CN110429171A - 一种极限拉伸改善热传导支架 - Google Patents

一种极限拉伸改善热传导支架 Download PDF

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Publication number
CN110429171A
CN110429171A CN201910595742.6A CN201910595742A CN110429171A CN 110429171 A CN110429171 A CN 110429171A CN 201910595742 A CN201910595742 A CN 201910595742A CN 110429171 A CN110429171 A CN 110429171A
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heat transfer
terminal
convex closure
reduces
ultimate elongation
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谢东桃
祝宗锐
黄明宝
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Huizhou Changfang Lighting Energy Saving Technology Co Ltd
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Huizhou Changfang Lighting Energy Saving Technology Co Ltd
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Priority to CN201910595742.6A priority Critical patent/CN110429171A/zh
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • H01L33/642Heat extraction or cooling elements characterized by the shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • H01L33/647Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

一种极限拉伸改善热传导支架,本发明涉及LED技术领域,它包含端子、胶料;端子的底部左右两侧均设有胶料;所述的端子的正面拉伸设有凸包,凸包的高度为1.55mm。其凸包直接拉伸成型,减少端子工艺的繁琐步骤,降低生产品质异常发生率,减小灯珠工作时产生的热量传递距离,使热量扩散的更快,降低了灯珠由于过热导致的老化死灯,实用性更强。

Description

一种极限拉伸改善热传导支架
技术领域
本发明涉及LED技术领域,具体涉及一种极限拉伸改善热传导支架。
背景技术
随着社会的发展与不断进步,人类对LED照明灯使用寿命要求越来越高。影响LED照明灯寿命长短在制造生产阶段分两类:其一为封装工段,其二为支架工段。支架作为LED照明灯的生产第一站,其作用是不可估量的。3535系列LED灯珠因其具有极强稳定性,被运用于路灯,车灯,射灯等。但目前阶段3535支架引脚长,热传导距离远散热性差,而且包脚工站工艺复杂,引脚易退脚,亟待改进。发明内容
本发明的目的在于针对现有技术的缺陷和不足,提供一种设计合理的极限拉伸改善热传导支架,其凸包直接拉伸成型,减少端子工艺的繁琐步骤,降低生产品质异常发生率,减小灯珠工作时产生的热量传递距离,使热量扩散的更快,降低了灯珠由于过热导致的老化死灯,实用性更强。
为达到上述目的,本发明采用了下列技术方案:它包含端子、胶料;端子的底部左右两侧均设有胶料;所述的端子的正面拉伸设有凸包,凸包的高度为1.55mm。
进一步地,所述的凸包的成型工艺如下:其分两次拉伸而成,第一次先拉伸呈“U”形结构,第二次,将该“U”形结构的底部圆弧面压型呈平面,即可。
进一步地,所述的端子处于折弯工艺时,采用切断直接成型。
采用上述结构后,本发明的有益效果是:本发明提供了一种极限拉伸改善热传导支架,其凸包直接拉伸成型,减少端子工艺的繁琐步骤,降低生产品质异常发生率,减小灯珠工作时产生的热量传递距离,使热量扩散的更快,降低了灯珠由于过热导致的老化死灯,实用性更强。
附图说明:
图1是本发明的结构示意图。
图2是本发明的俯视图。
图3是本发明的剖视图。
附图标记说明:
端子1、胶料2、凸包3。
具体实施方式:
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
如图1-图3所示,本具体实施方式采用如下技术方案:它包含端子1、胶料2;端子1的底部左右两侧均设有胶料2;所述的端子1的正面拉伸设有凸包3,凸包3的高度为1.55mm;该凸包3采用两次成型,即:第一次先拉伸呈“U”形结构,第二次,将该“U”形结构的底部圆弧面压型呈平面,即可;同时,端子1处于折弯工艺时,取消了折弯包脚工序,直接切断成型。
采用上述结构后,本具体实施方式的有益效果是:本具体实施方式提供了一种极限拉伸改善热传导支架,其凸包直接拉伸成型,减少端子工艺的繁琐步骤,降低生产品质异常发生率,减小灯珠工作时产生的热量传递距离,使热量扩散的更快,降低了灯珠由于过热导致的老化死灯,实用性更强。
尽管参照前述实施例对本发明进行了详细的说明,对于本领域的技术人员来说,其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。

Claims (3)

1.一种极限拉伸改善热传导支架,它包含端子(1)、胶料(2);端子(1)的底部左右两侧均设有胶料(2);其特征在于:所述的端子(1)的正面拉伸设有凸包(3),凸包(3)的高度为1.55mm。
2.根据权利要求1所述的一种极限拉伸改善热传导支架,其特征在于:所述的凸包(3)的成型工艺如下:其分两次拉伸而成,第一次先拉伸呈“U”形结构,第二次,将该“U”形结构的底部圆弧面压型呈平面,即可。
3.根据权利要求1所述的一种极限拉伸改善热传导支架,其特征在于:所述的端子(1)处于折弯工艺时,采用切断直接成型。
CN201910595742.6A 2019-07-03 2019-07-03 一种极限拉伸改善热传导支架 Pending CN110429171A (zh)

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060192224A1 (en) * 2005-02-24 2006-08-31 Kabushiki Kaisha Toshiba Semiconductor light emitting device
CN202067835U (zh) * 2011-03-11 2011-12-07 广东宏磊达光电科技有限公司 一种大功率led支架
CN102655190A (zh) * 2012-03-23 2012-09-05 广东长盈精密技术有限公司 Led支架制造方法
CN203983336U (zh) * 2014-07-18 2014-12-03 博罗承创精密工业有限公司 一种高防水型led支架及其支架料带
CN104465953A (zh) * 2014-12-15 2015-03-25 赵景添 一种led灯支架及该led灯支架中的金属支架
CN105304806A (zh) * 2015-10-27 2016-02-03 广东长盈精密技术有限公司 Led支架及其生产方法
CN205488225U (zh) * 2016-01-25 2016-08-17 安徽盛烨电子有限公司 一种加强气密性结构的发光二极管引线框架
CN206301833U (zh) * 2016-10-10 2017-07-04 佛山市蓝箭电子股份有限公司 一种户内top型led器件及其支架
CN208570651U (zh) * 2018-05-28 2019-03-01 木林森股份有限公司 一种适用于户外显示屏的smd白光灯珠结构

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060192224A1 (en) * 2005-02-24 2006-08-31 Kabushiki Kaisha Toshiba Semiconductor light emitting device
CN202067835U (zh) * 2011-03-11 2011-12-07 广东宏磊达光电科技有限公司 一种大功率led支架
CN102655190A (zh) * 2012-03-23 2012-09-05 广东长盈精密技术有限公司 Led支架制造方法
CN203983336U (zh) * 2014-07-18 2014-12-03 博罗承创精密工业有限公司 一种高防水型led支架及其支架料带
CN104465953A (zh) * 2014-12-15 2015-03-25 赵景添 一种led灯支架及该led灯支架中的金属支架
CN105304806A (zh) * 2015-10-27 2016-02-03 广东长盈精密技术有限公司 Led支架及其生产方法
CN205488225U (zh) * 2016-01-25 2016-08-17 安徽盛烨电子有限公司 一种加强气密性结构的发光二极管引线框架
CN206301833U (zh) * 2016-10-10 2017-07-04 佛山市蓝箭电子股份有限公司 一种户内top型led器件及其支架
CN208570651U (zh) * 2018-05-28 2019-03-01 木林森股份有限公司 一种适用于户外显示屏的smd白光灯珠结构

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