WO2018006572A1

WO2018006572A1 - Air-cooled refrigerator and dehumidification method thereof

Info

Publication number: WO2018006572A1
Application number: PCT/CN2016/113934
Authority: WO
Inventors: 聂圣源; 姬立胜; 戚斐斐; 刘建如
Original assignee: 青岛海尔股份有限公司
Priority date: 2016-07-06
Filing date: 2016-12-30
Publication date: 2018-01-11
Also published as: CN106196826B; CN106196826A

Abstract

Provided are an air-cooled refrigerator (100) and a dehumidification method thereof. The air-cooled refrigerator (100) comprises a refrigerator body (101) defining a refrigeration compartment (10); an evaporator (40) for cooling air flowing therethrough; an air-blowing channel (11) used to supply the air cooled by the evaporator (40) to the refrigeration compartment (10); an air return channel (12) used to transport the air from the refrigeration compartment (10) to the evaporator (40) for cooling; and one or more semiconductor refrigeration assemblies (50) having respective first temperature-varying ends and respective second temperature-varying ends. The first temperature-varying end of each semiconductor refrigeration assembly (50) is disposed in the air return channel (2). The semiconductor refrigeration assembly (50) is controllable such that the first temperature-varying end and the second temperature-varying end respectively serve as a refrigeration end for lowering a temperature and a heating end for raising the temperature, such that the air entering the air return channel (12) flows through the first temperature-varying end before flowing through the evaporator (40), thereby condensing moisture in the air at the first temperature-varying end. Before the air with a high humidity in the refrigeration compartment (10) returns to the evaporator (40), the moisture contained therein has condensed and removed at the first temperature-varying end, thereby significantly reducing frost build up at the evaporator (40).

Description

Air-cooled refrigerator and dehumidification method thereof

Technical field

The invention relates to the technical field of refrigeration equipment, and in particular to an air-cooled refrigerator and a dehumidification method thereof.

Background technique

The evaporator of the air-cooled refrigerator is disposed independently of the storage compartment, and the air cooled by the evaporator is delivered to the storage compartment through the blower and the air duct. Since the air temperature is always lower than the compartment temperature, there is no room frosting problem. However, the humidity of the air flowing back from the refrigerating chamber to the evaporator is relatively high, and frost is formed on the surface of the evaporator. Increasing the amount of frost on the evaporator will seriously affect its heat exchange efficiency, which in turn affects the refrigeration efficiency of the refrigerator and the stability of the compartment temperature.

At present, the commonly used defrosting method for air-cooled refrigerators is to periodically melt the frost on the evaporator by means of electric heating. This kind of defrosting method will cause the temperature in the storage room to rise, which will affect the preservation of food and bring more energy loss.

Summary of the invention

It is an object of the first aspect of the present invention to overcome at least one of the deficiencies of the prior art and to provide an air-cooled refrigerator that reduces frosting of the evaporator or substantially achieves frost-free operation of the evaporator.

Another object of the first aspect of the present invention is to provide an air-cooled refrigerator to minimize temperature fluctuations in the storage compartment due to defrosting of the evaporator.

It is an object of the second aspect of the present invention to provide a dehumidification method for an air-cooled refrigerator to reduce frosting of the evaporator or substantially achieve frost-free operation of the evaporator.

According to a first aspect of the present invention, there is provided an air-cooled refrigerator comprising: a casing defining a refrigerating compartment therein; an evaporator for cooling air flowing therethrough; and a supply duct configured to Air cooled via the evaporator is supplied to the refrigerating compartment; a return air duct configured to deliver air from the refrigerating compartment to the evaporator for cooling; and having a first temperature-changing end and a At least one semiconductor refrigeration assembly having two temperature-changing ends, wherein a first temperature-varying end of each of the semiconductor refrigeration components is disposed in the return air duct, the semiconductor refrigeration assembly being configured to control-control the first temperature-changing end The second temperature changing end is respectively used as a cooling end with a lowered temperature and a heating end with an increased temperature, so that the air entering the return air passage first flows through the first temperature changing end and then flows through The evaporator is such that moisture therein condenses at the first temperature changing end.

