CN110834269A - Bearing head for chemical mechanical polishing and wafer bearing device - Google Patents
Bearing head for chemical mechanical polishing and wafer bearing device Download PDFInfo
- Publication number
- CN110834269A CN110834269A CN201911398830.3A CN201911398830A CN110834269A CN 110834269 A CN110834269 A CN 110834269A CN 201911398830 A CN201911398830 A CN 201911398830A CN 110834269 A CN110834269 A CN 110834269A
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- Prior art keywords
- carrier head
- head
- locating pin
- drive unit
- bearing
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
A carrier head for chemical mechanical polishing comprising a flange disposed at the top of the carrier head for mounting the carrier head to a drive unit, the flange having positioning pins whose bodies are made of a metal material and whose surfaces are partially or entirely provided with a non-metal structure to avoid abrasion.
Description
Technical Field
The invention belongs to the technical field of chemical mechanical polishing, and particularly relates to a bearing head for chemical mechanical polishing and a wafer bearing device.
Background
Currently, Chemical Mechanical Planarization (CMP) has been developed as a technique for global Planarization of wafers, and integrates polishing, wafer transfer, on-line measurement, cleaning, and other techniques into a whole. Chemical mechanical polishing generally attracts a wafer to a bottom surface of a carrier head at a lower portion of a carrier, wherein a surface of the wafer having a deposition layer is pressed against an upper surface of a polishing pad, and the carrier head rotates in a same direction as the polishing pad under actuation of an Upper Pneumatic Assembly (UPA) and gives a downward load to the wafer; meanwhile, the polishing solution is supplied to the upper surface of the polishing pad and distributed between the wafer and the polishing pad, so that the chemical mechanical polishing of the wafer is completed under the combined action of chemistry and machinery.
The problems encountered in the prior art include that the wafer surface is easily scratched by metal contaminants and/or the metal contaminants exceed the standard during the chemical mechanical polishing process, which are unacceptable in the field of chip manufacturing, and especially, as the chip manufacturing process is continuously advanced, unprecedented high requirements are provided for the metal contamination level. Generally, once the surface of the wafer is scratched by or exceeds the metal contamination level, all the related consumables may need to be replaced, thereby greatly increasing the cost and reducing the production efficiency. For example, CN107301960A points out that in a semiconductor manufacturing process, metal ion contaminants are called mobile ion contamination sources, and have strong mobility in a semiconductor material, which may cause defects in an oxide-polysilicon gate structure, increase PN junction leakage current, decrease in minority carrier lifetime, change in threshold voltage, and seriously harm the yield and reliability of devices.
The carrier head of the wafer carrier is an important component of the chemical mechanical polishing equipment, and the carrier head needs to be periodically assembled and disassembled to carry out maintenance operation and replace components so as to ensure the service life of the carrier head. In order to precisely align the plurality of air holes of the carrier head and the air holes of the upper driving unit with each other, the carrier head of the wafer carrier device is positioned with the connecting member of the upper driving unit by the positioning pins and connected thereto via the clips, and vice versa; while the prior art locating pins tend to scratch the mounting surface of the metal attachment member during installation, thereby creating metal contaminants such as metal debris, metal particles, and the like, the attachment member of the upper drive unit may be similarly configured with locating pins for locating with the mounting surface of the attachment member of the carrier head, and the upper locating pins also tend to scratch the attachment member of the carrier head during installation and create metal contaminants.
Disclosure of Invention
The present invention aims to solve at least to some extent one of the technical problems existing in the prior art. To this end, the invention proposes a carrier head for chemical mechanical polishing, characterized in that it comprises a flange arranged on top of the carrier head for mounting the carrier head to a drive unit, the flange having positioning pins whose bodies are made of a metallic material and whose surfaces are provided, partially or totally, with non-metallic structures that avoid wear.
Further, the non-metal structure is arranged on the end face of the positioning pin, which is used for being inserted into the positioning pin hole of the driving unit.
