200539759 (1) 九、發明說明 【發明所屬之技術領域】 本發明係有關可撓性電路基板，尤其是以向異導電樹 脂膜來連接於對象機器或對象基板的可撓性電路基板。 【先前技術】 例如顯示面板之端子與電路的連接，是藉由以向異導 電樹脂層連接可撓性電路基板，來進行的。亦即，在顯示 面板之端子與可撓性電路基板之端子之間，配置向異導電 樹脂，藉由加熱加壓而進行連接（參考日本專利第 3 423 277號公報）。 第6圖，係將先前之可撓性電路基板之構造，表示爲 剖面圖者。作爲基底之樹脂薄膜1其表面及背面，配置有 銅箔等的配線層2、3 ;且此等配線層2、3，係對通孔施 加通孔電鍍4而被互相連接。然後覆蓋通孔電鍍4地’設 置絕緣樹脂層5。 此可撓性電路基板中，設置於圖示左側端與顯示面板 的連接部，係藉由金電鍍等設有表面處理層6 ;此表面處 理層6上，形成有與顯示面板之端子（未圖示）進行連接 的向異導電樹脂層7。 向異導電樹脂，係例如含有導電粒子之黏著劑，爲黏 膠狀或薄膜狀。然後於導體間挾持向異導電樹脂並於單方 向持續加熱，可形成導電性粒子接觸於應連接之導體的連 接狀態，而在加壓方向以外成爲非連接狀態者。 200539759 (2) 第7圖，係表示使用此向異導電樹脂，將可撓性電路 基板10連接於顯示面板20之型態，而爲沿著第6圖A-A 線切斷者。包覆構成可撓性電路基板1 〇之端子的配線層 2、通孔電鍍4及表面處理層6地，來塡充向異導電樹脂 層7，然後對準可撓性電路基板1 0，與顯示面板20之端 子1及端子22，而加以配置。 接著，由可撓性電路基板1 〇之背後，向著顯示面板 g 2 0而押上加熱加壓工具3 0，經由向異導電樹脂層7而將 可撓性電路基板1 0按壓於顯示面板2 0。依此，可撓性電 路基板1 〇會被連接於顯示面板2 0，且被黏著。 第8圖，係表示此食用於定位之標誌。設置於可撓性 電路基板1 〇終端子之最外端的標誌6a，係在經由向異導 電樹脂層7，對準可撓性電路基板1 0和顯示面板之端子 22時，被用以作爲目標。 在此，將可撓性電路基板1 〇加熱加壓於顯示面板2 0 φ 時，會使可撓性電路基板本身產生折曲、扭曲，而這會成 爲作業之障礙。作爲該對策，例如在日本特開 2 0 0 3 1 9 8 0 7 0號公報中，是由可撓性電路基板之背面側， 以補強薄膜進行背襯，而提高其剛性。 【發明內容】 發明所欲解決之課題 若如此提高可撓性基板之剛性，則可改善作業性。但 是，爲了背襯必須有黏貼補強薄膜的工程。 -5- 200539759 (3) 另一方面，可撓性電路基板係如第6圖之破折線所示 ，沿著形成有顯示面板之端子的端部，折彎2地點而組裝 入機器時，就算是可撓性電路基板也難以折彎。結果，會 有因爲黏貼補強薄膜，而使作業性惡化的問題。 本發明係考慮了上述各點，而以提供一種具有不會產 生折曲、扭曲之剛性，且對於對象機器或對象基板之連接 作業亦有良好作業性的，可撓性電路基板爲目的。 用以解決課題之手段 爲了達成上述目的，本發明中係提供一種於絕緣層之 至少一面，形成有具備藉由向異導電樹脂層連接對象機器 及對象基板之端子，及設有表示此端子之配置相對位置之 標誌之端子範圍的電路配線層，而如此構成的可撓性電路 基板；其中具有在設有上述電路層之面其反對側面中，於 對應上述端子範圍之位置，將較上述端子範圍及上述電路 φ 基板之外緣更內側的上述向異導電樹脂層，其外緣附近作 爲邊緣部，且於錯開內側之上述端子範圍之位置，設有用 以透視上述標誌之開口的，平塗配線層；上述絕緣層，係 具有可透視到上述平塗配線層之程度的透明性。 發明效果 本發明係如上述，在端子位置之內側以平塗配線層做 背襯，可具有用以對準對象機器或對象基板之端子的充分 剛性，又可使對象機器與可撓性基板保持平行狀態，以加 -6- 200539759 (4) 熱加壓工具的壓合頭來進行良好的按壓並壓合之。又，因 絕緣層係爲透明性者，故可透過絕緣層看到相反側之層， 以位於端子位置背面側之平塗配線層作爲目標，而可適當 塡充向異導電性樹脂。從而，對於對象機器或對象基板連 接可撓性電路基板時，作業性係爲良好。 【實施方式】 g 參考第1圖至第5圖，說明本發明之實施方式。 [實施方式1 ] 第1圖係本發明之實施方式1的平面圖，表示一可撓 性電路基板之端部，該基板設置有對於對象機器例如顯示 面板的連接端子。第1圖之中央，係於縱方向以等節距 1 2條表面處理層（端子）6，自左右最外部之端子6延伸 出有標誌6a。 φ 然後，電路基板1 〇 A中’在包含端子6及標誌6 a， 自基板外緣Π緩緩向內側延伸的範圍中，形成有向異導 電樹脂層7。故，必須適當的使向異導電樹脂之塡充量不 會過多。 又第1圖中’係以雙破折線（輪廓）及虛線（銅箔） 來表示位於電路基板1 〇 A之背面側的背襯用平塗配線層3 。此平塗配線層3，係其外緣自基板外緣Π更往內側地 ’且開口有相當於標誌6 a之周圍的範圍地，來被設置。 然後基板1 〇 A ’係使用某種程度透明的絕緣層。 -7- 200539759 (5) 故作爲電路基板1 0 A之平面圖，雖以平塗配線層3 來背襯，但標誌6a之背後係沒有平塗配線層3之狀態； 而與端子6爲相同材料，亦即銅箔所形成的標誌6a，不 會被背景的平塗配線層3埋沒而可看見，故可以標誌6 a 作爲明確目標來作業。然後標誌6a因爲是十字狀，故不 只對電路基板1 〇 A，對平塗配線層3亦可輕易把握縱橫各 方向的位置關係。 φ 第2圖，係沿著第1圖之B - B線的剖面圖。然後由第 2圖可得知，較基底薄膜1更位於圖示上方的部分，係與 第7圖所示者相同，爲電路配線層2、通孔電鍍4及表面 處理層6。 另一方面，較基底薄膜1更位於圖示下方處，係設有 平塗配線層3、通孔電鍍4及表面處理層6。惟，此等3 層在對應標誌6之位置，係成爲空洞。然後由上方看時， 可明確的辨認標誌6a。 φ 第3圖，係具有第1圖及第2圖所示之構造的端子， 顯示面板用之可撓性電路基板的縱剖面圖。圖中右端，係 與顯示面板（未圖示）之端子連接的端子部，而圖示左端 爲電路基板本體；而中央，則是將可撓性電路基板沿著圖 示破折線折彎，將顯示面板之基板收入爲C字形時，與基 板之端面接觸的部分。此等端子部、電路基板本體及接觸 部分的相互之間，爲了增加彎曲性，係形成有構成了單面 銅貼基板的彎曲部。 第4圖，係沿著第3圖中C - C線來切斷的縱剖面圖， -8- 200539759 (6) 而相當於第7圖者。亦即，於如第2圖所示而形成的可撓 性電路基板1 0 A之端子部，使其形成向異導電樹脂層7 地來適量供給向異導電樹脂，而對準顯示面板2 〇並裝載 之。顯示面板2 0，係由基板2 1和端子2 2所構成。此時 標誌6a ’係可利用於可撓性電路基板〗〇A與顯示面板20 的端子對準。 然後設置向異導電樹脂時，爲了對準基板外緣之位置 g ’係可藉由透過基底薄膜1來觀察平塗配線層3，一邊確 認位置一邊作業。向異導電樹脂層7若是形成爲薄膜狀者 ，則預先切斷爲特定形狀，而黏貼於電路基板1 0 A之端 子6的位置。此時，藉由將平塗配線層3作爲黏貼向異導 電樹脂層7的目標，則可黏貼於正確位置。使用黏膠狀之 向異導電樹脂時，可利用平塗配線層3來作爲塗佈作業的 目標。 對準之後，以加熱加壓工具3 0將可撓性電路基板 φ 1 〇A按壓向顯示面板20，而可藉由向異導電樹脂層7進 行電性連接及黏著。 此時，電路基板1 0A與顯示面板20，係由加熱加壓 工具30之壓合頭（未圖示），自上下被按壓。壓合頭係 由一對構件所構成，一方被固定，另一方係相對於此且構 成可旋轉者，而在兩構件間插入被處理物並壓合。 電路基板1 〇 A，因背面配線層3之存在而有充分剛性 ，故藉由被壓合頭挾持而與顯示面板20亦同被加熱加壓 ，兩者可經由向異導電樹脂層7成爲良好平行關係，而被 -9- k 200539759 (7) 壓合、連接。 第5圖’係表示可撓性電路基板被連接於顯示面板 LCD的狀態。這是將第3圖中爲展開狀態之可撓性電路基 板折彎爲C字形，而安裝於顯示面板之端子部者；成爲以 C字形之部分，吞入顯示面板之基板的狀態。 