CN110392188B

CN110392188B - Camera module with chamfer, photosensitive assembly and electronic equipment

Info

Publication number: CN110392188B
Application number: CN201810342446.0A
Authority: CN
Inventors: 赵波杰; 袁栋立; 黄桢
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2018-04-17
Filing date: 2018-04-17
Publication date: 2024-08-02
Anticipated expiration: 2038-04-17
Also published as: CN110392188A

Abstract

The imaging module with the chamfer, the photosensitive assembly and the electronic equipment. The camera module comprises at least one chamfer part and is suitable for being arranged at the corner of the frame of the electronic equipment; an optical lens; the light sensing component is provided with a second chamfering part, the second chamfering part is used for forming the chamfering part, the light sensing component comprises a light sensing element, a circuit board and a lens seat, the light sensing element is electrically connected to the circuit board, the lens seat supports the optical lens on a light sensing path of the light sensing element, and the lens seat is provided with a light window arranged on the light sensing path of the light sensing element, so that the image sensing module is suitable for being installed at a corner of a frame of electronic equipment, and the screen occupation ratio is improved.

Description

Camera module with chamfer, photosensitive assembly and electronic equipment

Technical Field

The invention relates to the field of camera modules, in particular to a camera module with a chamfer, a photosensitive assembly and electronic equipment, wherein the chamfer structure is suitable for the corner shape of the electronic equipment, so that the camera module can be arranged at the corner of the electronic equipment, and the screen occupation ratio is improved.

Background

In recent years, with the popularization and rapid development of intelligent equipment, especially the arrival of the current full-screen mobile phone age, the requirement on the screen occupation ratio of the display screen of the electronic equipment is increasing. Correspondingly, the camera module is adapted to development, and is required to be light, thin and miniaturized, so that space is reserved for the display screen by using the more miniaturized camera module and the more edge-located arrangement, the screen occupation ratio is improved, and particularly, a part of screen space is occupied by a front camera of electronic equipment such as a mobile phone at present. Therefore, in order to meet the demands of the full screen, the camera module needs to be further miniaturized, and manufacturers of camera modules are continuously dedicated to design, manufacture and manufacture camera modules meeting the demands.

The means commonly adopted at present is to arrange the camera module in the center of the electronic equipment and close to the upper edge of the mobile phone, so that the screen occupation ratio of the mobile phone is improved. Or only a partial module area in the center of the screen of the mobile phone, namely 'Ji Liuhai' in the present case, is left. Although the screen ratio is increased in this way, the visual experience for the user is poor because the module area is a black area, the display screen area is a color area, and the user always has a black area in the center after the screen is lightened, which is difficult to ignore.

Therefore, a new design scheme is provided to bring better visual experience to the user while meeting the requirements of the full screen, and the need for bringing an abrupt sense to the user like Liu Haibing is avoided.

Disclosure of Invention

An object of the present invention is to provide a camera module, a photosensitive assembly and an electronic device with chamfer, wherein the camera module is suitable for being installed at corners of frames of electronic devices such as mobile phones, flat panels and the like.

Another object of the present invention is to provide a camera module, a photosensitive assembly and an electronic device with a chamfer, wherein a chamfer portion of the camera module is adapted to a corner shape of a frame of the electronic device such as a mobile phone, so that the camera module is more suitable to be mounted at a corner of the electronic device, and can be closer to the corner of the mobile phone than a conventional square camera module, thereby improving the screen occupation ratio and simultaneously providing a better use experience for a user.

Another objective of the present invention is to provide an imaging module, a photosensitive assembly and an electronic device with a chamfer, wherein the chamfer is implemented as a round chamfer, so as to be matched with the design of round corners of the frame of most of the existing electronic devices, and meet the market demand.

Another object of the present invention is to provide an image pickup module, a photosensitive assembly, and an electronic device having a chamfer, wherein the chamfer can be designed to have a shape of a slanted edge or the like, thereby adapting to corner shapes of frames of different electronic devices.

Another object of the present invention is to provide an imaging module, a photosensitive assembly, and an electronic apparatus having a chamfer, wherein the imaging module has a plurality of chamfer portions to increase a screen ratio.

Another object of the present invention is to provide a camera module with a chamfer, a photosensitive assembly and an electronic device, wherein the camera module has two round chamfer portions diagonally disposed at opposite corners of the camera module, so that a butt joint angle between a screen of the electronic device and the camera module is rounded, the area of the screen is increased, and the screen occupation ratio is increased.

Another object of the present invention is to provide an imaging module, a photosensitive assembly and an electronic device with a chamfer, wherein an outer edge of an optical lens without a chamfer is located inside an outer edge of a chamfer of a lens holder, so that the optical lens can be processed without additional chamfering process, thereby saving process steps.

