CN113124598A - Refrigerator and control method thereof - Google Patents
Refrigerator and control method thereof Download PDFInfo
- Publication number
- CN113124598A CN113124598A CN201911411324.3A CN201911411324A CN113124598A CN 113124598 A CN113124598 A CN 113124598A CN 201911411324 A CN201911411324 A CN 201911411324A CN 113124598 A CN113124598 A CN 113124598A
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- defrosting water
- defrosting
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- 238000000034 method Methods 0.000 title claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 208
- 238000010257 thawing Methods 0.000 claims abstract description 166
- 239000004065 semiconductor Substances 0.000 claims abstract description 89
- 238000005057 refrigeration Methods 0.000 claims abstract description 62
- 230000017525 heat dissipation Effects 0.000 claims abstract description 40
- 238000005187 foaming Methods 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 9
- 238000004891 communication Methods 0.000 claims description 4
- 239000002274 desiccant Substances 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 11
- 230000001502 supplementing effect Effects 0.000 description 5
- 238000010030 laminating Methods 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000003020 moisturizing effect Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000013589 supplement Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000007791 dehumidification Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011897 real-time detection Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
- F25D19/003—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors with respect to movable containers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
- F25D21/02—Detecting the presence of frost or condensate
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
- F25D21/06—Removing frost
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
- F25D21/14—Collecting or removing condensed and defrost water; Drip trays
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D23/00—General constructional features
- F25D23/10—Arrangements for mounting in particular locations, e.g. for built-in type, for corner type
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
- F25D29/003—Arrangement or mounting of control or safety devices for movable devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
- F25D29/005—Mounting of control devices
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Removal Of Water From Condensation And Defrosting (AREA)
Abstract
The invention discloses a refrigerator, which comprises: the cabinet body, still including reducing the frost module, reduce the frost module including: the defrosting channel is used for communicating the inner space of the cabinet body with the outer space of the cabinet body; the semiconductor refrigeration element comprises a cold end and a hot end, and the cold end heat dissipation piece is positioned on the air inlet flow path of the defrosting channel and can absorb the cold energy of the cold end when the semiconductor refrigeration element operates so as to condense the water vapor in the wet air flowing through the defrosting channel into frost to be attached to the surface of the frost; and the defrosting water collecting module can be at least used for collecting defrosting water on the cold-end radiating piece and radiating the hot end of the semiconductor refrigerating element through the collected defrosting water. The invention solves the problem of high production cost caused by adopting a drying agent to reduce the frost degree in the prior art.
Description
Technical Field
The invention belongs to the field of household electrical equipment, and particularly relates to an improvement of a refrigerator structure with a defrosting module and a defrosting control method of the refrigerator.
Background
At present, a large amount of frosting exists in commercial horizontal freezers, the frosting amount is large, the electricity consumption of the freezer can be increased, and the experience feeling of a user during use is very poor. The important factor influencing the frosting amount in the refrigerator is that when the compressor is started and stopped, the pressure in the refrigerator changes, wet air outside the refrigerator enters the refrigerator through the door gap, and then the wet air is precooled and condensed into frost.
The common method for reducing the frosting amount in the refrigerator is to utilize a vent pipe to be connected with the outside, a drying agent is added into the vent pipe, the ventilation amount of the vent pipe is larger than that of a door seam, and when a compressor of the refrigerator works, outside air enters the refrigerator after being dehumidified by the drying agent through the pre-installed vent pipe, so that the aim of controlling frosting is achieved. However, this method has the problem that the desiccant in the breather tube has a short service life and needs to be replaced periodically, which increases the use cost of the user.
Disclosure of Invention
Aiming at the problem of high production cost caused by dehumidification by adopting a drying agent in the prior art, the invention provides the refrigerator, the defrosting module of the refrigerator can be repeatedly used for defrosting, and the use cost of a user is reduced.
In order to realize the purpose of the invention, the invention is realized by adopting the following technical scheme:
a kind of refrigerator, which is composed of a refrigerator body,
comprises the following steps: the cabinet body, still including reducing the frost module, reduce the frost module including:
the defrosting channel is used for communicating the inner space of the cabinet body with the outer space of the cabinet body;
the semiconductor refrigerating element comprises a cold end and a hot end,
a cold-end heat sink located on the air inlet flow path of the defrosting channel and capable of absorbing cold energy of the cold end when the semiconductor refrigeration element is operated so as to condense water vapor in the humid air flowing through the defrosting channel into frost attached to the surface of the cold-end heat sink;
and the defrosting water collecting module can be at least used for collecting defrosting water on the cold-end radiating piece and radiating the hot end of the semiconductor refrigerating element through the collected defrosting water.
