WO2020107506A1 - Eb curing-specific packaging adhesive, preparation method, and method for packaging film capacitor - Google Patents

Eb curing-specific packaging adhesive, preparation method, and method for packaging film capacitor Download PDF

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WO2020107506A1
WO2020107506A1 PCT/CN2018/119297 CN2018119297W WO2020107506A1 WO 2020107506 A1 WO2020107506 A1 WO 2020107506A1 CN 2018119297 W CN2018119297 W CN 2018119297W WO 2020107506 A1 WO2020107506 A1 WO 2020107506A1
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Prior art keywords
curing
encapsulant
film capacitor
special
packaging
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PCT/CN2018/119297
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French (fr)
Chinese (zh)
Inventor
陈川红
罗洪文
江华
潘启志
朱焕铮
季左
封玉龙
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中广核达胜加速器技术有限公司
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Publication of WO2020107506A1 publication Critical patent/WO2020107506A1/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors 
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Definitions

  • the invention relates to the field of capacitor packaging, in particular to an EB curing special packaging glue, a preparation method and a method for packaging a film capacitor.
  • Film capacitors have unique advantages in new energy vehicles, wind power generation, smart products and other industries because of their energy-saving, environmental protection, renewable, high efficiency and other characteristics. After more than 20 years of development, the United States, Germany, Japan and other countries have attached great importance to the development of the industry in terms of film capacitors, from the government to the enterprises, and have invested a lot of manpower, material and financial resources as new energy technologies. In many industries, film capacitors are gradually replacing traditional capacitors, and the advantages of the film capacitor industry have been fully demonstrated.
  • the packaging of the film capacitor industry uses epoxy resin and its modified products, which are self-drying or heat-drying materials. Therefore, the curing of the existing film capacitor encapsulating adhesives mainly uses hot-press drying, using long-distance or long-term heat drying. Dry, to achieve the curing of the encapsulant, the process is simple, but there are disadvantages such as high energy consumption, long processing time, large solvent volatilization, and low-end product performance. Therefore, the curing technology of the thin film capacitor encapsulant needs to be further improved and optimized. At the same time improve the efficiency of the product.
  • the technical problem to be solved by the present invention is to provide an EB curing special encapsulant, a preparation method, and a method of encapsulating a thin film capacitor.
  • EB curing special encapsulant By using EB curing special encapsulant, the effect of encapsulating film capacitors can be improved, and EB curing can effectively improve The degree of correlation between the components in the encapsulant, and reduce the harm of volatile solvents to the environment and human body.
  • an EB curing special encapsulant and the composition of the encapsulant by weight includes,
  • composition of the encapsulant by weight includes,
  • composition of the encapsulant by weight includes,
  • a method for preparing the above EB curing special encapsulant, the steps of the preparation method are:
  • step S2 Add high-grade urethane acrylate and aliphatic polyester material to the materials mixed in step S1, and mix for 5-20 minutes;
  • step S3 Add silsesquioxane to the material obtained in step S2, and continue to mix and stir for 5-20 minutes;
  • the ambient temperature is guaranteed to be between 20-50°C.
  • the pH value of the finished encapsulant is controlled at 6 ⁇ 1
  • the viscosity is controlled in the range of 1700-2400Mpas
  • the solid content is controlled at more than 99%.
  • a method for encapsulating a film capacitor using the above encapsulant the steps of the method are:
  • the pre-cured film capacitor is deeply cured by EB to obtain a finished film capacitor, so that the interior of the encapsulant is cured and the cross-linking degree of the encapsulant is effectively improved.
  • the film capacitors are vertically arranged, and the UV curing energy is controlled at 200-1000 mJ/cm 2 .
  • the film capacitors are arranged horizontally, the energy of the electron accelerator for EB curing is selected to be 3.0 MeV-10.0 MeV, and the curing absorption dose is controlled at 20-80 kGy.
  • the packaging glue is oscillated and compacted during the transmission process to drive the remaining air bubbles in the packaging glue.
  • the beneficial effects of the present invention are: the use of special encapsulant has a solid content rate of more than 99%, and does not require the use of solvents, which can effectively reduce the emissions of VOCs in the production workshop, optimize the production workshop environment, and benefit the health and safety of employees. It is conducive to environmental optimization; the combination of UV pre-curing and EB deep curing can improve the cross-linking degree of the encapsulant, thereby increasing the storage capacity of the capacitor and prolonging the service life.
  • the EB curing technology is a room temperature curing technology that does not require additional heating. Reduce energy consumption; at the same time, compared with the existing technology, UV pre-curing and EB deep curing, the curing speed is increased, the production efficiency is improved, and the floor space can be reduced at the same time.
  • An EB curing special encapsulant the composition of the encapsulant by weight includes,
  • the pH value of the finished encapsulant is controlled at 6 ⁇ 1, the viscosity is controlled in the range of 1700-2400Mpas, and the solid content is controlled at more than 99%.
