groove 16
The smaller sealing block 15 (float) in section, sealing block 15 (float) density are more light than liquid.When there is liquid to flow to, boost close
It seals block 15 (float), liquid flows to sink 18 by sluice way 17, and 17 lower part of sluice way uses soft material, sink 18 is facilitated to take
Out.The absolute altitude floating ball 19 of observation liquid level can be set on sink 18.When not having liquid to pass through, sealing block 15 (float) is due to weight
Power falls into seal groove 16 and forms sealing state, and external humid gas does not enter in band enclosure space.Second level hot-side heat dissipation device 14 prolongs
It reaches near seal groove 16, prevents lower liquid from freezing by this partial heat.Gas after demisting passes through level-one hot-side heat dissipation
Device 8 and electric heater 3 heat.Setting outlet Temperature Humidity Sensor 2, reaches suitable temperature and humidity near dry gas outlet 1
Gas is flowed in enclosure space by dry gas outlet 1.
Work as T2When≤0, dehumidification process and work as T2It is similar when > 0, it is not both to increase defrosting process, since frosting influences to dehumidify
Effect needs slightly to lower T2Temperature, to guarantee humidity requirement.Due to T2≤ 0, it can be in the even level-one of second level cold end radiator 12
The 6 surface frosting of cold end radiator influences heat transfer effect, and compared with low humidity requirement, it is also desirable to second level cold end radiator 12 is in frost point
It works below.Enter defrosting process for a period of time (such as 0.5~8 hour) in dehumidification process continuous work, at this moment inlet fans 5
Reversion, air-flow are reversely opposite with dehumidification process.Opening electric heater 3 can also open one if being not provided with electric heater 3
Level semiconductor cooling piece 7 obtains heating effect；Close Level Two semiconductor cooling piece 13.At this moment since heating effect keeps second level cold
End radiator 12 and the frost on 6 surface of level-one cold end radiator are melted into liquid, fall into two-stage connection 11 lower end of air duct, pass through sealing
Slot 16, sealing block 15 (float), sluice way 17 flow in sink 18.When intermediate temperature sensor 10 is higher than 0 DEG C (such as 0.01~8
DEG C) stop defrosting process, return to dehumidification process.It, will be in enclosure space by toggling defrosting process and dehumidification process
Limited moisture discharge, so that humidity reaches setting value.Such as control temperature T1At 50 DEG C, T2Near -7 DEG C, or control temperature
T1At 45 DEG C, T2Near -10 DEG C, W can be made1It is minimum to reach 3%.It even will such as control temperature T1When being set in 50 DEG C,
T2At -20 DEG C hereinafter, W1It is minimum to reach 1% hereinafter, only at this moment refrigerating efficiency is very low.Generally arrival lower temperature, two
13 power of level semiconductor cooling piece is greater than 7 power of Level One semiconductor cooling piece, the best refrigeration of Level Two semiconductor cooling piece 13 function
Rate is greater than 7 heating power of Level One semiconductor cooling piece.Demister 9 is fabricated to drawer type, can take out in the direction of the arrow, and
It is inserted into along arrow opposite direction.
Embodiment 2
Referring to Fig.2, for another two level semiconductor damp-proof moisture removing apparatus of controllable temperature, the difference of embodiment 2 and embodiment 1 it
Be in: between inlet fans 5 and level-one cold end radiator 6 be provided with entrance Temperature Humidity Sensor 20, it is cold to be located at second level
Air duct offers entrance and inlet is provided with external hot end fan 21 in the opposite device in end 12 position of radiator.
In the present embodiment, inlet fans 5 carry out expansion explanation using cross flow fan, cancel 3 heat of electric heater by level-one
Semiconductor chilling plate 7 obtains.Increase entrance Temperature Humidity Sensor 20, controlling gas in enclosure space can be passed by entrance temperature and humidity
Sensor 20 controls, but will lead to outlet temperature and can be higher than set temperature T1If by entrance Temperature Humidity Sensor 20 and outlet temperature
Humidity sensor 2 jointly controls, and effect makes moderate progress.Increase external hot end fan 21 and improves 13 efficiency of Level Two semiconductor cooling piece
And the fan net of associated satellite.And the centrifugal fan of 1 inlet fans 5 of embodiment is replaced with cross flow fan.
The present apparatus can be equipped with one for controlling the control of controllable temperature semiconductor damp-proof moisture removing apparatus start and stop when coming into operation
Device processed.
