CN110470971A - A kind of SPI measuring fixture and method for measurement - Google Patents
A kind of SPI measuring fixture and method for measurement Download PDFInfo
- Publication number
- CN110470971A CN110470971A CN201910653297.4A CN201910653297A CN110470971A CN 110470971 A CN110470971 A CN 110470971A CN 201910653297 A CN201910653297 A CN 201910653297A CN 110470971 A CN110470971 A CN 110470971A
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- probe
- spi
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- row
- point seat
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The present invention provides a kind of SPI measuring fixture and method for measurement, belong to the technical field of SPI measurement.A kind of its technical solution are as follows: SPI measuring fixture, including pedestal and carbon-point seat, the base bottom is placed on SPI chip, the base top is provided with the carbon-point seat, circuit is provided on the pedestal end face, the pedestal realizes the connection with the carbon-point seat by the circuit, realizes the signal testing to SPI chip eventually by carbon-point seat.The invention has the benefit that can quickly put on the Chip needed a little using this jig, and repeat to weld without using soldering iron；Welded manually and using jig test result comparison in difference, the time it takes is measured using jig substantially to shorten, if five minutes weld intervals need to be spent using soldering iron welding, as long as using estimating after jig ten seconds, the process for saving welding is also reduced with the damage risk for surveying object.
Description
Technical field
The present invention relates to the SPI technical field measured more particularly to a kind of SPI measuring fixtures and method for measurement.
Background technique
SPI is the abbreviation of Serial Peripheral Interface, and Chinese means serial peripheral interface, due to tool
Low pin count is had, structure is simple, and transmission speed is fast, and the characteristics such as easy to use have become the usual standard of industry at present.
When measuring SPI, there are many Chip of 8PIN foot, in order to ensure signal integrity, so needing when doing product development
Signal testing is done for each this kind of Chip, due to the dynamic then tens of Chip of set of system, so many need to be expended
The resources such as time, equipment and manpower are all using the duplicate welding of soldering iron at this stage, and then probe goes to be measured on frame, institute
It goes to measure these Chip when carrying out SPI measurement, constantly to reuse the ground wire of soldering iron probe and set up probe, it is this
Method for measurement is more time-consuming.
Summary of the invention
In view of the above technical problems, measurement step can be saved and reduce measurement low speed news the present invention by providing one kind
Number when easily cause risk and mistake SPI measuring fixture and method for measurement.
The present invention is achieved through the following technical solutions: a kind of SPI measuring fixture, including pedestal and carbon-point seat, institute
It states base bottom to be placed on SPI chip, the base top is provided with the carbon-point seat, is provided on the pedestal end face
Circuit, the pedestal realize the connection with the carbon-point seat by the circuit, realize eventually by carbon-point seat to SPI chip
Signal testing.
Further, probe is provided on the carbon-point seat, the probe runs through the carbon-point seat, and one end is arranged described
Carbon-point seat top, the other end are arranged in carbon-point seat bottom.
Further, the probe is arranged on the carbon-point seat for two row three-row, and the probe of each column is one group,
The probe is three groups.
Further, the pedestal is photosensitive circuit plate.
Further, the circuit includes interface, conducting wire and probe aperture, and the SPI chip is provided in the interface
On pin foot, the probe aperture is also the arrangement of two row three-row, is provided with the probe in the probe aperture.
Further, the pin foot includes signal foot and grounding leg.
Further, the interface includes No.1 interface, No. four interfaces, No. five interfaces and No. six interfaces, the No.1
Interface corresponds to the CS signal foot on the SPI chip, and No. four interfaces correspond to the GND grounding leg on the SPIchip, institute
It states No. five interfaces and corresponds to DATA signal foot on the SPI chip, No. six interfaces correspond to the news of the CLK on the SPI chip
Number foot.
Further, be provided with the conducting wire between the adjacent probe aperture of the second row, the second row secondary series it is described
Probe aperture is connect with No. four interfaces by the conducting wire.
Further, the probe of the first row first row is connect with the No.1 interface by the conducting wire, the second row
The probe of first row is connect by the probe of the second row secondary series with No. four interface leads, the first row secondary series
The probe connect with No. six interfaces by the conducting wire, the probe of the second row secondary series and No. four interfaces
Conducting wire connection, the tertial probe of the first row are connect with No. five interfaces by the conducting wire, and the second row is tertial
The probe is connect by the probe of the second row secondary series with No. four interface leads.