Another object of the present invention is to provide an imaging module, a photosensitive assembly and an electronic device with a chamfer, wherein a first chamfer portion is disposed at a corner of the photosensitive assembly to adapt to a corner shape of the electronic device.

Another object of the present invention is to provide an imaging module, a photosensitive assembly and an electronic device with chamfer, wherein an outer edge of an optical lens without chamfer is located outside an outer edge of a chamfer of a lens base, and the optical lens needs to be subjected to chamfer treatment to form a second chamfer portion.

Another object of the present invention is to provide an imaging module, a photosensitive assembly, and an electronic apparatus having a chamfer, wherein the second chamfer portion of the optical lens is disposed at the same position as the first chamfer portion of the photosensitive assembly, and the chamfer portion is formed.

Another object of the present invention is to provide an image pickup module, a photosensitive assembly, and an electronic apparatus having a chamfer, in which each electronic component of the image pickup module is arranged at an edge region different from the chamfer region, thereby facilitating the photosensitive assembly to form the first chamfer portion.

Another object of the present invention is to provide an imaging module, a photosensitive assembly and an electronic device with a chamfer, wherein, in order to increase the display ratio, the optical lens is abutted against the top side wall of the electronic device, and accordingly the photosensitive element is attached to the circuit board with being biased upwards.

Another object of the present invention is to provide an imaging module, a photosensitive assembly and an electronic device with a chamfer, wherein the electronic component is disposed at a side area and/or a corner area of the photosensitive assembly, so that the photosensitive element is attached to the circuit board in an offset manner, that is, a top area of the circuit board is narrower than other areas.

Another object of the present invention is to provide an imaging module, a photosensitive assembly and an electronic device with a chamfer, wherein the second chamfer portion corresponds to the first chamfer portion and fits the shape and position of the corner of the frame of the electronic device, so that the imaging module is closer to the edge of the electronic device than the existing imaging module, and the screen occupation ratio is higher.

Another object of the present invention is to provide an image capturing module, a photosensitive assembly, and an electronic device having a chamfer, wherein two adjacent sides of the second chamfer are implemented as straight sides, so that adjacent side walls of a corner of a frame of the electronic device can be as close as possible, and the screen ratio can be increased.

Another object of the present invention is to provide an imaging module, a photosensitive assembly, and an electronic apparatus having a chamfer, wherein the electronic component is disposed at the corner edge region, so that the photosensitive element is attached to the wiring board in a right and upper direction, that is, the top and side regions of the wiring board are narrower than other regions.

Another object of the present invention is to provide an image capturing module, a photosensitive assembly and an electronic device with a chamfer, wherein the molded lens seat surrounds the periphery of the light-transmitting element, so that the light-transmitting element is disposed on the light window, the area of the light-transmitting element is reduced, the damage of the light-transmitting element is avoided, and the overall height of the image capturing module is reduced, thereby meeting the miniaturization requirement of the current image capturing module.

Another object of the present invention is to provide an imaging module, a photosensitive assembly, and an electronic apparatus having a chamfer, wherein the chamfer of the circuit board having the chamfer may be formed before a lens holder is mounted, after the lens holder is mounted, before an optical lens is mounted, or after the optical lens is mounted.

Another object of the present invention is to provide an imaging module, a photosensitive assembly, and an electronic device having a chamfer, wherein the chamfer of the circuit board can be formed by a suitable process such as stamping, cutting or laser cutting, and a manufacturer can select a suitable forming process according to practical situations.

Another object of the present invention is to provide an imaging module, a photosensitive assembly, and an electronic device with a chamfer, wherein the chamfer is formed by assembling the circuit board chamfer, a lens holder chamfer of the lens holder, and a second chamfer of the optical lens, or by grinding or cutting the imaging module after the assembly.

Another object of the present invention is to provide an imaging module, a photosensitive assembly and an electronic device with a chamfer, wherein the chamfer of the lens seat is formed by injection molding, and cutting or grinding is not required, so that the overall grinding or cutting difficulty of the imaging module is reduced.

Another object of the present invention is to provide an image pickup module, a photosensitive assembly, and an electronic apparatus having a chamfer, in which a manufacturer can manufacture the photosensitive assembly using an existing mold, and then form the chamfer by cutting or the like, thereby reducing the cost of reworking the mold.

According to one aspect of the present invention, there is provided a camera module with chamfer for an electronic device, comprising

At least one chamfer part which is suitable for being arranged at the corner of the frame of the electronic equipment;

an optical lens; and

The light sensing component is provided with a first chamfer part, wherein the first chamfer part is used for forming the chamfer part, the light sensing component comprises a light sensing element, a circuit board and a lens seat, the light sensing element is electrically connected to the circuit board, the lens seat supports the optical lens on a light sensing path of the light sensing element, and the lens seat is provided with an optical window for providing a light ray path for the light sensing element.

