CN113124597B - Refrigerator and frost reduction control method thereof - Google Patents
Refrigerator and frost reduction control method thereof Download PDFInfo
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- CN113124597B CN113124597B CN201911411323.9A CN201911411323A CN113124597B CN 113124597 B CN113124597 B CN 113124597B CN 201911411323 A CN201911411323 A CN 201911411323A CN 113124597 B CN113124597 B CN 113124597B
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- 238000000034 method Methods 0.000 title claims description 17
- 238000010257 thawing Methods 0.000 claims abstract description 157
- 239000004065 semiconductor Substances 0.000 claims abstract description 64
- 238000005057 refrigeration Methods 0.000 claims abstract description 63
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 27
- 235000013305 food Nutrition 0.000 claims abstract description 26
- 230000017525 heat dissipation Effects 0.000 claims description 45
- 238000009423 ventilation Methods 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 16
- 238000004891 communication Methods 0.000 claims description 4
- 230000001360 synchronised effect Effects 0.000 claims description 2
- 108091006146 Channels Proteins 0.000 claims 14
- 102000010637 Aquaporins Human genes 0.000 claims 1
- 108010063290 Aquaporins Proteins 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 11
- 239000002274 desiccant Substances 0.000 abstract description 9
- 230000005855 radiation Effects 0.000 abstract description 4
- 238000005187 foaming Methods 0.000 description 10
- 238000004321 preservation Methods 0.000 description 5
- 238000007710 freezing Methods 0.000 description 4
- 230000008014 freezing Effects 0.000 description 4
- 235000013372 meat Nutrition 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
-
- A—HUMAN NECESSITIES
- A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
- A23L—FOODS, FOODSTUFFS, OR NON-ALCOHOLIC BEVERAGES, NOT COVERED BY SUBCLASSES A21D OR A23B-A23J; THEIR PREPARATION OR TREATMENT, e.g. COOKING, MODIFICATION OF NUTRITIVE QUALITIES, PHYSICAL TREATMENT; PRESERVATION OF FOODS OR FOODSTUFFS, IN GENERAL
- A23L3/00—Preservation of foods or foodstuffs, in general, e.g. pasteurising, sterilising, specially adapted for foods or foodstuffs
- A23L3/36—Freezing; Subsequent thawing; Cooling
- A23L3/365—Thawing subsequent to freezing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
- F25D21/06—Removing frost
- F25D21/08—Removing frost by electric heating
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Health & Medical Sciences (AREA)
- Nutrition Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Food Science & Technology (AREA)
- Polymers & Plastics (AREA)
- Defrosting Systems (AREA)
Abstract
The invention discloses a refrigerator, which comprises: the box, still including subtracting the frost module, subtract the frost module including: the defrosting channel is used for communicating the inner space of the box body with the outer space of the box body; the semiconductor refrigeration element comprises a cold end and a hot end; a heat radiation member which is located on an air inlet flow path of the defrosting channel and is capable of absorbing cold energy of the cold end to condense water vapor of humid air entering the defrosting channel from the outside to adhere to the surface thereof when the semiconductor refrigeration element is operated; and the defrosting module is positioned in the box body and can absorb the heat of the hot end when the semiconductor refrigerating element operates so as to defrost food. The invention solves the problems that the use cost is high when the desiccant is adopted to reduce the frost, and the food materials are difficult to cut after being taken out, so that the user experience is poor.
Description
Technical Field
The invention belongs to the field of household appliances, and particularly relates to an improvement of a refrigerator structure and a frost reduction control method for the refrigerator.
Background
The existing horizontal freezer always has the problem of large amount of frosting, the large amount of frosting not only can cause the increase of the electricity consumption of the freezer, but also has extremely poor experience when a user uses the freezer. The important factor influencing the frosting quantity in the refrigerator is that when the compressor is started and stopped, the pressure in the refrigerator changes, and wet air outside the refrigerator enters the refrigerator through a door seam, and then the wet air is pre-condensed to form frosting.
