CN219050856U - Low-temperature air dehumidifying device - Google Patents
Low-temperature air dehumidifying device Download PDFInfo
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- CN219050856U CN219050856U CN202223608541.1U CN202223608541U CN219050856U CN 219050856 U CN219050856 U CN 219050856U CN 202223608541 U CN202223608541 U CN 202223608541U CN 219050856 U CN219050856 U CN 219050856U
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Abstract
The embodiment of the utility model provides a low-temperature air dehumidifying device, which comprises: the body is provided with a containing cavity, the first inlet is used for being communicated with the environment bin, the first outlet is used for being communicated with the environment bin, the second inlet is used for being communicated with the external environment, and the second outlet is used for being communicated with the external environment; a semiconductor refrigerator located in the accommodating chamber; the first radiator and the second radiator are positioned in the accommodating cavity and are respectively connected with the semiconductor refrigerator; the first valve component is arranged between the first inlet and the second inlet and is used for controlling the accommodating cavity to be communicated with the first inlet or the second inlet, when the first valve component is in a first state, the first inlet is communicated with the accommodating cavity, and the second inlet is disconnected with the accommodating cavity; when the first valve component is in the second state, the first inlet is disconnected from the accommodating cavity, and the second inlet is communicated with the accommodating cavity.
Description
Technical Field
The embodiment of the utility model relates to the technical field of air dehumidification, in particular to a low-temperature air dehumidification device.
Background
The environment bin system used for the low-temperature environment simulation test of the vehicle is required to be continuously supplemented with fresh air to supply the fresh air to the engine for combustion during operation. The water vapor introduced by fresh air, smoke exhaust and leakage air and gap leakage air is difficult to remove at low temperature, and after the water vapor is continuously accumulated in the bin until the air is in a high-humidity state, condensation water can be formed on the surface of precision test equipment, so that the equipment is damaged. The existing solution is to slowly heat the air in all the environmental bins to above 0 ℃, and then replace the high-humidity air in the environmental bins with dry fresh air to achieve the effect of dehumidification, but the scheme has high energy consumption and high time cost.
Disclosure of Invention
The embodiment of the utility model provides a low-temperature air dehumidifying device, which does not need to slowly warm up the whole environmental bin to normal temperature for dehumidification and then cool down for continuous test, thereby saving time cost.
In a first aspect, an embodiment of the present utility model provides a low-temperature air dehumidifying apparatus for dehumidifying low-temperature air in an environmental chamber, including:
a body having a receiving cavity, the body having a first inlet for communication with the environmental chamber, a second inlet for communication with an external environment, a first outlet for communication with the environmental chamber, and a second outlet for communication with the external environment;
a semiconductor refrigerator located in the accommodating chamber;
a first radiator and a second radiator positioned in the accommodating cavity, wherein the first radiator and the second radiator are respectively connected with the semiconductor refrigerator;
a first valve assembly disposed between the first inlet and the second inlet for controlling the receiving chamber to communicate with either the first inlet or the second inlet, the first inlet communicating with the receiving chamber and the second inlet being disconnected from the receiving chamber when the first valve assembly is in a first state; when the first valve component is in a second state, the first inlet is disconnected from the accommodating cavity, and the second inlet is communicated with the accommodating cavity;
a second valve assembly disposed between the first outlet and the second outlet for controlling the receiving chamber to communicate with the first outlet or the second outlet, the first outlet communicating with the receiving chamber and the second outlet being disconnected from the receiving chamber when the second valve assembly is in a first state; when the second valve assembly is in the second state, the first outlet is disconnected from the receiving cavity, and the second outlet is communicated with the receiving cavity.
