CN110381689A - Shell structure and preparation method thereof, electronic equipment - Google Patents
Shell structure and preparation method thereof, electronic equipment Download PDFInfo
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- CN110381689A CN110381689A CN201910639132.1A CN201910639132A CN110381689A CN 110381689 A CN110381689 A CN 110381689A CN 201910639132 A CN201910639132 A CN 201910639132A CN 110381689 A CN110381689 A CN 110381689A
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- glass
- shell structure
- sealed connection
- plate
- connection portion
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/062—Hermetically-sealed casings sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
This application discloses shell structures and preparation method thereof, electronic equipment.Specifically, present applicant proposes a kind of shell structures, the shell structure is used for electronic equipment, the shell structure includes: glass cover-plate and glass center, the glass cover-plate is screen cover board, has recessed portion on the glass center, the glass cover-plate is overlapped on the recessed portion, and there is sealed connection portion between the side edge of the glass cover-plate and the glass center, the sealed connection portion is formed by welding glass material.Binding force as a result, between the glass cover-plate and glass center is stronger, and the intensity of the shell structure is higher, and leakproofness is good, and the shell structure be used for electronic equipment when, the frame of electronic equipment is relatively narrow, and appearance is good.
Description
Technical field
This application involves field of electronic devices, and in particular, to shell structure and preparation method thereof, electronic equipment.
Background technique
With the continuous development of field of electronic device technology of preparing, case material for electronic equipment also enriches therewith.
Glass material has the characteristics that good translucency, corrosion resistance, heat resistance and easy to process, is commonly used to production electronic equipment
Screen cover board, cell rear cover cover board etc..Also, current many electronic products (such as mobile phone etc.), center also uses glass
The production of glass material, thus, it is possible to realize full glass fuselage, greatly improves the appearance consistency and appearance of electronic product
Power.
However, current casing mechanism and preparation method thereof, electronic equipment still have much room for improvement.
Summary of the invention
The application is to be made based on inventor to the discovery of following facts and problem and understanding:
Inventors have found that using the electronic equipment (such as mobile phone etc.) of glass screen cover board and glass center at present, exist
The problems such as binding force between glass screen cover board and glass center is weak, leakproofness is poor and dispensing wider width, to influence electricity
The appearance and service performance of sub- equipment.Generalling use glue (such as hot melt adhesive) at present will be in glass screen cover board and glass
Frame is bonded, and the sealing intensity of glue is lower, and waterproof effect is poor, and stronger to spot gluing equipment and parameter dependence, is produced
Product yield is lower.Also, in order to guarantee the intensity after glass screen cover board is Nian Jie with glass center and leakproofness (such as waterproofness
Deng), when being bonded glass screen cover board and glass center using glue, need certain dispensing width (dispensing width i.e. glass
The width of glue between the side edge and glass center of glass screen cover board), such as in the electronic equipment that makes at present, dispensing is wide
Degree is typically larger than 0.5mm and is unfavorable for the narrow frame of electronic equipment to increase the width of the screen frame of electronic equipment,
Influence the appearance of electronic equipment.Therefore, if a kind of new shell structure can be proposed, in the shell structure, glass screen
Dispensing narrower width between cover board and glass center, and the binding force between glass screen cover board and glass center is strong, sealing
Property is good, and product yield is higher, will largely solve the above problems.
The application is intended to solve at least some of the technical problems in related technologies.
In the one aspect of the application, present applicant proposes a kind of shell structures.The shell structure is used for electronic equipment,
The shell structure includes: glass cover-plate and glass center, and the glass cover-plate is screen cover board, is had on the glass center
There is recessed portion, the glass cover-plate is overlapped on the recessed portion, and the side edge of the glass cover-plate and the glass center
Between have sealed connection portion, the sealed connection portion is formed by welding glass material.The sealed connection portion can be with as a result,
Preferably glass cover-plate and glass center are combined, the intensity of the shell structure is higher, and leakproofness and waterproofness are good, and should
The narrower width in sealed connection portion, when which is used for electronic equipment, the frame of electronic equipment is relatively narrow, and appearance is good
It is good, and leakproofness is good.
