CN108758882A - A kind of semiconductor refrigerating dehumidizer and its dehumanization method - Google Patents
A kind of semiconductor refrigerating dehumidizer and its dehumanization method Download PDFInfo
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- CN108758882A CN108758882A CN201810882730.7A CN201810882730A CN108758882A CN 108758882 A CN108758882 A CN 108758882A CN 201810882730 A CN201810882730 A CN 201810882730A CN 108758882 A CN108758882 A CN 108758882A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 89
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000012546 transfer Methods 0.000 claims abstract description 101
- 238000001816 cooling Methods 0.000 claims abstract description 28
- 235000012149 noodles Nutrition 0.000 claims abstract description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 20
- 238000003303 reheating Methods 0.000 claims abstract description 12
- 238000010521 absorption reaction Methods 0.000 claims description 12
- 230000000694 effects Effects 0.000 claims description 11
- 238000001035 drying Methods 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 6
- 230000005484 gravity Effects 0.000 claims description 4
- 230000007704 transition Effects 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 2
- 239000007916 tablet composition Substances 0.000 claims 1
- 238000007791 dehumidification Methods 0.000 abstract description 14
- 238000013461 design Methods 0.000 abstract description 5
- 238000005057 refrigeration Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 5
- 238000000605 extraction Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000003507 refrigerant Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/14—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/89—Arrangement or mounting of control or safety devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/30—Arrangement or mounting of heat-exchangers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/14—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
- F24F2003/144—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification by dehumidification only
Abstract
A kind of double heat pipe semiconductor refrigeration dehumidifiers of present invention offer and its dehumanization method,Double heat pipe semiconductor refrigeration dehumidifiers of the present invention include semiconductor chilling plate,First thermal transfer devices,Second thermal transfer devices,Third thermal transfer devices,Air duct,Exhaust fan,Water outlet,The present invention carries out the air heat humidity of air by the way that three thermal transfer devices are arranged,Wherein the first thermal transfer devices can shift the cold of the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate,And secondary cooling is carried out to the air in exhaust passage using the cold of the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate absorbed,Third thermal transfer devices can shift the heat in the hot face of semiconductor chilling plate,Reheating is carried out to the air in exhaust passage,Air is allowed to first pass through " huyashi-chuuka (cold chinese-style noodles) " heat exchange in the case where not changing direction,It exchanges heat using " hot face ",Simplify air channel structure design,Reduce air flowing pressure loss in air duct,Improve the dehumidification efficiency of entire dehumidifier.
Description
Technical field
The present invention relates to dehumidifier technical fields, and in particular to a kind of semiconductor refrigerating dehumidizer and its dehumanization method.
Background technology
The core component of semiconductor refrigerating dehumidizer is " semiconductor chilling plate ", which has two sides, inhaled on one side after energization
Refrigeration heat is " huyashi-chuuka (cold chinese-style noodles) ", another side heat release is " hot face ", and air firstly flows through " huyashi-chuuka (cold chinese-style noodles) ", and moisture in air is by cooling condensation quilt
Removal, air after cooling passes through " hot face " cooling cooling piece " hot face ", because it is with small, simple in structure, failure rate
It low, the advantages that service life is long, is widely used, but restricted by semiconductor chilling plate self-condition, it is made to compare steam
Refrigerated dehumidification is compressed, has the shortcomings that efficiency is low.
