CN110462096A - Material deposition arrangement, the method for deposition materials and material deposition chambers - Google Patents
Material deposition arrangement, the method for deposition materials and material deposition chambers Download PDFInfo
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- CN110462096A CN110462096A CN201780088859.4A CN201780088859A CN110462096A CN 110462096 A CN110462096 A CN 110462096A CN 201780088859 A CN201780088859 A CN 201780088859A CN 110462096 A CN110462096 A CN 110462096A
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- Prior art keywords
- material deposition
- valve components
- deposition arrangement
- temperature
- valve
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45561—Gas plumbing upstream of the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K49/00—Means in or on valves for heating or cooling
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K49/00—Means in or on valves for heating or cooling
- F16K49/002—Electric heating means
Abstract
Describe a kind of material deposition arrangement chamber (1000) for being deposited on material on substrate.Material deposition arrangement chamber includes device for vacuum generation (1060) and material deposition arrangement (100).Material deposition arrangement has valve components (200), and valve components are configured as adjusting and the material of the material of deposition circulates.
Description
Technical field
Embodiment of the present disclosure is related to a kind of material deposition arrangement, including valve components.In addition, embodiment is related to one kind
Material deposition chambers.Furthermore a kind of technique that embodiment further relates to deposition for material.In particular, the implementation of the disclosure
Mode is related to such as making in few techniques field needing to evaporate different materials to form several layers in the case where on several substrates
The vacuum coated of several substrates.
Background technique
Evaporation technology for deposition materials generally comprises two kinds of basic technologies；Source materials evaporate and are then condensed in base
On plate.Executing evaporation has several methods, and one of method for executing evaporation is hot method, wherein such as metal material supply to
On the semimetal of heating, or it is placed in crucible.Semimetal seems ceramics.Crucible is e.g. electrically heated.Molten metal material
Cloud is flashed to above source, and is directed to substrate then to be used to form one or more sedimentaries.
However, evaporation technique is not limited to evaporated metal, but can also be executed in conjunction with organic material.Organic evaporating device is for example
Suitable for manufacturing Organic Light Emitting Diode (organic light-emitting diodes, OLEDs).For such diode
Function for, the luminescent layer of specific organic compound is deposited on substrate appropriate.This layer is then thin including deposition materials
Film.OLEDs comes to use such as manufacture video screen, monitor, plate, smartphone and other hands in combination with several applications
Hold device etc..In addition, many other applications are expected in OLED technology field.
A parameter when evaporating material is temperature.Using temperature with hydatogenesis material.Temperature not only with ensuring when
Between efficiency, material it is interference-free related with the physical state that suitably changes, further include having height requirement to material and structure design.
It is very expensive in view of the material being contained in technique, the loss of any material will be avoided.
Therefore, there is demand for material deposition arrangement and technique, and suitable for being used such situation as mentioned.
Summary of the invention
In view of above-mentioned, a kind of material deposition arrangement as indicated by the independent claim, a kind of material deposition arrangement chamber are proposed
Room and a kind of method for material to be deposited on substrate.Other aspect, advantage and features of the disclosure are wanted according to right
Ask, the description and the appended drawings it is apparent.
According to the one side of the disclosure, a kind of material deposition arrangement is proposed.Material deposition arrangement includes valve components, wherein extremely
Least a portion of valve components are heatable.
According to the one side of the disclosure, a kind of material deposition arrangement chamber is proposed.Material deposition arrangement chamber includes one kind
Arrangement and device for vacuum generation are deposited according to the material of embodiment as described herein.
According to the one side of the disclosure, a kind of method for material to be deposited on substrate is proposed.The method includes straight
Ground connection heating valve components.
Detailed description of the invention
Hereinafter, the brief description of accompanying drawing is provided.These figures are intended to help to explain in detail this hair disclosed in lower section
It is bright.
Fig. 1 shows the sectional view according to the material of some embodiments described herein deposition arrangement；
Fig. 2 shows the sections for being located at the valve components in first position with valve components according to embodiment described herein
Figure；
Fig. 3 is shown according to the constructed profile of the valve components referring to embodiment described in Fig. 2, and wherein valve components are located at the
Two positions；
Fig. 4 shows the constructed profile of the valve components according to embodiment as described herein；
Fig. 5 shows the constructed profile of the closing device according to embodiment as described herein；
Fig. 6 shows the constructed profile of the closing device according to embodiment as described herein；
Fig. 7 is shown according to embodiment as described herein with driving mechanism and the actuator for attaching to driving mechanism
The sectional view of valve components；
Fig. 8 shows the constructed profile of the valve components with driving mechanism according to embodiment as described herein；
Fig. 9 shows the signal of the valve components being located in first position with valve components according to embodiment as described herein
Sectional view；
Figure 10 shows the constructed profile of the valve components of reference Fig. 9 according to embodiment as described herein, wherein valve member
Part is located at the second position；
Figure 11 shows the constructed profile of the valve components according to embodiment as described herein；
Figure 12 shows the constructed profile of the valve components according to embodiment as described herein；
Figure 13 shows the constructed profile of the material deposition chambers according to embodiment as described herein.