The temperature T that user needs to reach in controller input1, humidity W1After %, the control temperature of medium temperature sensor 10
Spend T2It can substantially be determined by following formula:
T2=-55.116+11.878ln (W1+0.86625)+(0.53574+0.09218ln(W1+0.43378))×T1
By T2Initial setting temperature as medium temperature sensor 10.The temperature has lowered 0.5 DEG C.
Work as T2When > 0, defrosting movement is not needed substantially, and concrete operations are as follows, open Level One semiconductor cooling piece 7 and removed
It is wet.As 20 temperature of entrance Temperature Humidity Sensor is higher than set temperature T1, then Level Two semiconductor cooling piece 13 is opened；Such as medium temperature
Sensor 10 reaches T2When, 20 temperature of entrance Temperature Humidity Sensor is lower than in set temperature T1, then Level Two semiconductor cooling piece is closed
13, so that 20 temperature of entrance Temperature Humidity Sensor reaches set temperature T1。T1, T2After temperature reaches, entrance Temperature Humidity Sensor 20
Humidity value is higher than setting humidity W1When %, gradually slightly lower T2, so that 20 humidity value of entrance Temperature Humidity Sensor reach setting it is wet
Spend W1% requirement.Similarly, Temperature Humidity Sensor humidity value is far below setting humidity W1When %, by gradually slightly improving T2, reach
It is required that.Temperature Humidity Sensor humidity value is generally required than setting humidity W1It is slightly lower when %.Such as control temperature T1At 50 DEG C, T2
Near 0 DEG C, W can be made1It is minimum to reach 5%.If general procedure described above, inlet fans 5 are opened, adjustable
Different air quantity requirements.The temperature T of setting is reached in entrance Temperature Humidity Sensor 201, humidity W1% is through after a period of time (such as
0.5-3 hours) delay after, into humidity hold mode.This state semiconductor cooling piece, Level Two semiconductor cooling piece 13 not
It must be switched on, inlet fans 5 can also close at this time, be circulated by what atmospheric density difference was formed.Gas flows following road
Diameter passes through inlet fans 5 and sucks semiconductor moisture remover of dampproof box with gas in the enclosure space kept the temperature；Before inlet fans 5
Face is provided with entrance net 4 to prevent ash from entering device, while preventing operator from touching flabellum.It dehumidifies and fills into semiconductor proof cabinet
Gas is set to dissipate by the level-one cold end radiator 6 of Level One semiconductor cooling piece 7 and the second level cold end of Level Two semiconductor cooling piece 13
Hot device 12 condenses, and forms drop, removes droplet by such as silk screen demister 9 of demister 9, drop flows down to two-stage connection
11 lower end of air duct；Two-stage connection 11 lower end of air duct is connected with seal groove 16, and cross section is provided on seal groove 16 than seal groove 16
The smaller sealing block 15 (float) in cross section, sealing block 15 (float) density are more light than liquid.When there is liquid to flow to, boost
Sealing block 15 (float), liquid flow to sink 18 by sluice way 17, and 17 lower part of sluice way uses soft material, sink 18 is facilitated to take
Out.The absolute altitude floating ball 19 of observation liquid level can be set on sink 18.When not having liquid to pass through, sealing block 15 (float) is due to weight
Power falls into seal groove 16 and forms sealing state, and external humid gas does not enter in band enclosure space.Second level hot-side heat dissipation device 14 prolongs
It reaches near seal groove 16, prevents lower liquid from freezing by this partial heat.Gas after demisting passes through level-one hot-side heat dissipation
Device 8 and electric heater 3 heat.The inlet porting Temperature Humidity Sensor 20 near dry gas outlet 1, reaches suitable temperature and humidity
Gas is flowed in enclosure space by dry gas outlet 1.
Work as T2When≤0, dehumidification process and work as T2It is similar when > 0, it is not both to increase defrosting process, since frosting influences to dehumidify
Effect needs slightly to lower T2Temperature, to guarantee humidity requirement.Due to T2≤ 0, it can be in the even level-one of second level cold end radiator 12
The 6 surface frosting of cold end radiator influences heat transfer effect, and compared with low humidity requirement, it is also desirable to second level cold end radiator 12 is in frost point
It works below.Enter defrosting process for a period of time (such as 0.5~10 hour) in dehumidification process continuous work, at this moment inlet fans
5 reversions, air-flow are reversely opposite with dehumidification process.Level One semiconductor cooling piece 7 is opened, heating effect is obtained；Second level is closed partly to lead
Body cooling piece 13.At this moment since heating effect is melted into the frost on 6 surface of second level cold end radiator 12 and level-one cold end radiator
Liquid falls into two-stage connection 11 lower end of air duct, is flowed in sink 18 by seal groove 16, sealing block 15 (float), sluice way 17.
