CN110450045A - A kind of wafer bearing device - Google Patents
A kind of wafer bearing device Download PDFInfo
- Publication number
- CN110450045A CN110450045A CN201910864319.1A CN201910864319A CN110450045A CN 110450045 A CN110450045 A CN 110450045A CN 201910864319 A CN201910864319 A CN 201910864319A CN 110450045 A CN110450045 A CN 110450045A
- Authority
- CN
- China
- Prior art keywords
- positioning pin
- bearing device
- wafer bearing
- carrier head
- ring flange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
Abstract
The invention discloses a kind of wafer bearing devices, including carrier head and top Pneumatic assembly, the carrier head is coupled to the top Pneumatic assembly by connection component, the connection component includes positioning pin and the ring flange with dowel hole, the positioning pin and ring flange are made of metal material, and some or all of described positioning pin surface, which is provided with nonmetal structure the positioning pin is contacted with the ring flange, does not generate metal pollutant.
Description
Technical field
The invention belongs to chemical Mechanical Polishing Technique fields, in particular to a kind of wafer bearing device.
Background technique
Currently, chemically mechanical polishing (Chemical Mechanical Planarization, CMP, also referred to as chemical machinery
Planarization) as the technology for making wafer obtain global planarizartion, have developed into collection polishing, wafer transfer, online measuring, cleaning
Etc. technologies in one equipment.Wafer is usually pull-in on the bottom surface of the carrier head of bogey lower part by chemically mechanical polishing, brilliant
Circle presses on polishing pad upper surface with sedimentary on one side, and carrier head is in top Pneumatic component (UPA, upper pneumatic
Assembly under actuating) with polishing pad rotating Vortex and give wafer down load；Meanwhile polishing fluid is supplied in polishing pad
Upper surface is simultaneously distributed between wafer and polishing pad, so that wafer completes the chemistry of wafer under chemistry and mechanical collective effect
Mechanical polishing.
The problem of encountering in the prior art includes being easy to happen crystal column surface in CMP process and being contaminated with metals
The problem that object scratches and/or metal pollutant is exceeded, this is all to be difficult to receive in chip manufacturing field, in particular with chip
The continuous test of processing procedure proposes unprecedented high request to metal contamination level.In general, once finding crystal column surface
It is contaminated with metals object scuffing or metal pollutant is exceeded, then whole consumables associated therewiths may be needed replacing, so that cost be significantly increased
And reduce production efficiency.Such as CN107301960A is pointed out, in manufacture of semiconductor, contaminant metal ions are referred to as removable
Dynamic ionic soil source, has very strong mobility in a semiconductor material, will cause oxide-polysilicon grating structure defect, PN
Junction leakage increases, minority carrier lifetime is reduced, the change of threshold voltage, and yield and reliability to device have serious danger
Evil.
The carrier head of wafer bearing device is the important component of chemical-mechanical polisher, needs periodically to load and unload carrier head
To carry out maintenance operation, replace component to guarantee the service life of carrier head.In order to make the multiple stomatas and top gas of carrier head
It is accurately aligned with each other between the stomata of dynamic component, the carrier head of wafer bearing device passes through positioning pin and top Pneumatic assembly
Connector is positioned and is attached thereto via clip, and vice versa；Existing positioning pin is easy to scratch metal company during the installation process
The mounting surface of fitting, so that the metal pollutant of such as metal fragment, metal particle, metallic particles etc is generated, it is similar, on
The connector of portion's Pneumatic assembly can also be configured the positioning pin of the mounting surface positioning for the connector with carrier head, and the top
Positioning pin is also easy to scratch the connector of carrier head during the installation process and generates metal pollutant.
Summary of the invention
The present invention is directed to solve one of the technical problems existing in the prior art at least to some extent.For this purpose, of the invention
It is proposed that a kind of wafer bearing device, including carrier head and top Pneumatic assembly, the carrier head are coupled to institute by connection component
State top Pneumatic assembly, the connection component includes positioning pin and the ring flange with dowel hole,
The main body and ring flange of the positioning pin are made of metal material,
Some or all of positioning pin surface is provided with nonmetal structure and makes the positioning pin and the ring flange
Contact does not generate metal pollutant.
In some embodiments, the nonmetal structure is set to the end face of the insertion dowel hole of the positioning pin
Place.
In some embodiments, the nonmetal structure is formed as rotary table, bottom surface of the rotary table in conjunction with positioning pin
Diameter is less than or equal to the diameter of the positioning pin equal to the diameter of the positioning pin and the diameter of the rotary table top surface.
In some embodiments, the nonmetal structure is made of at least one of plastics, ceramics, glass.
