CN110416198A - 一种新型的三合一全彩led贴片 - Google Patents

一种新型的三合一全彩led贴片 Download PDF

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CN110416198A
CN110416198A CN201910737061.9A CN201910737061A CN110416198A CN 110416198 A CN110416198 A CN 110416198A CN 201910737061 A CN201910737061 A CN 201910737061A CN 110416198 A CN110416198 A CN 110416198A
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bowl
blue chip
luminous zone
nanometers
novel
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林成通
孙亚婕
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ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co Ltd
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ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

本发明公开一种新型的三合一全彩LED贴片,包括碗杯,其特征在于:所述碗杯包括碗底、碗壁,所述碗底内表面为固晶区,所述碗底外表面设有六个金属引脚,所述碗杯内设有两个内杯壁把所述碗杯内部空间分隔成第一发光区、第二发光区、第三发光区,所述第一发光区内设有波段为440‑465纳米的蓝色芯片一、包裹所述蓝色芯片一的绿色胶体,所述第二发光区内设有波段为440‑465纳米的蓝色芯片二、包裹所述蓝色芯片二的红色胶体,所述第三发光区内设有波段为465‑485纳米的蓝色芯片三、包裹所述蓝色芯片三的无色胶体。采用本技术方案,三种颜色发光芯片都采用蓝色芯片,避免了不同颜色芯片因光衰差异出现色飘的问题,且蓝色相对成本低,节约了生产制造成本,提高了光品质。

Description

一种新型的三合一全彩LED贴片
技术领域
本发明涉及LED技术领域,尤其是一种新型的三合一全彩LED贴片。
背景技术
随着照明技术的发展,以及智能化理念的深入,智能照明受到许多照明企业以及智能控制企业的热捧。全彩智能LED灯因其即能随意调节灯光的颜色和亮度,又能提供专业的白光照明,所以受到人们的热捧。
目前的彩色LED灯是将白(包括冷白和暖白等各种照明白光)、红、绿、蓝(R、G 、B)四种基本颜色的LED灯珠芯片封装在一个碗杯中,每一种颜色的LED灯珠芯片分别与驱动电路和单片机相连接,单独控制。直接由红、绿、蓝(R、G、B)三种芯片混合发出白光的光谱半波宽很窄显色指数低,光色品质量高。由于目前芯片制备工艺条件的限制,绿色芯片的发光效率比较低,降低了整个光源的效率。而且红色芯片的电压与绿色和蓝色芯片的电压有一定的差异,三种芯片电压的匹配度差,这样对于驱动的选择有更高的要求,增加了成本。在光源使用过程中,由于三种芯片的光衰存在差异,所以会出现色飘的现象。就算加上白光光源,但是效果不佳,而且增加了成本。如何克服现在彩色LED灯面临的难题,这是亟待解决的事情。
发明内容
本发明要解决的技术问题是:现有的LED贴片出现色飘的现象、成本高的问题
本发明解决该技术问题采用的技术方案是:
一种新型的三合一全彩LED贴片,包括碗杯,其特征在于:所述碗杯包括碗底、碗壁,所述碗底内表面为固晶区,所述碗底外表面设有六个金属引脚,所述碗杯内设有两个内杯壁把所述碗杯内部空间分隔成第一发光区、第二发光区、第三发光区,所述第一发光区内设有波段为440-465纳米的蓝色芯片一、包裹所述蓝色芯片一的绿色胶体,所述第二发光区内设有波段为440-465纳米的蓝色芯片二、包裹所述蓝色芯片二的红色胶体,所述第三发光区内设有波段为465-485纳米的蓝色芯片三、包裹所述蓝色芯片三的无色胶体。
作为优选,所述绿色胶体为绿色胶水固化后形成,所述绿色胶水各组分质量百分比为硅胶36%-39%、波长495-520纳米青色荧光粉51%-53%、波长530-550纳米绿色荧光粉9%-12%。
作为优选,所述红色胶体为红色胶水固化后形成,所述红色胶水各组分质量百分比为硅胶74%-76%、波长600-700纳米红色色荧光粉24%-26%。
作为优选,所述无色胶体为硅胶固化后形成。
作为优选,六个所述金属引脚分为三对,第一对所述金属引脚分别与所述蓝色芯片一正负极连接,第二对所述金属引脚分别与所述蓝色芯片二正负极连接,第三对所述金属引脚分别与所述蓝色芯片三正负极连接。
本发明的有益效果是:采用本技术方案,三种颜色发光芯片都采用蓝色芯片,避免了不同颜色芯片因光衰差异出现色飘的问题,且蓝色相对成本低,节约了生产制造成本。三部分发光区是独立控制的,可以自由控制调节光源的颜色和亮度,实现变色的效果。不同波段的蓝色芯片并封装了不同波段的荧光粉,所以光源发出光的光谱宽,达到全光谱产品的效果,显色指数为98,R1-R15均大于95,光谱接近太阳光的光谱,提高了光品质。
附图说明
图1是本发明实施例主视图
图2是本发明实施例背面示意图
图3是本发明实施例芯片安装示意图
图中:1.碗杯;2.碗底;3.碗壁;4.固晶区;5.金属引脚;6.内杯壁;7.第一发光区;8. 第二发光区;9. 第三发光区;10.蓝色芯片一;11.绿色胶体;12.蓝色芯片二;13.红色胶体;14.蓝色芯片三;15.无色胶体;16.金属导线。
具体实施方式
下面结合附图和实施例,对本发明的具体实施方式作进一步详细描述。以下实施例用于说明本发明,但不用来限制本发明的范围。
一种新型的三合一全彩LED贴片,包括碗杯1,碗杯1包括碗底2、碗壁3,碗底2内表面为固晶区4,碗底2外表面设有六个金属引脚5,碗杯1内设有两个内杯壁6,两个内杯壁6把碗杯1内部空间分隔成第一发光区7、第二发光区8、第三发光区9,第一发光区7内设有波段为445纳米的蓝色芯片一10、包裹蓝色芯片一10的绿色胶体11,第二发光区8内设有波段为452.5纳米的蓝色芯片二12、包裹蓝色芯片二12的红色胶体13,第三发光区9内设有波段为472.5纳米的蓝色芯片三14、包裹蓝色芯片三14的无色胶体15。
六个金属引脚5分为三对,第一对金属引脚5分别与蓝色芯片一10正负极连接,第二对金属引脚5分别与蓝色芯片二12正负极连接,第三对金属引脚5分别与蓝色芯片三14正负极连接。
本实施例中,绿色胶体11为绿色胶水固化后形成,绿色胶水各组分质量百分比为硅胶36%、波长500纳米青色荧光粉53%、波长550纳米绿色荧光粉11%。红色胶体13为红色胶水固化后形成,红色胶水各组分质量百分比为硅胶74%、波长700纳米红色色荧光粉26%。无色胶体15为硅胶固化后形成。
本发明可改变为多种方式对本领域的技术人员是显而易见的,这样的改变不认为脱离本发明的范围。所有这样的对所述领域技术人员显而易见的修改将包括在本权利要求的范围之内。

