CN110444648A - 微型发光二极管阵列显示背板及其制造方法和修复方法 - Google Patents
微型发光二极管阵列显示背板及其制造方法和修复方法 Download PDFInfo
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- CN110444648A CN110444648A CN201910687499.0A CN201910687499A CN110444648A CN 110444648 A CN110444648 A CN 110444648A CN 201910687499 A CN201910687499 A CN 201910687499A CN 110444648 A CN110444648 A CN 110444648A
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- 238000002844 melting Methods 0.000 claims abstract description 11
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- 239000000155 melt Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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Abstract
Description
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910687499.0A CN110444648B (zh) | 2019-07-29 | 2019-07-29 | 微型发光二极管阵列显示背板及其制造方法和修复方法 |
PCT/CN2020/085550 WO2021017537A1 (zh) | 2019-07-29 | 2020-04-20 | 微型发光二极管阵列显示背板及其制造方法和修复方法 |
Applications Claiming Priority (1)
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CN201910687499.0A CN110444648B (zh) | 2019-07-29 | 2019-07-29 | 微型发光二极管阵列显示背板及其制造方法和修复方法 |
Publications (2)
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CN110444648A true CN110444648A (zh) | 2019-11-12 |
CN110444648B CN110444648B (zh) | 2020-09-04 |
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CN201910687499.0A Expired - Fee Related CN110444648B (zh) | 2019-07-29 | 2019-07-29 | 微型发光二极管阵列显示背板及其制造方法和修复方法 |
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WO (1) | WO2021017537A1 (zh) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110931627A (zh) * | 2019-11-27 | 2020-03-27 | 南京中电熊猫平板显示科技有限公司 | 一种微型发光二极管显示背板及其制造方法 |
CN111490143A (zh) * | 2020-04-20 | 2020-08-04 | 南京中电熊猫平板显示科技有限公司 | 一种显示背板及其制造方法、微型发光二极管显示器 |
CN111883472A (zh) * | 2020-06-29 | 2020-11-03 | 南京中电熊猫液晶显示科技有限公司 | 微型发光二极管显示器的制造方法和修补方法 |
WO2021017537A1 (zh) * | 2019-07-29 | 2021-02-04 | 南京中电熊猫液晶显示科技有限公司 | 微型发光二极管阵列显示背板及其制造方法和修复方法 |
CN112490176A (zh) * | 2020-12-02 | 2021-03-12 | 南京中电熊猫液晶显示科技有限公司 | 一种微型发光二极管的转移结构及其方法 |
CN112968105A (zh) * | 2020-04-24 | 2021-06-15 | 重庆康佳光电技术研究院有限公司 | 一种Micro LED芯片巨量转移方法及一种显示背板 |
CN112993134A (zh) * | 2020-06-03 | 2021-06-18 | 重庆康佳光电技术研究院有限公司 | 微型led的绑定方法、显示背板以及显示装置 |
WO2021142960A1 (zh) * | 2020-01-13 | 2021-07-22 | 南京中电熊猫液晶显示科技有限公司 | 一种微型发光二极管显示背板及其制造方法 |
CN113409699A (zh) * | 2020-03-16 | 2021-09-17 | 重庆康佳光电技术研究院有限公司 | 一种便于修复的led显示器及其修复方法 |
CN113471346A (zh) * | 2020-03-31 | 2021-10-01 | 成都辰显光电有限公司 | 一种微发光二极管的修复方法 |
CN113964147A (zh) * | 2021-10-21 | 2022-01-21 | 上海天马微电子有限公司 | 显示面板及其组装方法、显示装置 |
CN115156654A (zh) * | 2021-11-15 | 2022-10-11 | 武汉帝尔激光科技股份有限公司 | 一种mini led芯片修复方法及装置 |
CN116230723A (zh) * | 2023-05-09 | 2023-06-06 | 惠科股份有限公司 | 显示面板、显示装置及其修补方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1728783A (zh) * | 2004-07-29 | 2006-02-01 | 索尼株式会社 | 固态成像装置、其制造和驱动方法和照相机 |
US8518204B2 (en) * | 2011-11-18 | 2013-08-27 | LuxVue Technology Corporation | Method of fabricating and transferring a micro device and an array of micro devices utilizing an intermediate electrically conductive bonding layer |
CN105518888A (zh) * | 2015-09-09 | 2016-04-20 | 歌尔声学股份有限公司 | 微发光二极管的修复方法、制造方法、装置及电子设备 |
CN105576088A (zh) * | 2015-11-06 | 2016-05-11 | 友达光电股份有限公司 | 转置微元件的方法 |
CN105814698A (zh) * | 2013-12-27 | 2016-07-27 | 勒克斯维科技公司 | 具有内部限制的电流注入区域的led |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107851586B (zh) * | 2015-01-23 | 2021-07-06 | 维耶尔公司 | 到受体衬底的选择性微型器件转移 |
