CN110381689B - Shell structure, preparation method thereof and electronic equipment - Google Patents
Shell structure, preparation method thereof and electronic equipment Download PDFInfo
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- CN110381689B CN110381689B CN201910639132.1A CN201910639132A CN110381689B CN 110381689 B CN110381689 B CN 110381689B CN 201910639132 A CN201910639132 A CN 201910639132A CN 110381689 B CN110381689 B CN 110381689B
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- middle frame
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/062—Hermetically-sealed casings sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ
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- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
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Abstract
The application discloses a shell structure, a preparation method of the shell structure and electronic equipment. Specifically, the present application provides a shell structure, shell structure is used for electronic equipment, shell structure includes: glass apron and glass center, the glass apron is the screen cover board, the last depressed part that has of glass center, the overlap joint of glass apron is in on the depressed part, just the side reason of glass apron with sealed connecting portion have between the glass center, sealed connecting portion are through the formation of butt fusion glass frit. Therefore, the binding force between the glass cover plate and the glass middle frame is strong, the strength of the shell structure is high, the sealing performance is good, and when the shell structure is used for electronic equipment, the frame of the electronic equipment is narrow, and the appearance effect is good.
Description
Technical Field
The present application relates to the field of electronic devices, and in particular, to a housing structure, a manufacturing method thereof, and an electronic device.
Background
With the continuous development of the preparation technology in the field of electronic equipment, the shell material for the electronic equipment is also abundant. The glass material has the characteristics of good light transmission, corrosion resistance, heat resistance, easiness in processing and the like, and is commonly used for manufacturing screen cover plates, battery rear cover plates and the like of electronic equipment. In addition, in many current electronic products (such as mobile phones, etc.), the frame is also made of glass materials, so that a full-glass body can be realized, and the appearance consistency and the appearance expressive force of the electronic products are greatly improved.
However, the current housing structure, the manufacturing method thereof, and the electronic device still need to be improved.
Disclosure of Invention
The present application is based on the discovery and recognition by the inventors of the following facts and problems:
the inventor finds that the existing electronic equipment (such as a mobile phone and the like) adopting the glass screen cover plate and the glass middle frame has the problems of weak bonding force between the glass screen cover plate and the glass middle frame, poor sealing performance, wide dispensing width and the like, so that the appearance effect and the service performance of the electronic equipment are influenced. At present, glue (such as hot melt adhesive) is generally adopted to bond the glass screen cover plate with the glass middle frame, the sealing strength of the glue is low, the waterproof effect is poor, the dependency on gluing equipment and parameters is strong, and the product yield is low. In addition, in order to ensure the strength and the sealing property (for example, water resistance) of the glass screen cover plate after being bonded with the glass middle frame, when the glass screen cover plate is bonded with the glass middle frame by using glue, a certain glue dispensing width (i.e., the glue dispensing width between the side edge of the glass screen cover plate and the glass middle frame) is required, for example, in the currently manufactured electronic device, the glue dispensing width is usually greater than 0.5mm, so that the width of the screen frame of the electronic device is increased, the narrow frame of the electronic device is not facilitated, and the appearance effect of the electronic device is affected. Therefore, if a new shell structure can be provided, in the shell structure, the dispensing width between the glass screen cover plate and the glass middle frame is narrow, the bonding force between the glass screen cover plate and the glass middle frame is strong, the sealing performance is good, and the product yield is high, the problem can be solved to a great extent.
The present application is directed to solving, at least to some extent, one of the technical problems in the related art.
In one aspect of the present application, a housing structure is presented. The housing structure is for an electronic device, the housing structure comprising: glass apron and glass center, the glass apron is the screen cover board, the last depressed part that has of glass center, the overlap joint of glass apron is in on the depressed part, just the side reason of glass apron with sealed connecting portion have between the glass center, sealed connecting portion are through the formation of butt fusion glass frit. Therefore, the sealing connection part can well combine the glass cover plate with the glass middle frame, the strength of the shell structure is high, the sealing performance and the waterproof performance are good, the width of the sealing connection part is narrow, and when the shell structure is used for electronic equipment, the frame of the electronic equipment is narrow, the appearance effect is good, and the sealing performance is good.