The common method for reducing the frosting quantity in the refrigerator is to connect the ventilating pipe with the outside, the desiccant is added in the ventilating pipe, the ventilation quantity of the ventilating pipe is larger than that of the door seam, when the refrigerator compressor works, the outside air enters the refrigerator after being dehumidified by the desiccant through the preassembled ventilating pipe, and the purpose of controlling the frosting is achieved. However, the method has the problems that the service life of the drying agent in the ventilation pipe is short, and the drying agent needs to be replaced regularly, so that the use cost of a user is increased; meanwhile, when the existing refrigerator is frozen, food materials like fish or meat are generally placed in a freezing chamber for freezing, the temperature in the freezing chamber is low, the food materials are difficult to cut and can be thawed after being taken out for a long time after being frozen in the freezing chamber, and the user experience is poor.
Disclosure of Invention
Aiming at the problems that in the prior art, a desiccant is adopted to defrost, the replacement use cost is high, and food materials are difficult to cut after being taken out, so that the user experience is poor, the invention provides a refrigerator which comprises a defrosting module, can be used for repeatedly using to defrost, reduces the use cost of a user, and is provided with a defrosting module, and the food materials can be taken out again after passing through the defrosting module, so that the user experience is improved.
In order to achieve the aim of the invention, the invention is realized by adopting the following technical scheme:
a refrigerator, which comprises a refrigerator body,
comprises the following steps: the box body is provided with a box body,
the device also comprises a defrosting module, wherein the defrosting module comprises:
the defrosting channel is used for communicating the inner space of the box body with the outer space of the box body;
the semiconductor refrigeration element comprises a cold end and a hot end;
a heat radiation member which is located on an air inlet flow path of the defrosting channel and is capable of absorbing cold energy of the cold end to condense water vapor of humid air entering the defrosting channel from the outside to adhere to the surface thereof when the semiconductor refrigeration element is operated;
and the defrosting module is positioned in the outer box body and can absorb the heat of the hot end when the semiconductor refrigerating element operates so as to defrost food.
Further, the thawing module comprises:
a thawing box having a sealed thawing chamber formed therein;
the defrosting tray is positioned in the defrosting cavity and is arranged at the bottom of the defrosting box;
and the heat conduction component is arranged in the thawing box and connected with the hot end of the semiconductor refrigeration element and is used for conducting heat of the hot end of the semiconductor refrigeration element into the thawing box.
Further, the heat conducting component is a heat conducting coil, one end of the heat conducting coil is attached to the hot end of the semiconductor refrigerating element, and the other end of the heat conducting coil extends outwards from the hot end of the semiconductor refrigerating element to the inside of the thawing box.
Further, the heat conducting coil is at least arranged in or on the bottom wall of the thawing box.
Further, the hot end of the semiconductor refrigeration element is arranged close to or attached to the inner container of the box body.
Further, the defrosting channel is vertically arranged in the box body along the height direction of the box body and comprises a first airflow circulation port and a second airflow circulation port, the first airflow circulation port is positioned at the bottom of the defrosting channel and is communicated with the outer space of the box body, and the second airflow circulation port is communicated with the inner space of the box body.
Further, the method also comprises the following steps: the water collecting device is used for receiving defrosting water generated by defrosting of the heat radiating component, is arranged at the bottom of the defrosting channel and corresponds to the position of the first airflow circulation port.
Further, the heat dissipation device also comprises a heating component for heating the heat dissipation component, and the heating component is attached to the heat dissipation component.
Further, the thawing box also comprises a controller, an infrared temperature sensor is arranged in the thawing box, and the infrared temperature sensor is in communication connection with the controller.
The frost reduction control method of the refrigerator adopting the technical scheme comprises the following steps:
the whole machine is electrified, the operation of the compressor is controlled, and the semiconductor refrigeration element are controlled to synchronously operate;
detecting the running time of the compressor and the working state of the compressor, controlling the semiconductor refrigeration element to keep a stop working state when the accumulated running time of the compressor reaches n and the compressor is in a stop working state, controlling the heating component to heat and defrost the heat dissipation component, and controlling the heating component to stop heating when the defrosting time reaches T.
