CN108611039A - A kind of electronic beam curing adhesive and preparation method thereof and painting method - Google Patents
A kind of electronic beam curing adhesive and preparation method thereof and painting method Download PDFInfo
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- CN108611039A CN108611039A CN201810472170.8A CN201810472170A CN108611039A CN 108611039 A CN108611039 A CN 108611039A CN 201810472170 A CN201810472170 A CN 201810472170A CN 108611039 A CN108611039 A CN 108611039A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/02—Polyalkylene oxides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/068—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using ionising radiations (gamma, X, electrons)
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/10—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an adhesive surface
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
- C08K2003/3045—Sulfates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- Engineering & Computer Science (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention relates to a kind of electronic beam curing adhesive and preparation method thereof and painting methods.Including main body reactive resin, polyfunctional group curing agent, plasticizer, filler and active solvent, which is subjected to electron beam irradiation generation polymerization and is changed into solid with crosslinking.Advantage is：Realize rapid curing, thus without introducing photoinitiator in formula, it is more economical；It can be cured under the electron beam irradiation of relatively low-dose, it is safer；Solidification can be carried out in room temperature, and heat source that should not be additional is more energy efficient；Without volatile solvent, entire solidification process is more environmentally friendly；The high energy and high-penetration of electron beam keep solidification more complete, and plybonding effect is better, and adhesive layer is more resistant to time, resistance to boiling.
Description
Technical field
The present invention relates to a kind of adhesive fields, in particular, a kind of electronic beam curing adhesive and preparation method thereof and
Painting method.
Background technology
The mankind have long history using adhesive, and the adhesive used earliest mostly derives from natural sicker
Matter, and be all mostly water-soluble.Due to the development of modern industry, whether yield or kind be all already for natural glue
It cannot meet the requirements, thus facilitate the continuous development of synthetic adhesive industry.Early in the twentieth century phenolic resin glue opens conjunction
At new era of adhesive.Later, the development of adhesive is then more swift and violent.Adhesive be can be carried out with curing agent it is cured, solid
An organic or inorganic, natural or synthetic substance with sufficient intensity after change.Its main function be by two kinds or
Two or more homogeneities or heterogeneous material link together.
The mode that traditional adhesive is all made of baking after coating carries out heat cure, and which not only greatly wastes
The energy, and a series of solvent can be discharged, it is more likely that lead to the generation of fire incident.Meanwhile using the technique of baking into
Row solidification, cost input is high, takes up a large area, and do not meet energy-saving and emission-reduction, this environmental-friendly requirement.And EB (electron beam) is solid
Change technology has its particular advantages in equipment, process and actual effect, can meet height of the people to process of producing product
Effect, energy-saving and environmental protection, economy composite request.EB (electron beam) curing technology has the solvent-free property of process, and (no environment is dirty
Dye), save the energy 1/5-1/10 of energy consumption (about heat curing techniques), curing rate fast (0.1-10 second) (production efficiency height),
It does not generate heat (film does not generate contraction and distortion, can process thermo-sensitive material), is compact to design (fewer than traditional heat cure to account for 90%
Space), extensive practicability (can be used for decorating, print, laminate, silicone release coating and adhesive for solvent-free use) etc. it is unique excellent
Point.Therefore EB (electron beam) curing technology is summarized as to have " 5E " characteristic, less-Energy consumptive in the world
(low energy consumption)；Ecological (ecological balance)；Economic (business efficiency is high)；Excellent finishing (products
It has excellent performance)；Easy operation (equipment is easy to operate).However, now widely used electronic beam curing adhesive is still
Low temperature, quick-drying this requirement cannot so be met.Therefore, research and develop a ripening at low temperature, quick-dry type electronic beam curing adhesive will
It can push and accelerate the application and popularization of Electron beam curing technology.
Invention content
Technical problem to be solved by the present invention lies in the deficiency for overcoming the above-mentioned prior art, provide a kind of ripening at low temperature,
Quick-dry type electronic beam curing adhesive and preparation method thereof and painting method.
