CN108911493A - Prepare method, glass rear shell, electronic equipment and the assembly method of glass rear shell - Google Patents
Prepare method, glass rear shell, electronic equipment and the assembly method of glass rear shell Download PDFInfo
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- CN108911493A CN108911493A CN201810912564.0A CN201810912564A CN108911493A CN 108911493 A CN108911493 A CN 108911493A CN 201810912564 A CN201810912564 A CN 201810912564A CN 108911493 A CN108911493 A CN 108911493A
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- glass
- attachment
- rear shell
- accommodating cavity
- glass substrate
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/20—Uniting glass pieces by fusing without substantial reshaping
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Signal Processing (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
This application discloses a kind of method for preparing glass rear shell, this method includes:Glass substrate and glass attachment are provided;The welding of glass attachment is leaned on to the position of proximal edges in glass substrate, so that glass substrate and glass attachment enclose and set to form accommodating cavity, accommodating cavity is for accommodating electronic equipment ontology.The welding of glass attachment is leaned on to the position of proximal edges in glass substrate above, so that glass substrate and glass attachment enclose and set to form accommodating cavity, which is used to accommodate the ontology of electronic equipment.Above method is formed by the glass attachment in glass rear shell and extends far from glass cover-plate side, and then a part of side for the electronic equipment being arranged in accommodating cavity is enveloped.So that the integrated effect of electronic equipment appearance using the glass rear shell is more preferable, exquisite appearance degree gets a promotion.The application also provides glass rear shell, the assembly method of the electronic equipment including the glass rear shell and electronic equipment of a kind of above method preparation.
Description
Technical field
This application involves electronic technology fields, more particularly to a kind of method for preparing glass rear shell, glass rear shell, electronics
Equipment and assembly method.
Background technique
With making rapid progress for electronic product, the renewal speed of the electronic equipments such as mobile phone, tablet computer is getting faster, each product
The product competition of board is more and more fierce, and consumer is higher and higher to the appearance requirement of electronic equipment.
Electronic equipment includes rear shell, and general rear shell has plastics rear shell, metal rear shell and glass rear shell.In recent years after glass
Shell is quite liked by consumer, generally from the appearance includes glass cover-plate, center for the electronic device for including glass rear shell
And the structure of rear shell stacking.
Summary of the invention
The application provides the assembly of a kind of method for preparing glass rear shell, glass rear shell, electronic equipment and electronic equipment
Method.
The application use a technical solution be:A kind of method preparing glass rear shell is provided comprising:Glass is provided
Substrate and glass attachment;By the glass attachment welding in the position of the glass substrate side, so that the glass substrate
It encloses to set to form accommodating cavity with the glass attachment, the accommodating cavity is for accommodating electronic equipment ontology;The glass substrate is carried on the back
From accommodating cavity side removal a part to form curved surface;And/or the glass attachment is gone away from the accommodating cavity side
Except a part is to form curved surface.
The application also provides a kind of glass rear shell comprising:Glass substrate;The position of proximal edges is leaned on the glass substrate
Glass attachment is connected, the glass substrate and the glass attachment form accommodating cavity, and the accommodating cavity is for accommodating electronic equipment
Ontology;The surface that the glass substrate and/or the glass attachment deviate from the accommodating cavity side is curved surface.
The application also provides a kind of electronic equipment comprising glass rear shell, framework and display screen group as described above
Part, the display screen component are fixed in the framework, and the framework and the display screen component are accommodated in the accommodating cavity.
The application also provides the assembly method of a kind of electronic equipment comprising:The display screen component is fixed on described
To form frame assembly in framework;The frame assembly is fixed in the accommodating cavity.
The position of proximal edges is leaned in the welding of glass attachment by the method provided by the present application for preparing glass rear shell in glass substrate,
So that glass substrate and glass attachment enclose and set to form accommodating cavity, which is used to accommodate the ontology of electronic equipment.Above method
The glass attachment being formed by glass rear shell extends far from glass cover-plate side, forms three-dimensional structure, and is no longer analogous to
The structure of surface plate, and then a part of side for the electronic equipment being arranged in accommodating cavity is enveloped.Further, glass substrate
And/or glass attachment is curved surface away from the surface of accommodating cavity side, so that using the electronic equipment appearance of the glass rear shell
Exquisite degree gets a promotion.