Because the low-temperature environment in which the vehicle is simulated is generally established by using an environment cabin, in order to ensure the low-temperature environment, the environment cabin used at present permeates outside air entering the environment cabin to contain water vapor, but the water vapor in the environment cabin is not easy to discharge due to the low-temperature environment, and after the water vapor is continuously accumulated in the cabin until the air is in a high-humidity state, condensation water is formed on the surfaces of various devices in the environment cabin, so that the devices are damaged. The existing method for removing the water vapor in the environmental bin adopts the method that after the air in all the environmental bins is slowly heated to more than 0 ℃, the high-humidity air in the environmental bins is replaced by dry fresh air to realize the effect of dehumidification, but the scheme has high energy consumption and high time cost. Therefore, the first valve component and the second valve component are adopted to change the directions of air inlet and air exhaust entering the accommodating cavity, so that the switching of the two modes of desublimation, dehumidification and defrosting and draining are realized. The semiconductor refrigerator operates to make the first radiator and the second radiator in refrigerating and heating states respectively. The desublimation and dehumidification mode realizes the dehumidification function of low-temperature air, and the defrosting and draining mode melts and discharges ice on the surface of the radiator. The two modes are alternately operated to continuously dehumidify and drain low-temperature air and reduce the energy consumption to the maximum extent. The semiconductor refrigerator has the advantages of no noise, no vibration, no refrigerant, reliable operation, simple operation and high control precision. The heat inertia is small, the maximum temperature difference can be quickly reached, and the refrigeration effect can be obtained without preheating or slow starting to a stable state. Specifically in low temperature air dehydrating unit, when low temperature air dehydrating unit is in the desublimation dehumidification mode, first valve assembly is in first state, first import and hold the chamber intercommunication, the second import is disconnected with hold the chamber, second valve assembly is in first state, first export and hold the chamber intercommunication, the second export is disconnected with hold the chamber, hold the chamber and communicate with the environment storehouse at this moment, the semiconductor refrigerator is by first radiator from the low temperature air heat absorption, make vapor desublimation separation, the heat of absorption is exothermic to low temperature air by the second radiator. The air flowing out of the first radiator and the second radiator is mixed and then returns to the environment bin through the first outlet. When the low-temperature air dehumidifying device is in a defrosting and liquid draining mode, the first valve assembly is in a second state, the first inlet is disconnected from the accommodating cavity, the second inlet is communicated with the accommodating cavity, the first outlet is disconnected from the accommodating cavity, the second outlet is communicated with the accommodating cavity when the second valve assembly is in the second state, the accommodating cavity is communicated with the external environment, after the power supply of the semiconductor refrigerator is cut off, ice on the surface of the radiator is transferred to the normal-temperature air from the external environment, the temperature is slowly increased to a melting point so as to realize the function of defrosting to liquid water, and the liquid water is discharged to the external environment along the direction from the second inlet to the second outlet, namely, the liquid draining function is realized in the atmosphere. Compared with the adsorption rotary dehumidification principle, the adsorption rotary dehumidification principle needs to be heated to more than 100 ℃ for regeneration, and a large amount of energy sources are needed to be consumed. Compared with the vapor compression refrigeration principle, the theoretical thermal efficiency limit is the Carnot cycle efficiency, and the energy consumption of the operation between the low-temperature environment and the normal temperature is higher. The device utilizes the existing low-temperature air as a cold source of the hot end radiator, reduces the temperature difference between the hot end and the cold end of the working circulation, and greatly improves the heat efficiency and the stability.
Optionally, the method further comprises: a blowing assembly located within the receiving cavity;
the blowing assembly drives gas to flow in the accommodating cavity.
Optionally, the first valve component is a two-position three-way electromagnetic valve.
Optionally, the second valve component is a two-position three-way electromagnetic valve.
Optionally, the semiconductor refrigerator further comprises a differential pressure switch, wherein the differential pressure switch is connected with the first valve assembly, the second valve assembly and the semiconductor refrigerator, and the differential pressure switch is arranged at a circulation channel flowing through the first radiator.
Optionally, the semiconductor refrigerator further comprises a temperature switch, wherein the temperature switch is connected with the first valve assembly, the second valve assembly and the semiconductor refrigerator, and the temperature switch is arranged in the accommodating cavity.
Optionally, the device also comprises waste heat recovery equipment positioned in the accommodating cavity, and the waste heat recovery equipment is used for recovering heat of components positioned in the accommodating cavity.
Optionally, the accommodating cavity comprises a first subspace and a second subspace which are communicated;
the second inlet is respectively communicated with the first subspace and the external environment, and the second outlet is respectively communicated with the second subspace and the external environment.
Optionally, a certain height difference exists between the second inlet and the second outlet, and the plane of the second inlet and the plane of the second outlet incline downwards.
Optionally, the blower assembly comprises a fan.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a low-temperature air dehumidifying apparatus according to an embodiment of the present utility model;
fig. 2 is a schematic diagram illustrating an operation state of a low-temperature air dehumidifying apparatus according to an embodiment of the present utility model;
fig. 3 is a second schematic diagram of a working state of the low-temperature air dehumidifying apparatus according to the embodiment of the present utility model.