Optionally, the air-cooled refrigerator further includes: a blower configured to be controlled to open to blow air cooled by the evaporator to the air supply duct; the semiconductor refrigeration component is configured to: When the blower is turned on, the first temperature changing end and the second temperature changing end are respectively used as a cooling end with a lowered temperature and a heating end with an increased temperature.

Optionally, the semiconductor refrigeration component is further configured to: when the air blowing mechanism is stopped, make the first temperature changing end and the second temperature changing end respectively serve as a heating end with a rising temperature and a cooling end with a lowered temperature And melting the frost that condenses the first temperature-changing end.

Optionally, the number of the semiconductor refrigeration components is plural, and a plurality of the semiconductor refrigeration components are spaced apart in the air flow direction in the return air duct.

Optionally, in any two adjacent semiconductor refrigeration components, a set temperature when the first temperature-changing end of the semiconductor refrigeration component located upstream is used as a cooling end is lower than a first temperature change of the semiconductor cooling component located downstream The set temperature at the end as the cooling end.

Optionally, the air-cooled refrigerator further includes temperature acquiring means for acquiring the temperature of the refrigerating compartment; and each of the semiconductor refrigeration components is further configured to: when the blower is turned on, if the first variable temperature end thereof When the set temperature of the refrigerating end is greater than or equal to the temperature of the refrigerating compartment, it is in a shutdown state; if the set temperature of the first variable temperature end as the refrigerating end is less than the temperature of the refrigerating compartment, The first temperature changing end and the second temperature changing end respectively serve as a cooling end with a lowered temperature and a heating end with an increased temperature.

Optionally, the semiconductor refrigeration assembly includes a semiconductor refrigeration sheet having a first temperature change surface and a second temperature change surface; a first heat exchanger thermally coupled to the first temperature change surface; and a heat to the second temperature change surface a second heat exchanger connected; wherein the first temperature change surface and the first heat exchanger serve as the first temperature change end; the second temperature change surface and the second heat exchanger as the second Variable temperature end.

Optionally, the semiconductor refrigeration component is disposed on a rear wall of the return air duct, wherein at least the first heat exchanger of the first temperature change end extends into the return air duct; At least the second heat exchanger of the two temperature changing ends extends to the outside of the tank to dissipate heat of the second temperature changing surface into an external environment of the tank.

According to a second aspect of the present invention, there is provided a dehumidifying method for an air-cooled refrigerator, wherein the air-cooled refrigerator includes a refrigerating compartment, an evaporator, and air of the refrigerating compartment is led to the evaporator for cooling Return air duct, and at least one semiconductor system having a first temperature changing end and a second temperature changing end a cooling assembly, wherein the first temperature changing end is located in the return air duct, and the dehumidifying method comprises: causing the first temperature changing end and the second temperature changing end of the semiconductor refrigeration unit to respectively serve as a temperature reducing cooling end and an increase in temperature The heating end is configured to condense moisture in the air flowing through the return air passage.

Optionally, the air-cooled refrigerator further includes a blower for blowing air cooled by the evaporator into the refrigerating compartment, the dehumidifying method further comprising: when the blower is turned on, The first temperature changing end and the second temperature changing end respectively serve as a cooling end with a lowered temperature and a heating end with an increased temperature.

Optionally, the number of the semiconductor refrigeration components is plural, and the set temperature of the plurality of the first cooling terminals of the semiconductor refrigeration components as the cooling end is different, and the dehumidifying method further comprises: acquiring the a temperature of the refrigerating compartment; when the blower is turned on, a set temperature when the first temperature-changing end of each of the semiconductor refrigeration components is used as a refrigerating end is compared with a temperature of the refrigerating compartment, if the semiconductor refrigerating When the first temperature-changing end of the assembly is used as the cooling end, the set temperature is greater than or equal to the temperature of the refrigerating compartment, so that it is in the shutdown state; if the first temperature-changing end is used as the cooling end, the set temperature is less than the refrigerating The temperature of the compartment causes the first temperature-changing end and the second temperature-changing end to serve as a cooling end with a lowered temperature and a heating end with an increased temperature, respectively.