In further aspect of the application, present applicant proposes a kind of methods for preparing mentioned-above shell structure.It should
Method includes: to be overlapped on glass cover-plate on the recessed portion of glass center；Side edge and the glass in the glass cover-plate
Filling glass material between center irradiates the frit using laser beam, enables described frit melted, formation sealed connection portion,
Form the shell structure.This method can easily prepare mentioned-above shell structure as a result, and product yield is higher, and
This method has whole feature and beneficial effect possessed by mentioned-above shell structure, and details are not described herein.Total comes
It says, the shell structure intensity of this method preparation is higher, and leakproofness and waterproofness are good, and the narrower width in sealed connection portion,
When the shell structure is used for electronic equipment, frame is relatively narrow, and appearance is good, and leakproofness is good.
In the another aspect of the application, present applicant proposes a kind of electronic equipment.The electronic equipment includes: noted earlier
Shell structure, the shell structure limits accommodation space；Display module, the display module are arranged in the shell structure
Towards the side of the inside of the electronic equipment；It is empty that mainboard and memory, the mainboard and memory are located at the receiving
Between it is internal.As a result, the electronic equipment have the advantages that whole feature possessed by mentioned-above shell structure and, herein no longer
It repeats.Generally speaking, the electronic equipment frame is relatively narrow, and leakproofness and waterproofness are preferable, and appearance is good, service performance compared with
It is good.
Detailed description of the invention
Fig. 1 shows the schematic diagram of the section structure according to one exemplary shell structure of the application；
Fig. 2 shows the structural schematic diagram according to one exemplary shell structure of the application；
Fig. 3 shows the cut-away section structural schematic diagram of another exemplary shell structure according to the application；
Fig. 4 shows the cut-away section structural schematic diagram of another exemplary shell structure according to the application；
Fig. 5 shows the method flow diagram according to the application one exemplary preparation shell structure；
Fig. 6 shows the method flow diagram of another exemplary preparation shell structure according to the application；
Fig. 7 shows the method flow diagram of another exemplary preparation shell structure according to the application；And
Fig. 8 shows the structural schematic diagram according to one exemplary electronic equipment of the application.
Description of symbols:
100: glass cover-plate；200: glass center；300: sealed connection portion；400: buffer part；500: display module；600:
Cell rear cover cover board；1000: shell structure；1100: electronic equipment.
Specific embodiment
The example of the application is described below in detail, the example is shown in the accompanying drawings.Below with reference to attached drawing description
Example is exemplary, it is intended to for explaining the application, and should not be understood as the limitation to the application.
In the one aspect of the application, present applicant proposes a kind of shell structure, which is used for electronic equipment, example
Such as mobile phone.According to some examples of the application, with reference to Fig. 1 and Fig. 2, (Fig. 1 is that the cross section structure in the direction AA ' shows along Fig. 2
It is intended to), which includes: glass cover-plate 100, glass center 200 and sealed connection portion 300, wherein glass cover
Plate 100 is screen cover board, has recessed portion (not marking in figure) on glass center 200, glass cover-plate 100 is overlapped on recessed portion
On, and there is sealed connection portion 300 between the side edge of glass cover-plate 100 and glass center 200, sealed connection portion 300 is logical
The formation of welding frit is crossed, in other words, the material in sealed connection portion 300 is formed, can be frit.As a result, by molten
The sealed connection portion 300 for connecing frit formation, can be preferably affixed by glass cover-plate 100 and 200 welding of glass center, is formed
Integrated shell structure 1000, since sealed connection portion 300, glass cover-plate 100 and glass center 200 are glass material
Formed, and by welding it is affixed after, the high mechanical strength of the shell structure 1000, leakproofness and waterproofness are good, and
Transparency is higher, and appearance integration effect is preferable；And the width in the sealed connection portion 300 can be relatively narrow, the shell structure
1000 be used for electronic equipment when, the frame of electronic equipment can be relatively narrow, and appearance is good, and leakproofness is good.
