CN110452625B - Pressure-sensitive adhesive articles and methods of making the same - Google Patents

Pressure-sensitive adhesive articles and methods of making the same Download PDF

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Publication number
CN110452625B
CN110452625B CN201910904650.1A CN201910904650A CN110452625B CN 110452625 B CN110452625 B CN 110452625B CN 201910904650 A CN201910904650 A CN 201910904650A CN 110452625 B CN110452625 B CN 110452625B
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pressure
adhesive
sensitive adhesive
peeling force
areas
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CN110452625A (en
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顾正青
朱强
计建荣
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Suzhou Shihua New Material Technology Co ltd
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Suzhou Shihua New Material Technology Co ltd
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/10Adhesives in the form of films or foils without carriers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • C09J7/381Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385Acrylic polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/20Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/21Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being formed by alternating adhesive areas of different nature
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C

Abstract

The application discloses a pressure-sensitive adhesive product and a preparation method thereof, the pressure-sensitive adhesive product has at least two different peeling force areas on the adhesive surface, the area with relatively lower peeling force penetrates through the adhesive surface and extends to the edge of the adhesive product, the adhesive thickness of the other areas with relatively lower peeling force except the area with the highest peeling force is smaller than that of the area with the highest peeling force, and the pressure-sensitive adhesive product is formed by curing the adhesive after being subjected to electronic irradiation with different doses. The pressure-sensitive adhesive tape product colloid is an integral body, and has excellent air exhaust performance and better reworkability.