A kind of method for measurement using SPI measuring fixture, comprising the following steps:
Step 1: pedestal is placed on above the SPI chip；
Step 2: it is placed on the CS signal foot on SPI chip in the No.1 interface, GND grounding leg is made to be placed on four
In number interface, it is placed on DATA signal foot in No. five interfaces, is placed on CLK signal foot in No. six interfaces；
Step 3: carbon-point seat being pasted on the base, probe is inserted into carbon-point seat, and probe one end is arranged
On the top of the carbon-point seat, the lower part of the carbon-point seat is arranged in the other end, and the probe of lower part is interspersed in the probe
In hole, and probe is kept not touch SPI chip；
Step 4: will be in the jack on the probe insertion carbon-point above carbon-point seat, it can realize the signal to SPIchip
Test.
The invention has the benefit that can quickly be put on the Chip needed a little using this jig, and without using ironing
Iron repeats to weld.Welded manually and using jig test result comparison in difference, measure the time it takes using jig
Substantially shorten, if five minutes weld intervals need to be spent using soldering iron welding, as long as saving using estimating after jig ten seconds
The process of welding also reduces the damage risk of band survey object.
Detailed description of the invention
Fig. 1 is SPI structure schematic diagram.
Fig. 2 is structural schematic diagram of the invention.
Fig. 3 is the configuration schematic diagram of pedestal and carbon-point seat.
Fig. 4 is the structural schematic diagram of carbon-point seat.
Fig. 5 is the structural schematic diagram of pedestal.
Wherein, appended drawing reference are as follows: 1, pedestal；2, carbon-point seat；21, probe；4, circuit；41, interface；411, No.1 interface；
412, No. four interfaces；413, No. five interfaces；414, No. six interfaces；42, conducting wire；43, probe aperture.
Specific embodiment
In order to clarify the technical characteristics of the invention, being illustrated below by specific embodiment to this programme.
SPI is the abbreviation of Serial Peripheral Interface, and Chinese means serial peripheral interface, due to tool
Low pin count is had, structure is simple, and transmission speed is fast, and the characteristics such as easy to use ... have become the usual standard of industry at present:
More than have on single chip microcontroller, many new soc chips directly just support multiple groups SPI interface, or even spread to gang mould
The product (such as: the LCD module (SDI interface) of mobile phone, camera model) of block and 3C Product is (such as: the memory of digital camera
Card) it is also all using SPI interface.
As shown in Figure 1, SPI is a master-slave architecture, usually there are a Master (main equipment) and one (or multiple)
Slave (from equipment).Wherein, SPI (Serial Peripheral Interface) is master-slave mode synchronous serial communication, can be divided
For either simplex/half-duplex/full duplex:
Either simplex: the signal on route can only do one-way transmission.
Half-duplex: the signal on route can be bi-directionally transmitted, but cannot transmit simultaneously.
Full duplex: the signal on route can be transmitted simultaneously bi-directionally.
Synchronous: the same CLOCK is shared in transmission end and receiving end.
All transmission can be all produced from according to a common frenquency signal, this frenquency signal " master control set (Master
End) ", slave unit (end Slave) can synchronize the bit streams received with this frenquency signal.For master to
The SPI standard measurement of slave needs to use four pin, is CLK, DATA, CS and GND respectively.
Such as Fig. 2-5, the present invention is a kind of SPI measuring fixture, including pedestal 1 and carbon-point seat 2, and 1 bottom of pedestal is placed on
On SPI chip, carbon-point seat 2 is provided at the top of pedestal 1, is provided with circuit 4 on 1 end face of pedestal, pedestal 1 by circuit 4 realize with
The connection of carbon-point seat 2 realizes the signal testing to SPIchip eventually by carbon-point seat 2.
Probe 21 is provided on carbon-point seat 2, probe 21 runs through carbon-point seat 2, and one end is arranged in 2 top of carbon-point seat, the other end
It is arranged in 2 bottom of carbon-point seat.
