CN110211906A - 石墨舟夹具 - Google Patents
石墨舟夹具 Download PDFInfo
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- CN110211906A CN110211906A CN201910322897.2A CN201910322897A CN110211906A CN 110211906 A CN110211906 A CN 110211906A CN 201910322897 A CN201910322897 A CN 201910322897A CN 110211906 A CN110211906 A CN 110211906A
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- Prior art keywords
- graphite boat
- axis
- pedestal
- card
- fixture
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 33
- 229910002804 graphite Inorganic materials 0.000 title claims abstract description 33
- 239000010439 graphite Substances 0.000 title claims abstract description 33
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000007787 solid Substances 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 14
- 229910052710 silicon Inorganic materials 0.000 abstract description 14
- 239000010703 silicon Substances 0.000 abstract description 14
- 238000005299 abrasion Methods 0.000 abstract description 3
- 238000004140 cleaning Methods 0.000 abstract description 3
- 239000012634 fragment Substances 0.000 abstract description 3
- 230000008439 repair process Effects 0.000 abstract description 3
- 238000000926 separation method Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 6
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
本发明属于工装夹具领域,尤其涉及一种石墨舟夹具,包括该夹具包括底座、卡轴以及卡帽,该底座两侧对称固定该卡轴,该卡轴远离该底座一端固定连接该卡帽,该底座与该卡轴之间设有该卡槽,该卡槽呈U型开设于该卡轴上,该卡帽至该卡槽之间设有倒角。本发明的石墨舟夹具,加厚卡帽可有效保护石墨舟夹具的磨损及意外触碰导致的损坏,增加石墨舟夹具使用寿命及减少产线返修率;同时倒角可降低因插不到位导致的碎片及不良,并方便清理夹具内异物;卡槽宽度小于常规U型卡槽间距,减小硅片与底座之间的空隙,使硅片与石墨舟片贴合更加紧密。
Description
技术领域
本发明属于工装夹具领域,尤其涉及一种石墨舟夹具。
背景技术
在太阳能在太阳能电池片的制造过程中,硅片进行其表面镀膜工序时,需要将未镀膜的硅片插入PECVD真空镀膜设备的石墨舟上,具体操作过程是将硅片插入石墨舟并通过石墨舟夹具定位于其上,将载有硅片的石墨舟放置在PECVD真空镀膜设备中,采用PECVD工艺对硅片进行镀膜。
目前使用的常规主要是两种:V型与U型;V型卡槽的槽内尺寸较小,在插片过程中硅片易造成划伤,另因V型卡槽空间细小易因沉积氮化硅而导致插取片过程崩边或缺角,影响产品合格率并且工艺过程中夹具烧焦严重;U型卡槽的槽体位置及卡帽斜度增大,相对减少了划伤、崩边问题;但是U型卡槽烧焦后,异物难以处理;还有其槽体为平行设计,如果硅片接触放置滑落槽底与舟叶吻合度不高,则气流会绕镀到正膜,对应正膜边缘夹具会形成绕镀印,影响正膜外观。
发明内容
本发明的目的是解决上述现有技术的不足,提供一种减小硅片与夹具底座之间的空隙,使硅片与石墨舟贴合更加紧密的石墨舟夹具。
本发明解决上述现有技术的不足所采用的技术方案是:一种石墨舟夹具,包括底座、卡轴以及卡帽,该底座两侧对称固定该卡轴,该卡轴远离该底座一端固定连接该卡帽,该底座与该卡轴之间设有该卡槽,该卡槽呈U型开设于该卡轴上,该卡帽至该卡槽之间设有一倒角。
优选的,该卡帽至该卡槽之间的倒角为54°~55°。
优选的,该卡槽的宽度为0.3~0.4mm。
优选的,该卡帽为圆形,厚度为1.29~1.39mm。
优选的,该底座、卡轴以及卡帽为一体成型结构。
优选的,该底座和卡帽的中心轴处于同一基准线上。
