CN1104372A - Apparatus for coating base sheet of semiconductor products with film - Google Patents

Apparatus for coating base sheet of semiconductor products with film Download PDF

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Publication number
CN1104372A
CN1104372A CN94115782A CN94115782A CN1104372A CN 1104372 A CN1104372 A CN 1104372A CN 94115782 A CN94115782 A CN 94115782A CN 94115782 A CN94115782 A CN 94115782A CN 1104372 A CN1104372 A CN 1104372A
Authority
CN
China
Prior art keywords
substrate
spin coating
guard circle
filming
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN94115782A
Other languages
Chinese (zh)
Other versions
CN1042861C (en
Inventor
E·米尔弗里德
M·卡利斯
K·阿皮希
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hama Technologies AG
Hama Technology Ape Lianghe
Singulus Technologies AG
Original Assignee
Steag Microtech GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from SG1995001632A external-priority patent/SG41944A1/en
Application filed by Steag Microtech GmbH filed Critical Steag Microtech GmbH
Publication of CN1104372A publication Critical patent/CN1104372A/en
Application granted granted Critical
Publication of CN1042861C publication Critical patent/CN1042861C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/105—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material by capillary action, e.g. using wicks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/02—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to surfaces by single means not covered by groups B05C1/00 - B05C7/00, whether or not also using other means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005—Spin coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)

Abstract

The invention concerns a device for coating substrates. The coating material is first applied to the substrate by means of a capillary slit, and in a subsequent centrifuging operation the film is made uniform and reduced in thickness.