In some embodiments, the plastics are hard engineering plastic.
In some embodiments, the hard engineering plastic be Hard PVC, polyethylene, organic glass, polypropylene,
Polystyrene, polytetrafluoroethylene (PTFE), nylon, PET, ABS, PEEK and/or PPS.
In some embodiments, the nonmetal structure is made of the composite plastic containing fiber and/or graphene.
In some embodiments, the metal material is the hard metal material without containing aluminium element.
The invention also discloses a kind of wafer bearing device, including carrier head and top Pneumatic assembly, the carryings simultaneously
Head is coupled to the top Pneumatic assembly by connection component, and the connection component includes positioning pin and the method with dowel hole
Blue disk, the ring flange is made of metal material and the positioning pin is made of nonmetallic materials.
In some embodiments, the nonmetallic materials are Hard PVC, polyethylene, organic glass, polypropylene, gather
Styrene, polytetrafluoroethylene (PTFE), nylon, PET, ABS, PEEK, ceramics, glass and/or PPS.
A kind of wafer bearing device described herein, structurally reasonable, some or all of positioning pin surface is provided with
Nonmetallic materials structure, so that not produced in bogey maintenance operation and when the positioning pin is contacted with the ring flange
Raw metal pollutant solves the problems, such as that crystal column surface is easy to be contaminated with metals object scuffing and/or metal pollutant is exceeded.
Detailed description of the invention
It will be apparent and be easier to understand by made detailed description, advantages of the present invention in conjunction with the following drawings,
These attached drawings are only schematical, are not intended to limit protection scope of the present invention, in which:
Fig. 1 is a kind of structural schematic diagram of chemical mechanical polishing apparatus according to the present invention；
Fig. 2 is the structural schematic diagram of the wafer bearing device according to the present invention；
Fig. 3 is the structural schematic diagram of carrier head according to the present invention；
Fig. 4 is the structural schematic diagram of top Pneumatic assembly according to the present invention；
Fig. 5 a, 5b, 5c are the structural schematic diagrams of positioning pin according to the present invention.
Wherein, the meaning of numerals is as follows:
100- chemical mechanical polishing apparatus；
10- polishing disk；
20- polishing pad；
30- wafer bearing device；31- carrier head；The top 32- Pneumatic assembly；33- connection component；331a- lower flange；
331b- upper flange plate；332- positioning pin；3321a, 3321b, 3321c- nonmetal structure；333a, 333b- dowel hole；
334a, 334b- stomata；
40- trimming device；41- conditioning arm；42- modifies head；
50- polishes liquid supply unit.
Specific embodiment
Combined with specific embodiments below and its attached drawing, technical solution of the present invention is described in detail.It records herein
Embodiment be specific specific embodiment of the invention, for illustrating design of the invention；These explanations are explanatory
With it is illustrative, should not be construed as the limitation to embodiment of the present invention and the scope of the present invention.Except the implementation recorded herein
Exception, those skilled in the art can also be based on the claim of this application books and its specification disclosure of that using aobvious and easy
The other technical solutions seen, these technical solutions include any obviously replacing using to making for the embodiment recorded herein
The technical solution changed and modified.
The attached drawing of this specification is schematic diagram, aids in illustrating design of the invention, it is schematically indicated the shape of each section
And its correlation.It should be understood that for the ease of clearly showing the structure of each component of the embodiment of the present invention, it is each attached
It is not drawn according to identical ratio between figure, identical reference marker is for indicating identical part in attached drawing.
It should be pointed out that the wafer in the present invention is in the industry cycle otherwise referred to as " substrate " or " substrate ", meaning is substantially
It is identical, it is not distinguished in the field CMP in most cases.
Chemical mechanical polishing apparatus 100 shown in fig. 1 includes polishing disk 10, polishing pad 20, wafer bearing device 30, finishing
Device 40 and polishing liquid supply unit 50；Polishing pad 20 is set to 10 upper surface of polishing disk and therewith revolves along axis Ax1
Turn；Horizontally movable wafer bearing device 30 is set to 20 top of polishing pad, and lower surface sticking has polished wafer W；
Trimming device 40 includes conditioning arm 41 and finishing head 42, and conditioning arm 41 drives the finishing head 42 of rotation to swing to modify polishing pad 20
Surface reaches the state suitable for polishing；It polishes liquid supply unit 50 and polishing fluid is interspersed among into 20 surface of polishing pad；When polishing operation,
The polished face of wafer W is compressed the surface of polishing pad 20 by wafer bearing device 30, and polishing fluid distribution is in polishing pad 20 and wafer W
Between, the removal of crystal column surface material is completed under the action of chemical machinery.