Specific embodiment
Detailed reference will be reached now with several implementations, and one or more examples of several implementations are illustrated in
In each schema.Each example is provided by way of explanation and it is not intended that for limitation.For example, it is illustrated or narration and as a reality
The feature for applying the part of mode can be used for any other embodiment or in conjunction with any other embodiment, further to obtain
Embodiment.This means that the disclosure includes these adjustment and variation.
In the explanation of the lower section of figure, identical reference numerals mean same or similar element.In general, only about
The deviation of individual embodiments is illustrated.Unless otherwise indicated, the explanation of a part in an embodiment or aspect
The corresponding part or aspect that can be also applied in another embodiment.
Before the several implementations of the disclosure are described in more detail, about division name as used herein and expression
Some aspects explain.
In the disclosure, " material deposition arrangement " is interpreted as arranging, is configured for material deposition.In particular, " material is heavy
Product arrangement " can be regarded as arranging, be configured for before being directed to substrate, deposits and has been converted into gaseous material." material
Deposition arrangement " provides the evaporation of material for example including crucible.The material of evaporation is then sent to via entrance and/or outlet
It substrate and is deposited on substrate.
In the disclosure, " crucible " is interpreted as a structure, allows in applied at elevated temperature, especially in high-temperature process material." earthenware
Pot " for example can be connected to spray head via shell, hollow space, pipe and/or valve." crucible " can also for can generating material evaporation
Evaporator a part.
In the disclosure, " spray head " is interpreted as spray form device, provides being distributed on substrate for deposition materials." spray head " can
Including several openings, it is connected to shell, hollow space, pipe and/or valve.Evaporated material in shell, hollow space, pipe and/or
It provides or guides in valve, such as provide or be directed to substrate from evaporation crucible.Spray head can in horizontal or vertical direction or level or
Other positions guiding between vertical orientation.
In the disclosure, " valve components " are interpreted as valve.It may flow through this valve for any material of liquid phase or gas phase." valve
The general connecting material source of element " is to material terminal and provides the control of this connection." valve components " can shadow as used herein
Ring following one or more factors: flow rate, flowing velocity and back pressure (back pressure) can be by adjusting " valve members
Part " is adjusted.Furthermore " valve components " can be used, to adjust the circulation for having evaporated material for being sent to spray head from crucible." valve member
Part " can be single part, in conjunction with entrance and/or outlet or can be arranged between entrance and/or outlet." valve components " can
As shutter." valve components " provide and are used to control the flowing by material deposition arrangement." valve components " can be tradable.
" valve components " are applicable to disposable application.
In the disclosure, " flowing " or " flowing through " be interpreted as can two-way generation particle flowing.For example, having evaporated
Material can flow through valve components from evaporator in the direction of spray head.In addition, particle can be in the direction of evaporator from material
Deposition arrangement chamber.Valve components can control, limit and/or avoid " to flow ".
In the disclosure, " contact area " is interpreted as a part of tube wall.This part of tube wall can contact another element, example
Such as when closing valve components, by a part for the inner pipe wall that contact element occupies." contact area " can be positioned adjacent to valve neck,
It or can be a part of valve neck.
In the disclosure, " valve neck " is interpreted as entrance tube wall or exports the construction of tube wall." valve neck " can be used as closing
The boundary of device.
In the disclosure, " inlet tube " is interpreted as a pipe, can be used as the connector between evaporator and spray head.It is general next
It says, " inlet tube " is connected to valve components and/or outlet in side, and is connected to evaporator in the other side." inlet tube " can
It further include valve neck.Diameter can change in the different sections of pipe." inlet tube " generally comprises two walls, inside and outside tube wall.
In the disclosure, " outlet " is interpreted as a pipe, can be used as the connector between evaporator and spray head.It is general next
It says, " outlet " is connected to valve components and/or inlet tube in side, and is connected to spray head in the other side." outlet " can be also
Including valve neck.Diameter can change in the different sections of pipe." outlet " generally comprises two walls, inside and outside tube wall.
In the disclosure, " orienting in Way in " is interpreted as closing a position of device.It can direction when closing device
When inlet tube orients, closing device can be used " entry position ".When being located in " entry position ", closing device can be in vertical position
In setting.
In the disclosure, " orienting in export direction " is interpreted as closing a position of device.It can direction when closing device
When outlet orients, closing device can be used " outlet port ".When being located in " outlet port ", closing device can be in horizontal position
In setting.
In the disclosure, " about " is understood as the deviation for example including ± 20%, especially ± 15% deviation, and more
Especially ± 10% deviation.
Fig. 1 shows the constructed profile according to the material of some embodiments described herein deposition arrangement 100.Material deposition
Arrangement 100 can be used and especially be used for coated substrates.Substrate can be the material for each group being coated with suitable for heat deposition, example
Such as film or foil.According to embodiment, material deposition arrangement 100 may include evaporator 110 and spray head 120, but be not limited to these spies
Sign.Evaporator 110 may include crucible 112.Evaporator may be connected to inlet tube 115.