In another aspect of the present application, a method of making the foregoing housing structure is presented. The method comprises the following steps: overlapping the glass cover plate on the concave part of the glass middle frame; and filling glass frit between the side edge of the glass cover plate and the glass middle frame, irradiating the glass frit by using laser beams, melting the glass frit, forming a sealing connection part, and forming the shell structure. Therefore, the method can simply and conveniently prepare the shell structure, the product yield is high, and the method has all the characteristics and beneficial effects of the shell structure, and is not repeated herein. Generally speaking, the shell structure prepared by the method is high in strength, good in sealing performance and waterproofness, and narrow in width of the sealing connection part, and when the shell structure is used for electronic equipment, the frame is narrow, the appearance effect is good, and the sealing performance is good.
In yet another aspect of the present application, an electronic device is presented. The electronic device includes: the housing structure as described above, the housing structure defining an accommodating space; the display module is arranged on one side, facing the interior of the electronic equipment, of the shell structure; mainboard and memory, mainboard and memory are located inside the accommodation space. Thus, the electronic device has all the features and advantages of the housing structure described above, and thus, the description thereof is omitted. Generally speaking, the electronic equipment has the advantages of narrow frame, good sealing performance and waterproofness, good appearance effect and good use performance.
Drawings
FIG. 1 shows a cross-sectional structural schematic of a housing structure according to one example of the present application;
FIG. 2 shows a schematic structural view of a housing structure according to an example of the present application;
FIG. 3 shows a schematic partial cross-sectional structure of a housing structure according to another example of the present application;
FIG. 4 illustrates a schematic partial cross-sectional structure of a housing structure according to yet another example of the present application;
FIG. 5 shows a flow chart of a method of preparing a housing structure according to an example of the present application;
FIG. 6 shows a flow chart of a method of making a housing structure according to another example of the present application;
FIG. 7 shows a flow chart of a method of preparing a housing structure according to yet another example of the present application; and
fig. 8 shows a schematic structural diagram of an electronic device according to an example of the application.
Description of reference numerals:
100: a glass cover plate; 200: a glass middle frame; 300: sealing the connection part; 400: a buffer section; 500: a display module; 600: a battery rear cover plate; 1000: a housing structure; 1100: an electronic device.
Detailed Description
Examples of the present application are described in detail below and are illustrated in the accompanying drawings. The examples described below with reference to the drawings are illustrative and intended to be used for explaining the present application and are not to be construed as limiting the present application.
In one aspect of the present application, a housing structure for an electronic device, such as a mobile phone, is presented. Referring to fig. 1 and 2 (fig. 1 is a schematic cross-sectional structure view along the direction AA' in fig. 2), the housing structure 1000 includes: the glass cover plate 100 is a screen cover plate, the glass center frame 200 has a recess (not shown), the glass cover plate 100 is overlapped on the recess, and the sealing connection 300 is provided between the side edge of the glass cover plate 100 and the glass center frame 200, the sealing connection 300 is formed by fusing frit, that is, the material forming the sealing connection 300 may be frit. Therefore, the glass cover plate 100 and the glass middle frame 200 can be fixedly welded and connected through the sealing connection part 300 formed by welding the glass frit to form the integrated shell structure 1000, and the shell structure 1000 has high mechanical strength, good sealing performance and water resistance, high transparency and good appearance integration effect because the sealing connection part 300, the glass cover plate 100 and the glass middle frame 200 are all made of glass materials and are fixedly welded and connected; the width of the sealing connection portion 300 may be relatively narrow, and when the housing structure 1000 is used in an electronic device, a frame of the electronic device may be relatively narrow, and the housing structure has a good appearance effect and good sealing performance.
