CN110423102A - 一种适用于低电阻引线的陶瓷封装外壳材料 - Google Patents

一种适用于低电阻引线的陶瓷封装外壳材料 Download PDF

Info

Publication number
CN110423102A
CN110423102A CN201910721021.5A CN201910721021A CN110423102A CN 110423102 A CN110423102 A CN 110423102A CN 201910721021 A CN201910721021 A CN 201910721021A CN 110423102 A CN110423102 A CN 110423102A
Authority
CN
China
Prior art keywords
low resistance
ceramic package
resistance lead
sheathing material
package sheathing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910721021.5A
Other languages
English (en)
Inventor
庄亚平
鲍侠
许杨生
王维敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHEJIANG CHANGXING ELECTRONIC FACTORY CO Ltd
Original Assignee
ZHEJIANG CHANGXING ELECTRONIC FACTORY CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZHEJIANG CHANGXING ELECTRONIC FACTORY CO Ltd filed Critical ZHEJIANG CHANGXING ELECTRONIC FACTORY CO Ltd
Priority to CN201910721021.5A priority Critical patent/CN110423102A/zh
Publication of CN110423102A publication Critical patent/CN110423102A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3201—Alkali metal oxides or oxide-forming salts thereof
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
    • C04B2235/3215—Barium oxides or oxide-forming salts thereof
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
    • C04B2235/3232—Titanium oxides or titanates, e.g. rutile or anatase
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
    • C04B2235/3241—Chromium oxides, chromates, or oxide-forming salts thereof
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/327—Iron group oxides, their mixed metal oxides, or oxide-forming salts thereof
    • C04B2235/3275—Cobalt oxides, cobaltates or cobaltites or oxide forming salts thereof, e.g. bismuth cobaltate, zinc cobaltite
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3281—Copper oxides, cuprates or oxide-forming salts thereof, e.g. CuO or Cu2O
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3409—Boron oxide, borates, boric acids, or oxide forming salts thereof, e.g. borax
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3418—Silicon oxide, silicic acids, or oxide forming salts thereof, e.g. silica sol, fused silica, silica fume, cristobalite, quartz or flint
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/44—Metal salt constituents or additives chosen for the nature of the anions, e.g. hydrides or acetylacetonate
    • C04B2235/444—Halide containing anions, e.g. bromide, iodate, chlorite
    • C04B2235/445—Fluoride containing anions, e.g. fluosilicate
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • C04B2235/9646—Optical properties
    • C04B2235/9661—Colour

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Oxide Ceramics (AREA)

Abstract

本发明公开了一种适用于低电阻引线的陶瓷封装外壳材料，包括以下成分：二氧化硅、氟化钙、硼砂、氧化钡、氧化钾、着色剂和氧化铝。该材料通过原料配比的调整，可以达到显著降低介质损耗的技术效果；同时由于加入氟化钙和硼砂，本发明的陶瓷封装外壳材料制备过程中的烧结温度显著降低，减少了能耗。