【圖式簡單說明】 φ 第1圖表示本發明之實施方式1之構造的說明圖 第2圖沿著第1圖B-B線的橫剖面圖 第3圖具有第1圖及第2圖所示之構造之端子，一種 顯示基板用之可撓性電路基板的縱剖面圖 第4圖沿著第3圖C-C線切斷的橫剖面圖 第5圖表示可撓性電路基板被連接於顯示面板LCD 之狀態的說明圖 第6圖表示先前此可撓性電路基板之構造的剖面圖 φ 第7圖表示先前使用向異導電樹脂，將可撓性電路基 板連接於顯示面板之型態的說明圖 第8圖表示將先前之可撓性電路基板裝配於顯示面板 時，其對準用之標誌的說明圖。 【主要元件符號說明】 1 基底薄膜 2 配線層 3 平塗配線層 -10- 200539759 (8) 4 通孔電鍍 5 絕緣樹脂層 6 表面處理層 6 a 標誌 6 b 表面處理層 7 向異導電樹脂層 10 可撓性電路基板 10A 電路基板 11 基板外緣 2 0 顯示面板 2 1 基板 22 端子 30 加熱加壓工具200539759 (1) IX. Description of the invention [Technical field to which the invention belongs] The present invention relates to a flexible circuit board, and particularly to a flexible circuit board connected to a target device or a target substrate with an anisotropic conductive resin film. [Prior art] For example, the terminals of a display panel are connected to a circuit by connecting a flexible circuit board with an anisotropic conductive resin layer. That is, an anisotropic conductive resin is arranged between the terminal of the display panel and the terminal of the flexible circuit board, and is connected by applying heat and pressure (see Japanese Patent No. 3 423 277). Fig. 6 is a cross-sectional view showing the structure of a conventional flexible circuit board. The resin film 1 as a base is provided with wiring layers 2 and 3 of copper foil and the like on the front and back sides; and these wiring layers 2 and 3 are connected to each other by applying through-hole plating 4 to the through-holes. An insulating resin layer 5 is then provided to cover the through-hole plating 4 '. In this flexible circuit board, a connection portion between the left end of the figure and the display panel is provided, and a surface treatment layer 6 is provided by gold plating or the like; on this surface treatment layer 6, a terminal (not shown) with the display panel is formed (Illustrated) Anisotropic conductive resin layer 7 to be connected. The anisotropic conductive resin is, for example, an adhesive containing conductive particles, and is adhesive or film-like. Then, the anisotropic conductive resin is held between the conductors and continuously heated in one direction to form a connected state where the conductive particles are in contact with the conductors to be connected, and become a non-connected state outside the pressure direction. 200539759 (2) FIG. 7 shows a type in which the flexible circuit board 10 is connected to the display panel 20 using this anisotropic conductive resin, and is cut along the line A-A in FIG. 6. The wiring layer 2, the through-hole plating 4, and the surface treatment layer 6 constituting the terminals of the flexible circuit board 10 are covered to fill the heteroconductive resin layer 7, and then aligned with the flexible circuit board 10, and The terminals 1 and 22 of the display panel 20 are arranged. Next, from behind the flexible circuit board 10, a heating and pressing tool 30 is pressed toward the display panel g20, and the flexible circuit board 10 is pressed against the display panel 20 through the anisotropic resin layer 7. . According to this, the flexible circuit board 10 is connected to the display panel 20 and is adhered. Figure 8 shows the sign used for positioning. The mark 6a provided on the outermost end of the flexible circuit board 10 terminal is used as a target when the flexible circuit board 10 and the terminal 22 of the display panel are aligned via the anisotropic conductive resin layer 7. . Here, when the flexible circuit board 10 is heated