Furthermore, the non-metal structure is formed into a circular table, the diameter of the bottom surface of the circular table combined with the positioning pin is equal to the diameter of the combined surface of the positioning pin, and the diameter of the top surface of the circular table is smaller than or equal to the diameter of the positioning pin.
Further, the non-metal structure is made of at least one of plastic, ceramic and glass.
Further, the plastic is hard engineering plastic.
Further, the hard engineering plastic is hard polyvinyl chloride, polyethylene, organic glass, polypropylene, polystyrene, polytetrafluoroethylene, nylon, PET, ABS, PEEK and/or PPS.
Further, the non-metallic structure is made of composite plastic containing fibers and/or graphene.
Further, the metal material is a hard metal material containing no aluminum element.
In addition, the invention also discloses a wafer bearing device which comprises a bearing head and an upper driving unit, wherein the bearing head is coupled to the upper driving unit through a connecting assembly, the connecting assembly comprises a positioning pin and two flange plates with positioning pin holes, the positioning pin is arranged on the flange plate at the bottom of the upper driving unit and/or the flange plate at the top of the bearing head, and a part or the whole surface of the positioning pin is provided with a nonmetal structure, so that the positioning pin and the flange plate are in contact with each other without abrasion and/or metal pollutants.
In addition, the invention also discloses a wafer bearing device which comprises a bearing head and an upper driving unit, wherein the bearing head is coupled to the upper driving unit through a connecting assembly, the connecting assembly comprises a positioning pin and two flanges with positioning pin holes, the positioning pin is arranged on the flange at the bottom of the upper driving unit and/or the flange at the top of the bearing head, and the positioning pin is made of non-metal materials, so that the positioning pin and the flange are in contact with each other without abrasion and/or metal pollutants.
This application carrier head and wafer bear device, its is rational in infrastructure, the part or the whole surface of locating pin are provided with the non-metallic material structure for to bear the weight of in the device dimension guarantor operation and the locating pin with do not produce metal contaminant during the ring flange contact, solved the wafer surface easily by the problem that metal contaminant fish tail and/or metal contaminant exceed standard.
Drawings
The advantages of the invention will become clearer and more readily appreciated from the detailed description given with reference to the following drawings, which are given by way of illustration only, and which do not limit the scope of protection of the invention, wherein:
FIG. 1 is a schematic view of a chemical mechanical polishing apparatus according to the present invention;
FIG. 2 is a schematic structural diagram of a wafer carrier according to the present invention;
FIG. 3 is a schematic diagram of a carrier head according to the present invention;
FIG. 4 is a schematic structural diagram of an upper drive unit according to the present invention;
fig. 5a, 5b, 5c are schematic views of the structure of the positioning pin according to the present invention.
Wherein the numerical references have the following meanings:
100-a chemical mechanical polishing apparatus;
10-a polishing disk;
20-a polishing pad;
30-a wafer carrier; 31-a carrier head; 32-an upper drive unit; 33-a connecting assembly; 331 a-lower flange; 331 b-an upper flange; 332-positioning pins; 3321a, 3321b, 3321 c-nonmetal structure; 333a, 333 b-dowel pin holes; 334a, 334 b-air holes;
40-a trimming device; 41-trimming arm; 42-trimming the head;
50-polishing liquid supply device.
Detailed Description
The technical solution of the present invention will be described in detail with reference to the following embodiments and accompanying drawings. The embodiments described herein are specific embodiments of the present invention for the purpose of illustrating the concepts of the invention; the description is intended to be illustrative and exemplary and should not be taken to limit the scope of the invention. In addition to the embodiments described herein, those skilled in the art will be able to employ other technical solutions which are obvious based on the disclosure of the claims and the specification thereof, and these technical solutions include technical solutions which make any obvious replacement or modification of the embodiments described herein.
The drawings in the present specification are schematic views to assist in explaining the concept of the present invention, and schematically show the shapes of respective portions and their mutual relationships. It should be understood that the drawings are not necessarily to scale, the same reference numerals being used to identify the same elements in the drawings in order to clearly show the structure of the elements of the embodiments of the invention.