Invention content
To solve above-mentioned technological deficiency, the technical solution adopted by the present invention is, provides a kind of semiconductor refrigerating dehumidizer,
The semiconductor refrigerating dehumidizer includes：Semiconductor chilling plate, the first thermal transfer devices, the second thermal transfer devices, third heat
Measure transfer device, air duct, exhaust fan, water outlet；
The air duct includes exhaust passage and air inlet duct；The exit of the exhaust passage is provided with air outlet, and the exhausting
Machine is located at the air outlet；The entrance of the air inlet duct is provided with air inlet；
One end of second thermal transfer devices is located in the air inlet duct, and the air entered from the air inlet is pre-
It cools down, and the atmospheric heat of absorption is passed to the other end of second thermal transfer devices；
One end of first thermal transfer devices is located in the exhaust passage, and the air secondary of precooling is cooled down；Institute
The other end for stating the first thermal transfer devices is connect with the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate, by the cold of the semiconductor chilling plate
The cold in face is transferred to one end of first thermal transfer devices；The semiconductor chilling plate is located at outside the exhaust passage；
The other end of second thermal transfer devices is located in the exhaust passage, and the air of secondary cooling is carried out pre-add
Heat, and the air cold of absorption is passed to one end of second thermal transfer devices；
The third thermal transfer devices are located in the exhaust passage, and the third thermal transfer devices are partly led with described
The hot face of body cooling piece connects, and pre-warmed air secondary is heated；
The water outlet is located at one end of one end and second thermal transfer devices of first thermal transfer devices
Dislocation at the exhaust passage on.
Optionally, first thermal transfer devices include the first release end of heat and the first heat absorbing end；First release end of heat
It is connected by the first heat pipe with first heat absorbing end；First release end of heat is connect with the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate；
First heat absorbing end is located in the exhaust passage.
Optionally, first release end of heat is plate-type exchanger；First heat absorbing end is finned heat exchanger.
Optionally, second thermal transfer devices include the second release end of heat and the second heat absorbing end；Second release end of heat
It is connected by the second heat pipe with second heat absorbing end；Second release end of heat is located in the exhaust passage, and described second puts
Hot junction is between the third thermal transfer devices and first heat absorbing end；Second heat absorbing end is located at the air inlet duct
It is interior.
Optionally, second release end of heat is finned heat exchanger, and second heat absorbing end is layer plate heat interchanger.
Optionally, first heat pipe and second heat pipe are U-shaped.
Optionally, the air inlet duct and the exhaust passage constitute L-shaped.
Optionally, the junction of the air inlet duct and the exhaust passage is round-corner transition.
Optionally, it is additionally provided with humidity sensor at the air outlet of the exhaust passage；It is also set up outside the exhaust passage
There is controller；The controller and the humidity sensor, the semiconductor chilling plate and the exhausting mechatronics, the control
Device processed receives the data of the humidity sensor detection, and controls the operation of the semiconductor chilling plate and the exhaust fan.
The dehumanization method of above-mentioned semiconductor refrigerating dehumidizer, includes the following steps：
1) power on, start the semiconductor chilling plate and the exhaust fan；
2) second thermal transfer devices to by the air inlet enter the air inlet duct air precooling but, and will
The heat that air cooling is released is recycled；
3) cold of the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate is transferred to the exhaust passage by first thermal transfer devices
The interior air by precooling carries out secondary cooling to the air of precooling, and the water vapour in air reaches dew-point temperature condensation
At liquid water, under the effect of gravity, it is pooled to the water outlet discharge, air obtains drying；
4) second thermal transfer devices are using the atmospheric heat recycled, to passing through dry air in the exhaust passage
It is preheated；
5) heat in the hot face of the semiconductor chilling plate is transferred to the exhaust passage by the third thermal transfer devices
Interior to pass through pre-warmed air, pre-warmed air obtains reheating；
6) exhaust passage is discharged through the exhaust fan at the air outlet in the air Jing Guo reheating.
Compared with the prior art, the beneficial effects of the present invention are：
(1) semiconductor refrigerating dehumidizer of the invention is removed by the way that the heat exchange of three thermal transfer devices progress air is arranged
It is wet, wherein the first thermal transfer devices can shift the cold of the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate, and utilize the semiconductor system absorbed
The cold of cold huyashi-chuuka (cold chinese-style noodles) carries out secondary cooling to the air in exhaust passage, and third thermal transfer devices can be by semiconductor chilling plate
Hot face heat transfer, in exhaust passage air carry out reheating, allow air first to be passed through in the case where not changing direction
" huyashi-chuuka (cold chinese-style noodles) " heat exchange is crossed, is exchanged heat using " hot face ", air channel structure design is simplified, reduces air flowing pressure in air duct and damages
It loses, improves the dehumidification efficiency of entire dehumidifier.