As previously mentioned, glass screen cover board and glass center to be combined to using mode for dispensing glue the electronic equipment of production at present
In, it the problems such as that there are the binding forces between glass screen cover board and glass center is weak, leakproofness is poor and dispensing wider width, influences
The appearance and service performance of electronic equipment.And the shell structure in the application, connected by the sealing that welding glass material is formed
Socket part is by glass cover-plate and glass center welding, and the intensity of the shell structure of formation is stronger, and leakproofness is preferable, and waterproof performance is good
It is good, and the width in sealed connection portion can be relatively narrow, is conducive to the narrow frame of electronic equipment, further improves and uses the shell
The appearance and service performance of the electronic equipment of body structure.In addition, being produced when the method for welding glass material forms sealed connection portion
Product yield is higher.Specifically, when being combined glass screen cover board and glass center using mode for dispensing glue, to spot gluing equipment and ginseng
Number dependence is stronger, and complicated for operation, product yield is lower, and is influenced by gluing process precision, and dispensing width is usually wider；And
And since the sealing intensity of glue itself is lower, waterproof effect is poor, therefore, in order to guarantee in glass screen cover board and glass
The bond strength and seal degree of frame, dispensing width are also required to wider；And in the application, by welding glass material by glass cover-plate
When affixed with glass center, welding glass material can form integrated shell structure, and bond strength is higher, and the sealed connection
The intensity in portion itself is also higher (intensity for being approximately equal to glass material), it is therefore desirable to sealed connection portion narrower width；And
Only need certain gap is reserved between the side edge of glass cover-plate and glass center in advance, and frit can be filled to
The gap can be easily affixed by glass cover-plate and glass center subsequently through the welding frit, operating procedure letter
Just；Therefore, when by welding glass material by glass cover-plate and affixed glass center, the bond strength of glass cover-plate and glass center
With seal degree height, integrated degree is high, and appearance is good.Further, since the sealed connection portion is formed by frit,
Therefore, the transparency in the sealed connection portion is higher, therefore, can be visually after which is used for electronic equipment
The border width for further decreasing electronic equipment further increases the narrow frame degree of electronic equipment.
According to an embodiment of the invention, glass cover-plate 100 is screen cover board, for example, the screen cover board of mobile phone with reference to Fig. 1
Deng.Specifically, glass cover-plate 100 has towards the side (the "inner" direction with reference to shown in figure) of electronic equipment internal with reference to Fig. 4
Have display module 500 (such as liquid crystal display die set, organic light emitting display mould group etc.), the edge of glass cover-plate 100 is beyond display
The edge of mould group 500, and the part beyond display module 500 of glass cover-plate 100 is extension 110, extension 110 is at least
A part and the recessed portion (not shown) of glass center 200 overlap.Thus, it is possible to easily by glass cover-plate 100 and glass
Glass center 200 connects.Specifically, extension 110 can be overlapped all with the recessed portion of glass center 200, thus, it is possible into one
Step reduces the frame of electronic equipment, improves the appearance of electronic equipment.
According to some examples of the application, with reference to Fig. 1, glass center 200 has recessed portion (not marking in figure), the recess
Portion is overlapped suitable for glass cover-plate 100.Specifically, glass center 200 can have thicker side wall glass, it can be thicker to this
Side wall glass carries out cutting process, to form recessed portion, specifically, can carry out numerical control processing processing to glass center 200
(CNC) etc., it is suitable for glass cover-plate 100 overlapped recessed portion to be formed.Specifically, the cup depth of recessed portion is (with reference in Fig. 1
Shown cup depth L) can be identical with the thickness of glass cover-plate 100, thus, it is possible to further increase the shell structure
1000 aesthetics.It specifically, the cup depth L of recessed portion can be 0.5-0.8mm, such as can be 0.6mm, Ke Yiwei
0.7mm etc., as a result, the recessed portion be suitable for glass cover-plate 100 overlap joint, and overlap after the shell structure outer surface (with reference to figure
Shown in "outside" direction) it is more smooth, appearance is preferable.It is tightly connected according to some examples of the application with reference to Fig. 1
The width d in portion 300 can be not more than 0.3mm, such as can be 0.25mm, can be 0.2mm etc..As previously mentioned, using at present
When method for dispensing glue combines glass screen cover board and glass center, dispensing width is typically larger than 0.5mm, is unfavorable for realizing electronics
The narrow frame of equipment.And the narrower width in the sealed connection portion 300 in the application, be conducive to set using the electronics of the shell structure
Standby narrow frame further improves the appearance of the electronic equipment using the shell structure.
