CN110370153B - Upper fixed disc wafer stripping device for polishing equipment - Google Patents
Upper fixed disc wafer stripping device for polishing equipment Download PDFInfo
- Publication number
- CN110370153B CN110370153B CN201910499126.0A CN201910499126A CN110370153B CN 110370153 B CN110370153 B CN 110370153B CN 201910499126 A CN201910499126 A CN 201910499126A CN 110370153 B CN110370153 B CN 110370153B
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- China
- Prior art keywords
- water vapor
- stripping
- joint
- upper fixed
- pipeline
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
The invention belongs to the field of plane processing of semiconductor electronic components, and particularly relates to an upper fixed disc wafer stripping device for polishing equipment. Comprises a water vapor connecting plate; a plurality of cylinders are arranged above the water vapor connecting plate; the cylinder telescopic rod is connected with the cylinder mounting block; a water vapor joint and a stripping nozzle are arranged in the cylinder mounting block; one end of the water vapor joint is connected with the water vapor pipeline, and the other end of the water vapor joint is connected with the stripping nozzle; a liquid receiving ring is arranged below the water vapor mounting plate, a vertical through hole is formed in the liquid receiving ring, a plug sleeve is arranged in the through hole, and the bottom of the plug sleeve is connected with the multi-way connector; the liquid separation block is connected with the multi-way joint through a pipeline; the upper fixed plate is provided with a plurality of vertical through holes; the stripping plug sleeve is fixedly arranged in the through hole and is connected with the liquid separation block through a pipeline. The invention can solve the problem that the wafer is difficult to be absorbed on the polishing disk to take the wafer, avoid the conditions of stripping fragments, dropping fragments and scratching of the wafer caused by the absorption, and avoid the absorption traces left on the surface of the wafer in the processes of vacuum absorption and vacuum breaking.
Description
Technical Field
The invention belongs to the technical field of semiconductor electronic component plane processing equipment, and particularly relates to an upper fixed disc wafer stripping device for polishing equipment.
Background
In China, a semiconductor is always a relatively weak block in the manufacturing industry, and the semiconductor technology is lagged behind seriously compared with the technology abroad. China has the largest consumer market in the world, but more than eighty percent of chips used in communication industries such as mobile phones and the like are imported, and the autonomy of the information technology is still limited and restricted. In recent years, with the continuous increase of the demand and the increase of the support of the national chip technology, the technology improvement of the domestic chip production is obvious, and a plurality of silicon chip devices and processing manufacturers, including silicon chip forming, cutting, thinning, grinding, polishing and the like, rise rapidly. Among them, the last three processes are the most critical and the most difficult.
Although various specifications of polishing equipment are successfully developed, a plurality of technical problems still exist to restrict further development of domestic equipment. For example, in the prior art, wafers are fixed and separated on a disc surface by combining vacuum suction and vacuum breaking, the process is only suitable for the field of single-side polishing and is not suitable for the field of double-polishing, in the field of double-polishing, the wafers are not directionally adsorbed on an upper polishing disc or a lower polishing disc because the surfaces of the wafers after polishing are smooth and can be adsorbed on a polishing pad, and the requirements of actually requiring all the wafers on the lower polishing disc are contradictory and cannot be realized.
Disclosure of Invention
The invention aims to solve the technical problem of overcoming the defects in the prior art and provides an upper fixed disk wafer stripping device for polishing equipment.
In order to solve the technical problem, the solution of the invention is as follows:
the upper fixed plate wafer stripping device for the polishing equipment comprises an upper fixed plate, a water vapor supply system, a liquid separating mechanism and a liquid spraying mechanism;
the water vapor supply system comprises a water vapor connecting plate, a water vapor joint and a water vapor pipeline; a plurality of air cylinders are vertically arranged above the water vapor connecting plate; the cylinder telescopic rod is connected with the cylinder mounting block; a water vapor joint is arranged in the cylinder mounting block, and a stripping nozzle is arranged at the bottom of the cylinder mounting block; one end of the water vapor joint is connected with the water vapor pipeline, and the other end of the water vapor joint is connected with the stripping nozzle; a liquid receiving ring is arranged below the water vapor mounting plate and fixedly arranged on the upper fixed disc through a supporting device; a vertical through hole is formed in the liquid receiving ring right below the stripping nozzle, a plug sleeve is arranged in the through hole, and the bottom of the plug sleeve is connected with the multi-way connector;
the liquid separating mechanism comprises a liquid separating block, a plurality of second joints are arranged at the bottom of the liquid separating block, and the top end of the liquid separating block is connected with the multi-way joint through a pipeline;
the upper fixed plate is provided with a plurality of vertical through holes;
the liquid spraying mechanism comprises a stripping plug sleeve which is fixedly arranged in the through hole, the top end of the stripping plug sleeve is connected with a first connector, and the first connector is connected with a second connector through a pipeline.