Detailed description of the invention
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, the drawings in the following description are only some examples of the present application, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is the partial structure diagram that the structure before the application glass rear shell is improved is applied in electronic equipment;
Fig. 2 is the flow diagram for one embodiment of method that the application prepares glass rear shell;
Fig. 3 is the partial enlargement structural representation in one embodiment of the application glass rear shell;
Fig. 4 is the schematic diagram of the section structure in one embodiment of the application glass rear shell along the direction a-a as shown in Figure 2;
Fig. 5 is the schematic diagram of the section structure in another embodiment of the application glass rear shell along the direction a-a as shown in Figure 2;
Fig. 6 is the structural schematic diagram that glass rear shell is applied to be formed after electronic equipment in one embodiment of the application;
Fig. 7 is the structural schematic diagram that glass rear shell is applied to be formed after electronic equipment in another embodiment of the application;
Fig. 8 is the schematic diagram of the section structure in one embodiment of the application glass rear shell along the direction a-a as shown in Figure 2;
Fig. 9 is the schematic diagram of the section structure in another embodiment of the application glass rear shell along the direction a-a as shown in Figure 2;
Figure 10 is the schematic diagram of the section structure in the another embodiment of the application glass rear shell along the direction a-a as shown in Figure 2;
Figure 11 is the schematic diagram of the section structure in the application glass rear shell another embodiment along the direction a-a as shown in Figure 2;
Figure 12 is the schematic diagram of the section structure in the another embodiment of the application glass rear shell along the direction a-a as shown in Figure 2;
Figure 13 is the flow diagram for another embodiment of method that the application prepares glass rear shell;
Figure 14 is the schematic diagram of the section structure in the application glass rear shell another embodiment along the direction a-a as shown in Figure 2;
Figure 15 is the structural schematic diagram that glass rear shell is applied to be formed after electronic equipment in the another embodiment of the application;
Figure 16 is the structural schematic diagram of electronic equipment in one embodiment of the application;
Figure 17 is electronic equipment assembly method flow diagram in one embodiment of the application.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation description.It is understood that specific embodiment described herein is only used for explaining the application, rather than to the limit of the application
It is fixed.It also should be noted that illustrating only part relevant to the application for ease of description, in attached drawing and not all knot
Structure.Based on the embodiment in the application, obtained by those of ordinary skill in the art without making creative efforts
Every other embodiment, shall fall in the protection scope of this application.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments
It is contained at least one embodiment of the application.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
In order to preferably illustrate present invention point, the electronics such as mobile phone, tablet computer before taking off improvement are said first below
There is the glass rear shell of curved-surface structure in equipment and form the preparation method of the bend glass rear shell.
Referring to Fig. 1, before improving for structure there is bend glass rear shell to apply and the partial structure diagram after electronic equipment.
It include glass rear shell 10a, display screen component 212a and center 214a in Fig. 1.The manufacture craft of glass rear shell 10a is to flat
Surface glass is heated at high temperature, and softens in a mold at curved shape, bend glass is made using annealing.Specific substantially mistake
Cheng Wei:On the mold that flat glass is placed first, then it is heated at high temperature, when flat glass being made to reach softening point temperature, plane
Glass reaches consistent with the cavity plate curvature that mold gives under the action of self gravity or external pressure.Finally anneal,
Until reaching room temperature, so that flat glass forms curved structure as shown in Figure 1.But this method formation glass rear shell 10a is each
The consistency of thickness at place, and in the electronic equipment of application glass rear shell 10a, glass rear shell 10a can not will cover center 214a
Side, the middle position glass rear shell 10a can arch upward again if the side of center 214a to be covered, can not set applied to electronics
It is standby upper.