A kind of electronic beam curing adhesive provided by the invention, the main technical schemes used for：
A kind of electronic beam curing adhesive, including main body reactive resin, polyfunctional group curing agent, plasticizer, filler and work
Property solvent, the electronic beam curing adhesive be subjected to electron beam irradiation occur polymerization with crosslinking be changed into solid.
A kind of strong electronic beam curing adhesive of safety of structure provided by the invention further includes following attached technical side
Case：
Wherein, the mass percentage of each constituent of the electronic beam curing adhesive is：
Wherein, the active solvent includes the unsaturated monomer that can be caused polymerization by electron beam.
Wherein, the filler is barium sulfate and graphene.
Wherein, the main body reactive resin includes in organic siliconresin, acrylic resin, polyester resin and polyether resin
One or more of combinations；Oxygen modified organic silicone resin or acryl-modified silicone resin resin；
The active end group of the acrylic resin, polyester resin and polyether resin is undersaturated vinyl, undersaturated
Allyl or epoxy group.
Wherein, further include functional additive, the functional additive includes age resister, anti ultraviolet agent, coupling agent
One or more of combination.
Wherein, each constituent of the electronic beam curing adhesive and mass percentage are：
Main body reactive resin is polyethylene glycol (200/400/600/1000) monomethyl ether acrylate, percentage composition 25-
55wt%；
Polyfunctional group curing agent is polyethylene glycol (200/400/600/1000) diacrylate, percentage composition 10-
40wt%；
Active solvent is Isooctyl acrylate monomer, percentage composition 5-10wt%；
Plasticizer is trioctyl phosphate, percentage composition 1-5wt%；
Filler is barium sulfate and graphene, percentage composition 0.3-1wt%；
Functional additive is age resister, anti ultraviolet agent and coupling agent, percentage composition 0.1-0.5wt%.
Include following technique effect using a kind of electronic beam curing adhesive provided by the invention：
The present invention uses reactive resin based on organic siliconresin or acrylic resin or polyester resin or polyether resin, adopts
With polyfunctional group curing agent, special gluing is formed in the presence of plasticizer, filler, active solvent and functional additive
Agent, the adhesive have high susceptibility to electron beam, can be fast by polymerization and crosslinking under the irradiation of relatively low-dose electron beam
Speed is transformed into solid, and major advantage is：
1) adhesive is under the action of high-power electron beam, can generate free radicals, anion or cation and polymerize, it is real
Existing rapid curing, thus without introducing photoinitiator in formula, it is more economical.
2) adhesive can cure electron beam and its sensitivity under the electron beam irradiation of relatively low-dose, safer.
3) solidification of adhesive can be carried out in room temperature, heat source that should not be additional, more energy efficient.
4) volatile solvent is free of in adhesive, entire solidification process is more environmentally friendly.
5) high energy of electron beam and high-penetration keep solidification more complete, and plybonding effect is better, and adhesive layer is more resistant to time, resistance to steaming
It boils.
A kind of preparation method of electronic beam curing adhesive provided by the invention, the main technical schemes used for：
Including step：
1) by main body reactive resin, polyfunctional group curing agent and active solvent be added blender in, temperature adjustment to 20-100 DEG C,
Constant temperature is kept, is stirred 20-50 minutes；
2) plasticizer and filler are added into the mixture obtained in 1), temperature adjustment keeps constant temperature, stirring mixed to 20-100 DEG C
It closes 20-50 minutes.
A kind of preparation method of the strong electronic beam curing adhesive of safety of structure provided by the invention further includes following attached
Belong to technical solution：
Wherein, functional additive is added in the mixture obtained into step 2), temperature adjustment keeps permanent to 20-100 DEG C
Temperature is stirred 20-50 minutes.
Include following technique effect using a kind of preparation method of electronic beam curing adhesive provided by the invention：
The process of preparation is simple, is convenient for the production of scale, the adhesive using effect prepared good.For existing
Production line it is easily updated, integrate.
A kind of painting method of electronic beam curing adhesive provided by the invention, the main technical schemes used for：
Including step：
A) adherend surface is handled；
B) each constituent of adhesive is uniformly mixed by preset ratio, stands 40-80 minutes；
C) adhesive after standing is coated in adherend surface, and adhesive is exposed under sufficient electron beam irradiation
Carry out solidification and it is compound.
