CN110455009A - A kind of weather adjustment device and air-conditioning - Google Patents
A kind of weather adjustment device and air-conditioning Download PDFInfo
- Publication number
- CN110455009A CN110455009A CN201910863036.5A CN201910863036A CN110455009A CN 110455009 A CN110455009 A CN 110455009A CN 201910863036 A CN201910863036 A CN 201910863036A CN 110455009 A CN110455009 A CN 110455009A
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- Prior art keywords
- adjustment device
- air duct
- heat
- weather adjustment
- supply air
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- 238000004378 air conditioning Methods 0.000 title claims abstract description 17
- 239000004065 semiconductor Substances 0.000 claims abstract description 52
- 230000017525 heat dissipation Effects 0.000 claims description 28
- 238000009423 ventilation Methods 0.000 claims description 13
- 239000011229 interlayer Substances 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000003507 refrigerant Substances 0.000 abstract description 7
- 238000010438 heat treatment Methods 0.000 description 11
- 238000005057 refrigeration Methods 0.000 description 10
- 230000006872 improvement Effects 0.000 description 8
- 238000001816 cooling Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 238000009434 installation Methods 0.000 description 5
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- 238000009413 insulation Methods 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
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- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
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- 230000002463 transducing effect Effects 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/02—Ducting arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/22—Means for preventing condensation or evacuating condensate
- F24F13/222—Means for preventing condensation or evacuating condensate for evacuating condensate
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/24—Means for preventing or suppressing noise
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/24—Means for preventing or suppressing noise
- F24F2013/247—Active noise-suppression
Abstract
The present invention provides a kind of weather adjustment device and air-conditionings, comprising: supply air duct；Semiconductor chilling plate, for carrying out temperature adjusting to the gas in the supply air duct；Wherein, heat-conducting piece is provided in the supply air duct, the heat-conducting piece is used to conduct the heat of the semiconductor chilling plate.The weather adjustment device will not generate noise at work, meanwhile, it is not necessarily to refrigerant, use cost is low.
Description
Technical field
The present invention relates to Oil Temperature Controlling Technigue field more particularly to a kind of weather adjustment devices and air-conditioning.
Background technique
In life, it will usually be adjusted using air-conditioning to temperature, under the action of air-conditioning, be may make in a region
Temperature is changed.
Air-conditioning full name is air regulator (Air Conditioner), is a kind of for temperature to be adjusted and controlled
Equipment.
Currently, air-conditioning is all to be freezed or heated using compressor, but compressor is at work, noise is bigger.Together
When, for existing air-conditioning, refrigerant is also indispensable pith, but with the use of air-conditioning, refrigerant meeting
It is constantly consumed, this makes the use cost of air-conditioning also become very high.
Summary of the invention
It is an object of the invention to overcome the deficiencies of existing technologies, a kind of weather adjustment device and air-conditioning are provided, to solve
Air-conditioning certainly in the prior art has that noise is big, use cost is high.
To solve the above problems, the present invention provides: a kind of weather adjustment device, comprising:
Supply air duct；
Semiconductor chilling plate, for carrying out temperature adjusting to the gas in the supply air duct；
Wherein, heat-conducting piece is provided in the supply air duct, the heat-conducting piece is for conducting the semiconductor chilling plate
Heat.
As a further improvement of the above technical scheme, the heat-conducting piece includes aluminium flake.
As a further improvement of the above technical scheme, the weather adjustment device further includes air supply module, the air-supply
Module is used to make to generate the air-flow of flowing in the supply air duct.
As a further improvement of the above technical scheme, the outside of the supply air duct is provided with for collecting condensed water
Collection module.
As a further improvement of the above technical scheme, the weather adjustment device further includes for the semiconductor system
The cold radiating module to radiate.
As a further improvement of the above technical scheme, the radiating module includes radiator and is used for the radiator
The radiator fan to radiate.
As a further improvement of the above technical scheme, the radiating module further includes heat dissipation wind channel, the heat dissipation wind channel
The air-flow generated for conveying the radiator fan.
As a further improvement of the above technical scheme, the supply air duct and the heat dissipation wind channel are set to an inner casing
It is internal；
The semiconductor chilling plate is installed on the inner casing.
As a further improvement of the above technical scheme, be provided between the supply air duct and the heat dissipation wind channel every
Layer；
Ventilation opening is provided on the interlayer, the supply air duct and the heat dissipation wind channel are connected with the ventilation opening
Logical, the ventilation opening is right against the radiator.
Present invention further provide that a kind of air-conditioning, including as above described in any item weather adjustment devices.
