CN110418506A - The method of electric conductivity between enhancing product structure - Google Patents
The method of electric conductivity between enhancing product structure Download PDFInfo
- Publication number
- CN110418506A CN110418506A CN201910711961.6A CN201910711961A CN110418506A CN 110418506 A CN110418506 A CN 110418506A CN 201910711961 A CN201910711961 A CN 201910711961A CN 110418506 A CN110418506 A CN 110418506A
- Authority
- CN
- China
- Prior art keywords
- fpc
- punching press
- electric conductivity
- product structure
- salient point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/033—Punching metal foil, e.g. solder foil
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The present invention provides a kind of method of electric conductivity between enhancing product structure comprising: S1, punch steps comprising: metal substrate S11, is provided, carries out first time punching press on metallic substrates, makes to be formed the salient point suitable for FPC fitting thereon；S12, second of punching press is carried out on metallic substrates, stamp out the appearance profile suitable for FPC fitting in the side of salient point；S13, third time punching press is carried out on metallic substrates, be suitable for the type chamber of FPC fitting in the appearance profile limited area punching press stamped out；S2, laminating step；S21, FPC is placed on adhesive bonding jig, in FPC by glue surface coating viscose glue；S22, FPC is transferred on the type chamber of metal substrate, and the glue surface of FPC is set towards type chamber；S23, FPC is bonded fixation with metal plate by way of hot pressing.The method of electric conductivity is suitable for the protrusion and type chamber of FPC fitting by punch forming on metallic substrates between enhancing product structure of the invention, is conducive to cooperate with the engraved structure on FPC, realizes the secure fit of FPC.
Description
Technical field
The present invention relates to a kind of methods of electric conductivity between FPC coating technique field more particularly to enhancing product structure.
Background technique
Flexible circuit board (Flexible Printed Circuit abbreviation FPC) is using polyimides or polyester film as base
One kind made of material has height reliability, excellent flexible printed circuit.High, the light-weight, thickness with Distribution density
Feature thin, bending is good.In actual application process, need that flexible circuit board is further fitted in a metal substrate
On, however in existing laminating type, in order to guarantee the secure fit between FPC and metal substrate, need auxiliary by rubber pad
The fixation of FPC is helped, when being so bonded, increases the laminating step of rubber pad, while rubber pad is easy hair after prolonged use
Raw failure.Therefore, in view of the above-mentioned problems, it is necessary to propose further solution.
Summary of the invention
The present invention is intended to provide it is a kind of enhancing product structure between electric conductivity method, with overcome it is existing in the prior art not
Foot.
In order to solve the above technical problems, the technical scheme is that
A kind of method of electric conductivity between enhancing product structure comprising:
S1, punch steps comprising:
S11, metal substrate is provided, carries out first time punching press on metallic substrates, make to be formed thereon suitable for the convex of FPC fitting
Point；
S12, second of punching press is carried out on metallic substrates, stamp out the shape wheel suitable for FPC fitting in the side of salient point
It is wide；
S13, third time punching press is carried out on metallic substrates, be suitable in the appearance profile limited area punching press stamped out
The type chamber of FPC fitting；
S2, laminating step；
S21, FPC is placed on adhesive bonding jig, in FPC by glue surface coating viscose glue；
S22, FPC is transferred on the type chamber of the metal substrate, and sets the glue surface of the FPC towards the type chamber
It sets；
S23, FPC is bonded fixation with metal plate by way of hot pressing.
As the improvement of the method for electric conductivity between enhancing product structure of the invention, the metal substrate is copper base.
As the improvement of the method for electric conductivity between enhancing product structure of the invention, in the step S11, carry out for the first time
When punching press, interval punching press is carried out on metallic substrates, each punching press position is formed at least one described salient point.
As the improvement of the method for electric conductivity between enhancing product structure of the invention, the salient point is three, three salient points
It is arranged side by side, the size of the salient point on both sides is greater than the size of intermediate salient point.
As the improvement of the method for electric conductivity between enhancing product structure of the invention, the appearance profile includes: to surround institute
It states the outer profile of salient point, positioned at the outer profile and be distributed in the hollowed out areas of the salient point two sides.
As the improvement of the method for electric conductivity between enhancing product structure of the invention, the third time punching press includes: will be outer
The both ends of shape profile are dug, and digging for both ends is carried out multilayer laminated bending along perpendicular to metal substrate direction.