Include following technique effect using a kind of painting method of electronic beam curing adhesive provided by the invention：
Save space (than the space that traditional heat cure saves 90%), easily updated, whole for already present production line
It closes, be widely used, can be used for decorating, silicone release coating and adhesive for solvent-free use；Cured film is uniform；It is easy to operate, it is convenient for
Dynamic and stopping.
Specific implementation mode
The present invention is described in detail below in conjunction with embodiment, it should be pointed out that described embodiment only purport
Convenient for the understanding of the present invention, and any restriction effect is not played to it.
According to a kind of embodiment of electronic beam curing adhesive provided by the invention, including it is main body reactive resin, multifunctional
Curing agent, plasticizer, filler and active solvent, the electronic beam curing adhesive are subjected to electron beam irradiation and polymerization and crosslinking occur
It is changed into solid.
The adhesive carries out low-temperature setting using the process for treating surface of electronic beam curing, it does not need additional photoinitiator
It generates free radicals, but directly acts on reactive resin；Usually solidification process is completed in several milliseconds；Entire solidification process energy
Consume it is low, than UV technical energy saving 60%；Cure after being not necessarily to, can reach 95-100% transforming degrees；Solidification process does not generate heat, to compound
Material (printing, laminate, film) not will produce contraction and distortion, can process thermo-sensitive material；And easy to operate, controllability
By force, accuracy and repeatability are high, environmental pollution is low (VOC emission amount low, odorless oxygen evolution), bonding effect is notable, weather-proof, resistance to
Boiling.
Wherein, the mass percentage of each constituent of electronic beam curing adhesive is：
Main body reactive resin is 10%-70%, it is therefore preferable to 25%-55%, most preferably 55%；
Polyfunctional group curing agent is 3%-60%, it is therefore preferable to 3%-40%, most preferably 5%；
Plasticizer is 0.4%-10%, it is therefore preferable to 1%-9.5%, most preferably 9%；
Filler is 0.1%-30%, it is therefore preferable to 0.3%-25%, most preferably 23%；
Active solvent is 0.05wt%-10wt%, it is therefore preferable to 0.3%-9%, most preferably 8%.
Wherein, the filler is barium sulfate and graphene.Using barium sulfate and graphene, surface energy is big, to reinfored glue
The suction-operated of glutinous agent, keeps adhesive finer and close, the adhesive force of adhesive can be improved, help to improve the impact resistance of adhesive
Performance, crocking resistance, thermal conductivity, weatherability and antiseptic property.Further promote the weatherability of adhesive.
By a large amount of it is demonstrated experimentally that the adhesive that the constituent under the ratio manufactures, is commented in the synthesis of each performance
It is optimal under disconnected.
It is changed into solid with crosslinking to achieve the effect that polymerization occurs for excellent electron beam irradiation.Wherein, aforementioned body is lived
Property resin can be homopolymer and copolymer, molecular weight can be it is basic, normal, high, molecular weight distribution can it is wide, can be narrow, main body activity
Resin can be reactive or non-reactive.Preferably main body reactive resin includes organic siliconresin, acrylic resin, gathers
The combination of one or more of ester resin and polyether resin.
Wherein, organic siliconresin is epoxy modified silicone resin or acryl-modified silicone resin resin；
The active end group of acrylic resin, polyester resin and polyether resin is undersaturated vinyl, undersaturated allyl
Base or epoxy group.
A variety of different main body reactive resins are arranged in pairs or groups different curing agent for its performance or different active end groups,
Excellent solidification effect can be achieved under electron beam effect.
Wherein, further include active solvent, the active solvent includes the unsaturated monomer that can be caused polymerization by electron beam.It is main
Include acrylic compounds and vinyl-based, it is therefore preferable to monofunctional acrylate, mono-functional methacrylate etc..It is combining
The molecular weight of active solvent can be arbitrary in object, be added according to service condition arbitrary proportion.
Wherein, the polyfunctional group curing agent is the polyfunctional group curing agent containing unsaturated bond, more officials containing N, S element
It can curing agent or polyamine.