As described above, in the electronic device manufactured by combining the glass screen cover plate and the glass middle frame in the current dispensing manner, the problems of weak bonding force, poor sealing performance, wide dispensing width and the like between the glass screen cover plate and the glass middle frame exist, and the appearance effect and the service performance of the electronic device are affected. And shell structure in this application, the sealing connection portion that forms through the frit of fusion welding is with glass apron and the butt fusion of glass center, and the shell structure's that forms intensity is stronger, and the leakproofness is better, and waterproof performance is good to sealing connection portion's width can be narrower, is favorable to electronic equipment's narrow frame, has further improved the outward appearance effect and the performance of using this shell structure's electronic equipment. In addition, when the sealing connection part is formed by the method of fusing the glass frits, the product yield is high. Specifically, when the glass screen cover plate and the glass middle frame are combined in a dispensing manner, the dependence on dispensing equipment and parameters is strong, the operation is complex, the product yield is low, the dispensing width is generally wide under the influence of the dispensing process precision; moreover, the sealing strength of the glue is low, and the waterproof effect is poor, so that the dispensing width needs to be wide in order to ensure the bonding strength and the sealing degree of the glass screen cover plate and the glass middle frame; in the application, when the glass cover plate and the glass middle frame are fixedly connected through the frit glass, the frit glass can form an integrated shell structure, the bonding strength is high, and the strength of the sealing connection part is also high (approximately equal to that of a glass material), so that the required width of the sealing connection part is narrow; a certain gap is reserved between the side edge of the glass cover plate and the glass middle frame in advance, and glass frit can be filled into the gap, and then the glass cover plate and the glass middle frame can be simply and conveniently fixedly connected through welding the glass frit, so that the operation process is simple and convenient; therefore, when the glass cover plate and the glass middle frame are fixedly connected through the frit, the glass cover plate and the glass middle frame are high in bonding strength and sealing degree, high in integration degree and good in appearance effect. In addition, because the sealing connection part is formed by the glass frit, the transparency of the sealing connection part is high, and therefore, after the shell structure is used for the electronic device, the frame width of the electronic device can be further reduced visually, and the narrow frame degree of the electronic device can be further improved.
Referring to fig. 1, a glass cover 100 is a screen cover, such as a screen cover of a mobile phone. Specifically, referring to fig. 4, a display module 500 (e.g., a liquid crystal display module, an organic light emitting display module, etc.) is disposed on a side (referring to an "inner" direction shown in the figure) of the glass cover 100 facing the inside of the electronic device, an edge of the glass cover 100 exceeds an edge of the display module 500, a portion of the glass cover 100 exceeding the display module 500 is an extension 110, and at least a portion of the extension 110 overlaps a recess (not shown) of the glass bezel 200. This allows the glass cover plate 100 and the glass center frame 200 to be easily connected. Specifically, the extending portion 110 may be completely overlapped with the recessed portion of the glass middle frame 200, so that the frame of the electronic device may be further reduced, and the appearance effect of the electronic device may be improved.
According to some examples of the present application, referring to fig. 1, the glass center frame 200 has a recess (not shown) adapted to overlap the glass cover plate 100. Specifically, the glass center 200 may have a thick glass sidewall, which may be cut to form a recess, and specifically, the glass center 200 may be subjected to a numerical control machining (CNC) process or the like to form a recess suitable for the overlapping of the glass cover plate 100. Specifically, the recess depth of the recess (refer to the recess depth L shown in fig. 1) may be the same as the thickness of the glass cover plate 100, and thus, the aesthetic property of the case structure 1000 may be further improved. Specifically, the depth L of the recess may be 0.5-0.8mm, for example, 0.6mm, and may be 0.7mm, so that the recess is suitable for overlapping the glass cover plate 100, and after the overlapping, the outer surface of the housing structure (refer to the "outer" direction shown in the figure) is flat, and the appearance effect is good. According to some examples of the present application, referring to fig. 1, the width d of the sealing connection 300 may be no greater than 0.3mm, e.g., may be 0.25mm, may be 0.2mm, etc. As mentioned above, when the glass screen cover plate and the glass middle frame are combined by using the dispensing method, the dispensing width is usually greater than 0.5mm, which is not favorable for realizing a narrow frame of the electronic device. The width of the sealing connection portion 300 is narrow, which is beneficial to narrowing the frame of the electronic device using the housing structure, and further improves the appearance effect of the electronic device using the housing structure.