  • the proportion of each component is selected according to the weight part to make.
  • the preparation process is as follows. During the preparation process, ensure that the ambient temperature is between 20-50 °C to ensure the quality of the product And production efficiency.
  • S1 choose 6 parts of diol dipropionate, 6 parts of tripropylene glycol dipropionate, 7 parts of trimethylolpropane tripropionate, and 2 parts of trimethylbenzoyl diphenyl Phosphine oxide and mix these four together, stirring, time control within 1-10 minutes, this time select 5 minutes, so that the components are mixed evenly.
  • step S2 Add 6 parts of high-grade urethane acrylate and 8 parts of aliphatic polyester material to the material mixed in step S1, continue to mix and stir, the time can be controlled within 5-20 minutes, this time choose For 10 minutes, make the components mix evenly.
  • step S3 Add 55 parts of silsesquioxane to the material obtained in step S2, continue to mix and stir for 5-20 minutes, this time select 15 minutes, so that the components are mixed evenly.
  • step S2 In the material mixed in step S1, add 6 parts of high-grade urethane acrylate and 6 parts of aliphatic polyester type material, and continue to mix and stir for 15 minutes, so that the components are mixed evenly.
  • step S3 Add 60 parts of silsesquioxane to the material obtained in step S2, continue mixing for 8 minutes, so that the components are mixed evenly.
  • the EB curing special encapsulant obtained in the above Examples 1 and 2 is used to encapsulate the thin film capacitor.
  • the steps are as follows:
  • the filled film capacitors are arranged vertically in the transmission tray in order, and the layout is done according to the size of the film capacitors in the transmission tray, and the film capacitors are fixed by the corresponding structural design to avoid the film capacitors during the transmission process.
  • the tilting or knocking caused by the vibration, the film capacitor through the movement of the transmission plate is sequentially pre-cured by the surface of the UV lamp, and the film capacitor is oscillated during the transmission process and the encapsulant is compacted, in this way to drive the residual residue Bubbles to improve the packaging effect during the packaging process, because the surface is cured so that the liquid inside the packaging glue will not leak or move; the energy of curing with UV lamps is controlled at 200-1000mJ/cm 2 .
  • the encapsulant of Example 1 and Example 2 was selected and the film capacitor was prepared by the above method.
  • the encapsulant with higher solid content was used to replace the volatile solvent in the production process, thereby effectively reducing the VOCs in the production workshop Emissions, optimizing the production workshop environment, is conducive to the health and safety of employees, and is conducive to environmental optimization;
  • the process of film capacitor production is improved, ensuring that the packaging adhesive It will leak to the outside of the film capacitor, improve the degree of cross-linking of the encapsulant, thereby enhancing the storage capacity of the capacitor;
  • the combination of UV surface pre-curing and EB internal deep curing replaces the traditional process, thereby reducing energy consumption and occupying space The area reduces the time required for production and improves production efficiency.
  • the storage capacity has been improved; the capacity of the film capacitors made by the original process is mainly concentrated between 470 and 480nF, while the capacity of the film capacitors made by the EB curing process is mainly concentrated Between 480 and 485nF, and the current capacitor capacity>470nF is a good product, which shows that the probability of defective products using the EB curing process is much lower than the original traditional process, so the film capacitor produced by this technology greatly improves the good product Rate, effectively reduce the production costs of enterprises and improve the economic benefits of enterprises.

Abstract

The present invention relates to an EB curing-specific packaging adhesive, a preparation method, and a method for packaging a film capacitor. S1, hexanediol diacrylate, tripropylene glycol diacrylate, trimethylolpropane triacrylate, and diphenyl trimethylbenzoyl phosphine oxide are mixed; S2, high-functionality polyurethane acrylate and an aliphatic polyester material are added for mixing; S3, silsesquioxane is added for mixing; S4, a photoinitiator, hydroxycyclohexyl ketone, a modified dilute acid ester polymer defoamer, and a fluorine modified polysiloxane polymer are added for mixing to obtain an EB curing-specific packaging adhesive. The specific packaging adhesive is used for manufacturing a film capacitor. The specific packaging adhesive used has a solid content of 99% or more, and can reduce the VOCs emissions in a production workshop; UV pre-curing and EB deep curing are used in combination to improve the degree of cross-linking, thereby increasing the electricity storage capacity; no additional heating is needed, thereby reducing energy consumption; the curing speed is increased, the production efficiency is improved, and the occupied area is reduced.

Description

EB固化专用封装胶、制备方法及封装薄膜电容器的方法EB curing special packaging glue, preparation method and method for packaging film capacitor
本申请要求了申请日为2018年11月30日，申请号为201811455545.6，发明名称为“EB固化专用封装胶、制备方法及封装薄膜电容器的方法”的发明专利申请的优先权，其全部内容通过引用结合在本申请中。This application requires the priority of the invention patent application with the application date of November 30, 2018, the application number is 201811455545.6, and the name of the invention is "EB curing special encapsulant, preparation method and method of encapsulating thin film capacitors". The reference is incorporated in this application.
