CN110408981A - A kind of plate bonding device of micro wiring - Google Patents
A kind of plate bonding device of micro wiring Download PDFInfo
- Publication number
- CN110408981A CN110408981A CN201910855251.0A CN201910855251A CN110408981A CN 110408981 A CN110408981 A CN 110408981A CN 201910855251 A CN201910855251 A CN 201910855251A CN 110408981 A CN110408981 A CN 110408981A
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- Prior art keywords
- micro wiring
- chip
- micro
- pressure head
- positioning
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- 238000001556 precipitation Methods 0.000 claims abstract description 40
- 238000009713 electroplating Methods 0.000 claims abstract description 23
- 239000003792 electrolyte Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 239000002184 metal Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 241000397426 Centroberyx lineatus Species 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- YTCQFLFGFXZUSN-BAQGIRSFSA-N microline Chemical compound OC12OC3(C)COC2(O)C(C(/Cl)=C/C)=CC(=O)C21C3C2 YTCQFLFGFXZUSN-BAQGIRSFSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/06—Filtering particles other than ions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
A kind of plate bonding device of micro wiring, including chip positioning device, micro wiring positioning device, precipitation equipment and solution circulating device, wherein, chip is fixed in chip positioning device, and micro wiring is fixed on above the conductive film of chip by the setting element of micro wiring positioning device；Chip positioning device and micro wiring positioning device are arranged on locating platform, and locating platform is arranged on electroplating bath, and electroplating bath is arranged on horizontally moving device；Precipitation equipment is arranged in vertical lift device, and vertical lift device is arranged on horizontal table by worktable support frame.Horizontally moving device can determine the relative position that pressure head is connected on the micro wiring being located on chip and precipitation equipment in the movement of X and Y-direction, and the moving up and down of vertical lift device can drive the realization of the connection pressure head on precipitation equipment to loosen and press to being located in micro wiring on chip.The present apparatus is easy to operate, accurate positioning, the connection suitable for conductive film and any materials micro wiring on the micro chip of pole.
Description
Technical field
The present invention relates to a kind of plate bonding devices of micro wiring, in particular to a kind of for connecting conductive film on chip
With the plate bonding device of external micro wiring.
Background technique
In MEMS processing technology, the side of conductive film and external wire frequently with ultrasonic bonding (Bonding) on chip
Method is attached, but certain undersized, conductive films or micro wiring material melting point is excessively high, hardness is excessive conducting wire are connected
It connects, suitable quality of connection can not be obtained using ultrasonic bonding.Other common conductor connections are also often because it cannot be obtained
Reliably, effective quality of connection, and be not suitable for using in conducting wire connection, as Laser Welding because beam energy excessively concentrates, due to
Easily make the heated defect that peeling, crumple or film breaks occur of metallic film on chip, Welding intensity is low, quality can not
It leans on, it is low etc. that resistance pressure-welding is welded into power.Clearly for more small workpiece and conducting wire, existing Joining Technology is difficult to have
Effect reliably realizes connection request.Therefore, a kind of novel process and device are needed to realize conductive film and micro wiring on chip
Connection.
Electro-deposition techniques are the processes that atom is grown on conductive substrates surface under certain condition, in two electric conductors
Between by electroplating deposition metal, make the metal fill the gap between full electric conductor to realize the connection of two conductors, be metal
Connection between atom, bonding strength can reach the intensity of metal body, high reliablity.Applicant of the present invention is in patent
Itd is proposed in ZL200710199235.8 " in conjunction with electroplating technology formed telegraph circuit exit film structure and realize and it is external
The reliability of conducting wire connects " show that electro-deposition techniques can realize being reliably connected for conductive film and micro wiring.And to being led on chip
For the connection of conductive film and micro wiring, how fast, to be reliably achieved micro wiring close on the small conductive film of size
It is adjacent to and is properly positioned to urgent problem to be solved in technique.Therefore, it is necessary to a kind of easy to operate, accurate positioning, it is suitable for pole
The plate bonding device that micro chip and micro wiring are attached.