Specifically, referring to fig. 1, the height of the sealing connection 300 may be the same as the recess depth L of the recess. Thus, the sealing joint 300 can preferably weld the glass cover plate 100 and the glass center frame 200.
Specifically, referring to fig. 3, the height of the sealing connection portion 300 may also be less than the recess depth L of the recess, one end of the sealing connection portion 300 may be flush with the outer surface of the glass cover plate 100, and a buffer portion 400 may be provided between the other end of the sealing connection portion 300 and the glass middle frame 200, wherein the modulus of the buffer portion 400 may be lower than that of the sealing connection portion 300. Therefore, the buffer part 400 has a buffer function, so that the risk of breakage of the glass cover plate and the glass middle frame can be reduced, and the service performance of the shell structure is improved; in addition, after the buffer part 400 is provided between the side edge of the glass cover plate 100 and the glass middle frame 200, the height of the sealing connection part 300 is small, which is convenient for the subsequent disassembly and repair of the glass cover plate. Specifically, the modulus of buffer 400 can be not more than 20GPa, and from this, the modulus of buffer 400 is less, and elasticity is better, has better cushioning effect, can further reduce the cracked risk of glass apron and glass center, improves this shell structure's performance. Specifically, the material forming the buffer portion 400 is not particularly limited, and may include, for example, a buffer paste or the like. For example, a cushion rubber usually installed at a coil spring of a suspension system of a vehicle may be used, so as to better perform a cushioning function. The cushion rubber is a rubber product with higher elasticity and higher toughness.
Specifically, referring to fig. 3, the height h of the buffer 4002May be 0.2-0.4mm, for example, 0.25mm, 0.3mm, or 0.35mm, and the height h of the sealing connection part 3001May be 0.2-0.4mm, for example, 0.25mm, 0.3mm, 0.35mm, etc., and thus, when the heights of the sealing connection part 300 and the buffer part 400 are within the above ranges, the connection strength and the sealing property between the glass cover plate 100 and the glass middle frame 200 can be ensured, the risk of the glass cover plate 100 and the glass middle frame 200 being broken can be reduced, and the glass cover plate can be conveniently disassembled and repaired, etcFurther improving the usability of the housing structure 1000. Specifically, referring to fig. 4, when the glass cover plate 100 and the glass middle frame 200 are welded, since the display module 500 is usually already disposed on the side of the glass cover plate 100 facing the inside of the electronic device, when the height of the sealing connection portion 300 is large (i.e., the buffer portion 400 is not disposed, or the height of the buffer portion 400 is small), the performance of the display module 500 is easily affected during the process of welding the frit glass to form the sealing connection portion 300. Accordingly, the height h of the cushioning portion 4002In the above range (0.2-0.4mm), the sealing connection portion 300 and the display module 500 formed by welding can be ensured to have a certain distance, so that the performance of the display module 500 is prevented from being affected by the welding process, and the reliability of welding can be ensured, i.e., the bonding strength of the sealing connection portion 300 when the glass substrate 100 and the glass middle frame 200 are fixedly connected is ensured.
According to some examples of the present application, referring to fig. 4, the case structure 1000 may further include a battery back cover plate 600, and the battery back cover plate 600 may be glass. Specifically, the battery back cover 600 and the glass middle frame 200 may be bonded by the aforementioned method of connecting the glass cover 100 and the glass middle frame 200, that is, the battery back cover 600 may be overlapped on the glass middle frame 200 and welded by a sealing connection part (not shown) formed by welding frit glass, thereby improving the bonding strength and the sealing property of the battery cover 600 and the glass middle frame 200. Alternatively, the battery back cover plate 600 and the glass middle frame 200 may be integrally formed. Therefore, the method is beneficial to preparing the electronic equipment shell with the all-glass body, and further improves the appearance consistency and appearance expressive force of the electronic equipment.