It should be noted that the wafer in the present invention is sometimes referred to as "substrate" or "substrate" in the industry, and the meaning is generally the same, and in most cases is not differentiated in the CMP field. In addition, in view of the major components and structures of the carrier head, and the innovative point of the present invention is the special structure of the connecting flange, the present invention omits the description of the specific structure and components of the carrier head in the prior art, and the contents of the present invention can be referred to in the prior art.
Fig. 1 shows a chemical mechanical polishing apparatus 100 including a polishing pad 10, a polishing pad 20, a wafer carrier 30, a dressing apparatus 40, and a slurry supply apparatus 50; the polishing pad 20 is disposed on the upper surface of the polishing disk 10 and rotates therewith along the axis Ax 1; a horizontally movable wafer carrier 30 disposed above the polishing pad 20, and having a lower surface holding a wafer W to be polished; the dressing device 40 comprises a dressing arm 41 and a dressing head 42, wherein the dressing arm 41 drives the rotating dressing head 42 to swing so as to dress the surface of the polishing pad 20 to a state suitable for polishing; the polishing liquid supply device 50 distributes the polishing liquid on the surface of the polishing pad 20; during the polishing operation, the wafer carrier 30 presses the surface of the wafer W to be polished against the surface of the polishing pad 20, and the polishing liquid is distributed between the polishing pad 20 and the wafer W, so as to remove the surface material of the wafer under the action of the chemical mechanical process.
As shown in fig. 2, the wafer carrier 30 includes a carrier head 31 and an upper driving unit 32 (UPA), the carrier head 31 is coupled to the upper driving unit 32 through a connecting assembly 33, the connecting assembly 33 includes a lower flange 331a, an upper flange 331b, at least one positioning pin 332, and a collar (not shown); a lower flange 331a is provided at the top of the carrier head 31 for connection to an upper flange 331b at the bottom of the upper drive unit 32.
Fig. 3 shows a carrier head 31 of a wafer carrier 30 according to the present invention, the top lower flange 331a of which is configured with at least one positioning pin 332, at least one positioning pin hole 333a and a plurality of air holes 334a for communicating with air passages of an upper driving unit 32; fig. 4 shows the upper driving unit 32 of the wafer carrier 30 according to the present invention, wherein the upper flange 331b of the bottom is configured with at least one positioning pin 332, at least one positioning pin hole 333b and a plurality of air holes 334b, and the air holes 334a of the carrier head 31 and the air holes 334b of the upper driving unit 32 are respectively connected in a gas-tight alignment so that the upper driving unit 32 can adjust the pressure formula of the carrier head 31 by introducing/exhausting gas into/from the carrier head 31. As an alternative embodiment, two positioning pins 332 and corresponding positioning pin holes may be disposed only on the upper flange 331b or the lower flange 331 a.
When assembling and/or maintaining, the carrier head 31 is lifted to be accurately assembled to the upper driving unit 32, so that the positioning pins 332 of the carrier head 31 are inserted into the positioning pin holes 333b of the upper driving unit 32 and/or the positioning pins 332 of the upper driving unit 32 are inserted into the positioning pin holes 333a of the carrier head 31, so as to ensure that the air holes 334a of the carrier head 31 and the air holes 334b of the upper driving unit 32 are precisely aligned with each other, and the lower flange 331a and the upper flange 331b are fastened by unshown clips, thereby achieving the assembling connection of the carrier head 31 and the upper driving unit 32.
As an embodiment of the present invention, as shown in fig. 2, the main bodies of the lower flange 331a, the upper flange 331b and the positioning pins 332 are made of a metal material, and at least one end surface of the positioning pins 332 and/or the adjacent portions thereof have a non-metal structure, and since the non-metal structure has a hardness much lower than that of the metal flange, the non-metal structure can contact with each other to prevent the positioning pins 332 from being inserted into the positioning pin holes 333a, 333b in a misaligned manner to damage the surface of the flange and generate metal contamination including metal chips and/or metal particles, thereby preventing scratching the wafer or affecting the yield of wafer polishing.
