CN110416195A - A kind of car light lamp bead synthetic method and a kind of lamp bead synthesize LED support - Google Patents
A kind of car light lamp bead synthetic method and a kind of lamp bead synthesize LED support Download PDFInfo
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- CN110416195A CN110416195A CN201810402734.0A CN201810402734A CN110416195A CN 110416195 A CN110416195 A CN 110416195A CN 201810402734 A CN201810402734 A CN 201810402734A CN 110416195 A CN110416195 A CN 110416195A
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- Prior art keywords
- led
- lamp bead
- baking
- placement region
- led wafer
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- 239000011324 bead Substances 0.000 title claims abstract description 60
- 238000010189 synthetic method Methods 0.000 title description 6
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 16
- 238000003786 synthesis reaction Methods 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000000843 powder Substances 0.000 claims abstract description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000000203 mixture Substances 0.000 claims abstract description 8
- 238000007711 solidification Methods 0.000 claims abstract description 8
- 230000008023 solidification Effects 0.000 claims abstract description 8
- 239000000741 silica gel Substances 0.000 claims abstract description 7
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 7
- 239000000853 adhesive Substances 0.000 claims abstract description 5
- 230000001070 adhesive effect Effects 0.000 claims abstract description 5
- 239000003292 glue Substances 0.000 claims abstract description 4
- 230000002194 synthesizing effect Effects 0.000 claims description 5
- 238000009434 installation Methods 0.000 abstract description 7
- 239000002994 raw material Substances 0.000 abstract description 4
- 238000003466 welding Methods 0.000 abstract description 3
- 230000003796 beauty Effects 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003760 hair shine Effects 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The present invention provides a kind of packaging method of auto lamp synthesis lamp bead, is applied to car light technical field, and the method for the synthesis lamp bead includes at least: LED support first carries out 150 DEG C of dehumidifying bakings, and baking time is 0.5-1.5 hours；Crystal-bonding adhesive solidification baking is carried out after the LED placement region on the LED support enters the first LED wafer admittedly, wherein first LED wafer is positive polarity placement；Consolidate again in the LED placement region and carry out solidification baking into the second LED wafer, wherein second LED wafer is reversed polarity；Lead welding is carried out to second LED wafer and the first LED wafer electrode and bracket, and injects the mixture of fluorescent powder and silica gel in the LED placement region, then carries out glue curing baking, wherein the time for solidifying baking is 1-4 hours.In addition, the present invention also provides a kind of lamp beads to synthesize LED support.Using the embodiment of the present invention, lamp bead cost is reduced, allows back-end client to reduce raw material cost and increases installation beauty.
Description
Technical field
The present invention relates to car light lamp bead hybrid technology fields, close more particularly to a kind of lamp bead synthetic method and a kind of lamp bead
At LED support.
Background technique
Common lamp bead has simple three colors RGB encapsulation paster LED lamp bead currently on the market, this lamp bead can only be only as one kind
Landscape ornamental.
What is seen currently on the market is simple sodium yellow LED patch encapsulation, and wavelength is in 590-595；Or cool colour temperature LED
Patch encapsulation, colour temperature is about in 4000-6500K；This lamp bead discrete can only use or be purely by way of a kind of illuminator use.
Therefore, one kind is lacked on existing market and is capable of the lamp bead of mixed luminescence as vehicle light illumination and warning use.
Summary of the invention
In view of the foregoing deficiencies of prior art, the purpose of the present invention is to provide a kind of encapsulation of car light synthesis lamp bead
Method and a kind of lamp bead synthesize LED support, for solving the problems, such as lamp bead synthesis in the prior art.
In order to achieve the above objects and other related objects, the present invention provides a kind of method for synthesizing lamp bead, the synthesis lamp
The method of pearl includes at least:
LED support first carries out 150 DEG C of dehumidifying bakings, and baking time is 0.5-1.5 hours；
Crystal-bonding adhesive solidification baking is carried out after the LED placement region on the LED support enters the first LED wafer admittedly, wherein
First LED wafer is positive polarity；
Consolidate again in the LED placement region and carry out solidification baking into the second LED wafer, wherein second LED wafer
For reversed polarity；
Second LED wafer and first LED wafer are welded, and injected in the LED placement region
Then the mixture of fluorescent powder and silica gel carries out glue curing baking, wherein the time for solidifying baking is 1-4 hours.