In summary, in the case structure 1000 of the present application, the sealing connection portion 300 can better combine the glass cover plate 100 and the glass middle frame 200, the strength of the case structure 1000 is high, the sealing performance and the waterproof performance are good, the width of the sealing connection portion 300 is narrow, and when the case structure 1000 is used in an electronic device, the frame of the electronic device is narrow, the appearance effect is good, and the sealing performance is good.
In another aspect of the present application, a method of making a housing structure is presented. According to some examples of the present application, the shell structure prepared by the method may be the shell structure described above, and thus, the shell structure prepared by the method has all the features and advantages of the shell structure described above, which are not described herein again. Generally speaking, the shell structure prepared by the method is high in structural strength, good in sealing performance and waterproofness, and narrow in width of the sealing connection part, and when the shell structure is used for electronic equipment, the frame is narrow, the appearance effect is good, and the sealing performance is good.
According to some examples of the present application, referring to fig. 5, the method comprises:
s100: overlapping the glass cover plate on the concave part of the glass middle frame
In this step, a glass cover plate is lapped on the concave portion of the glass center frame. Specifically, the glass cover plate and the glass middle frame may be as described above, and are not described herein again. For example, the glass cover plate is a screen cover plate, and one side of the glass cover plate facing the inside of the electronic device is provided with a display module and the like; for example, the depth of the recess may be 0.5-0.8 mm.
S200: forming a sealed joint
In this step, a frit is filled between the side edge of the glass cover plate and the glass center, and the frit is irradiated with a laser beam to melt the frit, forming a sealing joint. Specifically, a glass frit can be filled between the side edge of the glass cover plate and the glass middle frame, and a laser generator is adopted to enable a laser beam to move along the glass frit at a preset sealing speed so as to sequentially heat the glass frit and melt the glass frit, so that the glass cover plate and the glass middle frame are completely connected and sealed to form a sealing connection part. Therefore, the method can simply and conveniently form the sealing connection part, the product yield is high, the width of the sealing connection part can be narrow, for example, the width can be not more than 0.3mm, the narrow frame of the electronic equipment with the shell structure prepared by the method is further facilitated, and the electronic equipment is high in strength, good in waterproofness and good in sealing performance.
According to some examples of the present application, in order to further improve the usability of the prepared case structure, in the method, after lapping the glass cover plate on the recess of the glass center frame and before forming the sealing connection, referring to fig. 6, the method may further include:
s300: forming a buffer part
In the step, a buffer material is filled between the side edge of the glass cover plate and the glass middle frame to form a buffer part. Specifically, the height of the buffer part is not more than the depth of the concave part of the glass middle frame, and the modulus of the buffer material is less than that of the glass frit. Therefore, the buffer part has a buffer function, the risk of breakage of the glass cover plate and the glass middle frame can be reduced, and the service performance of the shell structure prepared by the method is improved; and, after setting up the buffer part, the height of sealing connection portion is less, has reduced the sintering degree of depth when laser sintering forms sealing connection portion promptly, is convenient for follow-up disassembles the glass apron and reprocesses etc.. In particular, the buffer may be as described above, for example the buffer may have a height of 0.2-0.4mm and the height h of the sealing connection may be1May be 0.2-0.4mm, etc.
According to some examples of the present application, in order to further improve the usability of the prepared shell structure, in the method, after forming the sealing connection, referring to fig. 7, the method may further include:
s400: performing post-treatment
In the step, the sealing connection part is subjected to post-treatment, and the surface of the sealing connection part facing to the outer side of the electronic equipment is flush with the outer surface of the glass cover plate. Specifically, the outer surface of the sealing connection part can be processed, so that the connection positions of the sealing connection part, the glass cover plate and the glass middle frame are smooth and attractive, and the attractiveness and appearance consistency of the shell structure are further improved.