Summary of the invention
The present invention provides a kind of plate bonding devices, and micro wiring is slightly compressed to chip using liftable connection pressure head
Conductive film on, under electric field action, the deposited metal layer between micro wiring and conductive film, to realize micro wiring and core
The plate bonding of piece.
To realize above-mentioned technique, in plate bonding device provided by the invention, the technical solution adopted is that: a kind of micro wiring
Plate bonding device, including chip positioning device, micro wiring positioning device, precipitation equipment and solution circulating device.Wherein, core
Piece is fixed in chip positioning device, and chip positioning device and micro wiring positioning device are arranged on locating platform, locating platform
It is arranged on electroplating bath, electroplating bath is arranged on horizontally moving device；Precipitation equipment is arranged in vertical lift device, vertical to rise
Falling unit is arranged on worktable support frame, and worktable support frame is arranged on horizontal table.
The chip positioning device include fishbolt, movable block, work stage and fixed block, it can be achieved that chip on it
Fixation and clamping.
The micro wiring positioning device includes adjusting bolt, sliding locating piece, fixing bolt, upper plate, lower roof plate, bullet
Spring and guide rail, are assemblied on the guide rail of locating platform；One layer of bullet is arranged in the surface of the upper plate 2-4 and lower fixed board 2-5
Property material, when positioning, micro wiring is assemblied between upper plate and lower roof plate, passes through the tensioning that rotary fixing screw bolt realizes micro wiring
And fixation.
The precipitation equipment includes orificed anode and connection pressure head；The pressure of connection pressure head is arranged in the orificed anode
It is connected in the cavity of head upper end with positive pole；The connection pressure head of precipitation equipment is hollow up big and down small funnel-shaped structure,
The lower end for connecting pressure head is equipped with notch, and the notch of X-direction is pressure head lower end positioning port, for positioning and compressing micro wiring,
Notch geometry is V-arrangement, semicircle；The notch of Y-direction is flowed out for electrolyte, and notch geometry is rectangle, square；Described
Precipitation equipment when moving up and down, realizes loosening and pressing to the micro wiring being located on chip in vertical lift device.
The solution circulating device includes circulating line, pump, filter screen and reservoir, and the solution circulating device connects
Connect the inlet that pressure head upper end is connected in the liquid outlet and precipitation equipment of electroplating bath.
The horizontally moving device is arranged on horizontal table, including power part, Y-direction nut screw, Y-direction are led
Rail, Y-direction nut load platform, X loaded to nut screw, X direction guiding rail and X to nut, it can be achieved that device Y-direction and X to shifting
It is dynamic.
The vertical lift device includes locking nut, manual knob, Z-direction nut screw, Z-direction guide rail, Z-direction slide nut
Block platform and L shape positioning table are, it can be achieved that be assemblied in precipitation equipment the moving up and down in Z-direction of L shape positioning table.
The course of work according to the present invention is: 1. chip positioning.Fixed block chip being placed in chip positioning device
On workbench between movable block；Close up fixed block and movable block by the fishbolt of rotary chip positioning device, it will
Chip clamps；2. positioning of the micro wiring on chip.By micro wiring pass through micro wiring positioning device upper plate and lower roof plate it
Between gap, adjust micro wiring, make it in the state of tensioning, rotary fixing screw bolt consolidates upper plate and lower roof plate by micro wiring
It is fixed, then by adjusting the adjusting bolt in micro wiring positioning device micro wiring positioning device is moved horizontally, by micro wiring
The middle of position adjustment conductive film on chip, the fixing bolt rotated in micro wiring positioning device again make under micro wiring
Transposing contacts the conductive film surface of chip；3. the fixation of micro wiring.Vertical lift device drives precipitation equipment to move down, and moves
Move above chip, by adjusting on horizontally moving device Y-direction nut load platform and X to nut load platform in Y and the side X
To reciprocating movement adjust the conductive film of chip and the position of micro wiring, be located at the connection pressure head lower end of precipitation equipment
The underface of portion's positioning port adjusts vertical locating device again, moves down precipitation equipment, leads pressure head lower end positioning port by micro-
Line is pressed on the conductive film of chip, realizes fixation of the micro wiring on film；4. plate bonding.It is sun with orificed anode
Pole, micro wiring are cathode, and electrolyte is flowed into from the connection pressure head upper port of precipitation equipment, by orificed anode, flow through connection pressure
Conductive film on head lower end, micro wiring and chip, forms continuous electrolysis liquid pool on micro wiring and chip at conductive film,
Electrolyte is flowed out from connection pressure head lower end notch later, is flowed in electroplating bath, after solution circulating device circulating filtration
It is returned in precipitation equipment.Deposition reaction occurs on micro wiring by the electrolyte of orificed anode, grows the coat of metal, plates
Layer gradually increases, until micro wiring and chip are linked together.