Icon: a, an environment bin; b-external environment; 1-a body; 11-a first inlet; 12-a second inlet; 13-a first outlet; 14-a second outlet; 15-a receiving cavity; 151-a first subspace; 152-a second subspace; 16-a first heat sink; 17-a second heat sink; 2-semiconductor refrigerator; 3-a first valve component; 4-a second valve component; 5-blowing component.
Detailed Description
In order to make the objects, technical solutions and advantages of the present utility model more apparent, the present utility model will be described in further detail below with reference to the accompanying drawings, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
For convenience of understanding, the following explanation is made about the related terms in the low-temperature air dehumidifying apparatus provided by the embodiment of the present utility model:
environmental bin a: the test room comprises a heat-insulating environment cabin A body, a rotating hub dynamometer pit, a temperature and humidity regulating system, a fresh air and smoke exhausting system, an electrical control cabinet and other equipment. The working range of the temperature is-40 ℃ to +60 ℃, and the ground system is simply called an environmental bin A.
Cooling and dehumidifying: when the wet air is cooled to be below the dew point temperature, water vapor in the air can be condensed into water, and then the aim of dehumidifying the air can be achieved by separating the water. However, when the temperature is lowered below the frost point, water vapor is condensed on the surface of the apparatus, which makes it difficult to separate the frost and hinders the progress of the dehumidification function.
Semiconductor refrigeration: the semiconductor refrigeration is also called electronic refrigeration or thermoelectric refrigeration, and utilizes the Peltier effect of semiconductor material, when the direct current passes through the couple formed from two different semiconductor materials which are series-connected, the two ends of the couple can respectively absorb heat quantity and give off heat quantity so as to implement refrigeration.
Fig. 1 is a diagram of a low-temperature air dehumidifying apparatus according to an embodiment of the present utility model, configured to dehumidify low-temperature air in an environmental chamber a, including:
a body 1 having a receiving cavity 15, the body 1 having a first inlet 11, a second inlet 12, a first outlet 13 and a second outlet 14, wherein the first inlet 11 is for communication with an ambient compartment a, the first outlet 13 is for communication with an ambient compartment a, the second inlet 12 is for communication with an external environment B, and the second outlet 14 is for communication with an external environment B;
a semiconductor refrigerator 2 located in the accommodation chamber 15;
a first heat sink 16 and a second heat sink 17 located in the accommodation chamber 15, the first heat sink 16 and the second heat sink 17 being connected to the semiconductor refrigerator 2, respectively;
a first valve assembly 3 arranged between the first inlet 11 and the second inlet 12 for controlling the communication of the accommodating chamber 15 with the first inlet 11 or the second inlet 12, the first inlet 11 being in communication with the accommodating chamber 15 and the second inlet 12 being disconnected from the accommodating chamber 15 when the first valve assembly 3 is in the first state; when the first valve assembly 3 is in the second state, the first inlet 11 is disconnected from the accommodating chamber 15, and the second inlet 12 is communicated with the accommodating chamber 15;
a second valve assembly 4 disposed between the first outlet 13 and the second outlet 14 for controlling the receiving chamber 15 to communicate with the first outlet 13 or the second outlet 14, the first outlet 13 communicating with the receiving chamber 15 and the second outlet 14 being disconnected from the receiving chamber 15 when the second valve assembly 4 is in the first state; when the second valve assembly 4 is in the second state, the first outlet 13 is disconnected from the receiving chamber 15 and the second outlet 14 is in communication with the receiving chamber 15.
