CN110428749A - A kind of LED display module and packaging method by block stacked package - Google Patents
A kind of LED display module and packaging method by block stacked package Download PDFInfo
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- CN110428749A CN110428749A CN201910771479.1A CN201910771479A CN110428749A CN 110428749 A CN110428749 A CN 110428749A CN 201910771479 A CN201910771479 A CN 201910771479A CN 110428749 A CN110428749 A CN 110428749A
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- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000004806 packaging method and process Methods 0.000 title abstract description 4
- 241001025261 Neoraja caerulea Species 0.000 claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 239000003292 glue Substances 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 239000000956 alloy Substances 0.000 claims description 16
- 229910045601 alloy Inorganic materials 0.000 claims description 16
- 238000005538 encapsulation Methods 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 7
- 238000010147 laser engraving Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 241001062009 Indigofera Species 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of LED display modules and packaging method by block stacked package, LED display module includes the translucency screen substrate of display screen surface, red-light LED layer is successively stacked with random order in the translucency screen substrate, green light LED layer, blue-ray LED layer and be located at the red-light LED layer, the green light LED layer, LED lighting control device layer on the blue-ray LED layer, the red-light LED layer by can global transfer put red LED chip chunking constitute, the green light LED layer by can global transfer put green LED chip chunking constitute, the blue-ray LED layer by can global transfer put blue-light LED chip chunking constitute.
Description
Technical field
The present invention relates to chip encapsulation technology fields, and in particular to a kind of LED display module by block stacked package and
Packaging method.
Background technique
LED color screen has reaction speed fast, and power saving light extraction efficiency is high, the advantages that actively shining.AR, VR especially may be implemented
The effect of equal virtual realitys, for the main force of display simultaneously backward.But at this stage MiNi LED or MiCRO LED be limited to bonding wire or
Person's reverse installation process, it is all limited in pixel, it can about accomplish that P0.8 is that the distance between each central point is now
0.8mm.The prior art is when manufacturing LED display module due to being draw then entirety for independent single LED chip
Shift (flood tide transfer), therefore exist how by the LED chip spacing being arranged in LED display module do it is small and such as it is how small
The problem of spacing die bond.
Summary of the invention
The technical problem to be solved in the present invention is that providing a kind of by the LED display module of block stacked package and encapsulation
Method overcomes prior art LED display packaging technology to cause pixel spacing excessive, and display resolution is relatively low, display
Not fine and smooth enough the defect of effect.
The present invention to solve above-mentioned technical problem used by technical solution are as follows:
A kind of LED display module by block stacked package, the translucency screen substrate including display screen surface, in the light transmission
Property screen substrate on successively with random order be stacked with red-light LED layer, green light LED layer, blue-ray LED layer and be located at the feux rouges
LED layer, the green light LED layer, the LED lighting control device layer on the blue-ray LED layer, the red-light LED layer is by can be whole
Body transfer put red LED chip chunking constitute, the green light LED layer by can global transfer put green LED chip group
Block constitute, the blue-ray LED layer by can global transfer put blue-light LED chip chunking constitute, the translucency screen substrate,
The red-light LED layer, the blue-ray LED layer, passes through shadowless glue between the LED lighting control device layer at the green light LED layer
Layer solidification connection, the red-light LED layer, the green light LED layer, the blue-ray LED layer, on the LED lighting control device layer
It is laid with through conducting wire made of metal film or alloy film are carved or etched.
According to an embodiment of the invention, the red LED chip chunking, the green LED chip chunking and the blue light
LED chip chunking is made of 10*10,20*20,30*30 or 40*40 LED chip respectively.
According to an embodiment of the invention, the red LED chip chunking, the green LED chip chunking and the blue light
LED chip chunking is manufactured using photomask technology.
According to an embodiment of the invention, in the periphery of the red-light LED layer, the green light LED layer and the blue-ray LED layer
It is provided with shallow channel.
According to an embodiment of the invention, in the red LED chip chunking, the green LED chip chunking and the indigo plant
The periphery of light LED chip chunking is provided with shallow channel.