Valve components 200 can control the connection between evaporator and/or crucible and spray head 120.Valve components 200 can be disposed at into
Between mouth pipe 115 and outlet 116.Valve components can provide the isolated from atmosphere of evaporator and spray head.Outlet 116 may be connected to spray
First 120.
Crucible can be used the material of deposition in heating.Crucible can such as groove seat (tub).Being used in can be with reality described herein
The general material for the depositing operation that the mode of applying is used together can for metal, organic semiconductor or seem silica material.It will
The state (shape) of the Effect of Materials of deposition technique therein, because may depend on the parameter of the material of deposition for handling
Physics and the chemical characteristic of material and difference.The temperature of crucible is adjustable.Temperature is adjusted can be especially by conversion chemistry or electricity
Transmission and/or the generation of thermal energy be can be carried out to execute.The applicable example for heating mechanism can are as follows: heating wire, thermal element,
Casing heats (jacket tube heating), quartzy radiator and/or graphite heating main body (graphite heating
bodies)。
For example, the operation temperature of material deposition arrangement can be in the range between 300 DEG C to 800 DEG C.Evaporator and/or
Crucible can be made with thermostabilization, heat-resisting and/or inert material, be especially made with metal, be especially made with carbon, more particularly not
Rust steel or titanium are made.Inlet tube 115 can provide the transmission of deposition materials.According to embodiment, inlet tube 115 and outlet 116
It can provide deposition materials transmission.Inner tube may include inner wall 111 and outer wall 113.Outlet can further include inner wall 117 and outer wall
118.Inner wall 111,117 can be heat conductor, and outer wall 113,118 can be heat insulator.Heat up at least part of material deposition cloth
It sets for 100, it can be using the gap between inlet tube and/or the inner and outer wall of outlet.
According to embodiment, all parts of material deposition arrangement can be heated.A part carries out heating and another portion
It is also feasible for dividing without heating.Evaporator, inlet tube, outlet, spray head and/or valve components may include double-walled, wherein in
Wall can be heat conductor, and outer wall can be heat insulator.Controller is configurable, with the temperature for setting heatable section.For example, earthenware
Pot can be heated to the most suitable material depositing temperature of the material of deposition.The temperature of valve components 200 can be set higher than crucible
112 temperature.For example, this temperature can be set in higher than between 5 DEG C and 20 DEG C, especially greater than about 10 DEG C.Spray head 120 can add
Heat a to temperature, this temperature is higher than the temperature of valve components 200.For example, this temperature can be set in the temperature of at least above valve components 200
Between 5 DEG C and 20 DEG C of degree, especially greater than about 10 DEG C.
For example, the material of deposition is heated to 450 DEG C.Valve components can be heated to 460 DEG C.In this example, spray head can have
There is 470 DEG C of temperature.
Gap between inner and outer wall can be used in the temperature for adjusting material deposition arrangement.Temperature is adjusted can be especially logical
It crosses conversion chemistry or electric energy carries out transmission and/or the generation of thermal energy to execute.The applicable example for heating mechanism can are as follows:
Heating wire, thermal element, casing heating, quartzy radiator and/or graphite heating main body.
Fig. 2 shows according to embodiment described herein there are valve components to be located at cuing open for the valve components 200 in closed position
Face figure.Valve components are designed to provide the separation of such as evaporator and spray head.Spray head can be adjacent to substrate.In several applications,
Inlet tube 115 can link valve components 200 and evaporator.Outlet 116 generally links valve components 200 and spray head.Valve components 200
It can be disposed between inlet tube 115 and outlet 116.Valve components may include valve chamber 222.
Both inlet and outlet tubes may include inner pipe wall 111,117 and outer pipe wall 113,118.Inner wall 111,117 can
For heat conductor, and outer wall 113,118 can be heat insulator.Inlet tube and/or outlet may include valve neck 214 and/or contact area
219。
For the adjusting of the temperature of the inlet tube 115 of valve components 200 and outlet 116, inner wall 111,117 and outer can be used
Gap between wall 113,118.Temperature adjusts the transmission and/or generation that thermal energy can be carried out especially by conversion chemistry or electric energy
To execute.The applicable example for heating mechanism can are as follows: heating wire, thermal element, casing heating, quartzy radiator and/or
Graphite heating main body.The outer wall of the outer wall of inlet tube and outlet can seamlessly and connect.
According to embodiment, valve components may include closing device 230.Valve components can construction so that close device 230 can adopt
With several configurations.One of which is configured to close configuration.Closing device may include contact element 234.In closing configuration, close
The contact element 234 of device can flush (flush) with the contact area 219 of interior inlet tube wall 111.In another embodiment
In, in closing configuration, contact element can be flushed with the contact area of internal vent tube wall 117.It closes device and tube wall can be special
It is not to form metal seal.