It should be noted that, as shown in fig. 2 and fig. 3, fig. 2 is a schematic diagram of a low-temperature air dehumidifying apparatus in a desublimation dehumidifying state according to an embodiment of the present utility model; fig. 3 is a schematic diagram of the low-temperature air dehumidifying apparatus in a defrosting and draining state. Because the low-temperature environment in which the vehicle is simulated is generally established by using the environment cabin A, in order to ensure the low-temperature environment, the environment cabin A used at present has water vapor in the outside air permeated into the environment cabin A, but the water vapor in the environment cabin A is not easy to discharge due to the low-temperature environment, and after the water vapor is continuously accumulated in the cabin until the air is in a high-humidity state, the water vapor can form condensation water on the surfaces of various devices in the environment cabin A, so that the devices are damaged. The existing method for removing the water vapor in the environmental bin A adopts the method that after the air in the whole environmental bin A is slowly heated to more than 0 ℃, the high-humidity air in the environmental bin A is replaced by dry fresh air to realize the effect of reducing the humidity, but the scheme has high energy consumption and high time cost. Therefore, the first valve component 3 and the second valve component 4 are adopted to change the directions of air inlet and air exhaust entering the accommodating cavity 15, so that the two modes of desublimation, dehumidification and defrosting and draining are switched. The semiconductor refrigerator 2 operates such that the first radiator 16 and the second radiator 17 are in both a cooling state and a heating state, respectively. The desublimation and dehumidification mode realizes the dehumidification function of low-temperature air, and the defrosting and draining mode melts and discharges ice on the surface of the radiator. The two modes are alternately operated to continuously dehumidify and drain low-temperature air and reduce the energy consumption to the maximum extent. The semiconductor refrigerator 2 is noiseless, vibration-free, refrigerant-free, reliable in operation, simple in operation and high in control accuracy. The heat inertia is small, the maximum temperature difference can be quickly reached, and the refrigeration effect can be obtained without preheating or slow starting to a stable state. Specifically, in the cryogenic air dehumidifying apparatus, when the cryogenic air dehumidifying apparatus is in the desublimation mode, the first valve assembly 3 is in the first state, the first inlet 11 is communicated with the accommodating chamber 15, the second inlet 12 is disconnected from the accommodating chamber 15, the second valve assembly 4 is in the first state, the first outlet 13 is communicated with the accommodating chamber 15, the second outlet 14 is disconnected from the accommodating chamber 15, the accommodating chamber 15 is communicated with the environmental chamber a, the semiconductor refrigerator 2 absorbs heat from the cryogenic air by the first radiator 16, the water vapor is desublimated and separated, and the absorbed heat is released from the second radiator 17 to the cryogenic air. The air flowing out of the first radiator 16 and the second radiator 17 is mixed and returned to the environmental chamber a through the first outlet 13. When the low-temperature air dehumidifying device is in a defrosting and liquid discharging mode, the first valve assembly 3 is in a second state, the first inlet 11 is disconnected from the accommodating cavity 15, the second inlet 12 is communicated with the accommodating cavity 15, the first outlet 13 is disconnected from the accommodating cavity 15 when the second valve assembly 4 is in the second state, the second outlet 14 is communicated with the accommodating cavity 15, at the moment, the accommodating cavity 15 is communicated with the external environment B, after the power supply of the semiconductor refrigerator 2 is cut off, ice which is transferred to the surface of the radiator by utilizing normal-temperature air from the external environment B is utilized, the temperature is slowly increased to a melting point so as to realize the function of defrosting to liquid water, and the liquid water is discharged to the external environment B along the direction from the second inlet 12 to the second outlet 14, namely, the liquid discharging function is realized in the atmosphere. Compared with the adsorption rotary dehumidification principle, the adsorption rotary dehumidification principle needs to be heated to more than 100 ℃ for regeneration, and a large amount of energy sources are needed to be consumed. Compared with the vapor compression refrigeration principle, the theoretical thermal efficiency limit is the Carnot cycle efficiency, and the energy consumption of the operation between the low-temperature environment and the normal temperature is higher. The device utilizes the existing low-temperature air as a cold source of the hot end radiator, reduces the temperature difference between the hot end and the cold end of the working circulation, and greatly improves the heat efficiency and the stability.