When intermediate temperature sensor 10 is higher than 0 DEG C (such as 0.01~8 DEG C) stopping defrosting process, back to dehumidification process.By carrying out switchback
Defrosting process and dehumidification process are changed, the limited moisture in enclosure space is discharged, so that humidity reaches setting value.Such as control temperature
T1At 50 DEG C, T2Near -7 DEG C, or control temperature T1At 45 DEG C, T2Near -10 DEG C, W can be made1It is minimum to reach
3%.It even will such as control temperature T1When being set in 50 DEG C, T2At -20 DEG C hereinafter, W1It is minimum can reach 1% hereinafter, only this
When refrigerating efficiency it is very low.Lower temperature is generally reached, 13 power of Level Two semiconductor cooling piece is greater than Level One semiconductor refrigeration
7 power of piece, best 13 refrigeration work consumption of Level Two semiconductor cooling piece are greater than 7 heating power of Level One semiconductor cooling piece.Demister 9
It is fabricated to drawer type, can be taken out in the direction of the arrow, and is inserted into along arrow opposite direction.
T1、W1It can also be determined by entrance Temperature Humidity Sensor 20 and outlet 2 average value of Temperature Humidity Sensor.Passing through simultaneously can
To control interior circulating fan speed, the temperature and humidity difference between adjustment entrance Temperature Humidity Sensor 20 and outlet Temperature Humidity Sensor 2 is not
It can be excessive.
The moisture remover of dampproof box of the application can control temperature and humidity simultaneously.By in case or in control space
Temperature control, so that refrigeration mode proof cabinet, dehumidifier relative humidity are more than common refrigeration mode proof cabinet 10%, lead to 6% or so
Inlet fans reversion defrosting is crossed, or even obtains 3% or less relative humidity even lower such as 1% or less.Being provided simultaneously with will finally reach
To temperature, humidity controlled, meet desired atmosphere requirements double to temperature and humidity, be more than that common proof cabinet only carries out humidity
Control.Optimize data, set by temperature humidity, so that it may the preliminary temperature for obtaining control and needing.
After the given temperature for needing to reach, humidity, pass through the temperature that program obtains two set points.In a band heat preservation
Enclosure space in the temperature of two set points of control obtain given temperature, the humidity for needing to reach.Two-stage semiconductor cooler
Piece, the cold heat exchanging part of level-one side in the enclosed space, the cold heat exchanging part of level-one is on the outside of enclosure space, and hot heat exchanging part is in outside
Space.Demister 9 is arranged after the cold heat exchanging part of second level again.When needing relative humidity very low, low-temperature space temperature 0 degree with
Under, stop Level Two semiconductor cooling piece 13 after reaching humidity requirement and freeze, the reversion reversion of inlet fans 5 defrost to low
Warm area temperature restores normal dehumidification process at 0 degree or more.
The present apparatus have have the advantages that following some technical characterstics and:
1) to atmosphere temperature and humidity double control.
2) under humidity hold mode, blower (inlet fans 5) operation is not needed, the spontaneous wind of temperature difference, self-loopa are passed through.
3) it is located at the discharge outlet and sink 18 of self-sealing, is excluded so that moisture is unidirectionally outer in enclosure space.
4) two-stage semiconductor cooler piece (refrigerating plant) makes enclosure space temperature, can pass through second level semiconductor refrigerating
Piece 13 cools down, and can also be heated up by first order semiconductor chilling plate 7 and heater.
5) freezing state is reached by two-stage semiconductor cooler piece, obtained after being suitble to temperature, (enter one's intention as revealed in what one says by inverting blower
5) fan, defrosts, 0 degree of removal or less moisture obtains lower humidity.
6) temperature of more accurate two set points is obtained after the given temperature for needing to reach, humidity by program
Degree.
Above-listed detailed description is illustrating for possible embodiments of the present invention, and the embodiment is not to limit this hair
Bright the scope of the patents, all equivalence enforcements or change without departing from carried out by the present invention, is intended to be limited solely by the scope of the patents of this case.It answers
When, it is noted that for those of ordinary skill in the art, without departing from the inventive concept of the premise, can also make
Several modifications and improvements, these are all within the scope of protection of the present invention.