Further, the defrosting water collecting module comprises:
the defrosting water collecting piece is obliquely arranged, a water flow channel is formed in the defrosting water collecting piece, and comprises a defrosting water inlet and a defrosting water outlet, and the defrosting water inlet is positioned at the bottom of an air flow inlet of the defrosting channel;
and the water collecting device is arranged at the bottom of the defrosting water outlet and is used for collecting the defrosting water overflowing from the defrosting water collecting piece.
Furthermore, the defrosting water collecting piece is arranged in a compressor bin, the semiconductor refrigerating element is arranged on the defrosting water collecting piece, the semiconductor refrigerating element and the defrosting water collecting piece are arranged in the same direction in an inclined mode and are attached to the surface of the defrosting water collecting piece through the hot end, the hot end corresponds to the defrosting water collecting piece, and the cold end heat radiating piece is arranged in the compressor bin, is arranged in the same direction in an inclined mode with the semiconductor refrigerating element and is attached to the cold end of the semiconductor refrigerating element.
Further, the frost reducing channel comprises: main passage and drainage channel, drainage channel is located in the compressor storehouse, cold junction radiating piece sets up in the drainage channel, main passage one end with drainage channel intercommunication, the other end with cabinet body inner space intercommunication be equipped with the air inlet grid on the compressor storehouse, drainage channel's entry with the air inlet grid position corresponds.
Furthermore, the main channel comprises an airflow outlet facing the internal space of the cabinet body, and the airflow outlet is provided with a blocking component which can enable airflow to flow from the outside of the box body to the inside of the box body in a one-way mode.
Further, still including the inner bag, be provided with the foaming layer between the cabinet body and inner bag, the defrosting water is collected the piece semiconductor refrigeration element with cold junction radiating piece all inclines to be set up in the foaming layer, semiconductor refrigeration element establishes on the defrosting water is collected the piece and its with the defrosting water is collected piece syntropy slope setting, it pass through the hot junction correspond with the surface laminating of defrosting water is collected, cold junction radiating piece with semiconductor refrigeration element syntropy slope setting and with semiconductor refrigeration element the cold junction laminating.
Further, the defrosting water collecting piece comprises a body part, and a flow guide part and an overflow part which are respectively communicated with the body part and are positioned at two ends of the body part, wherein a water flow channel is formed in the body part, the overflow part is formed by extending downwards from the body part, the flow guide part is formed by extending upwards from the body part, and the height of the joint of the overflow part and the body part is greater than that of the joint of the flow guide part and the body part.
Further comprises an air duct cover plate which is assembled on the inner container and forms an air duct cavity with the inner container,
the evaporator is arranged in the air duct cavity;
the defrosting water collecting module also comprises an evaporator defrosting water collecting module, and the evaporator defrosting water collecting module comprises:
the water receiving element is arranged at the bottom of the evaporator and used for receiving defrosting water flowing down from the evaporator;
and one end of the defrosting water drainage piece is communicated with the water receiving element, and the other end of the defrosting water drainage piece is communicated with the defrosting water collecting piece.
Further, still including the moisturizing device, the moisturizing device with change the white water and collect a intercommunication, and with change the white water and collect a constitution linker be equipped with in the moisturizing device and be used for detecting level height's level sensor.
Further, still including the controller be equipped with temperature sensor on the cold junction radiating element, temperature sensor with the controller communication is connected.
A control method of a refrigerator comprises the following steps:
the whole machine is powered on, the temperature in the cabinet body is detected, when the difference between the temperature in the cabinet body and the starting temperature of the compressor is detected to be smaller than a first threshold value, the temperature of the cold-end heat dissipation piece is detected, when the temperature on the cold-end heat dissipation piece is detected to be larger than a first preset temperature, the semiconductor refrigeration element is controlled to supply power for refrigeration in the positive direction, and when the temperature on the cold-end heat dissipation piece is detected to be smaller than a second preset temperature, the semiconductor refrigeration element is controlled to be in a stop working state;
when the semiconductor refrigeration element stops working, the working state of the compressor is detected, the compressor is detected to stop, the first preset time is exceeded, the time that the temperature on the cold-end heat dissipation part is lower than the second preset temperature exceeds the second preset time, the semiconductor refrigeration element is controlled to supply power reversely to defrost the cold-end heat dissipation part, and when the temperature on the cold-end heat dissipation part is detected to reach the third preset temperature, the semiconductor refrigeration element is controlled to stop supplying power reversely to defrost.
