CN110452652A - A kind of epoxy adhesive and application - Google Patents

A kind of epoxy adhesive and application Download PDF

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Publication number
CN110452652A
CN110452652A CN201910727926.3A CN201910727926A CN110452652A CN 110452652 A CN110452652 A CN 110452652A CN 201910727926 A CN201910727926 A CN 201910727926A CN 110452652 A CN110452652 A CN 110452652A
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China
Prior art keywords
parts
epoxy adhesive
epoxy
epoxy resin
adhesive
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CN201910727926.3A
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Chinese (zh)
Inventor
罗保
燕莎
卢亢
朱江花
马荔
高建宾
郭茜
王培�
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Xi'an Aerospace Sunvalor Chemical Co Ltd
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Xi'an Aerospace Sunvalor Chemical Co Ltd
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Priority to CN201910727926.3A priority Critical patent/CN110452652A/en
Publication of CN110452652A publication Critical patent/CN110452652A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/222—Magnesia, i.e. magnesium oxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention discloses a kind of epoxy adhesive and application, period length high for energy consumption in the production procedure of existing FPC light bar, does not meet the problems such as environmental requirement at etching solution processing cost height.Technical solution are as follows: including polyurethane, polyphenylene oxide, epoxy resin, curing agent, fire retardant, filler, solvent.The epoxy adhesive is used for the preparation process of PET cover film, specific steps are as follows: first, epoxy adhesive is spread evenly across electrical insulating film single side, secondly, the electrical insulating film for being coated with adhesive removes solvent and drying by drying oven, and then, the electrical insulating film with semi-solid preparation glue-line is pasted again with separated type material roll-in, finally product is cured, obtains PET cover film.The PET cover film off-type force of this adhesive of epoxy adhesive prepared by the present invention and application is low, and peel strength is stablized, and can be used for preparing without etching LED circuit board, production cost is low, more environmentally protective.

Description

A kind of epoxy adhesive and application
Technical field
The invention belongs to electronic element device materials preparation technical fields, and in particular to a kind of epoxy adhesive and application.
Background technique
With the development of LED lighting technology, the application field of flexible LED illuminating material is more and more extensive.Flexible LED rope light Generally comprise five-layer structure, including outermost two sides insulating materials, intermediate two conductive layers and the center that two conductive layers are isolated Insulating layer,.LED light strip production process is that conventional having etches FPC production procedure.Therefore two conductive in the fabrication process It need to pass through respectively and the making technologies such as etch and be bonded respectively with the completion hot pressing of two sides isolation protective material, will be led using this technique It causes unilateral conductive layer and insulating layer that need to reduce properties of product and service life through multiple acid and alkali corrosion and high-temperature baking, produces Low efficiency, higher cost pollute larger.
This patent is high primarily directed to energy consumption in the production procedure for solving FPC light bar, the period is long, etching solution processing cost Height does not meet the problems such as environmental requirement, to develop a carrier circuit material for no etch process FPC light bar.
Summary of the invention
The invention aims to provide a kind of epoxy adhesive and application, to overcome the disadvantages of the prior art mentioned above.
In order to achieve the above object, the technical solution of the present invention is as follows:
A kind of epoxy adhesive, including 10-40 parts of polyurethane, 5-20 parts of polyphenylene oxide, 80-150 parts of epoxy resin, curing agent 3-10 Part, 5-15 parts of fire retardant, 50-100 parts of filler, 30-50 parts of solvent；The polyurethane is polyester-type polyurethane containing carboxyl, polyethers One of type polyurethane containing carboxyl or a variety of mixing；The polyphenylene oxide is terminal hydroxy group polyphenylene oxide, in epoxy terminated polyphenylene oxide One or more mixing；The epoxy resin is polyfunctional epoxy resin, is phenol type novolac epoxy resin, bisphenol A-type phenol One of formaldehyde epoxy resin, biphenyl type epoxy resin, phosphorous epoxy resin or a variety of mixing；The curing agent is amine-type cure One of agent, acid anhydride type curing agent or a variety of mixing are dicyanodiamine, m-phenylene diamine (MPD), diethylenetriamine, phthalic anhydride One of or a variety of mixing；The fire retardant is polyphenyl phosphate；The filler is silica, aluminium hydroxide, oxidation One of magnesium, aluminium oxide or a variety of mixing；The solvent is butanone.
