CN110491968A - 用于改善板式镀膜效果的载板 - Google Patents

用于改善板式镀膜效果的载板 Download PDF

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Publication number
CN110491968A
CN110491968A CN201910700112.0A CN201910700112A CN110491968A CN 110491968 A CN110491968 A CN 110491968A CN 201910700112 A CN201910700112 A CN 201910700112A CN 110491968 A CN110491968 A CN 110491968A
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support plate
board
frame
improving
silicon wafer
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CN201910700112.0A
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乐雄英
李冰
余永健
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Jiangsu Runyang Yueda Photovoltaic Technology Co Ltd
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Jiangsu Runyang Yueda Photovoltaic Technology Co Ltd
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Priority to CN201910700112.0A priority Critical patent/CN110491968A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本发明公开了一种用于改善板式镀膜效果的载板，该载板至少包括一个单元，每个单元包括承载硅片的框架，该框架在一个单元内有相互连接的四块，四块无缝连接，保持在同一水平面，这四块框架在镀膜过程中起着承载硅片的作用，框架与硅片承载接触的界面呈现一定的角度，使硅片镀膜与载板接触时，搭载在载板上硅片与载板以线性接触，硅片与载板之间无缝对接，没有丝毫高度差，防止了板式上镀膜的工艺中绕镀现象的产生，提高了板式上镀膜的镀膜效果。

Description

用于改善板式镀膜效果的载板
技术领域
本发明涉及太阳能电池板式镀膜工艺中的一种硅片承载装置，具体涉及一种用于改善板式镀膜效果的载板。
背景技术
太阳能电池片的镀膜制程是太阳能电池生产中非常重要的一步，对后面电池片制程的有着重大的影响，传统电池片在生产过程中采用挂钩的装置，这样使得硅片和载板之间存在比较大高度差，在镀膜的过程中，容易产生绕镀现象，特别是在随着高效电池的发展，在板式镀氧化铝薄膜时，这种绕镀现象尤其严重，对后面的镀膜效果和效率有十分重大的影响。本发明克服了现有载板的不足，提供了一种用于改善板式镀膜效果的载板，可以防止了板式上镀膜的工艺中绕镀现象的产生，提高了板式上镀膜的镀膜效果。
发明内容
有鉴于此，本发明的目的是解决上述现有技术的不足，提供了一种用于改善板式镀膜效果的载板，可以防止了板式上镀膜的工艺中绕镀现象的产生，提高了板式上镀膜的镀膜效果。
本发明解决上述现有技术的不足所采用的技术方案是：一种用于改善板式镀膜效果的载板，该载板至少包括一个单元，每个单元包括承载硅片的框架，所述框架与所述硅片承载接触的界面呈现一设定的角度。
进一步的，所述框架在每个该单元内有相互连接的四块载板，所述四块载板无缝连接，保持在同一水平面，在镀膜过程中承载所述硅片。
进一步的，所述设定的角度为0-90°。
进一步的，所述设定的角度为30-45°。
进一步的，多个所述单元相连并共用一个所述框架。
进一步的，所述框架厚度为5-12mm，所述框架宽度为3-20mm。
进一步的，所述载板包括5-20个所述单元。
进一步的，所述载板的材质为碳纤维。
相较于现有技术，本发明用于改善板式镀膜效果的载板，由于该载板至少包括一个单元，每个单元包括承载硅片的框架，以及该框架在一个单元内有相互连接的四块，四块无缝连接，保持在同一水平面，这四块框架在镀膜过程中起着承载硅片的作用，框架与硅片承载接触的界面呈现一定的角度，使硅片镀膜与载板接触时，搭载在载板上硅片与载板以线性接触，硅片与载板之间无缝对接，没有丝毫高度差，防止了板式上镀膜的工艺中绕镀现象的产生，提高了板式上镀膜的镀膜效果。
附图说明
图1为本发明用于改善板式镀膜效果的载板的一种实施例的示意图。
具体实施方式
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例，本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。
请参阅图1，为本发明用于改善板式镀膜效果的载板的一种实施例的示意图，如图所示，一种用于改善板式镀膜效果的载板，该载板至少包括一个单元，每个单元包括承载硅片的框架1，所述框架1与所述硅片3承载接触的界面2呈现一设定的角度4，所述框架1在每个该单元内有相互连接的四块载板，所述四块载板无缝连接，保持在同一水平面，在镀膜过程中承载所述硅片3。
于本实施例中，所述设定的角度4为0-90°，优选的，在其他实施例中，所述设定的角度4为30-45°。
于本实施例中，多个所述单元相连并共用一个所述框架1，且所述框架1得到厚度为5-12mm，所述框架1的宽度为3-20mm。
于本实施例中，所述载板包括5-20个所述单元。
于本实施例中，所述载板的材质为碳纤维。
本发明未详述之处，均为本领域技术人员的公知技术。
本领域的技术人员应理解，上述描述的本发明的实施例以及附图只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明，在没有背离所述原理下，本发明的实施方式可以有任何变形或修改。

Claims (8)

1.一种用于改善板式镀膜效果的载板，该载板至少包括一个单元，其特征在于，每个单元包括承载硅片的框架，所述框架与所述硅片承载接触的界面呈现一设定的角度。
2.根据权利要求1所述的用于改善板式镀膜效果的载板，其特征在于，所述框架在每个该单元内有相互连接的四块载板，所述四块载板无缝连接，保持在同一水平面，在镀膜过程中承载所述硅片。
3.根据权利要求1所述的用于改善板式镀膜效果的载板，其特征在于，所述设定的角度为0-90°。
4.根据权利要求1所述的用于改善板式镀膜效果的载板，其特征在于，所述设定的角度为30-45°。
5.根据权利要求1所述的用于改善板式镀膜效果的载板，其特征在于，多个所述单元相连并共用一个所述框架。
6.根据权利要求5所述的用于改善板式镀膜效果的载板，其特征在于，所述框架厚度为5-12mm，所述框架宽度为3-20mm。
7.根据权利要求2所述的用于改善板式镀膜效果的载板，其特征在于，所述载板包括5-20个所述单元。
8.根据权利要求2所述的用于改善板式镀膜效果的载板，其特征在于，所述载板的材质为碳纤维。
CN201910700112.0A 2019-07-31 2019-07-31 用于改善板式镀膜效果的载板 Pending CN110491968A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110978720A (zh) * 2019-11-29 2020-04-10 无锡智上新材料科技有限公司 一种耐高温碳纤维复合材料载板的制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN208637394U (zh) * 2018-09-21 2019-03-22 中节能太阳能科技（镇江）有限公司 一种perc电池片的石墨框装置及电池片镀膜设备
CN110211906A (zh) * 2019-04-22 2019-09-06 江苏润阳悦达光伏科技有限公司 石墨舟夹具

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN208637394U (zh) * 2018-09-21 2019-03-22 中节能太阳能科技（镇江）有限公司 一种perc电池片的石墨框装置及电池片镀膜设备
CN110211906A (zh) * 2019-04-22 2019-09-06 江苏润阳悦达光伏科技有限公司 石墨舟夹具

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110978720A (zh) * 2019-11-29 2020-04-10 无锡智上新材料科技有限公司 一种耐高温碳纤维复合材料载板的制备方法

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Application publication date: 20191122