Optionally, the dehumidifying method further includes: when the air blowing mechanism is stopped, the first temperature changing end and the second temperature changing end of the semiconductor refrigeration component are respectively used as a heating end with a rising temperature and a cooling end with a lowered temperature, The frost that condenses the first temperature-changing end is melted.

In the air-cooled refrigerator of the present invention, the air having a relatively high humidity in the refrigerating compartment flows back to the evaporator, and flows through the first temperature-changing end of the semiconductor refrigeration unit in the return air duct as a refrigerating end, wherein the moisture is first The temperature-changing end condenses, so that the air has been dehumidified before returning to the evaporator, greatly reducing the amount of frost on the evaporator.

Further, the air-cooled refrigerator of the present invention reduces the frosting amount of the evaporator by providing the semiconductor refrigeration unit, and improves the heat exchange efficiency of the evaporator. The invention can also prolong the opening interval of the defrosting heating wire, shorten the opening time of the defrosting heating wire, or reduce the heating power of the defrosting heating wire, and even cancel the defrosting heating wire, thereby reducing the power consumption of the refrigerator as a whole. the amount.

Further, the air-cooled refrigerator of the present invention is configured to configure the semiconductor refrigeration unit such that when the blower is turned on, the first temperature-changing end and the second temperature-changing end are respectively used as a refrigerating end and a heating end to be utilized in the refrigerating compartment. The first temperature changing end removes moisture in the air; and when the air blowing mechanism stops, the first temperature changing end and the second temperature changing end are respectively used as a heating end and a refrigerating end, so that when the cooling of the refrigerating compartment is stopped, the first The frost at the temperature-changing end is melted. Since the present invention defrosts the first temperature-changing end in time, Therefore, the first variable temperature end can ensure the coagulation ability to moisture during the opening of the blower, and always has a good dehumidification effect.

Further, in the air-cooled refrigerator of the present invention, a plurality of semiconductor refrigeration components can be disposed in the return air duct such that the set temperature of the cooling end is gradually decreased in the air flow direction in the return air duct to achieve a better dehumidification effect.

The above as well as other objects, advantages and features of the present invention will become apparent to those skilled in the <

DRAWINGS

Some specific embodiments of the present invention are described in detail below by way of example, and not limitation. The same reference numbers in the drawings identify the same or similar parts. Those skilled in the art should understand that the drawings are not necessarily drawn to scale. In the figure:

1 is a schematic side view of an air-cooled refrigerator in accordance with one embodiment of the present invention;

Figure 2 is a partial enlarged view of the portion A of Figure 1;

Figure 3 is a schematic block diagram of an air-cooled refrigerator in accordance with one embodiment of the present invention;

4 is a flow chart of a dehumidification method of an air-cooled refrigerator according to an embodiment of the present invention;

Figure 5 is a flow chart of one embodiment of step S305 in the dehumidification method of Figure 4.

detailed description

1 is a schematic side view of an air-cooled refrigerator in accordance with one embodiment of the present invention. The air-cooled refrigerator 100 may generally include a case 101. The case 101 may include a steel plate outer case having a front side opening, a synthetic resin inner case provided in the inner space of the outer case and having a front side opening, and foaming formed by filling foaming in a gap between the outer case and the inner liner. Polyurethane insulation material. A storage compartment for storing food or the like is formed in the casing 101. Depending on the storage temperature and use, the interior of the storage compartment is divided into a refrigerating compartment 10 and at least one other storage compartment. The other storage compartment may be a freezing compartment 20 or the like. The air-cooled refrigerator 100 further includes a door for opening/closing the refrigerating compartment 10 and other storage compartments, the door being not shown in the drawings.

As can be appreciated by those skilled in the art, the air-cooled refrigerator 100 of the embodiment of the present invention can be cooled by a vapor compression refrigeration cycle system like the existing air-cooled refrigerator. The refrigeration cycle system consists of a compressor condenser, a throttling element, an evaporator, and a refrigeration line and other accessories. The air cooled via the evaporator 40 is supplied to each of the storage compartments to maintain the temperature in each compartment of the storage within a corresponding set temperature range. For the sake of simplicity, except for the evaporator 40, the rest of the refrigeration cycle system The components are not shown in the figure.

