CN110366306A - A kind of heat-conducting plastic circuit board and preparation method thereof - Google Patents
A kind of heat-conducting plastic circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN110366306A CN110366306A CN201910641586.2A CN201910641586A CN110366306A CN 110366306 A CN110366306 A CN 110366306A CN 201910641586 A CN201910641586 A CN 201910641586A CN 110366306 A CN110366306 A CN 110366306A
- Authority
- CN
- China
- Prior art keywords
- heat
- substrate
- circuit board
- plastic
- conducting plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
Abstract
The invention discloses a kind of Novel circuit boards based on heat-conducting plastic, including substrate, circuit layer is welded at the top of substrate, the through-hole or wire casing for fixing electronic component are offered on substrate, electric conduction routing is provided on circuit layer, the bottom of substrate is provided with heat conduction silicone, and the bottom of heat conduction silicone is provided with heat dissipating layer, hole is offered at the top both ends of substrate, and several thermal vias are offered in heat dissipating layer.Circuit board made of the present invention is without applying insulating layer coating, and for thermal coefficient up to 1.0, high temperature resistant is shrink-proof, indeformable, suppleness is preferable, has anti-flammability, not sulphur containing harmful components, and product weight, cost and running temperature are reduced, improve electronic device service life and operation stability.
Description
Technical field
The present invention relates to a kind of circuit board, in particular to a kind of heat-conducting plastic circuit board and preparation method thereof.
Background technique
Baseplate material used in PCB manufacturing process is copper-clad plate at present, and copper-clad plate is by aluminium sheet, copper foil, fiber cloth pressure
It closes, price is higher, and contains heavy metal, such as the method for bonding agent and copper foil is applied on insulating substrate, or
In the method for copper foil upper resin, but this method is needed using a large amount of bonding agent, and bonding agent usually can all cause
The environmental issues such as waste water and gas improve the cost of business processes environmental pollution, and it is very unfavorable that this equally brings environmental protection
Influence.
Summary of the invention
The technical problem to be solved by the present invention is to overcome the defect of the prior art, provide a kind of heat-conducting plastic circuit board and its
Production method, circuit board made of the present invention is without applying insulating layer coating, and for thermal coefficient up to 1.0, high temperature resistant is shrink-proof, constant
Shape, suppleness is preferable, has anti-flammability, not sulphur containing harmful components, and reduce product weight, cost and running temperature, improves
Electronic device service life and operation stability.
In order to solve the above-mentioned technical problems, the present invention provides the following technical solutions:
A kind of heat-conducting plastic circuit board of the present invention, including substrate are welded with circuit layer, the substrate at the top of the substrate
On offer through-hole or wire casing for fixing electronic component, be provided with electric conduction routing on the circuit layer, the substrate
Bottom is provided with heat conduction silicone, and the bottom of the heat conduction silicone is provided with heat dissipating layer, equal at the top both ends of the substrate
Hole is offered, several thermal vias are offered in the heat dissipating layer.
As a preferred technical solution of the present invention, the substrate is infused using ABS, PC, PA or PEEK plastic material
It moulds.
As a preferred technical solution of the present invention, the electric conduction routing on the circuit layer is molded using graphene filler
Molding, the electric conduction routing are embedded in the wire casing of substrate.
As a preferred technical solution of the present invention, the bottom of the substrate is connected with heat conduction silicone through hole.
As a preferred technical solution of the present invention, the heat dissipating layer is graphene cooling fin.