The molecular weight of the polyurethane is 3000 ~ 60000, and glass transition temperature is -15 DEG C ~ 80 DEG C；The polyphenylene oxide Molecular weight be 3000 ~ 10000.
A kind of preparation process of the PET cover film based on above-mentioned epoxy adhesive, comprising the following steps:
Step 1: epoxy adhesive is spread evenly across electrical insulating film single side using coating apparatus, rubberization thickness is 10-30 μm；
Step 2: the electrical insulating film that adhesive is coated in step 1 is removed into solvent and drying, dry temperature by drying oven 80-160 DEG C of degree, heating time 1-3min；
Step 3: the electrical insulating film that semi-solid preparation glue-line is had in step 2 is pasted again with separated type material roll-in, roll temperature 60- 100℃；
Step 4: it is cured 30 ± 10 hours under the conditions of the product of step 3 is placed on 40-80 DEG C, obtains the epoxy adhesive PET cover film.
The electrical insulating film is polyester film, with a thickness of 12.5-50 μm.
The adhesive layer dry thickness is 10-30 μm.
The separated type material is BOPP release film, and BOPP release film is with a thickness of 25 μm.
Compared with prior art, the beneficial effects of the present invention are:
1) the PET cover film of this adhesive of epoxy adhesive prepared by the present invention and application has low off-type force, and peel strength is steady Fixed characteristic can be used for preparing without etching LED circuit board.
2) reduce exposure in FPC processing procedure using epoxy adhesive prepared by the present invention, development, etch, move back film etc. and changing Processing technological flow is learned, product stability and production efficiency is improved, reduces environmental pollution, reduce production cost, is greener Colour circle is protected.
Specific embodiment
Below in conjunction with specific embodiment, the present invention is described in further detail, but embodiments of the present invention include But it is not limited to the range of following embodiment expression.
Embodiment 1
A kind of epoxy adhesive is made using following raw material:
10 parts of polyester-type polyurethane containing carboxyl, 10 parts of terminal hydroxy group polyphenylene oxide, 70 parts of phenol type novolac epoxy resin, bisphenol A-type phenol 20 parts of formaldehyde epoxy resin, 10 parts of phosphorous epoxy resin, 15 parts of polyphenyl phosphate, 20 parts of silica, 30 parts of magnesia, dicyan 3 parts of diamines, 42 parts of butanone.
The preparation method is as follows:
Step 1: by 10 parts of polyester-type polyurethane containing carboxyl, 10 parts of terminal hydroxy group polyphenylene oxide, 70 parts of phenol type novolac epoxy resin, 20 parts of bisphenol A-type novolac epoxy resin, 10 parts of phosphorous epoxy resin, 10 parts of butanone are placed in high dispersive mixing kettle and stir 2h；
Step 2: by gained mixture and 15 parts of polyphenyl phosphate, 20 parts of silica, 30 parts of magnesia, fourth in step 1 30 parts of mixing 2h of ketone；
Step 3: by gained mixture and 2 parts of 3 parts of dicyanodiamine, butanone mixing 2h in step 2；
Step 4: by addition butanone solvent or extend mixing time adjusting adhesive solid content, until when solid content is 47 ± 2% Stop stirring, obtains epoxy adhesive.
Using the epoxy adhesive being prepared as procedure described above, PET cover film is prepared, the method is as follows:
Step 1: using coating apparatus, even spread epoxy adhesive, rubberization thickness are 10-12 μ in 12.5 μm of PET film m；
Step 2: the PET film that adhesive is coated in step 1 is removed into solvent and drying, drying temperature by drying oven 80 DEG C, heating time 3min；
Step 3: by the PET film for having semi-solid preparation glue-line in step 2 and the BOPP release film material by means of rolling with a thickness of 25 μm Multiple patch, 60 DEG C of roll temperature；
Step 4: it is cured 40 hours under the conditions of the product of step 3 is placed on 40 DEG C, the PET for obtaining the epoxy adhesive covers copper Plate.