As the improvement of the method for electric conductivity between enhancing product structure of the invention, the viscose glue is conductive heat melten gel.
Compared with prior art, the beneficial effects of the present invention are: between enhancing product structure of the invention electric conductivity method
It is suitable for the protrusion and type chamber of FPC fitting by punch forming on metallic substrates, is conducive to match with the engraved structure on FPC
Close, realize the secure fit of FPC, when avoiding fixed by rubber pad auxiliary FPC there are the drawbacks of.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The some embodiments recorded in invention, for those of ordinary skill in the art, without creative efforts,
It is also possible to obtain other drawings based on these drawings.
One method flow schematic diagram of Fig. 1 method of electric conductivity between enhancing product structure of the invention；
The schematic diagram of Fig. 2 punch steps in the method for electric conductivity between enhancing product structure of the invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The present invention provide it is a kind of enhancing product structure between electric conductivity method comprising: punch steps and subsequent patch
Close step.
Wherein, the purpose of punch steps is, so that the protrusion and type chamber for being suitable for FPC fitting are formed on metal substrate,
Be conducive to cooperate with the engraved structure on FPC, realize the secure fit of FPC.And subsequent laminating step will be then coated with thereon
The FPC of viscose glue is combined with the metal substrate Jing Guo punching press, and is fixedly secured by hot pressing mode.
In the exemplary embodiment, the punch steps include:
S11, metal substrate is provided, carries out first time punching press on metallic substrates, make to be formed thereon suitable for the convex of FPC fitting
Point；
S12, second of punching press is carried out on metallic substrates, stamp out the shape wheel suitable for FPC fitting in the side of salient point
It is wide；
S13, third time punching press is carried out on metallic substrates, be suitable in the appearance profile limited area punching press stamped out
The type chamber of FPC fitting.
In the exemplary embodiment, the metal substrate is copper base, while continuous punching for convenience, it is preferred to use
The copper base of bar shaped so can realize continuous feeding and continuous punching by way of copper coiled strip.
In the exemplary embodiment, in order to be adapted with the engraved structure on FPC, in the step S11, first is carried out
When secondary punching press, interval punching press is carried out on metallic substrates, each punching press position is formed at least one described salient point.At this point, institute
Stating salient point is three, and three salient points are arranged side by side, and the size of the salient point on both sides is greater than the size of intermediate salient point.In a substitution
In embodiment, it can also be first stamped and formed out intermediate salient point, then in second of punching press, be integrally formed the salient point and shape of two sides
Profile.
In the exemplary embodiment, in order to be adapted with the engraved structure on FPC, the appearance profile includes: to surround
The outer profile of the salient point positioned at the outer profile and is distributed in the hollowed out areas of the salient point two sides.
In the exemplary embodiment, the laminating step includes:
S21, FPC is placed on adhesive bonding jig, in FPC by glue surface coating viscose glue；
S22, FPC is transferred on the type chamber of the metal substrate, and sets the glue surface of the FPC towards the type chamber
It sets；
S23, FPC is bonded fixation with metal plate by way of hot pressing.
In the exemplary embodiment, the viscose glue is conductive heat melten gel.
In the exemplary embodiment, the third time punching press includes: and digs the both ends of appearance profile, and by both ends
It digs and carries out multilayer laminated bending along perpendicular to metal substrate direction.So set, forming above-mentioned multilayer by way of punching press
Bending bending structure is laminated, certain buffer function is played in protection when also helping punching press, and then certain guarantor is formed to FPC
Shield.
In conclusion the method for electric conductivity is suitable by punch forming on metallic substrates between enhancing product structure of the invention
In the protrusion and type chamber of FPC fitting, is conducive to cooperate with the engraved structure on FPC, realizes the secure fit of FPC, avoid
When fixed by rubber pad auxiliary FPC there are the drawbacks of.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (7)
1. a kind of method of electric conductivity between enhancing product structure, which is characterized in that the side of electric conductivity between the enhancing product structure
Method includes:
S1, punch steps comprising:
S11, metal substrate is provided, carries out first time punching press on metallic substrates, make to form the salient point suitable for FPC fitting thereon；
S12, second of punching press is carried out on metallic substrates, stamp out the appearance profile suitable for FPC fitting in the side of salient point；
S13, third time punching press is carried out on metallic substrates, paste in the appearance profile limited area punching press stamped out suitable for FPC
The type chamber of conjunction；
S2, laminating step；
S21, FPC is placed on adhesive bonding jig, in FPC by glue surface coating viscose glue；
S22, FPC is transferred on the type chamber of the metal substrate, and the glue surface of the FPC is set towards the type chamber；
S23, FPC is bonded fixation with metal plate by way of hot pressing.