(2) the second thermal transfer devices of semiconductor refrigerating dehumidizer of the invention absorb the heat of air in air inlet duct in advance
Amount, precools the air in air inlet duct, meanwhile, it is secondary to passing through in exhaust passage using the atmospheric heat of own absorption
Cooling air is preheated, and after heat exchange, can be continued to precool the air in air inlet duct, be reached air cold
From the purpose of recycling, entire heat transfer process does not consume electric energy so that the heat exchanger effectiveness of the second thermal transfer devices is significantly
It improves, further improves the dehumidification efficiency of entire dehumidifier.
(3) the L-shaped design in entire air duct of semiconductor refrigerating dehumidizer of the invention so that air only passes through in air duct
90 ° of steerings can achieve the goal, and air need to be allowed at least to change two in air duct compared to existing general semiconductor dehumidifier
Secondary 180 ° of direction could realize the effect of dehumidifying, substantially increase the dehumidification efficiency of entire dehumidifier.
(4) because the present invention semiconductor refrigerating dehumidizer special air channel structure, circulating resistance of the air in air duct compared with
It is small so that the flowing that air in air duct can be realized in an exhaust fan is arranged in the present invention only at air outlet, simplifies and entirely removes
The structure of wet machine, and saved the energy consumption of entire dehumidifier.
(5) dehumanization method of the invention precools the air of air inlet, secondary cooling, preheating, it is secondary plus
Removal moisture drying of the dehumidifier to air can be realized in heat, and dehumanization method is simple, and in dehumidification process, three thermal transfer devices it
Between cooperate, dehumidification efficiency is high.
Description of the drawings
It is required in being described below to embodiment in order to illustrate more clearly of the technical solution in various embodiments of the present invention
The attached drawing used is briefly described.
Fig. 1 is a kind of structural schematic diagram of semiconductor refrigerating dehumidizer in the embodiment of the present invention one；
Fig. 2 is the structural schematic diagram of the first thermal transfer devices in the embodiment of the present invention one；
Fig. 3 is the structural schematic diagram of the second thermal transfer devices in the embodiment of the present invention one.
Digital representation in figure：
Semiconductor chilling plate 1, the first thermal transfer devices 2, the second thermal transfer devices 3, third thermal transfer devices 4,
Air duct 5, exhaust fan 6, water outlet 7, humidity sensor 8, controller 9；
First release end of heat 21, the first heat absorbing end 22, the first heat pipe 23；
Second release end of heat 31, the second heat absorbing end 32, the second heat pipe 33；
Exhaust passage 51, air inlet duct 52, air outlet 53, air inlet 54.
Specific implementation mode
Below in conjunction with attached drawing, the forgoing and additional technical features and advantages are described in more detail.
Embodiment one
As shown in Figure 1, being a kind of structural schematic diagram of semiconductor refrigerating dehumidizer provided in this embodiment, the dehumidifier packet
It includes：
Semiconductor chilling plate 1, the first thermal transfer devices 2, the second thermal transfer devices 3, third thermal transfer devices 4,
Air duct 5, exhaust fan 6, water outlet 7；
The air duct 5 includes exhaust passage 51 and air inlet duct 52；The exit of the exhaust passage 51 is provided with air outlet 53, and
The exhaust fan 6 is located at the air outlet 53；The entrance of the air inlet duct 52 is provided with air inlet 54；
One end of second thermal transfer devices 3 is located in the air inlet duct 52, by what is entered from the air inlet 54
The atmospheric heat of absorption but, and is passed to the other end of second thermal transfer devices 3 by air precooling；
One end of first thermal transfer devices 2 is located in the exhaust passage 51, and the air secondary of precooling is cooled down；
The other end of first thermal transfer devices 2 is connect with the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate 1, by the semiconductor chilling plate
The cold of 1 huyashi-chuuka (cold chinese-style noodles) is transferred to one end of first thermal transfer devices 2；The semiconductor chilling plate 1 is located at the outlet air
Outside road 51；
The other end of second thermal transfer devices 3 is located in the exhaust passage 51, and the air of secondary cooling is carried out
It preheats, and the air cold of absorption is passed to one end of second thermal transfer devices 3；
The third thermal transfer devices 4 are located in the exhaust passage 51, and the third thermal transfer devices 4 with it is described
The hot face of semiconductor chilling plate 1 connects, and pre-warmed air secondary is heated；
The water outlet 7 is located at one end and the one of second thermal transfer devices 3 of first thermal transfer devices 2
On the exhaust passage 51 at the dislocation at end.