Description

Apparatus for coating base sheet of semiconductor products with film
The present invention relates to a kind of device of filming to semiconductor chip in two steps.The first step, make substrate wait be coated with the surface down, fill with the opening capillary gap that applies solvent or glue by what a traverse, will apply solvent or glue is coated on the substrate.Second step made the surface of having filmed still down, made the thickness of glue-line become more even thinner by spin coating.
In the semiconductor production field,, apply its initial state of layer of even on be everlasting rectangle or the circular substrate and be the glued membrane of liquid or be coated with membrane solvent for making colour filter or special protection layer.On the device of this class routine, be with substrate wait be coated with the surface up, be fixed on the platform that can horizontally rotate.With a certain amount of glue or be coated with membrane solvent and drop in substrate center from above by a spout.Start turntable then.In rotatablely moving, make liquid distribution on whole substrate by action of centrifugal force.Wherein most of liquid is got rid of through substrate edge.With this kind method the uniformity of getable bed thickness relevant with rotary acceleration and rotary speed.
The shortcoming of this known method is that the glue that is coated with is got rid of through substrate edge up to 95%.These glue that got rid of can not be used again, thereby slattern in process of production.
Liquid through a very narrow open slot, by capillarity and adhesion effect, is coated in liquid and waits to be coated with ventricumbent substrate surface, implement improvement this gluing and coating method.
This device for example in thin-film technique, is specially adapted to the gluing or the coating process of the sort of big substrate of picture LCDs.Yet, adopt this uniformity of installing the film thickness that can reach, for making the base wafer glue coating of highly integrated circuit, not all to be satisfied in all cases.
Therefore, one object of the present invention is, according to above-mentioned criterion known gluing and coating process is improved, and reaches in the semiconductor chip coating process requirement to the film thickness high uniformity.
The principal character of device of filming to substrate in two steps of the present invention is:
One give substrate wait to be coated with the device for demonstrating capillarity that surperficial precoating layer is coated with membrane solvent; And
One makes the substrate rotation so that the more even thinner device that becomes in rotary course of filming.
In the first step, give by capillary gap and to wait to be coated with surface substrate down and apply glued membrane.Then, make the surface of precoating make the substrate rotation with suitable rotary speed down.Thereby centrifugal action causes a kind of outside displacement force on glue-line.Certainly in glue-line, must between displacement force and adhesion, reach a kind of balance.To move to substrate edge with substrate surface or with the too small that part of glue of the adhesion of lower floor glued membrane, the part of glue is got rid of through the edge.Therefore, make the thickness of the glue-line on the substrate surface become more even, and overall attenuate.
Show that it is particularly advantageous applying glued membrane in the precoating step to substrate surface.For the usefulness of subsequently spin coating proceeding provides optimum condition.
According to a preferred embodiment of the invention, this device also comprises the holding device of a sticking substrate, and this device comprises that its driving shaft links the motor of holding device and one and be connected the free-ended rotating disk of driving shaft.This is particularly advantageous, because of in precoating with subsequently in spin coating proceeding (the being commonly called as whirl coating) process, can by same holding device keep substrate wait be coated with the surface down.
Best, this device comprises a straight line conveyer again, and close device for demonstrating capillarity and spin coating device (device for liquid adhesive) mutually is set therein, and this straight line conveyer is sent to spin coating device with substrate from device for demonstrating capillarity.This straight line conveyer is horizontal setting basically, and be used for substrate from the loading terminal to the discharge terminal transmission and be transmission between device for demonstrating capillarity and the spin coating device at two treating stations.Also in the middle of the precoating step, provide substrate to cross the desired uniform motion of capillary gap in addition.
In more advantageous embodiment of the present invention, spin coating device comprises that a cross section is the U-shaped guard circle that has some hypotenuses.In the middle of the spin coating process, this guard circle is placed so that collect the glue that is thrown out of and apply solvent around substrate.To collect and dredge away through coating solvent or the glue that substrate edge throws away with guard circle of the present invention.
Preferably spin coating device comprises a device that guard circle is dropped to the resting position that is lower than substrate between twice spin coating operation again.By this reduction device, just can substrate be stood erectly to connect from precoating along its horizontal route be sent to the spin coating station unblockedly.When substrate arrived the target location of spin coating device, this guard circle moved up up to the height of substrate, so that carry out its function in the spin coating proceeding process.
Preferably this device comprises that also one installs to loading terminal and the discharge terminal that substrate is taken off from spin coating device of holding device with substrate, so that the operation fully automatically of this device.This full automatic operation is suitable for the requirement of the manufacture craft of semi-conductor industry, and the effect of reproducible uniform coating also is provided for production in enormous quantities.
The invention still further relates to the method for filming to substrate.According to the present invention, the principal character of this method is the following step:
Wait that with what a device for demonstrating capillarity was given substrate being coated with surperficial precoating layer applies filming of solvent; With
This substrate of rotation becomes more even, thinner so that this is filmed in rotary manipulation in spin coating device.
Preferably this method also is included in to control in precoating and the spin coating process and waits to be coated with surface location so that wait to be coated with surface step down.
Advantageously this method also comprises the step with holding device sticking substrate, and this holding device comprises that again its driving shaft is connected to the motor of holding device and one and is connected the free-ended rotating platform of driving shaft.
Preferably this method also comprises the step that is used in close mutually device for demonstrating capillarity of settling and the transmission of the straight line conveyer between spin coating device substrate.
Advantageously this method further comprises the step of control guard circle position, and the cross section of this circle is the U-shaped section that has hypotenuse, is in the position around substrate in the spin coating process, and collects the membrane solvent that is coated with that is thrown out of with this guard circle.
Advantageously this method also is included in the step that between twice spin coating operation guard circle is reduced to the resting position that is lower than substrate.
This method preferably further comprises the step that automatically substrate is installed to holding device and automatically take off substrate from spin coating device with discharge terminal with loading terminal, realizes the full automation of this method with this.
In conjunction with the accompanying drawings, by following elaboration, above-mentioned purpose of the present invention and other purpose advantage are had more clearly understanding.
Fig. 1 is the general structure end view of gluing of the present invention and coating device;
Fig. 2 is the perspective illustration as the pre-coating device of a device part shown in Figure 1;
Fig. 3 represents the perspective illustration of the spin coating device of coating device shown in Figure 1.
Now, by several specific embodiments, use Fig. 1-Fig. 3 to elaborate the present invention.
Fig. 1 represents first embodiment of coating device 10 of the present invention.The guard circle 22 or the spin coating station 13 that are not only connecting the glue groove 12 and the spin coating device of precoating step on base 11 are also connecting the pillar 14 and 15 of straight line conveyer 16.At the moveable part of straight line conveyer 16, connecting the holding device that comprises a rotation motor 17 and a rotating disk 19.Rotating disk 19 is connected on the main shaft 18 of rotation motor 17.Substrate 20 for example leans on vacuum suction on the rolling disc 19 of holding device 19.For this reason, rotating disk 19 is provided with several vacuum holes shown in the figure.Within the scope of the invention, also can adopt the fixture of other form well known to those skilled in the art.
Be used for the open slot that has capillary gap 21 12 of precoating step, figure 1 illustrates its profile, further show its careful perspective view at Fig. 2.
Near device for demonstrating capillarity (precoating station), settle the guard circle 22 at the spin coating station 13 that is used for spin coating proceeding.Guard circle 22 is connected with 24 with one or more pillars 23, can regulate the level height position of guard circle 22 automatically.For example, this can realize with pneumatic actuating element, but also can adopt other device known in those skilled in the art.In the spin coating process.For example, guard circle 22 is moved straight up, until make guard circle 22 surround substrate with suitable method with pillar 23 and 24.In Fig. 2, show the substrate to be coated with of throwing off guard circle 22 and being connected with motor spindle 18 with rotating disk 19.This is the position that dots in Fig. 1, and diagram shows state before or after spin coating proceeding, and in spin coating proceeding, substrate and straight line conveyer 16 are connected in preposition in the spin coating proceeding, and just guard circle 22 moves or decline already on not as yet.In order to make substrate horizontal movement between precoating and spin coating station, the motion up and down of then claimed circle 22 with straight line conveyer 16.
Fig. 1 shows the profile of guard circle 22.Its cross section is the U-shaped section of band hypotenuse.This embodiment can be guaranteed the glue that throws away through substrate edge and apply solvent collection in annular guard ring, and the inner underside of guiding guard circle 22, discharges fully from device of the present invention through the binder removal mouth thus.
As the scheme of the full-automation of this coating unit, can in Fig. 1, an automatic charge station and an automatic discharge terminal be set with 26 and 27 zones that indicate.Feeding device extracts substrate 20 to be coated with from a hopper that in position links to each other with coating unit, is sent to holding device or rotating disk 19 again.Device for discharging receives substrate 20 from rotating disk 19, and drops it off in the hopper that is provided with in the appropriate location of device.
The mode of operation of glue spreading apparatus
In the first step, substrate 20 is fixed on the rotating disk 19 automatically or manually.At this moment, rotating disk 19 is in the position that indicates with label 26 among Fig. 1.Subsequently, straight line conveyer 16 promptly moves to the direction of groove 12 along the direction of arrow 28.
The precoating step has begun in case the forward position of substrate 20 arrives the upper limb of capillary gap 21.Certainly, in the precoating process, substrate crosses the capillary gap 21 of groove 12.
Finish after the precoating step, substrate 20 moves along the direction of arrow 28 with rotating disk 19, motor 17 and driving shaft 18, the central point until guard circle 22 tops, and the guard circle 22 of this moment still is in lower resting position.When substrate 20 reached this position, guard circle 22 moved upward, until in a suitable manner substrate 20 being surrounded by it.Then, the beginning spin coating proceeding by this process, makes on-chip bondline thickness become more even thinner.Unnecessary glue is thrown to guard circle 22, discharges through binder removal mouth 25 again.
After finishing spin coating proceeding, guard circle 22 descends.Subsequently, substrate 20 is sent to the position that shows with label 27 among Fig. 1, takes off substrate from the rotating disk 19 of holding device automatically or manually here with conveyer 16.
Certainly, the present invention never is subjected to the restriction of concrete disclosed specification and accompanying drawing, but also is included in the interior any remodeling of category of appended claim.