Embodiment 2
A kind of epoxy adhesive is made using following raw material:
25 parts of polyether-type polyurethane containing carboxyl, 5 parts of epoxy terminated polyphenylene oxide, 50 parts of bisphenol A-type novolac epoxy resin, phosphorous epoxy 30 parts of resin, 5 parts of polyphenyl phosphate, 60 parts of aluminium hydroxide, 20 parts of magnesia, 10 parts of phthalic anhydride, 43 parts of butanone.
The preparation method is as follows:
Step 1: by 25 parts of polyether-type polyurethane containing carboxyl, 5 parts of epoxy terminated polyphenylene oxide, bisphenol A-type novolac epoxy resin 50 Part, 30 parts of phosphorous epoxy resin, 8 parts of butanone be placed in high dispersive mixing kettle and stir 1h；
Step 2: by gained mixture and 5 parts of polyphenyl phosphate, 60 parts of aluminium hydroxide, 20 parts of magnesia, butanone in step 1 30 parts of mixing 3h；
Step 3: by gained mixture and 3 parts of 10 parts of phthalic anhydride, butanone mixing 3h in step 2；
Step 4: by addition butanone solvent or extend mixing time adjusting adhesive solid content, until when solid content is 47 ± 2% Stop stirring, obtains epoxy adhesive.
Using the epoxy adhesive being prepared as procedure described above, PET cover film is prepared, the method is as follows:
Step 1: using coating apparatus, even spread epoxy adhesive, rubberization thickness are 15-17 μm in 25 μm of PET film；
Step 2: the PET film that adhesive is coated in step 1 is removed into solvent and drying, drying temperature by drying oven 140 DEG C, heating time 1min；
Step 3: by the PET film for having semi-solid preparation glue-line in step 2 and the BOPP release film material by means of rolling with a thickness of 25 μm Multiple patch, 80 DEG C of roll temperature；
Step 4: it is cured 20 hours under the conditions of the product of step 3 is placed on 60 DEG C, the PET for obtaining the epoxy adhesive covers copper Plate.
Embodiment 3
A kind of epoxy adhesive is made using following raw material:
20 parts of polyester-type polyurethane containing carboxyl, 20 parts of polyether-type polyurethane containing carboxyl, 15 parts of terminal hydroxy group polyphenylene oxide, biphenyl type epoxy 75 parts of resin, 45 parts of phosphorous epoxy resin, 5 parts of polyphenyl phosphate, 50 parts of silica, 50 parts of aluminium hydroxide, divinyl three 3.6 parts of amine, 1.8 parts of m-phenylene diamine (MPD), 42 parts of butanone.
The preparation method is as follows:
Step 1: by 20 parts of polyester-type polyurethane containing carboxyl, 20 parts of polyether-type polyurethane containing carboxyl, 15 parts of terminal hydroxy group polyphenylene oxide, 75 parts of biphenyl type epoxy resin, 45 parts of phosphorous epoxy resin, 10 parts of butanone be placed in high dispersive mixing kettle and stir 2h；
Step 2: by gained mixture and 5 parts of polyphenyl phosphate, 50 parts of silica, 50 parts of aluminium hydroxide, fourth in step 1 30 parts of mixing 2h of ketone；
Step 3: gained mixture in step 2 is mixed with 3.6 parts of diethylenetriamine, 1.8 parts of m-phenylene diamine (MPD), 2 parts of butanone and is stirred Mix 2h；
Step 4: by addition butanone solvent or extend mixing time adjusting adhesive solid content, until when solid content is 47 ± 2% Stop stirring, obtains epoxy adhesive.
Using the epoxy adhesive being prepared as procedure described above, PET cover film is prepared, the method is as follows:
Step 1: using coating apparatus, even spread epoxy adhesive, rubberization thickness are 25-27 μm in 38 μm of PET film；
Step 2: the PET film that adhesive is coated in step 1 is removed into solvent and drying, drying temperature by drying oven 140 DEG C, heating time 2min；
Step 3: by the PET film for having semi-solid preparation glue-line in step 2 and the BOPP release film material by means of rolling with a thickness of 25 μm Multiple patch, 80 DEG C of roll temperature；
Step 4: it is cured 30 hours under the conditions of the product of step 3 is placed on 60 DEG C, the PET for obtaining the epoxy adhesive covers copper Plate.
