CN110430715B - Method for controlling temperature of cooling liquid outlet of electronic equipment - Google Patents
Method for controlling temperature of cooling liquid outlet of electronic equipment Download PDFInfo
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- CN110430715B CN110430715B CN201910580694.3A CN201910580694A CN110430715B CN 110430715 B CN110430715 B CN 110430715B CN 201910580694 A CN201910580694 A CN 201910580694A CN 110430715 B CN110430715 B CN 110430715B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20381—Thermal management, e.g. evaporation control
Abstract
The invention discloses a method for controlling the temperature of a cooling liquid outlet of electronic equipment, which can solve the problem that the temperature of the cooling liquid outlet breaks through the upper limit when the electronic equipment works in a transient state. The invention is realized by the following technical scheme: selecting a phase change material with a phase change point between the highest working environment temperature and the allowable temperature of key components in the electronic equipment, and packaging the selected phase change material in a phase change expansion valve with one surface made of a flexible heat conduction material; packaging the selected phase-change material in a metal plate to form a phase-change energy storage device; a liquid cooling system comprising a cold plate A, a cold plate B, a phase change energy storage device, a phase change expansion valve and a branch and confluence pipeline is built; the phase change expansion valve is arranged at the downstream of the flow passage of the cold plate A; the upper limit of the temperature of the cooling liquid outlet when the electronic equipment works in a transient state is controlled by utilizing the synergistic effect of the valve effect and the energy storage and release effect of the phase change device, and if the flow channel of the heat transfer heat sink A cold plate is cut off, the phase change energy storage device replaces heat transfer and supplements heat to the heat sink B cold plate.
Description
Technical Field
The invention relates to the field of electronic equipment thermal control, in particular to a method for controlling the temperature of a cooling liquid outlet of electronic equipment.
Background
The thermal control of electronic equipment is measures such as cooling, heating or constant temperature, etc. adopted to ensure that the electronic equipment, elements and devices thereof normally work within a specified temperature range, and heat dissipated by the elements and devices is dissipated to the ambient environment by utilizing heat conduction, convective heat transfer or radiant heat transfer. Common cooling methods used in modern electronic devices are: natural cooling, forced ventilation cooling, liquid cooling, evaporative cooling, vapor-water dual-phase flow cooling, semiconductor refrigeration, heat pipe heat dissipation and the like. The choice of cooling method depends mainly on the surface heating power density of the component, device or apparatus and its allowed temperature rise. When the heat flux density of the electronic equipment is large and the temperature cannot be controlled by forced air cooling, the radiator for forced air cooling must be large, and liquid cooling is usually adopted when the structure is difficult to realize or when the forced air cooling is difficult to use due to small air density of the electronic equipment on a high-altitude platform. Liquid-cooled cooling systems are generally complex, bulky, heavy, expensive and difficult to maintain. According to the cooling mode, liquid cooling can be divided into direct liquid cooling and indirect liquid cooling. Direct cooling is heat exchange performed by direct contact between a cooling liquid and a heat generating component. The heat source transfers heat to the cooling liquid, which transfers the heat away. Indirect liquid cooling means that heating components and assemblies are not in contact with a coolant, electronic equipment components are mounted on a cold plate cooled by liquid, and the generated heat is transferred to the cold plate by heat conduction and then taken away by the coolant. The surface of the indirect liquid cooling cold plate is in close contact with components and parts to form a low thermal resistance passage. The cold plate can be a bottom plate with a cooling pipeline, or two metal plates can be punched into grooves at corresponding positions, and then the two plates are welded into a whole to form the flat tube type cold plate.