The air-cooled refrigerator 100 may further include a blower 30, a blower duct 11, and a return air duct 12. The blower 30 is configured to be controlled to open to blow the air cooled by the evaporator 40 to the blower duct 11. The air supply duct 11 is for supplying the air cooled by the evaporator 40 to the refrigerating compartment 10, and the air that has entered the air supply duct 11 flows into the refrigerating compartment 10 via the air blowing port 111. The return air duct 12 is for conveying air flowing out of the refrigerating compartment 10 to the evaporator 40 for cooling. Under the action of the blower 30, the air cooled via the evaporator 40 enters the blower duct 11 to supply a cooling amount to the refrigerating compartment 10 so that the temperature in the refrigerating compartment 10 is maintained at a set temperature (usually 0 ° C ~ 10 ° C); while the air in the refrigerating compartment 10 flows into the return air duct 12 to flow to the evaporator 40 for re-cooling to form a wind path circulation system.

The humidity of the air in the refrigerating compartment 10 is generally large, and after the air returns from the refrigerating compartment 10 to the evaporator 40, it will condense on the surface of the evaporator 40. To this end, existing solutions usually use electric heating to defrosting, but the power consumption is high, and the storage compartment is also heated.

To this end, the air-cooled refrigerator 100 of the embodiment of the present invention is particularly provided with at least one semiconductor refrigeration unit 50. The semiconductor refrigeration unit 50 has a first temperature changing end 59 and a second temperature changing end 57, and the first temperature changing end 59 is disposed in the return air duct 12. Moreover, the first temperature changing end 59 and the second temperature changing end 57 are respectively used as a cooling end with a lowered temperature and a heating end with a temperature increase, so that the air entering the return air duct 12 first flows through the first temperature changing end 59. It is then passed through the evaporator 40 so that the air has been dehumidified before returning to the evaporator 40, greatly reducing the amount of frost formed by the evaporator 40. In this way, on the one hand, the heat exchange efficiency of the evaporator 40 is improved, on the other hand, the opening interval of the defrosting heating wire can be extended more, or the opening time of the defrosting heating wire can be shortened, or the heating of the defrosting heating wire can be reduced. The power is even removed, and the defrosting heating wire is eliminated, thereby reducing the power consumption of the air-cooled refrigerator 100 as a whole.

Of course, those skilled in the art should understand that according to the semiconductor refrigeration principle, the first temperature changing end 59 can be switched to the heating end by changing the power supply mode, and the second temperature changing end 57 can be switched to the cooling end.

In some embodiments of the invention, the first temperature varying end 59 of the semiconductor refrigeration assembly 50 can be used as a refrigerating end to always dehumidify the air.

In a preferred embodiment, the semiconductor refrigeration assembly 50 is configured to have the first temperature varying end 59 and the second temperature varying end 57 as a refrigeration end and a heating end, respectively, when the blower 30 is turned on. That is to say, when the refrigerating compartment 10 is cooled, dehumidification is performed by the first temperature changing end 59. Further, when the blower 30 is turned off, the first temperature changing end 59 and the second temperature changing end 57 are switched between hot and cold, so that the first temperature changing end 59 serves as a heating end, and the second temperature changing end 57 serves as a cooling end. The purpose of doing this is in the refrigerated compartment 10 When the cooling is stopped, the temperature of the first temperature-changing end 59 is raised to melt the frost which has condensed. The melted water may flow, for example, along the inner wall of the return air duct 12 into the water tray below the evaporator 40, and then to the evaporating dish of the air-cooled refrigerator 100, thereby evaporating the outside of the refrigerator 100 by the heat of the compressor. The structure of the water tray and the evaporating dish belongs to the conventional structure of the existing air-cooled refrigerator, and is not shown in the drawings for the sake of simplicity, and will not be described herein. Defrosting the first temperature-varying end 59 during the shutdown of the blower 30 ensures that the first temperature-varying end 59 has sufficient space for frosting during the opening of the blower 30 to ensure the sustainability of the dehumidification function.