Description

一种适用于低电阻引线的陶瓷封装外壳材料
技术领域
本发明涉及陶瓷封装材料技术领域，尤其涉及一种适用于低电阻引线的陶瓷封装外壳材料。
背景技术
近年来，在半导体技术飞速发展的带动下，电子元器件不断向小型化、集成化和高频化方向发展。
常规氧化铝陶瓷的烧结温度在 1500℃以上，对烧成设备有较高的要求，需要高温氢气烧结炉，对能源的消耗也相当大，如电力、氢气等，所以制造成本一直居高不下，而且较高的烧结温度也限制了其只能采用难熔的 W、Mo 等金属作为导体材料。W、Mo材料的金属化电阻大，导体损耗高，不能完全满足高速、高频领域的应用。LTCC（低温共烧陶瓷材料）虽可以使用金、银、铜等低电阻导体，但为了降低烧结温度而加入了大量玻璃成分，从而导致其抗弯强度不足 200Mpa。抗弯强度的降低导致了其可靠性的下降，在稍大一些的冲击下易出现裂纹或发生断裂，造成产品出现严重的失效现象。此外LTCC低的抗弯强度也限制了封装基板的厚度，不利于超薄封装形式的应用，从而限制了封装的进一步小型化。
目前国内公开的可以匹配低电阻导体材料，同时又保持较高机械性能的陶瓷封装材料仍较少。中国发明专利CN102503377A公开了一种高强度半导体封装陶瓷材料及其制作方法，所用原料按质量百分比由以下物质组成：玻璃粉15-25%，着色剂5-15%，余量为氧化铝粉料。该陶瓷材料机械强度高，烧结温度较低，可以使用铜-钨作为配套的导体材料，其电导率大大提高。但其介电损耗仍有待改良，故本发明提供了一种适用于低电阻引线的陶瓷封装外壳材料。
发明内容
基于背景技术存在的技术问题，本发明提出了一种适用于低电阻引线的陶瓷封装外壳材料。
本发明的技术方案如下：
一种适用于低电阻引线的陶瓷封装外壳材料，包括以下成分：二氧化硅、氟化钙、硼砂、氧化钡、氧化钾、着色剂和氧化铝。
一种适用于低电阻引线的陶瓷封装外壳材料，由以下重量百分比的成分组成：二氧化硅 6-12%、氟化钙 1-3%、硼砂 1-2%、氧化钡 2-5%、氧化钾 0.5-1%、着色剂 6-15%和氧化铝。
优选的，所述的着色剂为二氧化钛、氧化铜、三氧化二铬、氧化亚钴中的一种或者多种的组合。
优选的，所述的氧化铝为α相氧化铝，纯度＞99.9%。
优选的，所述的二氧化硅的粒径小于100nm、其余原料的粒径小于1μm。
优选的，所述的适用于低电阻引线的陶瓷封装外壳材料的制备方法，包括以下步骤：
A、将各种原料混合均匀；
B、成型；
C、将成型后在氮气与氢气的比例为1：（1-3）气氛中进行烧结，烧结温度为 800-1000℃，所述氮气与氢气的比例为体积比。
本发明的有益之处在于：本发明的适用于低电阻引线的陶瓷封装外壳材料，，包括以下成分：二氧化硅、氟化钙、硼砂、氧化钡、氧化钾、着色剂和氧化铝。该材料通过原料配比的调整，可以达到显著降低介质损耗的技术效果；同时由于加入氟化钙和硼砂，本发明的陶瓷封装外壳材料制备过程中的烧结温度显著降低，减少了能耗。
具体实施方式
实施例1：
一种适用于低电阻引线的陶瓷封装外壳材料，由以下重量百分比的成分组成：二氧化硅 8%、氟化钙 1.5%、硼砂 1.2%、氧化钡 3.5%、氧化钾 0.7%、着色剂 12%和氧化铝。
所述的着色剂为二氧化钛和三氧化二铬质量比为1：1的混合物。
所述的氧化铝为α相氧化铝，纯度＞99.9%。
所述的二氧化硅的粒径小于100nm、其余原料的粒径小于1μm。
所述的适用于低电阻引线的陶瓷封装外壳材料的制备方法，包括以下步骤：
A、将各种原料混合均匀；
B、成型；
C、将成型后在氮气与氢气的比例为1：1气氛中进行烧结，烧结温度为 870℃，所述氮气与氢气的比例为体积比。
所制高强度半导体封装陶瓷材料的主要技术指标如下 ：
抗弯强度＞300MPa
介电常数 8.7（1MHz）、8.2（10GHz）
介质损耗 5.8×10-6（1MHz）、3.2×10-5（10GHz）
成瓷颜色：黑色
实施例2：
一种适用于低电阻引线的陶瓷封装外壳材料，由以下重量百分比的成分组成：二氧化硅 12%、氟化钙 1%、硼砂 2%、氧化钡 2%、氧化钾 1%、着色剂 7%和氧化铝。
所述的着色剂为二氧化钛和氧化亚钴质量比为2.5：1的混合物。
所述的氧化铝为α相氧化铝，纯度＞99.9%。
所述的二氧化硅的粒径小于100nm、其余原料的粒径小于1μm。
所述的适用于低电阻引线的陶瓷封装外壳材料的制备方法，包括以下步骤：
A、将各种原料混合均匀；
B、成型；
C、将成型后在氮气与氢气的比例为1：3气氛中进行烧结，烧结温度为 800℃，所述氮气与氢气的比例为体积比。
抗弯强度＞300MPa
介电常数 8.5（1MHz）、7.7（10GHz）
介质损耗 2.3×10-5（1MHz）、8.1×10-5（10GHz）
成瓷颜色：黑灰色
实施例3：
一种适用于低电阻引线的陶瓷封装外壳材料，由以下重量百分比的成分组成：二氧化硅 6%、氟化钙 3%、硼砂 1%、氧化钡 5%、氧化钾 0.5%、着色剂 15%和氧化铝。
所述的着色剂为二氧化钛和氧化铜质量比为5：1的混合物。
所述的氧化铝为α相氧化铝，纯度＞99.9%。
所述的二氧化硅的粒径小于100nm、其余原料的粒径小于1μm。
所述的适用于低电阻引线的陶瓷封装外壳材料的制备方法，包括以下步骤：
A、将各种原料混合均匀；
B、成型；
C、将成型后在氮气与氢气的比例为1：（1-3）气氛中进行烧结，烧结温度为 800-1000℃，所述氮气与氢气的比例为体积比。
抗弯强度＞300MPa
介电常数 9.0（1MHz）、8.5（10GHz）
介质损耗 6.9×10-6（1MHz）、3.7×10-5（10GHz）
成瓷颜色：浅红色
对比例1
将实施例1中的氟化钙去除，其余配比和制备方法不变。
介质损耗 7.1×10-5（1MHz）、5.5×10-4（10GHz）
对比例2
将实施例1中的硼砂去除，其余配比和制备方法不变。
介质损耗 1.5×10-4（1MHz）、8.6×10-4（10GHz）
由以上实施例和对比例的测试数据可以知道，本发明的适用于低电阻引线的陶瓷封装外壳材料具有非常低的介质损耗。
以上所述，仅为本发明较佳的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，根据本发明的技术方案及其发明构思加以等同替换或改变，都应涵盖在本发明的保护范围之内。