本发明的有益效果是,本发明的石墨舟夹具,加厚卡帽可有效保护石墨舟夹具的磨损及意外触碰导致的损坏,增加石墨舟夹具使用寿命及减少产线返修率;同时倒角可降低因插不到位导致的碎片及不良,并方便清理石墨舟夹具内异物;卡槽宽度小于常规U型卡槽间距,硅片能与石墨舟片贴合的更加紧密,极大减小硅片与底座之间的空隙,从而减少气流绕镀到硅片背面,降低正膜边缘石墨舟夹具绕镀印,改善正膜膜色,提高正膜的片内颜色的均匀性,进一步满足市场对高标准外观膜色的要求,应用前景广阔。
附图说明
图1为本发明石墨舟夹具的一种实施例的立体图,为该实施例的主视图。
图2为图1实施例的主视图。
具体实施方式
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例,本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。
在本发明的描述中,需要说明的是,术语“上”、“下”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。
在本发明的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“连接”、“相连”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体的连接;可以是机械连接,也可以是电连接; 可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本发明中的具体含义。
图1、图2示出了本发明石墨舟夹具的一种实施例结构示意图,也是一种优选实施例示意图。如图1-2所示,本实施例的石墨舟夹具1包括底座11、卡轴12以及卡帽13,该底座11两侧对称固定该卡轴12,该卡轴12远离该底座11一端固定连接该卡帽13,该底座11与该卡轴12之间设有该卡槽14,该卡槽14呈U型开设于该卡轴12上,该卡帽13至该卡槽14之间设有一倒角。
于本实施例中,该倒角为54°~55°,倒角可降低因插不到位导致的碎片及不良,并方便清理石墨舟夹具1内的异物。
于本实施例中,该卡槽的宽度为0.3~0.4mm;该卡帽为圆形,厚度为1.29~1.39mm,加厚卡帽可有效保护石墨舟夹具的磨损及意外触碰导致的损坏,增加石墨舟夹具使用寿命及减少产线返修率。
于本实施例中,该底座11、卡轴12以及卡帽13为一体成型结构,且该底座11和卡帽13的中心轴处于同一基准线上。
本发明未详述之处,均为本领域技术人员的公知技术。
本领域的技术人员应理解,上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明,在没有背离该原理下,本发明的实施方式可以有任何变形或修改。
Claims (6)
1.一种石墨舟夹具,其特征在于,该夹具包括底座、卡轴以及卡帽,该底座两侧对称固定该卡轴,该卡轴远离该底座一端固定连接该卡帽,该底座与该卡轴之间设有该卡槽,该卡槽呈U型开设于该卡轴上,该卡帽至该卡槽之间设有一倒角。
2.根据权利要求1所述的石墨舟夹具,其特征在于,该卡帽至该卡槽之间的倒角为54°~55°。
3.根据权利要求2所述的石墨舟夹具,其特征在于,该卡槽的宽度为0.3~0.4mm。
4.根据权利要求3所述的石墨舟夹具,其特征在于,该卡帽为圆形,厚度为1.29~1.39mm。
5.根据权利要求4所述的石墨舟夹具,其特征在于,该底座、卡轴以及卡帽为一体成型结构。
6.根据权利要求5所述的石墨舟夹具,其特征在于,该底座和卡帽的中心轴处于同一基准线上。
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CN201910322897.2A CN110211906A (zh) | 2019-04-22 | 2019-04-22 | 石墨舟夹具 |
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Cited By (1)
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CN110491968A (zh) * | 2019-07-31 | 2019-11-22 | 江苏润阳悦达光伏科技有限公司 | 用于改善板式镀膜效果的载板 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109244020A (zh) * | 2018-11-06 | 2019-01-18 | 通威太阳能(安徽)有限公司 | 一种新型管式pecd石墨舟卡点 |
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CN109244020A (zh) * | 2018-11-06 | 2019-01-18 | 通威太阳能(安徽)有限公司 | 一种新型管式pecd石墨舟卡点 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110491968A (zh) * | 2019-07-31 | 2019-11-22 | 江苏润阳悦达光伏科技有限公司 | 用于改善板式镀膜效果的载板 |
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Application publication date: 20190906 |