Specifically, the height in sealed connection portion 300 can be identical with the cup depth L of recessed portion with reference to Fig. 1.As a result, should
It sealed connection portion 300 can be preferably by 200 welding of glass cover-plate 100 and glass center.
Specifically, the height in sealed connection portion 300 might be less that the cup depth L of recessed portion with reference to Fig. 3, sealing connects
It one end of socket part 300 can be with the flush with outer surface of glass cover-plate 100, the other end and glass center 200 in sealed connection portion 300
Between have buffer part 400, wherein the modulus of buffer part 400 can be lower than sealed connection portion 300 modulus.The buffering as a result,
Portion 400 has buffer function, can reduce the risk of glass cover-plate and the rupture of glass center, improves the usability of the shell structure
Energy；Also, after buffer part 400 is set between the side edge of glass cover-plate 100 and glass center 200, sealed connection portion 300
Height it is smaller, convenient for it is subsequent to glass cover-plate carry out dismantling reprocess.Specifically, the modulus of buffer part 400 can be not more than
20Gpa, the modulus of buffer part 400 is smaller as a result, and elasticity preferably, has preferable buffer function, can further decrease glass
The risk of cover board and the rupture of glass center, improves the service performance of the shell structure.Specifically, forming the material of buffer part 400
It is not particularly limited, such as may include buffering adhesive etc..For example, the spiral commonly used to be mounted on automobile suspension system can be used
Buffering adhesive at spring, so as to preferably play the role of buffering and shock preventing.This kind of buffering adhesive be it is a kind of have higher elasticity and
Compared with the rubber product of high tenacity.
Specifically, with reference to Fig. 3, the height h of buffer part 4002It can be 0.2-0.4mm, such as can be 0.25mm, it can be with
It can be 0.35mm etc., the height h in sealed connection portion 300 for 0.3mm1It can be 0.2-0.4mm, such as can be 0.25mm,
It can be 0.3mm, can be 0.35mm etc., the height of sealed connection portion 300 and buffer part 400 is respectively in above range as a result,
When, it not only can guarantee the bonding strength and leakproofness between glass cover-plate 100 and glass center 200, but also can reduce glass cover-plate
100 and 200 fragmentation of glass center risk, and convenient for glass cover-plate carry out dismantling reprocess, further improve shell knot
The service performance of structure 1000.Specifically, with reference to Fig. 4, when glass cover-plate 100 and glass center 200 are carried out welding, due to glass
Glass cover board 100 is usually already provided with display module 500 towards the side of electronic equipment internal, therefore, sealed connection portion 300
When highly larger (be not provided with buffer part 400 or buffer part 400 height it is smaller when), form sealing in welding glass material and connect
During socket part 300, it is easy to impact the performance of display module 500.Therefore, the height h of buffer part 4002Above-mentioned
When range (0.2-0.4mm), it is ensured that there is certain distance in the sealed connection portion 300 and display module 500 that welding is formed, avoid
Fusion process impacts the performance of display module 500, and also can guarantee the reliability of welding, i.e. guarantee sealed connection portion
Bond strength when 300 affixed glass substrates 100 and glass center 200.