The present embodiment carries out the air heat humidity of air by the way that three thermal transfer devices are arranged, wherein the first heat transfer fills
The cold of the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 1 can be shifted by setting 2, and the cold pair of the huyashi-chuuka (cold chinese-style noodles) using the semiconductor chilling plate 1 absorbed
Air in exhaust passage 51 carries out secondary cooling, and third thermal transfer devices 4 turn the heat in the hot face of semiconductor chilling plate 1
It moves, reheating is carried out to the air in exhaust passage 51, air is made to first pass through " huyashi-chuuka (cold chinese-style noodles) " heat exchange in the case where not changing direction,
It exchanges heat using " hot face ", simplifies air channel structure design, reduce air flowing pressure loss in air duct, improve entire
The dehumidification efficiency of dehumidifier.And the second thermal transfer devices 3 of the present invention absorb the heat of air in air inlet duct 52 in advance, and it is right
Air in air inlet duct 52 is precooled, meanwhile, it is secondary to passing through in exhaust passage 51 using the atmospheric heat of own absorption
Cooling air is preheated, and after heat exchange, can continue to precool the air in air inlet duct 52, it is cold to reach air
Amount does not consume electric energy from the purpose recycled, entire heat transfer process so that the heat exchanger effectiveness of the second thermal transfer devices 3 is big
It is big to improve, further improve the dehumidification efficiency of entire dehumidifier.In addition, because of the air duct 5 of semiconductor refrigerating dehumidizer of the present invention
Structure greatly simplify, circulating resistance of the air in air duct 5 is smaller so that a pumping is arranged in the present invention only at air outlet 53
The flowing of air in air duct 5 can be realized in wind turbine 6, simplifies the structure of entire dehumidifier, and has saved the energy of entire dehumidifier
Consumption reduces the operating pressure of exhaust fan 6 at air outlet 53 in addition, in order to increase circulating rate of the air in air duct, also can be
One exhaust fan 6 is set at air inlet 54.
In the present embodiment, the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 1 can absorb heat, and hot face can heat release.
Exhaust passage 51 and air inlet duct 52 constitute L-shaped, and exhaust passage 51 and the junction of air inlet duct 52 are round-corner transition.By wind
Road 5 is set as L-shaped so that air can only achieve the goal by 90 ° of steerings in air duct 5, compared to existing common half
The direction that conductor dehumidifier need to allow air at least to change 180 ° twice in air duct 5 could realize the effect of dehumidifying, greatly improve
The dehumidification efficiency of entire dehumidifier, and set the junction of air inlet duct 52 and exhaust passage 51 to fillet, be conducive to reduce
Air is transferred to the circulating resistance of exhaust passage from air inlet duct.In addition, air duct 5 can be also bent into the shape of other angles as needed
Shape, such as 120 °, 150 °, it is transferred to the circulating resistance of exhaust passage to further decrease air from air inlet duct, while adjusting heat pipe
Shape makes the first thermal transfer devices 2 and the second thermal transfer devices 3 adapt to the bending shape in air duct 5.