In some embodiments, contact element 234 may include external rings.External rings can be made with metal, especially with
Soft metal is made, and is more particularly made with copper, stainless steel and/or gold.External rings can have tapered edge.Via with contact area
219 contacts, ring are deformable to form sealing element.In another embodiment, contact area may include material layer.This material can be
Metal, especially soft metal, more particularly copper, stainless steel and/or gold.It is contacted via with contact element 234, this material is deformable
To form sealing element.Sealing element can be tradable.
Title " metal seal " is interpreted as the sealing element generated by two hardwares of connection, such as connection contact area
And contact element.Material can advantageously such as titanium and/or stainless steel.In addition, " metal seal " contact element and can connect
Touching between region includes additional sealing material element, such as is made with metal, all copper in this way of metal.
In embodiments, the upper end 235 of contact element can be flushed with valve neck 214.Closing configuration does not allow material from evaporation
Device is sent to spray head, or vice versa.A positive result for closing configuration can pass through valve components especially to have evaporated material
Circulation can limit or even avoid.The degree of sealing can be in the range of about 0.1mbar and 10mbar.
During material deposition, technique can stop because of several reasons.For example, new substrate must provide and adjacent to spray
Head or material deposition arrangement must be cleaned during several applications.In general, only stop being transmitted in deposition materials
Spray head, but it can be important for not being off whole depositing operations.Therefore, another advantage can for by drive close device at
Configuration is closed, material deposition process, which can be interrupted, is converted into another physical state without interrupting material.For example, being closed by having
It is installed in closing configuration, it is feasible for allowing material to evaporate in evaporator but transmission is avoided to evaporate material to substrate simultaneously.
Fig. 3 shows the constructed profile of the valve components according to the embodiment referring to Fig. 2 description, and wherein valve components are located at and beat
Open position.Fig. 3 is illustrated in the schematic diagram for opening the device 230 of the closing in configuration.Contact element 230 at contact area 219
It can not be contacted with inner pipe wall 111,117.The upper end 235 of contact element and valve neck 214 can not also contact.Closing device can be in steaming
It sends out in the direction of device and relocates.
Embodiment shown in Fig. 4 includes side region 236, and the circulation of material deposition can be in side region 236 by closing dress
It sets.Side region 236 can hatch region between inlet tube and/or outlet and contact element.Side region can close device
Occur using when opening configuration.According to embodiment, side region can when valve components orient in entrance and/or export direction
It is existing, and close device and opening configuration can be used.
Side region 236 is close to valve chamber chamber region 238.Valve chamber chamber region 238 can be induction element 234 and internal valve chamber
Hatch region between wall 224.This configures protection system and is avoided the pressure loss.
The all parts or at least part of closing device, valve components, inlet tube, outlet, evaporation of material deposition arrangement
Device and spray head may include several materials or be even made of several materials, e.g. carbon, stainless steel or titanium.Material can have receiving
The ability of high temperature.Material can be chemical inertness.If material can provide hot transmission without in addition stating.
Valve components may include several inert materials or are even made of inert material, all carbon, stainless steel or titanium in this way.It closes
The material that device can be identical to valve components is made, and but not limited to this.Close device may include provide heat transmission material or
Even formed with the material for providing heat transmission.Closing device can be also including heat-staple material or even with heat-staple material group
At.Closing device can be made with inert material.
Example as shown in Figure 5 is shown, and closing device 230 may include contact element 234 and induction element 232.Guiding element
Part 232 can be made of the material for providing heat transmission.In embodiments, induction element 232 is connected to contact element 234, for example,
Induction element can be integrally formed with contact element.Induction element 232 can be used, to change the configuration for closing device 230.Pass through work
For induction element 232, contact element 234 can be relocated.Induction element may include fixed part.Induction element may include heat
Insulation, includes especially thermal insulation in fixed part.
In embodiments, closing device may include heating device 440.Heating device 440 may include connecting element 442.
Heating device 440 may include can cartridge heater.Heating device is embeddable in valve components, especially in closing device, particularly
It is in induction element and/or contact element.Connecting element 442 can connect heating device, adjust for temperature.
Heating device may include several heating mechanisms.For example, heating device 440 can be heated electrically.Heating device 440
Temperature generally can carry out transmission and/or the generation of thermal energy at heat to execute especially by conversion chemistry or electric energy.It is applicable
Example for heating mechanism can are as follows: heating wire, thermal element, quartzy radiator and/or graphite heating main body.
According to the embodiment referring to shown in Fig. 5, heating device can extend in contact element from induction element.According to figure
Embodiment shown in 6, heating device can be only as included by induction elements.Thermal energy can provide and pass through induction element, and
Closing element can be sent to via heat transmission.In another embodiment, heating device can be only as included by contact element.
The lower end 233 of the reliable adosculation element of heating device, with full blast is transmitted under thermal energy to contact element 234
End 233.The distance between lower end and the lower end 233 of contact element 234 of heating device 440 can be less than 5mm, especially even etc.