Claims (5)

1.一种新型的三合一全彩LED贴片,包括碗杯,其特征在于:所述碗杯包括碗底、碗壁,所述碗底内表面为固晶区,所述碗底外表面设有六个金属引脚,所述碗杯内设有两个内杯壁把所述碗杯内部空间分隔成第一发光区、第二发光区、第三发光区,所述第一发光区内设有波段为440-465纳米的蓝色芯片一、包裹所述蓝色芯片一的绿色胶体,所述第二发光区内设有波段为440-465纳米的蓝色芯片二、包裹所述蓝色芯片二的红色胶体,所述第三发光区内设有波段为465-485纳米的蓝色芯片三、包裹所述蓝色芯片三的无色胶体。
2.如权利要求1所述的新型的三合一全彩LED贴片,其特征在于:所述绿色胶体为绿色胶水固化后形成,所述绿色胶水各组分质量百分比为硅胶36%-39%、波长495-520纳米青色荧光粉51%-53%、波长530-550纳米绿色荧光粉9%-12%。
3.如权利要求1所述的新型的三合一全彩LED贴片,其特征在于:所述红色胶体为红色胶水固化后形成,所述红色胶水各组分质量百分比为硅胶74%-76%、波长600-700纳米红色色荧光粉24%-26%。
4.如权利要求1所述的新型的三合一全彩LED贴片,其特征在于:所述无色胶体为硅胶固化后形成。
5.如权利要求1所述的新型的三合一全彩LED贴片,其特征在于:六个所述金属引脚分为三对,第一对所述金属引脚分别与所述蓝色芯片一正负极连接,第二对所述金属引脚分别与所述蓝色芯片二正负极连接,第三对所述金属引脚分别与所述蓝色芯片三正负极连接。
CN201910737061.9A 2019-08-10 2019-08-10 一种新型的三合一全彩led贴片 Pending CN110416198A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113540322A (zh) * 2021-06-03 2021-10-22 东莞市立德达光电科技有限公司 一种摄影补光灯led封装方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113540322A (zh) * 2021-06-03 2021-10-22 东莞市立德达光电科技有限公司 一种摄影补光灯led封装方法

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