技术领域Technical field
本发明涉及电容器封装领域，尤其是涉及一种EB固化专用封装胶、制备方法及封装薄膜电容器的方法。The invention relates to the field of capacitor packaging, in particular to an EB curing special packaging glue, a preparation method and a method for packaging a film capacitor.
背景技术Background technique
薄膜电容因其具有节能、环保、可再生、效益高等特点，在新能源汽车、风力发电、智能产品等行业具有得天独厚的优势。经过二十多年的发展，美国、德国、日本等国家在薄膜电容方面，上至政府下至企业都极其重视该行业的发展，并作为新能源技术投入了大量的人力、物力和财力，在众多行业中，薄膜电容正逐步取代传统电容，薄膜电容产业优势得到了充分展示。Film capacitors have unique advantages in new energy vehicles, wind power generation, smart products and other industries because of their energy-saving, environmental protection, renewable, high efficiency and other characteristics. After more than 20 years of development, the United States, Germany, Japan and other countries have attached great importance to the development of the industry in terms of film capacitors, from the government to the enterprises, and have invested a lot of manpower, material and financial resources as new energy technologies. In many industries, film capacitors are gradually replacing traditional capacitors, and the advantages of the film capacitor industry have been fully demonstrated.
对薄膜电容器来说，它的耐压耐冲击能力就是它在电容器中的最大武器。它由聚丙烯制备而成，自愈性能比一般电容器要强，抗浪涌电压能力达到了普通电容器难以企及的额定电压1.5倍还多。同时，薄膜电容的温度特性好，电容抵抗恶劣环境的能力强，使用寿命长。现在市场需要高频、大容量、大电流、低阻抗、高电压的薄膜电容，在现有的技术条件下如何提高薄膜电容的性能，提高效率，降低综合成本是众多企业在寻找的一个重要方向。For film capacitors, its withstand voltage and impact resistance is its biggest weapon in the capacitor. It is made of polypropylene, its self-healing performance is stronger than that of ordinary capacitors, and its ability to resist surge voltage has reached more than 1.5 times the rated voltage that ordinary capacitors can't reach. At the same time, the temperature characteristics of thin film capacitors are good, the ability of the capacitors to withstand harsh environments is strong, and the service life is long. Now the market needs thin film capacitors with high frequency, large capacity, large current, low impedance, and high voltage. Under the existing technical conditions, how to improve the performance of thin film capacitors, improve efficiency, and reduce the overall cost is an important direction that many companies are looking for. .
现在薄膜电容行业封装均采用环氧树脂和其改性产品，属自干或热干型材料，因此现有的薄膜电容封装胶固化主要采用热压烘干，利用长距离或长时间的热烘干，实现封装胶的固化，工艺简单，但存在能耗高、加工时间长、溶剂挥发大和产品性能低端等弊端，因此薄膜电容封装胶的固化技术需要进一步改进和优化，在增强产品性能的同时提高产品的效率。At present, the packaging of the film capacitor industry uses epoxy resin and its modified products, which are self-drying or heat-drying materials. Therefore, the curing of the existing film capacitor encapsulating adhesives mainly uses hot-press drying, using long-distance or long-term heat drying. Dry, to achieve the curing of the encapsulant, the process is simple, but there are disadvantages such as high energy consumption, long processing time, large solvent volatilization, and low-end product performance. Therefore, the curing technology of the thin film capacitor encapsulant needs to be further improved and optimized. At the same time improve the efficiency of the product.
发明内容Summary of the invention
本发明所要解决的技术问题是提供一种EB固化专用封装胶、制备方法及封装薄 膜电容器的方法，通过采用EB固化专用的封装胶，能够提高在对薄膜电容封装的效果，采用EB固化有效提高封装胶内各组分中间的关联程度，而且减轻挥发性溶剂对环境及人体的危害。The technical problem to be solved by the present invention is to provide an EB curing special encapsulant, a preparation method, and a method of encapsulating a thin film capacitor. By using EB curing special encapsulant, the effect of encapsulating film capacitors can be improved, and EB curing can effectively improve The degree of correlation between the components in the encapsulant, and reduce the harm of volatile solvents to the environment and human body.