Compared with the prior art, the invention has the advantages and positive effects that:
the refrigerator provided by the invention comprises the defrosting channel, when the refrigerator runs, external air can enter the inside of the refrigerator body from the outside through the defrosting channel due to the negative pressure effect, the wet air flow flowing through the defrosting channel can pass through the heat dissipation part capable of absorbing cold energy of the cold end of the semiconductor refrigerating element, the temperature of the heat dissipation part is low, so that water vapor in the wet air flow is condensed on the heat dissipation part and frosted, and the air entering the refrigerator body is dry, so that the frost is prevented from being condensed on the inner container of the refrigerator body, and the defrosting is realized; meanwhile, the heat dissipation part can be repeatedly used after defrosting, and the cost is reduced by replacing the heat dissipation part with a drying agent;
in addition, the refrigerator is correspondingly provided with the thawing module, the thawing module can absorb the heat of the hot end of the semiconductor refrigerating element to thaw food, the heat energy utilized by thawing is from the heat of the hot end of the semiconductor refrigerating element, a heat source is not required to be arranged independently, the cost is reduced, and a user can thaw food through the thawing module before taking out the food, so that the experience of the user is improved.
Other features and advantages of the present invention will become apparent upon review of the detailed description of the invention in conjunction with the drawings.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the structure of the refrigerator of the present invention;
fig. 2 is a partial enlarged view at a of fig. 1.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail with reference to the accompanying drawings and examples.
It should be noted that, in the description of the present invention, terms such as "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, which are merely for convenience of description, and do not indicate or imply that the apparatus or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus are not to be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The invention provides an embodiment of a refrigerator, which is shown by referring to fig. 1-2, and specifically comprises a box body 100, wherein an inner container is arranged in the box body 100, a foaming cavity is formed between the box body 100 and the inner container, foaming materials are arranged in the foaming cavity, foaming layers 130 positioned between the box body 100 and the inner container 110 are correspondingly formed by the foaming materials, a cabinet opening is formed above the box body 100, and a cabinet door is arranged on the cabinet opening.
The inside compressor storehouse 800 that still is provided with of box 100 is equipped with the compressor in compressor storehouse 800, is equipped with the evaporimeter in the foaming layer 130 of foaming chamber, and compressor and evaporimeter are connected to control the evaporimeter operation refrigeration, and the evaporimeter laminating inner bag 110 sets up, in order to transmit the cold volume to inner bag 110, realizes the refrigeration to the inside of box 100.
When the compressor controls the evaporator to perform refrigeration operation, negative pressure is formed in the inner space of the box body 100, so that external wet air is frosted on the inner container wall of the box body 100 after entering, and in order to avoid frosting on the inner container wall, a defrosting module for defrosting is correspondingly arranged in the embodiment.
Preferably, the frost reducing module is disposed in the foaming layer 130. The defrosting module comprises:
a defrosting channel 200 for communicating the inner space of the case 100 with the outer space of the case 100, and allowing the external air flow to enter the case 100 through the defrosting channel 200 when the compressor and the evaporator are operated in refrigeration;
specifically, the frost reducing passage 200 includes a first airflow port 210 and a second airflow port 220, the first airflow port 210 communicates with the external space of the case 100, and the second airflow port 220 communicates with the internal space of the case 100.
Preferably, the frost reducing passage 200 is disposed along a height direction of the case 100 and vertically disposed in the case 100, the first airflow port 210 is located at a bottom of the frost reducing passage 200, and the second airflow port 220 is located at a top of the frost reducing passage 200 and faces an inner space of the case 100.
The semiconductor refrigeration element 300, which includes a cold side 310 and a hot side 320, is preferably a semiconductor refrigeration tablet.
A heat radiation member 400 which is positioned on an air intake flow path of the defrosting channel 200 and is capable of absorbing cold of the cold end 310 to condense water vapor of humid air entering the defrosting channel 200 from the outside into frost attached to the surface thereof when the semiconductor refrigeration element 300 is operated; preferably, the heat dissipation component 400 in this embodiment includes a heat dissipation shell and fins disposed in the heat dissipation shell and along the circumference of the heat dissipation shell, and when the heat dissipation component 400 is matched with the semiconductor refrigeration element 300, the heat dissipation component 400 can be attached to the cold end 310 of the semiconductor refrigeration element 300 through the heat dissipation shell, so that the cold energy of the cold end 310 of the semiconductor can be absorbed rapidly.