Detailed description of the invention
Fig. 1 ~ Fig. 4 is plate bonding device overall structure diagram of the invention and each modular construction schematic diagram.
Fig. 1 is plate bonding device.
Fig. 2 is chip positioning device.
Fig. 3 is connection pressure head structure.
Fig. 4 is micro wiring positioning device.
Label in figure respectively indicates: 1. chip positioning devices, in which: 1-1 fishbolt, 1-2 movable block, 1-3 work
Part platform and 1-4 fixed block；2. micro wiring positioning device, in which: 2-1 adjusts bolt, and 2-2 slides locating piece, the fixed spiral shell of 2-3
Bolt, 2-4 upper plate, 2-5 lower roof plate, 2-6 spring and 2-7 guide rail；3. precipitation equipment, in which: 3-1 orificed anode and 3-2
Connect pressure head；3-2-1 pressure head upper end cavity, 3-2-2 pressure head lower end positioning port；4. solution circulating device, in which: 4-1
Circulating line, 4-2 pump, 4-3 filter screen and 4-4 reservoir；5. micro wiring；6. chip, in which: 6-1 conductive film and
6-2 substrate；7. horizontally moving device, in which: 7-1 power part, 7-2 Y-direction nut screw, 7-3 Y-direction guide rail, 7-4 Y
To nut load platform, 7-5 X is to nut screw, 7-6 X direction guiding rail and 7-7 X to nut load platform；8. vertical lift dress
It sets, in which: 8-1 locking nut, 8-2 manual knob, 8-3 Z-direction nut screw, 8-4 Z-direction guide rail, 8-5 Z-direction nut slider are flat
Platform and 8-6L shape positioning table；9. electrolyte；10. locating platform；11. electroplating bath；12. worktable support frame；13. water
Flat workbench.
Specific embodiment
Implementation of the invention is described in further detail with reference to the accompanying drawing.
To realize above-mentioned technique, in plate bonding device provided by the invention, the technical solution adopted is that: a kind of micro wiring
Plate bonding device, including chip positioning device 1, micro wiring positioning device 2, precipitation equipment 3 and solution circulating device 4.Its
In, chip 6 is fixed in chip positioning device 1, and chip positioning device 1 and micro wiring positioning device 2 are arranged in locating platform 10
On, locating platform 10 is arranged on electroplating bath 11, and electroplating bath 11 is arranged on horizontally moving device 7, and the setting of precipitation equipment 3 is being hung down
It goes straight up on falling unit 8, vertical lift device 8 is arranged on worktable support frame 12, and worktable support frame 12 is arranged in horizontal work
Make on platform 13.
The chip positioning device 1 includes fishbolt 1-1, movable block 1-2, work stage 1-3 and fixed block 1-4, can
Realize the fixation and clamping of chip 6 on it.
The micro wiring positioning device 2 includes adjusting bolt 2-1, sliding locating piece 2-2, fixing bolt 2-3, upper plate
2-4, lower roof plate 2-5, spring 2-6 and guide rail 2-7, are assemblied on the guide rail 2-7 of locating platform 10；The upper plate 2-4
One layer of elastic material be set with the surface of lower fixed board 2-5, when positioning, micro wiring 5 be assemblied in upper plate 2-4 and lower roof plate 2-5 it
Between, when positioning, micro wiring 5 is assemblied between upper plate 2-4 and lower roof plate 2-5, is passed through rotary fixing screw bolt 2-3 and is realized micro wiring
5 tensioning and fixation.