US10177016B2 (en) * | 2015-08-18 | 2019-01-08 | Goertek Inc. | Pre-screening method, manufacturing method, device and electronic apparatus of micro-LED |
CN110444648B (zh) * | 2019-07-29 | 2020-09-04 | 南京中电熊猫平板显示科技有限公司 | 微型发光二极管阵列显示背板及其制造方法和修复方法 |
-
2019
- 2019-07-29 CN CN201910687499.0A patent/CN110444648B/zh not_active Expired - Fee Related
-
2020
- 2020-04-20 WO PCT/CN2020/085550 patent/WO2021017537A1/zh active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1728783A (zh) * | 2004-07-29 | 2006-02-01 | 索尼株式会社 | 固态成像装置、其制造和驱动方法和照相机 |
US8518204B2 (en) * | 2011-11-18 | 2013-08-27 | LuxVue Technology Corporation | Method of fabricating and transferring a micro device and an array of micro devices utilizing an intermediate electrically conductive bonding layer |
CN105814698A (zh) * | 2013-12-27 | 2016-07-27 | 勒克斯维科技公司 | 具有内部限制的电流注入区域的led |
CN105518888A (zh) * | 2015-09-09 | 2016-04-20 | 歌尔声学股份有限公司 | 微发光二极管的修复方法、制造方法、装置及电子设备 |
CN105576088A (zh) * | 2015-11-06 | 2016-05-11 | 友达光电股份有限公司 | 转置微元件的方法 |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021017537A1 (zh) * | 2019-07-29 | 2021-02-04 | 南京中电熊猫液晶显示科技有限公司 | 微型发光二极管阵列显示背板及其制造方法和修复方法 |
CN110931627A (zh) * | 2019-11-27 | 2020-03-27 | 南京中电熊猫平板显示科技有限公司 | 一种微型发光二极管显示背板及其制造方法 |
WO2021142960A1 (zh) * | 2020-01-13 | 2021-07-22 | 南京中电熊猫液晶显示科技有限公司 | 一种微型发光二极管显示背板及其制造方法 |
CN113409699A (zh) * | 2020-03-16 | 2021-09-17 | 重庆康佳光电技术研究院有限公司 | 一种便于修复的led显示器及其修复方法 |
CN113471346A (zh) * | 2020-03-31 | 2021-10-01 | 成都辰显光电有限公司 | 一种微发光二极管的修复方法 |
CN111490143A (zh) * | 2020-04-20 | 2020-08-04 | 南京中电熊猫平板显示科技有限公司 | 一种显示背板及其制造方法、微型发光二极管显示器 |
CN111490143B (zh) * | 2020-04-20 | 2021-07-13 | 南京中电熊猫液晶显示科技有限公司 | 一种显示背板及其制造方法、微型发光二极管显示器 |
CN112968105A (zh) * | 2020-04-24 | 2021-06-15 | 重庆康佳光电技术研究院有限公司 | 一种Micro LED芯片巨量转移方法及一种显示背板 |
CN112968105B (zh) * | 2020-04-24 | 2021-12-21 | 重庆康佳光电技术研究院有限公司 | 一种Micro LED芯片巨量转移方法及一种显示背板 |
CN112993134B (zh) * | 2020-06-03 | 2022-04-29 | 重庆康佳光电技术研究院有限公司 | 微型led的绑定方法、显示背板以及显示装置 |
CN112993134A (zh) * | 2020-06-03 | 2021-06-18 | 重庆康佳光电技术研究院有限公司 | 微型led的绑定方法、显示背板以及显示装置 |
CN111883472A (zh) * | 2020-06-29 | 2020-11-03 | 南京中电熊猫液晶显示科技有限公司 | 微型发光二极管显示器的制造方法和修补方法 |
CN112490176A (zh) * | 2020-12-02 | 2021-03-12 | 南京中电熊猫液晶显示科技有限公司 | 一种微型发光二极管的转移结构及其方法 |
CN113964147A (zh) * | 2021-10-21 | 2022-01-21 | 上海天马微电子有限公司 | 显示面板及其组装方法、显示装置 |
CN115156654A (zh) * | 2021-11-15 | 2022-10-11 | 武汉帝尔激光科技股份有限公司 | 一种mini led芯片修复方法及装置 |
CN116230723A (zh) * | 2023-05-09 | 2023-06-06 | 惠科股份有限公司 | 显示面板、显示装置及其修补方法 |
US12107206B1 (en) | 2023-05-09 | 2024-10-01 | HKC Corporation Limited | Display panel, display device and repair method thereof |
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WO2021017537A1 (zh) | 2021-02-04 |
CN110444648B (zh) | 2020-09-04 |
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Effective date of registration: 20200827 Address after: No.7 Tianyou Road, Qixia District, Nanjing City, Jiangsu Province Patentee after: NANJING CEC PANDA LCD TECHNOLOGY Co.,Ltd. Address before: Nanjing Crystal Valley Road in Qixia District of Nanjing City Tianyou 210033 Jiangsu province No. 7 Co-patentee before: NANJING CEC PANDA LCD TECHNOLOGY Co.,Ltd. Patentee before: NANJING CEC PANDA FPD TECHNOLOGY Co.,Ltd. Co-patentee before: NANJING HUADONG ELECTRONICS INFORMATION & TECHNOLOGY Co.,Ltd. |
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