In addition above method preparation cost is high, and preparation process difficulty is big, and yields is low, because heating during the preparation process
Process inside need laser heating or slow heating so that the temperature of mold inner plane glass everywhere is consistent, and need tight
Lattice prevent flat glass from settling suddenly when close to the temperature of softening controlling temperature.And there is hot bending in flat glass in order to prevent
Ripple, operator must the moment viewing plane glass change procedure, number of switches, the region of heat pipe are controlled by observing
With time change etc., human cost is very high.In addition the glass rear shell that above method is formed is for the bending of straight line, the ground of dog-ear
The defects of side is easy to appear moulding mark.
The application provides a kind of method for preparing glass rear shell, glass rear shell, using the electronic equipment of the glass rear shell, with
And the assembly method of the electronic equipment.It is explained one by one below by way of each embodiment.Following embodiment first introduces this simultaneously
Application prepares the method for glass rear shell and is formed by the structure of glass rear shell.Then the electricity using the glass rear shell is introduced again
The assembly method of sub- equipment and electronic equipment.
Referring to fig. 2, Fig. 2 is the flow diagram for one embodiment of method that the application prepares glass rear shell, and this method includes
Step 101 and step 102, referring also to Fig. 3, Fig. 3 are to prepare glass rear shell prepared by the method for glass rear shell using this
The structural schematic diagram of one embodiment.Wherein:
101:Glass substrate 10 and glass attachment 20 are provided.
The glass rear shell 100 includes glass substrate 10, and the glass connecting with glass substrate 10 by the position of proximal edges
Attachment 20.Wherein glass substrate 10 is cuboid, including two sides long side 12 and two sides short side 14.Glass attachment 20 is strip,
The length of glass attachment 20 is less than or equal to the length of the long side 12 of glass substrate 10.
102:The position that 20 welding of glass attachment is leaned on to proximal edges in glass substrate 10, so that glass substrate 10 and glass are attached
Part 20, which encloses, to be set to form accommodating cavity 11.
Specifically, glass attachment 20 is fused to the position that glass substrate 10 leans on proximal edges.Referring to fig. 4, glass substrate 11 wraps
Include front 16, with the front 16 opposite back sides 17 and two sides 18.Front 16 includes 162 He of bonding pad in one embodiment
Disconnected area 164, bonding pad 162 are positioned at the region of 16 side of front of glass substrate 10, and the area in disconnected area 164 is long-range
Area in bonding pad 162.In the present embodiment, glass attachment 20 is fused to the bonding pad 162 in the front 16 of glass substrate 10.Separately
In one embodiment, glass attachment 20 is directly connect with the side 18 of glass substrate 10, as shown in figure 5, this is not specifically limited.Glass
Glass substrate 10 and glass attachment 20 form accommodating cavity 11, and referring also to Fig. 4 and Fig. 6, Fig. 6 are that glass rear shell is applied to electronic equipment
Structural profile illustration after in 200.The accommodating cavity 11 is used to accommodate the ontology 210 of electronic equipment 200, it is possible to understand that, electricity
The ontology 210 of sub- equipment 200 includes display screen component 212 and framework 214.
In one embodiment, the quantity of glass attachment 20 is two, two glass attachmentes 20 respectively with the same table of glass substrate 10
Position welding of the face adjacent to long side 12.Namely two glass attachmentes 20 are fused to the front of glass substrate 10 as shown in Figure 3
16, and it is fused to two bonding pads, 162 position in front 16 respectively, so that the equal position in 210 two sides of the ontology of electronic equipment 200
In in accommodating cavity 11, the outside of 210 two sides of ontology of electronic equipment 200 is covered by glass attachment 20.It is understood that
, in the embodiment of the length for being shorter in length than 10 long side 12 of glass substrate of glass attachment 20, the ontology of electronic equipment 200
It is only partially located in accommodation groove 11 on the outside of 210 two sides.Wherein, ontology 210 can by the exposed position of accommodating cavity 11
For the side switch such as power key or sound key to be arranged.In another embodiment, two glass attachmentes 20 respectively with glass substrate 10
Two 18 weldings of side, as shown in Figure 4.