It is same as or less than 2mm.
Heating closes device and provides several advantages.In general, there is negative temperature gradient between evaporator and valve components.Both
So closing device can be used in limiting or avoid that steam may be promoted with the transmission of deposition materials existing for gaseous state, negative temperature gradient
It is condensed in valve components.By heating the closing device of valve components, removing negative temperature gradient and avoiding in the condensation for closing device.It is negative
Temperature gradient can also reversely be positive temperature gradient.For example, higher temperature can be supplied in closing device compared to evaporator.
Controller can be used in adjusting temperature.For example, closing the temperature of device and/or valve components may be set to be higher than evaporation
5 DEG C -20 DEG C of the temperature of device, especially greater than 10 DEG C of the temperature of evaporator.Spray head 120 can be heated to a temperature, this temperature is higher than
The temperature of valve components 200.For example, this temperature can be set higher than between at least 5 DEG C and 20 DEG C of temperature of valve components 200, especially
It is above about 10 DEG C of temperature of valve components 200.
In a specific example, material is heated and is evaporated in crucible 112.Steam is in the direction of the outlet of valve components
Flow through inlet tube.Closing device can be as shown in Figure 2 in closing configuration, and closes device and can be heated to a temperature,
This temperature can be higher than at least 5 DEG C of evaporating temperature.In particular, temperature can be higher than 10 DEG C of evaporating temperature.Flow of vapor is by closing device
Closing configuration limited.
Heating valve components can avoid the condensation at valve components.When evaporation of the stopping material deposition process without stopping material
When, closed position can be used in valve components.It can avoid steam in a closed position and be sent to spray head.Steam may accumulate on valve member
Part, especially steam may accumulate on closing device.Heating valve components and/or closing device can avoid coagulating the material of deposition
Knot.
Fig. 7 is shown according to embodiment described herein with driving mechanism 560 and the selection for attaching to driving mechanism
The constructed profile of the valve components 200 of actuator 562.Although driving mechanism only illustrates in Fig. 7-13, it should be understood that
It is that it can be applied in all embodiments as described herein.
In general, driving mechanism is mechanically, electrically, hydraulically, pneumatically, artificially or above-mentioned any combination
Operation.In embodiments, driving mechanism may be connected to actuator 562.Actuator 562 can electrically, it is mechanically or above-mentioned
Any combination acts in driving mechanism 560.Driving mechanism 560 can be made with temperature-resistant material.There is minimum heat waste in valve chamber
In the case where consumption, driving mechanism can be configured to act on and close on device.
Driving mechanism 560 may be connected at least part for closing the induction element 232 of device.Driving mechanism may be connected to
The fixed part of induction element.Induction element may include thermal insulation, especially the company in driving mechanism 560 and induction element 232
It connects and/or fixed part.This insulation avoids driving mechanism from being damaged because of high temperature.
Fig. 8 shows the constructed profile of the valve components according to embodiment described herein.Driving mechanism is in this embodiment
In include spring.Spring 664 can be used in the configuration for adjusting closing device 230.It includes that elasticity is special that spring, which can allow spring,
The material of sign is made, and is especially made with metal wire.Spring can be made with heat-resisting material.For example, material can be for from cobalt-
The group of nickel-chromium-molybdenum alloy (Cobalt-Nickel-Chromium-Molybdenum (CoNiCrMo)-alloys).Driving
Mechanism can be heat-insulated with thermally conductive closing device.Spring can electrically, mechanically, pneumatically, artificially or above-mentioned any combination
It is mobile.In the case where having minimum thermal losses in valve chamber, spring can be configured to act on and close on device.
Fig. 9, which is shown, is oriented to Way according to being located in closed position with valve components for embodiment described herein
In valve components constructed profile.Device 230 is closed as shown in Figure 9 using closing configuration.The upper end of contact element 234
235 can not contact with valve neck 214, but the lower end 233 of contact element 234 can be flushed with valve neck 214.Contact element 234 is accessible
The contact area 219 of interior inlet tube wall 111.Metal seal can especially be formed by closing device and tube wall.
According to embodiment, closing device can be driven by driving mechanism 560.Driving mechanism mechanically, electrically, it is hydraulic
Ground, pneumatically, artificially or the operation of above-mentioned any combination.In some embodiments, driving mechanism may be connected to actuator
562.Actuator 562 can electrically, mechanically or above-mentioned any combination acts on driving mechanism 560.When driving mechanism is based on
The presence of actuator 562 and when running, actuator especially attaches to driving mechanism.
According to embodiment, closing device may include two functions.One function can be avoided by using configuration is closed
Material is flowed from evaporator.Another function can enter position by using opening to configure from valve chamber sealing driving mechanism
It sets.When valve components are using configuration is opened, advantageous effect is that driving mechanism is extremely protected during evaporating material and kept away
Exempt from material granule and high temperature.