The precipitation equipment 3 includes orificed anode 3-1 and connection pressure head 3-2；The orificed anode 3-1 setting is even
It connects in the pressure head upper end cavity 3-2-1 of pressure head 3-2 and is connected with positive pole；The connection pressure head 3-2 of precipitation equipment 3 is hollow
Up big and down small funnel-shaped structure, the lower end of connection pressure head 3-2 is equipped with notch, and the notch of X-direction is that pressure head lower end positions
Mouth 3-2-2, for positioning and compressing micro wiring 5, notch geometry is V-arrangement, semicircle；The notch of Y-direction is flowed for electrolyte 9
Out, notch geometry is rectangle, square；The precipitation equipment 3 is realized pair in vertical lift device 8 when moving up and down
The micro wiring 5 being located on chip 6 loosens and presses.
The solution circulating device 4 includes circulating line 4-1, pump 4-2, filter screen 4-3 and reservoir 4-4；Described
Solution circulating device 4 is connected to the inlet that the upper end pressure head 3-2 is connected in the liquid outlet and precipitation equipment 3 of electroplating bath 11.
The horizontally moving device 7 is arranged on horizontal table 13, including power part 7-1, Y-direction lead screw 7-2, Y
Direction guiding rail 7-3, Y-direction nut load platform 7-4, X, can to nut screw 7-5, X direction guiding rail 7-6 and X to nut load platform 7-7
Realization device Y-direction and X to movement.
The vertical lift device 8 includes locking nut 8-1, manual knob 8-2, Z-direction nut screw 8-3, Z-direction guide rail
8-4, Z-direction nut slider platform 8-5 and L shape positioning table 8-6 are, it can be achieved that be assemblied in the precipitation equipment 3 of L shape positioning table 8-6 in Z-direction
Move up and down.
The course of work according to the present invention is: 1. chip positioning, and chip 6 is placed on the activity in chip positioning device 1
On work stage 1-3 between block 1-2 and fixed block 1-4；Make movable block by fishbolt 1-1 in rotary chip positioning device 1
1-2 and fixed block 1-4 close up, and chip 6 is clamped；2. positioning of the micro wiring on chip positions micro wiring 5 across micro wiring
Gap between the upper plate 2-4 and lower roof plate 2-5 of device 2 adjusts micro wiring 5, makes it in the state of tensioning, rotary fixing screw
Bolt 2-3 makes upper plate 2-4 and lower roof plate 2-5 that micro wiring 5 is fixed, then makes micro wiring fixed by adjusting bolt 2-1 is adjusted
Position device 1 moves horizontally, and the position of micro wiring 5 is adjusted to the middle of the conductive film 6-1 on chip 6, rotates micro- lead again
Fixing bolt 2-3 in line positioning device 2 makes micro wiring 5 move down the surface conductive film 6-1 for touching chip 6；3. micro wiring
Fixation, vertical lift device 8 drives precipitation equipment 3 to move down, is moved to the top of chip 6, moves horizontally dress by adjusting
The Y nut load platform 7-5 and X set on 7 is moved back and forth in Y and X-direction to nut load platform 7-7 to adjust precipitation equipment 3
Pressure head lower end positioning port 3-2-2, be located at the conductive film 6-1 of chip 6 and the surface of micro wiring 5, adjust again
Vertical locating device 8 moves down precipitation equipment 3, makes pressure head lower end positioning port 3-2-2 that micro wiring 5 is pressed on leading for chip 6
On conductive film 6-1；Realize fixation of the micro wiring 5 on conductive film 6-1；4. plate bonding, using orificed anode 3-1 as anode,
Micro wiring 5 is cathode, and electrolyte 9 flows into, from the connection pressure head upper port of precipitation equipment 3 by orificed anode 3-1, flows through connection
Conductive film 6-1 on the lower end pressure head 3-2, micro wiring 5 and chip 6, the shape at conductive film 6-1 on micro wiring 5 and chip 6
At continuous electrolysis liquid pool, electrolyte 9 flows in electroplating bath 11, process is molten from connection pressure head 3-2 lower end indentation, there outflow later
It is returned in precipitation equipment 3 after 4 circulating filtration of liquid circulating device.It is sent out on micro wiring 5 by the electrolyte 9 of orificed anode 3-1
Raw deposition reaction grows the coat of metal, and coating gradually increases, until micro wiring 5 and chip 6 are linked together.