Referring also to Fig. 7, in other embodiments, glass attachment 20 or one are formed by glass rear shell 100
Only 12 side of a long side is covered on the side of electronics, and the ontology 210 of electronic equipment 200 has a long side not by glass rear shell
100 are covered, with exposed for side switch to be arranged.
103:By glass substrate 10 away from 11 side of accommodating cavity removal a part to form curved surface.
Specifically, the back side 17 of glass substrate 10 is namely removed a part, to form curved surface.Optionally, this implementation
Technique in example by a part removal of glass substrate 10 uses CNC milling machine technique, also referred to as CNC technique.In other embodiments
Can be by the way of exposure development or laser ablation, this is not specifically limited.It is the application another embodiment referring to Fig. 8
The structural schematic diagram of middle rear shell, in the embodiment, the back side 17 of glass substrate 10 forms a cambered surface, 10 width direction of glass substrate
Cross section middle position thickness it is maximum, and be gradually reduced toward both sides of the edge direction.It should be understood that the amplitude will not be special
Greatly, that is, a lesser curved surface of amplitude is formed, so that there is 3D using the back side of the electronic equipment 200 of the glass rear shell 100
Texture.Referring to Fig. 9, in another embodiment, the part of glass substrate 10 and positive 16 disconnected 164 faces of area is plane, and with
The part of 162 face of bonding pad is arc transition, this is not specifically limited.
104:By glass attachment 20 away from 11 side of accommodating cavity removal a part to form curved surface.
It should be understood that the technique of the step is consistent with the technique that step 103 is illustrated, this is without repeating.One implements
In example, with continued reference to Fig. 8, glass attachment 20 and the cross-sectional width of 10 junction of glass substrate are smaller, towards far from glass substrate
10 directions are gradually increased, and are then gradually reduced again, to be the outer surface for the side that glass attachment 10 deviates from accommodating cavity 11 as cambered surface.
It should be understood that glass attachment 20 encloses the inner surface for setting accommodating cavity 11 as plane, or in the front 16 with glass substrate 10
The position of connection forms arc transition, to place the ontology 210 of electronic equipment 200, while avoiding the sheet with electronic equipment 200
Scraping is generated between body 210.
It should be understood that step 103 and step 104 are not the necessary step of the application, in other embodiments, can only wrap
Step 103 is included, i.e. outer surface of the glass substrate 10 far from accommodating cavity 11 is curved surface, and glass attachment 10 is far from the outer of accommodating cavity side
Surface is plane, as shown in Figure 10.Or only including step 104, i.e. outer surface of the glass substrate 10 far from accommodating cavity 11 is flat
Face, outer surface of the glass attachment 20 far from 11 side of accommodating cavity is curved surface, as shown in figure 11.
Optionally, in an embodiment, the junction of glass substrate 10 and glass attachment 20 is arc transition, such as Figure 12 institute
Show.So that 100 corner part of glass rear shell is smooth, not sharp seamed edge, so that 100 overall appearance of glass rear shell is more smart
Beauty.
Referring to Figure 13, the flow diagram of another embodiment of method of glass rear shell, the embodiment packet are prepared for the application
Step 201 is included to step 207, wherein step 201 to step 204 respectively with the step 101 of a upper embodiment to step 104 one
It causes, this is without repeating.Wherein:
201:Glass substrate 10 and glass attachment 20 are provided.
202:The position that 20 welding of glass attachment is leaned on to proximal edges in glass substrate 10, so that glass substrate 20 and glass are attached
Part 20, which encloses, to be set to form accommodating cavity 11.
203:By glass substrate 10 away from 11 side of accommodating cavity removal a part to form curved surface.
204:By glass attachment 20 away from 11 side of accommodating cavity removal a part to form curved surface.
205:Default through slot 22 is formed on glass attachment 20.