Figure 10 shows the constructed profile of the valve components of explanation this embodiment as described herein referring to Fig. 9, wherein
Valve components are located in open position in Figure 10.In this, device 230 is closed using opening configuration.The upper end of contact element 234
235 accessible inner valve chamber walls 224.In particular, the lower end 233 of contact element 234 and valve neck 214 can be in open positions not
Contact.
According to embodiment, when closing device in the open position, the accessible internal valve chamber in upper end 235 of device is closed
Locular wall 224.Contact element is configurable, so that the salable in-position for closing device in upper end 235.Contact element can avoid heat and
Particle is sent to driving mechanism from valve chamber.
One advantage of this embodiment is to avoid the particle of deposition materials being sent to driving mechanism from valve chamber.Cause
This, the less loss material during material deposition.Another advantage of this embodiment is in the direction of driving mechanism from valve
The thermal losses of chamber avoids, and helps to maintain technological temperature.In addition, by sealing approaching side, driving mechanism be protected and
Avoid high temperature and/or the relevant influence of any technique.
According to embodiment, closing device can be driven by driving mechanism 560.Driving mechanism mechanically, electrically, it is hydraulic
Ground, pneumatically or the operation of above-mentioned any combination.In embodiments, driving mechanism may be connected to actuator 562.Actuator
562 can electrically, mechanically or above-mentioned any combination acts on driving mechanism 560.
According to embodiment as described herein, the arrangement of valve components may include inlet tube 115, valve chamber 222 and outlet
116.According to embodiment, valve components can be oriented towards inlet tube, and especially closing device can be oriented towards inlet tube.Valve components
Closing device can thus in the direction of inlet tube open and/or close.Therefore, valve components can orient in Way in.
When being oriented in Way in, closing device can be vertical orientation.According to embodiment, valve components can be fixed towards outlet
To especially closing device can be oriented towards outlet.Close device can thus in the direction of outlet open and/or close
It closes.Therefore, valve components can orient in export direction.When being oriented in export direction, closing device can be horizontal orientation.
According to fig. 2 it is exemplary shown in embodiment, when being oriented in Way in, close device can pass through contact
The upper end 235 of element 234 flushes with valve neck 214 and is closing configuration.The embodiment according to shown in exemplary in Fig. 9, when fixed
When in Way in, closing device and being flushed by the lower end 233 of contact element 234 with valve neck 214 is to close configuration.
Metal seal can especially be formed by closing device and tube wall.
The embodiment according to shown in exemplary in Fig. 3, when being oriented in Way in, contact can be passed through by closing device
Element 234 does not contact with valve neck 214 and is located in inlet tube 115 and configures in opening.It is real according to shown in exemplary in Figure 10
Mode is applied, when being oriented in Way in, closing device can not be contacted with valve neck 214 by contact element 234 and be located at valve
It is configured in chamber 222 in opening.
Figure 11 shows according to embodiment described herein the valve components 200 being oriented in export direction with valve components
Constructed profile, wherein closing and open position can be used in valve components.Closing device can be used opening and closing configuration.Close dress
Setting 230 can move in the direction of outlet 116.Valve neck 214 can be located at outlet tube wall 116.Contact area 219 can go out for inside
The part of mouth tube wall 117.According to can with the embodiment in conjunction with any other embodiment described herein, open and close configuration
It can be based on the similar means of the embodiment illustrated in figure 2 and figure 3.
For using closing for configuration, closing device can move in the direction of valve neck.It can be in valve for example, closing device
It is moved in the direction of chamber 222.The upper end 235 of contact element can be flushed with valve neck 214.It closes device and tube wall 117 can be special
It is to form metal seal.For closing device and moving away from valve neck using opening for configuration.It can for example, closing device
It is mobile towards outlet 116.Driving mechanism may be present.Driving mechanism can be by according to the selection of embodiment as described herein
Actuator 562 drives.
Figure 12 shows showing for the valve components being oriented in export direction according to embodiment described herein with valve components
Meaning sectional view, wherein closing and open position can be used in valve components.Closing device can be used opening and closing configuration.Close device
It can be moved in the direction of outlet 116.Valve neck 214 can be located at outlet tube wall 116.Contact area 219 can be internal vent pipe
The part of wall 117.According to can with the embodiment in conjunction with any other embodiment described herein, open and close configuration can class
It is similar to the embodiment illustrated in relation to Fig. 9 and Figure 10.
For using closing for configuration, closing device can move in the direction of valve neck.It can be in out for example, closing device
It is moved in the direction of mouth pipe 116.The lower end 233 of contact element can be flushed with valve neck 214.For closing using opening for configuration
It closes device and moves away from valve neck.For example, closing device can move in the direction of valve chamber 222.The upper end 235 of contact element
Accessible inner valve chamber wall 224.Driving mechanism may be present.Driving mechanism can pass through the selection of embodiment as described herein
Actuator 562 drives.