Polyfunctional group curing agent containing unsaturated bond is extremely sensitive to electron beam, includes mainly binary crosslinking agent (such as two
Methacrylic acid glycol ester, tripropylene glycol diacrylate, 1.9- nonanediol diacrylates etc.), ternary crosslinking agent (such as
Ethoxylated glycerol triacrylate, pentaerythritol triacrylate etc.) and polynary crosslinking agent (such as ethoxylated pentaerythritol four
Acrylate, tetramethoxy methane tetraacrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexaacrylate etc.)
Deng；
Polyfunctional group curing agent containing N, S element includes mainly N '-methylene diacrylamines, triallyl isocyanuric acid
Ester and ethoxylation cyamelide triacrylate etc.；
Polyamine mainly including diamines hexahydrotoluene, isophorone diamine, diaminocyclohexane etc. and is based on above-mentioned fat
The addition product and condensation product and their mixture of ring polyamine.
Most preferably select the polyfunctional group curing agent containing unsaturated bond.
Each curing agent be directed to corresponding matrix resin, cooperation with realize only need electron beam irradiation can be realized it is low
Temperature, high speed curable.
Wherein, plasticizer includes mainly one kind or several in aliphatic ester, phosphate, phosphite ester, polyester, epoxy-ester etc.
The combination of kind, main function are to increase adhesive to substrate and by the adhesiveness of composite material so that plybonding effect is more preferable.
Wherein, filler mainly includes the combination of one or both of machine filler and inorganic filler, and main function is
Defoaming and levelability, wearability and the ultraviolet-resistent property etc. for improving adhesive.
Wherein, in composition further include functional additive, the functional additive includes age resister, uvioresistant
The combination of one or more of agent, coupling agent etc..Wherein, the major function of age resister and anti ultraviolet agent is to improve adhesive
Weatherability；Coupling agent, it is therefore preferable to which silane coupling agent or titanate coupling agent, main purpose are to improve adhesive and glued
Boundary layer between object surface, to obtain good bonding effect.
The preparation method of above-mentioned electronic beam curing adhesive, including step：
1) by main body reactive resin, polyfunctional group curing agent and active solvent be added blender in, temperature adjustment to 20-100 DEG C,
Preferably temperature adjustment keeps constant temperature, is stirred 20-50 minutes to 30 DEG C；
2) plasticizer and filler are added into the mixture obtained in 1), temperature adjustment keeps constant temperature, stirring mixed to 20-100 DEG C
It closes 20-50 minutes；
Functional additive is added in the mixture obtained again into step 2), temperature adjustment keeps constant temperature, stir to 20-100 DEG C
Mix mixing 20-50 minutes.
Wherein, functional additive also can simultaneously add in step 2) with plasticizer and filler, mainly according to functionality
The effect of additive and Chemical Physics performance determine., integration easily updated for already present production line.It is excellent in above-mentioned steps
Selection of land temperature adjustment is stirred 30 minutes to 50 DEG C.
The painting method of above-mentioned electronic beam curing adhesive and the electronic beam curing adhesive using above method manufacture,
Including step：
A) adherend surface is handled；
B) each constituent of adhesive is uniformly mixed by preset ratio, stands 40-80 minutes.
C) adhesive after standing is coated in adherend surface, and adhesive is exposed under sufficient electron beam irradiation
Carry out solidification and it is compound.
Wherein, the surface treatment of the substrate (base material) applied in painting method step a) is plasma surface treatment etc.,
To increase the affinity of adhesive and substrate (base material).
Solidification temperature is 20-100 DEG C in painting method step c), and preferably solidification temperature is 30 DEG C；Hardening time is 15-
30h, preferably hardening time are 20h.
It saves space (than the space that traditional heat cure saves 90%), be widely used, can be used for decorating, silicone stripping applies
Layer and adhesive for solvent-free use；Cured film is uniform；It is easy to operate, convenient for starting and stopping.
Preferably specific implementation mode is as follows：
Embodiment 1：
This adhesive is prepared (mass percentage) by following component proportion：
By adherend surface (such as：PET it) being handled, organic siliconresin adhesive is uniformly mixed according to said ratio,
After premixing one hour, gluing is carried out, cures followed by EB, finally carries out compound.