In the preferred embodiment of the present invention, first LED wafer is LED blue light chip, and second LED wafer is
LED yellow light chip.
In the preferred embodiment of the present invention, the time for solidifying baking is 2-4 hours.
In the preferred embodiment of the present invention, the wave-length coverage of the LED blue light chip is 445-465nm.
In the preferred embodiment of the present invention, the LED yellow light chip wave-length coverage 585-595nm.
In addition, the invention also discloses a kind of lamp beads to synthesize LED support, the bracket includes: LED placement region, first
Polar region, the second polar region, border area, fixed frame；The LED placement region is fixed on the fixed frame, described
First polar region and second polar region are located in the LED placement region, and are located at the both ends of LED wafer,
The border area is located at the edge of the LED placement region and is higher by the surface of the LED placement region.
As described above, a kind of lamp bead synthetic method of the invention and a kind of lamp bead synthesize LED support, have beneficial below
Effect:, by the synthesis in the enterprising portable lighter pearl of LED support, realize the problem of two lamp beads are synthesized into a lamp bead.So by
Two lamp beads, which synthesize a lamp bead, reduces lamp bead cost, and client is allowed to reduce raw material cost for rear end and increase installation is beautiful,
And two chips are packed into same LED bracket, two chip polarity are on the contrary, lamp bead pin can use bipolar circuit；This lamp bead
Make client cost-saved and installation space, electrical parameter compatibility is strong；The present invention effectively overcomes in the prior art various
Disadvantage and have high industrial utilization value.
Detailed description of the invention
Fig. 1 is shown as the flow diagram of lamp bead synthetic method provided in an embodiment of the present invention.
Fig. 2 is shown as the schematic diagram of the lamp bead synthesis LED support of the embodiment of the present invention.
Component label instructions
1-LED placement region
The first polar region of 2-
The second polar region of 3-
4- border area
5- fixed frame
S101~S104 step
Specific embodiment
Embodiments of the present invention are illustrated by particular specific embodiment below, those skilled in the art can be by this explanation
Content disclosed by book is understood other advantages and efficacy of the present invention easily.
Fig. 1 is please referred to Fig. 2.It should be clear that this specification structure depicted in this specification institute accompanying drawings, ratio, size etc., only to
Cooperate the revealed content of specification, so that those skilled in the art understands and reads, being not intended to limit the invention can be real
The qualifications applied, therefore do not have technical essential meaning, the tune of the modification of any structure, the change of proportionate relationship or size
It is whole, in the case where not influencing the effect of present invention can be generated and the purpose that can reach, it should all still fall in disclosed skill
Art content obtains in the range of capable of covering.Meanwhile in this specification it is cited as "upper", "lower", "left", "right", " centre " and
The term of " one " etc. is merely convenient to being illustrated for narration, rather than to limit the scope of the invention, relativeness
It is altered or modified, under the content of no substantial changes in technology, when being also considered as the enforceable scope of the present invention.
As shown, the present invention provides a kind of method for synthesizing lamp bead, which is characterized in that the method for the synthesis lamp bead is extremely
Include: less
S101, LED support first carry out 150 DEG C of dehumidifying bakings, and baking time is 0.5-1.5 hours.
In the embodiment of the present invention, moisture is carried out to LED support first and moisture is dispelled, the technology toasted using dehumidifying,
At 150 DEG C, the time is to be toasted in the case of 0.5-1.5 is small.Preferably, baking time is 1 hour.
S102 carries out crystal-bonding adhesive solidification baking after the LED placement region on the LED support enters the first LED wafer admittedly,
Wherein, first LED wafer is positive polarity.
S103 consolidates again in the LED placement region and carries out solidification baking into the second LED wafer, wherein described second
LED wafer is reversed polarity.
In the embodiment of the present invention, the first LED wafer and the first LED wafer are a kind of chip with certain particular color.
In the embodiment of the present invention, the first LED wafer is LED blue light chip, and the second LED wafer is LED yellow light chip.