As shown in Fig. 2, wafer bearing device 30 includes carrier head 31 and top Pneumatic assembly 32 (UPA, upper
Pneumatic assembly), carrier head 31 is coupled to top Pneumatic assembly 32 by connection component 33, and connection component 33 includes
Lower flange 331a, upper flange plate 331b, at least one positioning pin 332 and unshowned clip；Lower flange 331a setting
For being connected to the upper flange plate 331b of 32 bottom of top Pneumatic assembly at the top of carrier head 31.
Fig. 3 shows the carrier head 31 of wafer bearing device 30 according to the present invention, at the top of lower flange 331a match
Be equipped at least one positioning pin 332, at least one dowel hole 333a and it is multiple be used for and top Pneumatic assembly 32 gas circuit connect
Logical stomata 334a；Fig. 4 shows the top Pneumatic assembly 32 of wafer bearing device 30 according to the present invention, the upper method of bottom
Blue disk 331b is configured at least one positioning pin 332, at least one dowel hole 333b and multiple stomata 334b, carrier head 31
Fine registration is tightly connected the stomata 334b of stomata 334a and top Pneumatic assembly 32 each other respectively, so that top Pneumatic assembly 32
It can be by being passed through/being discharged the pressure formula of gas regulation carrier head 31 into carrier head 31.It, can also as alternative embodiment
Only to configure two positioning pins 332 and corresponding dowel hole on upper flange plate 331b or lower flange 331a.
When carrying out assembly and/or when maintenance operation, carrier head 31 need to be lifted so that its accurate assembly is to top Pneumatic assembly
32, so that the positioning pin 332 of carrier head 31 is inserted into the dowel hole 333b of top Pneumatic assembly 32 and/or makes pneumatic group of top
The positioning pin 332 of part 32 is inserted into the dowel hole 333a of carrier head 31, and stomata 334a and the top to guarantee carrier head 31 are pneumatic
Fine registration, unshowned clip fasten lower flange 331a and upper flange plate 331b to the stomata 334b of component 32 each other, real
The assembly connection of existing carrier head 31 and top Pneumatic assembly 32.
As an embodiment of the present invention, as shown in Fig. 2, lower flange 331a, upper flange plate 331b and positioning pin 332
Main body be made of metal material, at least one end face of positioning pin 332 and/or its neighbouring part have nonmetal structure, by
Being in contact with each other in the hardness of nonmetal structure far below ring flange made of metal, between them can be to avoid positioning pin 332 not
Alignment is inserted into dowel hole 333a, 333b and damages flange panel surface and generate the metal including metal fragment and/or metal particle
Pollution, and then prevent from scratching wafer or influence the yields of polishing wafer.
Fig. 5 a shows a kind of embodiment variant of positioning pin 332 according to the present invention, and nonmetal structure 3321a is sheathed on
The end of positioning pin 332, the end of positioning pin 332 are formed as round table-like, and the upper end diameter of nonmetal structure 3321a is less than under it
Diameter is held, so that positioning pin 332 damages flange dish cart convenient for the two misalignment is directed at and prevented with dowel hole 333a, 333b
Face generates metal fragment and/or metal particle.As a variant of the present embodiment, as shown in Figure 5 b, nonmetal structure 3321b
The outer end of the component formed with positioning pin 332 is column structure, does the processing of circular arc chamfered edge in the seamed edge of column structure；As this reality
A variant of example is applied, as shown in Figure 5 c, nonmetal structure 3321c can also be provided only at 332 circumference seamed edge of positioning pin, i.e., non-
Metal structure 3321c cover positioning pin 332 seamed edge, with prevent 332 misalignment of positioning pin insertion dowel hole 333a,
333b and the seamed edge of positioning pin made of metal 332 is directly contacted with ring flange 331a, 331b made of metal and is produced
The raw metallic pollutions such as metal fragment and/or metal particle.
In view of the degree for needing strictly to prevent aluminium ion from polluting in wafer production process, one as the present embodiment
Aspect, lower flange 331a, upper flange plate 331b and positioning pin 332 are such as stainless by the hard metal material without containing aluminium element
Steel, titanium alloy can reduce aluminum ions quantity in polishing environment in this way, by metal pollutant control in claimed range.
As another variant of the embodiment of the present invention, nonmetal structure, which can also cover, is set to 332 peripheral side of positioning pin
All surfaces or setting be covered in whole outer surfaces of positioning pin 332, connect dress with top Pneumatic assembly 32 in carrier head 31
Timing, the setting of nonmetal structure is not so that positioning pin 332 and lower flange 331a and upper flange plate 331b generate gold when contacting
Belong to pollutant.