A part on glass attachment is gone divided by forming one or more using CNC milling machine technique or laser technology
A through slot 22, as shown in figure 14.The through slot 22 is such as schemed for accommodating the side switch such as power key or the volume key of electronic equipment 220
Shown in 15.It should be understood that executing step 205 and step in step 205 and step 203 or 204 simultaneous embodiments
Rapid 203 or step 204 carry out simultaneously, using it is same set of setting can be completed, naturally it is also possible to separate.Step 205 can simultaneously
Before or after step 203 perhaps step 204 or between the two steps, this is not specifically limited.
It can not also include step 205 in other embodiments, such as the glass rear shell 100 is applied to no side switch 220
Electronic equipment 200 or side switch 220 are located in the top of electronic equipment 200 or the embodiment of bottom end.Or in glass attachment
In the embodiment that 20 quantity are 1, electronic equipment 200 has side long side not covered by glass rear shell 100, and the side long side is external
It is exposed, it is used equally for setting side switch 220.Or the length of 10 long side 12 of size phrase glass substrate in glass attachment 20, then
Electronic equipment 200 has a part of side long side not covered by glass rear shell 100, which can be used for setting
Set side switch 220.
206:The outer surface and/or inner surface of glass substrate 10 and glass attachment 20 are polished, it is smooth to obtain
Outer surface and/or inner surface.
The rigid welding of glass attachment 20 is after glass substrate 10, or after getting rid of a part by step 203 or 204
It is formed by outer surface or inner surface is rough, there are burrs or step 205 to form through slot 22 on glass attachment 20
During also result in some of positions there are burr, cause rough.Step 206 passes through to glass substrate 10 and glass
The outer surface of attachment 20 and/or inner surface are polished, to obtain smooth outer surface and/or inner surface, including through slot 22
Position.So that the entire outer surface of glass rear shell 100 is more smooth, more preferably, burr is not present in inner surface to feel, is avoided and electricity
The ontology 210 of sub- equipment 200 generates scraping.
207:Intensive treatment is carried out to glass substrate 10 and glass attachment 20, to improve glass substrate 10 and glass attachment
20 drop resistant intensity.
Step 207 improves the intensity of glass by changing the composition of glass surface, method be with other alkali metal
Ion is exchanged with Na+ the or K+ ion of surface layer of glass, and surface forms ion exchange layer, after being cooled to room temperature, at glass
In the state that internal layer tension, outer layer are pressurized, to achieve the purpose that increase intensity, effect is similar to tempered glass, Jin Erti
The drop resistant intensity of high glass substrate and glass attachment.
Optionally, in different embodiments, can be used high temperature modification ion-exchange, low form ion-exchange, dealkalize method,
The methods of surface crystallization method and sodium metasilicate reinforcement carry out intensive treatment to glass substrate and glass attachment.Below to these
Method is explained one by one.
High temperature modification ion-exchange:In temperature region between the softening point and transition point of glass, containing Na2O or K2O
Glass substrate and glass attachment intrusion lithium fused salt in, make the Li+ in the Na+ or the fused salt small with their radiuses in glass
It is exchanged, then cools to room temperature, since the surface layer containing Li+ is different from containing Na+ or K+ inner layer expansion coefficient, surface generates remaining
Pressure and strengthen.Meanwhile glass neutralizes when containing the ingredients such as AL203, TiO2, by ion exchange, can generate coefficient of expansion pole
Low p-eucryptite (LiO, AL2O3,2SiO2) crystallization, glass surface after cooling will generate very big pressure, can be obtained strong
Degree is up to the glass of 700MPa.It should be understood that being using this method, the glass substrate 10 and glass of the glass rear shell 100 are attached
Part 20 includes Na2O or K2O ingredient.
Low form ion-exchange:Low-temperature ion exchange process in the humidity province lower than strain point of glass, with than surface layer alkali from
The monovalent cation (such as K+) and Na+ ion exchange of sub (such as Na+) also larger ionic radius, make K+ enter the method on surface layer.