Embodiment effect：30 DEG C of solidification temperature, VOC emission 15%, hardening time 20h, low temperature resistant -150 DEG C, high temperature resistant
200 DEG C, tensile strength 25Mpa.
Embodiment 2：
This adhesive is prepared (mass percentage) by following component proportion：
This adhesive implementation is the same as embodiment 1.
Embodiment effect：25 DEG C of solidification temperature, VOC emission 20%, hardening time for 24 hours, low temperature resistant -155 DEG C, high temperature resistant
220 DEG C, tensile strength 30Mpa.
Embodiment 3：
This adhesive is prepared (mass percentage) by following component proportion：
This adhesive implementation is the same as embodiment 1.
Embodiment effect：30 DEG C of solidification temperature, VOC emission 13%, hardening time 20h, low temperature resistant -135 DEG C, high temperature resistant
180 DEG C, bond shearing force 40Mpa.
Embodiment 4：
This adhesive is prepared (mass percentage) by following component proportion：
This adhesive implementation is the same as embodiment 1.
Embodiment effect：20 DEG C of solidification temperature, VOC emission 15%, hardening time 18h, low temperature resistant -135 DEG C, high temperature resistant
180 DEG C, bond shearing force 30Mpa.
Embodiment 5：
This adhesive is prepared (mass percentage) by following component proportion：
This adhesive implementation is the same as embodiment 1.
Embodiment effect：80 DEG C of solidification temperature, VOC emission 20%, hardening time 21h, low temperature resistant -125 DEG C, high temperature resistant
145 DEG C, bond shearing force 38Mpa.
Embodiment 6：
This adhesive is prepared (mass percentage) by following component proportion：
This adhesive implementation is the same as embodiment 1.
Embodiment effect：25 DEG C of solidification temperature, VOC emission 10%, hardening time 15h, low temperature resistant -155 DEG C, high temperature resistant
195 DEG C, bond shearing force 38Mpa.
Embodiment 7：
This adhesive is prepared (mass percentage) by following component proportion：
This adhesive implementation is the same as embodiment 1.
Embodiment effect：35 DEG C of solidification temperature, VOC emission 13%, hardening time 5h, low temperature resistant -175 DEG C, high temperature resistant
155 DEG C, bond shearing force 33Mpa.
Embodiment 8：
This adhesive is prepared (mass percentage) by following component proportion：
This adhesive implementation is the same as embodiment 1.
Embodiment effect：35 DEG C of solidification temperature, VOC emission 15%, hardening time 13h, low temperature resistant -155 DEG C, high temperature resistant
195 DEG C, bond shearing force 39Mpa.
Embodiment 9：
This adhesive is prepared (mass percentage) by following component proportion：
This adhesive implementation is the same as embodiment 1.
Embodiment effect：20 DEG C of solidification temperature, VOC emission 10%, hardening time 12h, low temperature resistant -155 DEG C, high temperature resistant
205 DEG C, bond shearing force 40Mpa.
Embodiment 10：
This adhesive is prepared (mass percentage) by following component proportion：
This adhesive implementation is the same as embodiment 1.
Embodiment effect：20 DEG C of solidification temperature, VOC emission 13%, hardening time 12h, low temperature resistant -155 DEG C, high temperature resistant
205 DEG C, bond shearing force 40Mpa.
Embodiment 11：
This adhesive is prepared (mass percentage) by following component proportion：
This adhesive implementation is the same as embodiment 1.
Embodiment effect：20 DEG C of solidification temperature, VOC emission 10%, hardening time 12h, low temperature resistant -155 DEG C, high temperature resistant
215 DEG C, bond shearing force 48Mpa.
Embodiment 12
This adhesive is prepared (mass percentage) by following component proportion：
Monomer, curing agent and active solvent are stirred 30 minutes at 50 DEG C first, plasticizer, filler and work(is then added
Energy property additive continues stirring and obtains adhesive in 30 minutes at the same temperature.Adhesive is coated on the bottom after surface treated
Object, later with EB solidification and it is compound.