Claims (14)

1, a kind of device of filming to substrate in two steps is characterized in that it comprises:
A device for demonstrating capillarity of filming of waiting to be coated with surperficial precoating layer coating solvent of giving substrate; And
A device that makes the substrate rotation is so that it is more even thinner in the spin coating operation spin coating of filming to be got.
2, a kind of device according to claim 1 is characterized in that surface to be coated with is down in precoating and spin coating process.
3, a kind of device according to claim 1 is characterized in that it also comprises the holding device of a fixed substrate, and said device comprises the motor and a rotating disk that is connected with said driving shaft free end that its driving shaft is connected with holding device.
4, a kind of device according to claim 1, it is characterized in that it further comprises a straight line conveyer, wherein said device for demonstrating capillarity and said spin coating device are close mutually the settings, and said straight line conveyer is sent to said spin coating device to substrate from said device for demonstrating capillarity.
5, a kind of device according to claim 1 is characterized in that said spin coating device comprises the guard circle of U-shaped section of its cross section for the band hypotenuse, said guard circle is placed the position around substrate in the spin coating process, so that collect the coating solvent that is thrown out of.
6, a kind of device according to claim 5 is characterized in that said spin coating device comprises that also making said guard circle operate the centre twice spin coating drops to the resting position that is lower than substrate.
7, a kind of device according to claim 4 is characterized in that it comprises that further one installs to loading terminal and the discharge terminal that substrate is taken off from said spin coating device of said holding device to substrate, so that said device is fully automatically operated.
8, a kind of method of filming for substrate 20 is characterized in that comprising the following steps:
With a device for demonstrating capillarity give substrate wait be coated with that surperficial precoating layer is a kind of to apply filming of solvent; And
In a spin coating device, make the substrate rotation, so that it is more even thinner in the spin coating operation spin coating of filming to be got.
9, a kind of device according to Claim 8 is characterized in that it further is included in precoating and the spin coating process position that control waits to be coated with the surface, makes it ventricumbent step.
10, a kind of device according to Claim 8, it is characterized in that it comprises that also this holding device comprises the motor and a rotating disk that is connected with said driving shaft free end that its driving shaft is connected with holding device with the step of holding device sticking substrate.
11, a kind of device according to Claim 8 is characterized in that it further comprises with the straight line conveyer in the step that transmits substrate mutually between close said device for demonstrating capillarity that is provided with and the said spin coating device.
12, a kind of device according to Claim 8 is characterized in that it also is included in the spin coating process its cross section is that the guard circle that has a U-shaped section of hypotenuse places the position around substrate, and the step of collecting the coating solvent that is thrown out of with said guard circle.
13, a kind of method according to claim 12 is characterized in that it further is included in the step that between twice spin coating operation said guard circle is lowered to the resting position that is lower than substrate.
14, a kind of method according to Claim 8 is characterized in that it also comprises with loading terminal substrate is installed to said holding device automatically and with discharge terminal substrate to be taken off from spin coating device automatically, thereby makes said method realize full automatic step.
CN94115782A 1993-08-26 1994-08-23 Apparatus for coating base sheet of semiconductor products with film Expired - Lifetime CN1042861C (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DEPCT/DE93/00778 1993-08-26
DEPCT/DE93/0778 1993-08-26
PCT/DE1993/000778 WO1995005901A1 (en) 1993-08-26 1993-08-26 Device for coating substrates in semiconductor manufacture
SG1995001632A SG41944A1 (en) 1993-08-26 1993-08-26 Device for coating substrates in semiconductor production