According to an embodiment of the invention, being provided with shallow channel around the LED chip.
According to an embodiment of the invention, LED chip on the red-light LED layer, the green light LED layer, the blue-ray LED layer
The connection of positive copolar, the red-light LED layer, the green light LED layer, every a line or each column LED on the blue-ray LED layer
The cathode copolar of chip connects.
According to an embodiment of the invention, the conducting wire is formed by laser engraving.
A kind of LED display module encapsulation method, comprising steps of
A1, one layer of shadowless glue is coated in translucency screen substrate；
A2, by can global transfer put red LED chip chunking be arranged into red-light LED layer, by can global transfer put it is green
Light LED chip chunking is arranged into green light LED layer, by can global transfer put blue-light LED chip chunking be arranged into blue-ray LED
Layer；
A3, successively with random order stack red-light LED layer, green light LED layer, blue-ray LED layer, the red-light LED layer, the green light
Between LED layer, the blue-ray LED layer coat shadowless glue layer, while around the LED on each shadowless glue layer make metal film or
Alloy film carves the metal film or the alloy film or etching forms conducting wire；
One layer of A4, re-coating shadowless glue；
A5, LED lighting control device layer is stacked, while makes metal film or alloy film around LED lighting control device, it is right
The metal film or alloy film engraving or etching form conducting wire；
A6, in the top of the LED lighting control device layer, covering encapsulates glue layer.
According to an embodiment of the invention, the step A3 is comprising steps of be arranged shallow channel, each in the periphery of each LED layer
Shallow channel is arranged around each LED chip in the periphery setting shallow channel of LED chip chunking.
Advantageous effect of the invention: the present invention uses the new process by LED chip chunking arrangement LED chip, thus reduces
The technical difficulty of flood tide transfer is carried out when manufacturing LED display module, while can reduce LED chip spacing, is reduced small
The difficulty of spacing LED chip die bond, improves the resolution ratio of display screen, so that display effect is more preferably fine and smooth, while increasing production
The reliability of product, display panel module size is more random, and splicing is less, and cost of labor is lower.
Detailed description of the invention
It is specifically described the present invention below with reference to attached drawing and in conjunction with example, advantages of the present invention and implementation will
It is more obvious, wherein content only for the purpose of explanation of the present invention shown in attached drawing, without constitute to it is of the invention in all senses
On limitation, in the accompanying drawings:
Fig. 1 is LED display module stacking structure schematic diagram of the present invention；
Fig. 2 is LED chip pin connected mode schematic diagram of the present invention；
Fig. 3 is red blue green LED layer schematic diagram of the present invention.
Specific embodiment
As shown in Figure 1, Figure 2, Figure 3 shows, the present invention presses the LED display module of block stacked package, including display screen surface
Translucency screen substrate 11 is successively stacked with red-light LED layer 13, green light LED in translucency screen substrate 11 with random order
Layer 16, blue-ray LED layer 19 and the LED light emitting control on red-light LED layer 13, green light LED layer 16, blue-ray LED layer 19
Device layer 22, red-light LED layer 13 by can the red LED chip chunking 131 put of global transfer constitute, green light LED layer 16 is by can
Global transfer put green LED chip chunking 161 constitute, blue-ray LED layer 19 by can global transfer put blue-light LED chip
Chunking 191 is constituted, translucency screen substrate 11, red-light LED layer 13, green light LED layer 16, blue-ray LED layer 19, LED light emitting control
Pass through shadowless glue layer 12, shadowless glue layer 15, shadowless glue layer 18, the solidification connection of shadowless glue layer 21, red-light LED layer between device layer 22
12, green light LED layer 16, blue-ray LED layer 19, be laid on LED lighting control device layer 22 respectively metal film 14, metal film 17,
Metal film 20, metal film 23, by being carved to metal film or alloy film or etching and forms conducting wire, conducting wire by
Laser engraving is formed.Encapsulation glue layer 24 is covered on LED lighting control device layer 22.It is red LED chip chunking 131, green
Light LED chip chunking 161 and blue-light LED chip chunking 191 are respectively by 10*10,20*20,30*30 or 40*40 LED chip
Matrix module composed by composition or any X column * Y row.Red LED chip chunking 131, green LED chip chunking 161 and indigo plant
Light LED chip chunking 191 is manufactured using photomask technology.In the outer of red-light LED layer 13, green light LED layer 16 and blue-ray LED layer 19
It encloses and is provided with shallow channel.In red LED chip chunking 131, green LED chip chunking 161 and blue-light LED chip chunking 191
Periphery is provided with shallow channel.Shallow channel is provided with around LED chip.Red-light LED layer 13, green light LED layer 16, blue-ray LED
The positive copolar connection of LED chip on layer 19, red-light LED layer 13, green light LED layer 16, every a line or every on blue-ray LED layer 19
The cathode copolar of one column LED chip connects.
