CN110430682A - A kind of design method of wiring board production cycle - Google Patents
A kind of design method of wiring board production cycle Download PDFInfo
- Publication number
- CN110430682A CN110430682A CN201910687009.7A CN201910687009A CN110430682A CN 110430682 A CN110430682 A CN 110430682A CN 201910687009 A CN201910687009 A CN 201910687009A CN 110430682 A CN110430682 A CN 110430682A
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- film
- production cycle
- detection
- coating
- production
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to wiring board production application technical fields, and disclose the design method of wiring board production cycle a kind of, comprising the following steps: 1) production cycle film film, 2) detection cycle film film, 3) shift the film on image and mark, 4) substrate manufacture, 5) coating modification the date of manufacture, 6) produce and detect.The design method of the wiring board production cycle, it is digital dock font by will originally need engineer to redesign film film to be directly modified to production font with the program for remaking silk-screen halftone, and it is denoted as the novel cycle film film of " 0000 " and prints, the range of coating is extra position of the production cycle on " 0000 " label, overall flow is simple and saves the material of production film film, the artificial Material Cost of saving is achieved the effect that, the problem of lost labor's cost and Material Cost according to production cycle a large amount of output film films of different wiring boards to effective solution.
Description
Technical field
The present invention relates to wiring board production application technical field, specially a kind of design method of wiring board production cycle.
Background technique
Wiring board is also known as circuit board, and circuit board makes circuit miniaturization and intuitiveization, the batch production for fixed circuit
It playing an important role with optimization electrical appliance layout, the birth and development of FPC and PCB have expedited the emergence of this new product of Rigid Flex, because
This Rigid Flex is exactly flexible circuit board and rigid wiring board to exist by processes such as pressings, and according to related process requirement combination
The wiring board with FPC characteristic and PCB characteristic being formed together, wiring board are divided into single sided board, dual platen if dividing by the number of plies
With three big classification of multilayer circuit board.
Wiring board wiring board application in present society is very extensive, and the existing design method of wiring board is
In production, engineering department is the production cycle for showing this batch products, general using such as 1907 (producing for the 07th week 2019)
The design method of digital font, production requires to redesign the period and goes out film film again every time, but can waste in this way
A large amount of cost of labor and Material Cost, therefore, it is difficult to satisfy social needs, so propose a kind of setting for wiring board production cycle
Meter method come solve the problems, such as it is above-mentioned proposed in.
Summary of the invention
(1) the technical issues of solving
In view of the deficiencies of the prior art, the present invention provides the design method of wiring board production cycle a kind of, has saving
Artificial Material Cost and it is easy to produce the advantages that, solve production cycle a large amount of output film film meetings according to different wiring boards
The problem of lost labor's cost and Material Cost.
(2) technical solution
The technical problem to be solved in the present invention is to provide the design methods of wiring board production cycle a kind of, including following step
It is rapid:
1) production cycle film film, the main period film plate to be used of production change original fixed number
At digital dock font, and it is denoted as " 0000 ", then updates film film out, and detect to the film film of output;
2) detection cycle film film, using tools such as transmission densimeter, magnifying glass, graduated scale and film monitor stations to this
Period film film is detected, and detection project is whether text point lacks, and blank lives whether text loses shape, and detection finishes
And ensure normal rear progress next step;
3) image and mark on the film are shifted, it will be by inspection, brownification, row in sawing sheet, the internal layer film, interior etching, internal layer
Plate after the heavy copper of plate, pressing plate, drilling and via hole carries out the processing of the outer layer film, and the image on the outer-layer circuit film is transferred to
In plate face, while the production cycle word indicating on period film film being transferred to the corresponding position of plate face, and not by plate face
The dry film at exposure position is removed with liquid medicine;
4) plate that period film film and circuit image transfer finish is carried out post-processing and detection by substrate manufacture,
Processing and detection project be graphic plating, outer etching, inspection in outer layer, addition welding resistance oil, consent, turmeric and it is gold-plated, spray tin, template
The substrate of flying probe and batch electrical testing, processing and detection qualification is circuit board substrate;
5) the coating modification date of manufacture uses coating in the production cycle for determining circuit board substrate and when being produced
Device is coated in the date mark for being denoted as " 0000 ", and the range coated is the production cycle on " 0000 " label
Extra position, and the color coated is black, coating procedure needs rigorously, and prevents the coating mistake for occurring extra in coating procedure
Accidentally;
6) it produces and detects, carry out batch detection after production cycle coating, seen whether coating DATE ERROR
Or the indefinite situation of coating, the journeys such as the material attaching of the electronic components such as resistance can be carried out after detection to circuit board substrate
Sequence, attaching finish rear board production and finish, and carry out late detection and factory work.
