CN110383661A - Chip embedded power adapter - Google Patents

Chip embedded power adapter Download PDF

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Publication number
CN110383661A
CN110383661A CN201880016757.6A CN201880016757A CN110383661A CN 110383661 A CN110383661 A CN 110383661A CN 201880016757 A CN201880016757 A CN 201880016757A CN 110383661 A CN110383661 A CN 110383661A
Authority
CN
China
Prior art keywords
inductor
switch
converter
power adapter
pcb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201880016757.6A
Other languages
Chinese (zh)
Other versions
CN110383661B (en
Inventor
帕尔维兹·帕尔托
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Faraday Semi Inc
Original Assignee
Faraday Semi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/428,019 external-priority patent/US9729059B1/en
Priority claimed from US15/669,838 external-priority patent/US10193442B2/en
Application filed by Faraday Semi Inc filed Critical Faraday Semi Inc
Priority to CN202211229113.XA priority Critical patent/CN115765433A/en
Publication of CN110383661A publication Critical patent/CN110383661A/en
Application granted granted Critical
Publication of CN110383661B publication Critical patent/CN110383661B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of dc power input into dc power output
    • H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
    • H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
    • H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
    • H02M3/156—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
    • H02M3/158—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05F—SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES
    • G05F1/00—Automatic systems in which deviations of an electric quantity from one or more predetermined values are detected at the output of the system and fed back to a device within the system to restore the detected quantity to its predetermined value or values, i.e. retroactive systems
    • G05F1/10—Regulating voltage or current
    • G05F1/46—Regulating voltage or current wherein the variable actually regulated by the final control device is dc
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of dc power input into dc power output
    • H02M3/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of dc power input into dc power output
    • H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
    • H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
    • H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
    • H02M3/156—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
    • H02M3/158—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
    • H02M3/1584—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load with a plurality of power processing stages connected in parallel
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
    • Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes

Abstract

A kind of DC-DC (DC-DC) converter, including chip embedded integrated circuit (IC), one or more switches and inductor.IC is embeddable in the printed circuit boards.IC may include driver, switch and pulsewidth modulation (PWM) controller.IC and/or switch may include eGaN.Inductor can be stacked on IC and/or switch top, to reduce whole footprint.One or more capacitors also may be stacked on IC and/or switch top.Inductor and/or capacitor can be coupled to IC (for example, being coupled to switch) by via hole.The DC-DC converter can provide better mapping, has lower ripple or use less capacitor.Reduce the ghost effect that can interfere higher effective switching speed.Reduce inductor size and total footprint.Performance can be improved in more inductor arrangements.The ripple generator in various feedback systems, such as constant conduction or turn-off time modulation circuit can be used.

Description

Chip embedded power adapter
Cross reference to related applications
The application be submit on August 4th, 2017, application No. is the continuities of 15/669,838 U.S. Patent application, and The above-mentioned U.S. Patent application application No. is 15/669,838 be submit on 2 8th, 2017, application No. is 15/428,019 The part of U.S. Patent application (with the bulletin of U.S. Patent number 9,729,059) continues.For various purposes, the whole of these applications Content is herein incorporated by reference.
Technical field
This disclosure relates to electronic system, DC-DC (DC-DC) converter, electronic device design and electronic equipment production Technology.
Background technique
Although various DC-DC converters have been known, these DC-DC converters are by non-ideal group It part and/or constitutes there are the arrangement of parasitic loss and low efficiency problem, therefore there is the demand for improving power adapter.
Apply for content
This application discloses a kind of some embodiments of DC-DC (DC-DC) power adapter, which turns Parallel operation includes: part lower printed circuit board (PCB) with bottom side and top side；Upper printed circuit board with bottom side and top side (PCB) part；Flush type circuit between the top side of the lower part PCB and the bottom side of the upper part PCB, the flush type circuit packet It includes: pulse width modulator and at least one switch；Extend through one or more via holes of the part PCB；Positioned at the upper part PCB Inductor above top side, wherein one or more via holes are electrically coupled with the inductor and flush type circuit.The embodiment can be with Any combination with the following contents: where flush type circuit includes integrated circuit (IC)；Wherein, the footprint of inductor It is at least partly Chong Die with the footprint of integrated circuit；Wherein, mutual using no bonding wire electricity between inductor and flush type circuit Even；Wherein, the switching rate of circuit is at least 1MHz；Wherein, the switching rate of circuit is at least 3MHz；Wherein, circuit is opened It closes rate and is at least 5MHz；Wherein, the switching rate of circuit is up to 7MHz；Wherein, at least one switch includes enhanced nitrogen Change gallium field effect transistor (eGaN FET)；It further include one or more capacitors, which is arranged upper Above the top side of the part PCB；It further include core, which is arranged between the top side of the lower part PCB and the bottom side of the upper part PCB, In, which has one or more grooves, which is formed in core, and wherein, flush type circuit setting In the one or more groove；Wherein, the footprint of DC-DC power source conversion device is less than 25mm2；Wherein, DC-DC power source turns The footprint of parallel operation is less than 10mm2；Wherein, the footprint of DC-DC power source conversion device is less than 5mm2；Wherein, DC-DC power source The footprint of converter as low as 2mm2；Wherein, the footprint of DC-DC power source conversion device is 0.5-10mm2Every Ampere currents.
This application discloses a kind of some embodiments of DC-DC (DC-DC) power adapter encapsulation, DC-DC electricity Source converter encapsulation includes: integrated circuit (IC) chip being embedded in an at least printed circuit board (PCB), the IC chip packet Include driver；Positioned at chip embedded encapsulation outside and be coupled to the chip embedded encapsulation surface inductor；And Via hole for inductor and IC chip to be electrically coupled；Wherein, the footprint of inductor is at least partly accounted for IC chip The overlapping of position region.The embodiment can have any one of following: where and transistor is embedded at least one PCB, and its In, inductor is electrically coupled with transistor；Wherein, IC chip includes: pulsewidth modulation (PWM) controller for being coupled to driver, with And it is coupled to the switching transistor of the output of driver；It further include switch, which includes enhancement type gallium nitride (eGaN)；Its In, which is with 4MHz or faster frequency switching；Wherein, which is to be opened with 5MHz or faster frequency It closes；It further include switch, which includes at least one of silicon or GaAs.
This application discloses a kind of some embodiments of DC-DC (DC-DC) power adapter in a single package, The DC-DC power source conversion device includes: enhancement type gallium nitride (eGaN) component being partially embedded into inside installation base plate；Peace Inductor outside installation base plate；And inductor is coupled to the via hole of eGaN component；Wherein, the occupy-place area of inductor Domain is at least partly Chong Die with the footprint of eGaN component.The embodiment can have any combination of the following contents: where Installation base plate is multi-layer PCB；Wherein, eGaN component is the switch for including eGaN, and DC-DC power source conversion device further includes being configured to drive Move the driving circuit of the switch；Wherein, the driver and switch are a part of IC chip；Wherein, IC chip further includes pulsewidth Modulate (PWM) controller.
DC-DC (DC-DC) power adapter that this application discloses a kind of using chip embedded encapsulation it is some Embodiment, the DC-DC converter include: internal enhancement type gallium nitride (eGaN) switch of printed circuit board (PCB)；Pulsewidth modulation (PWM) controller；The driver being embedded in inside PCB, wherein the PWM controller and driver are configured to, with 1MHz or higher Frequency driving eGaN switch；Positioned at chip embedded package outside and it is coupled to the inductor of PCB surface；And by inductor The via hole being electrically coupled is switched with eGaN.These embodiments can have following characteristics, and wherein driver is configured to 5MHz or higher Frequency driving eGaN switch.
This application discloses a kind of some embodiments of DC-DC (DC-DC) power adapter, which turns Parallel operation includes: printed circuit board；And the integrated circuit of printed circuit intralamellar part, the integrated circuit include driver.The implementation Example can have any combination of the following contents: further include inductor, which extends through printing electricity by one or more The via hole of road plate is electrically coupled with integrated circuit；Wherein, the footprint of the inductor at least partly with the occupy-place of integrated circuit Region overlapping.
This application discloses a kind of some embodiments of DC-DC (DC-DC) power adapter, which turns Parallel operation includes: integrated circuit, which includes driver；And inductor, the inductor are vertically stacked on integrated circuit Top, so that the footprint of inductor is at least partly Chong Die with the footprint of integrated circuit, wherein the inductor and collection It is electrically coupled at circuit.The embodiment can have any combination of the following contents: further include printed circuit board (PCB), which has First side and second side opposite with the first side, wherein integrated circuit is mounted on the first side of PCB, and wherein, inductor peace Mounted in second side of PCB；Wherein, inductor extends through the via hole and integrated circuit electricity of printed circuit board by one or more Coupling.
This application discloses a kind of some embodiments of DC-DC (DC-DC) buck converter, DC-DC decompression turns Parallel operation includes: one or more switches；It is configured to the driver for driving the one or more to switch；And it is electrically coupled with the switch Inductor；Wherein, the footprint of the DC-DC buck converter is less than 65mm2；Wherein, which configures For the electric current for receiving at least 20 amperes；And wherein, which is configured as output at least 20 amperes of electric current.
This application discloses a kind of some embodiments of DC-DC (DC-DC) power adapter, which turns Parallel operation includes: one or more switches；Driver, be configured to drive with the frequency of 1-5MHz (including 1 and 5MHz) this or Multiple switch；And the inductor being electrically coupled is switched with the one or more；Wherein, the footprint of DC-DC converter is less than Or it is equal to 10mm2；Wherein, which is configured to receive at least 5 amperes of electric current；Wherein, which matches It is set to the electric current of at least 5 amperes of output.
This application discloses a kind of some embodiments of DC-DC (DC-DC) power adapter, which turns Parallel operation includes: the first switch for being coupled to the first inductor；It is coupled to the second switch of the second inductor；And it is embedded in printing IC chip in circuit board；Wherein, first switch and the second switch is coupled to modulator；And wherein, the first inductance Device and the second inductor are coupled to voltage output node.The embodiment can have any combination of the following contents: where modulation Device is included in IC chip；Wherein, modulator is configured to, and first switch and the second switch is made to operate phase with synchronizing cycle Position output；It wherein, is by the first signal of the first inductor and by the second inductor in the output signal of output node The superposition of second signal.
This application discloses a kind of some embodiments of DC-DC (DC-DC) power adapter, which turns Parallel operation includes: the IC chip of insertion in the printed circuit boards, which includes driver；It is coupled to driving The first switch of device；It is coupled to the inductor of first switch；And the feedback path from output node to modulation circuit.The implementation Example can have any combination of the following contents: where modulation circuit is voltage mode modulation circuit: where modulation circuit is Constant on-time or constant off-time modulation circuit: where modulation circuit is included in IC chip: where adjust Circuit and inductor processed and IC chip include in a package.
This application discloses a kind of some embodiments of DC-DC (DC-DC) power adapter, which turns Parallel operation includes: the IC chip of insertion in the printed circuit boards, which includes driver；It is coupled to driving The first switch of device；It is coupled to the inductor of first switch；Feedback path from output node to modulation circuit；And slope hair Raw device.The embodiment can have any combination of the following contents: where feedback path and the output coupling from ramp generator Close comparator；It further include the reference voltage source for being coupled to comparator；Wherein, ramp generator is configured to simulation by inductor Ripple current；Wherein, ramp generator includes: the first current source, the second current source and capacitor；Wherein, the first current source The inductance for being configured to be based at least partially on inductor with the second current source is modified；Wherein, ramp generator and inductor Included in the encapsulation of same DC-DC power source conversion device；Wherein, ramp generator is configured to what generation was not influenced by output capacitor Output signal, the output capacitor are coupled to inductor；Wherein, ramp generator is configured to generate output signal, output letter Number independently of output capacitor equivalent series resistance (ESR), which is coupled to inductor；It further include output capacitance There is sufficiently low ESR cannot reliably provide so that the ripple voltage on output capacitor is too small for device, the output capacitor To modulation circuit.
This application discloses a kind of some embodiments of ramp generator, which includes: to be coupled to power supply electricity First current source of pressure；Second current source of ground connection；And it is coupled in the capacitor between the first current source and the second current source. The embodiment can have any combination of the following contents: where ramp generator is configured to simulation by DC-DC converter Inductor ripple current；Wherein, the output of the first current source is based at least partially on the input voltage of DC-DC converter； Wherein, the output of the first current source is based at least partially on the inductance of the inductor in DC-DC converter；Wherein, the second electric current The output in source is based at least partially on the inductance of the inductor in DC-DC converter；Wherein, the output of the second current source at least portion Divide inductance of the ground based on the inductor in DC-DC converter；Wherein, the first current source is configured to be based at least partially on DC-DC The inductance of inductor in converter is modified；Wherein, the second current source is configured to be based at least partially on DC-DC converter In the inductance of inductor modified.
This application discloses a kind of manufacturing methods of chip embedded DC-to-dc converter, this method comprises: will integrate Circuit chip is embedded in the printed circuit boards；First inductor is coupled to printed circuit board；And the second inductor is coupled To printed circuit board, the first inductor and the second inductor are coupled to output node.
This application discloses a kind of some embodiments of method that first DC voltage is converted to the second DC voltage, should Method includes: the first switch that the first inductor is coupled in driving；The second switch of the second inductor is coupled in driving, wherein First switch and the second switch is coupled to output node；And out of phase modulate the driving of first switch and the second switch；Wherein, At least one of driver or modulator include that in the chips, which is embedded in the printed circuit boards.
This application discloses a kind of manufacturing methods of chip embedded DC-to-dc converter, this method comprises: will integrate Circuit chip is embedded in the printed circuit boards；Inductor is coupled between IC chip and output node；And it provides Feedback path from output node to modulation circuit, wherein the modulation circuit includes ramp generator.The embodiment can have Any combination of the following contents: where modulation circuit includes in the printed circuit boards；Wherein, when modulation circuit is constant conduction Between or constant off-time modulation circuit；Wherein, ramp generator includes in integrated circuits；It further include being based at least partially on The characteristic ramping generator of inductor；Wherein, which is the ramp generator of any preceding embodiment.
This application discloses a kind of some embodiments of method using DC-to-dc converter, this method comprises: defeated Ingress receives input power；It is powered by switch to inductor；It stores the energy in output capacitor, so that output capacitance Device both ends form output voltage；Output power is provided to output node under output voltage；Output voltage is provided to modulation circuit； Generate the ripple voltage independently of output capacitor；Ripple voltage is provided to modulation circuit；It is based at least partially on modulation circuit Output modulation switch.The embodiment can have any combination of the following contents: further include at least two in comparison or less: Ripple voltage, reference voltage and output voltage；It further include the inductance trim current source for being based at least partially on inductor；Wherein, Ripple voltage is generated by ramp generator, which is configured to the electric current that inductor is passed through in simulation.
This application discloses a kind of some embodiments of DC-DC (DC-DC) power adapter encapsulation, DC-DC electricity Source converter encapsulation includes: integrated circuit (IC) chip, is embedded in an at least printed circuit board (PCB), the IC chip packet Include driver；Inductor positioned at chip embedded package outside and is coupled to the surface of chip embedded encapsulation；And overcurrent Circuit is protected, is configured to detect when the electric current for being supplied to inductor oversteps the extreme limit.The embodiment can have the following contents Any combination: overcurrent protection circuit includes current source, the current source be configured to be based at least partially on IC bus or Power management bus line command is adjusted or modifies；The pulsactor of inductor oversteps the extreme limit and is more than the limit less than 50%； The limit is more than that maximum prescribed DC electric current specification adds maximum AC ripple specification and is more than less than 50%.
Some embodiments disclosed herein can be related to the encapsulation of DC-DC (DC-DC) power adapter, the DC-DC power source Converter package includes: integrated circuit (IC) chip, is embedded in an at least printed circuit board (PCB), which includes Driver；Inductor positioned at chip embedded package outside and is coupled to the surface of chip embedded encapsulation；And integrated circuit Bus or power management bus.The embodiment can have any combination of the following contents: where IC bus or power supply Management bus is coupled at least one current source, and is configured to provide for protocol command, with adjustment or trim current source；Wherein, collect It is coupled at least one current source at circuit bus or power management bus, and is configured to provide for protocol command, is arranged or adjust The whole reference value for being supplied to comparator；Wherein, IC bus or power management bus configuration are transportation protocol, the protocol package Include the instruction for executing at least one of following operation: the encapsulation of on or off DC-DC power source conversion device changes DC-DC power source The low-power or suspend mode of converter package, read the current setup information in relation to the encapsulation of DC-DC power source conversion device, and reading has The diagnosis and/or technical information for closing the encapsulation of DC-DC power source conversion device are set or changed and encapsulate offer by DC-DC power source conversion device Output voltage；Wherein, power management protocol is embodied as the interconnection layer on IC bus realization.
Some embodiments disclosed herein have power adapter, which includes printed circuit board (PCB) (print Printed circuit board includes: part lower printed circuit board (PCB) with bottom side and top side；And the upper printing with bottom side and top side Part circuit board (PCB))；Flush type circuit between the top side of the lower part PCB and the bottom side of the upper part PCB is (embedded Circuit includes: driver, is configured to generate one or more driving signals；And one or more switches, be configured to by this one A or multiple driving signal drivings), one or more extends through the via hole of the part PCB, and the top positioned at the upper part PCB The inductor of upper side, wherein one or more via holes are electrically coupled with inductor and flush type circuit, and the occupy-place of inductor Region is at least partly Chong Die with the footprint of flush type circuit.The embodiment can have any combination of the following contents: Wherein, power adapter be configured with isolated topology structure, the isolated topology structure be configured to isolated power supply converter input and Direct electrical connection between output；Wherein, which comprises at least one of the following: flyback topologies structure, and normal shock turns Parallel operation topological structure, pair transistor normal shock, LLC resonance converter, push-pull type topological structure, full-bridge, mixing, PWM harmonic conversion Device and half-bridge topology；It further include transformer, which includes the first inductor and the second inductor, they are configured to So that the variable-current by the first inductor induces variable-current in the second inductor；Further include and flush type circuit exists Wireless communication system in same encapsulation；Wherein, the output of power adapter is configured to, and is received in response to wireless communication system Wireless signal and be adjusted；It further include feedback system, which includes ramp generator, ramp generator configuration To generate simulation by the signal of the current ripples of inductor, and wherein, which includes current source, which matches It is set to and is modified or adjusted in response to wireless signal that wireless communication system receives；Wherein, flush type circuit includes nothing Line communication system；It further include communication interface, which is configured to receive the control of the output for adjusting power adapter Signal；Wherein, which includes power management bus (PMBUS)；Wherein, which is arranged for carrying out integrated circuit Bus (I2C) agreement；It further include feedback system, which includes ramp generator, which is configured to generate The signal of the current ripples of inductor is passed through in simulation, and wherein, feedback system is configured to, and receives in response to passing through communication interface Order and ramping generator；Wherein, flush type circuit includes pulsewidth modulation (PWM) controller, PWM controller configuration To generate one or more pwm signals, wherein PWM controller is coupled to driver, wherein driver is configured at least partly Ground is based on pwm signal and generates one or more driving signals；Wherein, inductor has rated current, and inductor is with specified Saturation value, and wherein, specified saturation value is not more than the 150% of rated current；Wherein, inductor has rated current, and electricity Sensor has specified saturation value, and wherein, and specified saturation value is not more than the 120% of rated current；It further include overcurrent protection Circuit, the overcurrent protection circuit are configured to prevent by the electric current of inductor to be more than specified saturation value；It further include over current protection Protection circuit, the overcurrent protection circuit are configured to make at least one of one or more switches switch in response to detecting electricity It is disconnected when flowing situation；Wherein, power adapter is DC-DC (DC-DC) power adapter；Wherein, power adapter is AC-DC (AC-DC) power adapter；It further include feedback system, which includes current source, wherein the current source It is configured to be based at least partially on and is modified or adjusted in response to wireless signal that wireless communication system receives；Further include Over-current protection system, the over-current protection system are configured to provide for the instruction that electric current passes through inductor, the overcurrent system Including current source, wherein the current source is configured to be based at least partially on the wireless communication received in response to wireless communication system Number and modified or adjusted.
Some embodiments disclosed herein have a kind of article, which includes: power adapter described in above-mentioned paragraph； It is configured so that electric energy executes the first system of physical action；And it is configured to the electrical system of control the first system；Wherein, electric Source converter is configured to provide electric energy to one or two of the first system and electrical system, and wherein, electrical system is matched Be set to be based at least partially on by the received wireless signal of wireless communication system and control the first system, the wireless communication system with Flush type circuit in power adapter is in same encapsulation.In some embodiments, which is internet of things equipment.Some realities Example is applied with power supply system, which includes: multiple power adapters, wherein each of multiple power adapters It is all the power adapter according to above-mentioned paragraph；And shared pulsewidth modulation (PWM) controller, it is configured to generate multiple Pwm signal, wherein the PWM controller is coupled to the driver of multiple power adapters, and multiple pwm signals are passed to electricity The respective actuator of source converter, and wherein, which is configured to be based at least partially on pwm signal generation one or more A driving signal.Some embodiments have power supply system, which includes: the first power adapter, which turns Parallel operation is according to power adapter described in claim 1；And turn with the second source of the first power adapter parallel coupled Parallel operation.The power supply system can have control system, which is configured to the output and the of the first power adapter of adjustment The output of two power adapters, to realize current balance type.
Some embodiments disclosed herein have power adapter, which includes: printed circuit board (PCB), Including lower printed circuit board (PCB) part with bottom side and top side and the upper printed circuit board (PCB) with bottom side and top side Part；Input port is configured to receive input voltage；Output port is configured to provide for the output voltage different from input voltage； Flush type circuit, between the top side of the lower part PCB and the bottom side of the upper part PCB, which is coupled to input terminal Mouth simultaneously is configured to change input voltage；Extend through the via hole of the part PCB；And above the top side of the upper part PCB Inductor or capacitor, wherein one or more via holes are electrically coupled with inductor or capacitor and with flush type circuit, and Wherein, the footprint of inductor or capacitor is at least partly Chong Die with the footprint of flush type circuit.The embodiment can With any combination with the following contents: where inductor is located above the top side of the upper part PCB；Wherein, one or more mistakes Hole is electrically coupled with inductor and flush type circuit；Wherein, the footprint of inductor is at least partly accounted for flush type circuit Position region overlapping: where the flush type circuit includes: driver, is configured to generate one or more driving signals；One or more A switch is configured to be driven by the one or more driving signal；Wherein, power adapter is DC-DC (DC-DC) conversion Device；Wherein, power adapter is AC-DC (AC-DC) converter；It further include transformer, which includes the first inductance Device and the second inductor, they are configured so as to induce variation in the second inductor by the variable-current of the first inductor Electric current；Wherein, flush type circuit includes rectification circuit, which, which is configured to that (AC) input voltage will be exchanged, changes into pulse D/C voltage；It including smooth circuit, is configured to smoothly be more stable D/C voltage by pulsating DC voltage, wherein the smooth circuit packet Include the inductor or capacitor above the top side of the upper part PCB；Wherein, rectification circuit includes one or more switches；Its In, rectification circuit includes diode bridge.
Some embodiments disclosed herein have DC-DC (DC-DC) power adapter, the DC-DC power source conversion device It include: part lower printed circuit board (PCB) with bottom side and top side；Upper printed circuit board (PCB) with bottom side and top side Part；Flush type circuit between the top side of the lower part PCB and the bottom side of the upper part PCB, which includes: to match It is set to and generates pulsewidth modulation (PWM) controller of pwm signal, be configured to receive pwm signal and generate one or more driving letters Number driver, be configured to by least one of one or more driving signals drive first switch and be configured to by The second switch of at least one of one or more driving signals driving；One or more extends through the mistake of the part PCB Hole；Inductor above the top side of the upper part PCB, wherein one or more via holes and the inductor and flush type circuit It is electrically coupled, and wherein, the footprint of the inductor is at least partly Chong Die with the footprint of flush type circuit；And with Wireless communication system of the flush type circuit in same encapsulation, wherein the wireless communication system is configured to PWM controller or At least one of one switch provides signal, to influence the output of DC-DC converter.
Some embodiments disclosed herein have DC-DC (DC-DC) power supply, and the DC-DC power source is comprising: integrated electricity Road, is located at that printed circuit board (PCB) is internal, which includes: to be configured to the first signal of origin output from driver to drive First gallium nitride (GaN) switchs and is configured to the 2nd GaN switch of the second signal driving of origin output from driver；Inductor, Above integrated circuit, so that the footprint of inductor is at least partly Chong Die with the footprint of integrated circuit；And Inductor and GaN switch are electrically coupled by via hole.Some embodiments may include: that wherein, the first GaN switch is first enhanced Gallium nitride (eGaN) switch, the 2nd GaN switch are the 2nd eGaN switches.
Detailed description of the invention
Fig. 1 shows the schematic diagram of the exemplary circuit grade of chip embedded DC-DC converter encapsulation.
Fig. 2 shows the package level schematic diagrames of the example embodiment of chip embedded DC-DC converter encapsulation.
Fig. 3 shows the cross-sectional view of the chip embedded DC-DC converter of example.
Fig. 4 A shows the perspective view of the chip embedded DC-DC converter of example with stacked inductor.
Fig. 4 B shows (rendered) chip embedded DC-DC converter of the rendering of the example with stacked inductor Reverse perspective view.
Fig. 4 C shows the side view of the chip embedded DC-DC converter of example with embedded stacked inductor.
Fig. 4 D shows the side view of the chip embedded DC-DC converter of example with embedded-type electric sensor.
Fig. 5 shows the perspective view 500 of the chip embedded DC-DC converter of example.
Fig. 6 shows the bottom view of the chip embedded DC-DC converter of example.
Fig. 7 A shows the example of the DC-DC converter for storing equipment.