In some embodiments, a plurality of semiconductor refrigeration components 50 may be disposed in the return air duct 12 to enhance the dehumidification effect. A plurality of semiconductor refrigeration components 50 may be spaced apart in the return air duct 12 in the direction of air flow. The set temperature at which the first temperature-changing end 59 of the plurality of semiconductor refrigeration units 50 is used as the cooling end may be set to the same temperature. However, in order to obtain a better effect, preferably, in any two adjacent semiconductor refrigeration components, the set temperature of the first temperature-changing end 59 of the upstream semiconductor refrigeration unit as the cooling end is lower than the downstream semiconductor cooling unit. The first temperature changing end 59 serves as the set temperature at the cooling end. By degrading the temperature of the refrigerating end with the air flow direction, the dehumidification capabilities of the plurality of semiconductor refrigerating assemblies 50 form a plurality of gradients, enhancing the dehumidification effect. For example, five semiconductor refrigeration components 50 can be provided, and the set temperature of the first temperature changing end 59 as the cooling end can be 5 ° C, 0 ° C, -5 ° C, -10 ° C, -20 ° C, that is, -5 The tolerance of °C is decreasing.

Figure 3 is a schematic block diagram of an air-cooled refrigerator in accordance with one embodiment of the present invention. As shown in FIG. 3, in a preferred embodiment of the present invention, the air-cooled refrigerator 100 may further include a temperature acquiring device 60 for acquiring the temperature of the refrigerating compartment 10. In some embodiments, the temperature acquisition device 60 can be at least one temperature sensor that directly captures the temperature of the refrigerating compartment 10 by the temperature detected by the temperature sensor. For example, when the number of temperature sensors is plural, the average temperature of the plurality of temperature sensors is the temperature of the refrigerating compartment 10. In other embodiments, the temperature acquisition device 60 can be directly coupled to the main control panel of the air-cooled refrigerator 100 to obtain the temperature of the refrigerating compartment 10 at the main control panel.

Each semiconductor refrigeration unit 50 is configured such that when the blower 30 is turned on, that is, during the cooling operation of the refrigerating compartment 10, if the set temperature of the first variable temperature end 59 as the refrigerating end is greater than or equal to the temperature of the refrigerating compartment 10, It is in a shutdown state; if the set temperature of the first temperature changing end 59 as the cooling end is lower than the temperature of the refrigerating compartment 10, it is in an open state, and its first temperature changing end 59 and second temperature changing end 57 are The dehumidification is performed by the first temperature changing end 59 as the cooling end of the temperature reduction and the heating end of the temperature increase, respectively.

Figure 2 is a partial enlarged view of the portion A of Figure 1, illustrating the semiconductor refrigeration assembly 50 Specific structure. As shown in FIG. 2, the semiconductor refrigeration package 50 can include a semiconductor refrigeration sheet 51 having a first temperature change surface 57 and a second temperature change surface 56. The first temperature changing end 59 and the second temperature changing end 57 may be the first temperature changing surface 57 and the second temperature changing surface 56, respectively.

In some embodiments, to enhance heat exchange efficiency, the semiconductor refrigeration assembly 50 further includes a heat exchanger and a thermally conductive block. As shown in FIG. 2, the first temperature changing surface 57 is provided with a first heat conducting block 53, and the first heat conducting block 53 is thermally connected to the first heat exchanger 55. The second temperature changing surface 56 is provided with a second heat conducting block 52, and the second heat conducting block 52 is thermally connected to the second heat exchanger 54. At this time, the foregoing first temperature changing end 59 includes a first heat exchanger 55, a first heat conducting block 53 and a first temperature changing surface 57, and the aforementioned second temperature changing end 57 includes a second heat exchanger 54 and a second heat conducting block 52. And a second temperature changing surface 56.

The first heat exchanger 55 and the second heat exchanger 54 function to enhance the heat exchange area, and specifically may be provided as a fin structure.

In some embodiments, the semiconductor refrigeration assembly 50 can be disposed on the rear wall 122 of the return air duct 12. At least the first heat exchanger 55 of the first temperature changing end 59 extends into the return air duct 12, and preferably the first heat exchanger 55 and the first heat conducting block 53 are extended into the return air duct 12 to increase the exchange. Hot area. At least the second heat exchanger 54 of the second temperature changing end 57 extends to the outside of the casing 101, and preferably both the second heat exchanger 54 and the second heat conducting block 52 extend to the outside of the casing 101 to facilitate the second temperature changing surface 56. The heat is sufficiently dissipated into the external environment of the cabinet 101.