本发明解决其技术问题所采取的技术方案是：一种EB固化专用封装胶，所述的封装胶的按重量份组成包括，The technical solution adopted by the present invention to solve its technical problems is: an EB curing special encapsulant, and the composition of the encapsulant by weight includes,
Figure PCTCN2018119297-appb-000001
Figure PCTCN2018119297-appb-000001
进一步具体的，所述的封装胶按重量份组成包括，More specifically, the composition of the encapsulant by weight includes,
Figure PCTCN2018119297-appb-000002
Figure PCTCN2018119297-appb-000002
Figure PCTCN2018119297-appb-000003
Figure PCTCN2018119297-appb-000003
进一步具体的，所述的封装胶按重量份组成包括，More specifically, the composition of the encapsulant by weight includes,
Figure PCTCN2018119297-appb-000004
Figure PCTCN2018119297-appb-000004
一种上述EB固化专用封装胶的制备方法，所述的制备方法的步骤为，A method for preparing the above EB curing special encapsulant, the steps of the preparation method are:
S1、将已二醇二丙稀酸酯、二缩三丙二醇二丙稀酸酯、三羟甲基丙烷三丙稀酸酯以及三甲基苯甲酰基二苯基氧化膦混合在一起，进行搅拌1-10分钟，使得各组分混合均匀；S1. Mix hexanediol dipropylate, tripropylene glycol dipropionate, trimethylolpropane tripropionate, and trimethylbenzoyl diphenylphosphine oxide, and stir 1-10 minutes to make the components mix evenly;
S2、在步骤S1中混合好的材料中加入高官聚氨酯丙稀酸酯以及脂肪族聚酯型材料，混合搅拌5-20分钟；S2. Add high-grade urethane acrylate and aliphatic polyester material to the materials mixed in step S1, and mix for 5-20 minutes;
S3、在步骤S2得到的材料中加入倍半硅氧烷，继续混合搅拌5-20分钟；S3. Add silsesquioxane to the material obtained in step S2, and continue to mix and stir for 5-20 minutes;
S4、最后加入光引发剂、羟基环已基甲酮、改性稀酸酯类聚合物消泡剂、氟改性聚硅氧烷聚合物混合在一起搅拌2-10分钟，得到EB固化专用封装胶。S4. Finally, add photoinitiator, hydroxycyclohexyl ketone, modified dilute ester polymer defoamer, and fluorine-modified polysiloxane polymer and mix together for 2-10 minutes to obtain a special package for EB curing gum.
进一步具体的，所述的封装胶制备过程中保证环境温度处于20-50℃之间。More specifically, during the preparation of the encapsulant, the ambient temperature is guaranteed to be between 20-50°C.
进一步具体的，所述的封装胶成品的pH值控制在6±1，粘度控制在1700-2400Mpas范围内，含固率控制在99％以上。More specifically, the pH value of the finished encapsulant is controlled at 6±1, the viscosity is controlled in the range of 1700-2400Mpas, and the solid content is controlled at more than 99%.
一种采用上述封装胶封装薄膜电容器的方法，该方法的步骤为，A method for encapsulating a film capacitor using the above encapsulant, the steps of the method are:
D1、将薄膜电容原材料通过绕卷、热压、喷金以及焊线后得到半成品薄膜电容 器；D1. After the raw materials of the film capacitor are wound, hot pressed, gold sprayed and welded, a semi-finished film capacitor is obtained;
D2、在半成品的薄膜电容器内通过灌装的方式加入上述EB固化专用封装胶，同时加入电容器芯子；D2. Add the above EB curing special encapsulant to the semi-finished film capacitor by filling, and add the capacitor core at the same time;
D3、对灌装好的薄膜电容器先通过UV进行表面预固化，使得封装胶不会泄露或者移动；D3. Pre-curing the surface of the filled film capacitor through UV, so that the encapsulant will not leak or move;
D4、最后将预固化后的薄膜电容器通过EB进行深度固化，得到成品薄膜电容器，使得封装胶的内部固化且有效提高封装胶的交联度。D4. Finally, the pre-cured film capacitor is deeply cured by EB to obtain a finished film capacitor, so that the interior of the encapsulant is cured and the cross-linking degree of the encapsulant is effectively improved.
进一步具体的，在所述的步骤D3中采用UV进行表面预固化时，薄膜电容器竖直排列，UV固化能量控制在200-1000mJ/cm 2。 More specifically, in the step D3, when UV is used for surface pre-curing, the film capacitors are vertically arranged, and the UV curing energy is controlled at 200-1000 mJ/cm 2 .
进一步具体的，在所述的步骤D4中采用EB进行深度固化时，薄膜电容器卧式排列，EB固化的电子加速器的能量选择为3.0MeV-10.0MeV，固化吸收剂量控制在20-80kGy。More specifically, when the EB is used for deep curing in the step D4, the film capacitors are arranged horizontally, the energy of the electron accelerator for EB curing is selected to be 3.0 MeV-10.0 MeV, and the curing absorption dose is controlled at 20-80 kGy.
进一步具体的，在所述的步骤D3进行UV预固化时采用在传输的过程中振荡并压实封装胶，驱赶封装胶中残存的气泡。More specifically, when the UV pre-curing is performed in the step D3, the packaging glue is oscillated and compacted during the transmission process to drive the remaining air bubbles in the packaging glue.