and pressurized to the display panel 20 φ, the flexible circuit board itself will be bent and twisted, which will become an obstacle to work. As a countermeasure for this, for example, in Japanese Patent Application Laid-Open No. 20 3 198 0 70, a flexible circuit board is backed with a reinforcing film to improve its rigidity. SUMMARY OF THE INVENTION Problems to be Solved by the Invention If the rigidity of a flexible substrate is increased in this way, workability can be improved. However, it is necessary to have a process of sticking a reinforcing film for the backing. -5- 200539759 (3) On the other hand, as shown in the dashed line in FIG. 6, the flexible circuit board is folded into two places along the end of the terminal where the display panel is formed, and it is counted even when it is assembled into the machine. It is also difficult to bend the flexible circuit board. As a result, there is a problem that workability is deteriorated due to adhesion of the reinforcing film. The present invention has been made in consideration of the foregoing points, and has as its object to provide a flexible circuit board having rigidity that does not cause bending and distortion, and also has good workability for connection operation of a target device or a target substrate. Means for Solving the Problem In order to achieve the above object, the present invention provides a terminal provided on at least one side of an insulating layer with a target device and a target substrate connected by an anisotropic resin layer, and a terminal provided with the terminal. The circuit wiring layer of the terminal range of the relative position mark is arranged, and the flexible circuit board is configured in this way. Among them, the opposite side of the surface on which the circuit layer is provided is located at a position corresponding to the terminal range. Range and the circuit φ The above-mentioned anisotropic conductive resin layer on the outer edge of the substrate, the vicinity of the outer edge of which is an edge portion, and is located at a position staggered from the inner terminal range, and is provided with an opening for seeing the sign, flat Wiring layer; the above-mentioned insulating layer is transparent to such an extent that it can see through to the flat-coated wiring layer. ADVANTAGEOUS EFFECTS OF THE INVENTION As described above, the present invention is backed by a flat-coated wiring layer inside the terminal position, which can have sufficient rigidity to align the terminals of the target device or the target substrate, and can also hold the target device and the flexible substrate. In a parallel state, use -6-200539759 (4) The pressing head of the hot pressing tool to perform good pressing and press it. In addition, since the insulating layer is transparent, the opposite layer can be seen through the insulating layer, and a flat-coated wiring layer located on the back side of the terminal position can be used as a target, so that an anisotropic resin can be appropriately filled. Therefore, when a flexible circuit board is connected to a target device or a target substrate, the workability is good. [Embodiment] g Embodiments of the present invention will be described with reference to Figs. 1 to 5. [Embodiment 1] FIG. 1 is a plan view of Embodiment 1 of the present invention and shows an end portion of a flexible circuit board provided with connection terminals