In the embodiment shown in FIGS. 1 and 2, the semiconductor refrigeration unit 50 is sandwiched between the rear wall 122 of the return air duct 12 and the rear wall panel 102 of the casing 101, so that the first heat exchanger 55 and the first A heat conducting block 53 extends into the return air duct 12 such that both the second heat exchanger 54 and the second heat conducting block 52 extend to the outside of the casing 101.

Another aspect of the present invention also provides a dehumidification method for an air-cooled refrigerator. The air-cooled refrigerator may be the air-cooled refrigerator 100 of any of the above embodiments, including the refrigerating compartment 10, the evaporator 40, and the return air duct 12 for guiding the air of the refrigerating compartment 10 to the evaporator 40 for cooling, and A semiconductor refrigeration assembly 50 having a first temperature change end 59 and a second temperature change end 57, wherein the semiconductor refrigeration assembly 50 is configured such that air prior to entering the evaporator 40 first flows through the first temperature change end 59.

The dehumidification method includes: making the first temperature changing end 59 and the second temperature changing end 57 of the semiconductor refrigeration unit 50 as a temperature-reducing cooling end and a temperature-increasing heating end, respectively, so as to flow through the first temperature-changing end 59 in the air. The moisture condenses at the first temperature changing end 59.

3 is a flow chart of a dehumidification method of an air-cooled refrigerator in accordance with one embodiment of the present invention. The air-cooled refrigerator 100 further includes an air for blowing the air cooled by the evaporator 40 into the refrigerating compartment 10. The blower 30. The number of the semiconductor refrigeration units 50 may be plural, and the set temperatures at which the first temperature-changing ends 59 of the plurality of semiconductor refrigeration units 50 function as the cooling ends are different. As shown in FIG. 3, the dehumidification method includes at least the following steps:

In step S301, the blower 30 is turned on. The air cooled by the evaporator 40 flows to the blower duct 11 by the blower 30, and flows into the refrigerating compartment 10 through the air outlet 111 to cool the refrigerating compartment 10. At the same time, the air in the refrigerating compartment 10 flows through the return air duct 12 to the evaporator 40 for cooling. It will be understood by those skilled in the art that the evaporator 40 can be turned on simultaneously with the blower 30, or turned on a little before or later.

In step S303, the temperature Tc of the refrigerating compartment 10 is obtained. The temperature Tc of the refrigerating compartment 10 can be measured by providing a temperature sensor or the like in the refrigerating compartment 10, or the temperature Tc of the refrigerating compartment 10 can be directly taken from the main control board.

Step S305, comparing the set temperature T and Tc when the first temperature-changing end 59 of each semiconductor refrigeration unit 50 is used as the cooling end, shutting off the semiconductor refrigeration unit 50 of T≥Tc, and turning on the semiconductor refrigeration unit 50 of T<Tc. And the first temperature changing end 59 is used as a cooling end for dehumidification, and the second temperature changing end 57 is used as a heating end.

In step S307, the blower 30 is turned off. This step is performed after the evaporator 40 is stopped after the temperature Tc of the refrigerating compartment 10 reaches or falls below the temperature set by the user.

In step S309, the first temperature changing end 59 and the second temperature changing end 57 are respectively used as a heating end with a rising temperature and a cooling end with a lowered temperature. The frost condensed at the first temperature changing end 59 is melted due to the temperature rise of the first temperature changing end 59.

In the above dehumidification method, the execution order of step S301 and step S303 may be reversed, that is, the temperature Tc of the refrigerating compartment 10 is first acquired, and the blower 30 is turned on again. Of course, the action of acquiring Tc can also be performed continuously when the air-cooled refrigerator 100 is in operation. When the set temperature of the cooling end of a certain semiconductor refrigeration unit 50 is greater than Tc, it is shut down in time.