本发明的有益效果是：采用的专用封装胶其含固率可达99％以上，并且无需采用溶剂，可以有效减少生产车间VOCs的排放，优化生产车间环境，有利于员工的健康与安全，有利于环境优化；采用UV预固化与EB深度固化相结合，能够提高封装胶的交联度，从而增加电容的储电量，延长使用周期；其中，EB固化技术属于常温固化技术，无需额外加热，从而降低能耗；同时，UV预固化与EB深度固化较现有工艺，其固化速度增加，提高生产效率，同时能够减少占地面积。The beneficial effects of the present invention are: the use of special encapsulant has a solid content rate of more than 99%, and does not require the use of solvents, which can effectively reduce the emissions of VOCs in the production workshop, optimize the production workshop environment, and benefit the health and safety of employees. It is conducive to environmental optimization; the combination of UV pre-curing and EB deep curing can improve the cross-linking degree of the encapsulant, thereby increasing the storage capacity of the capacitor and prolonging the service life. Among them, the EB curing technology is a room temperature curing technology that does not require additional heating. Reduce energy consumption; at the same time, compared with the existing technology, UV pre-curing and EB deep curing, the curing speed is increased, the production efficiency is improved, and the floor space can be reduced at the same time.
具体实施方式detailed description
下面结合实施例对本发明作详细的描述。The present invention will be described in detail below with reference to examples.
一种EB固化专用封装胶，所述的封装胶的按重量份组成包括，An EB curing special encapsulant, the composition of the encapsulant by weight includes,
Figure PCTCN2018119297-appb-000005
Figure PCTCN2018119297-appb-000005
Figure PCTCN2018119297-appb-000006
Figure PCTCN2018119297-appb-000006
封装胶成品的pH值控制在6±1，粘度控制在1700-2400Mpas范围内，含固率控制在99％以上。The pH value of the finished encapsulant is controlled at 6±1, the viscosity is controlled in the range of 1700-2400Mpas, and the solid content is controlled at more than 99%.
根据上述EB固化专用封装胶的组分范围，按重量份选择各个组分的配比进行制作，制备的过程如下，在制备过程中保证环境温度处于20-50℃之间，以确保产品的质量以及生产效率。According to the component range of the above EB curing special encapsulant, the proportion of each component is selected according to the weight part to make. The preparation process is as follows. During the preparation process, ensure that the ambient temperature is between 20-50 ℃ to ensure the quality of the product And production efficiency.
实施例1：(环境温度为40℃)Example 1: (Ambient temperature is 40℃)
S1、选取6份已二醇二丙稀酸酯、6份二缩三丙二醇二丙稀酸酯、7份三羟甲基丙烷三丙稀酸酯以及2份三甲基苯甲酰基二苯基氧化膦并将这四种混合在一起，进行搅拌，时间控制1-10分钟之内，本次选择5分钟，使得各组分混合均匀。S1, choose 6 parts of diol dipropionate, 6 parts of tripropylene glycol dipropionate, 7 parts of trimethylolpropane tripropionate, and 2 parts of trimethylbenzoyl diphenyl Phosphine oxide and mix these four together, stirring, time control within 1-10 minutes, this time select 5 minutes, so that the components are mixed evenly.
S2、在步骤S1中混合好的材料中加入6份高官聚氨酯丙稀酸酯以及8份脂肪族聚酯型材料，继续进行混合搅拌，时间控制在5-20分钟之内即可，本次选择为10分钟，使得各组分混合均匀。S2. Add 6 parts of high-grade urethane acrylate and 8 parts of aliphatic polyester material to the material mixed in step S1, continue to mix and stir, the time can be controlled within 5-20 minutes, this time choose For 10 minutes, make the components mix evenly.
S3、在步骤S2得到的材料中加入55份倍半硅氧烷，继续混合搅拌5-20分钟，本次选择为15分钟，使得各组分混合均匀。S3. Add 55 parts of silsesquioxane to the material obtained in step S2, continue to mix and stir for 5-20 minutes, this time select 15 minutes, so that the components are mixed evenly.
S4、最后加入5份光引发剂、8份羟基环已基甲酮、7份改性稀酸酯类聚合物消泡剂、6份氟改性聚硅氧烷聚合物进行混合搅拌，时间控制在2-10分钟，本次选择8分钟，即得到EB固化专用封装胶。S4. Finally, add 5 parts of photoinitiator, 8 parts of hydroxycyclohexyl ketone, 7 parts of modified dilute ester polymer defoamer, and 6 parts of fluorine-modified polysiloxane polymer for mixing and stirring, time control In 2-10 minutes, choose 8 minutes this time to get EB curing special encapsulant.