Fig. 5a shows an embodiment variation of the positioning pin 332 according to the present invention, wherein the non-metallic structure 3321a is sleeved on the end of the positioning pin 332, the end of the positioning pin 332 is formed in a truncated cone shape, and the upper end diameter of the non-metallic structure 3321a is smaller than the lower end diameter thereof, so that the positioning pin 332 is easily aligned with the positioning pin holes 333a, 333b and is prevented from being misaligned to damage the surface of the flange plate to generate metal chips and/or metal particles. As a variation of this embodiment, as shown in fig. 5b, the outer end of the assembly formed by the non-metal structure 3321b and the positioning pin 332 is a cylindrical structure, and an edge of the cylindrical structure is chamfered by an arc; as a variation of this embodiment, as shown in fig. 5c, the non-metal structure 3321c may be only disposed at the circumferential edge of the positioning pin 332, i.e. the non-metal structure 3321c covers the edge of the positioning pin 332, so as to prevent the positioning pin 332 from being inserted into the positioning pin holes 333a, 333b in a misaligned manner and the edge of the positioning pin 332 made of a metal material directly contacts with the metal flanges 331a, 331b to generate metal contamination such as metal chips and/or metal particles.
In view of the need to strictly prevent the contamination of aluminum ions during the wafer manufacturing process, as an aspect of this embodiment, the lower flange 331a, the upper flange 331b and the positioning pin 332 are made of a hard metal material without aluminum element, such as stainless steel or titanium alloy, so that the amount of aluminum ions can be reduced in the polishing environment and the metal contamination can be controlled within a desired range.
As another variation of the embodiment of the present invention, the non-metal structure may cover the entire surface of the outer periphery of the positioning pin 332 or the entire outer surface of the positioning pin 332, and when the carrier head 31 is connected to the upper driving unit 32, the non-metal structure is disposed such that no metal contamination is generated when the positioning pin 332 contacts the lower flange 331a and the upper flange 331 b.
As another variation of the embodiment of the invention, non-metallic structure 3321 has a thickness, preferably non-metallic structure 3321 has a thickness of 0.3mm to 3mm, preferably non-metallic structure 3321 shown in fig. 5a, 5b and 5c has a thickness of 1.2 mm.
As another variation of the embodiment of the present invention, the non-metal structure 3321 is made of at least one material selected from plastic, ceramic and glass, preferably, the plastic is hard engineering plastic. In some embodiments, the rigid engineering plastic may be rigid polyvinyl chloride, polyethylene, plexiglass, polypropylene, polystyrene, polytetrafluoroethylene, nylon, PET, ABS, PEEK, and/or PPS. In the embodiment shown in fig. 5a, non-metallic structure 3321 may be made of PEEK. As one aspect of this embodiment, the non-metal structure 3321 is made of reinforced composite plastic containing fiber and/or graphene, and on the premise that metal contaminants are not generated when the positioning pin 332 is in contact with the lower flange 331a and the upper flange 331b, the fiber and/or graphene can improve the strength of the positioning pin 332, prevent the positioning pin 332 from being damaged in the process of transmitting torque between the upper driving unit 32 and the carrier head 31, and ensure the normal operation of the wafer carrier device; the fiber can be one or more of glass fiber, carbon fiber, boron fiber, aramid fiber, silicon carbide fiber, asbestos fiber and the like for enhancing the strength of plastic, the length of the fiber is 0.2mm to 12mm, preferably 1mm to 5mm, and the weight proportion of the fiber material is 5% to 50%, preferably 15% to 25%.