The beneficial effects of the present invention are: the present invention proposes a kind of weather adjustment device, comprising: supply air duct；Semiconductor system
Cold, for carrying out temperature adjusting to the gas in supply air duct；Wherein, heat-conducting piece is provided in supply air duct, heat-conducting piece is used
In the heat of conductive semiconductor cooling piece.
The temperature in supply air duct can be adjusted using semiconductor chilling plate, wherein semiconductor chilling plate is without rotation
Component will not generate noise at work, meanwhile, semiconductor chilling plate is when being freezed or being heated without using refrigerant.
It is provided with heat-conducting piece in supply air duct, is conducted by heat of the heat-conducting piece to semiconductor chilling plate, thus may be used
To increase the heat-conducting area of semiconductor chilling plate, and improve the efficiency of semiconductor chilling plate refrigeration or heating.
The weather adjustment device will not generate noise at work, meanwhile, it is not necessarily to refrigerant, use cost is low.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 shows a kind of the first shaft side figure of weather adjustment device；
Fig. 2 shows a kind of the second shaft side figures of weather adjustment device；
Fig. 3 shows a kind of front view of weather adjustment device；
Fig. 4 shows a kind of partial sectional view of weather adjustment device.
Main element symbol description:
1- supply air duct；2- semiconductor chilling plate；3- heat-conducting piece；4- radiator；5- heat dissipation wind channel；6- inner casing；7- interlayer；
8- installation through-hole；9- linking arm.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " be orientation based on the figure or
Positional relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must
There must be specific orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.In the description of the present invention, the meaning of " plurality " is two or more,
Unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be mechanical connect
It connects, is also possible to be electrically connected；It can be directly connected, can also can be in two elements indirectly connected through an intermediary
The interaction relationship of the connection in portion or two elements.It for the ordinary skill in the art, can be according to specific feelings
Condition understands the concrete meaning of above-mentioned term in the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature in the second feature " on " or " down " can be with
It is that the first and second features directly contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature be directly above or diagonally above the second feature, or be merely representative of
First feature horizontal height is higher than second feature.Fisrt feature can be under the second feature " below ", " below " and " below "
One feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
Embodiment one
Fig. 1 and Fig. 4 are please referred to, in the present embodiment, proposes a kind of weather adjustment device, comprising:
Supply air duct 1；
Semiconductor chilling plate 2, for carrying out temperature adjusting to the gas in supply air duct 1；
Wherein, heat-conducting piece 3 is provided in supply air duct 1, heat-conducting piece 3 is used for the heat of conductive semiconductor cooling piece 2.
Semiconductor chilling plate 2 includes the first heat-transfer surface and the second heat-transfer surface, wherein the first heat-transfer surface may be disposed at air-supply
In air duct 1.
Semiconductor chilling plate 2 has the advantage that
1. any refrigerant is not needed, it, can continuous work without pollution sources；
2. not having rotary part, when work, will not generate vibration and noise；
3. semiconductor chilling plate 2 is electric current transducing matrix part, by the control to input current, it can be achieved that high-precision temperature
Degree control；
4. the thermal inertia of semiconductor chilling plate 2 is small, the cooling and warming time is fast.
There are two types of operating modes, respectively refrigeration mode and heating mode for weather adjustment device tool.
When weather adjustment device is in refrigeration mode, the first heat-transfer surface is cold end, at this point, the temperature in supply air duct 1
Lower than environment temperature；When weather adjustment device is in heating mode, the first heat-transfer surface is hot end, at this point, in supply air duct 1
Temperature is higher than environment temperature.
Wherein, by changing sense of current, it just can be realized the switching of refrigeration mode and heating mode.
Semiconductor chilling plate 2 can be electrically connected with power module, may be provided with charging interface on power module, wherein fill
USB interface can be used in electrical interface.
In the specific use process, user also can be used the alternating current of 110V or 220V (according to locating country and region
It is fixed) weather adjustment device is powered, under the action of the devices such as adapter, convert input voltage into the peace of 12V~36V
Full voltage is for the use of semiconductor chilling plate 2.
It may be provided with protection circuit on power module, when the current or voltage of input is more than certain value, protection circuit is just
It can automatically cut off the power, thus avoid being damaged in weather adjustment device with electrical component.
The temperature in supply air duct 1 can be adjusted using semiconductor chilling plate 2, wherein semiconductor chilling plate 2 without turn
Dynamic component will not generate noise at work, meanwhile, semiconductor chilling plate 2 is when being freezed or being heated without using refrigeration
Agent.