According to embodiment, when closing device using arrangement is opened, the accessible internal valve chamber in upper end 235 of device is closed
Locular wall 224.Contact element is configurable, so that the salable in-position for closing device in upper end 235.According to implementation as described herein
Mode, contact element can avoid material and/or heat and be sent to driving mechanism from valve chamber.
According to the embodiment in Figure 11 is illustrated, when valve components are oriented in export direction, device is closed
Can be flushed by the upper end 235 of contact element 234 with valve neck 214 is to close configuration.Shape can be especially by closing device and tube wall
At metal seal.According to the embodiment in Figure 12 is illustrated, when being oriented in export direction, closing device can
Being flushed by the lower end 233 of contact element 234 with valve neck 214 is to close configuration.
According to the embodiment in Figure 11 is illustrated, when valve components are oriented in export direction, device is closed
Valve neck 214 can not be contacted by contact element 234 and is located in outlet 116 in opening configuration.According to illustrate in
Embodiment in Figure 12, when being oriented in export direction, valve neck 214 can not be contacted by contact element 234 by closing device
And it is located in valve chamber 222 and is configured in opening.
Figure 13 shows the sectional view that arrangement chamber 1000 is deposited according to the material of embodiment described herein.Chamber may include
Material deposition arrangement, can run in high vacuum environment.Chamber may include device for vacuum generation 1060.Entire technique generally occurs
10-6In the high vacuum environment of pressure in the range of mbar, but not limited to this.Vacuum pressure can for example further include 10- 4Pressure in mbar range.Vacuum not only facilitates the purity of depositing operation, and the particle during deposition is also avoided to touch
It hits.
According to embodiment, vacuum can provide to material and deposit arrangement chamber 1000 and material deposition arrangement 100.It will deposition
Material can be evaporated in evaporator 110, especially evaporated under the assistance of crucible 112.Material vapor is transmittable to pass through entrance
Pipe 115, especially by the chamber (lumen) surrounded by inner pipe wall 111.Material vapor also can transmit through outlet 118,
Especially by the space limited by internal vent pipe 117.
According to embodiment, valve components 200 can limit or avoid material vapor to be sent to outlet 116 from inlet tube 115
And/or spray head 120 is sent to from outlet 116.Closing device 230 can be according to embodiment as described herein using closing cloth
It sets.In order to allow technique to start, or when any other technique that substrate changes or need to limit flow of vapor is completed, valve components can
Change to opening configuration.In particular, closing device can be used opening configuration.Valve components can be driven by driving mechanism 560, driving
Mechanism 560 can selectively be driven by actuator 562 again.
For example, the limitation of steam flow allows pause technique, such as during changing substrate, evaporated without stopping
Device.Another example, which can be valve components, to match during the preheating that the material before depositing operation starts deposits arrangement to close
It sets.In this connection, it should be noted that the beginning and stopping of evaporation technology are time-consuming and slow.This arrangement and by deposition
Material reaches technological temperature and expends the time, and temperature decline also will expend the time to stop evaporation technology in advance.Therefore, normal
In rule arrangement, material is evaporated and has persistently flow to substrate during starting with stop process.Therefore, have and controlled in evaporation technology
The material deposition arrangement of material flowing is advantageous.Furthermore if only minor interruptions technique when, evaporated material maintain gas
State, because limitation valve components can be heated to avoid condensation.
According to embodiment, valve components and especially closing device can heat during technique.Closing device can be especially
It is heated when using configuration is closed.Temperature adjusts the transmission and/or production that thermal energy can be carried out especially by conversion chemistry or electric energy
It executes from birth.The applicable example for heating mechanism can are as follows: heating wire, thermal element, casing heating, quartzy radiator and/
Or graphite heating main body.As described in embodiment herein, entire material deposition arrangement can be heated.In addition, from evaporation
There may be positive temperature gradients to substrate for device.
According to other aspects of the disclosure, a kind of method for material to be deposited on substrate is proposed.Method may include
Material has been evaporated in substrate from the deposition of evaporator 110.Method may include via inlet tube 115, valve components 200, outlet 116
And/or spray head 120 is transmitted the material of deposition.Method may include adjusting the configuration for closing device.Method may include using closing
The closing of device 230 configures and opens configuration.
In particular, adjusting valve components may include using the closing configuration for closing device and opening configuration.By using closing
Configuration, the method may include stopping the evaporation material of deposition.
The temperature of the method adjustable material deposition arrangement.In particular, adjusting temperature may include heating evaporation device, entrance
Pipe, valve components, outlet and/or spray head.Heating valve components may include that device is closed in heating, to avoid material has been evaporated in valve member
It is condensed in the closing configuration of part.Heating valve components may include directly heating valve components." directly heating " valve components are appreciated that
To operate in the heating device in valve components.In particular, directly heating can be regarded as operating in the heating dress closed in device
It sets, more particularly the heating device in operation guide element and/or contact element.
Although aforementioned be directed to embodiment of the present disclosure, without departing from the spirit and scope of the present invention, this can be designed
Disclosed further embodiment, and the scope of the present disclosure is determined by appended claims.