LED display module encapsulation method of the present invention, comprising steps of
A1, one layer of shadowless glue 12 is coated in translucency screen substrate 11；
A2, by can global transfer put red LED chip chunking 131 be arranged into red-light LED layer 13, by can global transfer put
Green LED chip chunking 161 be arranged into green light LED layer 16, by can global transfer put 191 row of blue-light LED chip chunking
Cloth is at blue-ray LED layer 19；
A3, successively with random order stack red-light LED layer 13, green light LED layer 16, blue-ray LED layer 19, red-light LED layer 13, green light
Between LED layer 16, blue-ray LED layer 19 coat shadowless glue layer, while around the LED on each shadowless glue layer make metal film or
Alloy film carves the metal film or the alloy film or etching forms conducting wire；
One layer of A4, re-coating shadowless glue 21；
A5, LED lighting control device layer 22 is stacked, while makes metal film 23 or alloy around LED lighting control device
Film carves metal film 23 or alloy film or etching forms conducting wire；
A6, in the top of the LED lighting control device layer 22, covering encapsulates glue layer 24.
According to an embodiment of the invention, conducting wire is formed by laser engraving.Encapsulation glue layer 24 is set as shadowless glue layer, gold
Belong to film 23 or alloy film is formed using the mode of vacuum splashing and plating, metal film 23 can be copper, tin, aluminium, golden film etc., then with laser carving
Mode carve route, removal excess metal, which forms route, makes each layer LED chip conducting connection, and bonding wire encapsulation is exempted from realization.
Those skilled in the art do not depart from essence and spirit of the invention, can there are many deformation scheme realize the present invention,
The foregoing is merely preferably feasible embodiments of the invention, and not thereby limiting the scope of the invention, all with this
The variation of equivalent structure made by description of the invention and accompanying drawing content, is intended to be included within the scope of the present invention.
Claims (10)
1. a kind of LED display module by block stacked package, it is characterised in that: the translucency screen base including display screen surface
Plate, in the translucency screen substrate successively with random order be stacked with red-light LED layer, green light LED layer, blue-ray LED layer with
And the LED lighting control device layer on the red-light LED layer, the green light LED layer, the blue-ray LED layer,
The red-light LED layer by can the red LED chip chunking put of global transfer constitute, the green light LED layer is by can be whole
Transfer put green LED chip chunking constitute, the blue-ray LED layer by can global transfer put blue-light LED chip chunking
It constitutes, the translucency screen substrate, the red-light LED layer, the green light LED layer, the blue-ray LED layer, the LED shine
Between control device layer by shadowless glue layer solidification connection, the red-light LED layer, the green light LED layer, the blue-ray LED layer,
It is laid on the LED lighting control device layer through conductor wire made of metal film or alloy film are carved or etched
Road.
2. the LED display module according to claim 1 by block stacked package, it is characterised in that: the red-light LED core
Piece chunking, the green LED chip chunking and the blue-light LED chip chunking are respectively by 10*10,20*20,30*30 or 40*
40 LED chips are constituted.
3. the LED display module according to claim 1 by block stacked package, it is characterised in that: the red-light LED core
Piece chunking, the green LED chip chunking and the blue-light LED chip chunking are manufactured using photomask technology.