According to some examples of the application, with reference to Fig. 4, shell structure 1000 may further include cell rear cover cover board
600, cell rear cover cover board 600 can be glass.Specifically, before cell rear cover cover board 600 and glass center 200 can use
The method that glass cover-plate 100 described in face and glass center 200 connect is combined, i.e., cell rear cover cover board 600 can also be taken
It connects on frame 200 in glass, and welding (not shown) is carried out by the sealed connection portion that welding glass material is formed, by
This, can be improved the bond strength and leakproofness of battery cover board 600 and glass center 200.Alternatively, cell rear cover cover board 600 is
It can be with glass center 200 integrally formed.Be conducive to prepare the casting of electronic device of full glass fuselage as a result, further
Improve the appearance consistency and appearance power of electronic equipment.
In summary, the shell structure 1000 in the application, sealed connection portion 300 can be preferably by glass cover-plates 100
It is combined with glass center 200, the intensity of the shell structure 1000 is higher, and leakproofness and waterproofness are good, and the sealed connection
The narrower width in portion 300, when which is used for electronic equipment, the frame of electronic equipment is relatively narrow, and appearance is good,
And leakproofness is good.
In further aspect of the application, present applicant proposes a kind of methods for preparing shell structure.According to the application's
The shell structure of some examples, this method preparation can be mentioned-above, and shell structure prepared by this method has as a result,
Whole feature and beneficial effect possessed by mentioned-above shell structure, details are not described herein.Generally speaking, this method
The shell structure intensity of preparation is higher, and leakproofness and waterproofness are good, and the narrower width in sealed connection portion, the shell structure
When for electronic equipment, frame is relatively narrow, and appearance is good, and leakproofness is good.
According to some examples of the application, with reference to Fig. 5, this method comprises:
S100: glass cover-plate is overlapped on the recessed portion of glass center
In this step, glass cover-plate is overlapped on the recessed portion of glass center.Specifically, in glass cover-plate and glass
Frame can be mentioned-above, and details are not described herein.For example, glass cover-plate is screen cover board, glass cover-plate is towards electronic equipment
Internal side has display module etc.；Such as the cup depth of recessed portion can be 0.5-0.8mm etc..
S200: sealed connection portion is formed
In this step, the filling glass material between the side edge of glass cover-plate and glass center, and shone using laser beam
Frit is penetrated, frit melted, formation sealed connection portion is enabled.Specifically, can be in the side edge and glass center of glass cover-plate
Between filling glass material, and use laser generator, enable laser beam with scheduled sealing speed, moved along frit, with suitable
Secondary heated frit, enables frit melted, realizes being fully connected and sealing for glass cover-plate and glass center, is formed and be tightly connected
Portion.This method can be simply forming sealed connection portion as a result, and product yield is high, also, the width in the sealed connection portion can
With relatively narrow, such as 0.3mm can be not more than, and then be conducive to the narrow side of the electronic equipment of the shell structure prepared using this method
Frame, and the intensity of the electronic equipment is higher, and waterproofness is preferable, and leakproofness is preferable.
According to some examples of the application, in order to further increase the service performance of prepared shell structure, this method
In, on the recessed portion that glass cover-plate is overlapped on glass center after, before forming sealed connection portion, with reference to Fig. 6, the party
Method may further include:
S300: buffer part is formed
In the step, filling buffering material, forms buffer part between the side edge and glass center of glass cover-plate.Specifically
, the modulus that the height of buffer part is not more than the cup depth of the recessed portion of glass center, and buffers material is less than the mould of frit
Amount.The buffer part has buffer function as a result, can reduce the risk of glass cover-plate and the rupture of glass center, improves this method
The service performance of the shell structure of preparation；Also, after buffer part is arranged, the height in sealed connection portion is smaller, that is, reduces laser
Sintering depth when sintering forms sealed connection portion carries out dismantling to glass cover-plate and reprocesses convenient for subsequent.Specifically, buffer part
It can be mentioned-above, such as the height of buffer part can be 0.2-0.4mm, the height h in sealed connection portion1It can be 0.2-
0.4mm etc..