Embodiment 4
A kind of epoxy adhesive is made using following raw material:
20 parts of polyester-type polyurethane containing carboxyl, 10 parts of terminal hydroxy group polyphenylene oxide, 10 parts of epoxy terminated polyphenylene oxide, phenol type epoxy novolac 30 parts of resin, 50 parts of bisphenol A-type novolac epoxy resin, 50 parts of biphenyl type epoxy resin, 20 parts of phosphorous epoxy resin, phosphate are neat 10 parts of polymers, 80 parts of aluminium hydroxide, 20 parts of aluminium oxide, 4.4 parts of m-phenylene diamine (MPD), 2.6 parts of dicyanodiamine, 45 parts of butanone.
The preparation method is as follows:
Step 1: by 20 parts of polyester-type polyurethane containing carboxyl, 10 parts of terminal hydroxy group polyphenylene oxide, 10 parts of epoxy terminated polyphenylene oxide, phenol 30 parts of type novolac epoxy resin, 50 parts of bisphenol A-type novolac epoxy resin, 50 parts of biphenyl type epoxy resin, phosphorous epoxy resin 20 Part, 12 parts of butanone be placed in high dispersive mixing kettle and stir 2h；
Step 2: by gained mixture and 10 parts of polyphenyl phosphate, 80 parts of aluminium hydroxide, 20 parts of aluminium oxide, fourth in step 1 30 parts of mixing 2h of ketone；
Step 3: by gained mixture in step 2 and 4.4 parts of m-phenylene diamine (MPD), 2.6 parts of dicyanodiamine, 3 parts of butanone mixings 2h；
Step 4: by addition butanone solvent or extend mixing time adjusting adhesive solid content, until when solid content is 47 ± 2% Stop stirring, obtains epoxy adhesive.
Using the epoxy adhesive being prepared as procedure described above, PET cover film is prepared, the method is as follows:
Step 1: using coating apparatus, even spread epoxy adhesive, rubberization thickness are 28-30 μm in 50 μm of PET film；
Step 2: the PET film that adhesive is coated in step 1 is removed into solvent and drying, drying temperature by drying oven 160 DEG C, heating time 3min；
Step 3: by the PET film for having semi-solid preparation glue-line in step 2 and the BOPP release film material by means of rolling with a thickness of 25 μm Multiple patch, 100 DEG C of roll temperature；
Step 4: it is cured 30 hours under the conditions of the product of step 3 is placed on 80 DEG C, the PET for obtaining the epoxy adhesive covers copper Plate.
The performance of PET cover film made from embodiment 1-4 based on the epoxy adhesive is tested, specific performance is shown in Table 1.
Table 1: the performance of the PET cover film of the production of each embodiment
From table 1 it follows that peel strength is 1.0kgf/cm to 3 sample of embodiment at room temperature, it is strong to meet the removing of IPC standard The requirement of degree, after room temperature storage 15 days, peel strength rate of descent is no more than 15%, has good stability, heat resistance, ruler Very little stability, anti-flammability are also all satisfied the standard requirements of IPC, and the off-type force of 15gf/5cm meets requirement.
In above embodiments, embodiment 3 is most preferred embodiment.

Claims (6)

1. a kind of epoxy adhesive, it is characterised in that:
Including 10-40 parts of polyurethane, 5-20 parts of polyphenylene oxide, 80-150 parts of epoxy resin, 3-10 parts of curing agent, fire retardant 5-15 Part, 50-100 parts of filler, 30-50 parts of solvent；The polyurethane is polyester-type polyurethane containing carboxyl, polyether-type polyurethane containing carboxyl One of or a variety of mixing；The polyphenylene oxide is one of terminal hydroxy group polyphenylene oxide, epoxy terminated polyphenylene oxide or a variety of mixing； The epoxy resin is polyfunctional epoxy resin, is phenol type novolac epoxy resin, bisphenol A-type novolac epoxy resin, biphenyl One of type epoxy resin, phosphorous epoxy resin or a variety of mixing；The curing agent is amine curing agent, acid anhydride type curing agent One of or a variety of mixing, be one of dicyanodiamine, m-phenylene diamine (MPD), diethylenetriamine, phthalic anhydride or a variety of Mixing；The fire retardant is polyphenyl phosphate；The filler is silica, aluminium hydroxide, magnesia, one in aluminium oxide Kind or a variety of mixing；The solvent is butanone.