The conventional liquid cooling system is composed of cooling liquid, a pump, a cooling liquid unit, a valve, a pipeline, a cold plate (heat exchanger) and the like, the cooling liquid is driven by the pump, is cooled by the cooling liquid unit, flows through a filter, flows through cold plates, absorbs heat generated by a heating device in the cold plate, is collected into the pipeline and is sucked back by the pump to form a closed loop cooling loop, the temperature of the cooling liquid can be adversely affected by the excessively high temperature return of the pipeline, the highest limit value of a part of electronic systems for the outlet temperature of the liquid cooling electronic equipment under the transient working condition is raised, therefore, for the electronic equipment, the upper limit of the temperature of the liquid cooling outlet of the pipeline needs to be controlled, and the temperature rise of the pipeline can be controlled by a constant temperature control method according to a calculation formula of the cooling liquid consumption rate of a cooling liquid controller, so that the temperature rise of the pipeline cannot be controlled by a constant temperature rise control method, and the temperature rise of the cooling liquid can be controlled by a constant temperature control method which is set by a constant PID, and the conventional PID control method, and the temperature rise control method is not easy to reduce the temperature rise of the conventional heat sink temperature control process.
A phase change device, which mainly uses a volume change function according to a temperature change to open and close a fluid path, is generally called a phase change expansion valve. The working principle is as follows: after the phase change material is heated to reach a phase change point, the density of the liquid and the solid of the phase change material can be greatly changed, so that the volume is driven to change. This produces a valve effect, namely: the phase change device in the flow passage can switch the flow passage through temperature change.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, and provides a method for controlling the cooling liquid outlet temperature of electronic equipment, which can reduce the complexity of a liquid cooling control system, has low implementation cost and high reliability and solves the problem of thermal control that the cooling liquid outlet temperature breaks through the upper limit during transient work of the electronic equipment.
The invention realizes the steps of the target method: selecting a phase change material with a phase change point between the highest working environment temperature and the allowable temperature of key components in the electronic equipment, and packaging the selected phase change material in a device with five surfaces made of aluminum alloy and one surface made of flexible heat conduction material to form a phase change expansion valve; packaging the phase change material with the selected phase change point in a metal plate to form a phase change energy storage device; a liquid cooling system comprising a cold plate A, a cold plate B, a phase change energy storage device, a phase change expansion valve and a branch and confluence pipeline is set up, wherein one side of the cold plate A is connected with a heat source through a thermal interface material, and the other side of the cold plate A is connected with the phase change energy storage device; the phase change expansion valve is arranged at the downstream of the flow channel of the cold plate A; the upper limit of the temperature of the cooling liquid outlet when the electronic equipment works in a transient state is controlled through the combined action of the valve effect and the energy storage effect of the phase change device, once the runner of the heat transfer heat sink A cold plate is cut off, the phase change energy storage device conducts substitute heat transfer immediately, and the heat is transferred to the supplement heat sink B cold plate.
Compared with the prior art, the invention has the following beneficial effects:
the complexity of the system is reduced. One side of a cold plate A is connected with a heat source through a thermal interface material, the other side of the cold plate A is connected with a phase change energy storage device, and a phase change expansion valve is arranged at the downstream of a flow passage of the cold plate A; the upper limit of the temperature of the cooling liquid outlet of the electronic equipment during transient operation is controlled only by a pure mechanical control method of a mechanical device through the combined action of the valve effect and the energy storage and release effect of the phase change device, so that the complexity of the liquid cooling control system is greatly reduced. The defect that the traditional temperature control method for opening and closing the valve through a programmable controller PID based on electronic equipment, program setting and a mechanical device, which relates to the temperature control of a plurality of systems and a plurality of components, needs a special development team to realize the control and has high complexity is overcome.
The system cost is reduced. The invention only relates to two core mechanical devices of the phase change expansion valve and the phase change energy storage device, so that a matched program does not need to be developed independently, and the realization cost of the liquid cooling control system is lower. Compared with the traditional PID control method which needs a circuit board, electronic components, a temperature sensor, an electronic valve and a control program to realize, the whole set of system has higher cost and lower realization cost.