The present invention further correspondingly discloses a kind of production method based on heat-conducting plastic circuit board, which is characterized in that including with
Lower step:
A. the plastic pellet that ABS, PC, PA or PEEK are basic material is added in drying machine and is stirred hours；
B. the plastic pellet after drying carries out injection molding under about 10Mpa back pressure by injection molding machine；
C. powder mixing process and heat are used with the material particles of two kinds of obstructed particle sizes of silicon nitride (Si3N4) and magnesia
Molded legal system produces the heat filling of function admirable；
D., a kind of method that plastic substrate after stirring is passed through to a kind of " super drawing nanofiber ", using CO laser-ultrasound
Wave stretcher is by plastic molecules confused and disordered after stirring, and stretching becomes superfine, orderly chain or net, then by heat filling
It is mixed with plastic pellet, and processing aid is added and is molded into substrate, wherein substrate includes: plastic substrate 35 by mass percentage
~45%, insulating heat-conductive filler 45~65%, processing aid 2~4%.
As a preferred technical solution of the present invention, the processing aid is methyl acrylic ester, esters of acrylic acid
One of.
Compared with prior art, beneficial effects of the present invention are as follows:
Circuit board made of the present invention is without applying insulating layer coating, and for thermal coefficient up to 1.0, high temperature resistant is shrink-proof, constant
Shape, suppleness is preferable, has anti-flammability, not sulphur containing harmful components, and reduce product weight, cost and running temperature, improves
Electronic device service life and operation stability.
Detailed description of the invention
Attached drawing is used to provide further understanding of the present invention, and constitutes part of specification, with reality of the invention
It applies example to be used to explain the present invention together, not be construed as limiting the invention.In the accompanying drawings:
Fig. 1 is overall structure diagram of the invention；
In figure: 1, circuit layer；2, hole；3, substrate；4, heat conduction silicone；5, heat dissipating layer；6, thermal vias.
Specific embodiment
Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings, it should be understood that preferred reality described herein
Apply example only for the purpose of illustrating and explaining the present invention and is not intended to limit the present invention.
Embodiment 1
As shown in Figure 1, the present invention provides a kind of heat-conducting plastic circuit board, including substrate 3, the top of substrate 3 is welded with electricity
Road floor 1 offers through-hole or wire casing for fixing electronic component on substrate 3, is provided with electric conduction routing, base on circuit layer 1
The bottom of plate 3 is provided with heat conduction silicone 4, and the bottom of heat conduction silicone 4 is provided with heat dissipating layer 5, equal at the top both ends of substrate 3
Hole 2 is offered, several thermal vias 6 are offered in heat dissipating layer 5.
Substrate 3 is molded using ABS, PC, PA or PEEK plastic material, and without applying insulating layer coating, circuit board is led
Hot coefficient is not less than 20W/M.K, and reduces product weight, cost and running temperature, improves electronic device service life and operation
Stability, while 280 DEG C of high temperature resistant, shrink-proof, indeformable, plastic pellet under the high temperature conditions, is still able to maintain higher mechanicalness
Can, corrosion-resistant, stress crack resistant, dimensionally stable, long-term operating temperature is short-term up to 480 DEG C up to 290 DEG C or so, can-
It works in the environment of 240 DEG C, using the injection molding of thioplast molecule is free of, effectively reduces poisonous and harmful substance discharge.
Electric conduction routing on circuit layer 1 uses the injection molding of graphene filler, and electric conduction routing is embedded in the wire casing of substrate 3
In, it can be designed according to circuit trace length, thickness, angle demand.
The bottom of substrate 3 is connected with 4 through hole 2 of heat conduction silicone, and circuit board heat is transferred to by heat conduction silicone 4
Heat dissipating layer 5, so that heat dissipation effect is strong.
Heat dissipating layer 5 is graphene cooling fin, can timely disperse the heat that circuit board generates at work, prevent circuit
Plate plate due to temperature is excessively high caused by damage.