Of course, in order to increase the efficiency of the low-temperature air dehumidifying apparatus, the low-temperature air dehumidifying apparatus provided in the embodiment of the utility model further includes: a blowing assembly 5 located in the accommodating chamber 15; the blowing assembly 5 drives the gas to flow in the accommodating chamber 15. For example, the blowing assembly 5 includes a fan. The fan motor operation drives the flow of air inside the device, i.e. the fan motor operation drives the movement of air in the containing chamber 15. For example, when in the desublimation state, the first valve assembly 3 is in the first state, the first inlet 11 is communicated with the accommodating cavity 15, the second inlet 12 is disconnected from the accommodating cavity 15, the second valve assembly 4 is in the first state, the first outlet 13 is communicated with the accommodating cavity 15, the second outlet 14 is disconnected from the accommodating cavity 15, the accommodating cavity 15 is communicated with the environment chamber A, the environment chamber A is pumped with low-temperature air through the operation of a fan, the low-temperature air is respectively sent to the first radiator 16 and the second radiator 17, the semiconductor refrigerator 2 absorbs heat from the low-temperature air by the first radiator 16, the water vapor is desublimated and separated, and the absorbed heat is released to the low-temperature air by the second radiator 17; the air flowing out of the first radiator 16 and the second radiator 17 is mixed and then passes through the second valve assembly 4 to return to the environment chamber a. For example, the first heat sink 16 is a cold side heat sink and the second heat sink 17 is a hot side heat sink.
When the low-temperature air dehumidifying device is in a defrosting and liquid discharging mode, the first valve assembly 3 is in a second state, the first inlet 11 is disconnected from the accommodating cavity 15, the second inlet 12 is communicated with the accommodating cavity 15, the first outlet 13 is disconnected from the accommodating cavity 15 when the second valve assembly 4 is in the second state, the second outlet 14 is communicated with the accommodating cavity 15, at the moment, the accommodating cavity 15 is communicated with the external environment B, after the power supply of the semiconductor refrigerator 2 is cut off, ice which is transferred to the surface of the radiator by utilizing normal-temperature air from the external environment B is utilized, the temperature is slowly increased to a melting point so as to realize the function of defrosting to liquid water, and the liquid water is discharged to the external environment B along the direction from the second inlet 12 to the second outlet 14, namely, the liquid discharging function is realized in the atmosphere.
When the low-temperature air dehumidifying device is in a defrosting and liquid discharging mode, the first valve assembly 3 is in a second state, the first inlet 11 is disconnected from the accommodating cavity 15, the second inlet 12 is communicated with the accommodating cavity 15, the first outlet 13 is disconnected from the accommodating cavity 15, the second outlet 14 is communicated with the accommodating cavity 15, the accommodating cavity 15 is communicated with the external environment B at the moment, normal-temperature air is extracted from the atmosphere through driving of the fan motor, namely, the normal-temperature air is extracted from the external environment B, the normal-temperature air is respectively fed into the two radiators, after the power supply of the semiconductor refrigerator 2 is cut off, ice which is transferred to the surfaces of the radiators from the normal-temperature air of the external environment B is utilized, the temperature is slowly increased to reach a melting point so as to realize the function of defrosting to liquid water, and the liquid water is discharged to the external environment B along the direction from the second inlet 12 to the second outlet 14, namely, the liquid water is discharged into the atmosphere to realize the liquid discharging function.
For example, the first valve assembly 3 is a two-position three-way solenoid valve. The second valve component 4 is a two-position three-way electromagnetic valve.
In some specific embodiments, to facilitate switching between the desublimation mode and the defrosting and draining mode, the cryogenic air dehumidifying apparatus provided by the embodiments of the present utility model further includes a differential pressure switch connected to the first valve assembly 3, the second valve assembly 4 and the semiconductor refrigerator 2, the differential pressure switch being disposed at a flow passage through the first radiator 16. Specifically, the water vapor sublimates into solid ice on the cold end radiator surface, which reduces the cross-sectional area of the pipeline and reduces the equivalent diameter of the pipeline. In the case of a constant volume flow of the fan motor, the air flow rate increases with decreasing cross-sectional area. It is known that the resistance to flow along is proportional to the square of the flow rate and inversely proportional to the equivalent diameter of the pipe. Solid ice condensed on the surface of the cold end radiator can increase the on-way resistance of the pipeline, and finally reaches the set value triggering action of the pressure difference switch.
In other specific embodiments, the cryogenic air dehumidifying apparatus provided by the embodiment of the present utility model further includes a temperature switch, wherein the temperature switch is connected to the first valve assembly 3, the second valve assembly 4 and the semiconductor refrigerator 2, and the temperature switch is disposed in the accommodating cavity 15. In the case of a constant temperature of the radiator ventilation air, the cold end temperature of the semiconductor refrigerator 2 is significantly reduced due to condensation of the surface of the radiator, so that the set value of the temperature switch triggers the action.