The reliability is high. The invention adopts the latent heat of phase change of the phase change material as tens of times, even hundreds of times of specific heat capacity in unit temperature, and the phase change device absorbs a great deal of heat by increasing the enthalpy value of the phase change device. The two characteristics that the volume of the phase change device changes and absorbs a large amount of heat when the phase change device changes the phase are utilized, the temperature of a liquid cooling outlet of the phase change device is controlled by using the heat storage and release function of the phase change device, valve type switch control of a flow channel is realized, and the peak clipping and valley filling effects on the change of heat consumption can be achieved. Under the condition of high heat consumption, the phase change energy storage device can absorb heat and maintain the temperature of the phase change energy storage device near a phase change point, the phase change energy storage device becomes equipment heat sink near the temperature of the phase change point, and the temperature of a heat source is controlled; under the condition of low heat consumption, the phase change energy storage device can release heat, so that the energy storage and release effect is generated. The phase change expansion valve and the phase change energy storage device control the temperature of the outlet while controlling the temperature of the heat source, the heat source is loaded under any heat consumption working condition in a design range, the whole liquid cooling system works normally, the outlet temperature of the cooling liquid is lower than an allowable value, the reliability of the liquid cooling system is improved, and the problem of thermal control that the outlet temperature of the cooling liquid breaks through the upper limit when the electronic equipment works in a transient state is solved. Because the method is realized by a mechanical device, volatile software and hardware such as control programs and electronic devices are not involved, and the reliability is higher than that of the traditional PID control method.
The invention adopts the phase change expansion valve, realizes the opening and closing of the fluid passage by using the volume change function according to the temperature change, the density of the liquid and the solid of the phase change material can be greatly changed after the phase change material is heated to reach the phase change point, thereby driving the volume to change, generating the valve effect, the phase change device in the flow channel can open and close the flow channel through the temperature change, once the flow channel of the original heat transfer heat sink A cold plate is cut off, the phase change energy storage device can immediately carry out the replacement heat transfer, and the heat is transferred to the supplement heat sink B cold plate. By replacing the supplementary heat transfer of the heat sink, the outlet temperature of the cooling liquid of the high-heat-consumption electronic equipment with transient operation can be effectively controlled. Under the working condition of high heat consumption, the temperature of the heat source can be effectively controlled, and the phenomenon that the temperature of the heat source is over-heated due to the fact that the outlet temperature of the cooling liquid is controlled cannot occur. The defects that the traditional PID control method can only control the temperature of the liquid cooling outlet of the electronic equipment, and once the cold plate flow channel is cut off due to overhigh temperature, the heat source loses all heat transfer heat sinks and does not replace the heat sinks to carry out supplementary heat transfer are overcome.
After the invention is applied, the temperature of key heating devices in the electronic equipment and the temperature of the cooling liquid outlet can be controlled simultaneously.
Drawings
FIG. 1 is a schematic view of a liquid cooling system under low heat consumption condition according to the present invention.
FIG. 2 is a schematic diagram of a liquid cooling system under high heat dissipation conditions in accordance with the present invention.
Fig. 3 is a schematic structural view of the phase change expansion valve shown in fig. 1 and 2.
Detailed Description
See fig. 1-3. According to the invention, a phase change material with a phase change point between the highest working environment temperature and the allowable temperature of key components in the electronic equipment is selected, the selected phase change material is packaged in a device with five surfaces made of aluminum alloy and one surface made of flexible heat conduction material to form a phase change expansion valve, and the phase change material with the selected phase change point is packaged in a metal plate to form a phase change energy storage device; a liquid cooling system comprising a cold plate A, a cold plate B, a phase change energy storage device, a phase change expansion valve and a branch and confluence pipeline is set up, wherein one side of the cold plate A is connected with a heat source through a thermal interface material, the other side of the cold plate A is connected with the phase change energy storage device, and the phase change expansion valve is arranged at the downstream of a flow passage of the cold plate A; the upper limit of the temperature of the cooling liquid outlet when the electronic equipment works in a transient state is controlled through the combined action of the valve effect and the energy storage effect of the phase change device, once the runner of the heat transfer heat sink A cold plate is cut off, the phase change energy storage device conducts substitute heat transfer immediately, and the heat is transferred to the supplement heat sink B cold plate.