Figure 4 is a flow chart of one embodiment of step S305 in the dehumidification method of Figure 3. The above step S305 will be described in detail with the air-cooled refrigerator 100 including three semiconductor refrigeration components as an example. The three semiconductor refrigeration components are respectively a semiconductor refrigeration component 501, a semiconductor refrigeration component 502, and a semiconductor refrigeration component 503. The set temperatures of the first variable temperature ends of the three semiconductor refrigeration components as the cooling ends are T1, T2, and T3, respectively. And T1 < T2 < T3. In such an embodiment, step S305 includes the following steps:

Step S3051, determining the setting of the first temperature-changing end of the semiconductor refrigeration unit 501 as the cooling end Whether the relationship of the constant temperature T1 < Tc is established. If not, the semiconductor refrigeration unit 501 is shut down. If so, step S3053 is performed.

In step S3053, the semiconductor refrigeration unit 501 is turned on.

In step S3055, it is judged whether or not the relationship of the set temperature T2 < Tc when the first temperature-changing end of the semiconductor refrigeration unit 502 is the cooling end is established. If not, the semiconductor refrigeration unit 502 is shut down. If so, step S3057 is executed.

In step S3057, the semiconductor refrigeration unit 502 is turned on.

In step S3058, it is judged whether or not the relationship of the set temperature T3 < Tc when the first temperature-changing end of the semiconductor refrigeration unit 503 is the cooling end is established. If not, the semiconductor refrigeration unit 503 is turned off, and if so, step S3059 is executed.

In step S3059, the semiconductor refrigeration unit 503 is turned on.

In other embodiments, T3 and Tc may also be compared first. If T3 < Tc, the semiconductor refrigeration components 501, 502, and 503 are turned on. If T3 = Tc, the semiconductor refrigeration components 501, 502 are turned on, and the semiconductor refrigeration component 503 is turned off. If T3>Tc, the semiconductor refrigeration unit 503 is turned off, and T2 and Tc are continuously compared.

In some embodiments, energization of the semiconductor refrigerating sheet 51 may be stopped after the frost melting of the first temperature changing end 59 is completed. For example, after the first temperature-changing end 59 and the second temperature-changing end 57 are respectively set as the heating end of the temperature increase and the temperature-reduced cooling end, the semiconductor cooling fins 51 are stopped from being energized. When the blower 30 is turned on again, the semiconductor refrigerating sheet 51 is energized again, so that the first temperature changing end 59 and the second temperature changing end 57 serve as a cooling end with a lowered temperature and a heating end with a raised temperature, respectively.

It should be understood by those skilled in the art that the "air-cooled refrigerator" referred to in the present invention is not limited to an air-cooled refrigerator having a refrigerating compartment and a freezing compartment and storing food in a general sense, and may also have other refrigeration functions. Devices such as wine coolers, refrigerated cans, etc.

In this regard, it will be appreciated by those skilled in the <RTIgt;the</RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; The content directly determines or derives many other variations or modifications consistent with the principles of the invention. Therefore, the scope of the invention should be understood and construed as covering all such other modifications or modifications.

Claims

An air-cooled refrigerator comprising:

a box having a refrigerating compartment formed therein;

An evaporator that cools air flowing therethrough;

a supply air duct configured to supply air cooled via the evaporator to the refrigerating compartment;

a return air duct configured to deliver air from the refrigerating compartment to the evaporator for cooling;

At least one semiconductor refrigeration assembly having a first temperature change end and a second temperature change end, wherein a first temperature change end of each of said semiconductor refrigeration units is disposed in said return air duct, said semiconductor refrigeration unit being configured to controlly The first temperature-changing end and the second temperature-changing end respectively serve as a cooling end with a lowered temperature and a heating end with an increased temperature, so that air entering the return air passage first flows through the first temperature-changing end, and then Flowing through the evaporator to cause moisture therein to condense at the first temperature changing end.
The air-cooled refrigerator of claim 1, further comprising:

a blower configured to be controlled to open to blow air cooled by the evaporator to the air supply duct;

The semiconductor refrigeration unit is configured to: when the blower is turned on, the first temperature change end and the second temperature change end are respectively used as a temperature-reduced cooling end and a temperature-increased heating end.
The air-cooled refrigerator according to claim 2, wherein