Publications (2)

Publication Number Publication Date
CN1104372A true CN1104372A (en) 1995-06-28
CN1042861C CN1042861C (en) 1999-04-07

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CN94115782A Expired - Lifetime CN1042861C (en) 1993-08-26 1994-08-23 Apparatus for coating base sheet of semiconductor products with film

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JP (1) JP2657044B2 (en)
CN (1) CN1042861C (en)
WO (1) WO1995005901A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102641823A (en) * 2012-05-14 2012-08-22 中国科学院微电子研究所 Microwave glue homogenizing device and glue homogenizing method
CN104289386A (en) * 2014-09-16 2015-01-21 宁波大学 High-temperature spinning device and method for preparing film
CN107731661A (en) * 2017-11-14 2018-02-23 山东芯诺电子科技股份有限公司 A kind of glassivation chip glass cement painting method and device
TWI622432B (en) * 2014-05-22 2018-05-01 東京威力科創股份有限公司 Coating device
CN109789440A (en) * 2016-09-27 2019-05-21 富士胶片株式会社 The manufacturing method of film

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102744538B (en) * 2012-06-11 2015-01-21 台州欧信环保净化器有限公司 Device for removing paste from wave crest for metal honeycomb carrier

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2046596A (en) * 1932-01-13 1936-07-07 Patent Button Co Apparatus for uniformly coating flat surfaces
JPS5776835A (en) * 1980-10-30 1982-05-14 Nec Corp Apparatus for applying liquid on semiconductor substrate
US4370356A (en) * 1981-05-20 1983-01-25 Integrated Technologies, Inc. Method of meniscus coating
US4590094A (en) * 1984-10-29 1986-05-20 International Business Machines Corporation Inverted apply using bubble dispense
US5199990A (en) * 1990-05-08 1993-04-06 Zeniya Industry Co., Ltd. Apparatus for solder-plating a lead-frame carrying electronic components

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102641823A (en) * 2012-05-14 2012-08-22 中国科学院微电子研究所 Microwave glue homogenizing device and glue homogenizing method
CN102641823B (en) * 2012-05-14 2015-10-28 中国科学院微电子研究所 Microwave glue homogenizing device and glue homogenizing method
TWI622432B (en) * 2014-05-22 2018-05-01 東京威力科創股份有限公司 Coating device
CN104289386A (en) * 2014-09-16 2015-01-21 宁波大学 High-temperature spinning device and method for preparing film
CN104289386B (en) * 2014-09-16 2016-09-21 宁波大学 A kind of high-temperature spin-on device and method preparing thin film
CN109789440A (en) * 2016-09-27 2019-05-21 富士胶片株式会社 The manufacturing method of film
CN107731661A (en) * 2017-11-14 2018-02-23 山东芯诺电子科技股份有限公司 A kind of glassivation chip glass cement painting method and device

Also Published As

Publication number Publication date
JP2657044B2 (en) 1997-09-24
CN1042861C (en) 1999-04-07
WO1995005901A1 (en) 1995-03-02
JPH07232126A (en) 1995-09-05

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