Probe 21 is arranged on carbon-point seat 2 for two row three-row, and the probe 21 of each column is one group, and probe 21 is three groups.
Pedestal 1 is photosensitive circuit plate.
Circuit 4 includes interface 41, conducting wire 42 and probe aperture 43, and the pin foot being provided on SPI chip in interface 41 is visited
Pin hole 43 is also arranged for two row three-row, is provided with probe 21 in probe aperture 43.
Pin foot includes signal foot and grounding leg.
Interface 41 includes the interface 413 of interface 412, five of No.1 interface 411, four and No. six interfaces 414, No.1 interface
CS signal foot on 411 corresponding SPI chip, No. four interfaces 412 correspond to the GND grounding leg on SPI chip, No. five interfaces 413
DATA signal foot on corresponding SPI chip, No. six interfaces 414 correspond to the CLK signal foot on SPI chip.
Conducting wire 42, the probe aperture 43 of the second row secondary series and No. four interfaces are provided between the adjacent probe aperture 43 of second row
412 are connected by conducting wire 42.
The probe 21 of the first row first row is connect with No.1 interface 411 by conducting wire 42, the probe 21 of the second row first row
It is connect by the probe 21 of the second row secondary series with No. four 412 conducting wires of interface, the probe 21 of the first row secondary series and No. six interfaces
414 are connected by conducting wire 42, and the probe 21 of the second row secondary series is connect with No. four 412 conducting wires of interface, the tertial spy of the first row
Needle 21 is connect with No. five interfaces 413 by conducting wire 42, and the tertial probe 21 of the second row passes through the probe 21 of the second row secondary series
It is connect with No. four 412 conducting wires of interface.
A kind of method for measurement using SPI measuring fixture, comprising the following steps:
Step 1: pedestal 1 is placed on above SPI chip；
Step 2: it is placed on the CS signal foot on SPI chip in No.1 interface 411, GND grounding leg is made to be placed on four
In number interface 412, it is placed on DATA signal foot in No. five interfaces 413, is placed on CLK signal foot in No. six interfaces 414；
Step 3: carbon-point seat 2 is pasted on pedestal 1, probe 21 is inserted into carbon-point seat 2, and make 21 one end of probe
The top of carbon-point seat 2 is set, the lower part of carbon-point seat 2 is arranged in the other end, and the probe 21 of lower part is interspersed in probe aperture 43, and
And probe 21 is kept not touch SPI chip；
Step 4: the probe 21 of 2 top of carbon-point seat is inserted into the jack on carbon-point, it can realize to SPI chip's
Signal testing.
The working principle of the invention: being placed on SPI chip for pedestal, makes CS signal foot, DATA signal on SPI chip
Foot, CLK signal foot and GND grounding leg are individually positioned in the corresponding interface of pedestal, and probe is inserted on carbon-point seat, and probe is inserted
It connects in the probe aperture of pedestal, such as the working principle of first group of probe, the probe of the first row first row contact CS signal foot,
The probe of second row first row contacts GND grounding leg, then the probe of the probe of the first row first row and the second row first row is arranged
On a carbon-point, a circuit is formed, realizes the test to CS signal foot.
Technical characteristic of the present invention without description can realize that details are not described herein by or using the prior art, certainly,
The above description is not a limitation of the present invention, and the present invention is also not limited to the example above, the ordinary skill of the art
The variations, modifications, additions or substitutions that personnel are made within the essential scope of the present invention also should belong to protection model of the invention
It encloses.
Claims (10)
1. a kind of SPI measuring fixture, which is characterized in that including pedestal and carbon-point seat, the base bottom is placed on SPI
On chip, the base top is provided with the carbon-point seat, and circuit is provided on the pedestal end face, and the pedestal passes through described
Circuit realizes the connection with the carbon-point seat, realizes the signal testing to SPI chip by carbon-point seat.
2. SPI measuring fixture according to claim 1, which is characterized in that be provided with probe, the spy on the carbon-point seat
Needle runs through the carbon-point seat, and one end setting is arranged in carbon-point seat top, the other end in carbon-point seat bottom.
3. SPI measuring fixture according to claim 2, which is characterized in that the probe is two rows on the carbon-point seat
Three-row arrangement, the probe of each column are one group, and the probe is three groups.