When a heat source is loaded under the working condition of low heat consumption, the cold plate A and the cold plate B are simultaneously connected, the phase change energy storage device and the phase change expansion valve do not work, and cooling liquid enters the liquid cooling system from the inlet, flows through the cold plate, is heated by the heat source to be heated, and is discharged from the outlet; when a heat source is loaded under the working condition of high heat consumption, the phase change expansion valve positioned at the downstream position of the flow passage of the cold plate A is heated to generate phase change, the volume is obviously expanded, the flow passage of the cold plate A is blocked, the flow passage of the cold plate A is closed, and all cooling liquid passes through the flow passage of the cold plate B; after the liquid is cut off in the A cold plate flow channel, the heat transfer path is changed into: the heat source-A cold plate structural member-phase change energy storage device-B cold plate, namely the heat firstly passes through the phase change energy storage device and then reaches the B cold plate serving as the final heat sink, the phase change energy storage device absorbs the heat, the phase change material is in a phase change state at the phase change point and becomes a liquid state, heat loss lower than the total heat loss of the heat source is released at the contact surface of the phase change material and the B cold plate, the cooling liquid flowing through the flow channel of the B cold plate absorbs lower heat in unit time, and the outlet temperature of the cooling liquid is controlled within an allowable value.
The phase change point of the phase change material in the phase change energy storage device and the phase change expansion valve is between the highest working environment temperature and the allowable temperature of key components in the electronic equipment. Selecting phase change point of phase change material of phase change expansion valve, selecting phase change point T according to the following formulapc,e：Tpc,e＝Tout,max-ΔTeWherein, Tout,maxMaximum temperature allowed at the liquid cooling outlet, Δ TeIs a value taken within a range of 1 ℃ to 10 ℃ depending on the case.
And selecting a phase change material with a proper phase change point, and packaging the phase change material in the metal plate to form the phase change energy storage device. The minimum amount of phase change material in the phase change energy storage device should be calculated according to the following formula: minimum usage m of phase change materialpc,h＝Qtp·ttp/hpWherein Q istpAnd ttpHeat consumption and operating time, h, respectively, under typical high heat consumption conditionspIndicating the latent heat of phase change of the phase change material.
Reference is made to the following examples.
The A cold plate and the B cold plate are in parallel connection in the flow channel structure.
In the case of the example 1, the following examples are given,
when a heat source is loaded under a typical low-heat-consumption working condition, the flow channels of the A cold plate and the B cold plate are simultaneously communicated, the phase change energy storage device and the phase change expansion valve do not work, and cooling liquid flows through the flow channels of the cold plates after entering the liquid cooling system from the inlet, is heated by the heat source to be heated and is discharged from the outlet of the flow channels. At this time, the outlet temperature does not exceed the allowable value due to the low heat consumption condition.
In the case of the example 2, the following examples are given,
the heat source is loaded at typical high heat-sink conditions. And the phase change expansion valve positioned at the downstream position of the flow passage of the cold plate A is heated to generate phase change, the volume of the phase change expansion valve obviously expands to block the flow passage of the cold plate A, the flow passage of the cold plate A is shut off, and all cooling liquid passes through the flow passage of the cold plate B. The heat can reach the B cold plate as the final heat sink after passing through the phase change energy storage device, in the process, the phase change energy storage device absorbs the heat and carries out phase change at the phase change point, the phase change material in the phase change energy storage device becomes liquid, and the heat loss lower than the total heat loss of a heat source is released at the contact surface of the phase change material and the B cold plate. Therefore, the cooling liquid flowing through the flow passage of the B cold plate only needs to absorb lower heat per unit time, so that the outlet temperature of the cooling liquid is controlled within an allowable value.
In the case of the example 3, the following examples are given,
the heat source is again loaded at typical low heat rate conditions. At the moment, the heat release rate of the phase change energy storage device is greater than the heat absorption rate of the phase change energy storage device, and the phase change material in the phase change energy storage device is subjected to phase change again and returns to a solid state; meanwhile, the phase change expansion valve also carries out phase change again, and the volume is shrunk, so that the flow passage of the A cold plate is opened, and the liquid cooling system returns to the initial state.
In an alternative embodiment, the phase change material is filled into the box body made of the aluminum alloy 6 material except the top surface, the flexible material 7 is used on the top surface of the box body, and the box body is completely packaged to form the phase change expansion valve 1. And encapsulating the phase change material into a metal cavity to form the phase change energy storage device 2.
The phase change energy storage device 2 is connected with the cold plate A3 and the cold plate B4, the phase change expansion valve 1 is installed on the cold plate A3, and the heat source 5 is connected with the cold plate A3.