The weather adjustment device can be adjusted temperature, realize refrigeration or heating；The weather adjustment device is working
Shi Buhui generates noise, simultaneously as refrigerant is not necessarily to, so the cost for using and safeguarding of weather adjustment device is low.
It is provided with heat-conducting piece 3 in supply air duct 1, is conducted by heat of the heat-conducting piece 3 to semiconductor chilling plate 2, by
This can increase the heat-conducting area of semiconductor chilling plate 2, and improve the efficiency of the refrigeration of semiconductor chilling plate 2 or heating.Air into
Enter to after supply air duct 1, under the action of semiconductor chilling plate 2 and heat-conducting piece 3, can quickly turn cold or heating.
Heat-conducting piece 3 is in contact with semiconductor chilling plate 2.Wherein, to propose highly thermally conductive efficiency and effect, heat-conducting piece 3 can
It is pasted on the first heat-transfer surface of semiconductor chilling plate 2 by heat conductive silica gel.
In the present embodiment, heat-conducting piece 3 can be selected aluminium and be made, specifically, heat-conducting piece 3 can be aluminium flake.Wherein, aluminium flake
Quantity can be configured as needed.
Further, heat-conducting piece 3 can also be made of thermal conductivitys higher materials such as iron, copper.
In the present embodiment, weather adjustment device may also include air supply module, and air supply module produces in supply air duct 1 for making
The air-flow of raw flowing.Wherein, air supply module may include Air Blast fan.
Supply air duct 1 may include air inlet and air outlet, and Air Blast fan can be right against the air inlet of supply air duct 1.When sending
After wind starting fan, under the action of the air pressure that Air Blast fan generates, air-flow can flow to gas outlet from air inlet.
Starting weather adjustment device, semiconductor chilling plate 2 and supply air duct 1 can all enter working condition, at this point, extraneous
Air can be flowed into supply air duct 1 from air inlet, under the action of semiconductor chilling plate 2 and heat-conducting piece 3 in supply air duct 1
Air can turn cold or heating, with the flowing of air-flow, turns cold or the air of heating can be discharged from gas outlet, thus improves extraneous office
Temperature in portion region.
In cooling mode, condensed water can be generated in supply air duct 1, for this purpose, the outside of supply air duct 1 may be provided with and be used for
Collect the collection module of condensed water.Wherein, collection module may include collecting bowl.
Semiconductor chilling plate 2 can generate certain heat at work, if cannot effectively be radiated, semiconductor refrigerating
The refrigeration of piece 2 or the efficiency of heating will be affected.
For this purpose, in the present embodiment, weather adjustment device may also include to be dissipated for what is radiated to semiconductor chilling plate 2
Thermal modules.
Radiating module may include radiator 4 and the radiator fan for radiating to radiator 4.Wherein, radiator 4 can
More copper pipes may be provided on tower heat sink to improve the efficiency to radiate using tower heat sink.
To disperse the heat on radiator 4 in time, radiating module may also include heat dissipation wind channel 5, and heat dissipation wind channel 5 is used
In the air-flow that conveying radiator fan generates.Wherein, the second heat-transfer surface of semiconductor chilling plate 2 may be disposed in heat dissipation wind channel 5, dissipate
Hot device 4 can be pasted on the second heat-transfer surface of semiconductor chilling plate 2 by heat conductive silica gel.
When semiconductor chilling plate 2 starts, radiator fan also synchronous averaging, the air-flow that radiator fan generates can understand band therewith
The heat on radiator 4 is walked, the purpose to radiate to semiconductor chilling plate 2 is thus played.
The air-flow that radiator fan generates is delivered in heat dissipation wind channel 5, and can flow to heat dissipation by the exhaust outlet of heat dissipation wind channel 5
Outside air duct 5.
In the present embodiment, supply air duct 1 and heat dissipation wind channel 5 may be disposed at the inside of an inner casing 6, wherein semiconductor system
It is mountable on inner casing 6 for cold 2.
In the present embodiment, supply air duct 1 and heat dissipation wind channel 5 are all set on inner casing 6, wherein supply air duct 1 and heat dissipation
Interlayer 7 is provided between air duct 5.
Interlayer 7 has the function of heat-insulated, generates heat exchange between supply air duct 1 and heat dissipation wind channel 5 for preventing.Specifically
, it may be configured as hollow structure inside interlayer 7, wherein can be filled with glass fibre, asbestos, rock wool, silicate in hollow structure
Etc. heat-insulated.
To improve heat-insulated effect, 7 outer surface of interlayer can be coated with insulating moulding coating.