(3) beneficial effect
Compared with prior art, the present invention provides the design methods of wiring board production cycle a kind of, have following beneficial
Effect:
1, the design method of the wiring board production cycle, by that originally engineer will be needed to redesign the numeric type period,
And go out film film used in board production again after the design is completed, then in process of production according to the film film newly gone out
It is digital dock font that the program for remaking silk-screen halftone, which is directly modified to production font, and is denoted as the novel week of " 0000 "
Phase film film is simultaneously printed, using coating unit in the day for being denoted as " 0000 " after the production cycle by determining circuit board substrate
It is accordingly coated in phase mark, and the range coated is extra position of the production cycle on " 0000 " label, overall flow
Material that is simple and saving production film film, has achieved the effect that the artificial Material Cost of saving, by with a piece of novel cycle
Film film can simultaneously print the multiple batches of wiring board of different cycles, and the label is easy to produce, this can be made novel
The design method of period film film is easy to produce and uses.
2, the design method of the wiring board production cycle, by using transmission density when production novel cycle film film
The tools such as meter, magnifying glass, graduated scale and film monitor station detect it, and " 0000 " label before coating with coating
Afterwards after testing, the coating procedure is relatively simple, and such detection only needs artificial rapid scan, can effectively avoid this
There is detection trouble and the inconvenient problem of coating when in use in design method, passes through image on the outer-layer circuit film and period
Label on film film is to be transferred in plate face simultaneously, and just enter next procedure of processing after shifting, and can effectively be increased
The clarity and integrality of strong period indicia, so that effective solution is according to production cycle a large amount of outputs of different wiring boards luxuriant and rich with fragrance
The problem of woods film meeting lost labor's cost and Material Cost.
Specific embodiment
Below in conjunction with the embodiment of the present invention, technical solution in the embodiment of the present invention is clearly and completely retouched
It states, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on the present invention
In embodiment, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
The present invention provides the design methods of wiring board production cycle a kind of, comprising the following steps:
1) production cycle film film, the main period film plate to be used of production change original fixed number
At digital dock font, and it is denoted as " 0000 ", then updates film film out, and detect to the film film of output;
2) detection cycle film film, using tools such as transmission densimeter, magnifying glass, graduated scale and film monitor stations to this
Period film film is detected, and detection project is whether text point lacks, and blank lives whether text loses shape, and detection finishes
And ensure normal rear progress next step;
3) image and mark on the film are shifted, it will be by inspection, brownification, row in sawing sheet, the internal layer film, interior etching, internal layer
Plate after the heavy copper of plate, pressing plate, drilling and via hole carries out the processing of the outer layer film, and the image on the outer-layer circuit film is transferred to
In plate face, while the production cycle word indicating on period film film being transferred to the corresponding position of plate face, and not by plate face
The dry film at exposure position is removed with liquid medicine;
4) plate that period film film and circuit image transfer finish is carried out post-processing and detection by substrate manufacture,
Processing and detection project be graphic plating, outer etching, inspection in outer layer, addition welding resistance oil, consent, turmeric and it is gold-plated, spray tin, template
The substrate of flying probe and batch electrical testing, processing and detection qualification is circuit board substrate;
5) the coating modification date of manufacture uses coating in the production cycle for determining circuit board substrate and when being produced
Device is coated in the date mark for being denoted as " 0000 ", and the range coated is the production cycle on " 0000 " label
Extra position, and the color coated is black, coating procedure needs rigorously, and prevents the coating mistake for occurring extra in coating procedure
Accidentally;
6) it produces and detects, carry out batch detection after production cycle coating, seen whether coating DATE ERROR
Or the indefinite situation of coating, the journeys such as the material attaching of the electronic components such as resistance can be carried out after detection to circuit board substrate
Sequence, attaching finish rear board production and finish, and carry out late detection and factory work.