And supplying liquid to the liquid cooling system to enable the heat source 5 to operate under the working condition of low heat consumption, wherein at the moment, the cooling liquid simultaneously flows through the channels of the A cold plate 3 and the B cold plate 4, and cools the heat source 5 when flowing through the channel of the A cold plate 3, and after the phase change material is heated to reach a phase change point, the liquid and solid densities of the phase change material can be greatly changed, so that the volume is driven to be changed, a valve effect is generated, and the channels are switched by the change of the temperature in the channels. Since the heat source 5 operates at a low heat consumption condition, the outlet temperature of the cooling liquid does not exceed the allowable value at this time according to the design of the liquid cooling system.
When the heat source 5 operates under the working condition of high heat consumption, the phase-change material of the phase-change expansion valve 1 expands to block the flow channel of the cold plate A3 and force the cooling liquid to flow only through the flow channel of the cold plate B, and the heat transfer path at the moment is as follows: the heat source 5-A cold plate 3 structural member-phase change energy storage device 2-B cold plate 4. The phase change energy storage device 2 absorbs heat to generate phase change, the phase change material in the phase change material is in a liquid state, and the heat transfer and heat consumption of the contact surface of the phase change material and the cold plate B4 are lower than the heat consumption generated by the heat source 5. After the cooling liquid flows through the channels of the B cold plate 4, the temperature does not exceed the allowable value.
When the heat source 5 operates under the working condition of low heat consumption, the phase change material of the phase change expansion valve 1 contracts, the flow channel of the cold plate A3 is opened again, the cooling liquid flows through the flow channels of the cold plates A3 and the cold plate B4 at the same time again, and the heat source 5 is cooled when the cooling liquid flows through the flow channel of the cold plate A3. At this time, the phase change material in the phase change energy storage device 2 releases heat, the phase change material becomes solid again, the cooling liquid cools the heat source 5 under the working condition of low heat consumption, and the outlet temperature does not exceed the allowable value.
The foregoing is directed to the preferred embodiment of the present invention and it is noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. A method for controlling the outlet temperature of the cooling liquid of the electronic equipment has the following technical characteristics: selecting a phase change material with a phase change point between the highest working environment temperature and the allowable temperature of key components in the electronic equipment, and packaging the selected phase change material in a device with five surfaces made of aluminum alloy and one surface made of flexible heat conduction material to form a phase change expansion valve; packaging the phase change material with the selected phase change point in a metal plate to form a phase change energy storage device; the method comprises the following steps of building a liquid cooling system comprising a cold plate A, a cold plate B, a phase change energy storage device, a phase change expansion valve and a branch and confluence pipeline, wherein the cold plate A and the cold plate B are connected in parallel at an outlet through an inlet flow channel, one side of the cold plate B is connected with the phase change energy storage device, one side of the cold plate A is connected with a heat source through a thermal interface material, and the other side of the cold plate A is connected with the phase change energy storage device; the phase change expansion valve is arranged at the downstream of the flow channel of the cold plate A; the upper limit of the temperature of the cooling liquid outlet when the electronic equipment works in a transient state is controlled through the combined action of the valve effect and the energy storage effect of the phase change device, once the runner of the heat transfer heat sink A cold plate is cut off, the phase change energy storage device conducts substitute heat transfer immediately, and the heat is transferred to the supplement heat sink B cold plate.
2. The method of controlling the outlet temperature of the electronic device coolant as set forth in claim 1, wherein: when the heat source is loaded under the working condition of low heat consumption, the cold plate A and the cold plate B are simultaneously connected, the phase change energy storage device and the phase change expansion valve do not work, and after cooling liquid enters the liquid cooling system from the inlet, the cooling liquid flows through the cold plate, is heated by the heat source, and is discharged from the outlet.
3. The method of controlling the outlet temperature of the electronic device coolant as set forth in claim 1, wherein: when a heat source is loaded under the working condition of high heat consumption, the phase change expansion valve positioned at the downstream position of the flow passage of the cold plate A is heated to generate phase change, the volume is obviously expanded to block the flow passage of the cold plate A, the flow passage of the cold plate A is shut off, and all cooling liquid passes through the flow passage of the cold plate B.