The chip positioning device 1 is arranged on the locating platform 10 in electroplating bath 11, and power part 7-1 rotation drives
Y-direction nut screw 7-2 and X is rotated to nut screw 7-5, drives chip positioning device 1 along Y-direction guide rail 7-4 and X direction guiding rail 7-7
It is Y and X-direction moves back and forth, for adjusting the relative position of liquid beam and micro wiring 5.
In the chip positioning device 1, the work stage 1-3 that chip 6 is placed between fixed block 1-4 and movable block 1-2
On；Close up fixed block 1-4 and movable block 1-2 by rotating fishbolt 1-1, chip 6 is positioned and is clamped.
The chip positioning device 1 and micro wiring positioning device 2 are arranged on locating platform 10, and locating platform 10 is arranged
On electroplating bath 11, and the micro wiring 5 positioned on chip 6 and connection pressure head are adjusted by being attached thereto horizontally moving device 7
The relative position of 3-2.
The tail portion of fishbolt 1-1 and the hole buckle-type of work stage 1-3 side wall are matched in the chip positioning device 1
It closes, fishbolt 1-1 is made to be only capable of rotating in the hole of work stage 1-3 side wall.
Work stage 1-3 is arranged on locating platform 10 in the chip positioning device 1, and shape is swallow-tail form, is used as and lives
The guide rail of motion block 1-2.
It adjusts bolt 2-1 and sliding locating piece 2-2 in the micro wiring positioning device 2 to be threadedly engaged, with fixed block 1-4
For snap fit.
Fixing bolt 2-3 and sliding locating piece 2-2 is threadedly engaged in the micro wiring positioning device 2, with upper plate 2-4
For snap fit.
It is U-shaped that locating piece 2-2 is slided in the micro wiring positioning device 2, and both ends are provided with the rectangle for being provided with through-hole
Block, for assembling the combination of fixing bolt 2-3, upper plate 2-4, lower roof plate 2-5 and spring 2-6.
The precipitation equipment 3 is assemblied in vertical lift device 8, can be moved downward with Z-direction nut slider platform 8-5,
Be pressed in pressure head lower end positioning port 3-2-2 micro wiring 5 on the conductive film 6-1 of chip 6.
In the precipitation equipment 3 connect pressure head 3-2 can according to the actual situation in 5 diametric requirements of micro wiring to pressure head lower end
The size of portion positioning port 3-2-2 is adjusted.
The Z-direction nut slider platform 8-5 of vertical lift device 8 is arranged in L shape positioning table 8-6 in the precipitation equipment 3
On, and be threadedly engaged with pressure head 3-2 is connect.
Anode of the ring electrode 3-2 as electrodeposition technology in the precipitation equipment 3, is provided with outer guidance
Line.
The connection pressure head 3-2 of the precipitation equipment 3 is equipped with notch in pressure head lower end, and the notch in X-direction is under pressure head
End positioning port 3-2-2, for positioning and compressing micro wiring 5, notch geometry is V-arrangement；Notch in Y-direction is used for electrolyte
9 outflows, notch geometry rectangle.
The filter screen 4-3 of the solution circulating device 4 is assemblied at the liquid outlet of electroplating bath 11, is used for impurity screening.
Liquid level position can be higher than or 11 bottom of matched electroplating bath in reservoir 4-4 in the solution circulating device 4, can also
Lower than electroplating bath 11, if liquid level position is higher than or matched electroplating bath 11 in reservoir 4-4, must be filled in the inlet of reservoir 4-4
Distribution pump does not need water pump then, in present case in reservoir 4-4 if liquid level position is lower than 11 bottom of electroplating bath in reservoir 4-4
Liquid level position is lower than 11 bottom of electroplating bath.