Description

Pressure-sensitive adhesive articles and methods of making the same
Technical Field
The application relates to the technical field of pressure-sensitive adhesive materials, in particular to a pressure-sensitive adhesive product and a preparation method thereof.
Background
With the rapid development of electronic product science and technology, the pressure-sensitive adhesive plays an irreplaceable role in the life of people, is widely applied to the assembly of various parts as an indispensable part in the field of electronic products, and has the effects of functional parts and structural parts.
The pressure-sensitive adhesive is applied to electronic products, and is required to have higher attaching flatness besides better adhesive property. The existing pressure-sensitive adhesive generally has the following problems in use: (1) during the laminating, bubbles are easily generated, and the (2) residual glue during laminating dislocation and repeated lamination or tearing is not easy to generate, so that the reject ratio of the product is high due to the problems.
The prior art discloses a grid venting adhesive, which is characterized in that an adhesive surface is attached to a grid release film, grid impression of the grid release film is left on the adhesive surface in a short time after the grid release film is removed, bubbles can be discharged, and then the adhesive surface gradually levels and loses the venting function; rebound bubbles appearing in the use process of the adhesive tape can remain on the adhesive surface, and finally the performance of the electronic equipment can be influenced.
Another technique discloses an adhesive tape in which an adhesive part and a non-adhesive part having no adhesive are mixed in an adhesive layer on at least one surface. The scheme has high exhaust performance, but the following defects exist at the same time: (1) the non-adhesive part without adhesive can remove gas, and outside pollutants or erosion matters can also enter the adhesive layer along the area, so that the durability of the non-adhesive part is reduced; (2) under the condition of the same formula of the adhesive, the overall peeling force of the adhesive tape with the non-adhesive part is far lower than that of the adhesive tape with the full-coverage adhesive; (3) when the double-sided adhesive tape without the base material is prepared, the removal difficulty of the colloid is high (the colloid becomes sporadic colloid and is stuck on an attached object).
In summary, how to reduce or easily eliminate bubbles generated during the attachment of the adhesive product and achieve reworkability of attachment dislocation in the attachment process is a technical problem to be solved by those skilled in the art.
Disclosure of Invention
Aiming at the defects of the prior art, the application aims to provide a pressure-sensitive adhesive and a preparation method thereof. The pressure-sensitive adhesive has a permanent venting function and adhesive properties and is easy to rework.
In order to achieve the above object, the present application provides the following technical solutions.
A pressure sensitive adhesive article having on at least one adhesive side, simultaneously at least two regions of differing peel force, and at least one region extending through the adhesive side and to the edge of the adhesive article; the different areas of peel force have the same or different glue thicknesses.
Preferably, the area with relatively low peeling force penetrates through the adhesive surface and extends to the edge of the adhesive product, and the area with relatively low peeling force is easy to separate from the object to be pasted and form an air exhaust channel when external force is applied. This arrangement allows either bubbles generated during fitting or bounce-back bubbles generated during later use to be quickly expelled through the area.
Preferably, the glue thickness of the other areas with relatively low peeling force except the area with the highest peeling force is smaller than that of the area with the highest peeling force, so that a glue layer structure is formed, wherein the glue layer of the area with relatively low peeling force is embedded in the area with the highest peeling force, and the integrity of the glue body is ensured.
Preferably, the different peeling force areas on the adhesive surface are any linear, strip-shaped, any shape area, or a combination of at least two of the shapes, or other shapes capable of forming the air vent channel.
Preferably, the ratio of the area with the highest peeling force on the adhesive surface to the area of the adhesive surface is 0.1-99.9%, and the ratio can be reasonably selected according to factors such as the target peeling force required by the adhesive surface, the number of rebound bubbles and the like.
The application also discloses a preparation method of the pressure-sensitive adhesive product, which is formed by coating the adhesive and curing the adhesive after receiving electron irradiation with different doses.
The pressure-sensitive adhesive comprises the following components in parts by mass: 10-60 parts of acrylate or methacrylate active polymer; 20-70 parts of a diluent; 5-20 parts of tackifying resin; 0-10 parts of functional additive.
Preferably, the diluent is an acrylate or methacrylate monomer.
Preferably, the tackifying resin is a rosin ester or terpene resin.