A kind of production method based on heat-conducting plastic circuit board, which comprises the following steps:
A. the plastic pellet that ABS, PC, PA or PEEK are basic material is added in drying machine and is stirred 3.5 hours；
B. the plastic pellet after drying carries out injection molding under about 10Mpa back pressure by injection molding machine；
C. powder mixing process and heat are used with the material particles of two kinds of obstructed particle sizes of silicon nitride (Si3N4) and magnesia
Molded legal system produces the heat filling of function admirable；
D., plastic substrate after stirring is passed through to the method for a kind of " super drawing nanofiber ", it is super using a kind of CO2 laser
For sound wave stretcher by plastic molecules confused and disordered after stirring, stretching becomes superfine, orderly chain or net, then fills out thermally conductive
Material is mixed with plastic pellet, and processing aid is added and is molded into substrate 3, and wherein substrate 3 includes: plastics base by mass percentage
Body 35~45%, insulating heat-conductive filler 45~65%, processing aid 2~4%.
Specifically, the plastic pellet that ABS, PC, PA or PEEK are basic material is added in drying machine and is stirred first
3.5 hour；Plastic pellet after drying carries out injection molding under about 10Mpa back pressure by injection molding machine；With silicon nitride (Si3N4)
Function admirable is produced using powder mixing process and hot pressing formation process with the material particles of two kinds of obstructed particle sizes of magnesia
Heat filling；A kind of method that plastic substrate after stirring is passed through to a kind of " super drawing nanofiber ", using CO2 laser-ultrasound
Wave stretcher is by plastic molecules confused and disordered after stirring, and stretching becomes superfine, orderly chain or net, then by heat filling
It is mixed with plastic pellet, and processing aid is added and is molded into substrate 3, wherein substrate 3 includes: plastic substrate by mass percentage
35~45%, insulating heat-conductive filler 45~65%, processing aid 2~4%, 1 electric conduction routing of circuit layer use graphite filler,
It is mixed with polymer substance, then injection molding, conductor wiring shape can also be according to the need of circuit trace length, thickness, angle
It asks and is designed；Substrate 3 is equipped with wire casing corresponding with the shape of electric conduction routing, allows the seamless insertion line of electric conduction routing
It in slot, then is fixed by ultrasonic bonding, is punched on circuit boards by drilling machine, can be used for fixing the through-hole of electronic component
Or slot, 3 bottom of substrate are connect with 4 through hole 2 of heat conduction silicone, circuit board heat is transferred to heat dissipating layer 5 by heat conduction silicone；
3 bottom of substrate is equipped with graphene heat sink layer 5, and opens several through-holes 6 in graphene cooling fin, can timely disperse circuit board
The heat generated at work, prevent circuit board due to temperature is excessively high caused by damage.
Compared with prior art, beneficial effects of the present invention are as follows:
Circuit board made of the present invention is without applying insulating layer coating, and for thermal coefficient up to 1.0, high temperature resistant is shrink-proof, constant
Shape, suppleness is preferable, has anti-flammability, not sulphur containing harmful components, and reduce product weight, cost and running temperature, improves
Electronic device service life and operation stability.
Finally, it should be noted that the foregoing is only a preferred embodiment of the present invention, it is not intended to restrict the invention,
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art, still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features.
All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in of the invention
Within protection scope.
Claims (7)
1. a kind of heat-conducting plastic circuit board, which is characterized in that including substrate (3), be welded with circuit layer at the top of the substrate (3)
(1), the through-hole or wire casing for fixing electronic component are offered on the substrate (3), are provided with and are led on the circuit layer (1)
The bottom of electric cabling, the substrate (3) is provided with heat conduction silicone (4), and the bottom of the heat conduction silicone (4) is provided with heat dissipation
Layer (5) offers hole (2) at the top both ends of the substrate (3), offers several thermal vias in the heat dissipating layer (5)
(6)。
2. a kind of Novel circuit board based on heat-conducting plastic according to claim 1, which is characterized in that the substrate (3)
It is molded using ABS, PC, PA or PEEK plastic material.
3. a kind of Novel circuit board based on heat-conducting plastic according to claim 1, which is characterized in that the circuit layer
(1) electric conduction routing on uses the injection molding of graphene filler, and the electric conduction routing is embedded in the wire casing of substrate (3).