Electrolyte 9 can be stored in reservoir 4-4 by the solution circulating device 4 when device stops working, and be prevented
Only electrolyte 9 pollutes.
The horizontally moving device 7 and worktable support frame 12 are arranged on horizontal table 13.
The power part 7-1 of the horizontally moving device 7 point for X to and Y-direction, be generally adopted by motor driven.
It is arranged on worktable support frame 12 in the vertical lift device 8, rotary manual knob 8-2 drives Z-direction spiral shell
Master screw 8-3 rotation, the Z-direction nut slider platform 8-5 being assemblied on Z-direction nut screw 8-3 drive precipitation equipment 3 to lead in Z-direction
It is moved up and down on rail 8-4.
The shape of Z-direction guide rail 8-4 can be common rail shapes in the vertical lift device 8, such as rectangle, dovetail
Shape, the present invention use dovetail slideway structure.
Claims (6)
1. a kind of plate bonding device of micro wiring, including chip positioning device (1), micro wiring positioning device (2), precipitation equipment
(3) and solution circulating device (4), wherein chip (6) is fixed on chip positioning device (1)；Chip positioning device (1) and micro-
Wire positioning device (2) is arranged on locating platform (10), and locating platform (10) is arranged on electroplating bath (11), electroplating bath (11)
It is arranged on horizontally moving device (7), horizontally moving device (7) is arranged on horizontal table (13)；Precipitation equipment (3) setting
On vertical lift device (8), vertical lift device (8) is arranged on worktable support frame (12), worktable support frame (12)
It is arranged on horizontal table (13).
2. a kind of plate bonding device of micro wiring according to claim 1, it is characterised in that: the chip positioning dress
Setting (1) includes fishbolt (1-1), movable block (1-2), work stage (1-3) and fixed block (1-4), it can be achieved that chip (6) is at it
On fixation and clamping.
3. a kind of plate bonding device of micro wiring according to claim 1, it is characterised in that: the micro wiring positioning
Device (2) includes adjusting bolt (2-1), sliding locating piece (2-2), fixing bolt (2-3), upper plate (2-4), lower roof plate (2-
5), spring (2-6) and guide rail (2-7)；When positioning, micro wiring (5) is assemblied between upper plate (2-4) and lower roof plate (2-5), is led to
Cross adjusting bolt (2-1), sliding locating piece (2-2), fixing bolt (2-3) and the guide rail (2- of adjustment micro wiring positioning device (2)
7), can micro wiring (5) be tensioned, be fixed on the top of conductive film (6-1) on chip (6).
4. a kind of plate bonding device of micro wiring according to claim 1, it is characterised in that: the precipitation equipment
It (3) include orificed anode (3-1) and connection pressure head (3-2)；Orificed anode (3-1) setting is in connection pressure head (3-2)
It is connected in pressure head upper end cavity (3-2-1) with positive pole.
5. the plate bonding device of a kind of micro wiring according to claim 4, it is characterized in that: the precipitation equipment (3)
Connection pressure head (3-2) be hollow up big and down small funnel-shaped structure, connection pressure head (3-2) lower end be equipped with notch, X-direction
Notch be pressure head lower end positioning port (3-2-2), for positioning and compressing micro wiring (5), notch geometry be V-arrangement, semicircle
Shape；The notch of Y-direction is flowed out for electrolyte (9), and notch geometry is rectangle, square.
6. the plate bonding device of a kind of micro wiring according to claim 4, it is characterized in that: the precipitation equipment (3)
The notch size of middle connection lower end pressure head (3-2) can be adjusted according to the size of micro wiring in actual processing (5) diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910855251.0A CN110408981A (en) | 2019-09-11 | 2019-09-11 | A kind of plate bonding device of micro wiring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910855251.0A CN110408981A (en) | 2019-09-11 | 2019-09-11 | A kind of plate bonding device of micro wiring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110408981A true CN110408981A (en) | 2019-11-05 |
Family
ID=68370486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910855251.0A Pending CN110408981A (en) | 2019-09-11 | 2019-09-11 | A kind of plate bonding device of micro wiring |
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| CN (1) | CN110408981A (en) |
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