First thermal transfer devices 2, including the first release end of heat 21 and the first heat absorbing end 22；First release end of heat 21 and first is inhaled
Hot junction 22 is connected by the first heat pipe 23 of U-shaped；First release end of heat 21 is cold with the semiconductor chilling plate 1 outside exhaust passage 51
Face connects, and the first release end of heat 21 absorbs the cold of the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 1, and by the first heat pipe 23 by the cold of absorption
The first heat absorbing end 22 passed in exhaust passage 51 passes through semiconductor chilling plate 1 for cooling down the air in exhaust passage
Huyashi-chuuka (cold chinese-style noodles) cold transfer, avoid it is another set air duct and exchanged heat with the huyashi-chuuka (cold chinese-style noodles) for passing air through semiconductor chilling plate 1, simplify wind
Road structure design reduces air flowing pressure loss in air duct, improves the dehumidification efficiency of entire dehumidifier；Wherein heat pipe
In refrigerant there is the property that fast speed heat is transmitted, when heat pipe one end is heated, the refrigerant in heat pipe evaporates rapidly, and gaseous coolant is micro-
The other end is flowed under small pressure difference, and discharges heat, and at liquid refrigerants, liquid refrigerants is back to heated one for regelation
End, so moves in circles.
And as shown in Fig. 2, the first release end of heat 21 be plate-type exchanger, be nested in the closed end of U-shaped heat pipe；First inhales
Hot junction 22 be finned heat exchanger, be nested in the open end of the first heat pipe of U-shaped 23, wherein the first heat absorbing end 22 it is finned
Heat exchanger includes fixed bottom plate and is vertically mounted on several fins on fixed bottom plate, and fixed bottom plate is nested in the first heat pipe of U-shaped 23
On.In addition, in order to enhance the compactedness of entire dehumidifier structure, can adjust between the first release end of heat 21 and the first heat absorbing end 22
The bending angle of first heat pipe 23.It sets the first release end of heat 21 to plate-type exchanger in the present embodiment, is conducive to flat
Heat exchanger is bonded with the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 1, increases the huyashi-chuuka (cold chinese-style noodles) contact surface of plate-type exchanger and semiconductor chilling plate 1
Product, and then improve heat exchanger effectiveness；It sets the first heat absorbing end 22 and the second release end of heat 31 to finned heat exchanger, tune can be passed through
Spacing between whole each fin needs adjustment outlet air to adjust the contact area with air in exhaust passage according to effect on moisture extraction
The heat exchanger effectiveness of air and air circulation resistance in road, and for convenience air circulation, the first heat absorbing end 22 it is finned
The direction of the equal air circulation in fin direction in heat exchanger is configured.In addition, can be first in order to improve the first heat absorbing end 22
Coated with thermally conductive material layer on the fin of heat absorbing end 22.
Second thermal transfer devices 3, including the second release end of heat 31 and the second heat absorbing end 32；Second release end of heat 31 and second is inhaled
Hot junction 32 is connected by the second heat pipe 33 of U-shaped；Second release end of heat 31 is located in exhaust passage 51, and the second release end of heat 31 is located at the
Between three thermal transfer devices 4 and the first heat absorbing end 22；Second heat absorbing end 32 is located in air inlet duct 52；Air from air inlet 54 into
Enter air inlet duct 52, carries out heat exchange with the second heat absorbing end 32, the second heat absorbing end 32 absorbs the heat that air is released, and is carried out to air
It precools, meanwhile, the second heat absorbing end 32 gives the heat transfer of absorption to the second release end of heat 31 by the second heat pipe 33, precooling
Air flows through the first heat absorbing end 22 in exhaust passage 51, carries out heat exchange with the first heat absorbing end 22, the first heat absorbing end 22 absorbs warp
The heat that the air precooled is released is crossed, achievees the purpose that cool down air secondary, for air after secondary cooling, temperature is big
Width reduces, and the water vapour in air, which reaches dew-point temperature and condenses into liquid water, to be attached in the first heat absorbing end 22 and in gravity
Under be pooled to the water outlet 7 of 51 bottom of exhaust passage and be discharged, air obtains drying；Air after secondary cooling is dried flows through
Two release end of heat 31, heat of second release end of heat 31 because absorbing the transfer of the second heat absorbing end 32, can carry out with the air of secondary cooling
The dry air of heat exchange, secondary cooling absorbs the heat that the second heat absorbing end 32 is released, and temperature increases, and the second heat absorbing end 32 is inhaled
The cold cooling of air has been received, and cold is passed to by the second release end of heat 31 by the second heat pipe 33, the second release end of heat 31 continues
The air entered from air inlet 54 is precooled, is moved in circles successively, the heat exchange of the second thermal transfer devices 3 relies on certainly
The effect of body heat pipe realizes that the recuperation of heat of air utilizes so that the heat exchanger effectiveness of the second thermal transfer devices 3 greatly improves,
Further improve the dehumidification efficiency of entire dehumidifier.