4. the LED display module according to claim 1 by block stacked package, it is characterised in that: in the red-light LED
The periphery of layer, the green light LED layer and the blue-ray LED layer is provided with shallow channel.
5. the LED display module according to claim 1 by block stacked package, it is characterised in that: in the red-light LED
The periphery of chip chunking, the green LED chip chunking and the blue-light LED chip chunking is provided with shallow channel.
6. the LED display module according to claim 2 by block stacked package, it is characterised in that: in the LED chip
Around be provided with shallow channel.
7. the LED display module according to claim 1 by block stacked package, it is characterised in that: the red-light LED
The positive copolar connection of LED chip, the red-light LED layer, the green light on layer, the green light LED layer, the blue-ray LED layer
The cathode copolar of every a line or each column LED chip connects in LED layer, the blue-ray LED layer.
8. the LED display module according to claim 1 by block stacked package, it is characterised in that: the conducting wire
It is formed by laser engraving.
9. a kind of LED display module encapsulation method, which is characterized in that comprising steps of
A1, one layer of shadowless glue is coated in translucency screen substrate；
A2, by can global transfer put red LED chip chunking be arranged into red-light LED layer, by can global transfer put it is green
Light LED chip chunking is arranged into green light LED layer, by can global transfer put blue-light LED chip chunking be arranged into blue-ray LED
Layer；
A3, successively with random order stack red-light LED layer, green light LED layer, blue-ray LED layer, the red-light LED layer, the green light
Between LED layer, the blue-ray LED layer coat shadowless glue layer, while around the LED on each shadowless glue layer make metal film or
Alloy film carves the metal film or the alloy film or etching forms conducting wire；
One layer of A4, re-coating shadowless glue；
A5, LED lighting control device layer is stacked, while makes metal film or alloy film around LED lighting control device, it is right
The metal film or alloy film engraving or etching form conducting wire；
A6, in the top of the LED lighting control device layer, covering encapsulates glue layer.
10. LED display module encapsulation method according to claim 9, it is characterised in that: the step A3 includes step
It is rapid: in the periphery setting shallow channel of each LED layer, in the periphery setting shallow channel of each LED chip chunking or in each LED chip
Shallow channel is arranged in surrounding.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910771479.1A CN110428749A (en) | 2019-08-21 | 2019-08-21 | A kind of LED display module and packaging method by block stacked package |
| US16/578,417 US20200105736A1 (en) | 2018-09-28 | 2019-09-23 | 3D Stacked and Encapsulated LED Display Screen Module and Its Encapsulation Method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910771479.1A CN110428749A (en) | 2019-08-21 | 2019-08-21 | A kind of LED display module and packaging method by block stacked package |
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| Publication Number | Publication Date |
|---|---|
| CN110428749A true CN110428749A (en) | 2019-11-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910771479.1A Pending CN110428749A (en) | 2018-09-28 | 2019-08-21 | A kind of LED display module and packaging method by block stacked package |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111864032A (en) * | 2020-08-05 | 2020-10-30 | 陈梓林 | LED array device and manufacturing method thereof |
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| CN210271595U (en) * | 2019-08-21 | 2020-04-07 | 深圳市洁简达创新科技有限公司 | LED display screen module stacked and packaged according to blocks |
-
2019
- 2019-08-21 CN CN201910771479.1A patent/CN110428749A/en active Pending
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| US20160005375A1 (en) * | 2014-07-01 | 2016-01-07 | Ricoh Company, Ltd. | Electrochromic display device, and producing method and driving method thereof |
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| Title |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111864032A (en) * | 2020-08-05 | 2020-10-30 | 陈梓林 | LED array device and manufacturing method thereof |
| CN111864032B (en) * | 2020-08-05 | 2021-12-07 | 陈梓林 | LED array device and manufacturing method thereof |
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