The beneficial effects of the present invention are: the design method of the wiring board production cycle, by will originally need engineer's weight
The new design numeric type period, and go out film film used in board production again after the design is completed, then in process of production
Directly being modified to production font according to the program that the film film newly gone out remakes silk-screen halftone is digital dock font, and is marked
It is shown as the novel cycle film film of " 0000 " and prints, use coating unit after the production cycle by determining circuit board substrate
It is accordingly coated in the date mark for being denoted as " 0000 ", and the range coated is the production cycle on " 0000 " label
Extra position, overall flow is simple and saves the material of production film film, has achieved the effect that the artificial Material Cost of saving, has led to
It crosses and can while the multiple batches of wiring board of different cycles be printed with a piece of novel cycle film film, and the label is convenient for life
It produces, the design method of the novel cycle film film can be made easy to produce and used, the design side of the wiring board production cycle
Method, by using the tools pair such as transmission densimeter, magnifying glass, graduated scale and the film monitor station when production novel cycle film film
It is detected, and " 0000 " label before coating with coating after after testing, the coating procedure is relatively simple, and this
Kind detection only needs artificial rapid scan, and the design method can effectively be avoided to occur detecting troublesome and coating not when in use
Convenient problem is to be transferred in plate face simultaneously by the label on the image and period film film on the outer-layer circuit film,
And just enter next procedure of processing after shifting, it can effectively enhance the clarity and integrality of period indicia, thus effectively
Solve according to production cycles of different wiring boards a large amount of output film films can lost labor's cost and Material Cost ask
Topic.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (1)
1. a kind of design method of wiring board production cycle, which comprises the following steps:
1) production cycle film film, the main period film plate to be used of production, original fixed number is modified to count
Word clock font, and it is denoted as " 0000 ", film film out is then updated, and detect to the film film of output;
2) detection cycle film film, using tools such as transmission densimeter, magnifying glass, graduated scale and film monitor stations to the period
Film film is detected, and detection project is whether text point lacks, and blank lives whether text loses shape, and detection finishes simultaneously really
Protect normal rear progress next step;
3) image and mark on the film are shifted, it will be by inspection, brownification, plate-laying, pressure in sawing sheet, the internal layer film, interior etching, internal layer
Plate after the heavy copper of plate, drilling and via hole carries out the processing of the outer layer film, and the image on the outer-layer circuit film is transferred to plate face
On, while the production cycle word indicating on period film film being transferred to the corresponding position of plate face, and plate face is unexposed
The dry film at position is removed with liquid medicine;
4) plate that period film film and circuit image transfer finish is carried out post-processing and detection, processing by substrate manufacture
With detection project be graphic plating, outer etching, inspection in outer layer, addition welding resistance oil, consent, turmeric and it is gold-plated, spray tin, template flying needle
The substrate of test and batch electrical testing, processing and detection qualification is circuit board substrate;
5) the coating modification date of manufacture uses coating unit in the production cycle for determining circuit board substrate and when being produced
It is coated in the date mark for being denoted as " 0000 ", and the range coated is that the production cycle is extra on " 0000 " label
Position, and the color coated is black, coating procedure needs rigorously, and prevents the coating fault for occurring extra in coating procedure;
6) it produces and detects, carry out batch detection after production cycle coating, seen whether coating DATE ERROR or painting
Indefinite situation is covered, the programs such as the material attaching of the electronic components such as resistance, patch can be carried out after detection to circuit board substrate
It is attached finish rear board production finish, and carry out late detection and factory work.
Priority Applications (1)
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CN201910687009.7A CN110430682A (en) | 2019-07-29 | 2019-07-29 | A kind of design method of wiring board production cycle |
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CN201910687009.7A CN110430682A (en) | 2019-07-29 | 2019-07-29 | A kind of design method of wiring board production cycle |
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CN110430682A true CN110430682A (en) | 2019-11-08 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5397678A (en) * | 1992-04-09 | 1995-03-14 | Fuji Photo Film Co., Ltd. | Image formation method using a photosensitive transfer material |
CN104470231A (en) * | 2014-12-31 | 2015-03-25 | 广州兴森快捷电路科技有限公司 | Method for manufacturing PCBs through serial numbers |
CN204431400U (en) * | 2015-01-20 | 2015-07-01 | 深圳市仁创艺电子有限公司 | The fly-cutting more changing device in film cycle |
CN106061139A (en) * | 2016-06-17 | 2016-10-26 | 奥士康精密电路(惠州)有限公司 | Layer-to-layer registration control method for inner layers of HDI (High Density Interconnector) board |
CN109343311A (en) * | 2018-09-25 | 2019-02-15 | 信利光电股份有限公司 | A kind of date of manufacture printing process |
-
2019
- 2019-07-29 CN CN201910687009.7A patent/CN110430682A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5397678A (en) * | 1992-04-09 | 1995-03-14 | Fuji Photo Film Co., Ltd. | Image formation method using a photosensitive transfer material |
CN104470231A (en) * | 2014-12-31 | 2015-03-25 | 广州兴森快捷电路科技有限公司 | Method for manufacturing PCBs through serial numbers |
CN204431400U (en) * | 2015-01-20 | 2015-07-01 | 深圳市仁创艺电子有限公司 | The fly-cutting more changing device in film cycle |
CN106061139A (en) * | 2016-06-17 | 2016-10-26 | 奥士康精密电路(惠州)有限公司 | Layer-to-layer registration control method for inner layers of HDI (High Density Interconnector) board |
CN109343311A (en) * | 2018-09-25 | 2019-02-15 | 信利光电股份有限公司 | A kind of date of manufacture printing process |
Non-Patent Citations (1)
Title |
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新知互动: "《Photoshop CS3平面广告设计与印前技术》", 31 July 2009 * |
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Application publication date: 20191108 |
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