And as shown in figure 3, the second release end of heat 31 is finned heat exchanger, it is nested in the closed end of U-shaped heat pipe, second inhales
Hot junction 32 is layer plate heat interchanger, is nested in the open end of the second heat pipe of U-shaped 33, the finned heat exchanger of the second release end of heat 31
Including fixed bottom plate and several fins on fixed bottom plate are vertically mounted on, fixed bottom plate is nested on the second heat pipe of U-shaped 33, and second
The layer plate heat interchanger of heat absorbing end 32 includes several thermally conductive sheets, and thermally conductive sheet is nested on the second heat pipe of U-shaped 33.In addition, in order to increase
The compactedness of strong entire dehumidifier structure, can adjust the bending angle of the heat pipe between the second release end of heat 31 and the second heat absorbing end 32
Degree.Set the second release end of heat 31 to finned heat exchanger, can by adjusting the spacing between each fin come adjust in exhaust passage
The contact area of air, and then hindered according to need the to adjust heat exchanger effectiveness of air and the air circulation in exhaust passage of effect on moisture extraction
Power；It sets the second heat absorbing end 32 to layer plate heat interchanger and is conducive to increase the precooling effect of air inlet air, and then improve
Later stage effect on moisture extraction, and air circulation for convenience, fin, the second heat absorption in the finned heat exchanger of the second release end of heat 31
The direction of each synusia in the layer plate heat interchanger at end 32 is configured along the direction of air circulation.In addition, in order to improve
The air heat humidity efficiency of two release end of heat 31, can on the fin of the second release end of heat 31 coated with thermally conductive material layer.
Third thermal transfer devices 4 are radiator for semiconductor comprising heat-conducting substrate and are vertically set on heat-conducting substrate
Several fins；The heat-conducting substrate of third thermal transfer devices 4 is connect with the hot face of semiconductor chilling plate 1, and third heat passes
Several fins of delivery device 4 are located in exhaust passage 51, and close to air outlet 53, the heat-conducting substrate of third thermal transfer devices 4 is inhaled
It receives the heat in the hot face of semiconductor chilling plate 1 and passes to several fins in exhaust passage 51, when the air by preheating flows through
When several fins of third thermal transfer devices 4, the air of preheating exchanges heat with several fins, obtains reheating so that through cold
Dry air reaches discharge temperature, and air outlet 53 finally is discharged through the exhaust fan 6 at air outlet 53, meanwhile, to through cooling
When dry air carries out reheating, the heat in the hot face of semiconductor chilling plate 1 can be taken away by third thermal transfer devices 4
Amount ensures that semiconductor chilling plate 1 works normally.
Embodiment two
As shown in Figure 1, be a kind of structural schematic diagram of semiconductor refrigerating dehumidizer provided in this embodiment, the present embodiment with
Above-described embodiment the difference is that：It is additionally provided with humidity sensor 8 at the air outlet 53 of exhaust passage 51；Exhaust passage 51
It is additionally provided with controller 9 outside；Controller 9 is electrically connected with humidity sensor 8, semiconductor chilling plate 1 and exhaust fan 6, receives humidity
The humidity data that sensor 8 detects, and by the analysis to humidity data at air outlet 53, control semiconductor chilling plate 1 and take out
The operation of wind turbine 6.