Preferably, the defrosting channel 200 in this embodiment adopts a mode that the upper ventilation pipeline 230 is matched with the lower ventilation pipeline 240, that is, the upper ventilation pipeline 230 is communicated with the inner space of the box body 100, the lower ventilation pipeline 240 is communicated with the outer space of the box body 100, the heat dissipation component 400 is correspondingly arranged between the upper ventilation pipeline 230 and the lower ventilation pipeline 240, and is respectively communicated with the upper ventilation pipeline 230 and the lower ventilation pipeline 240 through the heat dissipation shell, and when external air enters, the external air can pass through the lower ventilation pipeline 240, flows through the fins in the heat dissipation component 400 and then enters the box body 100 from the upper ventilation pipeline 230.
Of course, the defrosting channel 200 in this embodiment may also adopt an integral air duct, which may be disposed inside the defrosting channel 200, and the heat dissipating component 400 may adopt a heat dissipating fin disposed inside the air duct, and at this time, the heat dissipating component 400 may be attached to the air duct, and the air duct is attached to the cold end 310 of the semiconductor refrigeration element 300, so as to realize cold energy transfer between the cold end 310 on the semiconductor refrigeration element 300 and the heat dissipating component 400.
Alternatively, the defrosting channel 200 in the present embodiment adopts a ventilation channel structure provided in the foaming layer 130 by being correspondingly formed directly in the foaming layer 130. The molding manner of the defrosting channel 200 is not particularly limited herein.
The second heat dissipation component 400 is matched with the semiconductor hot end 320, and is used for dissipating heat of the semiconductor hot end 320, and ensuring normal refrigeration of the whole semiconductor refrigeration element 300 by dissipating heat of the semiconductor hot end 320. If the heat dissipation of the hot end 320 of the semiconductor refrigeration device 300 is not good, the cold end 310 of the whole semiconductor refrigeration device 300 cannot dissipate the heat, and the use requirement cannot be met.
In order to collect the defrosting water on the heat dissipation part 400, a water collecting device 600 for receiving the defrosting water generated by defrosting of the heat dissipation part 400 is correspondingly arranged in the embodiment. Preferably, the water collecting device 600 in this embodiment is a water receiving box, which is disposed in the compressor bin 800 and is attached to a side surface of the compressor, and can absorb heat emitted by the compressor to partially evaporate defrosting water in the compressor, so as to prevent excessive defrosting water in the water receiving box from overflowing outwards.
Specifically, the water collecting device 600 corresponds to the first airflow port 210 at the bottom of the defrosting channel 200 and is located at the bottom of the first airflow port 210, and when the heat dissipation component 400 in the defrosting channel 200 is defrosted, the defrosted water can flow into the water collecting device 600 at the bottom of the defrosting channel 200 along the first airflow port 210 to collect the defrosted water.
When the refrigerator in this embodiment is turned on, the compressor controls the evaporator to perform refrigeration operation and the semiconductor refrigeration sheet to perform synchronous operation, negative pressure is generated between the inside of the box body 100 and the outside of the box body 100 during refrigeration operation of the refrigerator, at this time, external humid air is sucked into the inside of the box body 100 through the frost reduction channel 200, because the semiconductor refrigeration element 300 also performs refrigeration operation, cold energy is generated at the cold end 310 and is transferred to the heat dissipation component 400, when external humid air passes through the heat dissipation component 400 on the air inlet path of the frost reduction channel 200, water vapor in the humid air is adsorbed by the heat dissipation component 400 with lower temperature and is condensed into frost on the surface of the heat dissipation component 400, so that the water vapor of the humid air to be introduced into the inside of the box body 100 from the external space is condensed on the heat dissipation component 400, the air entering into the inside of the box body 100 is dry air, no water vapor is contained, and frost is not condensed on the inner liner wall of the box body 100, and when the heat dissipation component 400 is defrosted, the defrosting water can drop into the water collection device 600 on the bottom of the frost reduction channel 200.
Meanwhile, the heat dissipation part 400 in this embodiment can be reused after condensing and defrosting, and compared with the prior art adopting a desiccant mode, the desiccant does not need to be replaced frequently, and the use cost of users is reduced.