Claims (10)
1. a kind of two level semiconductor damp-proof moisture removing apparatus of controllable temperature, it is characterised in that: including Level One semiconductor cooling piece and second level
Semiconductor chilling plate；Level One semiconductor cooling piece side is level-one cold end radiator, and the other side is level-one hot-side heat dissipation
Device；Level Two semiconductor cooling piece side is second level cold end radiator, and the other side is second level hot-side heat dissipation device；Described device
Interior air duct includes sequentially connected inlet fans, level-one cold end radiator, two-stage connection air duct, second level cold end radiator, centre
Temperature sensor, demister, level-one hot-side heat dissipation device, outlet Temperature Humidity Sensor, dry gas outlet；The two-stage connection
Air duct lower end is connected with unidirectional water trap.
2. two level semiconductor damp-proof moisture removing apparatus of controllable temperature according to claim 1, it is characterised in that: described unidirectionally to remove water
Device includes seal groove, sealing block, sluice way, sink and absolute altitude floating ball；The seal groove is connected to the two-stage connection wind
Road lower end, the sealing block are arranged in the seal groove；Described sluice way one end is connect with the seal groove, and the other end is led
To the sink, the absolute altitude floating ball is arranged in the sink.
3. two level semiconductor damp-proof moisture removing apparatus of controllable temperature according to claim 1, it is characterised in that: described device is being removed
After 0.5~10 hour of wet process continuous work enter defrosting process, inverted by the inlet fans, air-flow reversely with dehumidifying
Process is closed the Level Two semiconductor cooling piece and is realized on the contrary, open the electric heater or the Level One semiconductor cooling piece
Defrost function, when intermediate temperature sensor is higher than 0 DEG C and is less than or equal to 8 DEG C, stops defrosting process, back to dehumidifying
Journey.
4. two level semiconductor damp-proof moisture removing apparatus of controllable temperature according to claim 1, it is characterised in that: the medium temperature
The control temperature range of sensor are as follows: T2=-55.116+11.878ln (W1+0.86625)+(0.53574+0.09218ln(W1+
0.43378))×T1, wherein W1Humidity to be achieved, T are needed for device1Temperature to be achieved is needed for device.
5. two level semiconductor damp-proof moisture removing apparatus of controllable temperature according to claim 1, it is characterised in that: be located at the level-one
Electric heater is provided between hot-side heat dissipation device and the outlet Temperature Humidity Sensor.
6. two level semiconductor damp-proof moisture removing apparatus of controllable temperature according to claim 1, it is characterised in that: be located at the entrance
It is provided with entrance Temperature Humidity Sensor between fan and the level-one cold end radiator, is located at the second level cold end heat sink location
Air duct offers entrance and inlet is provided with external hot end fan in opposite device.
7. two level semiconductor damp-proof moisture removing apparatus of controllable temperature according to claim 1, it is characterised in that: the demister
It is set as drawer-type structure and can detach or be inserted into from device internal channel；The demister is silk screen demister or baffle plate
Demisting.
8. two level semiconductor damp-proof moisture removing apparatus of controllable temperature according to claim 1, it is characterised in that: the sealing block is
The sealing block that hollow metal or plastic material are made and its density ratio water is small, alternatively, the sealing block is metal filled and process system
At sealing block, alternatively, the sealing block be ceramic filler foam made of sealing block.
9. two level semiconductor damp-proof moisture removing apparatus of controllable temperature according to claim 1, it is characterised in that: the inlet fans
For centrifugal fan, cross flow fan, aerofoil fan or mixed flow fan；The inlet fans be placed on device entrance, outlet or
It is intermediate.
10. two level semiconductor damp-proof moisture removing apparatus of controllable temperature according to claim 1, it is characterised in that: the level-one is cold
Hold the fin of radiator and the level-one hot-side heat dissipation device for sheet, parallel shape, column, radial, screw-type or cast, and
Fin is arranged in in-line or staggered arrangement.
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| CN201910677988.8A CN110500805B (en) | 2019-07-25 | 2019-07-25 | Temperature-controllable two-stage semiconductor moisture-proof and dehumidifying device |
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| CN112556305A (en) * | 2020-11-25 | 2021-03-26 | 赵天芳 | Financial management data cabinet |
| CN114130168A (en) * | 2021-11-10 | 2022-03-04 | 北京京仪自动化装备技术股份有限公司 | Multistage dehumidification device, exhaust gas treatment system and dehumidification control method |
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| CN110500805B (en) | 2021-08-10 |
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