Ventilation opening is provided on interlayer 7, supply air duct 1 and heat dissipation wind channel 5 are connected with ventilation opening, and ventilation opening is right against
Radiator 4.When weather adjustment device is in refrigeration mode, ventilation opening can be opened, at this point, the cold air in supply air duct 1
Stream can be entered in heat dissipation wind channel 5 by ventilation opening, since ventilation opening is right against radiator 4, so radiator 4 is in cold airflow
Available certain heat dissipation and cooling, thus, it is possible to improve the radiating efficiency of radiator 4, and make semiconductor refrigerating under effect
The refrigerating efficiency of piece 2 is higher.
As shown in Fig. 2, semiconductor chilling plate 2 runs through interlayer 7, wherein be provided on interlayer 7 for installing semiconductor refrigerating
The installation through-hole 8 of piece 2, to improve leakproofness and thermal insulation, the settable heat insulation sealing gasket in installation through-hole 8.
During installation, it should be noted that the position of radiator fan, the air flow direction ventilation opening for avoiding radiator fan from generating.
Positioned at the side of supply air duct 1, interlayer 7 may be provided with inclined surface, can conveniently make condensation flow extremely by inclined surface
In collecting bowl.
In the present embodiment, inner casing 6 may be disposed at the inside of a shell, wherein heat release hole is provided on shell.Heat release hole
It is not right against the exhaust outlet of heat dissipation wind channel 5, setting in this way can avoid the thermal current in heat dissipation wind channel 5 directly from exhaust
Mouth is expelled to shell exterior, and thermal current can be cooled down in the space between inner casing 6 and shell in advance, then again from heat release hole
Drain into the outside of shell.
In the present embodiment, shell may be configured as cuboid, and the side of shell is located at the two sides of its front and back.Its
In, the exhaust outlet of heat dissipation wind channel 5 can be right against the back side of shell, and heat release hole then may be disposed at the side of shell.
The back side of shell may be provided with injection well, wherein the gas outlet of supply air duct 1 can be connected by conduit with injection well
Logical, the air-flow for thus avoiding heat dissipation wind channel 5 from being discharged flows in injection well.
It is detachably connected between inner casing 6 and shell.Wherein, the front of shell may include an opening, and inner casing 6 passes through opening peace
It is cased.
Since inner casing 6 is detachably connected with shell, so, the components such as semiconductor chilling plate 2 first can be installed on inner casing 6
After upper, then inner casing 6 is installed in shell.After inner casing 6 is put into shell, Air Blast fan can be installed inside the shell and catchmented
Cup, installs upper barrier cover on the shell again later, wherein door is used for the opening closed the housing.It may be provided with air inlet hole on door,
Air inlet hole is right against the air inlet of supply air duct 1.
As shown in figure 3, settable linking arm 9 on the outer wall of inner casing 6, linking arm 9 totally two and is symmetrically disposed on inner casing 6
Two sides.
Correspondingly, may be provided with sliding slot corresponding with linking arm 9 on the inner wall of shell, wherein linking arm 9 is inserted into sliding slot
It is interior and be slidably connected therewith.
For the position of fixed inner casing 6, inner casing 6 can be fixed in shell by screw or buckle etc..
To reduce production cost, inner casing 6 and shell can be used plastics and be made.Specifically, inner casing 6 and shell can also bases
It needs to select situations such as being made using the material of other insulation and high-flash, thus avoiding the occurrence of electric shock or kindling.
In the present embodiment, weather adjustment device, which may also include, temperature monitoring module and temperature control modules.
Temperature monitoring module may include temperature sensor, wherein temperature sensor may be disposed in supply air duct 1, pass through
Temperature monitoring module can monitor the temperature in supply air duct 1.
Temperature control modules may include processor etc., wherein can realized to supply air duct 1 using temperature control modules
The control of interior temperature.It should be noted that there are limiting values for the adjustable extent of the temperature in supply air duct 1, specifically and partly
The specification of conductor cooling piece 2 is related.
After opening weather adjustment device, temperature needed for user can use the terminal profiles such as button, remote controler or mobile phone
Value.The temperature signal monitored is transferred to processor by temperature sensor, when the temperature value and setting that monitor temperature value not
Meanwhile control module will issue control signal to power module, power module will adjust input after receiving control signal
Power, be achieved in the control to the temperature in supply air duct 1.
The structure of semiconductor chilling plate 2 is simple and small and exquisite, for this purpose, in the present embodiment, can according to need inner casing 6 and
Suitable size is made in shell, so that weather adjustment device is convenient for carrying.