In other specific embodiments, the cryogenic air dehumidifying apparatus provided by the embodiment of the present utility model further includes a waste heat recovery device located in the accommodating cavity 15, where the waste heat recovery device is used for recovering heat of components located in the accommodating cavity 15. The waste heat recovery device needs to select components nearby for heat recovery, so as to preheat the air entering the accommodating cavity 15 from the atmosphere, thereby improving the heat utilization rate.
For ease of understanding, referring to fig. 2 and 3 together, switching from the desublimation mode to the defrosting drain mode specifically includes:
the first valve assembly 3 opens the pipeline on the side of the environmental chamber a, that is, the first inlet 11 is opened, and low-temperature air is pumped from the environmental chamber a through the driving of the fan motor and is respectively sent to the first radiator 16 and the second radiator 17 of the two radiators. The semiconductor refrigerator 2 absorbs heat from the low-temperature air by the first radiator 16 (cold-end radiator) to desublimate and separate water vapor, and the absorbed heat is released to the low-temperature air by the second radiator 17 (hot-end radiator). After the air flowing out of the cold end radiator and the hot end radiator is mixed, the first outlet 13 is opened through the second valve component 4 and returns to the environment bin A.
The water vapor is sublimated into solid ice on the surface of the cold end radiator, so that the sectional area of the pipeline is reduced, and the equivalent diameter of the pipeline is also reduced. In the case of a constant volume flow of the fan motor, the air flow rate increases with decreasing cross-sectional area. It is known that the resistance to flow along is proportional to the square of the flow rate and inversely proportional to the equivalent diameter of the pipe. Solid ice condensed on the surface of the cold end radiator can increase the on-way resistance of the pipeline, and finally reaches the set value triggering action of the pressure difference switch.
The water vapor is sublimated into solid ice on the surface of the cold-end radiator, so that the sectional area of air flow can be reduced, and the heat exchange area of the radiator can be reduced under the condition that the length of a pipeline is unchanged. Given that the thermal conductivity of ice is 2.3W/(m×k), the thermal conductivity of aluminum metal of the radiator is 238W/(m×k), the heat transfer rate of heat dissipation can be significantly reduced by the ice condensed on the surface of the radiator, and the cold end temperature of the semiconductor refrigerator 2 can be significantly reduced under the condition that the circulating air temperature of the radiator is unchanged, so as to achieve the set value triggering action of the temperature switch.
The action signals of the pressure difference switch and the temperature switch can change the flow direction of the first valve component 3 and the second valve component 4 through the action of the relay, cut off the power supply of the semiconductor refrigerator 2, and realize the mode switching, namely the mode switching from the desublimation and dehumidification mode to the defrosting and draining mode. The waste heat recovery device needs to select heating components nearby for heat recovery, is used for preheating air, and can be started manually or can be started according to a temperature switch. After the action signals of the pressure difference switch and the temperature switch are reset, the defrosting and draining mode still needs to be performed in a delayed mode, the defrosting is ensured to be clean and thorough, and then the mode is switched to the desublimation and dehumidification mode.
After the mode is switched to the defrosting and draining mode, the first valve component 3 and the second valve component 4 open pipelines on the atmosphere side, namely the second inlet 12 and the second outlet 14 are opened, the first inlet 11 and the second outlet 14 are closed, normal-temperature air is extracted from the atmosphere through driving of a fan motor, and the normal-temperature air is respectively sent to the two radiators. After the power supply of the semiconductor refrigerator 2 is cut off, ice which is transferred to the surface of the radiator by normal-temperature air is slowly heated to a melting point so as to realize the function of defrosting to liquid water, and the liquid water is discharged to the atmosphere along the airflow direction of the fan motor through the second outlet 14 to realize the liquid discharging function. The waste heat recovery device needs to select heating components nearby for heat recovery, is used for preheating air, and can be started manually or can be started according to a temperature switch signal.
Because the set values of the pressure difference switch and the temperature switch are not in a completely frosted state, the on-way resistance is in direct proportion to the air density. After the switch is reset, the defrosting and draining functions still need to be performed in a delayed mode, and the defrosting is ensured to be clean and thorough.