As an embodiment of the present invention, the lower flange 331a and the upper flange 331b are made of a metallic material and the positioning pins 332 are entirely made of a non-metallic material. In some embodiments, the non-metallic material is ceramic, glass, rigid polyvinyl chloride, polyethylene, plexiglass, polypropylene, polystyrene, polytetrafluoroethylene, nylon, PET, ABS, PEEK, and/or PPS. Preferably, the non-metallic material contains fibers and/or graphene to reinforce the strength of the positioning pin, and prevent the positioning pin 332 from being damaged when torque is transmitted between the upper driving unit 32 and the carrier head 31, so as to ensure the normal operation of the wafer carrier device, wherein the fibers may be one or more of glass fibers, carbon fibers, boron fibers, aramid fibers, silicon carbide fibers, asbestos fibers, etc. for reinforcing the strength of plastics, and the length of the fibers is 0.2mm to 12mm, preferably 1mm to 5 mm. The positioning pins 332 made of a non-metallic material can prevent metal contamination from being generated when they contact the lower flange 331a and the upper flange 331 b.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A carrier head for chemical mechanical polishing comprising a flange disposed at the top of the carrier head for mounting the carrier head to a drive unit, the flange having positioning pins whose bodies are made of a metal material and whose surfaces are partially or entirely provided with a non-metal structure to avoid abrasion.
2. The carrier head of claim 1, wherein the non-metallic structure is provided at an end face of the dowel for insertion into a dowel hole of a drive unit.
3. The carrier head of claim 1 or 2, wherein the non-metallic structure is formed as a circular truncated cone, a diameter of a bottom surface of the circular truncated cone combined with the positioning pin is equal to a diameter of a combined surface of the positioning pin, and a diameter of a top surface of the circular truncated cone is equal to or less than the diameter of the positioning pin.
4. The carrier head of claim 1 or 2, wherein the non-metallic structure is made of at least one of plastic, ceramic, and glass.
5. The carrier head of claim 4, wherein the plastic is a hard engineering plastic.
6. The carrier head of claim 5, wherein the rigid engineering plastic is rigid polyvinyl chloride, polyethylene, plexiglass, polypropylene, polystyrene, polytetrafluoroethylene, nylon, PET, ABS, PEEK, and/or PPS.
7. The carrier head of claim 1 or 2, wherein the non-metallic structure is made of a composite plastic containing fibers and/or graphene.
8. The carrier head of claim 1 or 2, wherein the metallic material is a hard metallic material that does not contain elemental aluminum.
9. The utility model provides a wafer bears device, is including bearing head and upper portion drive unit, the bearing head is coupled to through coupling assembling upper portion drive unit, coupling assembling includes locating pin and two ring flanges that have the locating pin hole, the locating pin sets up in the ring flange of the bottom of upper portion drive unit and/or sets up in the ring flange at the top of bearing the head, the part or whole surface of locating pin are provided with non-metallic structure and make the locating pin with the ring flange contacts each other and do not produce wearing and tearing and/or do not produce metal contamination.