4. SPI measuring fixture according to claim 3, which is characterized in that the pedestal is photosensitive circuit plate.
5. SPI measuring fixture according to claim 4, which is characterized in that the circuit includes interface, conducting wire and probe
Hole, the pin foot being provided in the interface on the SPI chip, the probe aperture are also the arrangement of two row three-row, the spy
The probe is provided in pin hole.
6. SPI measuring fixture according to claim 5, which is characterized in that the pin foot includes signal foot and ground connection
Foot.
7. SPI measuring fixture according to claim 6, which is characterized in that the interface include No.1 interface, No. four connect
Mouth, No. five interfaces and No. six interfaces, the No.1 interface correspond to the CS signal foot on the SPIchip, No. four interfaces
GND grounding leg on the corresponding SPI chip, No. five interfaces correspond to DATA signal foot on the SPI chip, and described six
Number interface corresponds to the CLK signal foot on the SPI chip.
8. SPI measuring fixture according to claim 7, which is characterized in that set between the adjacent probe aperture of the second row
It is equipped with the conducting wire, the probe aperture of the second row secondary series is connect with No. four interfaces by the conducting wire.
9. SPI measuring fixture according to claim 8, which is characterized in that the probe of the first row first row with it is described
No.1 interface is connected by the conducting wire, the probe and institute of the probe of the second row first row by the second row secondary series
No. four interface lead connections are stated, the probe of the first row secondary series is connect with No. six interfaces by the conducting wire, and second
The probe of row secondary series is connect with No. four interface leads, the tertial probe of the first row and No. five interfaces
It is connected by the conducting wire, the tertial probe of the second row is connect by the probe of the second row secondary series with described No. four
Mouth conducting wire connection.
10. a kind of utilize the method for measurement using SPI measuring fixture described in any one of claim 1-9, including following step
It is rapid:
Step 1: pedestal is placed on above the SPI chip；
Step 2: being placed on the CS signal foot on SPIchip in the No.1 interface, so that GND grounding leg is placed on No. four and connects
In mouthful, it is placed on DATA signal foot in No. five interfaces, is placed on CLK signal foot in No. six interfaces；
Step 3: carbon-point seat being pasted on the base, probe is inserted into carbon-point seat, and probe one end is arranged in institute
The top of carbon-point seat is stated, the lower part of the carbon-point seat is arranged in the other end, and the probe of lower part is interspersed in the probe aperture,
And probe is kept not touch SPI chip；
Step 4: will be in the jack on the probe insertion carbon-point above carbon-point seat, it can realize and the signal of SPI chip is surveyed
Examination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910653297.4A CN110470971B (en) | 2019-07-19 | 2019-07-19 | SPI measuring jig and measuring method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910653297.4A CN110470971B (en) | 2019-07-19 | 2019-07-19 | SPI measuring jig and measuring method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110470971A true CN110470971A (en) | 2019-11-19 |
| CN110470971B CN110470971B (en) | 2021-08-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910653297.4A Active CN110470971B (en) | 2019-07-19 | 2019-07-19 | SPI measuring jig and measuring method |
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| Country | Link |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW461510U (en) * | 2000-06-29 | 2001-10-21 | Asustek Comp Inc | Tool adapting device |
| US6509754B2 (en) * | 2000-06-29 | 2003-01-21 | Asustek Computer Inc. | CPU adapter for a motherboard test machine |
| CN201107774Y (en) * | 2007-09-28 | 2008-08-27 | 佛山市顺德区顺达电脑厂有限公司 | SPI detection card |
-
2019
- 2019-07-19 CN CN201910653297.4A patent/CN110470971B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW461510U (en) * | 2000-06-29 | 2001-10-21 | Asustek Comp Inc | Tool adapting device |
| US6509754B2 (en) * | 2000-06-29 | 2003-01-21 | Asustek Computer Inc. | CPU adapter for a motherboard test machine |
| CN201107774Y (en) * | 2007-09-28 | 2008-08-27 | 佛山市顺德区顺达电脑厂有限公司 | SPI detection card |
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| Publication number | Publication date |
|---|---|
| CN110470971B (en) | 2021-08-20 |
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