As another variant of the embodiment of the present invention, nonmetal structure 3321 has certain thickness, it is preferable that nonmetallic
Structure 3321 with a thickness of 0.3mm-3mm, it is preferred that the thickness of the nonmetal structure 3321 shown in Fig. 5 a, Fig. 5 b and Fig. 5 c
Degree is 1.2mm.
As another variant of the embodiment of the present invention, nonmetal structure 3321 is by least one in plastics, ceramics, glass
Kind material is made, it is preferred that the plastics are hard engineering plastic.In some embodiments, the hard engineering plastic can be with
For Hard PVC, polyethylene, organic glass, polypropylene, polystyrene, polytetrafluoroethylene (PTFE), nylon, PET, ABS, PEEK
And/or PPS.In the embodiment shown in Fig. 5 a, nonmetal structure 3321 can be made of PEEK.A side as the present embodiment
Face, nonmetal structure 3321 are made of the enhancing composite plastic containing fiber and/or graphene, are guaranteeing positioning pin 332 under
Under the premise of ring flange 331a and upper flange plate 331b does not generate metal pollutant when contacting, fiber and/or graphene be can be improved
The intensity of positioning pin 332 prevents from destroying positioning pin during transmitting torque between top Pneumatic assembly 32 and carrier head 31
332, guarantee the normal operation of wafer bearing device；Wherein, the fiber can be the glass fibre for reinforced plastics intensity,
One of carbon fiber, boron fibre, aramid fiber, silicon carbide fibre, asbestos fibre etc. are a variety of, and the length of the fiber is
To 5mm, the weight ratio of the fibrous material is 5% to 50% by 0.2mm to 12mm, preferably 1mm, preferably 15% to
25%.
As an embodiment of the present invention, lower flange 331a and upper flange plate 331b is made of metal material and determines
Position pin 332 is made of nonmetallic materials completely.In some embodiments, the nonmetallic materials are ceramics, glass, hard polychlorostyrene
Ethylene, polyethylene, organic glass, polypropylene, polystyrene, polytetrafluoroethylene (PTFE), nylon, PET, ABS, PEEK and/or PPS.It is excellent
Selection of land enhances the intensity of the positioning pin in the nonmetallic materials containing fiber and/or graphene, prevents pneumatic group of top
Positioning pin 332 is destroyed between part 32 and carrier head 31 when transmitting torque, to guarantee the normal operation of wafer bearing device,
In, it is fine that the fiber can be the glass fibre for reinforced plastics intensity, carbon fiber, boron fibre, aramid fiber, silicon carbide
One of dimension, asbestos fibre etc. are a variety of, and the length of the fiber is 0.2mm to 12mm, preferably 1mm to 5mm.It is nonmetallic
Positioning pin 332 made of material can prevent it from generating metallic pollution when contacting with lower flange 331a and upper flange plate 331b
Object.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " illustrative examples ",
The description of " example ", " specific example " or " some examples " etc. means specific features described in conjunction with this embodiment or example, knot
Structure, material or feature are included at least one embodiment or example of the invention.In the present specification, to above-mentioned term
Schematic representation may not refer to the same embodiment or example.Moreover, specific features, structure, material or the spy of description
Point can be combined in any suitable manner in any one or more of the embodiments or examples.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that: not
A variety of change, modification, replacement and modification can be carried out to these embodiments in the case where being detached from the principle of the present invention and objective, this
The range of invention is defined by the claims and their equivalents.
Claims (10)
1. a kind of wafer bearing device, including carrier head and top Pneumatic assembly, the carrier head are coupled to by connection component
The top Pneumatic assembly, the connection component include positioning pin and the ring flange with dowel hole, the master of the positioning pin
Body and ring flange are made of metal material, some or all of described positioning pin surface be provided with nonmetal structure make it is described fixed
Position pin is contacted with the ring flange does not generate metal pollutant.
2. wafer bearing device as described in claim 1, which is characterized in that the nonmetal structure is set to the positioning pin
The insertion dowel hole endface.
3. wafer bearing device as described in claim 1, which is characterized in that the nonmetal structure is formed as rotary table, described
The diameter of bottom surface of the rotary table in conjunction with positioning pin be equal to the positioning pin diameter and the rotary table top surface diameter be less than etc.
In the diameter of the positioning pin.
4. wafer bearing device as described in claim 1, which is characterized in that the nonmetal structure is by plastics, ceramics, glass
At least one of be made.