Compared with the prior art, the invention has the advantages and positive effects that:
the invention provides a refrigerator, which comprises a defrosting channel, wherein when the refrigerator runs, external air enters the interior of a refrigerator body from the outside through the defrosting channel due to the negative pressure effect, wet air flow entering the interior of the refrigerator body passes through a cold end heat dissipation part in contact with a cold end of a semiconductor, the cold end heat dissipation part absorbs cold end energy of a semiconductor refrigeration element, the temperature is reduced, water vapor in the air flow is condensed on the cold end heat dissipation part and frosts, the air entering the refrigerator body is dry air, frost is prevented from being condensed on an inner container of the refrigerator body, frost control and defrosting are realized, and meanwhile, the cold end heat dissipation part can be repeatedly used after defrosting, so that the use cost is reduced compared with a drying agent mode;
in addition, the heat of the hot end of the semiconductor refrigeration element is radiated by the defrosting water of the cold end radiating piece directly, the hot end of the semiconductor refrigeration element is radiated by the defrosting water, a radiating device does not need to be additionally arranged, and the production cost is reduced.
Other features and advantages of the present invention will become more apparent from the following detailed description of the invention when taken in conjunction with the accompanying drawings.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a first structural schematic diagram of a freezer in which a frost reducing module is disposed in a compressor compartment;
FIG. 2 is an enlarged view of a portion of FIG. 1 at A;
FIG. 3 is a second schematic structural view of the freezer showing a defrosting module disposed in a compressor compartment according to the present invention;
fig. 4 is a third structural schematic view of the freezer of the present invention with the frost reducing module disposed in the compressor compartment;
fig. 5 is a schematic structural view of the refrigerator of the present invention with the frost reducing module disposed in the foam layer;
FIG. 6 is a first schematic structural view of the refrigerator according to the present invention when it is an air-cooled refrigerator;
FIG. 7 is a partial enlarged view of FIG. 6 at B;
fig. 8 is a control flow chart of the refrigerator of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings and examples.
It should be noted that in the description of the present invention, the terms of direction or positional relationship indicated by the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, which are merely for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The invention provides an embodiment of a refrigerator, which is shown in figures 1-8 and comprises: the cabinet body 110 is provided with a storage space for storing articles inside the cabinet body 110, the cabinet body 110 is provided with an inner container 120 inside, a foaming cavity is formed between the cabinet body 110 and the inner container 120, a foaming material is arranged in the foaming cavity, the foaming material correspondingly forms a foaming layer 130 positioned between the cabinet body 110 and the inner container 120, a cabinet opening is arranged above the cabinet body 110, and a cabinet door is arranged on the cabinet opening.
The cabinet body 110 is further provided with a compressor bin 600 inside, a compressor is arranged in the compressor bin 600, and the compressor is connected with the evaporator to control the evaporator to run and refrigerate.
The refrigerator in the embodiment also comprises an air duct cover plate, the air duct cover plate is assembled on the inner container 120 and between the inner container 120 and forms an air duct cavity, and the evaporator is arranged in the air duct cavity; still be equipped with air supply arrangement in the wind channel intracavity, be provided with air intake and air exit on the wind channel apron, when refrigerating, when the compressor control evaporimeter refrigerates the operation, can be formed with the negative pressure in the internal space of cabinet 110, make outside humid air get into the internal portion of cabinet 110, air supply arrangement during operation induced drafts from the internal portion of cabinet 110 through the air intake, make the inside humid air stream of the cabinet 110 discharge the refrigeration to the cabinet 110 in order to realize from the air exit after the evaporimeter heat transfer in the cabinet 110, the humid air that is located the incasement can frost on the evaporimeter surface when the evaporimeter, for avoiding frosting on the evaporimeter, it is used for carrying out the frost reduction module that reduces to correspond in this embodiment.
Preferably, the frost reducing module comprises:
a frost reducing passage 200 for communicating an inner space of the cabinet 110 with an outer space of the cabinet 110;
the semiconductor refrigeration element 300, preferably, the semiconductor refrigeration element 300 is a semiconductor refrigeration sheet, and includes a cold end 310 and a hot end 320, wherein when the semiconductor refrigeration element is powered on, the cold end 310 can generate cold, and the hot end 320 can generate heat.
The cold-end heat sink 400 is located on the air inlet flow path of the defrosting channel 200, and can absorb cold energy of the cold end 310 to condense water vapor in the wet air flowing through the defrosting channel 200 into frost attached to the surface of the wet air, so as to ensure that the air entering the cabinet 110 is dry air, and thus the water vapor is not condensed on the surface of the evaporator to frost, and the defrosting is realized.