Preferably, the functional additive is at least one of an electrically conductive filler, a thermally conductive filler, an anti-aging agent and an anti-ultraviolet agent. The conductive filler can be selected from metal powder, metal-coated non-conductive particles, conductive carbon black, carbon nano tubes and the like. The heat-conducting filler can be selected from alumina, silicon micropowder and the like.
Further, the pressure-sensitive adhesive may be a commercially available adhesive which can be cured by electron irradiation in the prior art, and the electron irradiation dose required for curing is 20 to 40 kGy. The use of electron radiation cured adhesives allows pressure sensitive adhesive articles to be used in most environments, including those under ultraviolet light.
Preferably, the accelerator type of the electron irradiation is a low-energy electron curtain type, and the energy range is 100-300 kev.
Preferably, the adhesive product is formed by electron irradiation at least twice, and different doses of electron irradiation are realized through local shielding.
Compared with the prior art, the technical scheme of the application has at least the following advantages.
(1) Has excellent air-release property: when bubbles appear in the attaching process, the gas can be driven to a relatively low peeling force area in an extruding mode and can be quickly removed.
(2) Has better reworkability: when the pre-pasting is attached and dislocated, the adhesive surface has a relatively low peeling force area, so that the adhesive surface can be removed, and the reworking is facilitated.
(3) The colloid is an integer, ensures the peeling force of the whole adhesive tape and is not easy to break when the adhesive tape is removed by heavy work.
Drawings
FIG. 1 is a schematic view of the structure of the different peel force zones on the adhesive side of the pressure-sensitive adhesive article of the present application.
FIG. 2 is a schematic cross-sectional view of a substrate-free, double-sided pressure sensitive adhesive article of the present application.
FIG. 3 is a schematic cross-sectional view of another non-substrate double-sided pressure-sensitive adhesive article of the present application.
FIG. 4 is a schematic cross-sectional view of a double-sided pressure-sensitive adhesive article having a substrate according to the present application.
FIG. 5 is a schematic cross-sectional view of a single-sided pressure-sensitive adhesive article of the present application.
FIG. 6 is a schematic cross-sectional view of another single-sided pressure-sensitive adhesive article of the present application.
Description of the drawings: 10-a glue layer of a pressure sensitive adhesive article, 20-a substrate layer of a double-sided pressure sensitive adhesive article having a substrate, 30-a carrier film of a single-sided pressure sensitive adhesive article, 101-a first glue side of a double-sided pressure sensitive adhesive article, 101-a second glue side of a double-sided pressure sensitive adhesive article, 11-a glue side region having a first peel force, 12-a glue side region having a second peel force, 13-a glue side region having a third peel force, 14-a glue side region having a first peel force.
Detailed Description
The present application will be further specifically described with reference to specific examples, but the present application is not limited to these examples.
Example 1.
Step 1: 10-40 parts of acrylate active polymer taking unsaturated vinyl as a terminal group, 40-70 parts of acrylate monomer and 10-20 parts of rosin ester are mixed and stirred to prepare the pressure-sensitive adhesive glue with the electron irradiation dose of 20-25kGy required for curing for later use.
Step 2: and coating the glue on a base material, a bottom film or a release film, irradiating by using an electron curtain type accelerator with the energy range of 150 and 200kev, curing the glue to form a colloid with single stripping force, and attaching an electron beam penetrable release film to the surface of the colloid to obtain the semi-finished product 1.
And step 3: covering a hollowed-out film which is not penetrated by the electron beam and has the shape of a glue surface area (12) with a second stripping force as shown in figure 1 on one side of the semi-finished product 1 which is attached to the electron beam penetrable release film, and carrying out secondary electron irradiation (the energy range is 130-180 kev) to form a semi-finished product 2 with two types of stripping force glue.
And 4, step 4: one side of the finished product 2, which is attached to the electron beam penetrable release film, is covered with a hollowed-out film which is not penetrated by the electron beam and has the shape of an adhesive surface area (13) with a third peeling force as shown in figure 1, and is subjected to third electron irradiation (with an energy range of 100-150 kev).
Obtaining a glue surface with three peel force areas (11, 12, 13) as shown in fig. 1, wherein the peel force of the glue surface areas is sequentially as follows: 11>12>13, wherein the proportion of the area of the glue face of the maximum peeling force area (11) to the total glue face area can be set to any proportion between 0.1-99.9%.
Example 2.
Step 1: 30-60 parts of acrylate active polymer taking unsaturated propenyl as a terminal group, 20-50 parts of acrylate monomer, 5-10 parts of terpene resin and 3-5 parts of conductive filler are mixed and stirred to prepare the pressure-sensitive adhesive glue with the electron irradiation dose of 20-30kGy required for curing for later use.