Embodiment 13
Matrix resin, cross-linking monomer and active solvent are stirred 30 minutes at 50 DEG C first, plasticizer is then added, fills out
Material and functional additive continue stirring and obtain adhesive in 30 minutes at the same temperature.Adhesive is coated on surface treated
Substrate afterwards, later with EB solidification and it is compound.
Embodiment 14
Matrix resin, cross-linking monomer and active solvent are stirred 30 minutes at 50 DEG C first, plasticizer is then added, fills out
Material and functional additive continue stirring and obtain adhesive in 30 minutes at the same temperature.Adhesive is coated on surface treated
Substrate afterwards, later with EB solidification and it is compound.
Embodiment 15
Embodiment 16
Embodiment 17
Embodiment 18
This adhesive manufactures and the method for coating is, first by main body reactive resin, cross-linking monomer and active solvent at 50 DEG C
It is stirred 30 minutes, plasticizer, filler and functional additive is then added, continue stirring at the same temperature and obtain for 30 minutes
To adhesive.Adhesive be coated on surface treated after substrate, later with EB solidification and it is compound.
Embodiment described above, only one kind of the present invention more preferably specific implementation mode, those skilled in the art
The usual variations and alternatives that member carries out within the scope of technical solution of the present invention should be all included within the scope of the present invention.
Claims (10)
1. a kind of electronic beam curing adhesive, including main body reactive resin, polyfunctional group curing agent, plasticizer, filler and activity
Solvent, the electronic beam curing adhesive are subjected to electron beam irradiation generation polymerization and are changed into solid with crosslinking.
2. a kind of electronic beam curing adhesive according to claim 1, which is characterized in that the electronic beam curing adhesive
The mass percentage of each constituent be：
3. a kind of electronic beam curing adhesive according to claim 1, which is characterized in that the active solvent includes can quilt
Electron beam causes the unsaturated monomer of polymerization.
4. a kind of electronic beam curing adhesive according to claim 1, which is characterized in that the filler is barium sulfate and stone
Black alkene.
5. a kind of electronic beam curing adhesive according to claim 1, which is characterized in that the main body reactive resin includes
The combination of one or more of organic siliconresin, acrylic resin, polyester resin and polyether resin；Oxygen modified organic silicone resin
Or acryl-modified silicone resin resin；
The active end group of the acrylic resin, polyester resin and polyether resin is undersaturated vinyl, undersaturated allyl
Base or epoxy group.
6. a kind of electronic beam curing adhesive according to claim 1, which is characterized in that further include functional additive,
The functional additive includes the combination of one or more of age resister, anti ultraviolet agent, coupling agent.
7. a kind of electronic beam curing adhesive according to claim 6, which is characterized in that the electronic beam curing adhesive
Each constituent and mass percentage be：
Main body reactive resin is monomethyl polyethylene glycol acrylate ester, percentage composition 25-55wt%；
Polyfunctional group curing agent is polyethyleneglycol diacrylate, percentage composition 10-40wt%；
Active solvent is Isooctyl acrylate monomer, percentage composition 5-10wt%；
Plasticizer is trioctyl phosphate, percentage composition 1-5wt%；
Filler is barium sulfate and graphene, percentage composition 0.3-1wt%；
Functional additive is age resister, anti ultraviolet agent and coupling agent, percentage composition 0.1-0.5wt%.
8. the preparation method of the electronic beam curing adhesive described in a kind of any one of above-mentioned 1-7, which is characterized in that including step
Suddenly：
1) main body reactive resin, polyfunctional group curing agent and active solvent are added in blender, temperature adjustment is kept to 20-100 DEG C
Constant temperature is stirred 20-50 minutes；
2) plasticizer and filler are added into the mixture obtained in 1), temperature adjustment keeps constant temperature, be stirred to 20-100 DEG C
20-50 minutes.
9. preparation method according to claim 8, which is characterized in that function is added into the mixture obtained in step 2)
Property additive, temperature adjustment to 20-100 DEG C, keep constant temperature, be stirred 20-50 minutes.