In one embodiment of the invention, the circuit board and the lens base are provided with a circuit board chamfer and a lens base chamfer respectively, wherein the positions of the circuit board chamfer and the lens base chamfer are corresponding, and the circuit board chamfer and the lens base chamfer form the first chamfer part.

In one embodiment of the invention, the chamfer is embodied as a round chamfer, wherein the first chamfer is correspondingly embodied as a round chamfer.

In one embodiment of the present invention, the camera module has two rounded portions, wherein the rounded portions are disposed diagonally at two opposite corners of the camera module, respectively.

In one embodiment of the present invention, the circuit board is pre-provided with a pre-cut edge for forming the first chamfer portion.

In an embodiment of the invention, the photosensitive assembly further includes a light-transmitting element, wherein the lens base includes a supporting portion, wherein a top of the supporting portion extends from a periphery to a center, defines the light window, and supports the light-transmitting element on a photosensitive path of the photosensitive element.

In one embodiment of the invention, the support encloses the peripheral side of the light-transmitting element.

In an embodiment of the invention, the photosensitive assembly further comprises at least one electronic component, wherein the electronic component is attached to the circuit board and electrically connected to the circuit board.

In one embodiment of the invention, the circuit board further has an electrical connection region, wherein the lens mount and the photosensitive element define the electrical connection region, wherein the electrical connection region has a chamfer region and an edge region, wherein the chamfer region and the edge region form the electrical connection region, wherein the electronic component is disposed in the edge region.

In one embodiment of the invention, the edge region has a top region, a side region and a corner region, wherein the optical lens abuts against a top sidewall of the electronic device, wherein a width of the top region is narrow relative to a width of the side region and the corner region, wherein the electronic component is mounted to the side region and/or the corner region.

In one embodiment of the present invention, the optical lens has a second chamfer portion, wherein the first chamfer portion corresponds to the second chamfer portion in position for forming the chamfer portion.

In one embodiment of the invention, the edge region has a top region, a side region and a corner region, wherein the second chamfer is adjacent to two sidewalls of a corner of the electronic device, wherein the widths of the top region and the side region are narrow relative to the width of the corner region, wherein the electronic component is mounted to the corner region.

In an embodiment of the invention, adjacent sides of the second chamfer are embodied as straight sides for attaching the second chamfer to both side walls of a corner of the electronic device.

In an embodiment of the invention, one of the adjacent sides of the second chamfer is embodied as a straight edge for attaching the first chamfer to a corner side wall of the electronic device.

According to another aspect of the present invention, there is further provided an electronic apparatus including:

an equipment body; and

The camera module with the chamfer is arranged at the corner of the frame of the equipment body.

According to another aspect of the present invention, there is further provided a photosensitive assembly for an image pickup module having a chamfer, comprising:

A photosensitive element;

A circuit board, wherein the photosensitive element is electrically connected and attached to the circuit board, and the circuit board is provided with a circuit board chamfer; and

The lens seat is provided with an optical window and a lens seat chamfer for providing a light path for the photosensitive element, a second chamfer structure is formed by the lens seat chamfer and the circuit board chamfer correspondingly and is suitable for forming the chamfer structure of the camera module, the lens seat surrounds the photosensitive element, is attached to the circuit board and is suitable for supporting an optical lens of the camera module on a photosensitive path of the photosensitive element.

Drawings

Fig. 1 is a block diagram of an electronic device according to the present invention, to illustrate a structure of a conventional camera module when the camera module is mounted at a corner of a frame of the electronic device.

Fig. 2 is a schematic structural view of an electronic device according to the present invention, to illustrate a structure of an imaging module with a chamfer of the present invention when the imaging module is mounted at a corner of a frame of the electronic device.

Fig. 3 is a schematic perspective view of an image capturing module according to a first preferred embodiment of the present invention.

Fig. 4 is a schematic structural diagram of the camera module according to the first preferred embodiment of the present invention.

Fig. 5 is a top view of a photosensitive assembly according to an embodiment of the image capturing module of the present invention.

FIG. 6 is a top view of a photosensitive assembly according to another embodiment of an imaging module of the present invention.

Fig. 7 is a schematic perspective view of an image capturing module according to a second embodiment of the present invention.

Fig. 8 is a schematic top view of the camera module according to the second embodiment of the present invention.

Fig. 9 is a schematic structural diagram of the camera module according to the second embodiment of the present invention.

FIG. 10 is a top view of a photosensitive assembly according to an embodiment of an imaging module of the present invention.

Detailed Description

The following description is presented to enable one of ordinary skill in the art to make and use the invention. The preferred embodiments in the following description are by way of example only and other obvious variations will occur to those skilled in the art. The basic principles of the invention defined in the following description may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be appreciated by those skilled in the art that in the present disclosure, the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc. refer to an orientation or positional relationship based on that shown in the drawings, which is merely for convenience of description and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore the above terms should not be construed as limiting the present invention.