In particular, this written explanation discloses the disclosure using the several examples for including optimal mode, and also allow ability
Field technique personnel can implement the theme, including manufacturing and using any device or system and executing any side being incorporated to
Method.When several specific embodiments are when aforementioned middle open, the non-exclusive feature of above embodiment can be tied each other
It closes.The range of patentability is defined by the claims, and if claim has the non-literal language for being different from claim
Structural detail when, or if claim includes equivalent structural elements, and equivalent structural elements and claim is literal
When language has insubstantial difference, other examples are intended to be contained in the scope of the claims.
Claims (15)
1. a kind of material deposition arrangement (100), comprising:
The valve components of valve components (200), wherein at least part are heatable.
2. material deposition arrangement (100) as described in claim 1, wherein the valve components (200) include heating device
(440)。
3. material deposition arrangement (100) as claimed in claim 2, wherein the heating device (440) is cartridge heater.
4. material deposition arrangement (100) as claimed in claim 2 or claim 3, wherein the valve components (200) include closing device
(230), the closing device includes the heating device (440).
5. material deposition arrangement (100) as claimed in claim 4, wherein the closing device (230) includes contact element
(234) and induction element (232), the induction element is connected to driving mechanism (560), for driving the induction element,
Described in driving mechanism preferably by electrical and/or mechanically actuated operation.
6. material deposition arrangement (100) as described in any one of the preceding claims, material deposition arrangement further include into
Mouth pipe (115) and outlet (116), the inlet tube and the outlet are preferably made with carbide, more preferably with stainless steel
Or titanium is made.
7. material deposition arrangement (100) as claimed in claim 5, wherein the driving mechanism (560) is spring (664).
8. material deposition arrangement (100) as described in any one of the preceding claims, wherein material deposition arrangement is also wrapped
Temperature controller is included, the temperature controller is configured to control the temperature of the material deposition arrangement.
9. material deposition arrangement (100) as described in any one of the preceding claims, the material deposition arrangement further includes steaming
Send out the one or more of device (110) and spray head (120).
10. material deposition arrangement (100) as claimed in claim 7, wherein material deposition arrangement is configured as at least
300 DEG C of temperature operation, is preferably operated at least 400 DEG C of temperature.
11. as described in any one of the preceding claims material deposition arrangement (100), wherein the contact element (234) and
Region (236) between the inlet tube or outlet is close to the area of the inlet tube (115) and/or the outlet (116)
Domain (238).
12. a kind of material deposition arrangement chamber (1000), comprising:
Material deposition arrangement (100) as described in any one of the preceding claims；And
Device for vacuum generation (1060).
13. a kind of method for material to be deposited on substrate, comprising:
Directly heat valve components.
14. it is as claimed in claim 13 for material to be deposited on the method on substrate, the method also includes:
Deposition materials；And
The deposition is interrupted by closing the valve components.
15. it is according to claim 13 or 14 for material to be deposited on the method on substrate, the method also includes:
The closing device (230) is operated at least 5 DEG C of temperature of temperature for being higher than the evaporator (110), is especially being higher than
The temperature that at least 10 DEG C of the temperature of the evaporator operates the closing device.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2017/059505 WO2018192668A1 (en) | 2017-04-21 | 2017-04-21 | Material deposition arrangement, a method for depositing material and a material deposition chamber |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110462096A true CN110462096A (en) | 2019-11-15 |
Family
ID=58579181
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780088859.4A Pending CN110462096A (en) | 2017-04-21 | 2017-04-21 | Material deposition arrangement, the method for deposition materials and material deposition chambers |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN110462096A (en) |
| TW (1) | TWI677586B (en) |
| WO (1) | WO2018192668A1 (en) |
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| JPH1089532A (en) * | 1995-12-13 | 1998-04-10 | Rintetsuku:Kk | Valve structure for vaporization device |
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| KR102228880B1 (en) * | 2014-05-12 | 2021-03-17 | 엘지전자 주식회사 | Deposition apparatus |
| JP6418388B2 (en) * | 2014-12-02 | 2018-11-07 | パナソニックＩｐマネジメント株式会社 | Vapor deposition apparatus and vapor deposition method |
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| US20060013964A1 (en) * | 2004-07-14 | 2006-01-19 | City University Of Hong Kong | Apparatus and method for focused electric field enhanced plasma-based ion implantation |
| CN101111625A (en) * | 2004-12-07 | 2008-01-23 | 阿顿公司 | Device for vacuum deposition with recharging reservoir and corresponding vacuum deposition method |
| CN101416284A (en) * | 2006-04-07 | 2009-04-22 | 东京毅力科创株式会社 | Processing apparatus and processing method |
| CN102234762A (en) * | 2010-04-23 | 2011-11-09 | 鸿富锦精密工业（深圳）有限公司 | Coating system |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2018192668A1 (en) | 2018-10-25 |
| TWI677586B (en) | 2019-11-21 |
| TW201907031A (en) | 2019-02-16 |
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Application publication date: 20191115 |