In order to achieve the primary thawing of the meat from the refrigerator, a thawing module 500 is correspondingly disposed in the present embodiment and located inside the case 100, which can absorb the heat of the hot end 320 of the semiconductor refrigeration element 300 to defrost the food.
The thawing module 500 may be suspended from a cabinet door when disposed, suspended at a cabinet opening or suspended at a location on the liner wall near the hot end 320 of the semiconductor refrigeration device 300, without limitation.
Specifically, the thawing module 500 in this embodiment includes:
the thawing box 510 has a sealed thawing cavity formed therein, and the thawing box 510 includes a thawing bottom box 511 and a thawing cover 512 assembled on the thawing bottom box 511, wherein the thawing cover 512 is detachably connected to the thawing bottom box 511, and the thawing cover 512 and the thawing bottom box 511 may be connected in a snap-fit or rotary-open-close manner, which is not particularly limited herein, and a sealed thawing cavity is formed between the thawing cover 512 and the thawing bottom box 511 after the thawing cover 512 and the thawing bottom box 511 are fixed.
Meanwhile, in order to achieve the effect of heat preservation and heat insulation, in this embodiment, a heat preservation layer is provided in the thawing bottom box 511 when in a set-up, and a heat preservation layer is also provided in the thawing cover 412 to achieve heat preservation and heat insulation.
The defrosting tray 520 is positioned in the defrosting cavity and is arranged at the bottom of the defrosting box 510; when setting up, the thawing tray 520 can directly be placed in the bottom position department of thawing box 510, when the user need defrost, can open the cover that unfreezes, takes out thawing box 510, then will need the food material of preliminary defrosting place the inside the thawing chamber, wait to defrost.
And a heat conduction member 530 disposed in the thawing box 510 and connected to the hot end 320 of the semiconductor refrigeration device 300, for transferring heat of the hot end 320 of the semiconductor refrigeration device 300 into the thawing box 510.
Preferably, the heat conducting member 530 in this embodiment is a heat conducting coil, one end of which is attached to the hot end 320 of the semiconductor refrigeration element 300, and the other end of which extends from the hot end 320 of the semiconductor refrigeration element 300 to the inside of the thawing box 510, and when extending into the thawing box 510, it should be at least extended to the bottom position of the thawing box 510, i.e. the heat conducting coil is at least disposed in or on the bottom wall of the thawing box 510, so as to defrost the food material on the thawing tray 520 placed at the bottom. When specifically setting up, can bury in the end box 511 of thawing inside, be located the heat preservation top, directly laminate the end box 511 bottom surface position of thawing in order to transfer heat to on the thawing tray 520, of course, it also can directly set up on the end box 511 diapire face of thawing when setting up to realize the thawing of placing the food in the thawing tray 520 of end box bottom department of thawing.
In order to further enhance the thawing effect, the heat conducting coil can be wound around the side wall of the thawing bottom box 511 when the thawing bottom box 511 is arranged, and heat is transferred to the whole thawing cavity through the heat conducting coil on the side wall of the thawing bottom box 511, so that the temperature in the thawing cavity is quickly increased, and food materials located inside can be quickly thawed.
Preferably, the hot end 320 of the semiconductor refrigeration device 300 in this embodiment is disposed close to or attached to the inner container 110 of the case 100, so that it is close to the thawing module 500, and the length of the heat conducting coil for transferring heat is shortened, so as to reduce the production cost.
Specifically, in this embodiment, a heating member 700 is further provided, where the heating member 700 is attached to the heat dissipation member 400, and by using the provided heating member 700, the heat dissipation member 400 can be heated when the semiconductor refrigeration element 300 stops working, so as to defrost the heat dissipation member 400.
In order to realize detection control on the temperature of the thawed food material in the thawing cavity 511, a controller and an infrared temperature sensor in the thawing box 510 are correspondingly arranged in the embodiment, and the infrared temperature sensor is in communication with the controller. The temperature of the thawed food can be detected through the infrared temperature sensor and is transmitted to the controller, so that whether the thawed food reaches the thawing temperature or not can be conveniently and intuitively obtained, the thawing box 510 is correspondingly provided with an alarm element which is in communication connection with the controller, when the temperature of meat is detected through the infrared temperature sensor and is transmitted to the controller, the controller compares the obtained temperature of the meat with the set thawing temperature, and the alarm element is controlled to give an alarm prompt after the set thawing temperature is reached.