It will be understood that the terms "a" and "an" should be interpreted as referring to "at least one" or "one or more," i.e., in one embodiment, the number of elements may be one, while in another embodiment, the number of elements may be plural, and the term "a" should not be interpreted as limiting the number.

As shown in fig. 1 to 10, the present invention provides an image pickup module 100 and an electronic apparatus having a chamfer, wherein the image pickup module 100 is installed at a corner of the electronic apparatus, thereby increasing a duty ratio. Further, as shown in fig. 1, in order to increase the aesthetic degree, the cushioning effect at the time of collision of each vertex angle is increased, the possibility that the sharp angle scratches the user is reduced, and the corners of the existing electronic device are basically designed to be round. The structure of the existing camera module is square, and when the camera module is arranged at the corner of the electronic device, the shape of the camera module 100 and the shape at the corner do not fit, and a large area is left blank, so that a higher screen ratio cannot be realized.

Therefore, in the present invention, the camera module 100 has at least one chamfer 10, wherein the chamfer 10 is formed at the corner 100 of the camera module for fitting the corner shape of the electronic device. Preferably, the shape and size of the chamfer portion 10 are adapted to the shape and size of the corner of the electronic device, so that the camera module is more suitable to be mounted at the corner of the electronic device, and can be closer to the corner of the frame of the electronic device than a traditional square camera module, thereby improving the screen ratio and simultaneously providing better use experience for users. The chamfer 10 is formed at a corner of the camera module 100. Preferably, as shown in fig. 2 to 10, the chamfer portion 10 is designed as a round chamfer so as to fit the shape of the corners of the frame of most of the existing electronic devices. It will be understood by those skilled in the art that the shape of the chamfer 10 is not limited and may be designed to accommodate different shapes of corners of the electronic device bezel. For example, the chamfer 10 may be implemented as a beveled edge to accommodate the corners of a prismatic shape of an electronic device.

In the present invention, the image capturing module 100 is mounted at the upper right corner of the electronic device as an example, and is not limited thereto, and those skilled in the art should understand that the image capturing module 100 may also be mounted at other corners such as the upper left corner of the electronic device, and the embodiments and features of the present invention are also applicable, and are not repeated herein.

In one embodiment of the present invention, the camera module 100 may have a plurality of chamfer portions 10, so as to adapt to the requirements that the camera module 100 is mounted at different corners of an electronic device, and to some extent, the volume and size of the camera module 100 are also reduced. Optionally, the camera module 100 has two rounded chamfer portions 10A, 10B, wherein the chamfer portions 10A, 10B are diagonally disposed at two opposite corners of the camera module 100, as shown in fig. 6, the butt joint angle between the screen of the electronic device and the camera module 100 is rounded, so that the corner of the screen is smoothly transited, and the butt joint installation is convenient. On the other hand, the area of the screen can be increased, and the screen occupation ratio can be improved.

As shown in fig. 3 to 5, in the first preferred embodiment of the present invention, the image capturing module 100 includes an optical lens 20 and a photosensitive element 30, wherein the optical lens 20 is fixed on a photosensitive path of the photosensitive element 30, so that the photosensitive element 30 receives image information for imaging. It is understood that the optical lens 20 may be implemented as an integral optical lens, a split optical lens, a bare lens, or an optical lens including a lens barrel, etc., which is not a limitation of the present invention.

The outer edge of the optical lens 20 without chamfering is located inside the outer edge of the first chamfering section 12, and the optical lens 20 can be free from an additional chamfering process, thereby saving process steps. The photosensitive member 30 has a first chamfering portion 12 in order to realize the chamfering portion 10, wherein the first chamfering portion 12 is provided at a corner of the photosensitive member 30 to accommodate a corner shape of an electronic device.

In particular, the optical lens 20A is implemented as a cylinder, which is adapted to the rounded corners of the electronic device. For example, when the camera module 100 is a fixed focus module, the optical lens 20 is cylindrical in shape, and the cross-sectional area of the optical lens is often smaller than that of the lens holder, so that chamfering is not required.

Specifically, as shown in fig. 4, the photosensitive assembly 30 includes a photosensitive element 31, a circuit board 32, and a lens holder 33, wherein the photosensitive element 31 is electrically connected to and attached to the circuit board 32, the lens holder 33 is mounted on the circuit board 32, and the lens holder 33 supports the optical lens 20 on a photosensitive path of the photosensitive element 31. The lens base 33 has a light window 331 for providing a light path for the photosensitive element 31.

In the first embodiment, the chamfering section 10 is implemented as the first chamfering section 12 of the photosensitive member 30. When the camera module 100 is mounted at a corner of the electronic device frame, the first chamfer 12 is located as close to the corner edge of the electronic device frame as possible, so as to increase the screen ratio. Correspondingly, the circuit board 32 and the lens holder 33 have a circuit board chamfer 121 and a lens holder chamfer 122, respectively, which are mounted to form the first chamfer 12.