实施例2：(环境温度为30℃)Example 2: (Ambient temperature is 30℃)
S1、选取5份已二醇二丙稀酸酯、5份二缩三丙二醇二丙稀酸酯、5份三羟甲基丙烷三丙稀酸酯以及2份三甲基苯甲酰基二苯基氧化膦并将这四种混合在一起，进 行搅拌，时间控制6分钟，使得各组分混合均匀。S1, select 5 parts of hexanediol dipropionate, 5 parts of tripropylene glycol dipropionate, 5 parts of trimethylolpropane tripropionate, and 2 parts of trimethylbenzoyl diphenyl Phosphine oxide and mix these four together, stirring for 6 minutes, so that the components are mixed evenly.
S2、在步骤S1中混合好的材料中加入6份高官聚氨酯丙稀酸酯以及6份脂肪族聚酯型材料，继续进行混合搅拌，时间控制在15分钟，使得各组分混合均匀。S2. In the material mixed in step S1, add 6 parts of high-grade urethane acrylate and 6 parts of aliphatic polyester type material, and continue to mix and stir for 15 minutes, so that the components are mixed evenly.
S3、在步骤S2得到的材料中加入60份倍半硅氧烷，继续混合搅拌8分钟，使得各组分混合均匀。S3. Add 60 parts of silsesquioxane to the material obtained in step S2, continue mixing for 8 minutes, so that the components are mixed evenly.
S4、最后加入5份光引发剂、6份羟基环已基甲酮、5份改性稀酸酯类聚合物消泡剂、5份氟改性聚硅氧烷聚合物进行混合搅拌，时间控制在5分钟，即得到EB固化专用封装胶。S4. Finally, add 5 parts of photoinitiator, 6 parts of hydroxycyclohexyl ketone, 5 parts of modified dilute ester polymer defoamer, and 5 parts of fluorine-modified polysiloxane polymer for mixing and stirring, time control In 5 minutes, EB curing special encapsulant is obtained.
采用上述实施例1以及实施2得到的EB固化专用封装胶来对薄膜电容进行封装，其步骤为：The EB curing special encapsulant obtained in the above Examples 1 and 2 is used to encapsulate the thin film capacitor. The steps are as follows:
D1、选取合适的薄膜电容原材料，并通过绕卷、热压、喷金以及焊线后得到半成品薄膜电容器，该步骤为薄膜电容器在未进行封装的前期制备，其过程与现有制备过程一致。D1. Select suitable raw materials for thin film capacitors, and obtain semi-finished thin film capacitors after winding, hot pressing, gold spraying and wire bonding. This step is the preliminary preparation of thin film capacitors without packaging, and the process is consistent with the existing preparation process.
D2、在半成品的薄膜电容器内通过灌装的方式加入实施例1得到的EB固化专用封装胶，同时加入电容器芯子。D2. Add the EB curing special encapsulant obtained in Example 1 to the semi-finished film capacitor by filling, and add the capacitor core at the same time.
D3、对灌装好的薄膜电容器按照顺序竖直排列在传输盘中，在传输盘中按照薄膜电容器的大小做好布局，并通过相应的结构设计来固定薄膜电容器，避免薄膜电容器在传输过程中因震动而引起的倾斜或碰倒，通过传输盘的运动薄膜电容器依次通过UV灯具进行表面预固化，而在传输过程中对薄膜电容器振荡并压实封装胶，以此方式驱赶封装胶中残存的气泡，以提高封装过程中的封装效果，由于其表面进行了固化使得封装胶内部的液体不会泄露或者移动；其中采用UV灯具固化的能量控制在200-1000mJ/cm 2。 D3. The filled film capacitors are arranged vertically in the transmission tray in order, and the layout is done according to the size of the film capacitors in the transmission tray, and the film capacitors are fixed by the corresponding structural design to avoid the film capacitors during the transmission process. The tilting or knocking caused by the vibration, the film capacitor through the movement of the transmission plate is sequentially pre-cured by the surface of the UV lamp, and the film capacitor is oscillated during the transmission process and the encapsulant is compacted, in this way to drive the residual residue Bubbles to improve the packaging effect during the packaging process, because the surface is cured so that the liquid inside the packaging glue will not leak or move; the energy of curing with UV lamps is controlled at 200-1000mJ/cm 2 .
D4、将预固化后的薄膜电容器利用机械手将竖直排列改为卧式排列，使得整体的高度降低，方便进行EB固化；卧式排列的薄膜电容器通过EB照射进行深度固化，使得封装胶内部得以固化，从而得到成品薄膜电容器；经过EB固化有效提高封装胶的交联度，能够提高薄膜电容器的储电性能；在该步骤中对电子加速器进行选择，控制其能量范围在3.0MeV-10.0MeV，固化吸收剂量控制在20-80kGy。D4. Change the vertical arrangement of the pre-cured film capacitors to a horizontal arrangement using a robotic arm, which reduces the overall height and facilitates EB curing; the horizontally arranged film capacitors are deeply cured by EB irradiation, which enables the interior of the encapsulant Curing to obtain a finished film capacitor; after EB curing, the cross-linking degree of the encapsulant is effectively improved, and the storage performance of the film capacitor can be improved; in this step, the electron accelerator is selected to control its energy range to 3.0MeV-10.0MeV, The curing absorbed dose is controlled at 20-80kGy.