Step 2: and coating the glue on a release film or a bottom film, irradiating by using an electron curtain accelerator with the energy range of 200-300kev, curing the glue to form a colloid with single stripping force, and attaching an electron beam to the surface of the colloid to penetrate through the release film to obtain a semi-finished product 1.
And step 3: covering a hollowed-out film which is not penetrated by the electron beam and has the shape of an adhesive surface area (12) with a second peeling force shown in figure 1 or figure 6 on one side of the semi-finished product 1, performing secondary electron irradiation (with the energy range of 200kev and 300 kev), and continuously irradiating until the area is completely crosslinked again on the thickness of the adhesive layer.
When glue is coated on the release film, the section of the obtained pressure-sensitive adhesive product is the double-sided pressure-sensitive adhesive with two peeling force areas and no substrate shown in figure 2; when the glue is applied to the carrier film, the resulting pressure-sensitive adhesive article has a cross-section of a single-sided pressure-sensitive adhesive having two peel force zones as shown in fig. 6.
Example 3.
Step 1: taking purchased pressure-sensitive adhesive glue capable of curing by electron irradiation (the electron irradiation dose required by curing is 25-35 kGy), adding heat-conducting filler (the mass is 0.1-5% of the glue mass), and uniformly stirring for later use.
Step 2: and (3) coating the glue on the electron beam penetrable release film, irradiating by using an electron curtain type accelerator with the energy range of 200-300kev, curing the glue to form a colloid with single stripping force, and attaching the electron beam penetrable release film to the surface of the colloid to obtain the semi-finished product 1.
And step 3: covering the hollow-out films with the shapes of the glue surface areas (12) which can not be penetrated by the electron beams and have the second stripping force shown in figure 3 on two sides of the semi-finished product 1 respectively, and performing secondary electron irradiation (with the energy range of 100-200 kev) respectively until the re-crosslinking depth of the areas is less than half of the thickness of the glue layer.
A substrate-free double-sided pressure-sensitive adhesive having two peel force zones in cross section as shown in fig. 3 was obtained.
Example 4.
Step 1: taking purchased pressure-sensitive adhesive glue capable of being cured by electron irradiation (the electron irradiation dose required by curing is 30-40 kGy), and uniformly stirring for later use.
Step 2: and coating the glue on an electron beam impenetrable substrate, irradiating by using an electron curtain type accelerator with the energy range of 150-250kev, curing the glue to form a colloid with single stripping force, and attaching an electron beam penetrable release film to the surface of the colloid to obtain the semi-finished product 1.
And step 3: coating the glue on an electron beam penetrable release film, and curing the glue through irradiation of an electron curtain type accelerator with the energy range of 150-; and (3) attaching the adhesive surface to the base material surface of the semi-finished product 1 in the step (2) to obtain a semi-finished product 2.
And 4, step 4: and covering the hollow-out films which are not penetrated by the electron beams and have the shapes of the glue surface areas (12) with the second stripping force shown in figure 4 on two sides of the semi-finished product 2 respectively, performing secondary electron irradiation (with the energy range of 100-200 kev) respectively, and controlling the irradiation time to ensure that the re-crosslinking depth in the areas is less than half of the thickness of the glue layer.
A double-sided pressure-sensitive adhesive with a substrate having two peel force areas as shown in fig. 4 was obtained in the cross section.
Example 5.
Step 1: taking purchased pressure-sensitive adhesive glue capable of being cured by electron irradiation (the electron irradiation dose required by curing is 20-30 kGy), and uniformly stirring for later use.
Step 2: and coating the glue on a bottom film, irradiating by using an electron curtain type accelerator with the energy range of 150-.
And step 3: covering a hollowed-out film which is not penetrated by the electron beam and has the shape of the glue surface area (12) with the second peeling force shown in figure 5 on one side of the semi-finished product 1, performing secondary electron irradiation (with the energy range of 100-150 kev), and controlling the irradiation time to ensure that the re-crosslinking depth in the area is less than the total thickness of the glue layer.
A double-sided pressure-sensitive adhesive with a substrate having two peel force areas as shown in fig. 4 was obtained in the cross section.
The above description is only for the purpose of illustrating the preferred embodiments of the present application and is not intended to limit the scope of the present application, which is to be accorded the full scope of the appended claims so as to embrace all such equivalent structures, either directly or indirectly, that are within the scope of the present application.
In addition, technical solutions between various embodiments may be combined with each other, but must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present application.

