CN110408360A - 一种绝缘胶液及其制备方法和应用以及由其得到的隔磁片 - Google Patents
一种绝缘胶液及其制备方法和应用以及由其得到的隔磁片 Download PDFInfo
- Publication number
- CN110408360A CN110408360A CN201910702439.1A CN201910702439A CN110408360A CN 110408360 A CN110408360 A CN 110408360A CN 201910702439 A CN201910702439 A CN 201910702439A CN 110408360 A CN110408360 A CN 110408360A
- Authority
- CN
- China
- Prior art keywords
- insulation glue
- insulation
- glue
- antifreeze plate
- band
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009413 insulation Methods 0.000 title claims abstract description 95
- 239000003292 glue Substances 0.000 title claims abstract description 66
- 230000002528 anti-freeze Effects 0.000 title claims abstract description 40
- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- 239000002245 particle Substances 0.000 claims abstract description 32
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 30
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 51
- 239000000377 silicon dioxide Substances 0.000 claims description 26
- 239000004814 polyurethane Substances 0.000 claims description 16
- 229920002635 polyurethane Polymers 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 12
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 10
- 239000004094 surface-active agent Substances 0.000 claims description 10
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 9
- 229910052749 magnesium Inorganic materials 0.000 claims description 9
- 239000011777 magnesium Substances 0.000 claims description 9
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052791 calcium Inorganic materials 0.000 claims description 8
- 239000011575 calcium Substances 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- SZVJSHCCFOBDDC-UHFFFAOYSA-N ferrosoferric oxide Chemical compound O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 7
- 239000010936 titanium Substances 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- 229910052681 coesite Inorganic materials 0.000 claims description 6
- 229910052906 cristobalite Inorganic materials 0.000 claims description 6
- 229910052682 stishovite Inorganic materials 0.000 claims description 6
- 229910052905 tridymite Inorganic materials 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 229910052593 corundum Inorganic materials 0.000 claims description 4
- 238000003618 dip coating Methods 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 3
- 125000003700 epoxy group Chemical group 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229940056319 ferrosoferric oxide Drugs 0.000 claims description 3
- 229920005792 styrene-acrylic resin Polymers 0.000 claims description 3
- 229910000859 α-Fe Inorganic materials 0.000 claims description 3
- 240000007594 Oryza sativa Species 0.000 claims description 2
- 235000007164 Oryza sativa Nutrition 0.000 claims description 2
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 2
- 230000001680 brushing effect Effects 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229920000570 polyether Polymers 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 2
- 235000009566 rice Nutrition 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 2
- 239000002253 acid Substances 0.000 claims 1
- 229910021529 ammonia Inorganic materials 0.000 claims 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims 1
- 235000009508 confectionery Nutrition 0.000 claims 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 1
- -1 poly- ammonia Ester Chemical class 0.000 claims 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229910000077 silane Inorganic materials 0.000 claims 1
- 239000012634 fragment Substances 0.000 abstract description 22
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 15
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 230000000694 effects Effects 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 208000037656 Respiratory Sounds Diseases 0.000 description 7
- 238000005470 impregnation Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000004568 cement Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 230000006698 induction Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000000084 colloidal system Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000013467 fragmentation Methods 0.000 description 3
- 238000006062 fragmentation reaction Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 235000013339 cereals Nutrition 0.000 description 2
- 238000010924 continuous production Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000002159 nanocrystal Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000011505 plaster Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F7/00—Magnets