Fig. 7 B shows the example of the chip embedded DC-DC converter for storing equipment.
Fig. 8 A shows the sample application of DC-DC converter on circuit boards.
Fig. 8 B shows the sample application of chip embedded DC-DC converter on circuit boards.
Fig. 9 shows the flow chart for manufacturing and using the exemplary method of chip embedded DC-DC converter.
Figure 10 shows the double inductor designs of example using the double down pressure converter of chip embedded DC-DC converter.
Figure 11 A shows the first exemplary arrangement design of embedded chip in double down pressure converter.
Figure 11 B shows the second exemplary arrangement design of embedded chip in double down pressure converter.
Figure 11 C shows the third exemplary arrangement design of embedded chip in double down pressure converter.
Figure 11 D shows the 4th exemplary arrangement design of embedded chip in double down pressure converter.
Figure 12 shows the exemplary circuit grade schematic diagram of the double down pressure converter including chip embedded DC-DC converter.
Figure 13 A shows the exemplary circuit grade schematic diagram of the DC-DC converter including chip embedded DC-DC converter.
Figure 13 B shows the exemplary circuit grade schematic diagram of the DC-DC converter including chip embedded DC-DC converter.
Figure 14 shows the chip embedded DC-DC converter of example with external ripple voltage feed circuit.
Figure 15 shows inductive current ILIt changes over time and equivalent series resistance voltage VESR(also referred to as ripple voltage) with The exemplary diagram of time change.
Figure 16 shows the chip embedded DC-DC converter of example with external ripple voltage feed circuit.
Figure 17 shows the chip embedded DC-DC converters of example with internal ripple voltage feed circuit.
Figure 18 shows the exemplary circuit grade schematic diagram of ramp generator.
Figure 19 shows the exemplary method of manufacture and use DC-DC converter.
Figure 20 shows the exemplary circuit grade signal of the encapsulation of the chip embedded DC-DC converter with isolated topology structure Figure.
Figure 21 A shows the example DC-DC converter in encapsulation with wireless communication system.
Figure 21 B shows the example DC-DC converter in encapsulation with wireless communication system.
Figure 21 C shows the example package including wireless communication system and two DC-DC converters.
Figure 21 D shows the wireless enabling power supply for being configured to communicate with external wireless device.
Figure 21 E shows the example DC-DC converter in encapsulation with wireless communication system.
Figure 22 shows example Internet of Things (IoT) equipment.
Figure 23 A shows the example DC-DC converter system including multiple DC-DC converters.
Figure 23 B shows the example DC-DC converter system including multiple DC-DC converters.
Figure 24 A shows the DC-DC converter with multiple power stages.
Figure 24 B shows the exemplary arrangement of the inductor in DC-DC converter.
Figure 25 shows the example side view of DC-DC converter.
Figure 26 A shows the example block diagram of AC-DC converter.
Figure 26 B shows example A C-DC converter.
Figure 26 C shows example A C-DC converter.
Specific embodiment
DC-DC (DC-DC) converter is a kind of electronic circuit.DC-DC converter can receive under first voltage Input power provides output power under second voltage.The example of DC-DC converter includes boost converter (its output voltage Higher than input voltage), buck converter (its output voltage be lower than input voltage), type of voltage step-up/down converter and various other topology knots Structure.
Some DC-DC converters are influenced by non-ideal component characteristic.These influences may include (such as is welded by component Line) and lead-frame packages (such as quad flat no-leads (QFN) encapsulation, power quad flat no-lead (PQFN) encapsulate, are double Flat no-lead (DFN) encapsulation, micro lead frame frame (MLF) encapsulation etc.) caused by parasitic inductance, parasitic capacitance and/or parasitic electricity Resistance.In addition, the interconnection between DC-DC converter internal component, such as from driver to switch, can also generate parasitic effect It answers.These ghost effects will limit the switching speed and/or efficiency of DC-DC converter.The encapsulation can refer to DC-DC converter grade Encapsulation.The encapsulation can encapsulate the one or more IC for including in DC-DC converter.The encapsulation can be in DC-DC converter Component provide and support and protection, and the encapsulation can be provided for connection to the electric contact of DC-DC converter.In various realities It applies in example, which may include interior positioned at encapsulation and/or be coupled from the outside to the one or more inductors and/or capacitor of encapsulation Device.
The disclosure includes the example of highly integrated solution, wherein DC-DC converter can switch more efficiently, It is switched with higher frequency and/or provides improved performance with reduced encapsulation footprint.It may include and be integrated with perhaps in encapsulation More DC-DC components (such as PDM keyer, driver and/or one or more enhanced GaAs switch (also referred to as increase Strong mode GaAs switch and eGaN FET)) IC chip.Integrated circuit can be embedded in a printed circuit board In, it can also be embedded between printed circuit board.Encapsulation may include the inductor and/or capacitor of vertical design, to reduce The footprint of encapsulation.Certain features can reduce ghost effect, and otherwise these ghost effects can hinder to realize higher switch Speed and/or higher efficiency.By effectively realizing higher switching speed, the size of inductor can reduce.The DC- DC converter can be run at still higher frequencies, provide better mapping, had lower ripple, used less electricity Container, and/or reduce total footprint.
In order to provide introduction, particular aspects, advantage and novel feature have been mentioned.It should be understood that not being institute There are these aspect, advantage and novel features that must all realize in a particular embodiment.Therefore, in unnecessary its other party of realization In the case where face, advantage and novel feature, what one or more aspects, advantage and novel feature also can be achieved on.Also It should be understood that not all aspect, advantage and novel feature all disclose in the introduction.
Example schematic diagram
Fig. 1 shows the exemplary circuit grade schematic diagram of chip embedded DC-DC converter encapsulation 100.The signal illustrates Power input port 101, power supply 103, input capacitor 105, grounding ports 106, ground connection 107, voltage output port 109, Output capacitor 111, integrated circuit (IC) chip 113A, optional integrated IC circuit 113B, driver 117, pulsewidth modulation (PWM) controller 119, the first electric path 121, first switch (for example, the first enhancement type gallium nitride (eGaN) switch) 123, Second electric path 125, second switch (for example, the 2nd eGaN is switched) 127, third electric path 129, inductor 131 and AC Feed-through capacitor 133.Dotted line 135 indicates optionally being individually encapsulated for switch 123,127.Switch 123,127 is also possible to power supply Switch, switching field effect transistor (FET) and/or switching transistor.The schematic diagram also shows current source 137, comparator 139 And fault logic and/or overcurrent protection circuit 141.
Chip embedded DC-DC converter encapsulation 100 can be coupled to power supply 103 by power input port 101, can also To be coupled to ground connection 107 by input capacitor 105.Chip embedded DC-DC converter encapsulation 100 can also include that voltage is defeated Exit port 109, the port 109 can be coupled to ground connection 107 by output capacitor 111.Chip embedded DC-DC converter envelope Filling 100 can also include the ground connection reference port 106 for being coupled to ground connection 107.
Chip embedded DC-DC converter encapsulation 100 can have printed circuit board (PCB), which includes embedded integration Circuit (IC) chip 113A or 113B.IC may include driver 117 and/or pulsewidth modulation (PWM) controller 119.For example, IC is coupled to the grid of the first eGaN switch 123 by the first electric path 121.IC is coupled to second by the second electric path 125 The grid of eGaN switch 127.IC is coupled to the source electrode of the first eGaN switch 123, the 2nd eGaN switch by third electric path 129 127 drain electrode and it is coupled to inductor 131.Inductor 131 may be coupled to voltage output port 109.AC feed-through capacitor 133 can be coupled to the source electrode of the 2nd eGaN switch 127 from the drain electrode of the first eGaN switch 123, and AC signal is shorted to ground connection 107。
Although fig 1 illustrate that a part of driver 117 and PWM controller 119 as IC 113A, but in various implementations In example, IC may include one in PWM controller 119 or driver 117, and in PWM controller 119 and driver 117 Another is individually coupled to IC 113A.It in some embodiments, can be by one or a pair of in eGaN switch 123,127 EGaN switch 123,127 is integrated into IC 113A together with respective electric path 121,125 and/or 129.IC 113A can be with It is semiconductor.IC 113A can be silicon, GaAs, gallium nitride, eGaN or other semiconductors based on III-V material.Cause This, any integrated package can also be by being made with the same or similar material of IC 113A.Switch 123,127, electric path 121, 129,125, driver 117 and PWM controller 119 can also be by being made with the same or similar material of IC 113A.
This can be monolithic eGaN field effect transistor (FET) to switch 123,127.In some embodiments, this is to switch 123,127 individual equipment, including two independent eGaN FET be can be.In some embodiments, switch 123,127 is gold Belong to oxide field-effect transistor (MOSFET).The switch of other quantity or type can be used in other embodiments.Although being permitted More embodiments by switch 123,127 be described as eGaN switch, but other be suitble to materials can also be used to replace eGaN or and its It is used in conjunction with.
In some embodiments, electric path 121,129,125 can be by via hole (such as copper post), trace and/or with low Other electric paths of ghost effect (for example, low parasitic inductance, low dead resistance and/or low parasitic capacitance) are implemented.Bonding wire can With higher ghost effect (for example, higher parasitic inductance, higher dead resistance and/or higher parasitic capacitance).
Port (including power input port 101, grounding ports 106 and voltage output port 109) may be embodied as weld pad, Pin or other electric conductors with low ghost effect (for example, low parasitic inductance, low dead resistance and/or low parasitic capacitance). These ports can be designed to couple with the trace on another equipment (such as mainboard, PCB).
Can there are many variation.In some embodiments, it is convenient to omit feed-through capacitor 133.Some embodiments can have There are different inductors, capacitor, magnet and/or resonance device.Various assemblies shown in the example schematic diagram of Fig. 1 constitute DC-DC converter, but DC-DC converter can have other variations.It will be appreciated that teachings disclosed herein can be extended to it The DC-DC converter that he changes.
For example, DC-DC converter 100 can receive power supply signal from power supply 103 by power input port 101.Electricity Source signal can be filtered by branch input capacitor 105, and it is noisy to filter which can be used as decoupling capacitor Exchange (AC) signal component.Power supply signal is provided to the drain electrode of the first switch 123 of a pair of switches 123,127.
Driver 117 provides the first control to the grid of first switch (for example, eGaN is switched) 123 by electric path 121 Signal processed.Driver also passes through electric path 125 and provides the second control to the grid of second switch (for example, eGaN is switched) 127 Signal.Using control signal, driver can be with alternate conduction and shutdown switch 123,127.Driver can control signal, so that The ON/OFF state of first switch 123 and the ON/OFF state of second switch 127 are opposite.PWM controller 119 is settable Control unlatching/closing duty cycle of signal.PWM controller 119 can also be controlled by being supplied to the pwm signal of driver Pulsewidth or period.
Switch 123,127, IC 113A (e.g., including PWM controller 119 and/or driver 117) and inductor 131 can It is arranged to a part of non-isolation type synchro source converter or power stage.When driver 117 drives the conducting of first switch 123 simultaneously When second switch 127 being driven to turn off, it can be supplied from power supply 103 to accumulator (such as inductor 131 and/or capacitor 111) Electricity, so that the DC output voltage at voltage output port 109 be made to increase.When driver 117 drives first switch 123 to turn off and drives When dynamic second switch 127 is connected, the electric power from accumulator can be leaked by second switch 127 to ground connection 107, lead to voltage DC output voltage at output port 109 reduces.Therefore, can be switched with high-speed switch to 123 this to switch 123,127, to control DC output voltage at voltage output port 109 processed.Inductor 131 and capacitor 111 act also as resonance filter, help to adjust D/C voltage.
Comparator 139 has the first input of the drain electrode for being coupled to second switch 127.Comparator 139, which has, is coupled to the Second input of the source electrode of two switches 127.Therefore, comparator 139 may be coupled to the both ends of second switch 127.In some realities It applies in example, comparator 139 can have the reverse side as the first input.First input of comparator 139 is also may be coupled to Current source 137.I can be used2C and/or PMBUS (have in Fig. 2 and further describe) modifies and/or adjusts current source 137 Export electric current.Therefore, it can be set and/or adjust the overcurrent limit.The output of comparator 139 is provided to fault logic and mistake Current protection (OCP) circuit 141.
Comparator 139 and fault logic and OCP circuit 141 are configured to, and sense drain-source resistance when switch 127 is connected Rds.It will be by RdsVoltage drop on caused switch 127 is compared with reference value, which can be by modifying or adjusting electricity Stream source 137 is adjusted.When overcurrent situations occur, the output of comparator 139 may trip.When detecting overcurrent feelings When condition and entrance fault mode, overcurrent protection circuit 141 can turn off switch 123,127 and/or driver.In various implementations In example, OCP circuit may be directly coupled to the grid of switch 123,127 to turn off switch, and it is logical to be shorted one or more substitution energy Road (not shown) influences the output of PWM controller 119 to release energy to cope with overcurrent situations, and/or influences driver 117 Output is to cope with overcurrent situations.In a failure mode, system can be by being briefly connected switch 123,127 and/or driving Device periodicallys attempt to restore, and attempts detection of excessive current situation, if overcurrent situations still have, turn off switch 123, 127 and/or driver 117, recovery is reattempted after waiting for a period of time.
Sometimes, overcurrent situations can be due to inductance is saturated.If providing too many electric current for a long time to inductor, electricity Sensor (such as inductor 131) can be saturated and lose its magnetism.In this case, the inductance of inductor can reduce by 10%, 30% is even more.Fully saturated inductor can actually play the role of electric wire, generate potential short circuit in circuit. In the saturated condition, the effective resistance of inductor can decline, and cause output electric current to increase above specification, and reach potential uneasiness It is complete horizontal.When inductor no longer operatively storage energy, the LC resonance of circuit also will receive influence, therefore overvoltage can occur And/or under-voltage situation.
Inductor 131 be can choose to bear load current (DC output current) and AC ripple.It is thereby possible to select inductance The saturation current limit of device 131, making it is more than defined DC output current plus maximum AC ripple.For example, as fruit chip is embedded in Formula DC-DC converter generates 10ADC electric current and +/- 5A ripple, then maximum total current is 15A, then inductance saturation limit should surpass Cross 15A.The higher inductor of inductance can have higher saturation limit and size is bigger.
In certain designs, determines the overcurrent protection limit and determine that inductor dimensions can carry out independently of each other, and And one of them or another can carry out surdimensionnement.For example, when second party selection inductor and coupling it to by manufacturing It, will this thing happens when the DC-DC converter of quotient's manufacture.In some cases, second party may be for careful and excessive Inductor is designed, for example, by allowing 5AAC electric current, 10A DC electric current and 100%DC overcurrent, so that the saturation of the inductor The limit is selected as 25A or higher.In some cases, second party may be unaware that the OCP limit, therefore take surdimensionnement, make Inductor is larger on inductance and size, so that inductor is unsaturated.In some cases, secondary user will use lesser originally Inductor, but since the overcurrent protection limit is too high, used size and inductance minimum (greater than necessary size and electricity Sense) inductor.In some cases, manufacturer the overcurrent limit may be arranged too high or too low.It is disclosed herein Some embodiments of DC-DC converter may include the adjustable overcurrent limit.DC-DC converter disclosed herein it is some Embodiment may include overcurrent protection circuit and inductor, wherein and the overcurrent limit is at least determining based on the size of inductor, And the overcurrent limit can be set to be equal to and/or lower than inductor saturation limit value.DC-DC converter disclosed herein Some embodiments may include overcurrent protection circuit and inductor, wherein the size of inductor was based at least partially on electricity The stream limit is selected so that the saturation limit of inductor equals or exceeds the lesser nargin of the overcurrent limit, such as 50% or It is smaller, 40% or smaller, 30% or smaller, 20% or smaller, 10% or smaller, or any value therebetween, or by it is any this The range etc. that any one of a little values limit.Some embodiments of DC-DC converter disclosed herein can have overcurrent The limit, the limit are set smaller than the expection DC electric current that expected maximum AC electric current adds twice, such as 90% or smaller DC Overcurrent, 75% or smaller DC overcurrent, 50% or smaller DC overcurrent, 50% or smaller DC overcurrent, 40% or Smaller DC overcurrent, 30% or smaller DC overcurrent, 20% or smaller DC overcurrent, 10% or smaller DC overcurrent Or any value therebetween, or the range etc. limited by any one of any of these values.In some embodiments, it individually sets Meter person can provide component and selection limit value for OCP circuit, and provide component for inductor and select the saturation of inductor Limiting value.Therefore, in some embodiments, DC-DC converter can be run in the case where inductor is not up to saturated, simultaneously With smaller footprint, lower inductor DC resistance and higher efficiency.
Encapsulation
Fig. 2 shows the package level schematic diagrames of the embodiment of chip embedded DC-DC converter encapsulation 100.Chip insertion The encapsulation of formula DC-DC converter may include input port 101, grounding ports 106 and output port 109.As described in Figure 1, power supply is defeated Inbound port 101 can be coupled to power supply 103 by, for example, the input capacitor 105 of ground connection.Voltage output port 109 can lead to It crosses, such as is coupled to the output capacitor 111 of ground connection 107, provide DC output voltage to the load for being coupled in node 201.It is enabled Port 205 is configured to receive signal, to enable DC-DC converter.Test port 203 can be used for checking the state of equipment.One In a little embodiments, IC bus (I2C) and/or power management bus (PMBUS) is provided to/from chip embedded The communication path of DC-DC converter encapsulation 100.
Encapsulate all components that 100 footprints may include DC-DC converter.In some embodiments, 100 occupy-places are encapsulated Region includes IC 113A or 113B and inductor 131, is run for example, the encapsulation is made to can be used as DC-DC converter, and nothing Need additional external inductance.In some embodiments, at least one of capacitor 105,111 and/or 133 or it is multiple can also In the encapsulation footprint, for example, making the encapsulation can be used as DC-DC converter operation, without additional outside Capacitor.
In some embodiments, I2C and/or PMBUS can be used for receiving I2C and/or PMBUS protocol communication, it is following to execute One or more operation: the chip embedded DC-DC converter encapsulation 100 of on or off changes DC-DC converter encapsulation 100 Low-power or suspend mode, read the current setup information of related DC-DC converter encapsulation 100, read related DC-DC conversion Output voltage (the example provided by DC-DC converter encapsulation 100 is set or changed in the diagnosis and/or technical information of device encapsulation 100 Such as, the digital signal of digital-to-analog controller " DAC " is supplied to by changing, as shown in Figure 16 and Figure 17), ramping hair The characteristic (such as amplitude or frequency) of raw device (for example, ramp generator of Figure 17), the one or more current sources of finishing (for example, The current source of Figure 18) and other function.In some embodiments, PMBUS protocol realization is in I2Interconnection layer on C realization.
Integrated and chip embedded design
Compared with other DC-DC converters, which has high integration, can be at still higher frequencies Switch, and better performance is provided.In certain designs, if ghost effect, ghost effect can prevent DC-DC Converter is effectively run under higher frequency (higher switching speed).Disclosed herein is the designs of some DC-DC converters And other designs that ghost effect is reduced.
Some DC-DC converter encapsulation include bonding wire and/or lead-frame packages.It gives one example, 1mil's, 1mm long Bonding wire can have the dead resistance of the parasitic inductance of 0.7nH, the parasitic capacitance of 0.08pF and 140m Ω.Lead-frame packages (example As quad flat no-leads (QFN) encapsulation, power quad flat no-lead (PQFN) encapsulation, double flat no-leads (DFN) encapsulation, Micro lead frame frame (MLF) etc.) similar or higher ghost effect can be generated.Some implementations of DC-DC converter disclosed herein Example, can limit or avoid the use of bonding wire and/or lead frame, to reduce ghost effect on the whole.Alternatively, Ke Yi Via hole, trace, convex block and/or bump pads are used in encapsulation.
Some DC-DC converter encapsulation do not include inductor or capacitor.This encapsulation allows users to neatly select The particular value of capacitor and inductor is selected, and controls the quality of these components.DC-DC converter encapsulation, inductor and capacitor It can be mounted on mainboard or individual PCB, and bonding wire or long trace by passing through mainboard or independent PCB are coupled (for example, as shown in Figure 7 A).However, external inductance or capacitor are coupled in DC-DC converter encapsulation can generate parasitic effect It answers.Similarly, ghost effect can also occur between inductor and load.Some implementations of DC-DC converter disclosed herein Example can be coupled to by the way that the other assemblies of inductor or capacitor and DC-DC converter are integrated in same encapsulation to reduce The ghost effect of inductor or capacitor.In some embodiments disclosed herein, coupled with inductor or capacitor electrical Access can be realized by via hole and/or trace rather than bonding wire.In some embodiments disclosed herein, with one or more Inductor or the electric path of capacitor coupling may include the via hole and/or trace being located in the PCB of DC-DC converter, and It does not include the trace in mainboard or independent PCB (for example, as illustrated in Figures 3 and 7 B).In some embodiments disclosed herein, PWM controller, driver, inductor, capacitor and/or switch any combination can be included in the same encapsulation.
In some designs, ghost effect may be to generate since component interconnects.For example, for Fig. 1, a collection It is may be coupled to individual electronic building brick 135 at the driver 117 in circuit 113A, which includes switch 123,127. Integrated circuit 113A and individual electronic building brick 135 may include in the pcb.It is electrical logical between driver and switch 123,127 The trace on PCB can be used to realize in road 121,129,125, but the trace on PCB and the electric path phase in integrated circuit Than with relatively high ghost effect.Some embodiments of DC-DC converter disclosed herein can be by that will switch 123,127 and driver 117 and its interconnection be integrated in the same IC 113B reduce driver and switch between mutual connect product Raw ghost effect.In some embodiments disclosed herein, PWM controller, driver and switch are included in same In IC 113B.In some embodiments, one or more capacitors also may be embodied in the same IC 113B.
In certain designs, switch mosfet can be used.However, under higher switching speed, switch mosfet Efficiency may be lower.In some embodiments disclosed herein, switch 123,127 can be eGaN switch.With switch mosfet It compares, eGaN switch can switch more efficient, more quickly.
It should be understood that techniques disclosed herein has synergistic effect.Parasitic capacitance and/or inductive effect can limit DC- The maximum switching speed of DC converter.This may be to influence energy because ghost effect will lead to the unwanted energy of storage Charge and discharge, to influence D/C voltage adjustment.Ghost effect also results in switch conduction or shutdown is slow.In some embodiments, originally The combination of technology disclosed in text can make ghost effect reduce enough degree, to improve the performance of DC-DC converter.It is related The setting of DC-DC converter, size and performance other synergistic effects, can also be discussed in the following section of detailed disclosure.
Compared with some other DC-DC converters, some embodiments disclosed herein eliminate about 40 root bead lines, this can be with Ghost effect is reduced into about 20m Ω, encapsulation leakage inductance (parasitic inductance) can also be reduced 10nH or more.Eliminate these parasitisms Effect helps to realize the advantages of switch (for example, eGaN is switched) at high speed.
The quality factor of power switch can be determined according to equation 1:
FOM=RDS(ON)* QG equation 1
Wherein, FOM is quality factor, RDS(ON)For the conducting resistance of switch, QGFor the gate charge of switch.Gate charge QGMeeting It is influenced by parasitic inductance.Reduce the available lower FOM of parasitic inductance, this is generally difficult to the design realized and improves.
It should also be understood that can only realize part if only simultaneously combined abundant reduction ghost effect with component selection And not all advantage.For example, in some cases, if the certain advantages for reducing ghost effect may nothing using MOSFET Method is realized.Although this is because ghost effect can be reduced to it is enough level to allow switching speed faster, MOSFET's Design may not allow effectively to be switched under faster speed.Equally, in DC-DC converter eGaN switch (or other Faster, usually more expensive switch) full switch potential energy may also be limited by ghost effect.Full switch potential energy may include, Megahertz (MHz) range (such as 1MHz or higher, 3MHz or higher, 4MHz or higher, 5MHz or higher, 7MHz or higher, 10MHz or more high) in more effectively switched with higher frequency.In some cases, it can be achieved that the switch speed of up to 15MHz Rate, and the switching rate except the range of these determinations can be used in certain implementations.
Therefore, limited technical is tested to reduce the engineer of ghost effect, and ghost effect may not be made to be down to and had an impact Level.If switching speed is limited by MOSFET, testing the parasitic engineer for reducing technical combinations possibly can not be obtained Remarkable result.Engineer is when testing eGaN switch, if not recognizing first and solving the parasitic effect in DC-DC converter It answers, then may cannot achieve the switching speed advantage switched using eGaN, especially because eGaN on-off ratio switch mosfet is more It is expensive.In addition, improving switching speed according to its dependent variable, being especially increased to 1,2,3,5,7 or 10MHz or more, biography can be violated System knowledge, i.e. efficiency are often reduced with the raising of switching speed.
The integrated and chip embedded design chapters and sections of detailed disclosure are discussed to reduce ghost effect and/or realize and be opened faster Close the various embodiments of speed.It include all or fewer than these features although some embodiments include the combination of many features Embodiment itself can be still understood.
Physical layout figure
Fig. 3 shows the cross-sectional view 300 of the chip embedded DC-DC converter of example.View 300 includes insulator 301, leads Body (such as metal) 303, convex block or the micro- via hole 305 of weld pad 304, conductor, the first PCB layer 307, conductive coating 309, PCB core 311, trace 313, embedded IC chip 315, the second PCB layer 317, inductor 321 and capacitor 323.
Embedded IC chip 315 can be embedded in PCB core 311.In various embodiments, IC chip 315 it is embeddable In one layer of PCB or between the two or more layers of PCB or between lower PCB and upper PCB.As discussed herein, embedded IC Chip 315 may include that PWM controller, driver and/or one or more switch (for example, eGgaN is switched), as shown in Figure 1.It is embedding Inductor 321 can be coupled to by the trace 313 in multiple via holes 305 and/or DC-DC converter device by entering Formulas I C chip 315 With capacitor 323.