In yet another aspect of the present application, an electronic device is presented. According to some examples of the present application, referring to fig. 8, the electronic device 1100 includes: the housing structure 1000, the display module, the motherboard and the memory (not shown in the figure) are described above, the housing structure 1000 defines an accommodating space, the display module is disposed on one side of the housing structure 1000 facing the inside of the electronic device, and the motherboard and the memory are located inside the accommodating space. Thus, the electronic device 1100 has all the features and advantages of the housing structure 1000 or the housing structure prepared by the method described above, which are not described herein again. Generally speaking, the electronic equipment has the advantages of narrow frame, good sealing performance and waterproofness, good appearance effect and good use performance.
For example, the electronic device may be any of various types of computer system devices that are mobile or portable and that perform wireless communications. In particular, the electronic device may be a mobile or smart phone (e.g., an iPhone (TM) based phone), a Portable gaming device (e.g., Nintendo DS (TM), PlayStation Portable (TM), Gameboy Advance (TM), iPhone (TM)), a laptop, a PDA, a Portable internet device, a music player, and a data storage device, other handheld devices, and a headset such as a watch, an in-ear headphone, a pendant, a headset, etc., and other wearable devices (e.g., a Head Mounted Device (HMD) such as an electronic necklace, an electronic garment, an electronic bracelet, an electronic necklace, an electronic tattoo, an electronic device, or a smart watch).
The electronic device may also be any of a number of electronic devices including, but not limited to, cellular phones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders, video recorders, cameras, other media recorders, radios, medical devices, vehicle transportation equipment, calculators, programmable remote controllers, pagers, laptop computers, desktop computers, printers, netbook computers, Personal Digital Assistants (PDAs), Portable Multimedia Players (PMPs), moving picture experts group (MPEG-1 or MPEG-2) audio layer 3(MP3) players, portable medical devices, and digital cameras and combinations thereof.
In some cases, the electronic device may perform a variety of functions (e.g., playing music, displaying videos, storing pictures, and receiving and sending telephone calls). If desired, the electronic device may be a portable device such as a cellular telephone, media player, other handheld device, wristwatch device, pendant device, earpiece device, or other compact portable device.
In the description herein, references to the description of the term "one example," "some examples," or the like, mean that a particular feature, structure, material, or characteristic described in connection with the example or example is included in at least one example or example of the application. In this specification, a schematic representation of the above terms does not necessarily refer to the same example or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more examples or examples. Moreover, various examples or examples and features of different examples or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
In the description of the present application, it is to be understood that the terms "outer", "inner", "width", "thickness", "height", "depth of depression", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application.
Although examples of the present application have been shown and described above, it is understood that the above examples are illustrative and are not to be construed as limiting the present application and that variations, modifications, substitutions and alterations in the above examples may be made by those of ordinary skill in the art within the scope of the present application.
Claims (14)
1. A case structure for an electronic device, comprising: the glass cover plate is a screen cover plate, the glass middle frame is of a square frame structure, a concave part is arranged at the edge of the inner side of the glass middle frame, the glass cover plate is in lap joint with the concave part, a sealing connecting part is arranged between the side edge of the glass cover plate and the glass middle frame, the sealing connecting part is formed by welding frit, and the glass cover plate and the glass middle frame are welded by the sealing connecting part to form the integrated shell structure;
the height of the sealing connection part is smaller than the sunken depth of the sunken part, one end of the sealing connection part is flush with the outer surface of the glass cover plate, and a buffer part is arranged between the other end of the sealing connection part and the glass middle frame.
2. A housing structure according to claim 1, characterized in that the width of the sealing connection is not more than 0.3 mm.
3. The housing structure according to claim 1, wherein a recess depth of the recess portion is the same as a thickness of the glass cover plate.
4. The shell structure of claim 1, wherein the depression has a depression depth of 0.5-0.8 mm.
5. The housing structure according to claim 1, characterized in that the modulus of the buffer portion is lower than the modulus of the sealing connection portion.
6. The case structure according to claim 1, wherein the modulus of the cushioning portion is not more than 20 GPa; the material forming the buffer part comprises buffer glue.