Claims (10)

1. A pressure sensitive adhesive article having permanent venting and easy rework, characterized by: at least two areas with different peeling forces exist on at least one side of the adhesive surface, and at least one area with relatively lower peeling force penetrates through the adhesive surface and extends to the edge of the adhesive product;
the areas with different peeling forces have the same or different glue thicknesses;
the pressure-sensitive adhesives in the different peeling force areas of the adhesive surface are all the same system;
the pressure-sensitive adhesive product is formed by coating the adhesive and curing the adhesive by electron irradiation with different doses at least twice.
2. A pressure sensitive adhesive article having permanent venting and easy rework, characterized by: at least two areas with different peeling forces exist on at least one side of the adhesive surface, and the area with relatively lower peeling force penetrates through the adhesive surface and extends to the edge of the adhesive product;
wherein the glue thickness of the other areas with relatively low peeling force except the area with the highest peeling force is smaller than that of the area with the highest peeling force;
the pressure-sensitive adhesives in the different peeling force areas of the adhesive surface are all the same system;
the pressure-sensitive adhesive product is formed by coating the adhesive and curing the adhesive by electron irradiation with different doses at least twice.
3. The pressure-sensitive adhesive article having a permanent air-release function and being easily reworked, according to claim 1 or 2, wherein: the different peeling force areas on the adhesive surface are surface areas in any linear shape, strip shape and any shape, or the combination of at least two shapes.
4. The pressure-sensitive adhesive article having a permanent air-release function and being easily reworked, according to claim 1 or 2, wherein: the proportion of the area with the highest stripping force on the adhesive surface to the area of the adhesive surface is 0.1-99.9%.
5. A method for producing a pressure-sensitive adhesive article having a permanent exhaust function and easy reworking as recited in any one of claims 1 to 4, wherein: the adhesive comprises the following components in parts by mass:
10-60 parts of acrylate or methacrylate active polymer;
20-70 parts of a diluent;
5-20 parts of tackifying resin;
0-10 parts of functional additive;
the electron irradiation dose required by curing the pressure-sensitive adhesive is 20-40 kGy.
6. A method for producing a pressure-sensitive adhesive article having a permanent exhaust function and easy reworking as recited in any one of claims 1 to 4, wherein: the pressure-sensitive adhesive product is a commercially available electron irradiation curing adhesive, and the electron irradiation dose required by curing is 20-40 kGy.
7. The method for producing a pressure-sensitive adhesive article having a permanent exhaust function and being easily reworked according to claim 5, wherein: the diluent is acrylate or methacrylate monomer.
8. The method for producing a pressure-sensitive adhesive article having a permanent exhaust function and being easily reworked according to claim 5, wherein: the tackifying resin is rosin ester or terpene resin.
9. The method for producing a pressure-sensitive adhesive article having a permanent exhaust function and being easily reworked according to claim 5, wherein: the functional additive is at least one of an electric conduction filler, a heat conduction filler, an anti-aging agent and an anti-ultraviolet agent.
10. The method for producing a pressure-sensitive adhesive article having a permanent exhaust function and being easily reworked according to claim 5 or 6, wherein: the accelerator type of the electron irradiation is a low-energy electron curtain type, and the energy range is 100-300 kev.
CN201910904650.1A 2019-09-24 2019-09-24 Pressure-sensitive adhesive articles and methods of making the same Active CN110452625B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102169849A (en) * 2009-12-25 2011-08-31 日东电工株式会社 Tape for holding chip, method of holding chip-shaped workpiece, method of manufacturing semiconductor device using tape for holding chip, and method of manufacturing tape for holding chip
CN102361945A (en) * 2009-02-05 2012-02-22 德莎欧洲公司 Pressure-sensitive adhesive transfer tape with differentiated adhesion on either side and method for producing the tape
CN206486463U (en) * 2016-12-22 2017-09-12 3M创新有限公司 Adhesive tape
CN108485553A (en) * 2018-05-17 2018-09-04 深圳市创立宏科技有限公司 A kind of battery protection film and battery
CN108611039A (en) * 2018-05-17 2018-10-02 苏州中来光伏新材股份有限公司 A kind of electronic beam curing adhesive and preparation method thereof and painting method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060234014A1 (en) * 2005-04-14 2006-10-19 Liu Yaoqi J Patterned adhesives for tamper evident feature

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102361945A (en) * 2009-02-05 2012-02-22 德莎欧洲公司 Pressure-sensitive adhesive transfer tape with differentiated adhesion on either side and method for producing the tape
CN102169849A (en) * 2009-12-25 2011-08-31 日东电工株式会社 Tape for holding chip, method of holding chip-shaped workpiece, method of manufacturing semiconductor device using tape for holding chip, and method of manufacturing tape for holding chip
CN206486463U (en) * 2016-12-22 2017-09-12 3M创新有限公司 Adhesive tape
CN108485553A (en) * 2018-05-17 2018-09-04 深圳市创立宏科技有限公司 A kind of battery protection film and battery
CN108611039A (en) * 2018-05-17 2018-10-02 苏州中来光伏新材股份有限公司 A kind of electronic beam curing adhesive and preparation method thereof and painting method

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