Such as the glass rear shell uses Na2O+CaO+SiO2 system glass, and it is small that more than ten can be impregnated in 400 degree of fuse salt
When.Low form ion-exchange can be readily attained high intensity, have that processing method is simple, it is transparent not damage glass surface
The features such as property, constant row.Conventionally used chemically reinforced glass is manufactured using low-temperature ion exchange process, so-called low temperature system
Refer to exchange temperature not higher than in the range of glass transformation temperature, be relative to High temperature ion exchange process transition temperature with
On, for softening point temperature range below.
Dealkalize method:Dealkalize method be in the high-temperature atmosphere containing sulphurous acid gas and moisture, using Pt catalyst treatment glass,
It oozes out Na+ ion from surface layer of glass to react with sulfurous acid, so that superficial layer becomes SiO2 layers of richness, result becomes due to surface layer
Low expansion glass generates compression when cooling.
Surface crystallization method:Surface crystallization method is different from high temperature modification ion exchange, but is only formed by being heat-treated on surface layer
Low-expansion microcrystal, to be allowed to the method strengthened.This method must select the glass that low bulk micro mirror body is precipitated.
Sodium metasilicate reinforcement:Sodium metasilicate reinforcement be by the aqueous solution of sodium metasilicate (waterglass) at 100 degrees Celsius or more
It is handled under several atmospheric pressure, to obtain the high strength glass for being difficult to scratch surface layer.
As long as this, which does not do, with the sequencings of other steps has it should be understood that step 207 is after step 202
Body limits.Certain step 203,204,205 or 206 enable to related process to be easier to carry out before step 207.Other
It can not also include step 207 in embodiment, this is not specifically limited.
It is the structural schematic diagram in 200 1 embodiment of the application electronic equipment referring to Figure 16, Figure 16, electronic equipment 200 wraps
Glass rear shell 100 described in the various embodiments described above is included, as shown in figure 15.The electronic equipment 200 can be multiple electronic equipments
Any one of, multiple electronic equipments 200 include but is not limited to cellular phone, smart phone, other wireless telecom equipments, a
Personal digital assistant, audio player, other media players, music recorder, video recorder, camera, other medium recorders,
It is radio, Medical Devices, calculator, programmable remote control, pager, netbook computer, personal digital assistant (PDA), portable
Formula multimedia player (PMP), Motion Picture Experts Group (MPEG-1 or MPEG-2) audio layer 3 (MP3) player, portable doctor
Treat the equipment that equipment and digital camera and combinations thereof etc. include display screen.
Specifically, referring also to Figure 14 and Figure 15, which includes glass rear shell 100, display screen component 212
And framework 214.Framework 214 is the center or battery cover of electronic device 200, for carrying and fixing display screen component
212, circuit board and various electronic devices etc..Display screen component 212 is fixed in framework 214, and display screen component 212 includes aobvious
Display screen 2122 and glass cover-plate 2124, display screen 2122 is for showing that the pictures such as picture and video, glass cover-plate 2124 cover
It is the front shell of electronic equipment 200 on display screen 2122.Glass cover-plate 2124 is made of the glass material of light transmission, cover board
For glass 2124 for protecting display screen 2122, user is it can be seen that the picture that display screen 2122 is shown through glass cover-plate 2124.
Framework 214 and display screen component 212 are accommodated in the accommodating cavity 11 of glass rear shell 100, and glass rear shell 100 forms 3D cladding knot
Structure wraps at least partly framework 214 of the long side of electronic equipment 200, improves the integrated effect of electronic equipment 200, makes
The appearance for obtaining electronic equipment 200 is more exquisite, meets the demand of user.
Optionally, in an implementation, glue is set between framework 214 or display screen component 212 on the inner wall of accommodating cavity 11
Glutinous layer 230, for framework 214 and display screen component 212 to be fixed in accommodating cavity 11.Optionally, adhesive layer 230 can or
Between framework 214 and glass substrate 10, and/or between glass attachment 20 and framework 214.