2. the method for electric conductivity between enhancing product structure according to claim 1, which is characterized in that the metal substrate is
Copper base.
3. the method for electric conductivity between enhancing product structure according to claim 1, which is characterized in that in the step S11,
When carrying out first time punching press, interval punching press is carried out on metallic substrates, each punching press position is formed at least one described salient point.
4. the method for electric conductivity between enhancing product structure according to claim 3, which is characterized in that the salient point is three
A, three salient points are arranged side by side, and the size of the salient point on both sides is greater than the size of intermediate salient point.
5. the method for electric conductivity between enhancing product structure according to claim 1, which is characterized in that the appearance profile packet
It includes: surrounding the outer profile of the salient point, positioned at the outer profile and is distributed in the hollowed out areas of the salient point two sides.
6. the method for electric conductivity between enhancing product structure according to claim 1, which is characterized in that the third time punching press
It include: to dig the both ends of appearance profile, and digging for both ends is subjected to multilayer laminated bending along perpendicular to metal substrate direction.
7. the method for electric conductivity between enhancing product structure according to claim 1, which is characterized in that the viscose glue is conduction
Hot melt adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910711961.6A CN110418506A (en) | 2019-08-02 | 2019-08-02 | The method of electric conductivity between enhancing product structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910711961.6A CN110418506A (en) | 2019-08-02 | 2019-08-02 | The method of electric conductivity between enhancing product structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110418506A true CN110418506A (en) | 2019-11-05 |
Family
ID=68365468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910711961.6A Withdrawn CN110418506A (en) | 2019-08-02 | 2019-08-02 | The method of electric conductivity between enhancing product structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110418506A (en) |
-
2019
- 2019-08-02 CN CN201910711961.6A patent/CN110418506A/en not_active Withdrawn
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100774440B1 (en) | Conductive pressure sensitive adhesive tape | |
| KR20110110353A (en) | Solar battery cell connection method and solar battery module | |
| CN114023841A (en) | Connection method of solar cell string, solar cell module and preparation process thereof | |
| CN113129761A (en) | Display module and display device | |
| TW200539759A (en) | Flexible circuit substrate | |
| JP2011258433A (en) | Method of manufacturing shield flat cable, and shield tape used for the manufacturing method | |
| CN105898995A (en) | Preparation method for double-layer LED high-voltage circuit board | |
| CN110418506A (en) | The method of electric conductivity between enhancing product structure | |
| CN105898988B (en) | Backlight FPC full pages glued membrane and its whole rubberizing technique | |
| JP2006202675A (en) | Method of manufacturing heater mirror, and heater mirror | |
| EP1148540A2 (en) | Method and device for attaching a semiconductor chip to a chip carrier | |
| JP2014232864A (en) | Manufacturing method for solar battery module | |
| CN103379743B (en) | Electronic building brick and the method being connected to metallic object in the conducting wire of flexible carrier | |
| CN107278028A (en) | A kind of flexible PCB and preparation method thereof and mobile terminal | |
| JP4657840B2 (en) | Semiconductor device and manufacturing method thereof | |
| JP2014093359A (en) | Substrate | |
| JPS593902A (en) | Conductive adhesion sheet | |
| JP2015095609A (en) | Solar battery cell, solar battery module and manufacturing method thereof | |
| CN216752231U (en) | Flexible super heat-conduction aluminum substrate and LED lamp bead connecting structure | |
| CN206923139U (en) | A kind of aluminium base Rigid Flex | |
| JP2016006819A (en) | Manufacturing method of solar cell module | |
| CN215577411U (en) | Display module and display device | |
| TW200921518A (en) | Method for producing RFID and structure thereof | |
| CN211457535U (en) | Bridging structure between soft and hard substrates | |
| CN215010856U (en) | Spliced glass circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20191105 |