As an improvement, a valve is arranged on the water vapor pipeline.
As an improvement, the air cylinder is fixed on the water vapor connecting plate through screws.
As an improvement, the plug sleeve is fixed on the liquid receiving ring through glue.
As an improvement, the cylinder telescopic rod and the cylinder mounting block are fixed through a nut.
Compared with the prior art, the invention has the beneficial effects that:
the invention can solve the problem that the wafer is difficult to be absorbed on the polishing disk to take the wafer, avoid the conditions of stripping fragments, dropping fragments and scratching of the wafer caused by the absorption, and avoid the absorption traces left on the surface of the wafer in the processes of vacuum absorption and vacuum breaking.
Drawings
FIG. 1 is a front cross-sectional view of the present invention;
fig. 2 is a partial view of the present invention.
The labels in the figures are: 1-fixing the disc; 2-stripping the plug sleeve; 3-a first joint; 4-a tube; 5-a second linker; 6-a shunting block; 7-liquid receiving ring; 8-a screw; 9-a water vapor connecting plate; 10-cylinder; 11-a multi-way joint; 12-a nut; 13-a water vapor joint; 14-a cylinder mounting block; 16-a stripping nozzle; 17-plug sleeve; 18-a water vapor pipeline; 19-wafer.
Detailed Description
The invention is described in further detail below with reference to the following detailed description and accompanying drawings:
an upper surface plate wafer peeling apparatus for a polishing apparatus shown in fig. 1 and 2 includes an upper surface plate 1, a moisture supply system, a liquid separation mechanism, and a liquid ejection mechanism.
The steam supply system comprises a steam connection plate 9, a steam joint 13 and a steam pipeline 18. A plurality of air cylinders 10 are vertically arranged above the water vapor connecting plate 9. The cylinder 10 is fixed on the water vapor connecting plate 9 through a screw 8. The cylinder telescopic rod is connected with a cylinder mounting block 14 through a nut 12. A water vapor joint 13 is arranged in the cylinder mounting block 14, and a stripping nozzle 16 is arranged at the bottom of the cylinder mounting block 14. The water vapor connector 13 is connected at one end to a water vapor line 18 and at the other end to a stripping nozzle 16. A valve is provided on the water vapor line 18. A liquid receiving ring 7 is arranged below the water vapor mounting plate 9, and the liquid receiving ring 7 is fixedly arranged on the upper fixed disc 1 through a supporting device; a vertical through hole is formed in the position of the liquid receiving ring 7 right below the stripping nozzle 16, a plug sleeve 17 is arranged in the through hole through glue, and the bottom of the plug sleeve 17 is connected with the multi-way connector 11;
the liquid separating mechanism comprises a liquid separating block 6, a plurality of second joints 5 are arranged at the bottom of the liquid separating block 6, and the top end of the liquid separating block 6 is connected with the multi-way joint 11 through a pipeline. The upper fixed plate 1 is provided with a plurality of vertical through holes.
The liquid spraying mechanism comprises a stripping plug sleeve 2, the stripping plug sleeve 2 is fixedly arranged in the through hole, the top end of the stripping plug sleeve 2 is connected with a first connector 3, and the first connector 3 is connected with a second connector 5 through a pipe 4.
The working process of the invention is as follows:
the cylinder 10 descends to enable the stripping nozzle 16 and the plug sleeve 17 to be pressed and sealed, the waterway control valve is opened, and a certain amount of liquid water is conveyed to enter the water vapor connector 13; and opening a pneumatic control valve to enable high-pressure air to enter the water vapor connector 13, enabling the high-pressure air to be quickly atomized through the stripping nozzle 16, enabling the atomized water vapor to be uniformly distributed to the stripping plug sleeve 2 through the flow dividing block 6, enabling the water vapor to be sprayed to the surface of the wafer 19 through the stripping plug sleeve 2, and enabling the wafer 19 to be stripped from the surface of the upper fixed plate 1 under the stress.