The defrosting module 500 in this embodiment can absorb and utilize the heat of the hot end 320 of the semiconductor refrigeration element 300 to defrost food, directly utilize the heat of the hot end 320 of the semiconductor refrigeration element 300, and does not need to separately set a heat source for defrosting food, thereby not only realizing the defrosting of the cabinet body, but also solving the heat dissipation problem of the hot end 320 of the semiconductor refrigeration element 300, and simultaneously realizing the defrosting of food.
When a user needs to take food, the food can be taken out from the inside of the box body 100 and then placed into a sealed heat-preserving defrosting cavity, then the food is defrosted, and when the defrosting reaches the required temperature, the cabinet door is opened to take out the food.
The invention also provides a defrosting control method of the refrigerator adopting the embodiment, which comprises the following steps:
when the refrigerator runs, the whole refrigerator is controlled to be electrified, the compressor and the semiconductor refrigeration element 300 are controlled to synchronously work, the evaporator is controlled to perform refrigeration by the compressor, and the semiconductor refrigeration element 300 performs refrigeration, so that the heat of the cold end 310 is transferred to the heat dissipation part 400 positioned in the defrosting channel 200 to perform defrosting;
after the semiconductor refrigeration element 300 operates for a period of time, a thicker frost layer is condensed on the surface of the semiconductor refrigeration element 300, so in this embodiment, the operation time and the operation state of the compressor are detected, if the operation time of the compressor reaches n and the compressor is in a stop operation state, the semiconductor refrigeration element 300 is controlled to stop working, the heating part 700 is controlled to heat and defrost the heat dissipation part 400, and the operation time of the compressor is cleared.
The compressor run time may be timed by having a timer built into the controller and communicated to the controller for recording.
When the defrosting time of the heat sink 400 reaches T, the heating unit 700 is controlled to stop heating, and the semiconductor is powered on to start operation.
Namely, the frost reduction control method in the present embodiment is as follows: the operation state of the compressor is detected every time n, and when the compressor is stopped, the semiconductor refrigeration element 300 is controlled to be in a stopped state no matter in an operating state or a stopped state, and then the heat radiation part 400 is heated and defrosted by the heating part 700, the defrosting time T is set, and the defrosting is stopped after the defrosting time is reached.
When the compressor operation time reaches n but the compressor is in a start-up state, defrosting is performed again when the compressor is stopped.
The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be apparent to one skilled in the art that modifications may be made to the technical solutions described in the foregoing embodiments, or equivalents may be substituted for some of the technical features thereof; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions.
Claims (7)
1. The frost reduction control method of the refrigerator is characterized in that the refrigerator comprises the following steps:
comprises the following steps: the box body is provided with a box body,
the defrosting module comprises:
the defrosting channel is used for communicating the inner space of the box body with the outer space of the box body, the defrosting channel adopts an upper ventilation pipeline and a lower ventilation pipeline to be matched, the upper ventilation pipeline is communicated with the inner space of the box body, the lower ventilation pipeline is communicated with the outer space of the box body, and the semiconductor refrigeration element comprises a cold end and a hot end;
the heat dissipation part is positioned on an air inlet flow path of the defrosting channel, can absorb the cold energy of the cold end when the semiconductor refrigeration element operates so as to condense and adhere water vapor of wet air entering the defrosting channel from the outside to the surface of the semiconductor refrigeration element, is correspondingly arranged between the upper air channel and the lower air channel, is respectively communicated with the upper air channel and the lower air channel through the heat dissipation shell, and can pass through the lower air channel when external air enters, flows through the heat dissipation part and then enters the box body from the upper air channel;
the module that unfreezes, the module that unfreezes including:
a thawing box having a sealed thawing chamber formed therein;
the defrosting tray is positioned in the defrosting cavity and is arranged at the bottom of the defrosting box;
a heat conduction member disposed in the thawing box and connected to the hot end of the semiconductor refrigeration element, for conducting heat from the hot end of the semiconductor refrigeration element into the thawing box;
when the refrigerator is started, the compressor controls the evaporator to perform refrigeration operation and the semiconductor refrigeration sheets to perform synchronous operation, negative pressure is generated between the inside of the refrigerator and the outside of the refrigerator during refrigeration operation, external wet air can be sucked into the inside of the refrigerator through the defrosting channel, the semiconductor refrigeration element performs refrigeration operation, cold energy is generated at the cold end and is transmitted to the heat dissipation part, when the external wet air passes through the heat dissipation part on the air inlet flow path of the defrosting channel, water vapor in the wet air can be adsorbed by the heat dissipation part with lower temperature and is condensed into frost on the surface of the heat dissipation part, the defrosting module absorbs the heat of the hot end to defrost food during operation of the semiconductor refrigeration element,
the heat radiating component is arranged on the base, and the heat radiating component is arranged on the base;
the control method comprises the following steps: the whole machine is electrified, the operation of the compressor is controlled, and the semiconductor refrigeration element are controlled to synchronously operate;
detecting the running time of the compressor and the working state of the compressor, controlling the semiconductor refrigeration element to keep a stop working state when the accumulated running time of the compressor reaches n and the compressor is in a stop working state, controlling the heating component to heat and defrost the heat dissipation component, and controlling the heating component to stop heating when the defrosting time reaches T.