The defrosting water collecting module 500 may be at least configured to collect defrosting water on the cold-end heat sink 400, and dissipate heat of the hot end 320 of the semiconductor refrigeration element 300 through the collected defrosting water.
A preferred embodiment of the defrosted water collection module 500 in this embodiment is: it comprises the following components:
the defrosting water collecting member 510 is formed with a water flow passage therein in an inclined manner, and the defrosting water collecting member 510 includes a defrosting water inlet 511 and a defrosting water outlet 512. The defrosting water inlet 511 is located at the bottom position of the air flow inlet of the defrosting passage 200, and facilitates receiving the defrosting water in the defrosting passage 200.
Specifically, the defrosting water collecting member 510 includes a main body 513, and a flow guiding portion 514 and an overflow portion 515 which are respectively communicated with the main body 513 and are located at two ends of the main body 513, wherein a water flow passage is formed in the main body 513, and water flows in the water flow passage when flowing into the main body 513, the overflow portion 515 is formed by extending downwards from the main body 513, the flow guiding portion 514 is formed by extending upwards from the main body 513, and the height of the connection between the overflow portion 515 and the main body 513 is greater than the height of the connection between the flow guiding portion 514 and the main body 513, that is, the main body 513 is arranged obliquely from top to bottom, so that the main body 513 of the defrosting water collecting member 510 is filled with defrosting water all the time, and the heat dissipation effect on the hot end 320.
Specifically, the flow guiding part 514 may be a flow guiding channel communicated with the main body part 513, the overflow part 515 may be an overflow channel communicated with the main body part 513, and the water collecting device 520 is disposed at the bottom of the overflow part 515 and is used for collecting the defrosting water overflowing from the main body part 513. The flow guide part 514 is used for guiding the defrosting water discharged from the defrosting channel 200 into the body part 513, the overflow part 515 is used for discharging the water when the defrosting water in the body part 513 is more, and the defrosting water inlet 511 is arranged at the top of the flow guide part 514; the defrosting water outlet 512 is provided at the bottom of the overflow portion 515.
When cold junction 310 fin defrosting, the defrosting water can be followed and is subtracted frosting passageway 200 and discharge downwards, and then enter into defrosting water collection piece 510 through defrosting water entry 511, the defrosting water of its inside storage accessible defrosting water export 512 discharges to in the water-collecting device 520 when more, water-collecting device 520 can be corresponding chooseing for use water-collecting box or water-collecting tray, and is preferred, and its laminating compressor lateral wall sets up, can absorb the heat that the compressor sent, carries out partial evaporation to its inside defrosting water, prevents to change the defrosting water and spills over.
As an arrangement manner of the defrosted water collecting member 510, the semiconductor refrigeration element 300, and the cold-end heat sink 400 in the present embodiment, there are: the defrosting water collecting piece 510 is obliquely arranged in the compressor bin 600, the semiconductor refrigerating element 300 is arranged on the defrosting water collecting piece 510, the defrosting water collecting piece 510 and the semiconductor refrigerating element are obliquely arranged in the same direction, the defrosting water collecting piece 510 and the semiconductor refrigerating element 300 are correspondingly attached to the surface of the defrosting water collecting piece 510 through the hot end 320, and the cold end heat dissipation piece 400 is arranged in the compressor bin 600, obliquely arranged in the same direction as the semiconductor refrigerating element 300 and attached to the cold end 310 of the semiconductor refrigerating element 300.
The arrangement of the defrosting channel 200 corresponding to the arrangement of the defrosting water collecting piece 510, the semiconductor refrigerating element 300 and the cold-end heat sink 400 is as follows: the frost reducing passage 200 includes: main channel 210 and drainage channel 220, drainage channel 220 is located compressor bin 600, cold junction heat sink 400 part sets up in the drainage channel 220, and the part is laminated with semiconductor refrigeration component 300's cold junction 310 in the drainage channel 220, for realizing with the cooperation of cold junction heat sink 400, drainage channel 220 also inclines to set up, main channel 210 one end and drainage channel 220 intercommunication, the other end and cabinet body 110 inner space intercommunication, main channel 210 part when setting up is located compressor bin 600 and docks with drainage channel 220, then follows compressor bin 600 to the inside setting that extends of sales counter, and is specific, and it alternates to set up in foaming layer 130 be equipped with the air inlet grid on compressor bin 600, the entry and the air inlet grid position of drainage channel 220 are to corresponding the setting.