It is conducive to the real-time effect on moisture extraction for monitoring dehumidifier by humidity sensor 3 and being provided with for controller.
The dehumanization method of above-mentioned semiconductor refrigerating dehumidizer, includes the following steps：
1) power on, start semiconductor chilling plate 1 and exhaust fan 6, the huyashi-chuuka (cold chinese-style noodles) heat absorption of semiconductor chilling plate 1, hot face are put
Air in environment is pumped into air inlet duct 52 by heat, exhaust fan 6 from air inlet 54；
2) the second thermal transfer devices 3 are and cold by air to entering the air precooling of air inlet duct 52 by air inlet 54 but
But the heat released is recycled；
3) cold of the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 1 is transferred in exhaust passage 51 by pre- by the first thermal transfer devices 2
Cooling air carries out secondary cooling to the air of precooling, and the water vapour in air reaches dew-point temperature and condenses into liquid water,
Under the effect of gravity, it is pooled to the discharge of water outlet 7, air obtains drying；
4) the second thermal transfer devices 3 carry out the air by drying in exhaust passage 51 using the atmospheric heat of recycling
Preheating；
5) heat in the hot face of semiconductor chilling plate 1 is transferred in exhaust passage 51 by pre- by third thermal transfer devices 4
The air of heating, pre-warmed air obtain reheating；
6) exhaust passage 51 is discharged through the exhaust fan 6 at air outlet 53 in the air Jing Guo reheating.
The air of air inlet is precooled in above-mentioned dehumanization method, secondary cooling, preheating, reheating
Realize removal moisture drying of the dehumidifier to air, dehumanization method is simple, and in dehumidification process, between three thermal transfer devices mutually
Cooperation, dehumidification efficiency are high.
In addition, in order to improve effective maintenance of dehumidifier working condition, humidity sensor 8 can be used to detect afterwards in step 6)
Air humidity at air outlet 53, and gathered data is fed back into controller 9, controller 9 passes through the humidity number at air outlet 53
According to the operation of control semiconductor chilling plate 1 and exhaust fan 6.
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art,
It still can be with technical scheme described in the above embodiments is modified, or is carried out to which part technical characteristic etc.
With replacing, all within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in this
Within the protection domain of invention.
Claims (10)
1. a kind of semiconductor refrigerating dehumidizer, which is characterized in that including：Semiconductor chilling plate (1), the first thermal transfer devices
(2), the second thermal transfer devices (3), third thermal transfer devices (4), air duct (5), exhaust fan (6), water outlet (7)；
The air duct (5) includes exhaust passage (51) and air inlet duct (52)；The exit of the exhaust passage (51) is provided with air outlet
(53), and the exhaust fan (6) is located at the air outlet (53)；The entrance of the air inlet duct (52) is provided with air inlet
(54)；
One end of second thermal transfer devices (3) is located in the air inlet duct (52), will enter from the air inlet (54)
Air precooling but, and the atmospheric heat of absorption is passed to the other end of second thermal transfer devices (3)；
One end of first thermal transfer devices (2) is located in the exhaust passage (51), and the air secondary of precooling is cooled down；
The other end of first thermal transfer devices (2) is connect with the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate (1), by the semiconductor system
The cold of the huyashi-chuuka (cold chinese-style noodles) of cold (1) is transferred to one end of first thermal transfer devices (2)；Semiconductor chilling plate (1) position
Outside in the exhaust passage (51)；
The other end of second thermal transfer devices (3) is located in the exhaust passage (51), and the air of secondary cooling is carried out
It preheats, and the air cold of absorption is passed to one end of second thermal transfer devices (3)；
The third thermal transfer devices (4) are located in the exhaust passage (51), and the third thermal transfer devices (4) and institute
The hot face connection for stating semiconductor chilling plate (1), pre-warmed air secondary is heated；
The water outlet (7) is located at one end of first thermal transfer devices (2) and second thermal transfer devices (3)
On the exhaust passage (51) at the dislocation of one end.