According to some examples of the application, in order to further increase the service performance of prepared shell structure, this method
In, after forming sealed connection portion, with reference to Fig. 7, this method be may further include:
S400: it is post-processed
In the step, sealed connection portion is post-processed, enables sealed connection portion towards the table of electronic device exterior side
The flush with outer surface in face and glass cover-plate.Specifically, can handle the outer surface in sealed connection portion, so that being tightly connected
The link position of portion and glass cover-plate and glass center is more smooth and beautiful, further improves the beauty of the shell structure
Property and appearance consistency.
In the another aspect of the application, present applicant proposes a kind of electronic equipment.According to some examples of the application, ginseng
Fig. 8 is examined, which includes: mentioned-above shell structure 1000, display module, mainboard and memory (in figure
It is not shown), shell structure 1000 limits accommodation space, and shell structure 1000 is arranged in towards in electronic equipment in display module
The side in portion, mainboard and memory are located inside accommodation space.The electronic equipment 1100 has mentioned-above shell as a result,
Whole feature and advantage possessed by shell structure prepared by structure 1000 or mentioned-above method, it is no longer superfluous herein
It states.Generally speaking, the electronic equipment frame is relatively narrow, and leakproofness and waterproofness are preferable, and appearance is good, and service performance is preferable.
Illustratively, electronic equipment can be various types of departments of computer science that are mobile or portable and executing wireless communication
Any one of equipment of uniting.Specifically, electronic equipment can be mobile phone or smart phone (for example, being based on iPhone
TM, the phone based on Android TM), portable gaming device (such as Nintendo DS TM, PlayStation
Portable TM, Gameboy Advance TM, iPhone TM), laptop computer, PDA, portable Internet appliance, sound
Happy player and data storage device, other handheld devices and such as wrist-watch, In-Ear Headphones, pendant, headphone
It can also be other wearable devices (for example, such as electronic glasses, electronics clothes, electronics bracelet, electronics Deng, electronic equipment
Necklace, electronics tatoo, the headset equipment (HMD) of electronic equipment or smartwatch).
Electronic equipment can also be that any one of multiple electronic equipments, multiple electronic equipments include but is not limited to honeycomb
Phone, smart phone, other wireless telecom equipments, personal digital assistant, audio player, other media players, music note
It records device, video recorder, camera, other medium recorders, radio, Medical Devices, vehicle transport instrument, calculator, may be programmed
Remote controler, pager, laptop computer, desktop computer, printer, netbook computer, personal digital assistant (PDA), just
Formula multimedia player (PMP), Motion Picture Experts Group (MPEG-1 or MPEG-2) audio layer 3 (MP3) player are taken, it is portable
Medical Devices and digital camera and combinations thereof.
In some cases, electronic equipment can execute multiple functions and (for example, playing music, show video, store picture
And send and receive call).If desired, electronic equipment can be such as cellular phone, media player, other hands
The portable device of holding equipment, watch equipment, pendant equipment, receiver device or other compact portable equipment.
In the description of this specification, the description of reference term " example ", " some examples " etc. means to show in conjunction with this
Example or example particular features, structures, materials, or characteristics described are contained at least one example or example of the application.?
In this specification, schematic expression of the above terms are necessarily directed to identical example or example.Moreover, the tool of description
Body characteristics, structure, material or feature can be combined in any suitable manner in any one or more examples or example.In addition,
Without conflicting with each other, those skilled in the art can by different examples described in this specification or example and
Different examples or exemplary feature are combined.
In the description of the present application, it is to be understood that term "outside", "inner", " width ", " thickness ", " height ", " recessed
The orientation or positional relationship of the instructions such as sunken depth " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of describing
The application and simplified description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific
Orientation construction and operation, therefore should not be understood as the limitation to the application.
Although the example of the application has been shown and described above, it is to be understood that above-mentioned example is exemplary,
Should not be understood as the limitation to the application, those skilled in the art within the scope of application can to above-mentioned example into
Row change, modification, replacement and modification.