10. the painting method of the electronic beam curing adhesive described in a kind of any one of above-mentioned 1-7, which is characterized in that including
Step：
A) adherend surface is handled；
B) each constituent of adhesive is uniformly mixed by preset ratio, stands 40-80 minutes；
C) adhesive after standing is coated in adherend surface, and adhesive is exposed under sufficient electron beam irradiation and is carried out
Cure and compound.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810472170.8A CN108611039A (en) | 2018-05-17 | 2018-05-17 | A kind of electronic beam curing adhesive and preparation method thereof and painting method |
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| CN201810472170.8A CN108611039A (en) | 2018-05-17 | 2018-05-17 | A kind of electronic beam curing adhesive and preparation method thereof and painting method |
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| CN108611039A true CN108611039A (en) | 2018-10-02 |
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| CN201810472170.8A Pending CN108611039A (en) | 2018-05-17 | 2018-05-17 | A kind of electronic beam curing adhesive and preparation method thereof and painting method |
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Cited By (7)
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| CN110396373A (en) * | 2019-07-31 | 2019-11-01 | 中广核达胜加速器技术有限公司 | One kind is based on cured bond plies of EB and preparation method thereof |
| CN110452625A (en) * | 2019-09-24 | 2019-11-15 | 苏州世华新材料科技股份有限公司 | Pressure-sensitive adhesive product and preparation method thereof |
| WO2020107506A1 (en) * | 2018-11-30 | 2020-06-04 | 中广核达胜加速器技术有限公司 | Eb curing-specific packaging adhesive, preparation method, and method for packaging film capacitor |
| WO2022062311A1 (en) * | 2020-09-25 | 2022-03-31 | 中广核达胜加速器技术有限公司 | Adhesive, preparation method therefor, and method for curing flame retardant fiberglass tape |
| CN114752307A (en) * | 2021-05-17 | 2022-07-15 | 亮线(上海)新材料科技有限公司 | Electron beam curing type acrylate adhesive and application thereof |
| CN114763456A (en) * | 2021-05-17 | 2022-07-19 | 亮线(上海)新材料科技有限公司 | Electron beam curing type hot-melt pressure-sensitive adhesive and application thereof |
| CN115447213A (en) * | 2022-09-20 | 2022-12-09 | 广东达益新材料有限公司 | Layered decorative sheet cured by electron beam and method for preparing the same |
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| CN102898878A (en) * | 2012-10-23 | 2013-01-30 | 上海乘鹰新材料有限公司 | Low-cost high-adhesive-force electron beam radiation curing paint and preparation method thereof |
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| WO2020107506A1 (en) * | 2018-11-30 | 2020-06-04 | 中广核达胜加速器技术有限公司 | Eb curing-specific packaging adhesive, preparation method, and method for packaging film capacitor |
| CN110396373A (en) * | 2019-07-31 | 2019-11-01 | 中广核达胜加速器技术有限公司 | One kind is based on cured bond plies of EB and preparation method thereof |
| CN110452625A (en) * | 2019-09-24 | 2019-11-15 | 苏州世华新材料科技股份有限公司 | Pressure-sensitive adhesive product and preparation method thereof |
| CN110452625B (en) * | 2019-09-24 | 2021-07-23 | 苏州世华新材料科技股份有限公司 | Pressure-sensitive adhesive articles and methods of making the same |
| WO2022062311A1 (en) * | 2020-09-25 | 2022-03-31 | 中广核达胜加速器技术有限公司 | Adhesive, preparation method therefor, and method for curing flame retardant fiberglass tape |
| CN114752307A (en) * | 2021-05-17 | 2022-07-15 | 亮线(上海)新材料科技有限公司 | Electron beam curing type acrylate adhesive and application thereof |
| CN114763456A (en) * | 2021-05-17 | 2022-07-19 | 亮线(上海)新材料科技有限公司 | Electron beam curing type hot-melt pressure-sensitive adhesive and application thereof |
| CN115447213A (en) * | 2022-09-20 | 2022-12-09 | 广东达益新材料有限公司 | Layered decorative sheet cured by electron beam and method for preparing the same |
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Application publication date: 20181002 |