选取实施例1以及实施例2的封装胶并通过上述方法对薄膜电容器进行了制备，首先，其生产过程中采用含固量较高的封装胶替代挥发性溶剂，从而有效减少了生产车间VOCs的排放，优化生产车间环境，有利于员工的健康与安全，有利于环境优化；同时，采用UV进行表面预固化后，再通过EB进行内部深度固化，改善了薄膜电容器生产的过程，保证封装胶不会泄露到薄膜电容器外部，提高封装胶的交联程度，从而增强了电容的储电能力；最后，采用UV表面预固化与EB内部深度固化相结合替代了传统工艺，从而减少能耗及占地面积，减少了生产所需时间提高生产效率。The encapsulant of Example 1 and Example 2 was selected and the film capacitor was prepared by the above method. First, the encapsulant with higher solid content was used to replace the volatile solvent in the production process, thereby effectively reducing the VOCs in the production workshop Emissions, optimizing the production workshop environment, is conducive to the health and safety of employees, and is conducive to environmental optimization; at the same time, after using UV for surface pre-curing, and then internal deep curing through EB, the process of film capacitor production is improved, ensuring that the packaging adhesive It will leak to the outside of the film capacitor, improve the degree of cross-linking of the encapsulant, thereby enhancing the storage capacity of the capacitor; Finally, the combination of UV surface pre-curing and EB internal deep curing replaces the traditional process, thereby reducing energy consumption and occupying space The area reduces the time required for production and improves production efficiency.
而对于实施例1以及实施例2制作出来的薄膜电容器与现有工艺制作的薄膜电容器进行对比，得出以下对比数据，如下表。By comparing the film capacitors manufactured in Example 1 and Example 2 with the film capacitors manufactured in the prior art, the following comparison data is obtained, as shown in the following table.
Figure PCTCN2018119297-appb-000007
Figure PCTCN2018119297-appb-000007
通过上述10组数据进行对比，相较于原有工艺储电能力有了提升；原有工艺制作的薄膜电容器容量主要集中在470～480nF之间，而采用EB固化工艺制作的薄膜电容器容量主要集中在480～485nF之间，而目前电容器容量＞470nF为良品，这说明采用EB固化工艺出现不良品的概率比原有的传统工艺低很多，因此采用该技术生产的薄膜电容器大大提高了产品的良品率，有效减少企业生产成本，提高企业经济效益。Compared with the above 10 sets of data, compared with the original process, the storage capacity has been improved; the capacity of the film capacitors made by the original process is mainly concentrated between 470 and 480nF, while the capacity of the film capacitors made by the EB curing process is mainly concentrated Between 480 and 485nF, and the current capacitor capacity>470nF is a good product, which shows that the probability of defective products using the EB curing process is much lower than the original traditional process, so the film capacitor produced by this technology greatly improves the good product Rate, effectively reduce the production costs of enterprises and improve the economic benefits of enterprises.
需要强调的是：以上仅是本发明的较佳实施例而已，并非对本发明作任何形式上的限制，凡是依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰，均仍属于本发明技术方案的范围内。It should be emphasized that the above are only the preferred embodiments of the present invention and do not limit the present invention in any form. Any simple modifications, equivalent changes and modifications to the above embodiments based on the technical essence of the present invention are all It still belongs to the scope of the technical solution of the present invention.