Claims (15)
1. a kind of shell structure, which is characterized in that the shell structure is used for electronic equipment, and the shell structure includes: glass
Cover board and glass center, the glass cover-plate are screen cover board, have recessed portion, the glass cover-plate on the glass center
It is overlapped on the recessed portion, and there is sealed connection portion, institute between the side edge of the glass cover-plate and the glass center
Stating sealed connection portion is formed by welding glass material.
2. shell structure according to claim 1, which is characterized in that the width in the sealed connection portion is not more than 0.3mm.
3. shell structure according to claim 1, which is characterized in that the cup depth of the recessed portion and the glass cover
The thickness of plate is identical.
4. shell structure according to claim 1, which is characterized in that the cup depth of the recessed portion is 0.5-0.8mm.
5. shell structure according to claim 1, which is characterized in that the height in the sealed connection portion and the recessed portion
Cup depth it is identical.
6. shell structure according to claim 1, which is characterized in that the height in the sealed connection portion is less than the recess
The cup depth in portion, the one end in the sealed connection portion and the flush with outer surface of the glass cover-plate, the sealed connection portion
There is buffer part, wherein the modulus of the buffer part is lower than the sealed connection portion between the other end and the glass center
Modulus.
7. shell structure according to claim 6, which is characterized in that the modulus of the buffer part is not more than 20GPa；
Optionally, the material for forming the buffer part includes buffering adhesive.
8. shell structure according to claim 6, which is characterized in that the height of the buffer part is 0.2-0.4mm, described
The height in sealed connection portion is 0.2-0.4mm.
9. shell structure according to claim 1, which is characterized in that the glass cover-plate is towards in the electronic equipment
The side in portion has display module, and the edge of the glass cover-plate exceeds the edge of the display module, the glass cover-plate
Part beyond the display module is extension, at least part of the extension and recessed portion overlap joint.
10. shell structure according to claim 1, which is characterized in that the shell structure further comprises cell rear cover
Cover board, the cell rear cover cover board and the glass center are integrally formed.
11. a kind of method for preparing the described in any item shell structures of claim 1-10 characterized by comprising
Glass cover-plate is overlapped on the recessed portion of glass center；
The filling glass material between the side edge and the glass center of the glass cover-plate irradiates the glass using laser beam
Material, enable it is described frit melted, formed sealed connection portion, form the shell structure.
12. according to the method for claim 11, which is characterized in that the formation sealed connection portion further comprises:
It enables the laser beam with scheduled sealing speed, is moved along the frit, to heat the frit, enable the glass
The fusing of glass material, forms the sealed connection portion.
13. according to the method for claim 11, which is characterized in that the recess that glass cover-plate is overlapped on to glass center
After in portion, before the formation sealed connection portion, the method further includes:
Filling buffering material, forms buffer part, the buffer part between the side edge and the glass center of the glass cover-plate
Height be not more than the recessed portion cup depth, and it is described buffering material modulus be less than the frit modulus.
14. according to the method for claim 11, which is characterized in that after the formation sealed connection portion, the method into
One step includes:
The sealed connection portion is post-processed, enables the sealed connection portion towards the surface of the electronic device exterior side
With the flush with outer surface of the glass cover-plate.
15. a kind of electronic equipment characterized by comprising
The described in any item shell structures of claim 1-10, the shell structure limit accommodation space；
The shell structure is arranged in towards the side of the inside of the electronic equipment in display module, the display module；
Mainboard and memory, the mainboard and memory are located inside the accommodation space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910639132.1A CN110381689B (en) | 2019-07-16 | 2019-07-16 | Shell structure, preparation method thereof and electronic equipment |
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| CN201910639132.1A CN110381689B (en) | 2019-07-16 | 2019-07-16 | Shell structure, preparation method thereof and electronic equipment |
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| CN110381689A true CN110381689A (en) | 2019-10-25 |
| CN110381689B CN110381689B (en) | 2021-03-16 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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