for a target device such as a display panel. In the center of FIG. 1, there are 12 surface treatment layers (terminals) 6 at equal pitches in the longitudinal direction. Marks 6a extend from the outermost terminals 6 on the left and right. φ In the circuit substrate 10A, an anisotropically conductive resin layer 7 is formed in a range including the terminal 6 and the mark 6a and gradually extending inward from the outer edge Π of the substrate. Therefore, it is necessary to appropriately prevent the amount of anisotropic resin from being excessively high. In the first figure, the double-dashed line (outline) and the dashed line (copper foil) indicate the flat-coated wiring layer 3 for the backing which is located on the back side of the circuit board 10A. The flat-coated wiring layer 3 is provided in such a manner that the outer edge thereof is further inward from the outer edge Π of the substrate, and a region corresponding to the mark 6a is opened. Then, the substrate 10A 'uses a transparent insulating layer to some extent. -7- 200539759 (5) Therefore, as a plan view of the circuit board 10 A, although it is backed by a flat-coated wiring layer 3, there is no state of the flat-coated wiring layer 3 behind the mark 6a; and the same material as the terminal 6 That is, the mark 6a formed by the copper foil is not buried and visible by the background flat-coated wiring layer 3. Therefore, the mark 6a can be operated as a clear target. Since the mark 6a is cross-shaped, it is easy to grasp the positional relationship between the vertical and horizontal directions not only for the circuit board 10A but also for the flat-coated wiring layer 3. φ Figure 2 is a sectional view taken along line B-B of Figure 1. Then, it can be seen from FIG. 2 that the portion located above the figure than the base film 1 is the same as that shown in FIG. 7 and is the circuit wiring layer 2, the through-hole plating 4, and the surface treatment layer 6. On the other hand, it is located lower than the base film 1 in the figure, and is provided with a flat-coated wiring layer 3, a through-hole plating 4 and a surface treatment layer 6. However, these three layers are hollow at the position corresponding to the mark 6. When viewed from above, the mark 6a can be clearly identified. φ FIG. 3 is a vertical cross-sectional view of a flexible circuit board for a terminal having a structure shown in FIGS. 1 and 2 and a display panel. The right end of the figure is the terminal part connected to the terminal of the display panel (not shown), and the left end of the figure is the circuit board body; while in the center, the flexible circuit board is bent along the broken line shown in the figure. When the substrate of the display panel is in a C-shape, the portion in contact with the end surface of the substrate. In order to increase the flexibility between these terminal portions, the circuit board body, and the contact portions, bent portions forming a single-sided copper-clad substrate are formed. Fig. 4 is a longitudinal sectional view taken along the line C-C in Fig. 3, -8-200539759 (6), and corresponds to the figure in Fig. 7. That is, at the terminal portion of the flexible circuit board 10 A formed as shown in FIG. 2, the anisotropic resin layer 7 is formed to supply an appropriate amount of anisotropic resin, and the display panel 2 is aligned. And load it. The display panel 20 is composed of a substrate 