Insulator 301 may include, for example, welding resistance layer, mold, underfill may etc..The layer 307,317 of PCB can be PCB base Plate, laminate, resin, epoxy resin, insulator etc..In diagrammatic view 300 shown in Fig. 3, PCB core 311 can for filler, Laminate, insulated compound mould or substrate etc..Conductor (for example, metal) 303, via hole 305 and trace 313 can be various types of Metal or conductive material, such as copper, aluminium, gold etc..Although the via hole is shown as metallization VIA, some embodiments be can be used Column or other via holes.More or less metal types and layer can be used in various embodiments.
In some embodiments, IC chip 315 can be installed with flip-chip.In various embodiments, IC chip 315 can face upward or downward, and allow the connector in IC chip 315 towards inductor 321 and/or capacitor 323, or remote From inductor 321 and/or capacitor 323.If the connector in IC chip 315 is directed away from inductor 321 and/or capacitor 323 direction, then inductor 321 and/or capacitor 323 can be coupled to IC chip 315 by via hole 305 and/or trace 313 Distal side.
Although Fig. 3 show may include driver and switch single IC chip 315, in some embodiments, switch (such as monolithic eGaN switch) can separate, and can be embedded in chip with chip embedded installation in the pcb with IC chip 315 Driver interconnection in Formulas I C chip 315.Via hole, weld pad and/or trace can couple various assemblies as DC-DC converter, And the two crystal grain can downward or upward.Inductor or other magnets can be placed in top layer or on top layer, and be used Half-bridge scheme creates complete half-bridge combination in buck converter or any other configuration.
Inductor 321 is coupled to by via hole 305 and trace 313 although showing IC chip 315, in some embodiments In, IC chip 315 is coupled to inductor 321 and/or capacitor 323 by via hole 305 or by one of trace 313.Various In embodiment, PCB assembly can have than more or fewer PCB layers shown in Fig. 3, and IC chip 315 is embeddable in single layer PCB In or multi-layer PCB between.In various embodiments, layer 307,317 can be multiple layers of single PCB or the layer of difference PCB.Cruelly The metal 303 for being exposed at the bottom PCB can provide input/output weld pad, for being coupled to input power, ground connection and/or load.
Inductor 321 and/or a part of of capacitor 323 can be stacked in IC chip 315.In some embodiments, Inductor 321 and/or capacitor 323 can be stacked on completely in IC chip 315.Inductor 321 and IC chip 315 are often DC- Biggish component in DC converter package.In some embodiments, in inductor 321 or IC chip 315 lesser one can be with It is stacked in inductor 321 or IC chip 315 in biggish one footprint.Although shown in Fig. 3 including switch and The single IC chip 315 of driver, but in various embodiments, inductor 321 and/or capacitor 323 at least can be partly With the overlapped thereto independently of the single IC chip 315.For example, inductor 321 can be controlled with one or more switch, PWM The overlapping such as device and/or driver.
The position of inductor 321 helps to improve the hot property of DC-DC converter.By the way that inductor 321 is arranged in top Portion, inductor 321 can be cooled down by surrounding air.Overhead inductor 321 also allows the inductor using different size or shapes 321 (for example, inductor 321 is not limited by PCB size).
Fig. 4 A shows the perspective view 400 of the chip embedded DC-DC converter of example with the inductor 321 stacked. Inductor 321 can be stacked on (invisible) top of IC chip, which is embedded in the core between the layer 317 of PCB and layer 307 In 311.Inductor 321 can at least partly be coupled to PCB by hard contact 401.In some embodiments, one or more A capacitor 323 (invisible) may be coupled to PBC layer 317.
Fig. 4 B shows the reversed of the chip embedded DC-DC converter of the example rendering with the inductor 321 stacked Perspective view 425.Inductor 321 can be stacked on (invisible) top of IC chip, which is embedded in the layer 317 and layer of PCB Between 307.Inductor 321 can at least partly be coupled to PCB by metal trace 313.One or more capacitor 323A, 323B can be coupled to PBC layer 317.The one or more capacitor 323A, 323B can also be coupled to inductor by trace 313 321。
In some embodiments, with the increase of switching frequency, inductor be can be made smaller.In addition, some materials and Technology (such as thin film technique) also can reduce the size of inductor.Therefore, in some embodiments, inductor can be embedded in In PCB, such as in the top or side of IC.This set further promotes integrated, and increases other peripheral assemblies (such as Output and input capacitor) amount of available space, such as the space on PCB mounting surface region.
Fig. 4 C shows the side view of the chip embedded DC-DC converter of example of the inductor with embedded stacking 450.First layer 451 can be, such as encapsulated layer or PCB layer.The second layer 453 can be the PCB layer including inductor, the inductance Device is embedded in the second layer 453.Third layer 455 can be the PCB layer including circuit (for example, IC), which is embedded in third In layer.The circuit (for example, IC) may include, such as PWM controller, driver and/or switch (for example, FET switch).4th Layer 457 can be, such as encapsulated layer or PCB layer.In figure 4 c, inductor it is at least partly Chong Die with circuit (for example, IC) or Secundly.Inductor can be coupled by via hole and/or trace with IC, without bonding wire.
Fig. 4 D shows the side view 475 of the chip embedded DC-DC converter of example with embedded-type electric sensor.Layer It 451,453,455 and 457 can be same or like with layer described in Fig. 4 C.In fig. 4d, layer 455 may include circuit (for example, ) and the inductor beside other circuits (for example, IC) IC.IC can be coupled on inductor by trace.Layer 453 may include embedding Enter formula capacitor.In some embodiments, one or more embedded capacitors can be embedded in the pcb, and can pacified Embedded capacitor is filled, so that the footprint of one or more embedded capacitors and circuit (for example, IC) and/or inductor Footprint overlapping.In some embodiments, one or more embedded capacitors can be with flush type circuit (for example, IC) And/or embedded-type electric sensor is included in same layer 455.In some embodiments, capacitor can be mounted on layer 453.? In some embodiments, it is convenient to omit layer 453.In some embodiments, capacitor (for example, capacitor 323 as shown in Figure 3) can To be mounted on outside PCB.There may be many variations.The electricity of any combination including PWM controller, driver and/or switch It road (for example, one or more IC) can be with one of one or more inductors and/or one or more capacitors or two Person is in same layer.IC can be eGaN IC.Monolithic eGaN IC may include PWM controller, driver and one or more Any combination of a switch.In some implementations, one or more capacitors and/or one or more inductors can be with one A or multiple PWM controllers, driver and/or one or more switches are included in an IC (for example, eGaN IC) together. One or more inductors, one or more capacitors or both can be set in being embedded in individual course in the pcb, such as electricity Above or below road (such as IC).In some embodiments, one or more inductors can be positioned at circuit (for example, IC) First side, one or more capacitors can be located at the opposite second side of circuit (for example, IC).In some embodiments, one A or multiple inductors and one or more capacitors can be embedded in the different layers of PCB, but positioned at circuit (for example, IC) The same side.One or both of one or more capacitors and/or one or more inductors can be set outside PCB (as shown in Figure 3).In some implementations, one or more PWM controllers, driver and one or more switches can positions In the different layers of insertion in the pcb.In some embodiments, PWM controller and driver can be located at respective IC (example Such as, eGaN IC) in.The component being embedded in PCB different layers can be oriented so that they are at least partially or fully overlapped, or Person is not overlapped.Any eGaN embodiment disclosed herein also may be embodied as GaN embodiment, and GaN embodiment may include consumption Type GaN, eGaN and/or any combination thereof to the greatest extent.
Fig. 5 shows the perspective view 500 of the chip embedded DC-DC converter of example.Fig. 5 is shown and Fig. 4 A and Fig. 4 B Shown in the identical chip embedded DC-DC converter of example, but do not have inductor 321, capacitor 323 or core 311, to say Other bright shielded components.Via hole 305 can couple trace 313 and/or weld pad 303.
Fig. 6 shows the bottom view 600 of the chip embedded DC-DC converter of example.Fig. 6 show with shown in Fig. 5 The identical chip embedded DC-DC converter of example.303 weld pad of exposing metal between 301 region of insulator be supply voltage, Ground connection and/or voltage output provide electric contact.Show via hole 305.However, in some embodiments, running through exposed metal 303 Via hole it is unobvious visible.
The footprint of reduction
Physical layout and other technologies disclosed herein can be used for reducing the footprint of DC-DC converter.Some In embodiment, footprint can be reduced by about 70%.The component of stacking, using have faster the more small inductor device of switching speed, with And the single package of component can reduce footprint.
As previously mentioned, some DC-DC converter encapsulation do not include inductor or capacitor, some DC-DC converters may Including the inductor being mounted on beside driver, PWM controller and/or IC chip.This class wrapper can allow user flexibility to select The particular value of capacitor and/or inductor, and control the quality of these components.However, component is stacked rather than is arranged side by side, It can reduce the footprint of DC-DC converter.Some embodiments disclosed herein has completely or partially vertical stacks Folded inductor on the ic chip.Some embodiments disclosed herein, which has, is completely or partially vertically stacked on IC chip On capacitor.Stacked inductor and/or capacitor can reduce the footprint of DC-DC converter.The component of stacking can lead to Via hole is electrically coupled (for example, being electrically coupled to IC chip), this can reduce ghost effect as described above.Disclosed herein one A little embodiments, which can provide, facilitates design, so that user does not need selection, setting and installation various components.Single envelope can be used DC-DC converter is filled, without configuring external capacitor or inductor.In addition, inductor can be integrated by some embodiments In encapsulation, without the size of influence inductor, the performance of inductor is nor affected on, and/or does not need customization inductor.
As set forth above, it is possible to reduce ghost effect, and effectively improve the switching speed of DC-DC converter.DC-DC conversion The inductance of device can be determining according to equation 2,
Wherein, L is inductance, VinIt is input voltage, VoIt is output voltage, Δ iL is inductance ripple current, FsIt is switching frequency.It answers Note that inductance reduces with the increase of switching speed.Therefore, ghost effect reduces and one or more switchs (examples faster Such as, eGaN is switched) it can permit DC-DC converter using smaller inductor.In DC-DC converter, inductor is maximum One of component.By reducing the size (for example, a certain ratio for being reduced to its original size) of inductor, can significantly subtract Reduced dimension region.
Some DC-DC converters include multiple encapsulation.For example, it may be possible to have the first encapsulation including driver, for switching Second encapsulation and including inductor third encapsulation.Some embodiments disclosed herein have single package comprising DC-DC The all components of converter, such as PWM controller, driver, switch (for example, eGaN is switched), inductor and capacitor.At this In some embodiments disclosed in text, many components (such as PWM controller, driver and/or switch (for example, eGaN is switched)) can To be integrated into single IC.
Therefore, characteristic related with higher switching speed can also act synergistically with the physical Design of DC-DC converter, So as to reduce the size of DC-DC converter.Lesser DC-DC converter can be used in various applications, higher to provide Current density, be modern electronic equipment (such as microprocessor, field programmable gate array, specific application integrated processor) supply Electricity.Lesser DC-DC converter can be manufactured with lower manufacturing cost.Techniques disclosed herein can reduce plate and encapsulation Ghost effect.Lesser DC-DC converter can have closer connection, to reduce inductor, IC chip and/or bear Ghost effect between load, and DC-DC converter can effectively be run at higher frequencies.Techniques disclosed herein Noise can be reduced, including reduces ripple effect and reduces electromagnetic interference.
In general, the DC-DC converter of larger size can handle a large amount of electric current.In some embodiments, with biography System method is compared, and the specified electric current of the lesser DC-DC converter processing of size can be used in DC-DC converter disclosed herein Amount.For example, the footprints of DC-DC converter disclosed herein are smaller than 20mm2Every Ampere currents is less than 15mm2Every ampere of electricity Stream is less than 10mm2Every Ampere currents is less than 7mm2Every Ampere currents is less than 5mm2Every Ampere currents is less than 4mm2Every ampere of electricity Stream is less than 3mm2Every Ampere currents is less than 2mm2Every Ampere currents is less than 1.5mm2Every Ampere currents is less than 1mm2Every ampere Electric current.The footprints of DC-DC converter can be down to 1.0 or 0.5mm2Every Ampere currents, however can be used in certain implementations Value except the range being discussed herein.
Sample application
DC-DC converter disclosed herein can be used for power electronic equipment.Example includes will be first using DC-DC converter Level power supply voltage is converted to D/C voltage, which is suitable for the electronic equipment powered by supply voltage.For example, being answered certain In, the chip embedded DC-DC converter that present generation power supplies rwan management solution RWAN can be used 40 or more is 40 or more More electronic components power supply, while meeting the specification requirement of size, input/output ripple, efficiency and thermoae limit.It is disclosed herein DC-DC converter can be smaller, and in space and the limited modern system of board size.DC-DC disclosed herein turns Parallel operation can be used for for component (such as memory, server, network, the telecommunications, Internet of Things) power supply in different segment market.Other Using including using DC-DC converter disclosed herein, to (such as the processing in blade server of miniature load point device Device, component of solid condition apparatus etc.) power supply.
Fig. 7 A shows DC-DC converter for storing the example of equipment 700.For example, storage equipment 700 can be, example Such as solid state drive.Store multiple storage chips 705 that equipment 700 may include controller 703 and couple by PCB 701. DC-DC converter 707 can receive supply voltage by power input pin 709, and to storage chip 705 and/or controller 703 DC power supply is provided.DC-DC converter 707 can be coupled to inductor 709 by bonding wire or by the trace 711 of PCB 701. PCB 701 can be the PCB 701 that the encapsulation with DC-DC converter 707 separates.The capacity of equipment 700 is stored by storage chip 705 quantity limitation, there are six storage chips in the realization of Fig. 7 A.
Fig. 7 B shows the example that chip embedded DC-DC converter is applied to storage equipment 750.It is chip embedded DC-DC converter 751 receives supply voltage by power input pin 709, and mentions to storage chip 705 and/or controller 703 For DC power supply.It may include lesser inductor in the encapsulation footprint of chip embedded DC-DC converter 751.Chip is embedding Enter formula DC-DC converter 751, the DC-DC converter 707 that can be substantially less than in Fig. 7 A.Therefore, additional PCB space is available In additional storage chip 753, to improve the memory capacity of storage equipment 750.
Fig. 8 A shows sample application of the DC-DC converter on circuit board 800.Circuit board 800 can be, such as blade Server or mainboard, including multiple power connectors 801 (PWR), voltage adjust management (VRM) circuit 803, multiple arbitrary accesses Memory (RAM) slot 805, multiple peripheral component interconnections high speed (PCIE) slot 813 and rear input/output panel 815.Circuit Plate 800 further includes multiple DC-DC converters 807 positioned at load point.Each DC-DC converter 807 is central processing unit (CPU) 809 or computer chip 811 in one power supply.DC-DC converter 807, which can receive, passes through power connector 801 and/or VRM The electric power that circuit 803 provides, and the voltage of provided electric power is converted to and meets each CPU 809 or computer chip 811 DC power supply specification D/C voltage.
Fig. 8 B shows sample application of the chip embedded DC-DC converter on circuit board 850.Circuit board 850 includes Multiple chip embedded DC-DC converters 851 (for example, in load point).For example, chip embedded DC-DC converter 851 can be with It powers for central processing unit 809 and/or computer chip 811.DC-DC converter 851, which can receive, passes through power connector 801 And/or the electric power that VRM circuit 803 provides, and the voltage of provided electric power is converted to and meets each CPU 809 and/or meter Calculate the D/C voltage of the DC power supply specification of machine core piece 811.Chip embedded DC-DC converter 851 can be less than the DC-DC in Fig. 8 A Converter 807.Therefore, mainboard can accommodate more computer chips 853.The region previously occupied by DC-DC converter 807 It can be the available open area 855 of other assemblies now, can also keep open to improve air-flow.
Other embodiments
In some example embodiments, one or more switches (for example, eGaN is switched) (for example, monolithic or independent switch) It can be used for having in the chip embedded DC-DC synchronous buck converter of inductor, wherein the IC chip of insertion includes PWM control Device and driver processed.Compared with the DC-DC synchronous buck converter based on MOSFET, chip embedded DC-DC converter can be with It, can be in high switching speed (for example, about 5MHz or this paper institute with higher speed switch in the lower situation of switching loss Other speed stated) under more effectively switch, and eGaN switch QGFive times or so may be reduced.
When with identical speed (such as 3MHz) switch, some embodiments realize the raising of efficiency gain, and optional Design is compared, and about 30% power loss is reduced.
In the exemplary embodiment, chip embedded DC-DC converter can be encapsulated in the encapsulation of about 3x3x1.5mm, about It is switched within the scope of 1-5MHz, and about 6A electric current is provided.In contrast, the similar various bonding wire DC-DC converters design of amperage Area be about 12x12mm, switching frequency is about 600kHz.
In the exemplary embodiment, chip embedded DC-DC converter can receive 12V power supply and export about 1.2V and about 10A DC signal.The switching frequency of chip embedded DC-DC converter can about 1MHz, and the inductance including about 300nH.
In some example embodiments, chip embedded DC-DC converter includes 25A buck converter, decompression conversion Device is mountable in the encapsulation of about 6x6mm or 7x7mm.
In some embodiments, chip embedded DC-DC converter includes eGaN switch.The switch can be at about 5MHz Work, the operational efficiency of chip embedded DC-DC converter is close to the DC-DC converter based on MOSFET (with about 1MHz fortune Row).Faster due to the response to transient load, this may make package dimension smaller, and overall system performance is higher.
Exemplary method
Fig. 9 shows the flow chart of the exemplary method 900 for manufacturing and using chip embedded DC-DC converter.
In block 901, integrated circuit can be manufactured.The integrated circuit can be IC chip, including it is following at least one: driving Device, PWM controller and one or more power switches.The IC chip may include following multiple: driver, PWM controller, electricity Source switch, inductor, capacitor or DC-DC converter other assemblies.In some embodiments, one or more power switches It can be eGaN switch, GaAs switch or other kinds of high performance switch.
In block 903, the first part PCB can be formed.Form the first part PCB can include: PCB layer or insulator are provided, covered Mould, etching, drill-through hole, filling via hole, deposition conductive trace and weld pad provide part or all of I2C and/or PMBUS etc..
In block 905, chip embedded technology insertion IC chip can be used.In some embodiments, it is, for example, possible to use Machining or etching technique form cavity (for example, in the pcb), and IC chip can be placed in the cavity.IC core Piece may be coupled to the part the first PCB, inside PCB, on PCB layer, between multiple PCB layers, between multiple PCB, etc..IC chip It can be chip that is face-up or being embedded in down.In some embodiments, IC is embedded in using flip chip technology (fct).IC chip or Crystal grain may be coupled to crystal grain and sticks together or binding material.In some embodiments, other assemblies can also be embedded in the pcb.Example Such as, in the embodiment that one or more switches (such as monolithic eGaN power switch) separate with IC chip, one or more is opened Closing (such as monolithic eGaN switch) can also be embedded in the pcb.
In block 907, the insulator and conducting wiring for PCB second part can be formed.This may include providing additionally PCB layer or insulator, mask, etching, drill-through hole or exposure via hole, filling via hole, deposition conductive trace and weld pad, provide part Or whole I2C and/or PMBUUS etc..In some embodiments, the described movement about block 903,905 and 907 can be same When handle and/or repeat.In block 903,905 and 907, conductor (for example, via hole and trace) can be formed, is turned with coupling DC-DC Component in exchanger unit (for example, as shown in figures 1 and 3).
In block 909, inductor can be coupled.Inductor may be coupled to the top of PCB.Inductor can be at least partly It is stacked with one or more other assemblies (such as IC chip) of DC-DC converter.Inductor can be at least partly It is stacked with one or more other assemblies (such as PWM controller, driver and switch) of DC-DC converter.Some In embodiment, other surfaces component (such as capacitor) can also be coupled.Therefore, the component of chip embedded DC-DC converter It can be coupled.In some embodiments, the overcurrent limit can be based at least partially on to select the inductance of inductor, Such as described in Figure 1.In some embodiments, the saturation limit that the overcurrent limit can be based at least partially on inductor is come true Fixed, adjustment and/or finishing.In some embodiments, inductance and overcurrent limiting value can by individual, designer, design team and/ Or manufacturer is determining and/or designs.
In block 911, chip embedded DC-DC converter can be encapsulated.This may include by chip embedded DC-DC converter It is encapsulated as single discrete assembly.The encapsulation may include inductor and capacitor, allow DC-DC converter in no external electrical It is run in the case where sensor or capacitor.
In block 913, load may be coupled to DC-DC converter.This may include, for example, passing through the mark on independent mainboard Line is by the output coupling of the chip embedded DC-DC converter of encapsulation to electronic equipment.In some embodiments, DC-DC is converted Device can couple near load point, to reduce some ghost effects.
In block 915, power supply can be coupled to the chip embedded DC-DC converter of encapsulation.Therefore, chip embedded DC-DC Converter can use provided electric power and provide DC output voltage, be power electronic equipment.
Although block 911,913 describes encapsulation and uses the chip embedded of the encapsulation with the independent PCB of load equipment DC-DC converter, but in some embodiments, technology described herein can be applied to terminal device PCB.
The chip embedded DC-DC converter of more inductors
Chip embedded DC-DC converter technology as described herein can extend to more inductors and realize.This may include, For example, double down pressure converter, double boost converters and electric pressure converter (with 2,3,4,5,6,8,16 or Any number of inductor).Multiple inductors can be arranged in parallel.The output of multiple inductors (for example, being arranged in parallel) can be with It is coupled to accumulator, such as capacitor or LC resonance circuit.Each inductor may be coupled to corresponding a pair of switches.Respectively Each pair of switch can be driven by respective driver.Each driver can be driven using pwm signal, PWM letter Number with the pwm signal out-phase that is supplied to other drivers.Each pwm signal can have a turn-on time, which is shared The sufficiently small a part in period, in this way, the stack combinations of driving signal have the effective period shorter than the shared period.Some In embodiment, some or all of (for example, shown in Fig. 1) component can be disclosed herein (for example, switch, inductance by replicating The component of device, integrated circuit) form the chip embedded DC-DC converter of more inductors.
Various embodiments disclosed herein can have one in following characteristics, some combinations or whole.More inductance The chip embedded DC-DC converter of device than the chip embedded DC-DC converter of single inductor the speed of service faster, efficiency It is higher.Electric current by DC-DC converter can shunt between multiple inductors.Heat can be sent out on multiple inductors It dissipates.The lesser single sensor of size can be used.Current density can be increased.It can reduce the overall ruler of DC-DC converter It is very little.The on-off times of switch can be reduced.The life expectancy of switch can be extended.The life expectancy of inductor can be improved.It can To use smaller and/or small number of output capacitor.Transient response speed may be faster.When current demand changes When, the fluctuation of output voltage may be smaller.DC-DC converter can run at higher frequencies and/or using lesser Inductor (for example, according to equation 2).It can reduce the size of DC-DC converter.Each pair of switch can be with maximum effective frequency Work, but sum frequency can be greater than the single frequency of any pair of switch.
In some embodiments, it is possible to reduce power loss.Utilize equation P=I2* R, it can be seen that power loss with The increase of DC electric current (I) and increase.However, total power damage can be reduced by the shunt current between multiple inductors Consumption.In addition, the resistance of each inductor can also reduce.For example, passing through shunt current (I between the two inductorsO), P=2* [(IO/ 2) 2*R/2]=[IO 2* R]/2, it can be seen that power loss can reduce half.Therefore, point between multiple inductors Efficiency can be improved in cloth power delivery.With the increase to high current density DC-DC converter demand, the chip of more inductors is embedding Small size, high current density and low-power consumption can be provided by entering formula DC-DC converter.
In some embodiments, lesser inductor can be to institute in the chip embedded DC-DC converter of more inductors The variation of electric current is needed to make faster transient response.For example, as shown in Figure 8 B, chip embedded DC-DC converter can be to CPU DC power supply is provided.CPU may bear very big computational load (for example, using all cores and/or improve its switching frequency) suddenly, Power consumed by causing increases (for example, increasing to 10 amperes from 1 ampere within the scope of ns) suddenly.Since energy is from output Capacitor (for example, output capacitor 111 in Fig. 1, Fig. 2), the voltage at output capacitor both ends may decline too fast, be more than DC power supply specification required by CPU (for example, < 1% voltage declines), may result in shutdown mistake.Therefore, implementable feedback System (for example, as shown in Figure 14, Figure 16 and Figure 17) passes to the power of capacitor by inductor with increase and prevents voltage Drop.However, the variation of high inductance energy resisting power transmitting.It is mostly electric since more inductor systems use lesser inductor The transient feedback response ratio of the chip embedded DC-DC converter of sensor has the DC-DC converter of less, larger inductor Transient feedback response is fast, and the response has lower output voltage drop.DC-DC disclosed herein with higher switching frequency Smaller inductor can be used in converter, and therefore, in embodiment as described herein, single inductor can be quickly to transient state Load responds.
The double down pressure converter of example
Figure 10 is shown to be set using the double inductors of example of the double down pressure converter 1000 of chip embedded DC-DC converter Meter.Double down pressure converter can be used two parallel inductors and replace single inductor.
Figure 10 includes the first inductor 1001, the second inductor 1003 and PCB 1005, which includes that chip is embedding Enter Formulas I C and other assemblies (as shown in Figure 11 A, 11B, 11C and 11D, invisible in Figure 10).The of first inductor 1001 One input node 1007A can correspond to the first weld pad 1007B on PCB 1005.Second input section of the second inductor 1003 Point 1009A corresponds to the second weld pad 1009B on PCB 1005.Voltage output node 1011A corresponds to the electricity on PCB 1005 Pressure output weld pad 1011B.Chart 1013 shows the waveform of signal 1, signal 2 and output signal.