In one embodiment, adhesive layer 230 is only set between glass attachment 20 and framework, framework 214 and glass substrate 10 it
Between be not provided with adhesive layer 230, i.e. adhesive layer 230 is only arranged between the side wall of electronic equipment 200 and glass rear shell 100.Into
And make in the case where being damaged when glass rear shell 100, convenient for adhesive layer 230 processed with by glass rear shell 100 with
The ontology 210 of electronic equipment 200 is removed.It is conveniently replaceable new glass rear shell 100.
In one embodiment, electronic equipment 200 includes side switch 220, and through slot 22 is opened up on glass attachment 20, and side switch 220 is arranged
It is connect in through slot 22, and with display screen component 212.In other embodiments, side switch 220 can also be located at electronic equipment 200
Top or bottom.In another embodiment, the length of glass attachment 20 is less than the length of base plate glass 10, and then framework 214
There is part not covered by glass attachment 20 for side, and the position that the side of framework 214 is not covered by glass attachment 20 is i.e.
It can be used for being arranged side switch 220.
In other embodiments, electronic equipment 200 can also be not provided with side switch 220, this is not specifically limited.
The application also provides a kind of assembly method of above-mentioned electronic equipment, is electronics in one embodiment of the application referring to Figure 17
The flow diagram of the assembly method of equipment, the method comprising the steps of 301 and step 302, wherein:
301:Display screen component is fixed in framework to form frame assembly.
First display screen component is fixedly connected on to form frame assembly in framework, so that display screen component and framework are formed
One entirety, is easily installed.
302:Frame assembly is fixed in accommodating cavity.
Frame assembly is promoted in accommodation groove, is fixedly connected with glass rear shell, so that the ontology of frame assembly accommodates
In accommodation groove, electronic equipment is formed.It should be understood that being set between framework or display screen component on the inner wall of accommodating cavity
It sets in the embodiment of adhesive layer, further includes before step 302:On the inner wall of accommodating cavity or frame assembly and accommodating cavity connect
It touches side and adhesive layer is set.So that frame assembly is more solidly fixed in accommodating cavity.
The foregoing is merely presently filed embodiments, are not intended to limit the scope of the patents of the application, all to utilize this
Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field similarly includes in the scope of patent protection of the application.
Claims (15)
1. a kind of method for preparing glass rear shell, which is characterized in that including:
Glass substrate and glass attachment are provided;
By the glass attachment welding in the position of the glass substrate side, so that the glass substrate and the glass attachment
It encloses and sets to form accommodating cavity, the accommodating cavity is for accommodating electronic equipment ontology;
By the glass substrate away from accommodating cavity side removal a part to form curved surface;And/or
By the glass attachment away from accommodating cavity side removal a part to form curved surface.
2. the method according to claim 1 for preparing glass rear shell, which is characterized in that the glass substrate is cuboid,
The glass attachment be strip, quantity two, two glass attachmentes respectively with the same surface side of the glass substrate
Position welding.
3. the method according to claim 1 for preparing glass rear shell, which is characterized in that described by the glass attachment welding
On the glass substrate, also wrapped so that the glass substrate is enclosed with the glass attachment after setting the step of forming accommodating cavity
It includes:
The outer surface and/or inner surface of the glass substrate and glass attachment are polished, with obtain smooth outer surface and/
Or inner surface.
4. the method according to claim 3 for preparing glass rear shell, which is characterized in that described by the glass attachment welding
On the glass substrate, also wrapped so that the glass substrate is enclosed with the glass attachment after setting the step of forming accommodating cavity
It includes:
Default through slot is formed on the glass attachment.
5. preparing the method for glass rear shell according to claim 3 or 4, which is characterized in that described to the glass base
The outer surface of plate and/or inner surface are polished, the step of to obtain smooth outer surface and/or inner surface after further include:
Intensive treatment is carried out to the glass substrate and the glass attachment, to improve the glass substrate and glass attachment
Drop resistant intensity.