The weather adjustment device realizes the adjusting of temperature by semiconductor chilling plate 2, and refrigeration, the effect of heating are good, meanwhile,
It is compact, compact-sized, it is moved easily and can carry.Weather adjustment device can be placed in desktop by user, be passed through
The cold wind or hot wind that injection well is sent out, cool down to body surface or are heated up.
Weather adjustment device is moved for the convenience of the user, may be provided with handle on shell.
In the present embodiment, it is also proposed that a kind of air-conditioning, including weather adjustment device above.Wherein, the air-conditioning is available
Temperature in the regions such as adjusting room, elevator, compartment.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.
In the present specification, the schematic representation of the above terms does not necessarily have to refer to the same embodiment or example.
Moreover, particular features, structures, materials, or characteristics described can be in any one or more of the embodiments or examples with suitable
Mode combines.In addition, without conflicting with each other, those skilled in the art can be by difference described in this specification
The feature of embodiment or example and different embodiments or examples is combined.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant.
Claims (10)
1. a kind of weather adjustment device characterized by comprising
Supply air duct；
Semiconductor chilling plate, for carrying out temperature adjusting to the gas in the supply air duct；
Wherein, heat-conducting piece is provided in the supply air duct, the heat-conducting piece is used to conduct the heat of the semiconductor chilling plate.
2. weather adjustment device according to claim 1, which is characterized in that the heat-conducting piece includes aluminium flake.
3. weather adjustment device according to claim 1, which is characterized in that the weather adjustment device further includes air-supply mould
Block, the air supply module are used to make to generate the air-flow of flowing in the supply air duct.
4. weather adjustment device according to claim 1, which is characterized in that the outside of the supply air duct, which is provided with, to be used for
Collect the collection module of condensed water.
5. weather adjustment device according to claim 1, which is characterized in that the weather adjustment device further include for pair
The radiating module that the semiconductor chilling plate radiates.
6. weather adjustment device according to claim 5, which is characterized in that the radiating module includes radiator and is used for
The radiator fan to radiate to the radiator.
7. weather adjustment device according to claim 6, which is characterized in that the radiating module further includes heat dissipation wind channel,
The heat dissipation wind channel is used to convey the air-flow that the radiator fan generates.
8. weather adjustment device according to claim 7, which is characterized in that the supply air duct and the heat dissipation wind channel are set
It is placed in the inside of an inner casing；
The semiconductor chilling plate is installed on the inner casing.
9. weather adjustment device according to claim 8, which is characterized in that the supply air duct and the heat dissipation wind channel it
Between be provided with interlayer；
Ventilation opening is provided on the interlayer, the supply air duct and the heat dissipation wind channel are connected with the ventilation opening, institute
It states ventilation opening and is right against the radiator.
10. a kind of air-conditioning, which is characterized in that including weather adjustment device of any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910863036.5A CN110455009A (en) | 2019-09-12 | 2019-09-12 | A kind of weather adjustment device and air-conditioning |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910863036.5A CN110455009A (en) | 2019-09-12 | 2019-09-12 | A kind of weather adjustment device and air-conditioning |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110455009A true CN110455009A (en) | 2019-11-15 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102848952A (en) * | 2012-09-21 | 2013-01-02 | 深圳先进技术研究院 | Temperature regulating device |
| CN203432016U (en) * | 2013-08-20 | 2014-02-12 | 上海理工大学 | Desk-type portable semiconductor refrigeration air conditioner |
| CN104896543A (en) * | 2014-03-05 | 2015-09-09 | 海尔集团公司 | Oil fume exhaust ventilator |
| CN105465931A (en) * | 2015-12-30 | 2016-04-06 | 合肥华凌股份有限公司 | Air conditioning fan |
| CN109185975A (en) * | 2018-10-15 | 2019-01-11 | 刘华有 | A kind of temperature-controlled package and its temperature-adjusting device |
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2019
- 2019-09-12 CN CN201910863036.5A patent/CN110455009A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102848952A (en) * | 2012-09-21 | 2013-01-02 | 深圳先进技术研究院 | Temperature regulating device |
| CN203432016U (en) * | 2013-08-20 | 2014-02-12 | 上海理工大学 | Desk-type portable semiconductor refrigeration air conditioner |
| CN104896543A (en) * | 2014-03-05 | 2015-09-09 | 海尔集团公司 | Oil fume exhaust ventilator |
| CN105465931A (en) * | 2015-12-30 | 2016-04-06 | 合肥华凌股份有限公司 | Air conditioning fan |
| CN109185975A (en) * | 2018-10-15 | 2019-01-11 | 刘华有 | A kind of temperature-controlled package and its temperature-adjusting device |
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