Double down pressure converter can be configured to include two inductors 1001,1003.Two inductors 1001,1003 can paste On PCB 1005.In various embodiments, two inductors 1001,1003 can be two separate inductors placed side by side There are two the single of inductor winding for device, two separate inductors of vertical stacking (one on the other side), or tool Magnetic core.
Signal 1 is supplied to the first input node 1007A.The period of signal 1 is T.Signal 2 is supplied to the second input node 1009A.The period of signal 2 is also T.Signal 1 and 2 is mutually out of phase, and " conducting " time is less than the 50% of cycle T.Output letter It number is composed of signal 1 and signal 2.For each pulse, output signal has " conducting " identical with signal 1 and signal 2 Time.Signal 1 is identical with " conducting " time of signal 2, and the effective period of output signal shortens half (doubling frequency).
Figure 12 shows the exemplary circuit grade schematic diagram of the double down pressure converter including chip embedded DC-DC converter 1200.The schematic diagram includes the second switch of voltage source 1201, the first switch 1203 of first switch pair, first switch pair 1205, the third switch 1207 of second switch pair, the 4th switch 1209 of second switch pair, first the 1211, second electricity of inductor Sensor 1213, output capacitor 1217 and voltage output node 1219.
It can be coupled in outside PCB by the inductor that inductor 1211,1213 forms to 1215.Switch 1203,1205, 1207,1209 it can be used as a part insertion of individual chips or IC chip in the pcb, which includes other assemblies (example Such as driver, PWM controller, other switches).Capacitor 1217 can be coupled in outside PCB or inside PCB.Inductor 1211 Shared general core can be used with 1213, individual core also can be used.
Voltage source 1201 may be coupled to the drain electrode of first switch 1203.The source electrode of first switch 1203 may be coupled to The first node of one inductor 1211.The source electrode of first switch 1203 also may be coupled to the drain electrode of second switch 1205.First The grid of switch 1203 and second switch 1205 may be coupled to driver (not showing in Figure 12).Driver can will be opposite Control signal drive to first switch 1203 and second switch 1205, be alternately conducted and turn off first switch 1203 and second Switch 1205 makes one in first switch 1203 and second switch 1205 to be connected, another shutdown.When first switch 1203 is led Logical, when second switch 1205 turns off, energy can be supplied to inductor 1211 and/or capacitor 1217, energy from voltage source 1201 Amount can store in inductor 1211 and/or capacitor 1217, so as to cause output voltage raising.When first switch 1203 is closed Disconnected, when second switch 1205 is connected, energy can be discharged from inductor 1211 and/or capacitor 1217, be caused under output voltage Drop.
Voltage source 1201 may be coupled to the drain electrode of third switch 1207.The source electrode of third switch 1207 may be coupled to The first node of two inductors 1213.The source electrode of third switch 1207 also may be coupled to the drain electrode of the 4th switch 1209.Third The grid of switch 1207 and the 4th switch 1209 may be coupled to driver (not showing in Figure 12).Therefore, driver can be with Opposite control signal is driven to third switch 1207 and the 4th switch 1209, to be alternately conducted and turn off third switch 1207 and the 4th switch 1209, make one in third switch 1207 and the 4th switch 1209 to be connected, and another is turned off.When The conducting of three switches 1207, when the 4th switch 1209 turns off, energy can be supplied to inductor 1213 and/or electricity from voltage source 1201 Container 1217, energy can store in inductor 1213 and/or capacitor 1217, and output voltage is caused to increase.When third switchs 1207 shutdowns, when the 4th switch 1209 is connected, energy can be discharged from inductor 1213 and/or capacitor 1217, cause to export Voltage decline.
The second node of the second node of first inductor 1211 and the second inductor 1213 may be coupled to output node 1219, also it may be coupled to output capacitor 1217 (also referred to as smoothing capacity device).Voltage at output node 1219 may It is influenced by the energy stored in capacitor 1217.When carrying out the electric current of sufficient power from capacitor 1217 from the second of the first inductor 1211 When the second node of node or the second inductor 1213 flows out, the energy being stored in capacitor 1217 be will increase.Therefore, when opening When offer being provided or being released energy, small signal ripple is provided to capacitor.
A pair of switches 1203,1205 can be driven with second pair of switch 1207,1209 out-phase.Can also with driving the The frequency and period identical frequency and Periodic signal drive a pair of switches 1203,1205 of two pairs of switches 1207,1209.Therefore, exist In some embodiments, at most one in switch 1203,1207 is at the appointed time connected.Four switches 1203,1205,1207, 1209 can be driven by four individual signals, these signals are mutually out of phase.A pair of switches 1203,1205 and the first inductor 1211 and second pair of switch 1207,1209 and the second inductor 1213 DC is provided simultaneously and inhibits function.
Figure 13 A shows the exemplary circuit grade schematic diagram of the DC-DC converter including chip embedded DC-DC converter 1300.Component in Figure 13 A can be same or similar with the component in Figure 12.DC-DC converter in Figure 13 A may include adding Capacitor 1221.When switch 1203 is connected, capacitor 1221 can store energy.In some embodiments, it can store energy Amount, makes capacitor 1221 charge to half of voltage of power supply 1201 or so.When switch 1203 is connected, switch 1207 is turned off, Switch 1205 turns off, and transient current can flow to inductor 1211 by capacitor 1221.When switch 1207 is connected, switch 1209 is closed When disconnected, capacitor 1221 is powered to switch 1207, makes current direction inductor 1213.Capacitor 1221 acts also as 1207 He of switch AC coupling capacitor between switch 1205.Compared with the component in Figure 12, component in Figure 13 also with it is modified arrange into Row setting, but the DC-DC converter in Figure 12 and Figure 13 A can similarly work.Inductor 1211 and 1213 can be used Shared general core, also can be used individual core.
Figure 13 B shows the exemplary circuit grade schematic diagram of the DC-DC converter including chip embedded DC-DC converter 1350.Component in Figure 13 can be same or similar with the component in Figure 12.A pair of switches 1203,1205 and the first inductor 1211 may be coupled to first capacitor device 1217A, and are configured to provide the first output voltage in the first output node 1219A.The Two pairs of switches 1207,1209 and the second inductor 1213 may be coupled to the second capacitor 1217B, and are configured in the second output Node 1219B provides the second output voltage.Output voltage at first and second output node 1219A, 1219B can be identical Voltage, be also possible to different voltage.In some embodiments, driver (for example, as shown in Figure 1, being not shown in Figure 13 B) A pair of switches 1203,1205 and second pair of switch 1207,1209 can be respectively driven so that different node 1219A, 1219B provides different voltage.Shared general core can be used in inductor 1211 and 1213, or can be used individually Core.
Embodiment shown in Figure 13 A and 13B can be implemented on one or more IC crystal grain.For example, in figure 13a, switch 1203, it 1205,1207,1209 can be included in single IC (for example, monolithic eGaN IC).In some embodiments, it switchs 1203, it 1205,1207,1209 can distribute between two or more individual equipment.Embodiment shown in Figure 13 A and 31B It can also be controlled by one or more drivers and/or PWM controller.For example, the first PWM controller may be coupled to the first driving Device, a pair of switches in the first driver driving switch 1203,1205,1207,1209, the second PWM controller can be with coupling It closes to the second driver, second pair of switch in the second driver driving switch 1203,1205,1207,1209.
The example design of chip is embedded in double down pressure converter
Figure 11 A shows the first exemplary arrangement design 1100 of embedded chip in double down pressure converter.The design includes The part IC 1101, the first power switch 1103 of first switch pair, first switch pair second source switch 1105, second switch Pair third power switch 1107 and second switch pair the 4th power switch 1109.
In the embodiment of Figure 11 A, the part IC 1101, the first power switch 1103, second source switch 1105, third electricity Source switch 1107 and the 4th power switch 1109 are included in same IC chip.The part IC 1101 may include PWM controller And driver.Driver is configurable to out of phase drive first switch pair and second switch pair.Driver be configurable to The identical period and identical frequency driving first switch to and second switch pair.It is every that driver is also configured as driven The switch of a switch centering.In some embodiments, the part IC 1101 includes the first driving for being configured to driving first switch pair Device, and it is configured to the second driver of driving second switch pair.PWM controller can provide the first PWM letter to the first driver Number, the second pwm signal is provided to the second driver, and the first and second pwm signals can be mutually out of phase.
Figure 11 B shows the second exemplary arrangement design 1120 of embedded chip in double down pressure converter.The design includes IC chip 1121, the first power switch 1123 of first switch pair, first switch pair second source switch 1125, second switch Pair third power switch 1127 and second switch pair the 4th power switch 1129.
First power switch 1123 and second source switch 1125 can be the first single-chip switching chip (such as monolithic eGaN Switch chip) a part.Third power switch 1127 and the 4th power switch 1129 can be the second single-chip switching chip A part.In some embodiments, the first single-chip switching to and the second single-chip switching to can be one of same monolithic chip Point.In some embodiments, the first single-chip switching to and the second single-chip switching to can be individual monolithic chip.IC chip 1121 and individual monolithic chip can be embedded in the pcb.The part IC 1121 may include PWM controller and driver.Driving Device is configurable to out of phase drive the first single-chip switching pair and the second single-chip switching pair.Driver is configurable to identical Period and identical frequency drive the first single-chip switching to and the second single-chip switching pair.Driver is also configurable to alternately drive Move the switch of each single-chip switching centering.In some embodiments, the part IC 1121 includes being configured to the first single-chip switching of driving Pair the first driver, and be configured to driving the second single-chip switching pair the second driver.PWM controller can be to the first driving Device provides the first pwm signal, provides the second pwm signal to the second driver, and the first and second pwm signals are mutually out of phase.
Figure 11 C shows the third exemplary arrangement design 1140 of embedded chip in double down pressure converter.The design includes 1141 part of IC chip, the first power switch 1143 of first switch pair, first switch pair second source switch 1145, second The third power switch 1147 of switch pair and the 4th power switch 1149 of second switch pair.
IC chip part 1141, the first power switch 1143 and third power switch 1147 can be the one of the first IC chip Part.Second source switch 1145 and the 4th power switch 1149 can be and the first IC chip (such as individual monolithic eGaN Chip) separated chip.In some embodiments, second source switch 1145 and the 4th power switch 1149 can be same list A part of piece chip.One, some or all chips can be embedded in the pcb.The part IC 1141 may include PWM controller And driver.Driver is configurable to out of phase drive first switch pair and second switch pair.Driver be configurable to The identical period and identical frequency driving first switch to and second switch pair.It is every that driver is also configured as driven The switch of a switch centering.In some embodiments, the part IC 1141 includes the first driving for being configured to driving first switch pair Device, and it is configured to the second driver of driving second switch pair.PWM controller can provide the first PWM letter to the first driver Number, the second pwm signal is provided to the second driver, and the first and second pwm signals are mutually out of phase.
Figure 11 D shows the 4th exemplary arrangement design 1160 of the embedded chip in double down pressure converter.The design packet Include IC chip part 1161, the first power switch 1163 of first switch pair, the second source switch 1165 of first switch pair, The third power switch 1167 of two switches pair and the 4th power switch 1169 of second switch pair.
IC chip part 1161, the first power switch 1163, second source switch 1165, third power switch 1167 and Four power switches 1169 can be different a part of IC chip.One, some or all of different IC chip can be embedding Enter in the pcb.The part IC 1161 may include PWM controller and driver.Driver is configurable to out of phase drive first Switch to second switch pair.Driver be configurable to identical period and identical frequency driving first switch to and the Two switches pair.Driver is also configured as the switch of each switch centering of driven.In some embodiments, the part IC 1161 include the second driver for being configured to the first driver of driving first switch pair, and being configured to driving second switch pair. PWM controller can provide the first pwm signal to the first driver, provide the second pwm signal, and first to the second driver It is mutually out of phase with the second pwm signal.
Can carry out various additional settings, so as to by component 1161,1163,1165,1167 and 1169 arbitrarily It is combined into any number of IC chip.In some embodiments, it can be converted by combining the DC-DC of single or multiple inductors The respective of device encapsulates to create the DC-DC converter of more inductors.
Other exemplary characteristics of the chip embedded DC-DC converter of more inductors
In certain chip embedded DC-DC converters, inductor is the largest physical assemblies.And the chip of more inductors The inductor of multiple lesser parallel coupleds can be used in embedded DC-DC converter.Switch can be driven with out-phase, so that more A inductor is by energy out of phase charge and discharge.In some embodiments, the output of the multiple inductors of parallel coupled, so that multiple inductance The frequency of the output ripple of device is higher than the frequency of the output ripple of any single inductor.In some embodiments, parallel coupled The output of multiple inductors, and the output ripple of multiple inductors and the output ripple of single inductor week having the same Phase.
In some embodiments, the output ripple frequency of the DC-DC converter of more inductors can be higher, and can subtract The quantity and/or capacitor of few output capacitor, and smaller output capacitor can be used.
As described above, the system of multiple inductors has higher effective switch speed compared with the system of single inductor Degree.In some embodiments, this can be completed in the case where not increasing the switching speed of switch；On the contrary, multiple switch can be with It works with being mutually out of phase.Therefore, in the case where the switching speed of single switch not being advanced to higher and inefficient, and reach more High effective switching speed.
According to equation 2, because the effective switching speed for the multiple inductors being arranged in parallel is higher, it is possible to reduce more The inductance of a inductor.Therefore, inductor can be arranged in parallel to reduce inductance, and/or can be used with small electric sense compared with Small inductor device.Because lesser inductor can be used, the size of entire DC-DC converter be can reduce, especially when When inductor is the largest component.
In some embodiments, it can produce further synergistic effect using lesser inductor: because of the inductance of switch Load reduces, so the switching speed of switch can increase.This can lead to faster effective switching speed, according to equation 2 into One step reduces inductance, and so on.
In some embodiments, compared with the output capacitor in the DC-DC converter of single inductor, multiple inductors Chip embedded DC-DC converter smaller output capacitor can be used.
The example of chip embedded DC-DC converter with feedback
Figure 14 shows the chip embedded DC-DC converter 1400 of example with external ripple voltage feed circuit.Such as Discussed in this article, chip embedded DC-DC converter 1400 may include embedded IC chip 1403, embedded IC chip 1403 It may include driver and/or modulator.IC chip can be embedded in PCB 1401.Chip embedded DC-DC converter 1400 It further include the first power switch 1405, second source switch 1407 and inductor 1409.Inductor 1409 is schematically illustrated, To show its Inductive component 1411 and its internal direct current resistance (DCR) component 1413.
Chip embedded DC-DC converter 1400 receives input voltage in voltage input node 1415, and in output voltage Node 1417 provides output voltage.Output capacitor 1421 is coupled to output node 1417, it is schematically indicated output capacitance Device, to show its capacitance component 1423 and its equivalent series resistance (ESR) 1425.Feedback path 1427 is coupled to from output node Embedded IC chip 1403.
As previously mentioned, chip embedded DC-DC converter 1400 can receive input voltage, and it can produce output voltage.When When switch conduction and shutdown, output voltage might have small fluctuation or ripple.Ripple voltage (VESR) can be by electric by inductance Flow ILIt is calculated multiplied by ESR.Feedback path 1427 senses ripple and/or DC output voltage.Ripple and/or DC output voltage Feedback instruction is provided to embedded IC chip 1403.Modulator in embedded IC chip 1403 can use feedback control and open 1405,1407 are closed, to reduce output voltage when output voltage is excessively high, output voltage is improved when output voltage is too low.
Current mode control scheme and voltage mode control program can be used in feedback system, to ensure DC-DC in many Operation stability in the different duty cycles.In existing Mode Control scheme, slope compensation scheme can be used, and lead to External module is crossed to realize, these external modules can increase size and cost.II type can be used in current mode control scheme Compensation may have slower loop response to realize loop stability.In voltage mode control program, voltage error It can be amplified, feed back and compensate.
In some embodiments, constant on-time frequency modulation schemes, constant off-time frequency can be used in modulator Rate modulation scheme, pulse width modulating scheme or other schemes.Constant on-time and constant off-time scheme can provide high property The stabilization DC-DC operation of energy.In some embodiments, modulator is preferably able to detection ripple voltage, to trigger certain control things Part.For example, modulator can detecte AC ripple in constant on-time scheme or constant off-time scheme, to produce respectively It is raw that there is constant conduction or the on or off pulse of turn-off time, thus modulating frequency and influencing be sent to switch 1405, The period of 1407 control signal.For example, in constant on-time scheme, can provide the conduction pulses of fixed width to Improve output voltage, in response to detect with the relatively low output voltage of reference voltage, and/or in response to detect enough The inductive current ripple of amount.Therefore, for constant on-time scheme, each pulse is having the same lasting in the on-state Time, and realize modulation (for example, the turn-off time between pulse can become by executing more or fewer pulses every time Change).Constant off-time scheme can be similar to constant on-time scheme described herein, only when shutdown between pulse Between be constant, and can pass through the width of conduction pulses realize modulation.It, can in the example of another voltage mode system With fixed frequency, and the duty ratio of pulse can be modulated.Variation may include forward position or trailing edge modulation scheme.It can be used and appoint What suitable modulation scheme.Therefore, can design and/or select ESR 1425 so that modulator be able to detect that it is sufficiently large VESR。
It is disclosed herein that some embodiments provide the schemes for solving some conflicting design challenges.Non-delayed feedback Path can carry out quick response to the variation of output voltage.Feedback path can be used for certain modulation/control programs, lead Ru constant Logical time or constant off-time scheme, with control switch 1405,1407 when on or off.In order to be provided along feedback path Measurable big VESRSignal (can be reliably detected by modulator), can design and/or select the ESR of capacitor 1421 1425, so that generating sufficiently large ripple.Meanwhile ripple voltage can be preferably minimized.DC-DC converter can ideal real estate Raw pure D/C voltage.In practice, many application permissions generate small ripple in the output of DC-DC converter, but only in very little In range.By certain equipment that DC power supply is powered may need maximum 3% ripple, 2% ripple, 1% ripple, 0.5% Ripple, 0.1% ripple, 0.05% ripple, the ripple of 10mV, the ripple of 5mV, the ripple of 3mV, 1mV ripple, The ripple of 0.5mV, lesser amount of ripple or a small amount of ripples that can not be detected, or limited by any one of these values The ripple of any range, however the value except these ranges can be used in some cases.For example, some load point devices can It can provide that DC power supply provides 1.00V DC output, ripple or variation are no more than 1% (10mV) of 1.00V value.It is non-that ESR can be used Often low capacitor realizes that low ripple exports.But if ripple is too low, modulator possibly can not based on ripple feedback and It works (for example, ripple and noise, possible fluctuation of service etc. may cannot be distinguished in modulator).
The disclosure includes using ripple triggering modulator, low ESR capacitor and providing the DC-DC conversion of low ripple DC output Some embodiments of device.
Example current and ripple figure
Figure 15 shows inductive current ILWith equivalent series resistance voltage VESR(also referred to as ripple voltage) changes over time Exemplary diagram 1500,1550.Line 1501 indicates the electric current I of the inductor 1409 by Figure 14L.Line 1551 indicates Figure 14 node 1417 The output ripple voltage V at placeESR。
When the conducting of switch 1405 and switch 1407 turn off, inductive current ILIncrease.ILIncreased according to following equation:
Wherein, VinIt is input voltage, VoutIt is output voltage, L is inductance, TonIt is the time that switch 1405 is connected, IoIt is initial Electric current.
When switch 1405 turns off, and switch 1407 is connected, inductive current ILReduce.ILReduced according to following equation:
Wherein, VoutIt is output voltage, L is inductance, ToffIt is the time that switch 1405 turns off, IoIt is initial current.3 He of equation 4 be the application version of universal equation formula (V=L (dI/dt)), wherein V is the voltage at inductor both ends, and dI/dt is that electric current is opposite In the change rate of time.
According to equation 3A and 4A, the change rate of electric current can be determined by time-derivative, such as:
VESRWith inductive current ILFluctuation up and down.However, with different conversion rates (for example, different slopes), VESR And ILIncrease and reduces.Rate difference is influenced by the ESR of capacitor 1421.According to equation V=I*RESR, voltage can pass through Inductive current ILIt is determined multiplied by ESR.Therefore,
As shown in Figure 150 0,1550, as electric current ILWhen increasing and reducing, VESRAlso in the same time, but with different conversions Rate (different slopes) increases and reduces.According to equation VESR=IL* ESR, VESRConversion rate it is proportional to ESR and by The influence of ESR.Therefore, for low ESR value, even if ILIt is very big, VESRAmplitude may also very little.For example, inductive current ILFor 3.0A, ripple 50%, therefore its fluctuation range are 1.5A to 4.5A, amplitude 3.0A.If low ESR is 1m Ω, VESRIt can It can be fluctuated in -1.5mV between 1.5mV, this is too small for certain modulators and/or is difficult to reliably use.In addition, when electricity When stream keeps positive value, VESRBetween positive value and negative value alternately.
The low ESR of example, low ripple, chip embedded DC-DC converter
Figure 16 shows the chip embedded DC-DC converter of example with external ripple voltage feed circuit 1600.Figure 16 embodiment may include PCB 1601, driver 1603, the first power switch 1605 (such as eGaN switch), second source Switch 1607 (such as eGaN switch), inductor 1609, output capacitor 1621 and output node 1617.Figure 16 further includes resistance Device 1643, capacitor 1645, AC feed-through capacitor 1647, feedback path 1627, comparator 1629 and with door 1631, single-tap generate electricity Road 1633, inverter 1635, minimum delay counter 1637, resistor 1639 and resistor 1641.
Output capacitor 1621 can be one or more low ESR capacitors.Low ESR effect can also be by parallel multiple Capacitor is realized, to reduce effective parallel connection ESR.For example, the ESR of each capacitor may m Ω range (such as 1m Ω, 10m Ω, 100m Ω) in or in μ Ω range (such as 10 μ Ω, 100 μ Ω) hereinafter, being arranged in parallel capacitor can further reduce Effective parallel connection ESR.Due to low ESR, the ripple voltage at node 1617 may be too small, can not be reliably used for feeding back, but Node 1617 provides low ripple DC output.For example, when using 1m Ω ESR capacitor, it can by the 1.5A ripple of inductor 1.5mV ripple can be only resulted in.Total ESR of one or more output capacitors 1621 can for 1000m Ω, 100m Ω, 10m Ω, 1m Ω, 100 μ Ω, any value therebetween, any range limited by any of these values or smaller ESR, although certain In the case of, the value except these ranges can be used.In some embodiments, the AC voltage of the output voltage of DC-DC converter Ripple can for 3% or smaller, 2% or smaller, 1% or smaller, 0.5% or smaller, 0.1% or smaller, 0.05% or smaller, 10mV or smaller, 5mV or smaller, it 3mV or smaller, 1mV or smaller, 0.5mV or smaller, lesser amount of ripple, can not reliably examine The ripple measured examines the ripple for the small amount not measured, or any range limited by any of these values, although in certain situations Under, the value except these ranges can be used.The low ESR and low ripple value being discussed herein can also be related to other embodiments, example Such as the embodiment of Figure 17.
In order to sense ripple and provide feedback voltage, resistor 1643 can connect with capacitor 1645, resistor 1643 with The tandem compound of capacitor 1645 can be parallel to the both ends of inductor 1609.Capacitor 1645 blocks DC signal.AC signal, such as line Wave still can be sensed.Capacitor 1645 and resistor 1643 constitute the divider of AC signal, and the ripple sensed can be worn It crosses AC feed-through capacitor 1647 and reaches feedback path 1627.The value of resistor 1643 and capacitor 1645 can be set, thus full Sufficient equation 5:
Wherein, L is the inductance value of inductor 1609, DCRLIt is the D.C. resistance (" DCR ") of inductor 1609, RxIt is resistor 1643 resistance, CxIt is the capacitor of capacitor 1645.It is, therefore, possible to provide circuit, independently of the mensurable ground of ESR value and reliably Ground senses inductive current ripple.
Resistor 1639 and 1641 can organize voltage divider, be coupled to output node 1617.The divider can be to output Voltage output at node 1617 is divided.In some embodiments, since the ESR of output capacitor 1621 is lower, output Ripple at node 1617 may very little, be difficult to detect, in noise threshold, or for modulating and unreliable.Therefore, should Divider primarily serves the effect of DC divider.
Feedback path 1627 is coupled to divider to receive D/C voltage, and is also coupled to AC shunt capacitance 1647 to sense Ripple voltage.Feedback path is additionally coupled to comparator 1629, and is compared with reference voltage.Reference voltage can be by reference voltage Generator (being not shown, such as band gap generator, crystal, digital analog converter (" DAC "), battery etc.) provides.In some embodiments In, reference voltage is provided using DAC, and digital signal can be provided to DAC required reference voltage is arranged.
Comparator 1629 can generate comparator output signal based on feedback signal with the comparison of reference voltage.With constant For turn-on time modulator, when feedback signal is lower than reference voltage, comparator 1629 can produce high output signal.
The output of comparator 1629 can be supplied to single-shot trigger circuit 1633, which generates constant on-time Pwm signal, the signal can be supplied to driver 1603.The output of single-shot trigger circuit 1633 can also be supplied to inverter 1635, minimum turn-off delay circuit 1637 and with door 1631, to prevent pwm signal to be continuously height.
The configuration of resistor 1643, capacitor 1645 and AC feed-through capacitor 1647 can lead to detect it is significant, can survey The ripple of amount, and it is injected into feedback path 1627, although the ESR of capacitor 1621 is lower and output ripple is lower.Therefore, it examines The ripple measured can be greater than output ripple.The AC ripple of injection feedback path 1627 can indicate are as follows:
Wherein, VcxIt is the ripple voltage on capacitor 1645, ILIt is the peak-to-peak current ripple of inductor, RxIt is resistor 1643 Resistance, CxIt is the capacitor of capacitor 1645.