The circuit board chamfer 121 may be formed before the lens holder 33 is mounted, or may be formed after the lens holder 33 is mounted and before the optical lens 20 is mounted, or may be formed after the optical lens 20 is mounted, and the order of the steps does not affect the final structure of the present invention.

Specifically, in one embodiment of the present invention, the circuit board chamfer 121 is formed before the lens holder 33 is mounted, avoiding dust generation during the subsequent cutting process. For example, the circuit board 32 without the circuit board chamfer 121 may be formed by cutting, die cutting, laser cutting, or the like in the circuit board profile cutting process. In general, the production of small circuit boards is made up, that is, chamfering processing can be performed on a plurality of circuit boards at a time in the outline cutting process, thereby improving the production efficiency.

In another embodiment of the present invention, the circuit board chamfer 121 is formed after the mount 33 is mounted, that is, after the mount 33 is mounted, the circuit board 32 is cut along the edge of the mount 33 to form the circuit board chamfer 121, and when the circuit board 32 is cut from the front side of the circuit board 32 (the side on which the mount 33 is mounted), the outer edge of the mount chamfer 122 is located inside the edge of the circuit chamfer 121 in order to avoid cutting to the mount 33. When the circuit board 32 is cut from the back of the circuit board 32, the cutting depth is controlled to avoid cutting the lens holder 33, so that the outer edge of the circuit board chamfer 121 is positioned on the inner side of the lens holder chamfer 122, and the bottom of the circuit board 32 is prevented from interfering with the electronic equipment housing when the camera module 100 is mounted on the electronic equipment.

As shown in fig. 4, the lens base 33 may be implemented as a conventional lens base, and is formed by injection molding, and then a light-transmitting element 34 is attached to the top surface of the lens base 33. Those skilled in the art will understand the structure and concept of the conventional lens base and the lens base of the injection molding process, and will not be repeated herein.

The lens holder chamfer 122 may be formed at the time of injection molding by designing an injection molding shape. If an original mold is used, that is, the shape of the mold is not changed, the lens base 33 without chamfer formed after injection molding is cut or ground or other suitable process is performed to form the lens base chamfer 122. Preferably, the lens holder chamfer 122 is integrally formed when the lens holder 33 is injection molded, thereby reducing the difficulty of subsequent cutting, particularly when the circuit board chamfer 122 is formed prior to mounting the lens holder 33.

The lens holder chamfer 122 corresponds to the shape and size of the circuit board chamfer 121 so as to form the first chamfer portion 12 by mounting the same. When the first chamfer 12 is close to the corner of the frame of the electronic device, the adjacent edge and the opposite angle of the first chamfer 12 are suitable for being close to the side wall and the screen connected to the corner of the frame of the electronic device, so that the side wall of the electronic device can be used as the bearing surface of the photosensitive assembly 30 to keep the stability of the camera module 100.

In one embodiment of the present invention, the circuit board 32 is formed with a precut edge by a laser drilling process, so that the surplus material is removed in the subsequent process to form the first chamfer portion 12. It will be appreciated that the manufacturer may chamfer the lens holder 33 and the circuit board 32 together according to the pre-cut edge after the lens holder 33 is installed or formed.

The photosensitive assembly 30 further includes the light-transmitting element 34, wherein the light-transmitting element 34 is disposed on the photosensitive path of the photosensitive element 31 for filtering the light unnecessary for imaging. The light transmissive element 34 may be an infrared filter, an ultraviolet filter, blue glass, or the like. It is understood that the light-transmitting element 34 may also be a visible light filter that filters out visible light, so as to be suitable for an infrared camera module that receives infrared light.

In the first preferred embodiment, the top of the lens holder 33 extends from the periphery to the center to form a supporting portion 332, wherein the supporting portion 332 defines the optical window 331. The light-transmitting element 34 is supported on the top surface of the lens holder 33.

That is, the top of the lens base 33 extends from the periphery to the center, and the size of the light window 331 is equal to or slightly larger than the size of the photosensitive area 311, so as to reduce the required area of the light-transmitting element 34 as much as possible, and facilitate the lens base 33 to form the lens base chamfer 122.

Further, the lens holder 33 and the photosensitive element 31 define an electrical connection area 40 on the circuit board 32 for electrically connecting a series of electronic components 35. That is, the electrical connection region 40 is disposed between the mounting region of the mirror mount 33 and the mounting region of the photosensitive element 31, i.e., the electrical connection region 40 is defined by the inner edge of the mirror mount 33 and the edge of the photosensitive element 31.

The photosensitive assembly 30 includes the electronic component 35, and the electronic component 35 may be one or more of a capacitor, a resistor, an inductor, a diode, and a triode. In this embodiment, the electronic component 35 is attached to the circuit board 32 and electrically connected to the circuit board 32.