The cylinder 10 ascends and descends to realize connection sealing and separation of the wafer stripping pipeline.
Finally, it should be noted that the above-mentioned list is only a specific embodiment of the present invention. It is obvious that the present invention is not limited to the above embodiments, but many variations are possible. All modifications which can be derived or suggested by a person skilled in the art from the disclosure of the present invention are to be considered within the scope of the invention.
Claims (5)
1. An upper fixed plate wafer stripping device for polishing equipment is characterized by comprising an upper fixed plate, a water vapor supply system, a liquid separating mechanism and a liquid spraying mechanism;
the water vapor supply system comprises a water vapor connecting plate, a water vapor joint and a water vapor pipeline; a plurality of air cylinders are vertically arranged above the water vapor connecting plate; the cylinder telescopic rod is connected with the cylinder mounting block; a water vapor joint is arranged in the cylinder mounting block, and a stripping nozzle is arranged at the bottom of the cylinder mounting block; one end of the water vapor joint is connected with the water vapor pipeline, and the other end of the water vapor joint is connected with the stripping nozzle; a liquid receiving ring is arranged below the water vapor connecting plate and fixedly arranged on the upper fixed disc through a supporting device; a first vertical through hole is formed in the liquid receiving ring right below the stripping nozzle, a plug sleeve is arranged in the first vertical through hole, and the bottom of the plug sleeve is connected with the multi-way joint;
the liquid separating mechanism comprises a liquid separating block, a plurality of second joints are arranged at the bottom of the liquid separating block, and the top end of the liquid separating block is connected with the multi-way joint through a pipeline;
a plurality of vertical through holes II are formed in the upper fixed disc;
the liquid spraying mechanism comprises a stripping plug sleeve which is fixedly arranged in the second vertical through hole, the top end of the stripping plug sleeve is connected with a first connector, and the first connector is connected with a second connector through a pipeline.
2. The apparatus of claim 1, wherein a valve is provided on the water vapor line.
3. The apparatus of claim 1 wherein the cylinder is secured to the moisture web by screws.
4. The device of claim 1, wherein the sleeve is secured to the drip ring by glue.
5. The device of claim 1, wherein the cylinder extension rod is connected to the cylinder mounting block by a nut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910499126.0A CN110370153B (en) | 2019-06-10 | 2019-06-10 | Upper fixed disc wafer stripping device for polishing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910499126.0A CN110370153B (en) | 2019-06-10 | 2019-06-10 | Upper fixed disc wafer stripping device for polishing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110370153A CN110370153A (en) | 2019-10-25 |
| CN110370153B true CN110370153B (en) | 2021-07-13 |
Family
ID=68249994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910499126.0A Active CN110370153B (en) | 2019-06-10 | 2019-06-10 | Upper fixed disc wafer stripping device for polishing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110370153B (en) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61243172A (en) * | 1985-04-17 | 1986-10-29 | Fujitsu Ltd | Magnetron sputtering device |
| US4624728A (en) * | 1985-06-11 | 1986-11-25 | Tegal Corporation | Pin lift plasma processing |
| IL115934A0 (en) * | 1995-11-09 | 1996-01-31 | Oramir Semiconductor Ltd | Laser processing chamber with cassette cell |
| JPH10178087A (en) * | 1996-12-17 | 1998-06-30 | Tokyo Seimitsu Co Ltd | Wafer suction table |
| US6149758A (en) * | 1997-06-20 | 2000-11-21 | Lintec Corporation | Sheet removing apparatus and method |
| JP5408790B2 (en) * | 2009-03-06 | 2014-02-05 | エルジー・ケム・リミテッド | Float glass polishing system |
| EP2402981B1 (en) * | 2009-03-18 | 2013-07-10 | EV Group GmbH | Device and method for releasing a wafer from a holder |
| CN105047589B (en) * | 2015-07-08 | 2018-05-29 | 浙江中纳晶微电子科技有限公司 | Wafer solution bonding apparatus |
-
2019
- 2019-06-10 CN CN201910499126.0A patent/CN110370153B/en active Active
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| Publication number | Publication date |
|---|---|
| CN110370153A (en) | 2019-10-25 |
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