In some embodiments, PCB 1601 and its internal component can be encapsulated, user can provide and/or configure electricity Road, the circuit include inductor 1609, resistor 1643, capacitor 1645, capacitor 1621, capacitor 1645, AC bypass electricity Container 1647, resistor 1639 and resistor 1641.In such embodiments, inductor can be selected and adjusted according to equation 6 1609, the value of resistor 1643 and/or capacitor.For example, if it is some applications (for example, with different inductance and/or DCR) change inductor 1609, user can solve equation 6, then select, obtain and change resistor 1643 and/or Capacitor 1645, to correspond to the new L and DCR of inductor 1609LValue.
In some embodiments, some or all of components shown in Figure 16 may include in a single package.In some realities It applies in example, includes at one by some but not all in resistance 1643, capacitor 1645 and inductor 1609 according to equation 6 It will limit the ability of tuning circuit in encapsulation.For example, if contain resistor 1643 and capacitor 1645 in encapsulation, but it is final User has selected inductor 1609, then will limit end user and can only use has specific L and DCRLThe particular inductor of value, with Meet equation 6.In this system and any tuning improperly system, inappropriate inductor 1609 is selected to will lead to system Unstable and/or break down, this may damage the component that power is received from DC-DC converter.In some cases, it is therefore desirable to Properly tune DC-DC converter, and provide as the single package equipment for not needing end user's modification.It is public herein The some embodiments opened may include the inductor 1609, resistor 1643 and capacitor 1645 as single package.
The DC-DC converter of the low ESR of example, low ripple
Figure 17 shows the example DC-DC converters 1700 with internal ripple voltage feed circuit (in some embodiments In can be chip embedded DC-DC converter).Chip embedded DC-DC converter 1700 includes 1701, driver of encapsulation 1703, the first power switch 1705, second source switch 1707 and inductor 1709, can be similar to it is as described herein other Embodiment.DC-DC converter 1700 can receive input voltage in voltage input node 1715, and can be in output voltage node 1717 Output voltage is provided.Output capacitor 1721 is (for example, low ESR output capacitor or multiple shunt capacitances with low parallel connection ESR Device) it may be coupled to output node 1717.Feedback path 1727 can be coupled to comparator 1729 from output node.Comparator is defeated May be coupled to out with door 1731 and single-shot trigger circuit 1733, pwm signal is supplied to driver 1703.Ramp generator 1751 Can be with simulaed inductance ripple current (for example, electric current 1501 in simulation drawing 15), and the voltage of output ripple electric current indicates (example Such as, 1551 in Figure 15).In some embodiments, the output of ramp generator 1751 can at signal combiner 1753 with Reference voltage combination (for example, be added or subtract each other).It in some embodiments, can by the inductance ripple signal that ramp generator exports To increase to feedback signal, rather than subtracted from reference voltage.What comparator 1729 can export ramp generator 1751 Ripple signal and reference voltage are compared.Comparison result can be used for feedback loop, with drive system (such as switch 1705 and/ Or 1707).
Inductor 1709 may include in the encapsulation of chip embedded DC-DC converter, such as Fig. 1, Fig. 3, Fig. 4 A and Fig. 4 B institute Show.Low ESR output capacitor 1721 can be coupled to output node 1717.At least one output capacitor 1721 can have low ESR (for example, value and range of the embodiment being similar in Figure 16 discussed in this article).For example, ESR can be in m Ω range (such as 1m Ω, 10m Ω, 100m Ω) in, or it is smaller, in μ Ω range (such as 10 μ Ω, 100 μ Ω), being arranged in parallel capacitor can be into one Step reduces effective parallel connection ESR.Output voltage can have low AC ripple or without AC ripple (for example, being similar to discussed in this article Value and range in Figure 16) so that low ripple needed for DC-DC converter can satisfy certain equipment exports specification.However, this The possible very little of the low AC ripple of sample, it is difficult to it detects, in noise threshold, is not present, or unreliable for modulation purpose (for example, Since the ESR of output capacitor 1721 is lower), and be difficult to be used for the AC ripple to modulate purpose.By feedback path 1727, DC output voltage is provided on feedback path 1727 (for example, together with any small (but can not reliable measurements) AC ripple or complete There is no AC ripple entirely).
Ramp generator 1751 is independently of capacitor 1721 and/or its ESR simulated inductor ripple.It is retouched referring to Figure 18 Example ramp generator is stated.The input of ramp generator may include input voltage, output voltage, switching signal and inductance Value.The output of ramp generator 1751 can be combined with reference voltage, for being compared with the voltage on feedback path 1727, or Person's ramp generator 1751 output can with the combinations of voltages on feedback path 1727, for being compared with reference voltage.Example Such as, Voltage Reference can be provided by DAC.DAC can generate voltage output based on numeral input.Therefore, it can be adjusted with little increment DAC voltage.For example, the output voltage of 9 DAC is adjustable, increment 5mV.DAC can be used for being arranged and/or adjusting DC-DC converter Output voltage.Other examples of Voltage Reference include crystal, bandgap reference, battery etc., and any one of them may not open With.The reference voltage for being combined with the inductor ripple of simulation can be supplied to the input of comparator 1729, as shown in figure 17.
Ramp generator 1751 may include in a package.Ramp generator 1751 can be together with driver 1703 and other Component is included in together in chip embedded IC.Inductor also may be embodied in encapsulation.It, can before encapsulation is supplied to user Ramp generator 1751 is tuned and configured for the particular inductor 1709 selected in encapsulation.It selects to have with user is allowed The design of the inductor of different characteristics is different, and the designer of the inductor 1709 of encapsulation is selected to be known that value and the spy of inductor Property, allow designer to extract and/or determine the conversion rate of inductor 1709, and use the duplication conversion speed of ramp generator 1751 Rate.In some embodiments, system is without using (for example, at inductor) practical ripple signal in feedback loop, but makes Ripple signal (for example, being present at inductor) is simulated with ramp generator.Ramp generator 1751 can be according to input Voltage Vin、VoutValue, inductor inductance value L (when inductor be integrated into DC-DC converter encapsulation in when, which can be Know value) and switching signal SW determine the ripple signal of simulation.Switching signal can indicate one or two in switch 1705,1707 One or two of a state and/or switch 1705,1707 change the time of state (for example, HS and LS signal).Due to Ramp generator knows inductance, outputs and inputs voltage and the timing of switch, therefore it can determine reality in analog circuit The simulation ripple signal of ripple signal (for example, ripple at inductor).Simulate ripple can with the ripple in inductor at than Example.Simulating ripple can be changed with slope (for example, with identical rate) identical with the slope of ripple change in inductor.Tool There is the simulation ripple in the system of low ESR capacitor 1721 simulation can may scheme when without using low ESR capacitor 1421 The ripple occurred at 14 node 1417.
It can produce the inductance ripple signal accurately reflected by the ripple of inductor 1709.By using ramp generator Inductance ripple signal is generated, for sensed/detected AC ripple, smallest capacitor ESR is non-required.Therefore, output electricity Pressure can be with lesser AC ripple or without the cleaner DC signal of AC ripple.
In some embodiments, comparator is by the output of DC-DC converter and reference signal and the inductance ripple of simulation Combination is compared.For example, in constant on-time modulation scheme, when the output signal on feedback path 1727 is lower than reference When the value that voltage is combined with the inductance ripple of simulation, comparator can export high RST.High RST can be by being supplied to list with door Constant on-time pwm pulse is supplied to driver 1703 by trigger circuit, the circuit, the driver driving switch 1705 conducting It is turned off with switch 1707.By ensuring periodically shutdown and the switch 1707 periodically conducting of switch 1705, it is coupled to inverse with door Becoming device 1735 and minimum turn-off time delay circuit 1737 can prevent single-shot trigger circuit 1733 from excessively continually triggering.It can be used Various other ways come realize based on comparator 1729 output driving switch.
Although the operation of circuit is described for constant on-time modulation scheme in Figure 16 and Figure 17, Ying Li Solution, teaching herein and is openly applicable to any voltage mode modulation scheme, such as circuit is appropriately modified (for example, Minimum turn-off time delay is changed into minimum turn on time delay, carry out certain comparisons and/or can be with reverse signal etc.) perseverance Determine turn-off time scheme.In addition, teaching herein and openly could be applicable to current-mode modulation scheme or voltage modulated scheme.
Figure 18 shows the exemplary circuit grade schematic diagram of ramp generator 1800.Ramp generator 1800 may include the first electricity Stream source 1801, the second current source 1803, capacitor 1805, ramp voltage output node 1807, first switch 1809, second switch 1811, controller 1813 and resistor 1815A, 1815B are modified.Modifying controller 1813 and/or current source 1801,1803 can be with It is coupled to I2C and/or PMBUS, to receive finishing and/or adjustment order.
Ramp generator can be configured to be generated according to following equation and export:
Wherein, Vramp-ONAnd Vramp-OFFIt is that (output is the inductance of ramp generator 1751 in Figure 17 to turn-on and turn-off voltage respectively The output of device ripple), k can be constant fixed factor, VinIt is input voltage (for example, being provided at node 1715 in Figure 17 Voltage), VoutIt is output voltage (for example, the voltage provided at node 1717 in Figure 17), wherein k is with the every volt of ampere Specially for the numerical value of unit measurement, CrampIt is the capacitor of capacitor 1805, tonIt is that DC-DC converter is powered to inductor (for example, working as Switch 1809 be closed, switch 1811 disconnection when) time quantum, toffIt is that DC-DC converter (is not opened to inductor power supply for example, working as Close 1809 disconnect, switch 1811 closure when) time quantum, VoFor starting voltage.Ripple voltage conversion rate is (also referred to as " tiltedly Rate ", unit are volt/second) by time cycle (ton, toff) coefficient that is multiplied with lower equation indicates:
Only equation 7 and equation 8 do not illustrate how the value of setting k to simulate voltage relevant to inductance ripple, are somebody's turn to do Voltage should depend on the inductance of inductor 1709.If ramp generator is configured to the conversion rate in Modified equation 3C, Equation 7B and equation 3C can be set to equal, wherein CrampIt is equal to Cx, and select resistance ReqTo replace RESR, So that:
Hence, it can be determined that the value of k, and when the capacitor of capacitor 1805, the resistance and inductance of resistor 1815A, 1815B When the inductance of device 1709 is fixed, the value of k will be a constant.In addition, the relationship between k and inductance is shown as inverse relation.Such as The inductance of inductor 1709 known to fruit, then can determine steady state value k.Therefore, the inductance of inductor 1709 can be measured, and can To modify and/or configure ramp generator.
First current source 1801 can be voltage controlled current source 1801.The output of voltage controlled current source 1801 at least portion Divide ground can be by VinVoltage and k control.In some embodiments, the output of voltage controlled current source can be by VinVoltage is controlled multiplied by k System.Therefore, when L increases, and k reduces, when L reduces, electricity can be modified with trim current source 1801 to reduce output electric current Stream source 1801 is to increase output electric current.Current source 1801 is coupled to first switch 1809 and is grounded.
Second current source 1803 can be voltage controlled current source 1803.The output of voltage controlled current source 1803 at least portion Divide ground can be by VoutVoltage and k control.In some embodiments, the output of voltage controlled current source can be by VoutVoltage comes multiplied by k Control.Therefore, can be with trim current source 1803 to reduce output electric current, and when L reduces when L increases, and k reduces, it can be with Trim current source 1803 is to increase output electric current.Current source 1803 is coupled to second switch 1811 and is grounded.
Finishing controller 1813 is coupled to current source 1801,1803.Finishing controller 1813 is configured at least partly ground In the inductance of inductor 1709 (including the respective or effective parallel inductor in various more inductor configurations) come adjust and/ Or the output of setting current source 1801,1803.In some embodiments, finishing controller 1813 can be configured at least partly ground It adjusts and/or sets in the resistance of the inductance of inductor 1709, the capacitor of capacitor 1805 and/or resistor 1815A, 1815B Set the output of current source 1801,1803.In some embodiments, Cramp*ReqValue can be set to steady state value, inductor 1709 Inductance be provided to finishing controller 1813.
First switch signal (for example, signal identical with the signal HS of switch 1705 being supplied in Figure 17) is provided to First switch 1809.Second signal (for example, signal identical with the signal LS of switch 1707 being supplied in Figure 17) can provide To second switch 1811.First and second switches 1809,1811 can be smaller than the power switch 1705,1707 in Figure 17.
One end of capacitor 1805 can be coupled between first switch 1809 and second switch 1811.Capacitor 1805 The other end can be grounded.
When the closure of first switch 1809 and the disconnection of second switch 1811, the first current source 1801 is configured to generate by voltage k*VinThe electric current of control charges to capacitor 1805, so that the voltage at node 1807 generates according to equation 7A and such as equation Oblique ascension described in formula 7B.
When first switch 1809 disconnects, and second switch 1811 is closed, the second current source 1803 is configured to generate by voltage k*VoutThe electric current of control draws electric current from capacitor 1805, so that the voltage of node 1807 is reduced according to equation 8A, is formed Negative voltage oblique ascension as described in equation 8B.
When electric current is flowed out from capacitor 1805, the voltage at capacitor both ends is reduced.Therefore, ramp generator can simulate The inductance ripple of simulation, and provide independently of output capacitance and/or the voltage available signal of ESR.
Therefore, even if when directly electricity reliably cannot be measured from low ESR capacitor using low ESR capacitor 1721 When embossing wave, the increase and reduced voltage that ramp generator exports at node 1807 can also be simulated by inductor 1709 Ripple, with by the ripple of inductor 1709 it is identical and/or proportional.By providing inductor 1709,1805 and of capacitor Resistor 1815A, 1815B, can determine these values, and can correspondingly DC-DC shown in configuration diagram 17 and Figure 18 turn Parallel operation.
It is different from the solution of user configuration external module is needed, the chip embedded DC-DC of encapsulation shown in Figure 18 Converter may include self-contained tuning feedback system.Therefore, user does not need design of feedback system, calculates inductance, DCR, electricity Ratio between resistance and capacitor.In addition, feedback and/or modulation component are integrated into encapsulation compared with using external feedback component And/or space can be saved in one or more IC in encapsulation.
Production and using low ESR, low ripple, chip embedded DC-DC converter exemplary method
Figure 19 show manufacture and use low ESR, low ripple, chip embedded DC-DC converter exemplary method.It should DC-DC is configurable under the first input voltage receive power in input node, different from the first input voltage second In output node output power under output voltage.
As described herein, in block 1901, IC chip can be embedded in the pcb.IC chip may include following part or All: driver, switch, ramp generator and modulation circuit, for example, as shown in Fig. 1, Fig. 3, Figure 14, Figure 16 and Figure 17.One In a little embodiments, multiple IC chips can be embedded in the pcb, for example, as shown in Figure 11 B to Figure 11 D.
In block 1903, one or more inductors can be coupled to IC chip and feedback path, for example, such as Fig. 1, Fig. 3, Shown in Figure 14, Figure 16 and Figure 17.The one or more inductor and feedback path can be coupled to output node.In some realities It applies in example, for example, multiple inductors can be coupled in more than one in inductor arrangement as described in Figure 10 to Figure 13.Inductor can To be configured to receive power, and it can be a part of the lc circuit device of storage energy.LC device may include one or Multiple capacitors, the capacitor can be low ESR capacitor.Effective low ESR can be provided by being arranged in parallel capacitor.One or The both ends of multiple capacitors can form the second output voltage.Block 1903 may include the electricity for measuring one or more inductors Sense.
In block 1905, ramp generator may include.Ramp generator may include in integrated circuits, and as integrated A part of circuit may include in the pcb as a part of different integrated circuits, or is included in DC-DC converter and seals In dress.About Figure 17 and Figure 18, example ramp generator is described.Ramp generator may include the first current source, the second electricity Stream source and the capacitor being coupled between the first current source and the second current source.
In block 1907, ramp generator is configurable to the ripple that inductor is passed through in simulation.This may include at least partly First or second current source is modified based on the value of inductor in ground.The value of inductor can be measured, with determination value for trimming. Ripple can be generated independently of the ESR of output capacitor and/or output capacitor.First input voltage, the second output voltage, electricity The inductance and switching signal of sensor can be supplied to ramp generator.Current source can be switched on and off according to switching signal.Switch Signal is provided to and/or results from one or more power switches in DC-DC converter.
In block 1909, it is possible to provide feedback signal, reference signal and ripple voltage are used for signal modulation.Feedback signal can be DC output signal (for example, without or with seldom AC ripple).In some cases, the AC ripple in DC output signal is insufficient To be reliably used for modulating.Reference signal can be required DC output signal, can be by crystal, bandgap reference, DAC, battery Deng generation.Ripple voltage can be exported by ramp generator.Feedback signal, reference signal and ripple voltage, which can be supplied to, to be compared Device.
In block 1911, feedback signal, reference signal and ripple voltage can be based at least partially on to modulate and drive one A or multiple switch.Modulation scheme can be, such as voltage mode modulation scheme, such as when constant on-time or constant shutdown Between scheme.Feedback signal can be compared with reference signal.This relatively in can also include ripple voltage.Modulator can be with It is based at least partially on this and compares generation control signal, such as pulse, with the one or more switches of driving.
In block 1913, the output signal of modulation can be provided by DC-DC converter.
Other details
Principles described herein and advantage can be realized in various devices.In addition, chip embedded DC-DC converter It can be used in various devices, for improving performance, chip embedded DC-DC converter is run by specification, and cost is relatively low, can reduce The overall price of these devices.The example of such device may include but be not limited to, the portion of consumption electronic product, consumption electronic product Part, electronic test equipment etc..The example of the component of consumption electronic product may include, clock circuit, analog-digital converter, amplifier, Rectifier, programmable filter, attenuator, frequency changer circuit etc..The example of electronic equipment can also include storage chip, storage mould Block, fiber optic network or other communication network circuits, cellular communication infrastructure (such as base station, radar system), disc driver electricity Road.Consumption electronic product can include but is not limited to, and wireless device, mobile phone (such as smart phone), wearable computing are set Standby (such as smartwatch or earphone), medical monitoring equipment, in-vehicle electronic system, phone, TV, computer monitoring equipment, electricity Brain, handheld computer, tablet computer, laptop, personal digital assistant (PDA), micro-wave oven, refrigerator, stereophonic sound system, boxlike Recorder or player, CD Player, digital video recorder (DVR), VCR, MP3 player, radio, are taken the photograph DVD player Camera, camera, digital camera, portable storage chip, washing machine, dryer, washing/drying machine, duplicator, fax Machine, scanner, multi-function peripheral, wrist-watch, clock etc..In addition, the apparatus may include uncompleted products.
Be distinctly claimed unless the context otherwise, otherwise in entire disclosure and claims, "comprising", " containing ", The words such as " comprising " are interpreted as inclusiveness meaning, rather than exclusive or exhaustive meaning；That is, " including but Be not limited to " meaning.As conventionally used herein, word " coupling " or " connection " refer to that two or more elements can To be directly connected to, can also be connected by one or more intermediary elements.In addition, " this paper " for using in this application, " on Text ", " hereafter " and the word with similar meaning, should refer to entire application, rather than any specific part of the application.Upper and lower In the case that text allows, plural number or odd number can also be respectively included using the word of singular or plural in detailed description.Word "or" refers to the list of two or more projects, it is intended to cover all explained below of the word: any project in list, column Any combination of project in all items and list in table.Word "and/or" is also intended to all following solutions for covering the word It releases: any combination of project in any project in list, all items in list and list.As this paper is conventionally used , term "based" includes to the explained below of the term: being based only upon or is based at least partially on.All numerical value provided herein The similar value being intended to include in measurement error.
In addition, conditional statement used herein, for example, " can with ", "available", " possibility ", " perhaps ", " such as ", " lift Example ", " such as ", unless otherwise specified, or another Rational Solutions within a context when in use, it is typically aimed at expression, Mou Xieshi Applying example includes, and other embodiments do not include certain features, element and/or state.
Above-mentioned various features and process can use independently of one another, can also be applied in combination in various ways.All possibility Combination and sub-portfolio be intended to and fall within the scope of the disclosure.In addition, can be omitted certain methods or mistake in certain implementations Journey block.Methods and processes described herein is also not necessarily limited to any specific sequence, and associated block or state can be by It is executed according to other sequences appropriate.For example, described block or state can be according to the sequences in addition to specifically disclosed sequence It executes or multiple pieces or state can be combined into a block or state.Sample block or state can with it is serial, parallel or other Mode executes.Block or state can be added in disclosed example embodiment or remove from disclosed example embodiment. Examples described herein system and component can be configured in mode different in a manner of described.For example, with disclosed Example embodiment compare, can add, remove or reconfigure element.
The introduction of embodiment presented herein can be applied to other systems, be not necessarily above system.Above-mentioned various implementations The element and effect of example can combine, to provide other embodiments.
Although some embodiments have been described, but these embodiments are only presented in exemplary fashion, it is no intended to be limited The scope of the present disclosure.In fact, new method as described herein and system can be embodied in the form of various other.In addition, not disobeying In the case where carrying on the back disclosure spirit, various omissions, substitutions and changes can be carried out to the form of methods described herein and system.Accompanying Claim and its equivalent be intended to cover fall into the form or modification of disclosure scope and spirit.
Other embodiments
Following list has example embodiment within the scope of this disclosure.Listed example embodiment should not be construed as limiting The scope of the present disclosure.The various features of listed example embodiment can be removed, add or combine, to form other embodiments, this A little embodiments are a part of this disclosure:
1. a kind of DC-DC (DC-DC) power adapter, comprising:
Part lower printed circuit board (PCB) with bottom side and top side；
Part upper printed circuit board (PCB) with bottom side and top side；
Flush type circuit, between the top side of the lower part PCB and the bottom side of the upper part PCB, which includes:
Pulse width modulator；And
At least one switch；
One or more via holes extend through the part PCB；
Inductor, above the top side of the upper part PCB, wherein one or more via holes and the inductor and flush type circuit It is electrically coupled.
2. the DC-DC power source conversion device of embodiment 1, wherein flush type circuit includes integrated circuit (IC).
3. the DC-DC power source conversion device of embodiment 2, wherein the footprint of inductor is at least partly accounted for integrated circuit The overlapping of position region.
4. any one DC-DC power source conversion device in embodiment 1 to 3, wherein do not welded between inductor and flush type circuit Line is electrically connected.
5. any one DC-DC power source conversion device in embodiment 1 to 4, wherein the switching rate of circuit is at least 1MHz.
6. any one DC-DC power source conversion device in embodiment 1 to 4, wherein the switching rate of circuit is at least 3MHz.
7. any one DC-DC power source conversion device in embodiment 1 to 4, wherein the switching rate of circuit is at least 5MHz.
8. any one DC-DC power source conversion device in embodiment 1 to 7, wherein the switching rate of circuit is up to 7MHz.
9. any one DC-DC power source conversion device in embodiment 1 to 8, wherein at least one switch includes enhancement type gallium nitride Field effect transistor (eGaN FET).
10. any one DC-DC power source conversion device in embodiment 1 to 9 further includes one or more is arranged in the upper part PCB Top side above capacitor.
It further include that the top side of the lower part PCB and upper is set 11. any one DC-DC power source conversion device in embodiment 1 to 10 Core between the bottom side of the part PCB, wherein the core has one or more grooves, the flush type circuit be arranged at this or In multiple grooves.
12. any one of embodiment 1 to 11 DC-DC power source conversion device, wherein DC-DC power source conversion device, which has, to be less than 25mm2Footprint.
13. the DC-DC power source conversion device of any one of embodiment 1 to 11, wherein the occupy-place area of DC-DC power source conversion device Domain is less than 10mm2。
14. the DC-DC power source conversion device of any one of embodiment 1 to 11, wherein the occupy-place area of DC-DC power source conversion device Domain is less than 5mm2。
15. the DC-DC power source conversion device of any one of embodiment 1 to 14, wherein the occupy-place area of DC-DC power source conversion device Domain as low as 2mm2。
16. the DC-DC power source conversion device of any one of embodiment 1 to 15, wherein the occupy-place area of DC-DC power source conversion device Domain is 0.5-10mm2Every Ampere currents.
17. a kind of DC-DC (DC-DC) power adapter encapsulation, comprising:
Integrated circuit (IC) chip, is embedded in an at least printed circuit board (PCB), which includes driver；
Inductor positioned at chip embedded package outside and is coupled to chip embedded package surface；And
Inductor and IC chip are electrically coupled by via hole；
Wherein, the footprint of inductor is at least partly Chong Die with the footprint of IC chip.
18. the DC-DC power source conversion device of embodiment 17, wherein transistor is embedded at least one PCB, and inductor with Transistor is electrically coupled.
19. the DC-DC power source conversion device of any one of embodiment 17 to 18, wherein IC chip includes:
It is coupled to pulsewidth modulation (PWM) controller of driver；And
It is coupled to the switching transistor of driver output.
20. the DC-DC power source conversion device of any one of embodiment 17 to 19 further includes switch, which includes enhanced Gallium nitride (eGaN).
21. the DC-DC power source conversion device of any one of embodiment 17 to 20, wherein the switchgear distribution is with 4MHz or more Fast speed switch.
22. the DC-DC power source conversion device of any one of embodiment 17 to 20, wherein the switchgear distribution is with 5MHz or more Fast speed switch.
23. the DC-DC power source conversion device of any one of embodiment 17 to 19 further includes switch, which includes silicon or arsenic Change at least one of gallium.
24. a kind of DC-DC (DC-DC) power adapter in a single package, comprising:
Enhancement type gallium nitride (eGaN) component, is at least partially embedded in the inside of installation base plate；
Inductor is mounted on outside installation base plate；And
Via hole couples inductor with eGaN component；
Wherein, the footprint of inductor is at least partly Chong Die with the footprint of eGaN component.