Claims (6)

1.一种适用于低电阻引线的陶瓷封装外壳材料，其特征在于，二氧化硅、氟化钙、硼砂、氧化钡、氧化钾、着色剂和氧化铝。
2.如权利要求1所述的适用于低电阻引线的陶瓷封装外壳材料，其特征在于，由以下重量百分比的成分组成：二氧化硅 6-12%、氟化钙 1-3%、硼砂 1-2%、氧化钡 2-5%、氧化钾0.5-1%、着色剂 6-15%和氧化铝。
3.如权利要求1或2所述的适用于低电阻引线的陶瓷封装外壳材料，其特征在于，所述的着色剂为二氧化钛、氧化铜、三氧化二铬、氧化亚钴中的一种或者多种的组合。
4.如权利要求1或2所述的适用于低电阻引线的陶瓷封装外壳材料，其特征在于，所述的氧化铝为α相氧化铝，纯度＞99.9%。
5.如权利要求1或2所述的适用于低电阻引线的陶瓷封装外壳材料，其特征在于，所述的二氧化硅的粒径小于100nm、其余原料的粒径小于1μm。
6.如权利要求1或2所述的适用于低电阻引线的陶瓷封装外壳材料，其特征在于，所述的适用于低电阻引线的陶瓷封装外壳材料的制备方法，包括以下步骤：
A、将各种原料混合均匀；
B、成型；
C、将成型后在氮气与氢气的比例为1：（1-3）气氛中进行烧结，烧结温度为 800-1000℃，所述氮气与氢气的比例为体积比。
CN201910721021.5A 2019-08-06 2019-08-06 一种适用于低电阻引线的陶瓷封装外壳材料 Pending CN110423102A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910721021.5A CN110423102A (zh) 2019-08-06 2019-08-06 一种适用于低电阻引线的陶瓷封装外壳材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910721021.5A CN110423102A (zh) 2019-08-06 2019-08-06 一种适用于低电阻引线的陶瓷封装外壳材料

Publications (1)

Publication Number Publication Date
CN110423102A true CN110423102A (zh) 2019-11-08

Family

ID=68414391

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910721021.5A Pending CN110423102A (zh) 2019-08-06 2019-08-06 一种适用于低电阻引线的陶瓷封装外壳材料

Country Status (1)