5. wafer bearing device as claimed in claim 4, which is characterized in that the plastics are hard engineering plastic.
6. wafer bearing device as claimed in claim 5, which is characterized in that the hard engineering plastic is hard polychlorostyrene second
Alkene, polyethylene, organic glass, polypropylene, polystyrene, polytetrafluoroethylene (PTFE), nylon, PET, ABS, PEEK and/or PPS.
7. wafer bearing device as described in claim 1, which is characterized in that the nonmetal structure by containing fiber and/or
The composite plastic of graphene is made.
8. wafer bearing device as described in claim 1, which is characterized in that the metal material is without containing the hard of aluminium element
Matter metal material.
9. a kind of wafer bearing device, including carrier head and top Pneumatic assembly, the carrier head are coupled to by connection component
The top Pneumatic assembly, the connection component include positioning pin and the ring flange with dowel hole, and the ring flange is by gold
Category material is made and the positioning pin is made of nonmetallic materials.
10. wafer bearing device as claimed in claim 9, which is characterized in that the nonmetallic materials be Hard PVC,
Polyethylene, organic glass, polypropylene, polystyrene, polytetrafluoroethylene (PTFE), nylon, PET, ABS, PEEK, ceramics, glass and/or
PPS。
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910864319.1A CN110450045A (en) | 2019-09-12 | 2019-09-12 | A kind of wafer bearing device |
| CN201922437347.3U CN212240553U (en) | 2019-09-12 | 2019-12-30 | Bearing head for chemical mechanical polishing and wafer bearing device |
| CN201922441800.8U CN213917711U (en) | 2019-09-12 | 2019-12-30 | Drive assembly for bearing head |
| CN201911398791.7A CN110861000A (en) | 2019-09-12 | 2019-12-30 | Driving assembly for bearing head and wafer bearing device |
| CN201911398830.3A CN110834269A (en) | 2019-09-12 | 2019-12-30 | Bearing head for chemical mechanical polishing and wafer bearing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910864319.1A CN110450045A (en) | 2019-09-12 | 2019-09-12 | A kind of wafer bearing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110450045A true CN110450045A (en) | 2019-11-15 |
Family
ID=68491875
Family Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910864319.1A Pending CN110450045A (en) | 2019-09-12 | 2019-09-12 | A kind of wafer bearing device |
| CN201922437347.3U Active CN212240553U (en) | 2019-09-12 | 2019-12-30 | Bearing head for chemical mechanical polishing and wafer bearing device |
| CN201911398791.7A Pending CN110861000A (en) | 2019-09-12 | 2019-12-30 | Driving assembly for bearing head and wafer bearing device |
| CN201911398830.3A Pending CN110834269A (en) | 2019-09-12 | 2019-12-30 | Bearing head for chemical mechanical polishing and wafer bearing device |
| CN201922441800.8U Active CN213917711U (en) | 2019-09-12 | 2019-12-30 | Drive assembly for bearing head |
Family Applications After (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922437347.3U Active CN212240553U (en) | 2019-09-12 | 2019-12-30 | Bearing head for chemical mechanical polishing and wafer bearing device |
| CN201911398791.7A Pending CN110861000A (en) | 2019-09-12 | 2019-12-30 | Driving assembly for bearing head and wafer bearing device |
| CN201911398830.3A Pending CN110834269A (en) | 2019-09-12 | 2019-12-30 | Bearing head for chemical mechanical polishing and wafer bearing device |
| CN201922441800.8U Active CN213917711U (en) | 2019-09-12 | 2019-12-30 | Drive assembly for bearing head |
Country Status (1)
| Country | Link |
|---|---|
| CN (5) | CN110450045A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111469049B (en) * | 2020-04-18 | 2020-10-27 | 华海清科股份有限公司 | Polishing head with self-adaptability |
| CN116372801A (en) * | 2023-04-12 | 2023-07-04 | 华海清科股份有限公司 | Bearing assembly and chemical mechanical polishing system |
-
2019
- 2019-09-12 CN CN201910864319.1A patent/CN110450045A/en active Pending
- 2019-12-30 CN CN201922437347.3U patent/CN212240553U/en active Active
- 2019-12-30 CN CN201911398791.7A patent/CN110861000A/en active Pending
- 2019-12-30 CN CN201911398830.3A patent/CN110834269A/en active Pending
- 2019-12-30 CN CN201922441800.8U patent/CN213917711U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN110834269A (en) | 2020-02-25 |
| CN110861000A (en) | 2020-03-06 |
| CN213917711U (en) | 2021-08-10 |
| CN212240553U (en) | 2020-12-29 |
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