25. the DC-DC power source conversion device of embodiment 24, wherein installation base plate is multi-layer PCB.
26. the DC-DC power source conversion device of any one of embodiment 24 to 25, wherein eGaN component is opening comprising eGaN It closes, which further includes the driving circuit for being configured to drive the switch.
27. the DC-DC power source conversion device of any one of embodiment 24 to 26, wherein driver is IC chip with switch A part.
28. the DC-DC power source conversion device of any one of embodiment 24 to 27, wherein IC chip further includes pulsewidth modulation (PWM) controller.
29. a kind of DC-DC (DC-DC) power adapter using chip embedded encapsulation, the DC-DC converter include:
Internal enhancement type gallium nitride (eGaN) switch of printed circuit board (PCB)；
Pulsewidth modulation (PWM) controller；
The driver being embedded in inside PCB, wherein PWM controller and driver are configured to drive with 1MHz or higher frequency EGaN switch；
Positioned at chip embedded encapsulation outside and be coupled to the inductor of PCB surface；And
Inductor and eGaN are switched into the via hole being electrically coupled.
30. the DC-DC power source conversion device of embodiment 29, wherein driver is configured to 5MHz or higher frequency driving eGaN Switch.
31. a kind of DC-DC (DC-DC) power adapter, comprising:
Printed circuit board；And
Integrated circuit is located at printed circuit intralamellar part, which includes driver.
32. the DC-DC power source conversion device of embodiment 31, further includes inductor, the inductor is by extend through printed circuit board One or more via holes be electrically coupled to integrated circuit.
33. the DC-DC power source conversion device of embodiment 32, wherein the inductor have at least partly with the occupy-place area of integrated circuit The footprint of domain overlapping.
34. a kind of DC-DC (DC-DC) power adapter, comprising:
Integrated circuit, including driver；And
Inductor is vertically stacked on above integrated circuit so that the footprint of inductor at least partly with integrated circuit Footprint overlapping, wherein inductor is electrically coupled with integrated circuit.
35. the DC-DC converter of embodiment 34 further includes printed circuit board (PCB), there is the first side and opposite with the first side Second side, wherein integrated circuit is mounted on the first side of PCB, and wherein, inductor is mounted on second side of PCB.
36. the DC-DC converter of embodiment 35, wherein one or more mistakes of the inductor by extend through printed circuit board Hole is electrically coupled to integrated circuit.
37. a kind of DC-DC (DC-DC) buck converter, comprising:
One or more switch；
It is configured to the driver for driving the one or more to switch；And
The inductor being electrically coupled with the switch；
Wherein, the footprint of the DC-DC buck converter is less than 65mm2；
Wherein, which is configured to receive at least 20 amperes of electric current；And
Wherein, which is configured as output at least 20 amperes of electric current.
38. a kind of DC-DC ((DC-DC)) power adapter, comprising:
One or more switch；
Driver is configured to that the one or more is driven to switch with the frequency of 1-5MHz (including 1 and 5MHz)；And
The inductor being electrically coupled is switched with the one or more；
Wherein, the footprint of the DC-DC converter is less than or equal to 10mm2；
Wherein, which is configured to receive at least 5 amperes of electric current；
Wherein, which is configured as output at least 5 amperes of electric current.
39. a kind of DC-DC (DC-DC) power adapter, comprising:
It is coupled to the first switch of the first inductor；
It is coupled to the second switch of the second inductor；And
The IC chip of insertion in the printed circuit boards；
Wherein, first switch and the second switch is coupled to modulator；And
Wherein, the first inductor and the second inductor are coupled to voltage output node.
40. DC-DC (DC-DC) power adapter of embodiment 39, wherein modulator is included in IC chip.
41. DC-DC (DC-DC) power adapter of any one of embodiment 39 to 40, wherein modulator is configured to Make first switch and the second switch with the output of phase of operation synchronizing cycle.
42. DC-DC (DC-DC) power adapter of any one of embodiment 39 to 41, wherein in output node Output signal is the superposition of the first signal by the first inductor and the second signal by the second inductor.
43. a kind of DC-DC (DC-DC) power adapter, comprising:
The IC chip being embedded in printed circuit board, which includes driver；
It is coupled to the first switch of driver；
It is coupled to the inductor of first switch；And
Feedback path from output node to modulation circuit.
44. DC-DC (DC-DC) power adapter of embodiment 43, wherein modulation circuit is voltage mode modulation circuit.
45. DC-DC (DC-DC) power adapter of any one of embodiment 43 to 44, wherein modulation circuit is permanent Determine turn-on time or constant off-time modulation circuit.
46. DC-DC (DC-DC) power adapter of any one of embodiment 43 to 45, wherein modulation circuit includes In IC chip.
47. the DC-DC power converter of any one of embodiment 43 to 46, wherein modulation circuit and inductor with IC chip includes in a package.
48. a kind of DC-DC (DC-DC) power adapter, comprising:
The IC chip of insertion in the printed circuit boards, which includes driver；
It is coupled to the first switch of driver；
It is coupled to the inductor of first switch；
Feedback path from output node to modulation circuit；And
Ramp generator.
49. DC-DC (DC-DC) power adapter of embodiment 48, wherein the output coupling of feedback path and ramp generator Close comparator.
50. DC-DC (DC-DC) power adapter of embodiment 49, further includes the reference voltage source for being coupled to comparator.
51. dc-dc (DC-DC) power adapter of any one of embodiment 48 to 50, wherein ramp generator It is configured to the ripple current that inductor is passed through in simulation.
52. dc-dc (DC-DC) power adapter of any one of embodiment 48 to 51, wherein ramp generator Include:
First current source；
Second current source；And
Capacitor.
53. DC-DC (DC-DC) power adapter of embodiment 52, wherein the first current source and the second current source are configured to The inductance for being based at least partially on inductor is modified.
54. DC-DC (DC-DC) power adapter of any one of embodiment 48 to 53, wherein ramp generator and Inductor is included in the encapsulation of same DC-DC power source conversion device.
55. DC-DC (DC-DC) power adapter of any one of embodiment 48 to 54, wherein ramp generator is matched It is set to generation output signal, which is not influenced by the output capacitor for being coupled to inductor.
56. DC-DC (DC-DC) power adapter of any one of embodiment 48 to 55, wherein ramp generator is matched It is set to generation output signal, equivalent series resistance (ESR) of the output signal independently of the output capacitor for being coupled to inductor.
57. DC-DC (DC-DC) power adapter of any one of embodiment 48 to 56, further includes output capacitor, There is the output capacitor sufficiently low ESR can not be reliably provided to so that the ripple voltage at output capacitor both ends is too small Modulation circuit.
58. a kind of ramp generator, comprising:
It is coupled to the first current source of supply voltage；
Second current source of ground connection；And
The capacitor being coupled between the first current source and the second current source.
59. the ramp generator of embodiment 58, wherein ramp generator is configured to simulation by the inductance in DC-DC converter The ripple current of device.
60. the ramp generator of any one of embodiment 58 to 59, wherein the output of the first current source at least partly ground In the input voltage of DC-DC converter.
61. the ramp generator of any one of embodiment 58 to 60, wherein the output of the first current source at least partly ground The inductance of inductor in DC-DC converter.
62. the ramp generator of any one of embodiment 58 to 61, wherein the output of the second current source at least partly ground The inductance of inductor in DC-DC converter.
63. the ramp generator of any one of embodiment 58 to 62, wherein the output of the second current source at least partly ground The inductance of inductor in DC-DC converter.
64. the ramp generator of any one of embodiment 58 to 63, wherein the first current source is configured at least partly ground The inductance of inductor is modified in DC-DC converter.
65. the ramp generator of any one of embodiment 58 to 64, wherein the second current source is configured at least partly ground The inductance of inductor is modified in DC-DC converter.
66. a kind of method for manufacturing chip embedded DC-to-dc converter, comprising:
In the printed circuit boards by IC chip insertion；
First inductor is coupled to printed circuit board；And
Second inductor is coupled to printed circuit board, the first inductor and the second inductor are coupled to output node.
67. a kind of method that first DC voltage is converted to the second DC voltage, comprising:
The first switch of the first inductor is coupled in driving；
The second switch of the second inductor is coupled in driving, wherein first switch and the second switch is coupled to output node；And
First switch and second switch are modulated to out-phase；
Wherein, at least one of driver or modulator are included in and are embedded in the chip of printed circuit board.
68. a kind of method for manufacturing chip embedded DC-to-dc converter, comprising:
In the printed circuit boards by IC chip insertion；
Inductor is coupled between IC chip and output node；And
There is provided the feedback path from output node to modulation circuit, wherein modulation circuit includes ramp generator.
69. the method for embodiment 68, wherein modulation circuit includes in the printed circuit boards.
70. the method for any one of embodiment 68 to 69, wherein when modulation circuit is constant on-time or constant shutdown Between modulation circuit.
71. the method for any one of embodiment 68 to 70, wherein ramp generator includes in integrated circuits.
72. the method for any one of embodiment 68 to 71, further includes:
It is based at least partially on the characteristic of inductor, ramping generator.
73. the method for any one of embodiment 68 to 72, wherein ramp generator is any one in embodiment 58 to 65 A ramp generator.
74. a kind of method using DC-to-dc converter, comprising:
Input power is received in input node；
It is powered by switch to inductor；
It stores energy in output capacitor, forms output voltage at the both ends of output capacitor；
Output power is provided to output node under output voltage；
Output voltage is provided to modulation circuit；
Generate the ripple voltage independently of output capacitor；
Ripple voltage is provided to modulation circuit；
It is based at least partially on the output modulation switch of modulation circuit.
75. the method for embodiment 74 further includes comparison or less at least two: ripple voltage, reference voltage and output voltage.
76. the method for any one of embodiment 74 to 75 further includes the inductance for being based at least partially on inductor, finishing electricity Stream source.
77. the method for any one of embodiment 74 to 76, wherein ripple voltage is generated by ramp generator, slope hair Raw device is configured to the electric current that inductor is passed through in simulation.
78. a kind of DC-DC (DC-DC) power adapter encapsulation, comprising:
Integrated circuit (IC) chip, is embedded in an at least printed circuit board (PCB), which includes driver；
Inductor positioned at chip embedded package outside and is coupled to the surface of chip embedded encapsulation；And
Overcurrent protection circuit is configured to detect when that the electric current for being supplied to inductor oversteps the extreme limit.
79. DC-DC (DC-DC) power adapter of embodiment 78 encapsulates, in which:
Overcurrent protection circuit includes current source, which is configured to be based at least partially on IC bus or power supply pipe Bus line command is managed, is adjusted or modifies；
The pulsactor of inductor oversteps the extreme limit, but is more than less than 50%；
The limit is more than maximum prescribed DC electric current specification plus maximum AC ripple specification, but is more than less than 50%.
80. a kind of DC-DC (DC-DC) power adapter encapsulation, comprising:
Integrated circuit (IC) chip, is embedded in an at least printed circuit board (PCB), which includes driver；
Inductor positioned at chip embedded package outside and is coupled to the surface of chip embedded encapsulation；And
IC bus or power management bus.
81. DC-DC (DC-DC) power adapter of embodiment 80 encapsulates, in which:
IC bus or power management bus are coupled at least one current source, and are configured to provide for protocol command, to adjust Whole or trim current source.
82. dc-dc (DC-DC) power adapter of any one of embodiment 80 to 81 encapsulates, in which:
IC bus or power management bus are coupled at least one current source, and are configured to provide for protocol command, to set Set or adjust the reference value for being supplied to comparator.
83. DC to DC (DC-DC) power adapter of any one of embodiment 80 to 82 encapsulates, wherein integrated electricity Road bus or power management bus configuration are transportation protocol, which includes executing at least one of following instruction:
The encapsulation of on or off DC-DC power source conversion device changes the low-power or suspend mode of the encapsulation of DC-DC power source conversion device, The current setup information in relation to the encapsulation of DC-DC power source conversion device is read, the diagnosis in relation to the encapsulation of DC-DC power source conversion device is read And/or technical information, the output voltage provided by the encapsulation of DC-DC power source conversion device is provided.
84. DC to DC (DC-DC) power adapter of any one of embodiment 80 to 83 encapsulates, wherein power supply pipe Managing protocol realization is the interconnection layer on IC bus realization.
85. a kind of DC-DC (DC-DC) power adapter, comprising:
Part lower printed circuit board (PCB) with bottom side and top side；
Part upper printed circuit board (PCB) with bottom side and top side；
The embedded IC being embedded between the bottom side of the part PCB and the top side of the part lower PCB, wherein this is embedded Integrated circuit includes:
Pulsewidth modulation (PWM) controller, is configured to generate one or more pwm signals；
Driver is configured to be based at least partially on one or more one or more driving signals of pwm signals generation, the driving Device is coupled to PWM controller in embedded IC；
First power switch is configured to receive at least one of one or more driving signals, and the first power switch is being embedded in It is coupled to driver in formula integrated circuit；And
Second source switch is configured to receive at least one of one or more driving signals, and second source switch is being embedded in It is coupled to driver in formula integrated circuit；
At least one via hole extends through the part PCB；
Inductor, above the top side of the upper part PCB, wherein inductor passes through at least one via hole and the first and second electricity Source switch is electrically coupled, and wherein the footprint of inductor is at least partly Chong Die with the footprint of embedded IC；
It is coupled to the input port of at least one of first and second power switches, which is configured in input voltage Lower reception input signal；
It is coupled to the output port of inductor, which is configured to, and provides under the output voltage for being different from input voltage Output signal, wherein the output voltage is based at least partially on the first and second power switches, makes inductor charge and discharge energy；With And feedback system, comprising:
It is coupled to the feedback path of output port, which is configured to provide for the instruction of output voltage；And
Ramp generator is configured to generate simulation by the signal of the current ripples of inductor；
Wherein, which is configured to be based at least partially on the letter that the output voltage of feedback path and ramp generator provide Number instruction, provide feedback signal, and be based at least partially on the feedback signal, drive the first and second power switches.
86. the DC-DC power source conversion device of embodiment 85, wherein ramp generator is configured to generate the electricity that inductor is passed through in simulation Ripple signal is flowed, is at least partly used:
Indicate the first input of input voltage；
Indicate the second input of output voltage；
Indicate the third input of the inductance value of inductor；And
4th input of switching signal.
87. the DC-DC power source conversion device of embodiment 85, wherein ramp generator includes:
First current source is configured to be based at least partially on input voltage generation electric current；
Second current source is configured to be based at least partially on output voltage generation electric current；
Third switch is configured to receive at least one of one or more driving signals, and third switch is coupled to the first electric current Source；
4th switch is configured to receive at least one of one or more driving signals, and the 4th switch is coupled to the second electric current Source；
And
It is coupled to the capacitor of third switch and the 4th switch.
88. the DC-DC power source conversion device of embodiment 85, wherein the first and second power switches are enhancement type gallium nitride (eGaN) Field effect transistor.
89. the DC-DC power source conversion device of embodiment 85, wherein PWM controller is configured to make driver at least frequency of 4MHz Switches.
90. the DC-DC power source conversion device of embodiment 85, wherein DC-DC power source conversion device is configured to the processing magnitude of current, also, The footprint of DC-DC power source conversion device is 1.0mm2-10mm2Every Ampere currents amount.
91. the DC-DC power source conversion device of embodiment 85, wherein one footprint in inductor and integrated circuit is complete In another footprint in inductor and integrated circuit.
92. the DC-DC power source conversion device of embodiment 85, wherein input port, output port and grounding ports are exposed to inductor The outside of the encapsulation of surrounding, wherein input port is coupled to the first power switch, is not necessarily to bonding wire, and output port is coupled to inductance Device is not necessarily to bonding wire, and second source switch ground connection is not necessarily to bonding wire, and inductor is coupled to the first and second power switches, without weldering Line.
93. the DC-DC power source conversion device of embodiment 85, further includes the second inductor for being coupled to PCB, the second inductor is also coupled To output node, wherein the first inductor and the second inductor are driven with being mutually out of phase.
94. the DC-DC power source conversion device of embodiment 85, wherein embedded IC includes ramp generator.
95. a kind of DC-DC (DC-DC) power adapter, comprising:
Printed circuit board (PCB)；
Insertion flush type circuit in the pcb, wherein flush type circuit includes:
Pulsewidth modulation (PWM) controller, is configured to generate one or more pwm signals；And
Driver is configured to be based at least partially on one or more one or more driving signals of pwm signals generation, the driving Device is coupled to PWM controller in flush type circuit；
First power switch is configured to receive at least one of one or more driving signals, and first power switch is embedding Enter in formula circuit and is coupled to driver；And
Second source switch, is configured to receive at least one of one or more driving signals, which switchs embedding Enter in formula circuit and is coupled to driver；
At least one via hole extends through a part of PCB；
Inductor, positioned at PCB outside and be coupled to the top of printed circuit board, wherein inductor passes through at least one via hole Be electrically coupled to the first and second power switches, and wherein, the footprint of inductor at least partly with flush type circuit Footprint overlapping；
Input port is coupled at least one of first and second power switches, which is configured in input voltage Lower reception input signal；And
Output port is coupled to inductor, which is configured to provide under the output voltage for being different from input voltage defeated Signal out；
Wherein, which is configured to the processing magnitude of current, and wherein, the occupy-place area of the DC-DC power source conversion device Domain is 1.0mm2-10mm2Every Ampere currents amount.
96. the DC-DC power source conversion device of embodiment 95, further includes:
Output capacitor is coupled to inductor and is coupled to output port, which has low ESR (ESR), wherein the voltage ripple in output voltage is 2% or smaller；And
Feedback system, including ramp generator, which, which is configured to generate, simulates the current ripples for passing through inductor Voltage ripple.
97. the DC-DC power source conversion device of embodiment 95, wherein the first power switch and second source switch be enhanced nitridation Gallium (eGaN) field effect transistor.
98. the DC-DC power source conversion device of embodiment 95, wherein input port is configured to receive at least 20 amperes of electric current, output Port is configured to provide at least 20 amperes of electric current, and the footprint of DC-DC power source conversion device is less than 65mm2。
99. the DC-DC power source conversion device of embodiment 95, wherein inductor and flush type circuit are connected with each other, and are not necessarily to bonding wire.
100. the DC-DC power source conversion device of embodiment 95, wherein flush type circuit includes integrated circuit, which includes PWM controller, driver, the first power switch and second source switch.
101. a kind of DC-DC (DC-DC) power adapter, comprising:
Printed circuit board (PCB)；
Insertion flush type circuit in the pcb, wherein flush type circuit includes:
Pulsewidth modulation (PWM) controller, is configured to generate one or more pwm signals；And
Driver is configured to be based at least partially on one or more one or more driving signals of pwm signals generation, the driving Device is coupled to PWM controller in flush type circuit；
First enhancement type gallium nitride field effect transistor (eGaN FET), is configured to receive in one or more driving signals extremely One few, the first eGaN FET is coupled to driver in flush type circuit；And
2nd eGaN FET is configured to receive at least one of one or more driving signals, and the 2nd eGaN FET is embedding Enter in formula circuit and is coupled to driver；
At least one via hole extends through a part of PCB；And
Inductor, positioned at PCB outside and be coupled to the top of PCB, wherein inductor is electrically coupled to by least one via hole First and second eGaN FET, and wherein, the footprint of inductor at least partly with the footprint of flush type circuit Overlapping.
102. the DC-DC power source conversion device of embodiment 101, wherein PWM controller is configured to the frequency for making driver with 4-10MHz The first and second eGaN of rate switch FET.
103. the DC-DC power source conversion device of embodiment 101, wherein DC-DC power source conversion device is configured to the processing magnitude of current, also, The footprint of DC-DC power source conversion device is 1.0mm2-10mm2Every Ampere currents amount.
104. the DC-DC power source conversion device of embodiment 101, wherein flush type circuit includes ramp generator, the ramp generator It is configured to generate simulation by the signal of the current ripples of inductor.
Exemplary insulation topological structure
Figure 20 shows the exemplary circuit grade of the encapsulation of the chip embedded DC-DC converter with isolated topology structure 2000 Schematic diagram.Signal shows power supply 103, AC ground connection 2003, DC ground connection 2001, output capacitor 111, integrated circuit (IC) core Piece 113A, optional IC 113B, driver 117, pulsewidth modulation (PWM) controller 119, first switch are (for example, first is enhanced Gallium nitride ((eGaN) switch) 123, second switch (for example, the 2nd eGaN is switched) 127, capacitor 2005 and 2007, diode D1 and D2 and inductor L4.The schematic diagram also shows isolation circuit 2009 comprising the first inductor L1, the second inductor L2 and third inductor L3.It is brilliant that switch 123,127 is alternatively referred to as power switch, switching field effect transistor (FET) and/or switch Body pipe.In some cases, input capacitor 105 (being not shown in Figure 20) can be used, be similar to Fig. 1.
Circuit in Figure 20 can be similar to circuit shown in Fig. 1 or any electricity in other embodiments disclosed herein Road works.The difference between the circuit in circuit and Fig. 1 in Figure 20 is that the configuration in Figure 20 is isolated topology knot Structure, including isolation circuit 2009 (for example, isolated half-bridge configuration).Voltage output port 109 can be electrically isolated with power supply 103, so that Between the two without direct conductive path.On the contrary, inductor L1, L2 and L3 can pass through in this way inductor L1 with electromagnetic coupling Electric current (for example, variable-current) can produce magnetic field and magnetic field be applied on inductor L2 and L3, to flow a current through Inductor L4 (for example, variable-current).It can make accumulation on the pole plate of capacitor 111 by the electric current of inductor L4, from And voltage is formed at 111 both ends of capacitor.Diode D1 and D2 can be used for making one direction of current direction.In some embodiments In, diode D1 and D2 can be substituted with switch (for example, MOSFETs), to obtain higher efficiency, or with other electronic equipments Replace diode D1 and D2.
Although the isolated topology structure in Figure 20 includes magnetic-coupled inductor L1, L2 and L3 in isolation circuit 2009 (the number of turns is respectively Np、Ns1And Ns2), but other embodiments may include other configurations and other kinds of isolation circuit topology knot Structure, such as flyback, positive excitation converter, pair transistor normal shock, LLC resonance converter, recommend, full-bridge, mixing, PWM harmonic conversion Device or other designs.Other arrangements disclosed herein, such as arranged shown in Figure 12, Figure 13 A and Figure 13 B, it can also modify To use isolated topology structure.In some embodiments, two inductors can be used for isolation circuit 2009.Although showing Two examples of optional integrated circuit 113A and 113B, but other modifications may include any amount of integrated circuit, and this is integrated Circuit includes any combination of element shown in integrated circuit 113B.
Example DC-DC converter with wireless communication system
Figure 21 A shows the example DC-DC converter 2101 in encapsulation 2105 with wireless communication system 2103.DC-DC Converter 2101 can be any DC-DC converter described herein.DC-DC converter 2101 can be configured to receive input electricity Press VinAnd provide output voltage Vout。
Wireless communication system 2103 can be included in same encapsulation with DC-DC converter 2101, or be wrapped in some cases It is contained in individually encapsulation.Wireless communication system 2103 can be, for example, Wi-Fi system, Bluetooth system, radio frequency system etc..Nothing Line communication system may include (not shown) antenna, oscillator, driver, controller, firmware, processor, buffer, digital-to-analogue turn Parallel operation etc..Wireless communication system can also include wire communication input/output interface (being shown as Comm I/O), which can be with Other equipment are connected to, such as CPU (for example, as shown in figure 22), allowing CPU, system 2103 sends and connects by wireless communication Receive wireless signal.
Wireless communication system 2103 can also with or optionally comprising with the communication path of DC-DC converter 2101 (for example, aobvious It is shown as PWR control line (PWR CTRL)), to control the power parameter of DC-DC converter.In some embodiments, it wirelessly communicates System 2103 can be coupled to DC-DC converter by PMBUS.Therefore, DC-DC converter 2101, which can respond, passes through channel radio Letter system 2103 (for example, passing through Wi-Fi, bluetooth, broadband or other kinds of wireless signal) received wireless instructions, such as lead Logical, shutdown, into sleep pattern, resetting, remove failure, change or setting output voltage, control or limitation output electric current, enter Different operation modes etc..DC-DC converter 2101 can also wirelessly report or broadcast related DC-DC converter health status Information, such as telemetering, input voltage, output voltage, input current, output electric current, temperature etc..
In some cases, wireless communication system 2103 can be included in same encapsulation 2105 with DC-DC converter 2101 In, it also may be embodied in individually encapsulation.Wireless communication system 2130 is powered by DC-DC converter 2101, is received by DC-DC The output voltage V that converter 2101 generatesout.It inputs and provides more for example, DC-DC converter is configurable to 120 volts of DC of reception It is suitable for 10 volts of DC output of certain electronic equipments, wireless communication system is configurable to using 10 from DC-DC converter Lie prostrate DC output.In some embodiments, by the way that wireless communication system 2103 and DC-DC converter 2101 are included in same encapsulation In 2105, it is possible to reduce the gross area that these components occupy.
Figure 21 B shows the example DC-DC converter 2101 in encapsulation 2105 with wireless communication system 2103.The DC- DC converter is configurable to receive input voltage VinAnd provide output voltage Vout.Wireless communication system can also be by input electricity Press VinPower supply.
Wireless communication system can be by input voltage VinPower supply.For example, DC-DC converter 2101 can be configured to receive 10 volts it is defeated Enter and 25 volts of outputs are provided.Wireless communication system 2103 can also be powered by this 10 volts inputs.Wireless communication system 2103 can It is interacted with other equipment described in DC-DC converter 2101 and/or Figure 21 A and (does not show PWR CTRL and Comm in Figure 21 B again I/O line).