Claims (10)

  1. 一种EB固化专用封装胶，其特征在于，所述的封装胶的按重量份组成包括，An EB curing special encapsulant, characterized in that the composition of the encapsulant by weight includes,
    Figure PCTCN2018119297-appb-100001
    Figure PCTCN2018119297-appb-100001
  2. 根据权利要求1所述的EB固化专用封装胶，其特征在于，所述的封装胶按重量份组成包括，The EB curing special encapsulant according to claim 1, characterized in that the composition of the encapsulant by weight includes,
    Figure PCTCN2018119297-appb-100002
    Figure PCTCN2018119297-appb-100002
  3. 根据权利要求1所述的EB固化专用封装胶，其特征在于，所述的封装胶按重量份组成包括，The EB curing special encapsulant according to claim 1, characterized in that the composition of the encapsulant by weight includes,
    Figure PCTCN2018119297-appb-100003
    Figure PCTCN2018119297-appb-100003
  4. 一种如权利要求1所述的EB固化专用封装胶的制备方法，其特征在于，所述的制备方法的步骤为，A method for preparing a special EB curing encapsulant according to claim 1, wherein the steps of the preparation method are:
    S1、将已二醇二丙稀酸酯、二缩三丙二醇二丙稀酸酯、三羟甲基丙烷三丙稀酸酯以及三甲基苯甲酰基二苯基氧化膦混合在一起，进行搅拌1-10分钟，使得各组分混合均匀；S1. Mix hexanediol dipropylate, tripropylene glycol dipropionate, trimethylolpropane tripropionate, and trimethylbenzoyl diphenylphosphine oxide, and stir 1-10 minutes to make the components mix evenly;
    S2、在步骤S1中混合好的材料中加入高官聚氨酯丙稀酸酯以及脂肪族聚酯型材料，混合搅拌5-20分钟；S2. Add high-grade urethane acrylate and aliphatic polyester material to the materials mixed in step S1, and mix for 5-20 minutes;
    S3、在步骤S2得到的材料中加入倍半硅氧烷，继续混合搅拌5-20分钟；S3. Add silsesquioxane to the material obtained in step S2, and continue to mix and stir for 5-20 minutes;
    S4、最后加入光引发剂、羟基环已基甲酮、改性稀酸酯类聚合物消泡剂、氟改性聚硅氧烷聚合物混合在一起搅拌2-10分钟，得到EB固化专用封装胶。S4. Finally, add photoinitiator, hydroxycyclohexyl ketone, modified dilute ester polymer defoamer, and fluorine-modified polysiloxane polymer and mix together for 2-10 minutes to obtain a special package for EB curing gum.
  5. 根据权利要求4所述的EB固化专用封装胶的制备方法，其特征在于，所述的封装胶制备过程中保证环境温度处于20-50℃之间。The method for preparing an EB curing special encapsulant according to claim 4, characterized in that, during the preparation of the encapsulant, the ambient temperature is guaranteed to be between 20-50°C.
  6. 根据权利要求4所述的EB固化专用封装胶的制备方法，其特征在于，所述的封装胶成品的pH值控制在6±1，粘度控制在1700-2400Mpas范围内，含固率控 制在99％以上。The preparation method of EB curing special encapsulant according to claim 4, characterized in that the pH value of the finished encapsulant is controlled at 6±1, the viscosity is controlled in the range of 1700-2400Mpas, and the solid content rate is controlled at 99 %the above.
  7. 一种采用权利要求1所述的封装胶封装薄膜电容器的方法，其特征在于，该方法的步骤为，A method for encapsulating a film capacitor with the encapsulant of claim 1, wherein the steps of the method are:
    D1、将薄膜电容原材料通过绕卷、热压、喷金以及焊线后得到半成品薄膜电容器；D1, after winding the film capacitor raw materials, hot pressing, gold spraying and welding wire to obtain semi-finished film capacitors;
    D2、在半成品的薄膜电容器内灌装入权利要求1所述的封装胶，同时加入电容器芯子；D2. Fill the semi-finished film capacitor with the encapsulant of claim 1 and add the capacitor core at the same time;
    D3、对灌装好的薄膜电容器先通过UV进行表面预固化，使得封装胶不会泄露或者移动；D3. Pre-curing the surface of the filled film capacitor through UV, so that the encapsulant will not leak or move;
    D4、最后将预固化后的薄膜电容器通过EB进行深度固化，得到成品薄膜电容器，使得封装胶的内部固化且有效提高封装胶的交联度。D4. Finally, the pre-cured film capacitor is deeply cured by EB to obtain a finished film capacitor, so that the interior of the encapsulant is cured and the cross-linking degree of the encapsulant is effectively improved.
  8. 根据权利要求7所述的封装薄膜电容的方法，其特征在于，在所述的步骤D3中采用UV进行表面预固化时，薄膜电容器竖直排列，UV固化能量控制在200-1000mJ/cm 2。 The method of packaging a film capacitor according to claim 7, wherein in step D3, when UV is used for surface pre-curing, the film capacitors are vertically arranged, and the UV curing energy is controlled at 200-1000mJ/cm 2 .
  9. 根据权利要求7所述的封装薄膜电容的方法，其特征在于，在所述的步骤D4中采用EB进行深度固化时，薄膜电容器卧式排列，EB固化的电子加速器的能量选择为3.0MeV-10.0MeV，固化吸收剂量控制在20-80kGy。The method for packaging a film capacitor according to claim 7, wherein when the EB is used for deep curing in the step D4, the film capacitors are arranged horizontally, and the energy of the electron accelerator for EB curing is selected to be 3.0 MeV-10.0 MeV, curing absorbed dose is controlled at 20-80kGy.
  10. 根据权利要求7所述的封装薄膜电容的方法，其特征在于，在所述的步骤D3进行UV预固化时采用在传输的过程中振荡并压实封装胶，驱赶封装胶中残存的气泡。The method of packaging film capacitors according to claim 7, characterized in that, during the UV pre-curing in the step D3, the packaging glue is oscillated and compacted during the transmission process to drive the remaining air bubbles in the packaging glue.
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