When the freezer is in operation, the compressor, semiconductor refrigeration component 300 operation, outside humid air enters into drainage channel 220 through air-inlet grille, through cold junction heat dissipation piece 400, then enter into cabinet body 110 through main entrance 210 inside, because cold junction heat dissipation piece 400 and the laminating of semiconductor refrigeration component 300 cold junction 310, its temperature is lower, when humid air current passes through it, steam can be adsorbed on its surface and condense into the frost, and then make and then the air that arrives cabinet body 110 inside be dry air, the internal air humidity of cabinet body 110 has been reduced, and then frost has been avoided condensing on the evaporimeter, the frost reduction has been realized.
Meanwhile, when the cold-end heat sink 400 is defrosted, the defrosted water can be stored inside the cold-end heat sink through the defrosted water collecting member 510, and the heat of the hot end 320 of the semiconductor refrigeration element 300 is absorbed by the defrosted water inside the semiconductor refrigeration element 300 through being attached to the hot end 320 of the semiconductor refrigeration element 300, so that the heat dissipation effect on the semiconductor refrigeration element 300 is realized.
Meanwhile, in the embodiment, the defrosting water collecting piece 510, the semiconductor refrigeration element 300 and the cold-end heat sink 400 are all arranged in the compressor bin 600, so that the concealed arrangement is realized;
furthermore, as the airflow inlet of the frost reducing channel 200 is not arranged externally, the problem of damage caused by exposure is avoided;
finally, because the defrosting water collecting piece 510, the semiconductor refrigerating element 300 and the cold-end heat radiating piece 400 are all arranged in the compressor bin 600, pipelines do not need to be arranged between the air inlet grille and the cold-end heat radiating piece 400, the length of the channel corresponding to the defrosting channel 200 is shortened, and the problem that the defrosting channel 200 is easy to block due to too long length is solved.
Further, the main channel 210 includes an airflow outlet 211 facing the inner space of the cabinet 110, and a blocking component 230 is disposed at the airflow outlet 211 and is capable of making the airflow flow in a single direction, preferably, the blocking component 230 in this embodiment is a one-way sealing plug, when the temperature in the box is lowered and negative pressure is generated in the box, the humid air can enter the cabinet 110 through the cold-end heat sink 400, the frost-reducing channel 200 and the one-way sealing plug, but when the temperature in the box is raised, the cold air in the box cannot flow in the frost-reducing channel 200 in a reverse direction through the one-way sealing plug, so as to reduce the loss of cold in the box. Meanwhile, when the semiconductor refrigeration element 300 supplies power to defrost the cold-end heat dissipation element 400, water vapor generated by the cold-end heat dissipation element 400 can be effectively blocked, and is prevented from entering the cabinet body 110 and frosting inside the cabinet body 110.
As another arrangement of the defrosted water collecting member 510, the semiconductor cooling element 300, and the cold-side heat sink 400 in the present embodiment, there are: the defrosting water collecting piece 510, the semiconductor refrigerating element 300 and the cold end heat dissipation piece 400 are obliquely arranged in the foaming layer 130, specifically, the semiconductor refrigerating element 300 is arranged on the defrosting water collecting piece 510 and obliquely arranged in the same direction as the defrosting water collecting piece 510, the semiconductor refrigerating element is correspondingly attached to the surface of the defrosting water collecting piece 510 through the hot end 320, and the cold end heat dissipation piece 400 and the semiconductor refrigerating element 300 are obliquely arranged in the same direction and attached to the cold end 310 of the semiconductor refrigerating element 300. The defrosting water collecting piece 510, the semiconductor refrigeration element 300 and the cold-end heat sink 400 are sequentially and obliquely arranged, so that the defrosting water generated by the cold-end heat sink 400 can smoothly flow into the defrosting water collecting piece 510.
In addition, with the defrosting water collection piece 510, semiconductor refrigeration component 300 and cold end heat dissipation piece 400 all set up in foaming layer 130 with the above the setting mode of setting in compressor bin 600 compare, can avoid cold end heat dissipation piece 400 to absorb the too much steam in compressor bin 600, improve the frost reduction effect of the module that subtracts frost.
In this embodiment, the defrosting water collecting module 500 further includes an evaporator defrosting water collecting module 530 for collecting defrosting water on the evaporator, and specifically, the evaporator defrosting water collecting module 530 includes:
and a water receiving element 531 arranged at the bottom of the evaporator for receiving the defrosting water flowing down from the evaporator.