Figure 21 C shows the example package including wireless communication system 2103 and two DC-DC converters 2101,2102 2105.First DC-DC converter 2101 can be configured to receive input voltage VinAnd provide the first output voltage Vout1.2nd DC- DC converter 2012 can be configured to receive input voltage VinAnd provide the second output voltage Vout2.First and second output voltages can With difference.Wireless communication module 2103 is configured to be powered by the second DC-DC converter 2102.
For example, the first DC-DC converter 2101 can be configured to receive 60 volts of inputs and provide 120 volts of outputs.2nd DC-DC Converter 2102 can be configured to receive 60 volts of inputs and provide 5 volts of outputs.Wireless communication system 2103 can be by coming from the second DC-DC 5 volts of outputs of converter 2102 are powered.Wireless communication system 2103 can be with two DC-DC converters 2101,2102 and/or figure The interaction of other equipment described in 21A (not showing PWR CTRL and Comm I/O line in Figure 21 C again).
Figure 21 D shows the example embodiment of the power supply 2101 with integrated wireless communications system 2103.Power supply 2101 can To be DC-DC converter, AC-DC converter, linear model power supply or the electricity of switched-mode power supply or any other suitable type Source.Isolated topology structure or non-isolated topological structure can be used in power supply 2101, and high voltage or low-voltage can be used.Electricity Any combination of appropriate feature disclosed herein can be used in source 2101.In the embodiment shown in Figure 21 D, power supply 2101 can To be DC-DC converter, it is configured to receive input voltage (Vin) (for example, come from battery) and export different output voltage Vout。 In some embodiments, power supply 2101 can be AC-DC converter, can receive AC signal (Vin) and export DC signal (Vout)。 As discussed herein, output capacitor can be used.Power supply 2101 can in equipment one or more loads (for example, Resistor as shown in figure 21d) power supply.The equipment can be electric appliance (such as home electronics), such as smart television, roasting Case, bread baker, coffee machine etc. are also possible to industrial equipment, Internet of Things (IoT) equipment etc..
Wireless device 2115 can be communicated with power supply 2103.The wireless communication system 2117 of wireless device 2115 can be similar In the wireless communication system 2103 of power supply 2101.In some embodiments, wireless device 2115 may include having wireless communication The power supply 2101 (for example, DC-DC converter or AC-DC converter) of system (for example, otherwise integrated).Wireless device 2115 can be with It is smart phone, tablet computer, wireless router or the access point communicated with remote equipment etc..Power supply 2101 can be local network A part of network, so that one or more wireless devices 2115 are communicated with power supply 2101.Wireless device 2115 can be to power supply 2101 send information or order or receive information or order (for example, passing through Wi-Fi, bluetooth, broadband or other classes from power supply 2101 The wireless signal of type).Wireless device 2115 can order power supply on or off, into sleep pattern (for example, reducing standby function Consumption), failure is removed, is reset power supply (for example, in case of a failure), voltage or levels of current are controlled, changes operation mould Formula etc..Power supply 2103 can communicate information to wireless device 2115, such as fault state, operational mode, voltage and or current (such as limit), information relevant to the health status of power supply 2101 (such as temperature) are set.Wireless device 2115 can pass through The wireless communication system 2013 of power supply 2101 sends order, to control equipment relevant to power supply, such as the conducting of order equipment, pass Disconnected, change setting, execution operation etc..For example, coffee machine can (system can be with power supply for system 2103 by wireless communication 2101 integrated or couplings) order from wireless device 2115 is received to start from coffee, such as when wireless device 2115 is true When determining user will go home.The wireless communication integrated with power supply 2101 can be passed through with the equipment (such as coffee machine) of power supply associated System 2103 sends information (such as setting, current mode, the before behaviour that executes in relation to itself to wireless device 2115 Make, coffee is ready, system mode, mistake etc.).Therefore, packet can be used in equipment (for example, coffee machine) relevant to power supply The wireless communication system 2103 for being contained in power supply 2101 or integrating with power supply 2101 individually wirelessly communicates system without second System.
Figure 21 E shows the example DC-DC converter with wireless communication system 2103, and (in some embodiments, this is System may be embodied in encapsulation 2105).DC-DC converter is configurable to receive input voltage VinAnd provide output voltage Vout。 DC-DC converter may include PWM controller 119, driver 117, switch 2109, inductor 131 and capacitor 111.It can be with Including the DC-DC for showing or being discussed in other embodiments (such as feedback system, multiple inductors etc.) in other figs. The some parts of converter, but for clarity, it is not showed that in Figure 21 E.
One or more system components may be embodied in integrated circuit 2107 (for example, it may be eGaN IC).Integrated electricity Road may include any combination of wireless communication system 2103, PWM controller 119, driver 117 and switch 2109.Such as dotted line Shown, integrated circuit can be divided into one or more independent integrated circuits, it may include wireless communication system 2103, PWM controller 119, any combination of driver 117 and switch 2109.In some embodiments, there can be multiple IC chips, including Individual IC chip for each wireless communication system 2103, PWM controller 119, driver 117 and switch 2109.One In a little embodiments, integrated circuit can be eGaN IC.Monolithic eGaN IC can be used in some embodiments comprising wireless communication It is whole or multiple in system 2103, PWM controller 119, driver 117 and switch 2109.Some embodiments are for channel radio Each of letter system 2103, PWM controller 119, driver 117 and switch 2109 or any combination thereof can also use single Only eGaN IC.In some embodiments, PWM controller 119 can be omitted from encapsulation 2105.Individual PWM controller 119 can be used for driving several DC-DC converter power stages, (for example, as shown in fig. 24 a) as discussed herein.
Wireless communication system 2103 can be communicated with PWM controller, to adjust the pwm signal for being for example supplied to driver, with Output voltage is set and/or changes current limitation.In some embodiments, wireless communication system is configurable to receive from electricity Flow table, voltmeter, thermometer, other sensors and/or state report register (not shown) signal, state report register It is configured to report the information in relation to circuit various pieces.
Example Internet of Things (Internet of Things, IoT) equipment
Figure 22 shows example internet of things equipment 2200.Internet of things equipment 2200 may include encapsulation 2105, which includes Wireless communication system 2103 and two DC-DC converters 2101,2102, as shown in fig. 21 c with it is described.Various other match can be used (for example, being similar to Figure 21 A, 21B or 21D) is set, such as with single DC-DC converter, or there is different types of power supply (example Such as, AC-DC converter).Internet of things equipment can also include the first system 2203.Internet of things equipment can also include electrical system 2201, which may include, for example, CPU 2205, RAM 2207, I/O system 2209 and other electrical equipments 2211. Internet of things equipment 2200 can be communicated by network 2213 with wireless device 2215 (such as smart phone).
In some embodiments, difference can be used in the component in the component and the first system 2203 in electrical system 2201 Voltage.Therefore, the first and second DC-DC converters 2201,2202 can provide different voltage to different equipment.
Electrical system 2201 can be configured to receive the V provided by the second DC-DC converterout2Voltage.Vout2Voltage can be with Be, for example, suitable for electrical system and wireless communication module certain electrical equipments voltage.The first system 2203 may include It is configured to receive different voltages Vout1Different components.
For example, in one embodiment, internet of things equipment 2200 is programmable lighting system.The first system 2203 can wrap Include one or more light bulbs for being configured to receive 60V voltage.Electrical system 2201 is configurable to turn on and off light bulb.User ON/OFF timetable can be programmed for lamp and/or issues order, by wireless communication 2103 ON/OFF lamp of system.It receives To order can be transferred to CPU 2205 from wireless communication system 2013.CPU 2205 can handle order, and according to order Turn on and off the lamp in the first system 2203.User can be wirelessly connected to Internet of Things from another computer or smart phone etc. Net equipment can also be connected to wireless communication system 2103 directly or by network (such as internet).
In another example of internet of things equipment, the first system 2203 be can be, such as mechanical system, the mechanical system Voltage more higher than electrical system (such as motor) and bigger power are received, to execute mechanical work.In other of IoT equipment In example, the first system 2203 can be any system (either electric, mechanical, chemical, heating power etc.), which connects The voltage of receipts and a component difference in electrical system 2201.Other examples of internet of things equipment include the gas of internet connection Wait control system, door, computer, camera, distributor, automobile, electric appliance etc..
Wireless communication system 2103 can send and receive wireless signal to wireless device 2215.In some embodiments, Wireless signal can be sent by network 2213 (such as Internet or WLAN).Wireless device 2215 can be, example Such as, smart phone, computer, desktop computer, IoT equipment in addition etc..Wireless device 2215 can system by wireless communication 2103 are communicated/are communicated from the reception of CPU 2205 to the transmission of CPU 2205 in the form of wireless signal.In some embodiments, wirelessly Equipment system 2103 can be wirelessly communicated/be connect from any DC-DC converter to the transmission of any DC-DC converter by wireless communication Receive wireless communication.Communication from wireless device 2215 can be by power control line (for example, PWR as shown in figure 21 a is controlled Line processed) (such as PMBUS between one or two of wireless communication system 2103 and DC-DC converter 2101,2102), It is transmitted between wireless communication system 2103.
Although Figure 22 shows the example of the internet of things equipment including encapsulation 2105, which includes the DC-DC in Figure 21 C Converter and wireless communication system, but other IoT equipment may include the internet of things equipment and wireless communication system of any encapsulation, For example, as shown in Figure 21 A to Figure 21 E.In addition, internet of things equipment may include other any amount of DC-DC converters, encapsulation In with and without wireless communication system, to provide additional voltage or electric current to any amount of electrical system.
Export adjustable multiple DC-DC converters
Figure 23 A shows the example DC-DC converter system including multiple DC-DC converters 2303,2305,2307 2300.In some embodiments, DC-DC converter 2303,2305,2307 may be embodied in encapsulation 2301.In some implementations In example, DC-DC converter 2303,2305,2307 can be individual encapsulation.User can combine any number of DC-DC and turn Parallel operation is encapsulated to generate the different magnitudes of current.In various embodiments, one in various DC-DC converters 2303,2305,2307 A or multiple components (such as PWM controller, driver and/or switch) can organize merging and be included in one or more integrated circuits In.In some embodiments, each of DC-DC converter 2303,2305,2307 has the independent IC of oneself, IC tool There are PWM controller, driver and/or the switch of the component independently of other DC-DC converters.In some embodiments, DC-DC Converter 2303,2305,2307 can be connected with each other, to promote the electric current between DC-DC converter 2303,2305,2307 total It enjoys.For example, one output in DC-DC converter 2303,2305,2307 can be used to control DC- in feedback system Other one or more outputs in DC converter 2303,2305,2307.For example, if DC-DC converter 2303 is overloaded, Then feedback system can make other DC-DC converters 2305,2307 bear more multi-load, DC-DC converter is better balanced 2303, the electric current between 2305,2307.
DC-DC converter system can be configured to receive input voltage VinAnd generate output voltage Vout.Each DC-DC conversion Device can be configured to generate output voltage.Each of DC-DC converter 2303,2305 and 2307 can also be with parallel coupled Between system input and system output.Due to parallel configuration, can be by the total current that DC-DC converter system 2300 provides By the summation for the single current that DC-DC converter 2303,2305,2307 provides.Example in Figure 23 A shows DC-DC conversion Device system 2300, wherein 3 DC-DC converters 2303,2305,2307 are configured to each electric current for providing 10 amperes, DC-DC conversion Total output electric current that device system 2300 provides is 30 amperes.In some embodiments, 6 20 Ampere currents of offer can be provided DC-DC converter is to provide 120 Ampere currents, or any other suitable power adapter combination can be used.Some In embodiment, the electric current from multiple DC-DC converters can be combined more than 200 amperes.Can in parallel any quantity (such as 2, 3,4,5,7,10,15,20,25 or more DC-DC converter) DC-DC converter, to provide the various different magnitudes of current.? In some embodiments, the DC-DC converter for being configured as output to the different magnitudes of current can be combined.For example, 1 is configured as output to 20 peaces DC-DC converter that the DC-DC converter of training can be configured as output to 10 amperes with 1 and 3 are configured as output to 2 amperes of DC- The combination of DC converter, is capable of providing 36 amperes of electric current.The various embodiments of DC-DC converter disclosed herein can be used as mould Block component, to form various voltage and or currents using only a small amount of DC-DC converter type to combine.For example, being configured to The DC-DC converter of 50 amperes, 20 amperes, 10 amperes, 5 amperes, 2 amperes and 1 ampere of output can be used for a variety of different combinations, 1 ampere of system to 100 Ampere currents amounts is exported using 6 or less DC-DC converter to provide.
Figure 23 B shows the example DC-DC converter system including multiple DC-DC converters 2353,2355,2357 2350.DC-DC converter 2353,2355,2357 is optionally included in encapsulation 2351.System 2350 (for example, encapsulation 2351) It can also include controller 2209 and switching system (for example, switching system with current sensor) 2361.In some implementations In example, the various assemblies in system 2350 can be in individual encapsulation.
DC-DC converter system 2350 can be configured to receive input voltage VinAnd it produces into output voltage Vout.Each DC-DC Converter can be configured to generate output voltage.Each of DC-DC converter 2303,2305 and 2307 can coupling in parallel It closes between system input and system output.Due to parallel configuration, the total current that is provided by DC-DC converter system 2200 can be with It is the summation of the single current provided by DC-DC converter 2303,2305,2307.
Controller 2359 can be configured to receive the order for coming from communication line (such as PMBUS), and match in response to the order Set the arrangement and combination of DC-DC converter 2353,2355,2357.Controller 2359 can make DC-DC converter 2353,2355, 2357 various combination helps to export.For example, controller 2359 can configure all three DC-DC converters to provide maximum Electric current, to provide the electric current for amounting to 35 amperes to export.15 amperes of order is provided in response to receiving, controller 2359 is then Each of three DC-DC converters 2353,2355,2357 can be configured, to provide the group for the electric current that summation is 15 amperes It closes (such as 5+5+5,0+10+5 or the 60/7+30/7+15/7 balanced in proportion).
Switching system can be controlled by controller 2359, such as disconnect appointing in DC-DC converter 2353,2355,2357 The connection in parallel branch between what one and output.For example, switching system can be by 20 in order to provide 15 amperes of electric current The DC-DC converter 2353 of ampere and output decouple, while keeping the DC-DC of 10 amperes of DC-DC converter 2355 and 5 ampere Converter 2357 and output coupling.In some embodiments, the function between controller 2359 and switching system 2361 can group Synthesize a control switch system.System 2350 (for example, switching system 2361) may include current sensor, to detect DC-DC The electric current of each of converter 2353,2355,2357 output.It in some embodiments, can be in each DC-DC converter Output comprising current sensor, and current sensor can be used as feedback and be supplied to controller 2359.In some embodiments In, it may include current sensor in each DC-DC converter, and each in DC-DC converter 2353,2355,2357 It may include feedback and control system (such as OCP) in a, as shown in Figure 1.If Figure 23 A is discussed, any amount can be combined DC-DC converter.
In some embodiments, it might have feedback in 2350 level of DC-DC converter system, wherein sensing each DC- The output of DC converter 2353,2355,2357 is simultaneously supplied to controller 2359.Controller can be (for example, be converted based on DC-DC The output of device 2353,2355,2357) execute current balance type.Current balance type may include increasing or decreasing DC-DC converter 2353, electric current each in 2355 and/or 2357 output.Current balance type may include, for example, the first DC-DC converter of detection It is to be in, meet or exceed threshold limit (for example, electric current output limit, inductance saturation limit, voltage limit, temperature extremes), The electric current of first DC-DC converter offer is provided, and, in some cases, increase the electricity that the second DC-DC converter provides Stream, to compensate the electric current of the reduction provided by the first DC-DC converter.Current balance type may include, for example, in response to loading institute Caused curent change increases and/or reduces output electricity one or more in DC-DC converter 2353,2355 and/or 2357 Stream.For example, the electric current that the motor in stable state can consume is less compared with the motor rotated, and can hold Row current balance type is to provide more or fewer electric currents to motor.
In some embodiments, the feedback of 2350 level of DC-DC converter system can be used for detecting comprising within the system One of DC-DC converter temperature and/or inductance saturation.Response reaches threshold temperature and/or has threshold value inductance full First DC-DC converter of sum, controller can reduce the electric current of DC-DC converter offer, and in some cases, pass through The electric current for increasing the offer of the second DC-DC converter compensates.
Some embodiments may include having multiple DC-DC converters of different ampere-capacities.For example, DC-DC converter system System 2350 may include three 10 amperes of DC-DC converter, and controller be configurable to provide up to 30 amperes can Time-dependent current output.As another example, DC-DC converter system 2350 may include four 1 ampere DC-DC converter, one A 5 amperes of DC-DC converter, one 10 amperes of DC-DC converter and one 20 amperes of DC-DC converter.As another One example, DC-DC converter system 2350 may include one 5 amperes of DC-DC converter, one 10 amperes of DC-DC Converter and multiple 20 amperes of DC-DC converters.As another example, DC-DC converter system 2350 may include more A DC-DC converter, total current capacity are at least 50 amperes, 100 amperes, 150 amperes, 200 amperes or more.It can be at least Efficiency, improved size, switching speed, improved heat dissipation and topological structure disclosed herein are based in part on to design Gao An Train the DC-DC converter system of number.
In some embodiments, configuration and arrangement shown in Figure 23 A and Figure 23 B can be set in 2301 Hes of no encapsulation In 2351 equipment.For example, each DC-DC converter 2303,2305 and 2307 can be and be individually encapsulated.
More power stage configurations
Figure 24 A shows the DC-DC converter 2400 with multiple power stage 2403A-2403C.PWM control can be used Device provides pwm signal to multiple power stages, and each power stage can have driver and one or more switches.It is two or more DC-DC converter power stage can share a PWM controller.For example, topological structure shown in Figure 24 can be used for being discussed herein Technology and principle certain realizations in, as shown in Figure 23 A and Figure 23 B and described.There may be show in other figs. Certain parts (such as feedback system) of DC-DC converter 2400 out, but be not shown in Figure 24 A.DC-DC converter 2400 can To include output capacitor 111, encapsulation 2401, integrated circuit (IC) chip 2413, driver 117A-117C, pulsewidth modulation (PWM) controller 119, switch (for example, eGaN is switched) 2405A-2405C and inductor 131A-131C.
In some embodiments, IC 2413 may include PWM controller 119, although in other embodiments, PWM control Device 119 needs not be a part of IC 2413.PWM controller 119 can separate with encapsulation 2401 or outside encapsulation 2401, and Each driver 117A-117C into different capacity grade 2403A-2403C provides the pwm signal of out-phase.For example, for three Power stage, pwm signal can be mutually out of phase 120 degree.In some embodiments, PWM controller 119 can with encapsulation 2401 in PCB is separated or outside PCB, but still is included in encapsulation 2401.In some embodiments, PWM controller 119 can be encapsulation 2401 a part.
Encapsulation 2401 may include multiple power stage 2403A-2403C.Each power stage 2403A-2403C can have integrated electricity Road, the IC chip are embedded in the PCB of encapsulation.As alternate embodiment, multiple power stages (such as 2403A-2403C) It may be embodied in an integrated circuit, as shown in dotted line 2404.
Each power stage 2403A-2403C may include the driver 117A-117C and switch 2405A- as being respectively shown in 2405C.Each power stage 2403A-2403C can be coupled with respective inductor 131A-131C.Power stage 2403A-2403C can Parallel configuration.The current capacity of DC-DC converter 2400 can be power stage 2403A-2403C and inductor 131A-131C is each The sum of current capacity of parallel branch.
Figure 24 B shows the exemplary arrangement of inductance 131A-131C in DC-DC converter 2400.For simplicity, scheme PWM controller 119 is not shown in 24B.Three inductor 131A-131C can respectively have footprint 2423A-2423C, occupy-place Region 2423A-2423C may include in the footprint of encapsulation 2401.It the footprint of inductor can be with ic core The overlapping of any one footprint of piece 2404 and/or power stage 2403A-3403C.Figure 24 B is not accurately drawn to scale, But still show the major part for encapsulating 2401 footprints and/or absolutely big portion are arranged and occupied in inductor footprint how Point.In some embodiments, inductor may be coupled to encapsulation 2401, without being physically located in encapsulation.For example, inductance Device is coupled to the upper surface of encapsulation and/or protrudes from the upper surface of encapsulation.For example, encapsulation 2401 can be with shown in Figure 24 A It is terminated at dotted line 2402.
Example sectional view
Figure 25 shows the example side view of DC-DC converter 2500.The DC-DC converter includes PCB 2501, inductance Device 2503, capacitor 2505, chip embedded PWM controller 2507, chip embedded driver 2509, chip embedded switch 2511 and via hole 2513.
Inductor 2503 and capacitor 2505 can be outside PCB 2501.Inductor can pass through via hole 2513 and switch 2511 couplings.
PWM controller 2507 can be in the first integrated circuit (showing) or the first chip embedded integrated circuit (not shown) In.In some embodiments, PWM controller 2507 can be in the outside of encapsulation 2501.First integrated circuit can be based on any Semiconductor material, such as silicon, and can be eGaN IC.
Driver 2509 can be in the second chip embedded integrated circuit.Second integrated circuit can partly be led based on any Body material, such as silicon, and can be eGaN IC.
Switch 2511 can (the such as second chip embedded integrated circuit or third chip be embedding in chip embedded integrated circuit Enter formula integrated circuit) in.The integrated circuit can be based on any semiconductor material, such as silicon, and can be eGaN IC.
In some embodiments, the second integrated circuit can be the monolithic IC including driver 2509 He switch 2511.? In some embodiments, driver 2509 and switch can be in individual IC.In some embodiments, PWM controller 2507, drive Dynamic device 2509 and switch 2511 can be in monolithic IC (for example, eGaN IC).In some embodiments, as discussed herein, PWM controller 2507 can drive multiple groups driver 2509 and switch 2511.
Inductance is prevented to be saturated
For the inductor of same physical size, it is designed to the inductor with higher saturation limit, D.C. resistance (DCR) it also will increase.In the case where not increasing DCR, inductor can also be designed to there is higher saturation limit, but inductance The physical size of device will increase.For example, rating plate is limited to, 10 peaces and saturation limit are and the DCR of the first inductor of 15 peaces can be with It is 4 milliohms.Second inductor (identical as the physical size of the first inductor) also can have the rated current of 10A, and only There is the DCR of 3 milliohms, but the second inductor has lower saturation limit, is 13A.Ideal way is using with smaller object The inductor (inductor 131 as shown in figure 1) of size and lower DCR are managed to improve efficiency, without with an attribute (DCR or Size) exchange another attribute (DCR or size) for, also, do so and will not violate design principle because inductance is saturated.Saturation Inductor lower inductance can be provided, can also be used as the accidental short circuit between input and output port.Therefore, in order to anti- Only inductor is saturated, and in some cases, although DCR will increase, also can be used with larger inductance and larger saturation limit Larger inductor come ensure inductor unsaturation.For example, the rated value of inductor can be 10A, but inductor can be undergone 30% AC ripple so that peak point current is 11.5A, and will receive the influence for influencing the temperature change of saturation limit.Cause This, inductor can be saturated various under operating condition in order to prevent, can be the saturation with 15A or 20A by 10A inductor design The limit, to provide saturation buffering or error margin.In some designs, buffer is devised for the worst situation, such as across More wider temperature range, may be selected by inductor in this way, and so that it is saturated rated value is that dc-dc convertor electric current output is specified Twice of value.However, this design the physical size and/or DCR that at least will increase inductor.
In some embodiments, the inductor with lower DCR can be used for improving efficiency without causing inductor saturation effect. For example, it is 11A, 10.5A, 10.25A, 10.1A etc. that rated value, which can be used, in the DC-DC converter that output-current rating is 10 peaces Inductor.In some cases, inductor can have rated current and specified saturation value, and specified saturation value can be higher than it Rated current.DC-DC converter can have inductor, and the saturation limit of the inductor is higher than inductor or DC-DC converter Rated current 0%, 5%, 10%, 20%, 30%, 40%, 50%, 75% or 100% or any value between it, or Any range limited by any combination of these values, although the value except these ranges can be used in some implementations.
DC-DC converter may include over-current protection system.As shown in Figure 1, the first input of comparator 139 can couple To current source 137, which can be used as the reference that the overcurrent limit is arranged.I2C and/or PMBUS (as described above with respect to Fig. 2) It can be used for modifying and/or adjusting the output electric current of current source 137.Therefore, it can be set and/or adjust the overcurrent limit.Compare The output of device 139 is provided to fault logic and overcurrent protection (OCP) circuit 141.
When comparator 139 can detecte inductor 131 approaching or at saturation limit.Current source 137 can provide reference Electric current is for comparing.Current source 137 (for example, by PMBUS or other control communication lines) can be modified and/or control, with Adjust reference current.Correspondingly, threshold reference value can be directed to different inductors 131 and be adjusted at different temperature Whole (signal from thermometer can be responded, be not shown).In response to overcurrent event (for example, when being detected by comparator 139 Then), fault logic 141 can activate overcurrent protection circuit.For example, this may make PWM controller and/or driver (or Switch 123 and closure switch 127 directly) are disconnected, or prevent excessive voltage or electric current from reaching output.When no longer detecting (there is hysteresis in some embodiments) when current protection, switch 123 and 127 can restore to work normally.
In some example embodiments, it can be set slow less than 50%, 25%, 15%, 10%, 5%, 2.5% or 1% Any range rushing any value of the space perhaps between it or being limited by any combination of these values, although in certain implementations The buffering capacity beyond these ranges can be used in example.Low-buffer space can even use under the conditions of various temperature.For example, The inductor that saturation limit is 10.5A (for example, 5% buffering) can be used in the DC-DC converter that rated value is 10A, and It can work under the conditions of -40 DEG C to+125 DEG C of temperature.It may include 0 DEG C -100 that other examples, which are minimal to maximum temperature range, DEG C, 10 DEG C -90 DEG C, 25 DEG C -75 DEG C etc..Other exemplary temperature ranges include at least 50 DEG C of variation, at least 75 DEG C of variation, At least 100 DEG C of variation, at least 125 DEG C of variation, at least 150 DEG C of variation, at least 165 DEG C of variation and at least 175 DEG C Variation.