The electrical connection region 40 has a chamfer region 44 and an edge region 45, wherein the edge region 45 and the chamfer region 44 form the electrical connection region 40, i.e. the edge region 45 removes the remaining region of the chamfer region 44, wherein the chamfer region 44 adjoins the inner edge of the lens mount chamfer 122. In order to facilitate the chamfer formation, to avoid the electronic component 35 being affected during the formation of the lens holder chamfer 122 and the circuit board chamfer 121, the electronic component 35 is preferably mounted to the edge region 45, especially when the lens holder chamfer portion 122 and the circuit board chamfer 121 are cut.

Further, the edge region 45 is divided into a top region 41, a side region 42 and a corner edge region 43. The top region 41 is located on the top side of the photosensitive element 31. When the camera module 100 is mounted on the upper right corner of the electronic device, as shown in fig. 6, the side area 42 is implemented as a right electrical connection area, which is located on the right side of the photosensitive element 31. When the camera module 100 is mounted in the upper left corner of the electronic device, the side area 42 is implemented as a left electrical connection area, which is located on the left side of the photosensitive element 31.

Correspondingly, when the side region 42 is implemented as a right electrical connection region, the corner edge region 43 is located on the left side as well as on the bottom side of the photosensitive element 31. When the side region 42 is implemented as a left electrical connection region, the corner edge region 43 is located on the right side as well as on the bottom side of the photosensitive element 31. The photosensitive element 31 is generally rectangular, and the upper and lower sides in the drawing are taken as the top and the longer sides are taken as the sides, so that the description is not limited.

In order to increase the display ratio, the optical lens 20 is located as close to the top side wall of the electronic device as possible, and even attached to the top side wall of the electronic device, and accordingly the photosensitive element 31 is attached to the circuit board 32 with being biased upwards. I.e. the top edge of the photosensitive element 31 is closer to the top inner edge of the mirror base 33, and the bottom edge thereof is farther from the bottom inner edge of the mirror base 33. This results in the top region 41 being narrower than other regions (the width is the distance between the edge of the photosensitive element 31 and the inner edge of the lens holder 33), which is disadvantageous for attaching the electronic component 35. Therefore, in the present embodiment, the electronic component 35 is preferably mounted to the wider side electrical connection side region 42 and/or the corner edge region 43.

Of course, it will be appreciated by those skilled in the art that the light sensing element 31 is not necessarily attached to the circuit board 32 in an upward direction, but is merely a preferred embodiment. One skilled in the art may choose to centrally locate the photosensitive element 31, i.e., not eccentrically located, as shown in fig. 6.

As shown in the drawing, in the second embodiment of the invention, the image capturing module 100A includes an optical lens 20A and a photosensitive assembly 30A, wherein the photosensitive assembly 30A includes a photosensitive element 31A, a circuit board 32A, a lens holder 33A, a light transmitting element 34A and a series of electronic components 35A. The photosensitive member 30A has a first chamfered portion 12A, and the circuit board 32A has an electrical connection area 40A, wherein the edge area 40A has a top area 41A, a side area 42A, a corner edge area 43A, and a chamfered area 44A. Correspondingly, the circuit board 32A has a circuit board chamfer 121A, and the lens holder 33A has a lens holder 122A.

It will be appreciated by those skilled in the art that the above-mentioned first preferred embodiment is applicable to the present embodiment, and the combination of the features of the present embodiment is omitted herein, in which the order of forming the round chamfer, the plurality of chamfers, the circuit board chamfer is not limited, the process of forming the lens seat chamfer is not limited, the outer edge of the lens seat chamfer is located at the inner side of the circuit chamfer edge, and the mounted electronic component is preferentially mounted in the top region, the side region and the corner edge region.

Unlike the first preferred embodiment, the cross-sectional area of the optical lens 20A without chamfer is not smaller than the cross-sectional area of the lens holder. Alternatively, the optical lens 20A without chamfer is located inside the outer edge of the first chamfer 12A, and the optical lens 20A needs to be subjected to a chamfering process to form a second chamfer 11A, wherein the first chamfer 12A and the second chamfer 11A are located at the same position.

When the camera module 100A is mounted at a corner of the electronic device frame, the first chamfer portion 12A and the second chamfer portion 11A respectively correspond to the shape and the position of the corner of the electronic device frame, so that the camera module 100A is closer to the edge of the electronic device than the existing camera module, and the screen occupation ratio is higher.

Preferably, in order to increase the duty ratio, the second chamfer portion 11A and the first chamfer portion 12A are as close to the adjacent side wall of the corner of the frame of the electronic device as possible. Taking the example that the optical lens 20A is mounted at the upper right corner of the electronic device, in the second embodiment, the adjacent edges of the second chamfer portion 11A of the optical lens 20A are straight edges, for example, the top edge and the right edge of the second chamfer portion 11A are straight edges, so that the top side wall and the right side wall of the corner of the frame of the electronic device can be close to each other as much as possible, and the screen ratio is improved. The optical lens 20A is less limited as close to the corner as possible than the first embodiment.