The defrosting water drainage piece 532 is communicated with the water receiving element 531 at one end and the defrosting water collecting element 510 at the other end, and the defrosting water drainage piece 532 can be a defrosting water drainage tube which can drain the defrosting water on the evaporator on the water receiving element 531 into the defrosting water collecting element 510 so as to absorb and dissipate heat of the hot end 320 of the semiconductor refrigerating element 300.
When the hot end 320 of the semiconductor refrigeration element 300 is cooled, the situation that the water source is insufficient may occur only by using the defrosting water of the semiconductor itself, the water supplement device 700 is correspondingly arranged in the embodiment, preferably, the water tank can be selected as the water supplement device 700 in the embodiment, in order to achieve the heat dissipation function, the water tank can be formed by splicing a plurality of metal plates, the metal plates are adopted to enable the water tank to have a good heat dissipation effect, and the placement position of the water tank can be located in the compressor bin 600 or on the outer side wall of the cabinet body 110, so as to enhance the heat dissipation effect.
The water supplementing device 700 is communicated with the defrosting water collecting piece 510 and forms a communicating vessel with the defrosting water collecting piece 510, so that the liquid level in the defrosting water collecting piece 510 can be always consistent with the liquid level of the water supplementing device 700, 2 connecting pipes can be arranged between the water supplementing device 700 and the defrosting water collecting piece 510 during specific connection, one connecting pipe is connected between the water supplementing device 700 and the bottom of the defrosting water collecting piece 510, and the other connecting pipe is connected between the water supplementing device 700 and the top of the defrosting water collecting piece 510.
Because the defrosting water in the water flow channel of the defrosting water collecting piece 510 can absorb the heat of the hot end 320 of the semiconductor refrigeration element 300, the heating temperature of the water inside the defrosting water collecting piece is increased, and the water density of the heated water is lower than that of the water at the same height of the water tank, the defrosting water in the defrosting water collecting piece 510 can move upwards, so that the water in the water replenishing device 700 flows into the condensed water collecting piece to replenish the condensed water collecting piece, the water flows in the joint part of the defrosting water collecting piece 510 and the hot end 320 of the semiconductor refrigeration element 300, and the heat dissipation effect on the hot end 320 of the semiconductor refrigeration element 300 is ensured. On the contrary, the density of the water after being cooled becomes large, and the defrosting water in the defrosting water collecting piece 510 moves downwards and reversely flows into the water replenishing device 700, so that the circulation of the defrosting water collecting piece 510 and the water in the water tank is realized.
In order to ensure that water flows exist in the defrosting water collecting member 510 and ensure the heat dissipation effect of the defrosting water collecting member 510 on the hot end 320 of the semiconductor refrigeration element 300, a liquid level sensor 710 for detecting the liquid level height of the water replenishing device 700 is further arranged in the water replenishing device 700 in the embodiment.
When the liquid level sensor 710 detects that the liquid level in the water replenishing device 700 is lower than the set water level, a signal can be transmitted to the controller, meanwhile, an alarm element can be correspondingly arranged and is in communication connection with the controller, and when the controller receives the signal of the liquid level sensor 710, the alarm element can be correspondingly controlled to give an alarm indication, so that a user can manually add water into the water tank.
For the realization to the detection of the frost condition of cold junction radiating piece 400, be equipped with temperature sensor on cold junction radiating piece 400 in this embodiment, temperature sensor with the controller communication is connected, but through establishing the temperature of the temperature sensor real-time detection cold junction radiating piece 400 surface department on cold junction radiating piece 400, and then determine the frost condition of cold junction radiating piece 400 according to the temperature on cold junction radiating piece 400, when the frost layer of condensing on cold junction radiating piece 400 is thick, because frost parcel cold junction radiating piece 400, can detect cold junction radiating piece 400 temperature value on the surface this moment is lower, when the frost layer of condensing on cold junction radiating piece 400 is thin, can detect cold junction radiating piece 400 temperature value on the surface is higher.