21 and terminals 22. At this time, the mark 6a 'can be used for aligning the terminals of the display panel 20 with the flexible circuit board. Then, when an anisotropic conductive resin is provided, in order to align the position g 'of the outer edge of the substrate, the flat-coated wiring layer 3 can be observed through the base film 1, and the position can be checked while confirming the position. If the anisotropic conductive resin layer 7 is formed in a thin film shape, it is cut in advance into a specific shape and adhered to the position of the terminal 6 of the circuit board 10A. At this time, by using the flat-coated wiring layer 3 as a target to be adhered to the heteroconductive resin layer 7, it is possible to adhere to the correct position. When a viscous anisotropic conductive resin is used, the flat coating wiring layer 3 can be used as a coating operation target. After the alignment, the flexible circuit substrate φ 100A is pressed against the display panel 20 with a heating and pressing tool 30, and the electrical connection and adhesion can be performed by the heteroconductive resin layer 7. At this time, the circuit board 10A and the display panel 20 are pressed from above and below by a pressing head (not shown) of the heating and pressing tool 30. The pressing head is composed of a pair of members, one of which is fixed, and the other of which is a rotatable member, and the object to be processed is inserted and pressed between the two members. The circuit board 10A is sufficiently rigid due to the presence of the back wiring layer 3, so it is heated and pressurized in the same manner as the display panel 20 by being held by the pressing head, and the two can be made good through the anisotropic resin layer Parallel relationship, while being pressed and connected by -9-2005200539759 (7). Fig. 5 'shows a state where the flexible circuit board is connected to the display panel LCD. This is a state in which the flexible circuit board in the unfolded state shown in FIG. 3 is bent into a C-shape and mounted on a terminal portion of a display panel; the C-shaped portion is swallowed into the substrate of the display panel. [Brief description of the drawings] φ Fig. 1 is an explanatory diagram showing the structure of the first embodiment of the present invention. Fig. 2 is a cross-sectional view taken along line BB of Fig. 1. Fig. 3 includes the first and second drawings. A structured terminal, a longitudinal sectional view of a flexible circuit board for a display substrate. FIG. 4 is a cross-sectional view cut along the CC line of FIG. 3. FIG. 5 shows a flexible circuit board connected to a display panel LCD. Explanation of the state. Fig. 6 is a cross-sectional view of the structure of the flexible circuit board. Fig. 7 is an explanatory diagram of the type in which the flexible circuit board is connected to the display panel. The figure is an explanatory diagram of a mark for alignment when a conventional flexible circuit board is mounted on a display panel. [Description of main component symbols] 1 Base film 2 Wiring layer 3 Flat coating wiring layer-10- 200539759 (8) 4 Through-hole plating 5 Insulating resin layer 6 Surface treatment layer 6 a Mark 6 b Surface treatment layer 7 Anisotropic conductive resin layer 10 Flexible circuit board 10A Circuit board 11 Substrate outer edge 2 0 Display panel 2 1 Substrate 22 Terminal 30 Heating and pressing tool