Country Link
CN (1) CN110423102A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112390630A (zh) * 2020-12-23 2021-02-23 湖州聚合环保科技有限公司 一种低收缩率的陶瓷封装外壳材料

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4891344A (en) * 1985-12-20 1990-01-02 Fujitsu Limited Low dielectric constant ceramic substrate
CN1078709A (zh) * 1992-05-18 1993-11-24 中国科学院上海硅酸盐研究所 高铝陶瓷的低温烧结
CN102503377A (zh) * 2011-09-30 2012-06-20 中国电子科技集团公司第十三研究所 一种高强度半导体封装陶瓷材料及其制作方法
CN106747357A (zh) * 2016-12-22 2017-05-31 广东风华高新科技股份有限公司 低温共烧陶瓷及其制备方法
CN109399937A (zh) * 2018-12-27 2019-03-01 中建材蚌埠玻璃工业设计研究院有限公司 一种低介电常数玻璃粉及其制备方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4891344A (en) * 1985-12-20 1990-01-02 Fujitsu Limited Low dielectric constant ceramic substrate
CN1078709A (zh) * 1992-05-18 1993-11-24 中国科学院上海硅酸盐研究所 高铝陶瓷的低温烧结
CN102503377A (zh) * 2011-09-30 2012-06-20 中国电子科技集团公司第十三研究所 一种高强度半导体封装陶瓷材料及其制作方法
CN106747357A (zh) * 2016-12-22 2017-05-31 广东风华高新科技股份有限公司 低温共烧陶瓷及其制备方法
CN109399937A (zh) * 2018-12-27 2019-03-01 中建材蚌埠玻璃工业设计研究院有限公司 一种低介电常数玻璃粉及其制备方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112390630A (zh) * 2020-12-23 2021-02-23 湖州聚合环保科技有限公司 一种低收缩率的陶瓷封装外壳材料

Similar Documents

Publication Publication Date Title
US4861646A (en) Co-fired metal-ceramic package
JP2567491B2 (ja) 高熱伝導性着色窒化アルミニウム焼結体およびその製造方法
CN106904953B (zh) 高密度封装用高热膨胀系数陶瓷材料及其制备方法
WO1990002712A1 (en) Glass/ceramic sealing system
CN113233773A (zh) 一种ltcc基板材料及其制备方法
CN110423102A (zh) 一种适用于低电阻引线的陶瓷封装外壳材料
CN112299825A (zh) 一种低介低温共烧陶瓷材料的制备方法
CN102503377B (zh) 一种高强度半导体封装陶瓷材料及其制作方法
CN105777080A (zh) 一种高强度陶瓷封装基座材料及其制备方法
CN102898027B (zh) 电子元器件封装材料用陶瓷粉及其生产方法
CN101565302B (zh) 一种led用陶瓷封装材料及其制作方法
CN101092672A (zh) 超低热膨胀铝碳化硅电子封装基板或外壳材料复合物及制备产品的方法
CN112170997A (zh) Mct微波介质陶瓷与金属钎焊用玻璃钎料及其钎焊方法
CN115231955B (zh) 微波真空器件用氧化铝陶瓷金属化方法
EP1434750B1 (en) Thick film conductor compositions for use on aluminum nitride substrates
KR100664979B1 (ko) 글라스 프릿트와 그 제조방법, 이를 이용하는 외부전극용페이스트 조성물 및 적층세라믹 커패시터
CN106810078B (zh) 一种超低温烧结的微晶玻璃系微波介质材料及其制备方法
CN113582732B (zh) 一种提高金属化与陶瓷结合力的膏剂配方
CN115667169A (zh) 玻璃粉的制备方法、银浆以及制备方法
CN104891952A (zh) 一种低温烧结低介玻璃陶瓷复合基板材料及其制备方法
CN112125527B (zh) 一种铜浆料用高热膨胀玻璃粉及其制备方法和应用
Li et al. Influences of glass content on the microstructure and properties of BaO-CaO-Al2O3-SiO2 glass/alumina composite for LTCC applications
CN112390631A (zh) 一种可低温烧结的陶瓷封装外壳材料
CN113683404A (zh) 一种低温共烧陶瓷粉体材料及其制备方法和应用
CN109704763B (zh) 一种低温烧结陶瓷介质材料的制备方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20191108