7. The housing structure according to claim 1, characterized in that the height of the buffer is 0.2-0.4mm and the height of the sealing connection is 0.2-0.4 mm.
8. The casing structure of claim 1, wherein a side of the glass cover plate facing the inside of the electronic device is provided with a display module, an edge of the glass cover plate exceeds an edge of the display module, a part of the glass cover plate exceeding the display module is an extension part, and at least a part of the extension part overlaps with the recess part.
9. The housing structure of claim 1, further comprising a battery back cover plate, the battery back cover plate and the glass center frame being integrally formed.
10. A method of making the shell structure of any one of claims 1-9, comprising:
overlapping a glass cover plate on a concave part of a glass middle frame, wherein the glass middle frame is of a square frame-shaped structure, and the concave part is positioned at the edge of the inner side of the glass middle frame;
filling a buffer material between the side edge of the glass cover plate and the glass middle frame to form a buffer part, wherein the height of the buffer part is not more than the concave depth of the concave part;
filling glass frit between the side edge of the glass cover plate and the glass middle frame, irradiating the glass frit by using laser beams, melting the glass frit to form a sealing connection part, and welding the glass cover plate and the glass middle frame by using the sealing connection part to form an integrated shell structure;
the height of the sealing connection part is smaller than the sunken depth of the sunken part, one end of the sealing connection part is flush with the outer surface of the glass cover plate, and the other end of the sealing connection part is provided with the buffer part.
11. The method of claim 10, wherein the forming a sealed connection further comprises:
moving the laser beam along the frit at a predetermined sealing speed to heat the frit and melt the frit to form the sealed joint.
12. The method of claim 10, wherein the modulus of the buffer material is less than the modulus of the glass frit.
13. The method of claim 10, wherein after the forming the sealed connection, the method further comprises:
and carrying out post-treatment on the sealing connection part, and enabling the surface of the sealing connection part facing to one side of the outside of the electronic equipment to be flush with the outer surface of the glass cover plate.
14. An electronic device, comprising:
the housing structure of any one of claims 1-9, defining a containment space;
the display module is arranged on one side, facing the interior of the electronic equipment, of the shell structure;
mainboard and memory, mainboard and memory are located inside the accommodation space.
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| CN201910639132.1A CN110381689B (en) | 2019-07-16 | 2019-07-16 | Shell structure, preparation method thereof and electronic equipment |
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| CN110381689A CN110381689A (en) | 2019-10-25 |
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| CN110818236B (en) * | 2019-11-16 | 2024-01-23 | 中建材玻璃新材料研究院集团有限公司 | Sealing mold and sealing method for middle glass frame and rear glass cover of mobile phone |
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| CN108650352A (en) * | 2018-05-11 | 2018-10-12 | Oppo广东移动通信有限公司 | Shell, electronic device and method for producing shell |
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| KR101298970B1 (en) * | 2013-03-12 | 2013-08-22 | 주식회사 파티클로지 | Low melting temperature glass frit composition for laser sealing, low melting temperature glass frit using the same and sealing method of amoled using the low melting temperature glass frit |
| CN204350507U (en) * | 2014-12-04 | 2015-05-20 | 昂纳信息技术（深圳）有限公司 | Can |
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| CN108476251B (en) * | 2016-12-26 | 2021-01-29 | 华为技术有限公司 | Shell assembly, mobile terminal and assembly method of shell assembly |
| WO2018171094A1 (en) * | 2017-03-19 | 2018-09-27 | 华为技术有限公司 | Housing, terminal, and method for manufacturing housing |
| CN207529273U (en) * | 2017-11-27 | 2018-06-22 | 维沃移动通信有限公司 | Electronic equipment |
| CN109166848A (en) * | 2018-08-28 | 2019-01-08 | 深圳市大源光电科技有限公司 | A kind of LED illumination lamp |
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| CN108650352A (en) * | 2018-05-11 | 2018-10-12 | Oppo广东移动通信有限公司 | Shell, electronic device and method for producing shell |
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