It is understood that one LED wafer of merging will first carry out primary regulation, in the embodiment of the present invention using into
Row die bond adhesive curing baking, and the first LED wafer is positive polarity.It should be noted that the yellow light and positive polarity of led reversed polarity
The difference of blue light be reversed polarity yellow light wafer anode below, cathode is upper；On chip, circular electrode is blue light positive and negative anodes
Anode, sector electrode are cathode.
S104 welds second LED wafer and first LED wafer, and injects in the LED placement region
Then the mixture of fluorescent powder and silica gel carries out glue curing baking, wherein the time for solidifying baking is 1-4 hours.
Specifically, the electrode and bracket to the first LED wafer and the second LED wafer carry out lead welding.
The mixture ratio of fluorescent powder and silica gel can be determined according to the wavelength of the first LED wafer blue light, specific real
Existing mode is the prior art, and this will not be repeated here for the embodiment of the present invention.
In the preferred embodiment of the present invention, first LED wafer is LED blue light chip, and second LED wafer is
LED yellow light chip.
In addition, being 1-4 hours for the time for solidifying baking.
It should be noted that LED blue light chip inspires white light by being subject to fluorescent powder, the monochrome of white can be used as
Lamp bead form uses.Specifically, in the embodiment of the present invention white light colour temperature 4000-6500K range, positive polarity circuit；White
Light is to add fluorescent powder to be excited into the form of white light with blue light chip 445-465 wavelength.Yellow light chip wave-length coverage 585-595nm,
Polarity is anti-polarity circuit；Sodium yellow is irradiated in the form of chip shines through silica gel, and fluorescent powder shines to it and color does not have
Have an impact.
Using the embodiment of the present invention, 1, by synthesizing lamp bead by two lamp beads reduce lamp bead cost, 2, make rear end objective
Family reduces raw material cost and increases installation beauty；3.LED lamp bead energy conservation and environmental protection and service life length (L50 was up to 30000 hours or more).
And two chips are packed into same LED bracket, two chip polarity are on the contrary, lamp bead pin can use bipolar circuit；This lamp bead
Make client cost-saved and installation space, electrical parameter compatibility is strong.
In addition, referring to fig. 2, the embodiment of the invention provides a kind of lamp beads to synthesize LED support, the bracket includes: that LED is put
Set region 1, the first polar region 2, the second polar region 3, border area 4, fixed frame 5；The LED placement region 1 is fixed on
On the fixed frame 5, first polar region 2 and second polar region 3 are located in the LED placement region 1, and point
Not Wei Yu LED wafer both ends, the border area 4, which is located at the edge of the LED placement region 1 and is higher by the LED, to be placed
The surface in region.
By placing LED blue dies and LED yellow chip, LED blue dies and LED yellow in LED placement region 1
Chip passes through the first polar region 2 respectively, the corresponding electrode of the second polar region 3 is welded, in LED placement region after welding
The mixture of injection fluorescent powder and silica gel is filled in 1, prevents mixture from outflowing by border area 4, after injecting mixture,
Then it is toasted.Therefore, simple using lamp bead provided in an embodiment of the present invention synthesis LED support structure, it is convenient for lamp bead
Synthesis, and it is easy to operate during practical industrialization.
In conclusion of the invention, the lamp bead synthetic method provided and a kind of lamp bead synthesize LED support, by LED branch
The synthesis of the enterprising portable lighter pearl of frame realizes the problem of two lamp beads are synthesized a lamp bead.So synthesizing one by two lamp beads
Lamp bead reduces lamp bead cost, and 2 and rear end make client's reduction raw material cost and increase installation beautiful, and two chips are packed into together
One LED bracket, two chip polarity are on the contrary, lamp bead pin can use bipolar circuit；This lamp bead can client can save into
This and installation space, electrical parameter compatibility are strong；The present invention effectively overcomes various shortcoming in the prior art and has height and produce
Industry utility value.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause
This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as
At all equivalent modifications or change, should be covered by the claims of the present invention.