10. The utility model provides a wafer bearing device, is including bearing head and upper portion drive unit, the bearing head is coupled to through coupling assembling upper portion drive unit, coupling assembling includes locating pin and two ring flanges that have the locating pin hole, the locating pin sets up in the ring flange of the bottom of upper portion drive unit and/or sets up in the ring flange at the top of bearing the head, the locating pin is made by non-metallic material, makes the locating pin with the ring flange contacts each other and does not produce wearing and tearing and/or do not produce metal contamination.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2019108643191 | 2019-09-12 | ||
| CN201910864319.1A CN110450045A (en) | 2019-09-12 | 2019-09-12 | A kind of wafer bearing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110834269A true CN110834269A (en) | 2020-02-25 |
Family
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Family Applications (5)
| Application Number | Title | Priority Date | Filing Date |
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| CN201910864319.1A Pending CN110450045A (en) | 2019-09-12 | 2019-09-12 | A kind of wafer bearing device |
| CN201922441800.8U Active CN213917711U (en) | 2019-09-12 | 2019-12-30 | Drive assembly for bearing head |
| CN201922437347.3U Active CN212240553U (en) | 2019-09-12 | 2019-12-30 | Bearing head for chemical mechanical polishing and wafer bearing device |
| CN201911398830.3A Pending CN110834269A (en) | 2019-09-12 | 2019-12-30 | Bearing head for chemical mechanical polishing and wafer bearing device |
| CN201911398791.7A Pending CN110861000A (en) | 2019-09-12 | 2019-12-30 | Driving assembly for bearing head and wafer bearing device |
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| CN201910864319.1A Pending CN110450045A (en) | 2019-09-12 | 2019-09-12 | A kind of wafer bearing device |
| CN201922441800.8U Active CN213917711U (en) | 2019-09-12 | 2019-12-30 | Drive assembly for bearing head |
| CN201922437347.3U Active CN212240553U (en) | 2019-09-12 | 2019-12-30 | Bearing head for chemical mechanical polishing and wafer bearing device |
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| CN201911398791.7A Pending CN110861000A (en) | 2019-09-12 | 2019-12-30 | Driving assembly for bearing head and wafer bearing device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111469049A (en) * | 2020-04-18 | 2020-07-31 | 华海清科股份有限公司 | Polishing head with self-adaptability |
| CN116372801A (en) * | 2023-04-12 | 2023-07-04 | 华海清科股份有限公司 | Bearing assembly and chemical mechanical polishing system |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110450045A (en) * | 2019-09-12 | 2019-11-15 | 清华大学 | A kind of wafer bearing device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005066712A (en) * | 2003-08-26 | 2005-03-17 | Mitsubishi Materials Techno Corp | Polishing machine, and method of manufacturing sheet |
| CN212240553U (en) * | 2019-09-12 | 2020-12-29 | 清华大学 | Bearing head for chemical mechanical polishing and wafer bearing device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7040957B2 (en) * | 2002-08-14 | 2006-05-09 | Novellus Systems Inc. | Platen and manifold for polishing workpieces |
| TWI359451B (en) * | 2006-11-29 | 2012-03-01 | Univ Nat Taiwan Science Tech | Chemical mechanical polishing apparatus and polish |
| JP6252734B2 (en) * | 2013-08-14 | 2017-12-27 | シーエヌユーエス カンパニー，リミテッド | Retainer ring structure for chemical mechanical polishing apparatus and method for manufacturing the same |
| TW201725092A (en) * | 2016-01-14 | 2017-07-16 | jian-zhong Sun | Polishing retaining ring of chemical mechanical polishing process for semiconductor wafer having progressive features of weight reduction, good strength, cost reduction, process reduction, and reduction of rust |
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2019
- 2019-09-12 CN CN201910864319.1A patent/CN110450045A/en active Pending
- 2019-12-30 CN CN201922441800.8U patent/CN213917711U/en active Active
- 2019-12-30 CN CN201922437347.3U patent/CN212240553U/en active Active
- 2019-12-30 CN CN201911398830.3A patent/CN110834269A/en active Pending
- 2019-12-30 CN CN201911398791.7A patent/CN110861000A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005066712A (en) * | 2003-08-26 | 2005-03-17 | Mitsubishi Materials Techno Corp | Polishing machine, and method of manufacturing sheet |
| CN212240553U (en) * | 2019-09-12 | 2020-12-29 | 清华大学 | Bearing head for chemical mechanical polishing and wafer bearing device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111469049A (en) * | 2020-04-18 | 2020-07-31 | 华海清科股份有限公司 | Polishing head with self-adaptability |
| CN111469049B (en) * | 2020-04-18 | 2020-10-27 | 华海清科股份有限公司 | Polishing head with self-adaptability |
| CN116372801A (en) * | 2023-04-12 | 2023-07-04 | 华海清科股份有限公司 | Bearing assembly and chemical mechanical polishing system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN212240553U (en) | 2020-12-29 |
| CN213917711U (en) | 2021-08-10 |
| CN110861000A (en) | 2020-03-06 |
| CN110450045A (en) | 2019-11-15 |
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