4. The method of controlling the outlet temperature of the electronic device coolant as set forth in claim 3, wherein: after the liquid is cut off in the A cold plate flow channel, the heat transfer path is changed into: the heat source-the structural member of the cold plate A-the phase change energy storage device-the cold plate B, after passing through the phase change energy storage device, reaches the cold plate B serving as a final heat sink, the phase change energy storage device absorbs the heat, the phase change material is changed into a liquid state at the phase change point of the phase change material, heat consumption lower than the total heat consumption of the heat source is released at the contact surface of the phase change material and the cold plate B, the cooling liquid flowing through the flow channel of the cold plate B absorbs lower heat in unit time, and the outlet temperature of the cooling liquid is controlled within an allowable value.
5. The method of controlling the outlet temperature of the electronic device coolant as set forth in claim 1, wherein: phase change energy storage device, phase change material phase change point in phase change expansion valve, and maximum environment temperature T allowed by working of liquid cooling outletout，maxAnd in electronic equipmentAllowable temperature of the key element device.
6. The method of controlling the outlet temperature of the electronic device coolant as set forth in claim 1, wherein: selecting phase change point of phase change material of phase change expansion valve, selecting phase change point T according to the following formulapc，e＝Tout，max-ΔTeWherein, Tout，maxMaximum temperature allowed at the liquid cooling outlet, Δ TeIs a value taken within a range of 1 ℃ to 10 ℃ depending on the case.
7. The method of controlling the outlet temperature of the electronic device coolant as set forth in claim 1, wherein: the minimum usage of the phase-change material in the phase-change energy storage device and the phase-change expansion valve is calculated according to the following formula: minimum usage m of phase change materialpc，h＝Qtp·ttp/hpWherein Q istpIs the heat loss, t, under typical high heat loss conditionstpIs the working time h under typical high heat consumption conditionspIndicating the latent heat of phase change of the phase change material.
8. The method of controlling the outlet temperature of the electronic device coolant as set forth in claim 1, wherein: the A cold plate and the B cold plate are in parallel connection in the flow channel structure.
9. The method of controlling the outlet temperature of the electronic device coolant as set forth in claim 1, wherein: under the environment of loading the heat source under the working condition of low heat consumption again, the heat release rate of the phase change energy storage device is greater than the heat absorption rate of the phase change energy storage device, the phase change material in the phase change energy storage device is subjected to phase change again and returns to the solid state, and meanwhile, the phase change expansion valve is subjected to phase change again and shrinks in volume, so that the flow channel of the A cold plate is opened, and the liquid cooling system returns to the initial state.
10. The method of controlling the outlet temperature of the electronic device coolant as set forth in claim 1, wherein: the phase-change material is filled into a box body made of aluminum alloy material except the top surface, the top surface of the box body is made of flexible material, and the box body is completely packaged to form the phase-change expansion valve; packaging the phase change material into a metal cavity to form a phase change energy storage device; and supplying liquid to the liquid cooling system to enable the heat source to operate under the working condition of low heat consumption, wherein at the moment, the cooling liquid simultaneously flows through the flow channels of the A cold plate and the B cold plate and cools the heat source when flowing through the flow channel of the A cold plate, and after the phase change material is heated to reach a phase change point, the liquid and solid densities of the phase change material can be greatly changed, so that the volume is driven to change, a valve effect is generated, and the flow channel is switched on and off through the temperature change in the flow channel.
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| CN108481747B (en) * | 2018-04-23 | 2020-12-25 | 广州迈普再生医学科技股份有限公司 | Ultralow temperature printing platform of biological 3D printer |
| CN208580825U (en) * | 2018-05-04 | 2019-03-05 | 苏州正力蔚来新能源科技有限公司 | A kind of cooling system and lithium ion battery mould group integrated system |
| CN208872160U (en) * | 2018-08-10 | 2019-05-17 | 江苏诺普乐生物科技有限公司 | A kind of multiloop dual control temperature phase change cold-storage device |
| CN109579316A (en) * | 2019-01-10 | 2019-04-05 | 上海彦安机电工程有限公司 | Energy automatic regulating system overheat and the control system of enclosed heat-exchange system fluid infusion pressure stabilizing |
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