Claims (6)
1. a kind of method for synthesizing lamp bead, which is characterized in that the method for the synthesis lamp bead includes at least:
LED support first carries out 150 DEG C of dehumidifying bakings, and baking time is 0.5-1.5 hours；
Crystal-bonding adhesive solidification baking is carried out after the LED placement region on the LED support enters the first LED wafer admittedly, wherein described
First LED wafer is positive polarity；
Consolidate again in the LED placement region and carry out solidification baking into the second LED wafer, wherein second LED wafer is anti-
Polarity；
Second LED wafer and first LED wafer are welded, and inject fluorescence in the LED placement region
Then the mixture of powder and silica gel carries out glue curing baking, wherein the time for solidifying baking is 1-4 hours.
2. the method for synthesis lamp bead according to claim 1, which is characterized in that first LED wafer is that LED blue light is brilliant
Piece, second LED wafer are LED yellow light chip.
3. the method for synthesis lamp bead according to claim 1, which is characterized in that the time for solidifying baking is 1-4 hours.
4. the method for synthesis lamp bead according to claim 2, which is characterized in that the LED yellow light chip wave-length coverage
585-595nm。
5. the method for synthesis lamp bead according to claim 4, which is characterized in that the wave-length coverage of the LED blue light chip
For 445-465nm.
6. a kind of lamp bead synthesizes LED support, which is characterized in that the bracket includes: LED placement region, the first polar region, the
Two polar regions, border area, fixed frame；The LED placement region is fixed on the fixed frame, first polar region
It is located in the LED placement region with second polar region, and is located at the both ends of LED wafer, the border area
Positioned at the LED placement region edge and be higher by the surface of the LED placement region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810402734.0A CN110416195A (en) | 2018-04-28 | 2018-04-28 | A kind of car light lamp bead synthetic method and a kind of lamp bead synthesize LED support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810402734.0A CN110416195A (en) | 2018-04-28 | 2018-04-28 | A kind of car light lamp bead synthetic method and a kind of lamp bead synthesize LED support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110416195A true CN110416195A (en) | 2019-11-05 |
Family
ID=68357125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810402734.0A Pending CN110416195A (en) | 2018-04-28 | 2018-04-28 | A kind of car light lamp bead synthetic method and a kind of lamp bead synthesize LED support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110416195A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005101296A (en) * | 2003-09-25 | 2005-04-14 | Osram-Melco Ltd | Device, module, and lighting apparatus of variable color light emitting diode |
| CN102543989A (en) * | 2012-03-19 | 2012-07-04 | 深圳市聚飞光电股份有限公司 | LED(light-emitting diode)device |
| CN202931606U (en) * | 2012-09-27 | 2013-05-08 | 鲁永忠 | Intelligent-control LED light and color modulating illumination lamp |
| CN103904199A (en) * | 2014-03-28 | 2014-07-02 | 山东明华光电科技有限公司 | White light LED allowing color temperature to be freely adjusted |
| CN105374921A (en) * | 2015-08-28 | 2016-03-02 | 安徽福恩光电科技有限公司 | LED lamp bead encapsulation technology |
-
2018
- 2018-04-28 CN CN201810402734.0A patent/CN110416195A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005101296A (en) * | 2003-09-25 | 2005-04-14 | Osram-Melco Ltd | Device, module, and lighting apparatus of variable color light emitting diode |
| CN102543989A (en) * | 2012-03-19 | 2012-07-04 | 深圳市聚飞光电股份有限公司 | LED(light-emitting diode)device |
| CN202931606U (en) * | 2012-09-27 | 2013-05-08 | 鲁永忠 | Intelligent-control LED light and color modulating illumination lamp |
| CN103904199A (en) * | 2014-03-28 | 2014-07-02 | 山东明华光电科技有限公司 | White light LED allowing color temperature to be freely adjusted |
| CN105374921A (en) * | 2015-08-28 | 2016-03-02 | 安徽福恩光电科技有限公司 | LED lamp bead encapsulation technology |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20210302 Address after: Room 110-7, building 3, 290 Xingci 1st Road, Hangzhou Bay New District, Ningbo City, Zhejiang Province, 315336 Applicant after: Ningbo anxinmei Semiconductor Co.,Ltd. Address before: 230011 Hefei Xinzhan Industrial Park, Hefei City, Anhui Province Applicant before: HEFEI IRICO EPILIGHT TECHNOLOGY Co.,Ltd. |
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Application publication date: 20191105 |
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