4. a kind of Novel circuit board based on heat-conducting plastic according to claim 1, which is characterized in that the substrate (3)
Bottom be connected with heat conduction silicone (4) through hole (2).
5. a kind of Novel circuit board based on heat-conducting plastic according to claim 1, which is characterized in that the heat dissipating layer
It (5) is graphene cooling fin.
6. a kind of production method based on heat-conducting plastic circuit board, which comprises the following steps:
A. the plastic pellet that ABS, PC, PA or PEEK are basic material is added in drying machine and is stirred 3.5 hours；
B. the plastic pellet after drying carries out injection molding under about 10Mpa back pressure by injection molding machine；
C. it using powder mixing process and is hot pressed into the material particles of two kinds of obstructed particle sizes of silicon nitride (Si3N4) and magnesia
Type legal system produces the heat filling of function admirable；
D., a kind of method that plastic substrate after stirring is passed through to a kind of " super drawing nanofiber ", using CO2 laser ultrasonic
For stretcher by plastic molecules confused and disordered after stirring, stretching becomes superfine, orderly chain or net, then by heat filling with
Plastic pellet mixes, and processing aid is added and is molded into substrate (3), and wherein substrate (3) includes: plastics base by mass percentage
Body 35~45%, insulating heat-conductive filler 45~65%, processing aid 2~4%.
7. a kind of production method based on heat-conducting plastic circuit board according to claim 6, which is characterized in that the processing
Auxiliary agent is one of methyl acrylic ester, esters of acrylic acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910641586.2A CN110366306A (en) | 2019-07-16 | 2019-07-16 | A kind of heat-conducting plastic circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910641586.2A CN110366306A (en) | 2019-07-16 | 2019-07-16 | A kind of heat-conducting plastic circuit board and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110366306A true CN110366306A (en) | 2019-10-22 |
Family
ID=68219977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910641586.2A Pending CN110366306A (en) | 2019-07-16 | 2019-07-16 | A kind of heat-conducting plastic circuit board and preparation method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101605431A (en) * | 2008-06-12 | 2009-12-16 | 欣兴电子股份有限公司 | The manufacture method of molding interconnection device |
| CN106810869A (en) * | 2017-01-19 | 2017-06-09 | 广东星联科技有限公司 | A kind of thermally conductive silicone rubber composite material and preparation method thereof |
| CN107371323A (en) * | 2017-08-07 | 2017-11-21 | 绵阳市维博电子有限责任公司 | A kind of heat dissipating method suitable for electronic water pump for automobile power device |
| CN107405826A (en) * | 2015-03-17 | 2017-11-28 | 飞利浦照明控股有限公司 | Make the 3D printing shape with interconnection and embedded components |
| JP2019007113A (en) * | 2017-06-28 | 2019-01-17 | Ｊｘｔｇエネルギー株式会社 | Apparatus for producing ultrafine fiber and method for producing ultrafine fiber |
-
2019
- 2019-07-16 CN CN201910641586.2A patent/CN110366306A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101605431A (en) * | 2008-06-12 | 2009-12-16 | 欣兴电子股份有限公司 | The manufacture method of molding interconnection device |
| CN107405826A (en) * | 2015-03-17 | 2017-11-28 | 飞利浦照明控股有限公司 | Make the 3D printing shape with interconnection and embedded components |
| CN106810869A (en) * | 2017-01-19 | 2017-06-09 | 广东星联科技有限公司 | A kind of thermally conductive silicone rubber composite material and preparation method thereof |
| JP2019007113A (en) * | 2017-06-28 | 2019-01-17 | Ｊｘｔｇエネルギー株式会社 | Apparatus for producing ultrafine fiber and method for producing ultrafine fiber |
| CN107371323A (en) * | 2017-08-07 | 2017-11-21 | 绵阳市维博电子有限责任公司 | A kind of heat dissipating method suitable for electronic water pump for automobile power device |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20191022 |
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| WD01 | Invention patent application deemed withdrawn after publication |