6. a kind of glass rear shell, which is characterized in that including:
Glass substrate;
Glass attachment, the glass attachment and the glass substrate lean on the position welding of proximal edges, the glass substrate with it is described
Glass attachment forms accommodating cavity, and the accommodating cavity is for accommodating electronic equipment ontology;The glass substrate and/or the glass are attached
Part is curved surface away from the surface of the accommodating cavity side.
7. glass rear shell according to claim 6, which is characterized in that among the cross section of the glass substrate width direction
Position thickness is maximum, and is gradually reduced toward both sides of the edge direction, to form cambered surface;And/or
The glass attachment is cambered surface away from a side external surface of the accommodating cavity.
8. glass rear shell according to claim 6, which is characterized in that the glass attachment be strip, quantity two, two
A glass attachment is connected to the position of the same surface side of the glass substrate.
9. glass rear shell according to claim 6, which is characterized in that the connection of the glass substrate and the glass attachment
Place is arc transition.
10. according to the described in any item glass rear shells of claim 6-9, which is characterized in that open up through slot on the glass attachment.
11. a kind of electronic equipment, which is characterized in that including the described in any item glass rear shells of such as claim 6-10, framework with
And display screen component, the display screen component are fixed in the framework, the framework and the display screen component are accommodated in institute
It states in accommodating cavity.
12. electronic equipment according to claim 11, which is characterized in that open up through slot, the electricity on the glass attachment
Sub- equipment includes side switch, and the side switch is set in the through slot, and is connect with the display screen component.
13. electronic equipment according to claim 11, which is characterized in that on the inner wall of the accommodating cavity with the framework or
Adhesive layer is set between display screen component described in person, for the framework and the display screen component to be fixed on the accommodating cavity
In.
14. the assembly method of a kind of electronic equipment, which is characterized in that including:
The display screen component is fixed in the framework to form frame assembly;
The frame assembly is fixed in the accommodating cavity.
15. the assembly method of electronic equipment according to claim 14, which is characterized in that described to consolidate the frame assembly
Include before the step being scheduled in the accommodating cavity:
On the inner wall of the accommodating cavity or adhesive layer is arranged in the contact side of the frame assembly and the accommodating cavity.
Priority Applications (1)
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110156348A (en) * | 2019-05-06 | 2019-08-23 | 中建材蚌埠玻璃工业设计研究院有限公司 | A kind of mobile phone glass center and back shroud sealing-in mold and its application method |
CN110381689A (en) * | 2019-07-16 | 2019-10-25 | Oppo(重庆)智能科技有限公司 | Shell structure and preparation method thereof, electronic equipment |
WO2020133858A1 (en) * | 2018-12-29 | 2020-07-02 | 比亚迪股份有限公司 | Electronic device housing, preparation method therefor and electronic device |
Citations (1)
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CN107902878A (en) * | 2017-12-12 | 2018-04-13 | 厦门祐尼三的新材料科技有限公司 | 3D glass cover-plates, processing method and electronic equipment |
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Patent Citations (1)
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CN107902878A (en) * | 2017-12-12 | 2018-04-13 | 厦门祐尼三的新材料科技有限公司 | 3D glass cover-plates, processing method and electronic equipment |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020133858A1 (en) * | 2018-12-29 | 2020-07-02 | 比亚迪股份有限公司 | Electronic device housing, preparation method therefor and electronic device |
CN110156348A (en) * | 2019-05-06 | 2019-08-23 | 中建材蚌埠玻璃工业设计研究院有限公司 | A kind of mobile phone glass center and back shroud sealing-in mold and its application method |
CN110156348B (en) * | 2019-05-06 | 2024-01-23 | 中建材玻璃新材料研究院集团有限公司 | Mobile phone glass middle frame and rear cover plate sealing mold and use method thereof |
CN110381689A (en) * | 2019-07-16 | 2019-10-25 | Oppo(重庆)智能科技有限公司 | Shell structure and preparation method thereof, electronic equipment |
CN110381689B (en) * | 2019-07-16 | 2021-03-16 | Oppo(重庆)智能科技有限公司 | Shell structure, preparation method thereof and electronic equipment |
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Application publication date: 20181130 |