The invention provides a control method of a refrigerator, which comprises the following steps:
the control method of the compressor comprises the following steps: the control of the compressor is mainly realized by controlling the temperature in the cabinet body 110, the temperature in the cabinet body 110 is detected, the compressor is controlled to start when the temperature in the cabinet body 110 reaches the starting temperature of the compressor, and the compressor is controlled to stop when the temperature in the cabinet body 110 reaches the stopping temperature of the compressor;
the control method of the semiconductor refrigeration element 300 comprises the following steps: after the refrigerator is started, detecting the temperature in the cabinet body 110, detecting the temperature of the cold-end heat sink 400 when detecting that the difference between the temperature in the cabinet body 110 and the compressor starting temperature is smaller than a first threshold, where the first threshold may be set according to an actual situation, for example, the first threshold may be 0.5 ℃, and the temperature in the cabinet body 110 is mainly used to determine whether the temperature of the cabinet body 110 is about to reach the compressor starting temperature and whether the compressor is about to start up, and if the temperature in the cabinet body 110 is detected to be smaller than the first threshold, it indicates that the compressor is about to start up, because the temperature of the semiconductor refrigeration element 300 cannot reach the temperature required by the cold-end heat sink 400 for defrosting when powered on, at this time, after the compressor is started up, part of water vapor may enter the cabinet body 110 to cause the evaporator to frost, in this embodiment, to ensure the defrosting effect, the temperature of the cold-end heat sink 400, when the temperature of the cold-end heat sink 400 is detected to be higher than a first preset temperature, the temperature of the cold-end heat sink 400 is higher, at the moment, in order to achieve a better frost control effect, the semiconductor refrigeration element 300 is controlled to supply power and refrigerate in the positive direction to cool the cold-end 310 heat sink, so that the temperature of the cold-end 310 heat sink can be reduced when the compressor is started, the adsorption effect on wet air is achieved, when the temperature of the cold-end heat sink 400 is lower than a second preset temperature, the semiconductor refrigeration element 300 can be controlled to stop refrigerating, and at the moment, the adsorption on water vapor can be achieved without refrigerating through cold energy on the cold-end heat sink 400;
in the operation process after the compressor is started and after the compressor is stopped, the semiconductor refrigeration element 300 is controlled by detecting the temperature on the cold-end heat sink 400: when the temperature of the cold-end heat sink 400 is lower than the second preset temperature, the semiconductor refrigeration element 300 is controlled to stop refrigerating, and when the temperature of the cold-end heat sink 400 is higher than the first preset temperature, the semiconductor refrigeration element 300 is controlled to refrigerate and lower the temperature.
When the semiconductor refrigeration element 300 stops supplying power, the working state of the compressor is detected, and when the compressor is detected to stop for more than a first preset time and the time that the temperature of the cold-end heat dissipation element 400 is lower than a second preset temperature is detected to exceed a second preset time, the semiconductor refrigeration element 300 is controlled to supply power reversely to defrost the cold-end heat dissipation element 400,
the compressor shutdown time is detected to exceed the first preset time, the negative pressure is mainly used for judging whether negative pressure still exists in the cabinet body 110, when the compressor shutdown time exceeds the first preset time, the negative pressure in the cabinet body 110 is eliminated, the cold-end heat dissipation part 400 is defrosted by controlling the semiconductor refrigeration element 300 to reversely supply power, and when the temperature of the cold-end heat dissipation part 400 is detected to reach the third preset temperature, the semiconductor refrigeration element 300 is controlled to stop reversely supplying power to defrosted.
When the compressor downtime is less than the first preset time, negative pressure may still exist inside the cabinet body 110, at this time, the temperature of the cold-end heat dissipation member still needs to be continuously detected, when the temperature of the cold-end heat dissipation member 400 is greater than the first preset temperature, the semiconductor refrigeration element 300 is controlled to operate to perform refrigeration, and when the temperature of the cold-end heat dissipation member 400 reaches the second preset temperature, the semiconductor refrigeration element 300 is controlled to stop refrigeration.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions.
Claims (11)
1. A kind of refrigerator, which is composed of a refrigerator body,
comprises the following steps: a cabinet body is arranged in the cabinet body,
its characterized in that still including reducing the frost module, reduce the frost module including:
the defrosting channel is used for communicating the inner space of the cabinet body with the outer space of the cabinet body;
the semiconductor refrigeration element comprises a cold end and a hot end;
a cold-end heat sink located on the air inlet flow path of the defrosting channel and capable of absorbing cold energy of the cold end when the semiconductor refrigeration element is operated so as to condense water vapor in the humid air flowing through the defrosting channel into frost attached to the surface of the cold-end heat sink;
and the defrosting water collecting module can be at least used for collecting defrosting water on the cold-end radiating piece and radiating the hot end of the semiconductor refrigerating element through the collected defrosting water.
2. The cooler of claim 1,
the defrosting water collecting module comprises:
the defrosting water collecting piece is obliquely arranged, a water flow channel is formed in the defrosting water collecting piece, and comprises a defrosting water inlet and a defrosting water outlet, and the defrosting water inlet is positioned at the bottom of an air flow inlet of the defrosting channel;
and the water collecting device is arranged at the bottom of the defrosting water outlet and is used for collecting the defrosting water overflowing from the defrosting water collecting piece.