2. semiconductor refrigerating dehumidizer according to claim 1, which is characterized in that first thermal transfer devices (2)
Including the first release end of heat (21) and the first heat absorbing end (22)；First release end of heat (21) and first heat absorbing end (22) pass through
First heat pipe (23) is connected；First release end of heat (21) connect with the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate (1)；Described first inhales
Hot junction (22) is located in the exhaust passage (51).
3. semiconductor refrigerating dehumidizer according to claim 2, which is characterized in that first release end of heat (21) is tablet
Formula heat exchanger；First heat absorbing end (22) is finned heat exchanger.
4. semiconductor refrigerating dehumidizer according to claim 3, which is characterized in that second thermal transfer devices (3)
Including the second release end of heat (31) and the second heat absorbing end (32)；Second release end of heat (31) and second heat absorbing end (32) pass through
Second heat pipe (33) is connected；Second release end of heat (31) is located in the exhaust passage (51), and second release end of heat (31)
Between the third thermal transfer devices (4) and first heat absorbing end (22)；Second heat absorbing end (32) is located at institute
It states in air inlet duct (52).
5. semiconductor refrigerating dehumidizer according to claim 4, which is characterized in that second release end of heat (31) is fin
Formula heat exchanger, second heat absorbing end (32) are layer plate heat interchanger.
6. semiconductor refrigerating dehumidizer according to claim 5, which is characterized in that first heat pipe (23) and described
Two heat pipes (33) are U-shaped.
7. the semiconductor refrigerating dehumidizer according to any claim in claim 1 to 6, which is characterized in that it is described into
Air duct (52) and the exhaust passage (51) constitute L-shaped.
8. semiconductor refrigerating dehumidizer according to claim 7, which is characterized in that the air inlet duct (52) and the outlet air
The junction in road (51) is round-corner transition.
9. semiconductor refrigerating dehumidizer according to claim 8, which is characterized in that the outlet air of the exhaust passage (51)
It is additionally provided with humidity sensor (8) at mouth (53)；It is additionally provided with controller (9) outside the exhaust passage (51)；The controller (9)
It is electrically connected with the humidity sensor (8), the semiconductor chilling plate (1) and the exhaust fan (6), the controller (9) connects
The data of the humidity sensor (8) detection are received, and control the operation of the semiconductor chilling plate (1) and the exhaust fan (6).
10. a kind of method to be dehumidified using semiconductor refrigerating dehumidizer, which is characterized in that the semiconductor refrigerating dehumidizer
Semiconductor refrigerating dehumidizer as claimed in any one of claims 1 to 9,
Dehumidifying includes the following steps：
1) power on, start the semiconductor chilling plate (1) and the exhaust fan (6)；
2) second thermal transfer devices (3) are to the air precooling by the air inlet (54) into the air inlet duct (52)
But it, and by the heat that air cooling is released recycles；
3) cold of the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate (1) is transferred to the outlet air by first thermal transfer devices (2)
By the air precooled in road (51), secondary cooling is carried out to the air of precooling, the water vapour in air reaches dew point temperature
Degree condenses into liquid water, under the effect of gravity, is pooled to the water outlet (7) discharge, air obtains drying；
4) second thermal transfer devices (3) are using the atmospheric heat recycled, to passing through drying in the exhaust passage (51)
Air is preheated；
5) heat in the hot face of the semiconductor chilling plate (1) is transferred to the outlet air by the third thermal transfer devices (4)
Pass through pre-warmed air in road (51), pre-warmed air obtains reheating；
6) exhaust passage is discharged through the exhaust fan (6) at the air outlet (53) in the air Jing Guo reheating
(51)。
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