The device can perform the circulation of a desublimation and dehumidification mode and a defrosting and draining mode in a small space so as to stabilize the function of effective dehumidification. The function can obviously reduce the energy consumption, the whole environment bin A is not required to be slowly heated to normal temperature for dehumidification and then cooled for continuous test, and the time cost is saved. The device uses the normal temperature air of the external environment B as a heat source for defrosting, and has no energy consumption except a fan motor during defrosting and liquid discharging circulation. The device utilizes the existing low-temperature air as a cold source of the hot end radiator, reduces the temperature difference between the hot end and the cold end of the working circulation, and greatly improves the thermal efficiency and the stability.
In some specific embodiments, the containment chamber 15 includes a first subspace 151 and a second subspace 152 in communication; the second inlet 12 communicates with the first subspace 151 and the external environment B, respectively, and the second outlet 14 communicates with the second subspace 152 and the external environment B, respectively. The second inlet 12 and the second outlet 14 should be kept at a reasonable distance to avoid short-circuiting of the air flow and should not be placed in the same enclosed space.
In some embodiments, there is a height difference between the second inlet 12 and the second outlet 14, and the plane of the second inlet 12 and the second outlet 14 is inclined downward. It is suggested that the pipe between the second inlet 12 and the second outlet 14 is inclined downwards in the direction of the air flow, which is advantageous for accelerating the discharge of liquid water, thereby improving efficiency.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present utility model without departing from the spirit or scope of the utility model. Thus, it is intended that the present utility model also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (10)
1. A cryogenic air dehumidifying apparatus for dehumidifying cryogenic air within an environmental chamber, comprising:
a body having a receiving cavity, the body having a first inlet for communication with the environmental chamber, a second inlet for communication with an external environment, a first outlet for communication with the environmental chamber, and a second outlet for communication with the external environment;
a semiconductor refrigerator located in the accommodating chamber;
a first radiator and a second radiator positioned in the accommodating cavity, wherein the first radiator and the second radiator are respectively connected with the semiconductor refrigerator;
a first valve assembly disposed between the first inlet and the second inlet for controlling the receiving chamber to communicate with either the first inlet or the second inlet, the first inlet communicating with the receiving chamber and the second inlet being disconnected from the receiving chamber when the first valve assembly is in a first state; when the first valve component is in a second state, the first inlet is disconnected from the accommodating cavity, and the second inlet is communicated with the accommodating cavity;
a second valve assembly disposed between the first outlet and the second outlet for controlling the receiving chamber to communicate with the first outlet or the second outlet, the first outlet communicating with the receiving chamber and the second outlet being disconnected from the receiving chamber when the second valve assembly is in a first state; when the second valve assembly is in the second state, the first outlet is disconnected from the receiving cavity, and the second outlet is communicated with the receiving cavity.
2. The cryogenic air dehumidifying device of claim 1, further comprising: a blowing assembly located within the receiving cavity;
the blowing assembly drives gas to flow in the accommodating cavity.
3. The cryogenic air dehumidifying device of claim 2, wherein the first valve assembly is a two-position three-way solenoid valve.
4. A cryogenic air dehumidifying device as claimed in claim 3 wherein the second valve assembly is a two-position three-way solenoid valve.
5. The cryogenic air dehumidification device of any one of claims 1-4, further comprising a pressure differential switch coupled to the first valve assembly, the second valve assembly and the semiconductor refrigerator, the pressure differential switch disposed at a flow path through the first heat sink.
6. The cryogenic air dehumidification device of claim 5, further comprising a temperature switch coupled to the first valve assembly, the second valve assembly, and the semiconductor refrigerator, the temperature switch disposed within the containment chamber.
7. The cryogenic air dehumidifying device of claim 6, further comprising a waste heat recovery apparatus located within the receiving chamber for recovering heat from components located within the receiving chamber.
8. The cryogenic air dehumidifying device of claim 1, wherein the receiving chamber comprises a first subspace and a second subspace in communication;
the second inlet is respectively communicated with the first subspace and the external environment, and the second outlet is respectively communicated with the second subspace and the external environment.
9. The cryogenic air dehumidifying device of claim 8, wherein there is a height difference between the second inlet and the second outlet, the plane of the second inlet and the second outlet being inclined downwardly.
10. The cryogenic air dehumidifying device of claim 2, wherein the blowing assembly comprises a fan.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202223608541.1U CN219050856U (en) | 2022-12-30 | 2022-12-30 | Low-temperature air dehumidifying device |
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| CN202223608541.1U CN219050856U (en) | 2022-12-30 | 2022-12-30 | Low-temperature air dehumidifying device |
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