Overcurrent detection and defencive function can execute under various conditions.For example, can be for including in DC-DC converter Each inductor calibration overcurrent detection and protection.PMBUS (or any other suitable control communication protocol or physical layer) On I2C communicates the reference current 137 that can be used for adjusting or calibrating inductor.In some embodiments, look-up table or other deposit Storage structure can store the temperature curve of inductor 131, and trim current source 137, to provide reference appropriate to comparator 139 Electric current.
AC-DC and other types of power adapter
Teachings disclosed herein and principle can be applied to any kind of power adapter, turn rather than just DC-DC Parallel operation.Teachings disclosed herein and principle also can be used in DC-DC converter, AC-DC converter and AC-AC converter.Example Such as, Figure 26 A shows the example block diagram 2600 of AC-DC converter.AC-DC converter 2600 is configured to receive ac input voltage simultaneously DC output voltage is provided.AC-DC converter 2600 may include filter 2601, isolation circuit 2603, rectification circuit 2605 and/ Or smoother and/or output filter 2607.
For example, filter 2601 can be arranged to the band in the interior transfer overvoltage signal of frequency range (such as 50-60Hz) Bandpass filter.The filter may include one or more switches, inductor and/or capacitor.It in some embodiments, can be with Omit filter 2601.
Isolation circuit 2603 can be configured to for AC input port and DC output port being electrically isolated, so that between the two without straight The conductive path connect.In some embodiments, after AC signal is converted to DC signal, isolation circuit be can be set in different positions It sets, such as direction output.For example, inductor L1 and L2 can be with electromagnetic coupling, so that by the electric current (example of inductor L1 Such as, variable-current (AC)) it can produce magnetic field and magnetic field be applied on inductor L2, to induce by inductor L2's Electric current (for example, variable-current (AC)).Inductor L1 and L2 can provide transformer, by higher AC voltage drop as low as lower AC voltage.In some embodiments, for example, if not needing to reduce input AC voltage, then it can be omitted transformer (for example, isolation Circuit 2603).
Rectifier 2605 may include diode apparatus 2609 and/or active switch 2611.Various types of rectifier topologies Structure includes half bridge rectifier, full-bridge rectifier, single-phase rectifier, polyphase rectifier, active rectifier etc..Active rectifier can Including one or more active switch 2611.In some embodiments, diode bridge can be used, AC signal is converted into pulse DC signal.It can be with active control switch 2611.In some embodiments, it may include PWM controller and provide pwm signal to control Make switch 2611.
Smoother and/or output filter 2607 may include LC network.LC network may include inductor L3 and capacitor C1.In some embodiments, it is convenient to omit inductor L3.Smoother and/or output filter 2607 may include energy-storage capacitor, It can make pulsed DC signal become smoother DC signal.
The techniques described herein can be applied to the various assemblies of the AC-DC converter in Figure 26 A.For example, circuit element Any combination, such as any control system (for example, PWM controller) and diode of active switch 2611, active switch 2611 2609 may be embodied in chip embedded integrated circuit, be coupled to inductor L1, L2 and/or L3 by via hole.AC-DC conversion Any functional level of device, such as filter 2601, isolation circuit 2603, rectifier 2605 and smoother output filter 2607, all It may be embodied in a chip embedded integrated circuit or any amount of chip embedded integrated circuit.Any inductor (such as L1, Ll2 and L3) or capacitor (such as C1 or energy-storage capacitor) can be stacked on flush type circuit (such as integrated electricity Road) top (for example, being at least partially or fully overlapped), and integrated circuit can be coupled to by one or more via holes.Object It may include technology that Fig. 3 is discussed that removing the work, which is set,.Any feedback disclosed herein and control technology can also be applied.
Figure 26 B shows the example embodiment of AC-DC converter.AC-DC converter can receive input AC signal (example Such as, Vin).Optionally, voltage-regulating circuit (such as transformer 2603) can change the voltage level of input AC signal.For example, Transformer 2603 is configurable to input AC voltage drop as low as reduced AC voltage.As discussed herein, transformer 2603 It may include two inductors.In some embodiments, it is convenient to omit transformer 2603.AC-DC converter may include rectified current Road 2605 can be configured to AC signal being converted into pulsed DC signal.In the embodiment shown in Figure 26 B, full-bridge can be used Rectification circuit (for example, there are four diodes for tool).It can be used various types of rectification circuits, such as diode bridge, half-wave are whole Stream, full-wave rectification, Half bridge rectifier etc..In some embodiments, rectification circuit may include one or more diodes.AC-DC Converter may include smooth circuit 2607.In some embodiments, smooth circuit 2607 may include capacitor (such as Figure 26 B institute Show), which can be used as energy-storage capacitor.In some embodiments, smooth circuit may include inductor, or including electricity The lc circuit of sensor and capacitor.Smooth circuit 2607 can smooth pulsed DC signal, to generate more stable D/C voltage (Vout).Export DV voltage (Vout) one or more loads (for example, shown herein as resistors) for can be used in equipment mention For electric current.
Figure 26 C shows the example embodiment of AC-DC converter.As described herein, optional voltage regulator 2603 can Including transformer (for example, there are two inductors for tool).In some embodiments, rectification circuit 2605 may include that one or more is opened 2622 are closed, which can be actuated to allow and prevent electric current to correct AC signal (for example, generating pulse DC signal).Switch 2622 can be switch mosfet.Switch 2622 can be eGaN switch.Switch 2622 can be same with AC signal Step.In some embodiments, PWM controller 2626 can be used and/or driver 2624 carrys out driving switch 2622.It can be used Feedback system 2628 is similar to other embodiments disclosed herein.In some embodiments, the combination of diode and switch is available Rectification circuit in AC-DC converter.Smooth circuit 2607 can be to smooth voltage, as discussed herein, and can To include capacitor and/or and inductor.
In some embodiments, rectification circuit 2605 can be embedded in the printed circuit boards, as described herein.Rectification circuit 2605 can be one or more integrated circuits (IC).For example, chip embedded circuit 2640 (for example, one or more IC) can To include any combination of PWM controller 2626, driver 2624 and one or more switches 2622.In some embodiments, Part or all of feedback system 2628 can be a part of flush type circuit 2640 (for example, in one or more IC On).In some embodiments, it is convenient to omit PWM controller 2626.In some cases, external PWM controller can be used for multiple AC-DC converter is similar to discussed in this article.Flush type circuit 2640 may include one or more diodes, the diode It can be configured to AC signal rectification into pulsed DC signal.One or more inductors and/or capacitor are (for example, constitute transformer 2603 and/or smooth circuit a part) can be set outside PCB, and can pass through one or more via holes and insertion Formula circuit is electrically coupled.One or more inductors and/or capacitor can at least partially or fully with the occupy-place of flush type circuit Region overlapping.For example, AC-DC converter can be similar to Fig. 3, wherein component 315 is flush type circuit (for example, IC) 2640.
Power adapter disclosed herein, including DC-DC converter, AC-DC converter, AC-AC converter, Yi Jitu Example in 26A, Figure 26 B and Figure 26 C, principle based on DC-DC converter and openly can be completely or partially chip insertion Formula.
Other embodiments
In order to help to understand, some embodiments are described referring to example value, such as voltage value, size, frequency, electricity Stream, position etc..But the disclosure is not intended to be limited to value disclosed herein.For example, voltage relevant to DC-DC converter Range may include any voltage range.The input voltage of any range and the output of any range can be used in various embodiments Voltage arrives the DC-DC converter of -5V including the conversion between generating positive and negative voltage, such as+12V.Various embodiments can also use Any current value, including the very high current value more than 200 amperes.Various embodiments can have in different location and/or The component of orientation is arranged.For example, any integrated circuit disclosed herein can be up or face-down.Although some examples Disclose certain communication systems, such as I2C and/or PMBUS, but communication system or other agreements and/or physical layer also can be used Design.Other embodiments can be used, for example, universal serial bus ID (SVID), adaptive voltage scaling bus (AVSbus) etc..This Controller disclosed in text may be implemented in a variety of ways, such as Digital Implementation, simulated implementation and mixing are realized.Some DC-DC conversions Device encapsulation or PCB may include coupled capacitor and/or capacitor.The encapsulation of some DC-DC converters or PCB can without with Its capacitor and/or capacitor for coupling；Inductor and/or capacitor can be added in encapsulation or PCB later.Some realities Applying example can be AC coupling.Inductor is formed in Figure 13 A and 13B can be shared one to 1215 inductor 1211,1215 The inductor of a core.Although some example systems are described for Example feedback control program, power supply disclosed herein turns Any feedback control scheme can be used in parallel operation.Power adapter can be used based on average current, peak-mode, valley mode, The current mode control scheme of analog current etc.；Based on preceding/rising edge, drives edge, it is double along etc. voltage mode control program；It is permanent Determine turn-on time；Constant off-time etc..Feedback system may include sluggishness.
Power adapter can be used for for the power supply of various equipment, such as the IoT equipment discussed in Figure 22.Shown in Figure 22 CPU2205 and any other controller, the processor that are discussed herein etc. can be a kind of hardware processor, be also possible to a variety of Hardware processor can be coupled to processing information with bus.For example, CPU, processor, controller etc. can be one or more A general purpose microprocessor.
CPU, processor, controller etc. may be coupled to main memory, such as random access memory (RAM) 2207, slow It deposits and/or other dynamic memories, is coupled to instruction of the bus for storing information and being executed by processor 2205.? During CPU2205 executes the instruction that will be executed by CPU 2205, RAM can also be used to store temporary variable or other average informations. When these instructions store in the addressable storage medium of processor 2205, computer system is presented to one by these instructions In special purpose machinery, which is the operation to specify in executing instruction and customizes.Any kind of calculating can be used Machine readable memory.
Electrical system 2201 or other systems disclosed in the present application may include the equipment 2211 for showing information to user, Such as display (such as cathode-ray tube (CRT) or LCD display or touch screen).Other examples of equipment 2211 include input Equipment, which includes alphanumeric key and other keys, for transmitting information and command selection to processor 2205.It is another The equipment 2211 of seed type is cursor control device, such as mouse, trace ball or cursor direction key, for passing to processor 2205 Directional information and command selection are sent, and mobile for controlling the cursor on display.This input equipment usually has on both axes Two freedom degrees, first axle (such as x) and the second axis (such as y) allow the position in equipment given plane.In some embodiments In, it can be realized by receiving touch on the touch screen without cursor and control identical directional information and order choosing with cursor It selects.
Electrical system 2201 or other systems disclosed herein may include subscriber interface module, to realize graphic user interface (GUI), which can be used as is stored in mass-memory unit by the executable software code that calculating equipment executes.Citing comes Say, the module and other modules may include such as component, such as the component software of component software, object-oriented, class component and Task component, process, function, attribute, program, subprogram, program code segments, driver, firmware, microcode, circuit, data, Database, data structure, table, array and variable.
In general, " module " word used herein refers to logic included in hardware or firmware, or refers to volume The possibility that Cheng Yuyan (such as Java, Lua, C or C++) writes has the software instruction set of entrance and exit point.Software mould Block can be compiled and is linked in executable program, be mounted in dynamic link library, or can use explanation type programming language (example Such as, BASIC, Perl or Python) it writes.It will be appreciated that software module from other modules or itself can be called, and/or it can basis The event or interruption that detect and call.The software module configured to execute on the computing device can be in computer-readable Jie It is provided in matter, such as CD, digital video disk, flash drive, disk or any other tangible medium, or as number Downloading (can initially be stored, which needs to install before execution, decompresses or solve with compression or installable format It is close).This software code, which can be partly or entirely stored in, to be executed in the storage equipment for calculating equipment, is executed by calculating equipment. Software instruction can be embedded into firmware (such as EPROM).It should also be understood that hardware module can be by the logic unit that connects (such as door And trigger) composition, and/or can be made of programmable unit (such as programmable gate array or processor).The module be somebody's turn to do herein or Computing device functionality is realized preferably as software module, but can be indicated with hardware or firmware.In general, module as described herein is Refer to that logic module, the module or can be divided into submodule, although their physical organizations or storage mode are not with other block combiners Together.
Customized hardwired logic, one or more spies can be used in electrical system 2201 or other systems as described herein Determine purposes integrated circuit (ASIC) or field programmable gate array (FPGA), firmware and/or programmed logic (these and department of computer science System (for example, electrical system 2201) reason or program are combined into the machine of specific use) Lai Shixian the techniques described herein. According to one embodiment, technology herein is executed in main memory 2207 in response to processor 2205 by electrical system 2201 and is wrapped One or more sequences of the one or more instructions contained execute.These instructions can be from another storage medium (as stored Equipment) it reads in main memory 2207.The sequence for executing the instruction for including in main memory 2207 will lead to processor 2205 It executes processing operation or realizes function as described herein.In alternative embodiments, hard-wired circuitry can be used to refer to instead of software It enables or is applied in combination with software instruction.
Non-transitory computer-readable medium can be used.The medium of any storing data and/or instruction can be used, the number According to and/or instruction run machine in a specific way.This non-transitory medium may include non-volatile media and/or volatibility Medium.Volatile media includes dynamic memory, such as main memory 2207.The common form of non-transitory medium includes, such as Floppy drive, floppy disk, hard disk, solid state drive, tape or any other magnetic data storage medium, CD-ROM driver (CD- ROM), any other optical data carrier, any physical medium with hole pattern, random access memory (RAM), can Program read-only memory (PROM) and erasable programmable read-only memory (EPROM) and flash EPROM (FLASH-EPROM), nonvolatile ram (NVRAM), any other storage chip or tape and identical net Network version.
Non-transitory medium can be different from transmission medium, but can be used together with transmission medium.Transmission medium can be with Participate in the information transmission between nontemporary medium.For example, transmission medium may include coaxial cable, copper wire and optical fiber, including packet Electric wire containing bus.Transmission medium can also be using the form of sound wave or light wave, as produced in radio wave and infrared data communication Raw sound wave or light wave.
Wireless communication system 2103 can provide bidirectional data communication coupling to network 2213.For example, wireless communication system 2103 can send and receive electricity, electromagnetic or optical signal, these signals carry the digit data stream for representing various types information. Alternatively, in some cases, wireless communication system 2103 can provide one-way communication (for example, receiving or transmit information).
Network 2213 usually provides data communication to other data equipments by one or more networks.For example, network 2213 can provide the company with host or with the data equipment operated by Internet Service Provider (ISP) by local network It connects.ISP then provides data communication services by global enfeoffment data communication network (now commonly referred to as " internet ").

Claims (43)

1. a kind of power adapter, comprising:
Printed circuit board (PCB), comprising:
Part lower printed circuit board (PCB) with bottom side and top side；And
Part upper printed circuit board (PCB) with bottom side and top side；Flush type circuit, described in the lower part PCB Between top side and the bottom side of the upper part PCB, the flush type circuit includes:
Driver is configured to generate one or more driving signals；And
One or more switch, is configured to be driven by one or more of driving signals；
One or more via holes extend through the upper part PCB；And
Inductor, above the top side of the upper part PCB, wherein one or more of via holes and the inductance Device and the flush type circuit are electrically coupled, and the footprint of the inductor at least partly with the flush type circuit Footprint overlapping.
2. power adapter according to claim 1, wherein the power adapter is configured with isolated topology structure, institute State direct electrical connection of the isolated topology structure for being isolated between the outputting and inputting of the power adapter.
3. power adapter according to claim 2, wherein the isolated topology structure includes: flyback topologies structure, just Swash converter topologies, pair transistor normal shock, LLC resonance converter, push-pull topology structure, full-bridge, mixing, PWM resonance turn At least one of parallel operation and half-bridge topology.
4. power adapter according to claim 2, including transformer, the transformer includes the first inductor and second Inductor, first inductor and second inductor configuration are so that existing by the variable-current of first inductor Variable-current is induced in second inductor.
5. power adapter according to claim 1 further includes wireless in same encapsulation with the flush type circuit Communication system.
6. power adapter according to claim 5, wherein the output of the power adapter is configured in response to described The wireless signal that wireless communication system receives is adjusted.
7. power adapter according to claim 5 further includes feedback system, the feedback system includes slope Device, the ramp generator are configured to generate simulation by the signal of the current ripples of the inductor, and wherein, described anti- Feedback system includes current source, and the current source is configured to be repaired in response to the wireless signal that the wireless communication system receives Whole or adjustment.
8. power adapter according to claim 5, wherein the flush type circuit includes the wireless communication system.
9. a kind of article, comprising:
Power adapter according to claim 5；
The first system is configured so that electric energy executes physical action；And
Electrical system is configured to control the first system；
Wherein, the power adapter is configured to provide electricity to one or two of the first system and the electrical system Can, and wherein, the electrical system is configured to be based at least partially on the wireless signal that the wireless communication system receives, Control the first system, the flush type circuit of the wireless communication system and the power adapter is in same encapsulation In.
10. power adapter according to claim 1 further includes communication interface, the communication interface is configured to receive and use In the control signal for the output for adjusting the power adapter.
11. power adapter according to claim 10, wherein the communication interface includes power management bus (PMBUS)。
12. power adapter according to claim 10, wherein the communication interface is arranged for carrying out IC bus (I2C) agreement.
13. power adapter according to claim 10 further includes feedback system, the feedback system includes slope Device, the ramp generator are configured to generate simulation by the signal of the current ripples of the inductor, and wherein, described anti- Feedback system is configured in response to modifying the ramp generator by the received order of the communication interface.
14. power adapter according to claim 1, wherein the flush type circuit includes pulsewidth modulation (PWM) control Device, pulsewidth modulation (PWM) controller is configured to generate one or more pwm signals, wherein the PWM controller is coupled to The driver, and the driver is configured to be based at least partially on the one or more of drives of the pwm signal generation Dynamic signal.
15. a kind of power supply system, comprising:
Multiple power adapters, wherein each of the multiple power adapter is all electricity according to claim 1 Source converter；And
Shared pulsewidth modulation (PWM) controller, is configured to generate multiple pwm signals, wherein the PWM controller is coupled to institute The multiple pwm signal, is passed to the corresponding drive of the power adapter by the driver for stating multiple power adapters Dynamic device, and wherein, the driver is configured to be based at least partially on the pwm signal and generate one or more and drive to believe Number.
16. a kind of power supply system, comprising:
First power adapter, first power adapter are according to power adapter described in claim 1；And
With the second source converter of the first power adapter parallel coupled.
17. power supply system according to claim 16 further includes control system, the control system is configured to described in adjustment The output of first power adapter and the output of the second source converter, to realize current balance type.
18. power adapter according to claim 1, wherein the inductor has rated current, the inductance utensil There is specified saturation value, and the specified saturation value is not more than the 150% of the rated current.
19. power adapter according to claim 1, wherein the inductor has rated current, the inductance utensil There is specified saturation value, and the specified saturation value is not more than the 120% of the rated current.
20. power adapter according to claim 19 further includes overcurrent protection circuit, the overcurrent protection circuit It is configured to prevent by the electric current of the inductor to be more than the specified saturation value.
21. power adapter according to claim 1 further includes overcurrent protection circuit, the overcurrent protection circuit It is configured to disconnect at least one of one or more of switches switch in response to detecting overcurrent situations.
22. power adapter according to claim 1, wherein the power adapter is DC-DC (DC-DC) electricity Source converter.
23. power adapter according to claim 1, wherein the power adapter is AC-DC (AC-DC) electricity Source converter.
24. power adapter according to claim 5 further includes feedback system, the feedback system includes current source, Described in current source be configured to be based at least partially on the wireless signal received in response to the wireless communication system and repaired Whole or adjustment.
25. power adapter according to claim 5 further includes over-current protection system, the over-current protection system It is configured to provide for the instruction that electric current passes through the inductor, the overcurrent system includes current source, wherein the current source It is configured to be based at least partially on the wireless signal received in response to the wireless communication system and is modified or adjusted.
26. a kind of power adapter, comprising:
Printed circuit board (PCB), comprising:
Part lower printed circuit board (PCB) with bottom side and top side；And
Part upper printed circuit board (PCB) with bottom side and top side；
Input port is configured to receive input voltage；
Output port is configured to provide for the output voltage different from the input voltage；
Flush type circuit, it is described embedding between the top side of the lower part PCB and the bottom side of the upper part PCB Enter formula circuit to couple with the input port, and is configured to change the input voltage；
Via hole extends through the upper part PCB；And
Inductor or capacitor, above the top side of the upper part PCB, wherein one or more of via holes with The inductor or capacitor and the flush type circuit are electrically coupled, and wherein, the occupy-place of the inductor or capacitor Region is at least partly Chong Die with the footprint of the flush type circuit.
27. power adapter according to claim 26, wherein the inductor is located at the described of the upper part PCB Above top side, one or more of via holes are electrically coupled with the inductor and the flush type circuit, and the inductor accounts for Position region is at least partly Chong Die with the footprint of the flush type circuit, and wherein, the flush type circuit includes:
Driver is configured to generate one or more driving signals；And
One or more switch, is configured to be driven by one or more of driving signals.
28. power adapter according to claim 26, wherein the power adapter is that DC-DC (DC-DC) turns Parallel operation.
29. power adapter according to claim 26, wherein the power adapter is that AC-DC (AC-DC) turns Parallel operation.
30. power adapter according to claim 29 further includes transformer, the transformer include the first inductor and Second inductor, first inductor and second inductor configuration are so that the variation by first inductor is electric Stream induces variable-current in second inductor.
31. power adapter according to claim 29, wherein the flush type circuit includes rectification circuit, described whole Current circuit, which is configured to that (AC) input voltage will be exchanged, changes into pulsating DC voltage.
32. power adapter according to claim 31 further includes smooth circuit, the smooth circuit is configured to, by institute Stating pulsating DC voltage smoothly is more stable D/C voltage, wherein the smooth circuit includes positioned at the described of the upper part PCB The inductor or capacitor above top side.
33. power adapter according to claim 31, wherein the rectification circuit includes one or more switches.
34. power adapter according to claim 31, wherein the rectification circuit includes diode bridge.
35. a kind of DC-DC (DC-DC) power adapter, comprising:
Part lower printed circuit board (PCB) with bottom side and top side；
Part upper printed circuit board (PCB) with bottom side and top side；
Flush type circuit, it is described between the top side of the lower part PCB and the bottom side of the upper part PCB Flush type circuit includes:
Pulsewidth modulation (PWM) controller is configured to generate pwm signal；
Driver is configured to receive the pwm signal and generates one or more driving signals；
First switch is configured to be driven by least one of one or more of driving signals；And
Second switch is configured to be driven by least one of one or more of driving signals；
One or more via holes extend through the upper part PCB；
Inductor, above the top side of the upper part PCB, wherein one or more of via holes and the inductance Device and the flush type circuit are electrically coupled, and wherein, the footprint of the inductor at least partly with it is described embedded The footprint of circuit is overlapped；And
Wireless communication system, with the flush type circuit in same encapsulation, wherein the configured for wireless communication is Xiang Suoshu At least one of PWM controller or first switch provide signal, to influence the output of the DC-DC converter.
36. a kind of DC-DC (DC-DC) power supply, comprising:
Integrated circuit, is located at the inside printed circuit board (PCB), and the integrated circuit includes:
First gallium nitride (GaN) switch is configured to the first driving signal driving of origin output from driver；And
2nd GaN switch is configured to by the second driving signal driving from the driver；
Inductor is located above the integrated circuit, at least partly accounts for the integrated circuit so that the inductor has The footprint of position region overlapping；And
The inductor and GaN switch are electrically coupled by via hole.
37. DC-DC power source according to claim 36, wherein the first GaN switch is the first enhancement type gallium nitride (eGaN) it switchs, the 2nd GaN switch is the 2nd eGaN switch.
38. power adapter according to claim 1 further includes capacitor；
Wherein, one or more of switches in the flush type circuit include:
First switch is coupled to the inductor by the capacitor；And
Second switch is coupled to the inductor；And
Wherein, the capacitor is coupled in series between the first switch and the second switch as AC coupling capacitor.
39. the power adapter according to claim 38 further includes the second inductor；
Wherein, one or more of switches in the flush type circuit further include:
Third switch, is coupled to the capacitor, the first switch and second inductor；And
4th switch is coupled to the third switch and second inductor.
40. the power adapter according to claim 38 is configured to DC-DC buck converter.
41. a kind of power supply system, comprising:
Multiple power adapters, are configured to provide for polyphase source, wherein according to each of the multiple power adapter Power adapter described in claim 40；And
Shared pulsewidth modulation (PWM) controller, is configured to generate multiple pwm signals, wherein the PWM controller is coupled to institute The multiple pwm signal, is passed to the corresponding drive of the power adapter by the driver for stating multiple power adapters Dynamic device, and wherein, the driver is configured to be based at least partially on the pwm signal and generate one or more and drive to believe Number.
42. power adapter according to claim 1, further includes: the second inductor,
Wherein, one or more of switches in the flush type circuit include:
A pair of switches is coupled to the inductor；And
Second pair of switch, is coupled to second inductor；
Wherein, the inductor includes the first winding being wound on core；And
Wherein, second inductor includes the second winding being wound on the core.
43. power adapter according to claim 1, further includes: the second inductor,
Wherein, one or more of switches in the flush type circuit include:
A pair of switches is configured to provide the first signal to the inductor；And
Second pair switch, coupling with to second inductor provide second signal, it is described second pair switch be configured to it is described A pair of switches out-phase is driven, and the second signal is configured to and the first signal out-phase.
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