The semiconductor refrigeration unit is further configured to: when the air blowing mechanism is stopped, the first temperature changing end and the second temperature changing end are respectively used as a heating end with a rising temperature and a cooling end with a lowered temperature, so as to make The frost that has condensed at the first temperature-changing end melts.
The air-cooled refrigerator according to claim 2, wherein

The number of the semiconductor refrigeration components is plural, and a plurality of the semiconductor refrigeration components are spaced apart in the air flow direction in the return air duct.
The air-cooled refrigerator according to claim 4, wherein

In any two adjacent semiconductor refrigeration modules, a set temperature when the first temperature-changing end of the semiconductor refrigeration component located upstream is used as a cooling end is lower than the semiconductor cooling located downstream The set temperature at which the first temperature-changing end of the component acts as the cooling end.
The air-cooled refrigerator of claim 5, further comprising:

a temperature acquiring device for acquiring a temperature of the refrigerating compartment, and

Each of the semiconductor refrigeration components is further configured to:

When the blower is turned on, if the set temperature of the first variable temperature end as the cooling end is greater than or equal to the temperature of the refrigerating compartment, it is in a shutdown state; if the first variable temperature end is used as the cooling end When the set temperature is lower than the temperature of the refrigerating compartment, the first temperature changing end and the second temperature changing end are respectively used as a cooling end with a lowered temperature and a heating end with an increased temperature.
The air-cooled refrigerator of claim 1, wherein the semiconductor refrigeration package comprises:

a semiconductor refrigeration sheet having a first temperature change surface and a second temperature change surface;

a first heat exchanger thermally coupled to the first temperature change surface;

a second heat exchanger thermally coupled to the second temperature change surface,

Wherein the first temperature change surface and the first heat exchanger serve as the first temperature change end; the second temperature change surface and the second heat exchanger serve as the second temperature change end.
The air-cooled refrigerator according to claim 7, wherein

The semiconductor refrigeration assembly is disposed on a rear wall of the return air duct

At least the first heat exchanger of the first temperature changing end extends into the return air duct;

At least the second heat exchanger of the second temperature changing end extends to the outside of the tank to dissipate heat of the second temperature changing surface into an external environment of the tank.
A dehumidification method for an air-cooled refrigerator, wherein the air-cooled refrigerator includes a refrigerating compartment, an evaporator, a return air duct that guides air of the refrigerating compartment to the evaporator for cooling, and at least one has a semiconductor cooling assembly of a first temperature changing end and a second temperature changing end, wherein the first temperature changing end is located in the return air duct

The dehumidifying method includes: making a first temperature changing end and a second temperature changing end of the semiconductor refrigeration component as a temperature reducing cooling end and a temperature increasing heating end, respectively, so as to flow through the air in the first temperature changing end The moisture condenses.
The dehumidifying method according to claim 9, wherein said air-cooled refrigerator further comprises a blower that blows air cooled by the evaporator to the refrigerating compartment,

The dehumidifying method further includes: when the blower is turned on, the first temperature changing end and the second temperature changing end are respectively used as a cooling end with a lowered temperature and a heating end with an increased temperature.
The dehumidifying method according to claim 10, wherein the number of the semiconductor refrigerating components is plural, and the set temperature at which the first temperature changing ends of the plurality of semiconductor refrigerating components serve as the refrigerating end are different, the dehumidification The method also includes:

Obtaining the temperature of the refrigerating compartment;

Comparing the set temperature of the first temperature-changing end of each of the semiconductor refrigeration components as a cooling end with the temperature of the refrigerating compartment when the blower is turned on,

If the set temperature of the first temperature-changing end of the semiconductor refrigeration unit as the cooling end is greater than or equal to the temperature of the refrigerating compartment, it is in a shutdown state; if the first temperature-changing end thereof is used as a cooling end When the set temperature is lower than the temperature of the refrigerating compartment, the first temperature changing end and the second temperature changing end are respectively used as a cooling end with a lowered temperature and a heating end with an increased temperature.
The dehumidification method according to claim 10, further comprising:

When the air blowing mechanism is stopped, the first temperature changing end and the second temperature changing end of the semiconductor refrigeration component are respectively used as a heating end with a rising temperature and a cooling end with a lowered temperature, so that the first temperature changing end is condensed. The frost melts.