2. The defrosting control method of a refrigerator according to claim 1, wherein the heat conducting member is a heat conducting coil pipe, one end of the heat conducting coil pipe is attached to the hot end of the semiconductor refrigerating element, and the other end of the heat conducting coil pipe extends outwards from the hot end of the semiconductor refrigerating element to the inside of the defrosting box.
3. The method of claim 2, wherein the thermally conductive coil is disposed at least in or on a bottom wall of the defrost case.
4. The method of claim 1, wherein the hot end of the semiconductor refrigeration element is adjacent to or in close proximity to the cold end of the semiconductor refrigeration element
And the inner container of the box body is closed.
5. The method for controlling frost removal of a refrigerator according to claim 1,
the defrosting channel is vertically arranged in the box body along the height direction of the box body and comprises a first airflow opening and a second airflow opening, wherein the first airflow opening is positioned at the bottom of the defrosting channel and is communicated with the outer space of the box body, and the second airflow opening is communicated with the inner space of the box body.
6. The method for controlling the frost removal of the refrigerator according to claim 5, further comprising: the water collecting device is used for receiving defrosting water generated by defrosting of the heat radiating component, is arranged at the bottom of the defrosting channel and corresponds to the position of the first airflow circulation port.
7. The method for controlling frost removal of a refrigerator according to claim 1,
the thawing box is characterized by further comprising a controller, wherein an infrared temperature sensor is arranged in the thawing box and is in communication connection with the controller.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013036643A (en) * | 2011-08-05 | 2013-02-21 | Panasonic Corp | Food storage device |
| WO2015144081A1 (en) * | 2014-03-28 | 2015-10-01 | 海尔集团公司 | Cold transfer and heat dissipation modular assembly, assembly method and semiconductor refrigerator |
| WO2018006571A1 (en) * | 2016-07-06 | 2018-01-11 | 青岛海尔股份有限公司 | Air-cooled refrigerator and dehumidification method thereof |
| CN109357460A (en) * | 2017-12-28 | 2019-02-19 | 广州Tcl智能家居科技有限公司 | A kind of refrigerator and the defreezing method for refrigerator |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3025741B2 (en) * | 1994-03-23 | 2000-03-27 | 三洋電機株式会社 | Anti-frost device for frozen showcases |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013036643A (en) * | 2011-08-05 | 2013-02-21 | Panasonic Corp | Food storage device |
| WO2015144081A1 (en) * | 2014-03-28 | 2015-10-01 | 海尔集团公司 | Cold transfer and heat dissipation modular assembly, assembly method and semiconductor refrigerator |
| WO2018006571A1 (en) * | 2016-07-06 | 2018-01-11 | 青岛海尔股份有限公司 | Air-cooled refrigerator and dehumidification method thereof |
| CN109357460A (en) * | 2017-12-28 | 2019-02-19 | 广州Tcl智能家居科技有限公司 | A kind of refrigerator and the defreezing method for refrigerator |
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