Correspondingly, the photosensitive element 31 is attached to the wiring board 33A in a right and upper direction. This results in the top region 41A and right electrical connection region 42A being narrower than the corner edge region 43A, i.e. in the present second embodiment, the electronic component 35A is preferably mounted to the corner edge region 43A.

In the present embodiment, the top of the lens holder 33A extends from the periphery to the center to form a supporting portion 332A, wherein the supporting portion 332A defines the light window 331A. The light-transmitting element 34A is disposed on the light window 331A, and the supporting portion 332A encapsulates the periphery of the light-transmitting element 34A, as shown in fig. 9, so as to reduce the area of the light-transmitting element 34A, avoid the light-transmitting element 34A from being excessively large, and prevent the photosensitive element 31A and the light-transmitting element 34A from being damaged due to the first chamfer portion 12A.

The lens holder 33A may be implemented as a molded lens holder formed by a molding process. The support 332A is formed by placing the light-transmitting element 34A in a mold and molding around the light-transmitting element 34A. In this way, the size of the light-transmitting element 34A is small and protected by the lens holder 33A, so as to avoid damage caused by the first chamfer 12.

In addition, the overall height of the camera module 100A is reduced, which meets the requirements of the current electronic device for light weight and miniaturization of the camera module. The requirement of miniaturization is met while the full-screen is met.

Preferably, when the lens holder 33A is a molded lens holder and the mold is designed to have a chamfer shape, the circuit board 32A is cut after the lens holder 33A is formed, thereby sufficiently ensuring that the circuit board chamfer 121A and the lens holder chamfer 122A are positioned appropriately.

Other means may be adopted by those skilled in the art to protect the light-transmitting element 34, such as a solution in which the light-transmitting element 34 is implemented as a filter film coated on the photosensitive element 34, which will not be described herein.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are by way of example only and are not limiting. The objects of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been shown and described in the examples and embodiments of the invention may be modified or practiced without departing from the principles described.

Claims

1. A camera module having a chamfer, wherein the camera module is adapted to an electronic device, comprising:

an optical lens; and

The light sensing component comprises a light sensing element, a circuit board and a lens seat, wherein the light sensing element is electrically connected to the circuit board, the lens seat supports the optical lens on a light sensing path of the light sensing element, the lens seat is provided with an optical window for providing a light ray path for the light sensing element, and the light sensing element is arranged close to one of the chamfer parts and eccentric to the circuit board.

2. The camera module of claim 1, wherein the circuit board and the lens mount have a circuit board chamfer and a lens mount chamfer, respectively, wherein the circuit board chamfer and the lens mount chamfer are positioned in correspondence, wherein the circuit board chamfer and the lens mount chamfer form the first chamfer portion.

3. The camera module of claim 2, wherein the chamfer is implemented as a round chamfer, wherein the first chamfer is correspondingly implemented as a round chamfer.

4. The camera module of claim 2, wherein the camera module has two chamfer portions, wherein the two chamfer portions are disposed diagonally at opposite corners of the camera module, respectively.

5. The camera module of any of claims 1 to 4, wherein the circuit board is pre-provided with a pre-cut edge for forming the first chamfer portion.

6. The camera module according to any one of claims 1 to 4, wherein the photosensitive assembly further comprises a light transmissive element, wherein the lens base comprises a support portion, wherein a top of the support portion extends from a periphery to a center, defines the optical window, and supports the light transmissive element on a photosensitive path of the photosensitive element.

7. The camera module of claim 5, wherein the photosensitive assembly further comprises a light transmissive element, wherein the lens mount comprises a support portion, wherein a top of the support portion extends from a periphery to a center, defines the light window, and supports the light transmissive element on a photosensitive path of the photosensitive element.

8. The camera module of claim 6, wherein the support encapsulates a perimeter of the light transmissive element.

9. The camera module of claim 7, wherein the support encapsulates a perimeter of the light transmissive element.

10. The camera module of any of claims 1-4, wherein the photosensitive assembly further comprises at least one electronic component, wherein the electronic component is attached to the circuit board and electrically connected to the circuit board.

11. The camera module of claim 10, wherein the circuit board further has an electrical connection region, wherein the lens mount and the photosensitive element define the electrical connection region, wherein the electrical connection region has a chamfer region and an edge region, wherein the edge region and the chamfer region form the electrical connection region, wherein the electronic component is disposed at the edge region.

12. The camera module of claim 11, wherein the edge region has a top region, a side region, and a corner region, wherein the optical lens abuts against a top sidewall of the electronic device, wherein a width of the top region is narrow relative to a width of the side region and the corner region, wherein the electronic component is mounted to the side region and/or the corner region.