2. a kind of epoxy adhesive according to claim 1, it is characterised in that:
The molecular weight of the polyurethane is 3000 ~ 60000, and glass transition temperature is -15 DEG C ~ 80 DEG C；Point of the polyphenylene oxide Son amount is 3000 ~ 10000.
3. the preparation process that a kind of epoxy adhesive as claimed in claim 1 or 2 is used for PET cover film, it is characterised in that:
The following steps are included:
Step 1: epoxy adhesive is spread evenly across electrical insulating film single side using coating apparatus, rubberization thickness is 10-30 μm；
Step 2: the electrical insulating film that adhesive is coated in step 1 is removed into solvent and drying, dry temperature by drying oven 80-160 DEG C of degree, heating time 1-3min；
Step 3: the electrical insulating film that semi-solid preparation glue-line is had in step 2 is pasted again with separated type material roll-in, roll temperature 60- 100℃；
Step 4: it is cured 30 ± 10 hours under the conditions of the product of step 3 is placed on 40-80 DEG C, obtains the epoxy adhesive PET cover film.
4. a kind of preparation process of the PET cover film of epoxy adhesive according to claim 3, it is characterised in that:
The electrical insulating film is polyester film, with a thickness of 12.5-50 μm.
5. a kind of preparation process of the PET cover film of epoxy adhesive according to claim 4, it is characterised in that:
The adhesive layer dry thickness is 10-30 μm.
6. a kind of preparation process of the PET cover film of epoxy adhesive according to claim 5, it is characterised in that
The separated type material is BOPP release film, and BOPP release film is with a thickness of 25 μm.
CN201910727926.3A 2019-08-08 2019-08-08 A kind of epoxy adhesive and application Pending CN110452652A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113381046A (en) * 2021-03-29 2021-09-10 浙江汉丞新能源有限公司 Preparation method of special enhanced fluorine-containing composite membrane or membrane electrode

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Publication number Priority date Publication date Assignee Title
JP2007070471A (en) * 2005-09-07 2007-03-22 Toyo Ink Mfg Co Ltd Plastic film having adhesive layer, flexible printed circuit board having cover film and method for producing the same
CN101333327A (en) * 2008-07-02 2008-12-31 中国科学院广州化学研究所 Composite modified polyphenylene oxide/epoxy material for printing circuit coller clad plate and method for preparing same
CN103045143A (en) * 2012-11-14 2013-04-17 浙江华正新材料股份有限公司 Halogen-free epoxy adhesive and cover film prepared by using halogen-free epoxy adhesive
CN107880530A (en) * 2017-12-25 2018-04-06 广东生益科技股份有限公司 Halogen-free resin composition and cover layer and preparation method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007070471A (en) * 2005-09-07 2007-03-22 Toyo Ink Mfg Co Ltd Plastic film having adhesive layer, flexible printed circuit board having cover film and method for producing the same
CN101333327A (en) * 2008-07-02 2008-12-31 中国科学院广州化学研究所 Composite modified polyphenylene oxide/epoxy material for printing circuit coller clad plate and method for preparing same
CN103045143A (en) * 2012-11-14 2013-04-17 浙江华正新材料股份有限公司 Halogen-free epoxy adhesive and cover film prepared by using halogen-free epoxy adhesive
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CN113381046A (en) * 2021-03-29 2021-09-10 浙江汉丞新能源有限公司 Preparation method of special enhanced fluorine-containing composite membrane or membrane electrode
CN113381046B (en) * 2021-03-29 2022-11-18 浙江汉丞新能源有限公司 Preparation method of enhanced fluorine-containing composite membrane or membrane electrode

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