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/70—Circuit arrangements or systems for wireless supply or distribution of electric power involving the reduction of electric, magnetic or electromagnetic leakage fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0075—Magnetic shielding materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Soft Magnetic Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910702439.1A CN110408360B (zh) | 2019-07-31 | 2019-07-31 | 一种绝缘胶液及其制备方法和应用以及由其得到的隔磁片 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910702439.1A CN110408360B (zh) | 2019-07-31 | 2019-07-31 | 一种绝缘胶液及其制备方法和应用以及由其得到的隔磁片 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110408360A true CN110408360A (zh) | 2019-11-05 |
CN110408360B CN110408360B (zh) | 2021-01-05 |
Family
ID=68364717
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910702439.1A Active CN110408360B (zh) | 2019-07-31 | 2019-07-31 | 一种绝缘胶液及其制备方法和应用以及由其得到的隔磁片 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110408360B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112289578A (zh) * | 2020-10-16 | 2021-01-29 | 横店集团东磁股份有限公司 | 一种磁条状纳米晶隔磁片及其制备方法和应用 |
CN112768218A (zh) * | 2020-12-22 | 2021-05-07 | 信维通信(江苏)有限公司 | 低损耗隔磁片及其制备方法 |
WO2021119937A1 (zh) * | 2019-12-16 | 2021-06-24 | 瑞声声学科技(深圳)有限公司 | 无线充电线圈模组及无线充电装置 |
CN113278309A (zh) * | 2020-03-25 | 2021-08-20 | 安泰科技股份有限公司 | 带有绝缘涂层的非晶纳米晶带材的制备方法及产品 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103214973A (zh) * | 2013-01-16 | 2013-07-24 | 南京工业大学 | 一种无机复合粘结剂及其制备方法 |
CN103320085A (zh) * | 2012-03-23 | 2013-09-25 | 深圳富泰宏精密工业有限公司 | 粘结剂,应用该粘结剂进行表面处理的方法及制品 |
CN105670350A (zh) * | 2016-02-17 | 2016-06-15 | 上海新安纳电子科技有限公司 | 一种成膜硅溶胶及其制备方法与应用 |
JP2017152372A (ja) * | 2016-02-24 | 2017-08-31 | 日東電工株式会社 | 絶縁テープ |
CN108146034A (zh) * | 2018-01-04 | 2018-06-12 | 苏州微磁新材料有限公司 | 隔磁材料及其制备方法和应用 |
CN109328011A (zh) * | 2018-11-05 | 2019-02-12 | 苏州世诺新材料科技有限公司 | 超薄电磁屏蔽片及其制备方法 |
-
2019
- 2019-07-31 CN CN201910702439.1A patent/CN110408360B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103320085A (zh) * | 2012-03-23 | 2013-09-25 | 深圳富泰宏精密工业有限公司 | 粘结剂,应用该粘结剂进行表面处理的方法及制品 |
CN103214973A (zh) * | 2013-01-16 | 2013-07-24 | 南京工业大学 | 一种无机复合粘结剂及其制备方法 |
CN105670350A (zh) * | 2016-02-17 | 2016-06-15 | 上海新安纳电子科技有限公司 | 一种成膜硅溶胶及其制备方法与应用 |
JP2017152372A (ja) * | 2016-02-24 | 2017-08-31 | 日東電工株式会社 | 絶縁テープ |
CN108146034A (zh) * | 2018-01-04 | 2018-06-12 | 苏州微磁新材料有限公司 | 隔磁材料及其制备方法和应用 |
CN109328011A (zh) * | 2018-11-05 | 2019-02-12 | 苏州世诺新材料科技有限公司 | 超薄电磁屏蔽片及其制备方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021119937A1 (zh) * | 2019-12-16 | 2021-06-24 | 瑞声声学科技(深圳)有限公司 | 无线充电线圈模组及无线充电装置 |
CN113278309A (zh) * | 2020-03-25 | 2021-08-20 | 安泰科技股份有限公司 | 带有绝缘涂层的非晶纳米晶带材的制备方法及产品 |
CN113278309B (zh) * | 2020-03-25 | 2022-07-15 | 安泰科技股份有限公司 | 带有绝缘涂层的非晶纳米晶带材的制备方法及产品 |
CN112289578A (zh) * | 2020-10-16 | 2021-01-29 | 横店集团东磁股份有限公司 | 一种磁条状纳米晶隔磁片及其制备方法和应用 |
CN112768218A (zh) * | 2020-12-22 | 2021-05-07 | 信维通信(江苏)有限公司 | 低损耗隔磁片及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN110408360B (zh) | 2021-01-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN110408360A (zh) | 一种绝缘胶液及其制备方法和应用以及由其得到的隔磁片 | |
CN105336465B (zh) | 一种无线充电和近场通讯用复合导磁片及其制备方法 | |
JP4585493B2 (ja) | 絶縁性磁性材料の製造方法 | |
CN101236819B (zh) | 一种镍铜锌铁氧体及其制造方法 | |
CN105632678A (zh) | 一种非接触式充电用柔性导磁薄片及其制备方法 | |
CN108430203A (zh) | 一种电磁屏蔽片及其制备方法 | |
CN108793991A (zh) | 一种MnZn铁氧体隔磁片及其制备方法和用途 | |
CN108597849A (zh) | 一种低损耗隔磁片制备工艺及隔磁片 | |
WO2023071317A1 (zh) | 一种负极片、电芯和锂离子电池 | |
KR20130122453A (ko) | 무선충전 라디에이터 기능을 갖는 자성 시트, 그 제조방법 및 이를 이용한 무선충전 디바이스 | |
CN108418317A (zh) | 无线充电用导磁板及其制备方法和无线充电模块 | |
CN103489543A (zh) | 适用于变频高压电机的耐电晕耐高频脉冲高透气性少胶云母带及其制备方法 | |
CN206961645U (zh) | 一种电感器磁芯 | |
CN110364340A (zh) | 一种隔磁片及其制备方法和应用 | |
CN108298972B (zh) | 一种软磁铁氧体片材的制备方法 | |
KR102315813B1 (ko) | 무선충전 수신장치 모듈용 방열부재, 이를 포함하는 무선충전 수신장치 모듈 및 무선충전 수신장치 | |
CN109451716A (zh) | 一种电磁屏蔽片及其制备方法和应用 | |
CN110335748B (zh) | 一种基于非晶或纳米晶带材的磁性薄片及其制备方法 | |
KR102220560B1 (ko) | 자기장 차폐시트 및 이의 제조 방법 | |
CN209516750U (zh) | 具有气隙的屏蔽片 | |
CN107230541A (zh) | 磁性材料及其制备方法 | |
CN209216757U (zh) | 一种基于非晶或纳米晶带材的磁性薄片 | |
CN201584183U (zh) | 聚酯与聚酯纤维无纺布组合绝缘材料及其组成的线缆 | |
CN109412279A (zh) | 具有气隙的屏蔽片及其制造方法 | |
KR20160005976A (ko) | 무선 충전용 복합시트 및 이의 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20191105 Assignee: Jinhua cimeng Intellectual Property Service Co.,Ltd. Assignor: HENGDIAN GROUP DMEGC MAGNETICS Co.,Ltd. Contract record no.: X2023330000883 Denomination of invention: An insulating adhesive liquid and its preparation method and application, as well as a magnetic separator obtained from it Granted publication date: 20210105 License type: Common License Record date: 20231128 |