3. The cooler of claim 2,
the defrosting water collecting piece is arranged in a compressor bin, the semiconductor refrigerating element is arranged on the defrosting water collecting piece, the defrosting water collecting piece and the defrosting water collecting piece are arranged in an inclined mode in the same direction and are attached to the surface of the defrosting water collecting piece through the hot end, the hot end corresponds to the surface of the defrosting water collecting piece, and the cold end heat radiating piece is arranged in the compressor bin, is arranged in an inclined mode in the same direction of the semiconductor refrigerating element and is attached to the cold end of the semiconductor refrigerating element.
4. The cooler with the frost reducing module of claim 3, wherein the frost reducing channel comprises: main passage and drainage channel, drainage channel is located in the compressor storehouse, cold junction radiating piece sets up in the drainage channel, main passage one end with drainage channel intercommunication, the other end with cabinet body inner space intercommunication be equipped with the air inlet grid on the compressor storehouse, drainage channel's entry with the air inlet grid position corresponds.
5. The refrigerator with the frost reducing module of claim 3, wherein the main channel comprises an airflow outlet facing the inner space of the cabinet, and a baffle component capable of making airflow flow from the outside to the inside of the cabinet in one direction is arranged at the airflow outlet.
6. The refrigerator of claim 2, further comprising an inner container, wherein a foaming layer is arranged between the refrigerator body and the inner container, the defrosting water collecting part, the semiconductor refrigerating element and the cold end heat dissipating part are obliquely arranged in the foaming layer, the semiconductor refrigerating element is arranged on the defrosting water collecting part and obliquely arranged in the same direction as the defrosting water collecting part, the semiconductor refrigerating element is attached to the surface of the defrosting water collecting part through the hot end correspondingly, and the cold end heat dissipating part is obliquely arranged in the same direction as the semiconductor refrigerating element and attached to the cold end of the semiconductor refrigerating element.
7. The refrigerator according to any one of claims 2 to 6, wherein the defrosted water collecting member includes a body portion, a flow guide portion and an overflow portion communicating with the body portion at both ends of the body portion, respectively, the body portion forming a water flow passage therein, the overflow portion being formed to extend downward from the body portion, the flow guide portion being formed to extend upward from the body portion, and a height of a junction of the overflow portion and the body portion being greater than a height of a junction of the flow guide portion and the body portion.
8. The cooler of claim 6,
also comprises an air duct cover plate which is assembled on the inner container and forms an air duct cavity with the inner container,
the evaporator is arranged in the air duct cavity;
the defrosting water collecting module also comprises an evaporator defrosting water collecting module, and the evaporator defrosting water collecting module comprises:
the water receiving element is arranged at the bottom of the evaporator and used for receiving defrosting water flowing down from the evaporator;
and one end of the defrosting water drainage piece is communicated with the water receiving element, and the other end of the defrosting water drainage piece is communicated with the defrosting water collecting piece.
9. The refrigerator of claim 7, further comprising a water replenishing device, wherein the water replenishing device is communicated with the defrosting water collecting part and forms a communicating vessel with the defrosting water collecting part, and a liquid level sensor for detecting the liquid level height is arranged in the water replenishing device.
10. The refrigerator of claim 1 further comprising a controller, wherein a temperature sensor is disposed on the cold end heat sink, and the temperature sensor is in communication with the controller.
11. A control method of a refrigerator is characterized by comprising the following steps:
the whole machine is powered on, the temperature in the cabinet body is detected, when the difference between the temperature in the cabinet body and the starting temperature of the compressor is detected to be smaller than a first threshold value, the temperature of the cold-end heat dissipation piece is detected, when the temperature on the cold-end heat dissipation piece is detected to be larger than a first preset temperature, the semiconductor refrigeration element is controlled to supply power for refrigeration in the positive direction, and when the temperature on the cold-end heat dissipation piece is detected to be smaller than a second preset temperature, the semiconductor refrigeration element is controlled to be in a stop working state;
when the semiconductor refrigeration element stops working, the working state of the compressor is detected, the compressor is detected to stop, the first preset time is exceeded, the time that the temperature on the cold-end heat dissipation part is lower than the second preset temperature exceeds the second preset time, the semiconductor refrigeration element is controlled to supply power reversely to defrost the cold-end heat dissipation part, and when the temperature on the cold-end heat dissipation part is detected to reach the third preset temperature, the semiconductor refrigeration element is controlled to stop supplying power reversely to defrost.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113908385A (en) * | 2021-10-14 | 2022-01-11 | 东莞先导先进科技有限公司 | Infusion device |
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| CN113124598B (en) | 2023-11-14 |
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