13. The camera module of claim 5, wherein the photosensitive assembly further comprises a series of electronic components, wherein the electronic components are attached to the circuit board and electrically connected to the circuit board.

14. The camera module of claim 13, wherein the circuit board further has an electrical connection region, wherein the lens mount and the photosensitive element define the electrical connection region, wherein the electrical connection region has a chamfer region and an edge region, wherein the edge region and the chamfer region form the electrical connection region, wherein the electronic component is disposed at the edge region.

15. The camera module of claim 14, wherein the edge region has a top region, a side region, and a corner region, wherein the optical lens abuts against a top sidewall of the electronic device, wherein a width of the top region is narrow relative to a width of the side region and the corner region, wherein the electronic component is mounted to the side region and/or the corner region.

16. The camera module of claim 8, wherein the photosensitive assembly further comprises a series of electronic components, wherein the electronic components are attached to the circuit board and electrically connected to the circuit board.

17. The camera module of claim 16, wherein the circuit board further has an electrical connection region, wherein the lens mount and the photosensitive element define the electrical connection region, wherein the electrical connection region has a chamfer region and an edge region, wherein the edge region and the chamfer region form the electrical connection region, wherein the electronic component is disposed at the edge region.

18. The camera module of claim 17, wherein the edge region has a top region, a side region, and a corner region, wherein the optical lens abuts against a top sidewall of the electronic device, wherein a width of the top region is narrow relative to a width of the side region and the corner region, wherein the electronic component is mounted to the side region and/or the corner region.

19. The camera module of any of claims 1-4, wherein the optical lens has a second chamfer, wherein the first chamfer corresponds to the second chamfer for forming the chamfer.

20. The camera module of claim 19, wherein the circuit board further has an electrical connection region, wherein the lens mount and the photosensitive element define the electrical connection region, wherein the electrical connection region has a chamfer region and an edge region, wherein the edge region and the chamfer region form the electrical connection region, wherein the edge region has a top region, a side region, and a corner edge region, wherein the second chamfer is adjacent to two sidewalls of a corner of the electronic device, wherein widths of the top region and the side region are narrow relative to widths of the corner edge region, wherein the photosensitive assembly further comprises at least one electronic component mounted to the corner edge region.

21. The camera module of claim 19, wherein adjacent sides of the second chamfer are embodied as straight edges for the second chamfer to be attached to both sidewalls of a corner of the electronic device.

22. The camera module of claim 19, wherein one of the adjacent sides of the second chamfer is implemented as a straight edge for attaching the second chamfer to a corner sidewall of the electronic device.

23. An electronic device, comprising:

an equipment body; and

A camera module with chamfer as in any of claims 1-22, wherein the camera module is mounted at a corner of a bezel of the device body.

24. A photosensitive assembly, wherein the photosensitive assembly is adapted for a camera module having a chamfer, comprising:

A photosensitive element;

The lens seat is provided with an optical window and a lens seat chamfer which provide a light path for the photosensitive element, a first chamfer part is formed by the lens seat chamfer and the circuit board chamfer, the lens seat is suitable for forming a chamfer structure of the camera module, the lens seat surrounds the photosensitive element and is attached to the circuit board, the lens seat is suitable for supporting an optical lens of the camera module to a photosensitive path of the photosensitive element, and the photosensitive element is arranged close to one first chamfer part and eccentric to the circuit board.

25. The photosensitive assembly of claim 24, wherein the first chamfer portion is implemented as a round chamfer, wherein the lens mount chamfer and the circuit board chamfer are correspondingly implemented as round chamfers.

26. The photosensitive assembly of claim 24 or 25, further comprising a light transmissive element, wherein the light transmissive element is disposed on the light window, and the lens mount encapsulates a perimeter of the light transmissive element.

27. The photosensitive assembly of claim 24 or 25, further comprising a series of electronic components, wherein the electronic components are attached to the wiring board and electrically connected to the wiring board.

28. The photosensitive assembly of claim 27, wherein said circuit board further has an electrical connection region, wherein said lens mount and said photosensitive element define said electrical connection region, wherein said electrical connection region has a chamfer region and an edge region, wherein said edge region and said chamfer region form said electrical connection region, wherein said electronic component is disposed at said edge region.

29. The photosensitive assembly of claim 28, wherein said edge region has a top region, a side region, and a corner edge region, wherein a width of said top region is narrow relative to a width of said side region and said corner edge region, wherein said electronic component is mounted to said side region and/or said corner edge region.

30. The photosensitive assembly of claim 28, wherein said edge region has a top region, a side region, and a corner edge region, wherein the widths of said top region and said side region are narrow relative to the width of said corner edge region, wherein said electronic component is mounted to said corner edge region.